Wafer etching device and etching method for chip production

Abstract

The invention relates to the technical field of wafer processing devices, and provides a wafer etching device for chip production, which comprises an etching case, an etching pool is arranged on the etching case, and etching liquid is injected into the etching pool; the shielding window is arranged on the etching machine box and is used for sealing the etching pool; the object placing basket is arranged in the etching pool and is used for placing a wafer; the waste gas treatment assembly is used for treating waste gas generated in the etching pool; the waste gas treatment assembly comprises a waste gas pipe, a water absorption pad and an impurity removal pipe, the waste gas pipe is communicated with the etching pool and is vertically arranged, the water absorption pad is used for absorbing moisture carried in waste gas, the impurity removal pipe is filled with adsorption particles, the adsorption particles are used for adsorbing impurities and pollutants in the waste gas, and the adsorption particles are used for adsorbing the impurities and the pollutants in the waste gas. And gas holes through which waste gas passes are distributed in the surface of the impurity removal pipe at intervals. The wafer etching method has the effect of reducing the pollution of wafer etching to the surrounding environment.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing devices, and in particular to a wafer etching device and etching method for chip production. Background Art

[0002] With the continuous development of semiconductor technology, wafer etching is a key link in chip manufacturing, and its accuracy and efficiency directly affect the performance and production cost of the chip. At present, most of the wafer etching devices on the market focus on improving etching accuracy, but there is still room for improvement in processing efficiency, material utilization and ease of operation.

[0003] Wafer processing generally includes processes such as coating, exposure, development, groove etching, and electrophoresis. The purpose of groove etching is to react the silicon in a specific area of ​​the wafer surface with the etching solution to form a groove. Existing wafer etching technologies usually use wet etching. Although these methods can achieve high etching accuracy, they are often accompanied by problems such as material waste, long processing time, and complex operation during the processing process.

[0004] Regarding the above-mentioned related technologies, the wafer etching device and method have high requirements on the skills of the operator during operation, and the etching liquid is easy to volatilize and produce harmful gases during the etching process. Improper waste gas treatment may cause pollution to the environment, so there is room for improvement. Summary of the invention

[0005] In order to reduce the pollution of the surrounding environment caused by wafer etching, the present application provides a wafer etching device for chip production.

[0006] In the first aspect, the present application provides a wafer etching device for chip production using the following technical solution: A wafer etching device for chip production, comprising: An etching machine box, wherein an etching pool is provided on the etching machine box, and the etching pool is filled with etching liquid; A shielding window, which is arranged on the etching machine box and is used to close the etching pool; A storage basket, which is arranged in the etching pool and is used for placing wafers, and a plurality of through holes are opened at the bottom of the storage basket; An exhaust gas treatment component, the exhaust gas treatment component is used to treat the exhaust gas generated in the etching pool; the exhaust gas treatment component includes an exhaust pipe, a water absorption pad and an impurity removal pipe, the exhaust pipe is connected to the etching pool and is vertically arranged, the water absorption pad and the impurity removal pipe are arranged in sequence from bottom to top along the height direction of the exhaust pipe, the water absorption pad is used to absorb moisture carried in the exhaust gas, the impurity removal pipe is filled with adsorption particles, the adsorption particles are used to adsorb impurities and pollutants in the exhaust gas, and the surface of the impurity removal pipe is spaced apart with air holes for the exhaust gas to pass through; Among them, the impurity removal pipe is V-shaped, and the impurity removal pipe is rotatably connected to the inside of the exhaust pipe through a rotating motor, and the rotation axis of the impurity removal pipe is in the horizontal direction; when the adsorption particles in the impurity removal pipe need to be replaced, the rotating motor controls the impurity removal pipe to flip and take an inverted V shape.

[0007] By adopting the above technical solution, during production, a row of wafers to be etched are arrayed in a basket, and then the basket is immersed in an etching pool, and then the etching pool is closed with a shielding window. After a period of time, the etching is completed. The waste gas generated during the etching process will enter the waste gas pipe, and the waste gas will pass through the water absorption pad and the impurity removal pipe in turn. The water absorption pad dehumidifies the waste gas, and the adsorption particles in the impurity removal pipe adsorb the dehumidified waste gas, so that the organic compounds or other pollutants in the waste gas are trapped on the adsorption particles, effectively reducing environmental pollution.

[0008] Preferably, it also includes a gas spring and a baffle, wherein the baffle is rotatably disposed at both ends of the impurity removal pipe and is used to intercept and adsorb particles, and the gas spring is connected to the baffle and is used to control the rotation of the baffle; a feed port and a discharge port are provided on the side wall of the impurity removal pipe, and the feed port is located above the discharge port, and when the impurity removal pipe is in a V-shape, the two ends of the impurity removal pipe correspond to the feed port; when the impurity removal pipe is in an inverted V-shape, the two ends of the impurity removal pipe correspond to the discharge port.

[0009] By adopting the above technical solution, the adsorption particles need to be replaced after long-term use. When the old adsorption particles need to be replaced, the rotary motor is first used to control the impurity removal pipe to flip and form an inverted V shape, and then the air spring is used to control the baffle to open so that the old adsorption particles can fall from the impurity removal pipe to the discharge port.

[0010] After the dumping is completed, the impurity removal pipe is flipped again to make it V-shaped; then the air spring is used to control the baffle to open. At this time, new adsorbed particles can enter the impurity removal pipe from the feed port along the baffle. After the loading is completed, the baffle is controlled to cover the two ends of the impurity removal pipe.

[0011] Preferably, the water absorbent pad is detachably connected to the exhaust pipe.

[0012] By adopting the above technical solution, when the water absorption capacity of the absorbent pad is saturated, the absorbent pad can be replaced regularly to ensure the waste gas treatment effect.

[0013] Preferably, a storage plate is connected to the exhaust pipe, two storage plates are arranged in parallel, a storage cavity is formed between the two storage plates, the absorbent pad is placed in the storage cavity, and a cover is connected to the exhaust pipe, and the cover is used to cover an opening at one end of the storage cavity.

[0014] By adopting the above technical solution, when replacing, first open the cover body, then pull out the old absorbent pad from between the two storage plates, then replace it with a new absorbent pad, and finally close the cover body.

[0015] Preferably, it also includes a stirring component, which is arranged on the etching machine box and is used to stir the etching liquid in the etching pool.

[0016] By adopting the above technical solution, during the etching process, the etching liquid in the etching pool has a relatively weak fluidity, which easily leads to the gradual weakening of the etching ability of the etching liquid around the wafer. By adding a stirring component, the stirring component can stir the etching liquid, thereby increasing the fluidity of the etching liquid, improving the etching effect and etching quality.

[0017] Preferably, the stirring assembly includes a driving member and a stirring plate, the stirring plate is movably arranged in the etching pool and is used to stir the etching liquid; the driving member is connected to the stirring plate and is used to control the reciprocating motion of the stirring plate, and the driving member is a cylinder, an oil cylinder or an electric push rod.

[0018] By adopting the above technical solution, the driving member can control the reciprocating movement of the stirring plate, and the movement of the stirring plate can exert a thrust on the etching liquid to achieve stirring.

[0019] Preferably, it also includes a receiving plate and a support column, the receiving plate includes a first plate and a second plate, the first plate and the second plate can be rotatably connected to the etching machine box; the receiving plates are arranged in two parallel pieces, both of which are used for placing the storage basket, and the support column is arranged between the two receiving plates, and the support column is used for temporarily placing the storage basket.

[0020] By adopting the above technical solution, when etching is completed, the staff first puts the entire storage basket on the support column, and then controls the first plate and the second plate to rotate so that the receiving plate changes from a straight state to a V shape, and then puts the storage basket on the two receiving plates for draining, thereby reducing the waste of etching liquid and facilitating the subsequent removal of wafers.

[0021] Preferably, the shielding window includes a first window and a second window, the first window is fixedly connected to the etching machine box, the second window is slidably connected to the first window, and transparent glass plates are provided on the first window and the second window.

[0022] By adopting the above technical solution, during the etching process, the staff can observe the condition in the etching pool through the transparent glass plate. After the etching is completed, the staff can push the second window to expose the etching pool, and then unload the wafer and perform subsequent etching.

[0023] Preferably, it also includes a control panel, which is arranged on the etching machine chassis.

[0024] By adopting the above technical solution, the staff can use the control panel to let the etching machine box execute corresponding instructions so as to carry out the wafer etching process.

[0025] In a second aspect, the present application also provides a wafer etching method for chip production, which adopts the following technical solution: A wafer etching method for chip production comprises the following steps: S1. First, place the wafer in a storage basket, then place the storage basket in the etching pool, and use a shielding window to close the etching pool; S2. Start the etching control system to perform etching; S3. During the etching process, the waste gas is automatically treated by the waste gas treatment component; S4. After etching is completed, take out the etched wafer.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: (1) By setting up the exhaust gas treatment component, the exhaust gas generated during the etching process will enter the exhaust gas pipe, and the exhaust gas will pass through the water absorbent pad and the impurity removal pipe in turn. The water absorbent pad dehumidifies the exhaust gas, and the adsorption particles in the impurity removal pipe adsorb the dehumidified exhaust gas, so that the organic compounds or other pollutants in the exhaust gas are trapped on the adsorption particles, effectively reducing environmental pollution.

[0027] (2) By detachably connecting the absorbent pad to the exhaust pipe, when the absorbent pad's water absorption capacity becomes saturated, the absorbent pad can be replaced regularly to ensure the exhaust gas treatment effect. (3) By setting a stirring component, the stirring component can stir the etching liquid, thereby increasing the fluidity of the etching liquid and improving the wafer etching effect and etching quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic structural diagram of an etching device in an embodiment of the present application; Figure 2 It is a schematic diagram of the structure in an embodiment of the present application; Figure 3 It is a schematic diagram of the structure in an embodiment of the present application; Figure 4 It is a schematic diagram of the structure in the embodiment of the present application.

[0029] Figure numerals: 1. Etching chassis; 2. Shielding window; 21. First window; 22. Second window; 3. Storage basket; 4. Exhaust treatment component; 41. Exhaust pipe; 42. Water-absorbing pad; 43. De-impurity pipe; 5. Rotating motor; 6. Feed inlet; 7. Discharge outlet; 8. Storage plate; 9. Storage cavity; 10. Cover body; 11. Stirring component; 111. Driving member; 112. Stirring plate; 12. Receiving plate; 121. First plate; 122. Second plate; 13. Support column; 14. Etching pool; 15. Control panel; 16. Transparent glass plate; 17. Bump; 18. Groove; 19. Gas spring; 20. Baffle. DETAILED DESCRIPTION

[0030] The technical solution of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The present application can be embodied in many different forms and is not limited to the embodiments described here.

[0031] In the description of the present application, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics represented can be combined in any one or more embodiments or examples in a suitable manner.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0033] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection; it can also be a detachable connection; or integrated; it can also be a mechanical connection. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0034] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples shown in the present application.

[0035] The present application embodiment discloses a wafer etching device for chip production. Figure 1 and Figure 2 The etching device includes an etching machine box 1, a shielding window 2, a storage basket 3 and an exhaust gas treatment component 4. The etching machine box 1 is placed on the ground, and an etching pool 14 is provided on the etching machine box 1, and the etching pool 14 is used to accommodate the etching liquid. The shielding window 2 is installed on the etching machine box 1 and is used to close the etching pool 14. The storage basket 3 is placed in the etching pool 14, and the storage basket 3 is rectangular in shape and is used for placing wafers. A plurality of through holes are provided at the bottom of the storage basket 3, and each through hole is used for the etching liquid to pass through. Among them, a control panel 15 is also provided on the etching machine box 1, and the control panel 15 is used for the staff to operate the instructions. During production, the staff arranges a row of wafers to be etched in the storage basket 3, and then immerses the storage basket 3 in the etching pool 14, and then uses the shielding window 2 to close the etching pool 14. After a period of time, the etching is completed.

[0036] In this embodiment, the shielding window 2 includes a first window 21 and a second window 22. The first window 21 is tilted and fixedly connected to the etching machine box 1. The second window 22 is slidably connected to the first window 21. Transparent glass plates 16 are provided on the first window 21 and the second window 22. A protrusion 17 is integrally formed on the surface of the first window 21 facing the second window 22, and a groove 18 is correspondingly provided on the side of the second window 22 facing the first window 21. When the protrusion 17 is inserted into the groove 18, the relative movement of the first window 21 and the second window 22 can be limited.

[0037] During the etching process, the staff can observe the condition in the etching pool 14 through the transparent glass plate 16 without opening the shielding window 2. After the etching is completed, the staff can push the second window 22 to expose the etching pool 14, and then unload the wafer and perform subsequent etching.

[0038] Combination Figure 3 The exhaust gas treatment component 4 is installed on the top of the etching machine box 1, and is used to treat the exhaust gas generated in the etching pool 14. Specifically, the exhaust gas treatment component 4 includes an exhaust pipe 41, a water absorption pad 42 and an impurity removal pipe 43. The exhaust pipe 41 is connected to the etching pool 14 and is vertically arranged. The water absorption pad 42 and the impurity removal pipe 43 are arranged in sequence from bottom to top along the height direction of the exhaust pipe 41. The water absorption pad 42 is used to absorb the moisture carried in the exhaust gas. The impurity removal pipe 43 is filled with adsorption particles, which are used to absorb impurities and pollutants in the exhaust gas. The surface of the impurity removal pipe 43 is spaced apart with air holes for the exhaust gas to pass through.

[0039] The waste gas generated during the etching process will enter the waste gas pipe 41, and the waste gas will pass through the water absorption pad 42 and the impurity removal pipe 43 in turn. The water absorption pad 42 dehumidifies the waste gas, and the adsorption particles in the impurity removal pipe 43 adsorb the dehumidified waste gas, so that the organic compounds or other pollutants in the waste gas are trapped on the adsorption particles, effectively reducing environmental pollution.

[0040] In this embodiment, the impurity removal pipe 43 is V-shaped, and the impurity removal pipe 43 is rotatably connected to the inside of the exhaust pipe 41 through the rotating motor 5, and the rotation axis of the impurity removal pipe 43 is in the horizontal direction. When the adsorbed particles in the impurity removal pipe 43 need to be replaced, the rotating motor 5 controls the impurity removal pipe 43 to flip and form an inverted V shape. The impurity removal pipe 43 is also equipped with a gas spring 19 and a baffle 20, which can be rotatably connected to both ends of the impurity removal pipe 43 and is used to intercept the adsorbed particles. The gas spring 19 is connected to the baffle 20 and is used to control the rotation of the baffle 20.

[0041] A feed port 6 and a discharge port 7 are provided on the side wall of the impurity removal pipe 43. The feed port 6 is located above the discharge port 7. When the impurity removal pipe 43 is in a V shape, the two ends of the impurity removal pipe 43 correspond to the feed port 6; when the impurity removal pipe 43 is in an inverted V shape, the two ends of the impurity removal pipe 43 correspond to the discharge port 7.

[0042] The adsorbent particles will become inactive after long-term use and need to be replaced. When the old adsorbent particles need to be replaced, the rotary motor 5 is first used to control the impurity removal pipe 43 to flip and form an inverted V shape, and then the air spring 19 is used to control the baffle 20 to open so that the old adsorbent particles can fall from the impurity removal pipe 43 to the discharge port 7.

[0043] After the dumping is completed, the impurity removal pipe 43 is turned over again to make it V-shaped; then the air spring 19 is used to control the baffle 20 to open. At this time, new adsorbed particles can enter the impurity removal pipe 43 from the feed port 6 along the baffle 20. After the loading is completed, the baffle 20 is controlled to cover the two ends of the impurity removal pipe 43 to prevent the adsorbed particles from falling out.

[0044] In some embodiments, the absorbent pad 42 is detachably connected to the exhaust pipe 41. When the water absorption capacity of the absorbent pad 42 becomes saturated, the absorbent pad 42 can be replaced regularly to ensure the treatment effect of the exhaust gas. A storage plate 8 is fixedly connected to the exhaust pipe 41, and two storage plates 8 are arranged in parallel. A storage cavity 9 is formed between the two storage plates 8, and the absorbent pad 42 is clamped in the storage cavity 9. A cover body 10 is connected to the exhaust pipe 41, and the cover body 10 can be installed on the exhaust pipe 41 by screwing. The cover body 10 is used to cover the opening at one end of the storage cavity 9. When replacing, first open the cover body 10, then pull out the old absorbent pad 42 from between the two storage plates 8, and then replace it with a new absorbent pad 42, and finally close the cover body 10 again to achieve blocking.

[0045] Combination Figure 4, the etching machine box 1 is also equipped with a stirring assembly 11, which is used to stir the etching solution in the etching pool 14. During the etching process, since the etching solution in the etching pool 14 has a relatively weak fluidity, it is easy to cause the corrosion ability of the etching solution around the wafer to gradually weaken. The stirring assembly 11 can stir the etching solution, thereby increasing the fluidity of the etching solution, improving the etching effect and etching quality. The stirring assembly 11 includes a driving member 111 and a stirring plate 112, and the stirring plate 112 is movably arranged in the etching pool 14 and is used to stir the etching solution. The driving member 111 is connected to the stirring plate 112 and is used to control the reciprocating motion of the stirring plate 112. The driving member 111 is an actuator such as a cylinder, an oil cylinder or an electric push rod. The driving member 111 controls the reciprocating motion of the stirring plate 112 so that the stirring plate 112 can play a thrust role on the etching solution, thereby increasing the fluidity of the etching solution.

[0046] In addition, a receiving plate 12 and a support column 13 are installed on the etching machine box 1, and the receiving plate 12 and the support column 13 are both located above the etching pool 14. The receiving plate 12 includes a first plate 121 and a second plate 122, and the first plate 121 and the second plate 122 can be rotatably connected to the etching machine box 1, and the first plate 121 and the second plate 122 can be rotated into a V shape. In this embodiment, two receiving plates 12 are arranged in parallel, and the two receiving plates 12 are used together to place the supply basket 3. The support column 13 is located between the two receiving plates 12, and the support column 13 is used to temporarily place the supply basket 3.

[0047] When etching is completed, the staff first places the entire storage basket 3 on the support column 13, and then controls the first plate 121 and the second plate 122 to rotate, so that the receiving plate 12 changes from a straight state to a V shape, and then places the storage basket 3 on the two receiving plates 12 for draining, thereby reducing the waste of etching solution and facilitating the subsequent removal of wafers.

[0048] The implementation principle of a wafer etching device for chip production in the embodiment of the present application is as follows: during production, a row of wafers to be etched is first arrayed in a storage basket 3, and then the storage basket 3 is immersed in an etching pool 14, and then the etching pool 14 is closed using a shielding window 2. After a period of time, the etching is completed. The waste gas generated during the etching process will enter the waste gas pipe 41, and the waste gas will pass through the water absorption pad 42 and the impurity removal pipe 43 in turn. The water absorption pad 42 dehumidifies the waste gas, and the adsorption particles in the impurity removal pipe 43 adsorb the dehumidified waste gas, so that the organic compounds or other pollutants in the waste gas are trapped on the adsorption particles, effectively reducing environmental pollution.

[0049] Based on the above embodiments, the present application also provides a wafer etching method for chip production, comprising the following steps: S1. First, place the wafers neatly in the storage basket 3, then place the storage basket 3 into the etching pool 14, and at the same time control the second window 22 to slide so that the entire shielding window 2 closes the etching pool 14; S2. Then start the etching control system to perform wafer etching; S3. The waste gas generated during the etching process enters the waste gas treatment component 4, and the waste gas treatment component 4 performs dehumidification and impurity removal operations on the waste gas; S4. After the etching is completed, the staff wearing protective gloves takes out the storage basket 3 from the etching tank 14, and puts it on the receiving plate 12 to drain, and finally takes out the etched wafer.

[0050] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer etching device for chip production, characterized in that: include: An etching machine box (1), wherein an etching pool (14) is arranged on the etching machine box (1), and an etching liquid is filled in the etching pool (14); A shielding window (2), the shielding window (2) being arranged on the etching machine box (1) and being used to seal the etching pool (14); A storage basket (3), the storage basket (3) being arranged in the etching pool (14) and used for placing wafers, and a plurality of through holes being provided at the bottom of the storage basket (3); An exhaust gas treatment component (4), the exhaust gas treatment component (4) being used to treat the exhaust gas generated in the etching pool (14); the exhaust gas treatment component (4) comprising an exhaust pipe (41), a water absorption pad (42) and an impurity removal pipe (43); the exhaust pipe (41) being connected to the etching pool (14) and being arranged vertically; the water absorption pad (42) and the impurity removal pipe (43) being arranged in sequence from bottom to top along the height direction of the exhaust gas pipe (41); the water absorption pad (42) being used to absorb moisture carried in the exhaust gas; the impurity removal pipe (43) being filled with adsorption particles, the adsorption particles being used to adsorb impurities and pollutants in the exhaust gas; and air holes for the exhaust gas to pass through are distributed at intervals on the surface of the impurity removal pipe (43); The impurity removal pipe (43) is in a V-shape, and is rotatably connected to the inside of the exhaust pipe (41) via a rotating motor (5), with the rotation axis of the impurity removal pipe (43) being in a horizontal direction; when it is necessary to replace the adsorbed particles in the impurity removal pipe (43), the rotating motor (5) controls the impurity removal pipe (43) to flip over and assume an inverted V-shape.

2. A wafer etching device for chip production according to claim 1, characterized in that: The utility model also comprises a gas spring (19) and a baffle (20), wherein the baffle (20) is rotatably arranged at the two ends of the impurity removal pipe (43) and is used to intercept and adsorb particles, and the gas spring (19) is connected to the baffle (20) and is used to control the rotation of the baffle (20); a feed port (6) and a discharge port (7) are provided on the side wall of the impurity removal pipe (43), wherein the feed port (6) is located above the discharge port (7); when the impurity removal pipe (43) is in a V-shape, the two ends of the impurity removal pipe (43) correspond to the feed port (6); when the impurity removal pipe (43) is in an inverted V-shape, the two ends of the impurity removal pipe (43) correspond to the discharge port (7).

3. A wafer etching device for chip production according to claim 1, characterized in that: The water-absorbing pad (42) is detachably connected to the exhaust pipe (41).

4. A wafer etching device for chip production according to claim 3, characterized in that: A storage plate (8) is connected to the exhaust pipe (41), two storage plates (8) are arranged in parallel, a storage cavity (9) is formed between the two storage plates (8), the water absorbent pad (42) is placed in the storage cavity (9), and a cover body (10) is connected to the exhaust pipe (41), and the cover body (10) is used to cover an opening at one end of the storage cavity (9).

5. The wafer etching device for chip production according to claim 1, characterized in that: It also comprises a stirring component (11), wherein the stirring component (11) is arranged on the etching machine box (1), and the stirring component (11) is used to stir the etching liquid in the etching pool (14).

6. A wafer etching device for chip production according to claim 5, characterized in that: The stirring assembly (11) comprises a driving member (111) and a stirring plate (112); the stirring plate (112) is movably arranged in the etching pool (14) and is used to stir the etching liquid; the driving member (111) is connected to the stirring plate (112) and is used to control the reciprocating motion of the stirring plate (112); the driving member (111) is a pneumatic cylinder, an oil cylinder or an electric push rod.

7. A wafer etching device for chip production according to claim 1, characterized in that: It also comprises a receiving plate (12) and a supporting column (13), wherein the receiving plate (12) comprises a first plate (121) and a second plate (122), wherein both the first plate (121) and the second plate (122) are rotatably connected to the etching machine box (1); two receiving plates (12) are arranged in parallel, and both of the two receiving plates (12) are used for placing the storage basket (3); the supporting column (13) is arranged between the two receiving plates (12), and the supporting column (13) is used for temporarily placing the storage basket (3).

8. The wafer etching device for chip production according to claim 1, characterized in that: The shielding window (2) comprises a first window (21) and a second window (22); the first window (21) is fixedly connected to the etching machine box (1); the second window (22) is slidably connected to the first window (21); and transparent glass plates (16) are provided on the first window (21) and the second window (22).

9. The wafer etching device for chip production according to claim 1, characterized in that: It also comprises a control panel (15), wherein the control panel (15) is arranged on the etching machine box (1).

10. A wafer etching method for chip production, characterized in that: The following steps are involved: S1. First, place the wafer in a storage basket (3), then place the storage basket (3) in an etching pool (14), and at the same time, use a shielding window (2) to close the etching pool (14); S2. Start the etching control system to perform etching; S3. During the etching process, the waste gas is automatically treated by the waste gas treatment component (4); S4. After etching is completed, take out the etched wafer.

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