Wafer batch transmission method and system

Abstract

The invention relates to the technical field of semiconductors, in particular to a wafer batch transmission method and system. Comprising a rack, a first placing position and a second placing position which are arranged on the rack and are used for placing two wafer boxes respectively, a first bearing seat and a second bearing seat which are used for holding wafers, a lifting mechanism used for driving the rack to move up and down, and a translation mechanism used for driving the first bearing seat and the second bearing seat to be close to each other or away from each other, the first bearing seat and the second bearing seat respectively correspond to the first placing position and the second placing position; according to the invention, the wafers can be arranged side by side, batch transfer of the wafers can be automatically realized, the conditions of low efficiency, strong subjectivity, high error rate and the like existing in manual operation are avoided, and the wafer transmission efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer batch transmission method and system. Background Art

[0002] In the semiconductor industry, the wafer transfer process is a key step in semiconductor manufacturing. According to international standards, there are 25 wafers in each box. In order to improve the wafer transfer efficiency, the 25 wafers in the two boxes need to be merged into 50 wafers. Mechanical methods are used to transfer the wafers from one box to another to meet the needs of subsequent processing or testing.

[0003] However, traditional wafer transmission uses manual transfer, which leads to the disadvantages of low efficiency, strong subjectivity and high error rate in manual operation, affecting the efficiency of wafer transmission. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a wafer batch transmission method and system, which can parallel wafers and automatically realize wafer batch transfer, avoid the low efficiency, strong subjectivity and high error rate of manual operation, and improve the wafer transmission efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: The present invention provides a wafer batch transmission method, comprising a rack, a first placement position and a second placement position arranged on the rack and used to place a wafer box respectively, a first bearing seat and a second bearing seat used to hold wafers, a lifting mechanism used to drive the rack to move up and down, and a translation mechanism used to drive the first bearing seat and the second bearing seat to move closer to or away from each other, wherein the first bearing seat and the second bearing seat correspond to the first placement position and the second placement position respectively; the wafer batch transmission method has the following steps: S01, when it is necessary to take out and merge the wafers in the two wafer boxes, the lifting mechanism is used to drive the frame to move so that the first bearing seat and the second bearing seat are both located below the frame; S02, using a manipulator to place wafer boxes containing wafers at a first placement position and a second placement position respectively, and causing the lifting mechanism to drive the frame to descend relative to the first bearing seat and the second bearing seat, so that the first bearing seat and the second bearing seat extend into the wafer box along the bottom opening of the wafer box, so that the wafers in the wafer box are respectively held by the first bearing seat and the second bearing seat; S03, using the lifting mechanism to continue to drive the frame to descend relative to the first bearing seat and the second bearing seat, so that the first bearing seat and the second bearing seat are higher than the top opening of the wafer box, and using the translation mechanism to drive the first bearing seat and the second bearing seat to move closer, so that the wafers on the first bearing seat and the second bearing seat are arranged side by side, so as to facilitate the robot to transfer the combined wafers in batches; S04, when it is necessary to load the combined wafers into two wafer boxes as a whole, the lifting mechanism is used to drive the frame to descend relative to the first bearing seat and the second bearing seat, so that the first bearing seat and the second bearing seat are higher than the top opening of the wafer box, and the translation mechanism is used to drive the first bearing seat and the second bearing seat to move closer; S05, using a robot to load the combined wafers into the first carrier and the second carrier, so that the first carrier and the second carrier respectively hold half the number of wafers, moving the robot away from the first carrier and the second carrier, and the translation mechanism drives the first carrier and the second carrier away from each other, so that the first carrier and the second carrier are respectively located at the opening ends of the wafer box; S06, using a lifting mechanism to drive the frame to rise relative to the first supporting seat and the second supporting seat, so that the wafers on the first supporting seat and the second supporting seat are supported by two wafer boxes respectively, so that the two 25 wafers are combined into 50 wafers.

[0006] The wafer batch transmission method is further provided with a box delivery mechanism, the output end of the lifting mechanism is connected with a box pushing mechanism, the box pushing mechanism is connected to the frame driving, and the frame is provided with a first pick-up and a second pick-up and a second put-out port corresponding to the first placement position and the second placement position respectively; When the wafer box needs to be placed on the rack, the lifting mechanism drives the rack to move above the first supporting seat and the second supporting seat, the output end of the box delivery mechanism carries the wafer box, and the box pushing mechanism drives the rack away from the first supporting seat, so that the top end of the box delivery mechanism is inserted into the first pick-up and release port or the second pick-up and release port, and the box delivery mechanism places the wafer box in the first placement position or the second placement position.

[0007] The box delivery mechanism includes a box delivery horizontal module and a box delivery longitudinal module drivingly connected to the box delivery horizontal module, an output end of the box delivery longitudinal module is connected to a box delivery bearing platform, and the box delivery horizontal module drives the box delivery longitudinal module and the box delivery bearing platform to move so that the box delivery bearing platform corresponds to the first pick-up and release port or the second pick-up and release port; When the wafer box needs to be placed on the rack, the lifting mechanism drives the rack to move above the first supporting seat and the second supporting seat, the wafer box is placed on the box delivery platform, and the box pushing mechanism drives the rack away from the first supporting seat, so that the box delivery platform extends into the rack along the first pick-up and release port or the second pick-up and release port, and the box delivery longitudinal module drives the box delivery platform and the wafer box to approach the first supporting seat or the second supporting seat, so that the wafer box is placed in the first placement position or the second placement position, so that the wafer box is placed on the rack.

[0008] The box pushing mechanism comprises a box pushing platform and a box pushing horizontal module installed on the box pushing platform, the box pushing platform is drivingly connected to the lifting mechanism, the output end of the box pushing horizontal module is drivingly connected to the frame, and the frame is slidably connected to the box pushing platform; When the wafer box needs to be placed on the rack, the lifting mechanism drives the rack to move above the first supporting seat and the second supporting seat, the output end of the box delivery mechanism carries the wafer box, and the box pushing horizontal module drives the rack away from the first supporting seat, so that the top end of the box delivery mechanism is inserted into the first pick-up and release port or the second pick-up and release port, and the box delivery mechanism places the wafer box in the first placement position or the second placement position.

[0009] Among them, the translation mechanism adopts a reverse synchronous double slide module, and the two output ends of the translation mechanism are respectively connected to the first support rod and the second support rod, and the first support rod and the second support rod are respectively connected to the first bearing seat and the second bearing seat.

[0010] Wherein, a first accommodating space is provided between the first bearing seat and the first supporting rod, and a second accommodating space is provided between the second bearing seat and the second supporting rod; When the first support seat and the second support seat are higher than the top opening of the wafer box, the translation mechanism drives the first support seat and the second support seat to move closer, so that one end of one wafer box extends into the first accommodating space, and one end of the other wafer box extends into the second accommodating space.

[0011] Wherein, the first support rod is connected to one output end of the translation mechanism through a first rotation unit, and the second support rod is connected to the other output end of the translation mechanism through a second rotation unit; When the wafer on the first supporting seat needs to be turned over, the lifting mechanism drives the frame to descend relative to the first supporting seat, the first supporting seat is exposed at the opening end of the corresponding wafer box, and the first rotating unit drives the first supporting rod to rotate, so that the wafer on the first supporting seat is rotated by 180°; When the wafer on the second supporting seat needs to be turned over, the lifting mechanism drives the frame to descend relative to the second supporting seat, and the second supporting seat is exposed at the opening end of the corresponding wafer box. The second rotating unit drives the second support rod to rotate, so that the wafer on the second supporting seat is rotated 180°.

[0012] Wherein, at least two first supporting parts are symmetrically arranged on the top of the first bearing seat, and a plurality of first slots matching the shape of the wafer and with notches facing upwards are arranged at intervals on the first supporting parts; At least two second supporting parts are symmetrically arranged on the top of the second bearing seat, and a plurality of second slots matching the shape of the wafer and with notches facing upwards are arranged at intervals on the second supporting parts; The first card slot is in an arc-shaped structure, and the centers of every two first card slots adapted to the same wafer coincide with each other; the second card slot is in an arc-shaped structure, and the centers of every two second card slots adapted to the same wafer coincide with each other.

[0013] Among them, the distance between two adjacent first card slots is L1, and the distance between two adjacent second card slots is L2; ​​when the first bearing seat and the second bearing seat are close to each other, the minimum distance between adjacent first card slots and second card slots is L3; L1, L2 and L3 satisfy L1=L2=L3.

[0014] The present invention also provides a wafer batch transmission system for implementing a wafer batch transmission method, comprising a rack, a first placement position and a second placement position arranged on the rack and used to place two wafer boxes respectively, a first support seat and a second support seat for holding the wafers, a lifting mechanism for driving the rack to move up and down, and a translation mechanism for driving the first support seat and the second support seat to move closer to or away from each other, the first support seat and the second support seat respectively corresponding to the first placement position and the second placement position.

[0015] Beneficial effects of the present invention: It can arrange wafers in parallel and automatically transfer wafers in batches, avoiding the low efficiency, strong subjectivity and high error rate of manual operation, and improving wafer transmission efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the wafer batch transmission system.

[0017] Figure 2 This is a three-dimensional picture of the box pushing mechanism pushing out the wafer box.

[0018] Figure 3 It is a three-dimensional structural diagram of the box feeding mechanism and the frame.

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the wafer box and the box delivery platform when the wafer box is placed on the rack.

[0020] Figure 5 It is a three-dimensional diagram of a translation mechanism, a first bearing seat, a second bearing seat and a frame.

[0021] Figure 6 It is a schematic diagram of the three-dimensional structure when the first supporting seat and the second supporting seat are close to each other.

[0022] Figure 7 It is a cross-sectional view of the three-dimensional structure when the first supporting seat and the second supporting seat are close to each other.

[0023] 1. Frame; 101, first placement position; 102, second placement position; 103, first access opening; 104, second access opening; 2. First bearing seat; 21. First supporting portion; 22. First card slot; 3. Second bearing seat; 31. Second supporting portion; 32. Second slot; 4. Lifting mechanism; 5. Translation mechanism; 51. First support rod; 52. Second support rod; 511, first accommodation space; 521, second accommodation space; 53. A first rotating unit; 54. A second rotating unit; 6. Box delivery mechanism; 61. Box delivery horizontal module; 62. Box delivery vertical module; 63. Box delivery bearing platform; 7. Box pushing mechanism; 71. Box pushing platform; 72. Box pushing horizontal module. DETAILED DESCRIPTION

[0024] To facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with examples and drawings. Specific implementation methods of the present invention will be described below. It should be pointed out that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all features of the actual implementation methods.

[0025] refer to Figures 1 to 7 As shown, the present invention provides a wafer batch transmission method, comprising a rack 1, a first placement position 101 and a second placement position 102 arranged on the rack 1 and used to place a wafer box respectively, a first bearing seat 2 and a second bearing seat 3 for holding wafers, a lifting mechanism 4 for driving the rack 1 to move up and down, and a translation mechanism 5 for driving the first bearing seat 2 and the second bearing seat 3 to move closer to or away from each other, wherein the first bearing seat 2 and the second bearing seat 3 correspond to the first placement position 101 and the second placement position 102 respectively; the steps of the wafer batch transmission method are as follows: S01 . When wafers in two wafer boxes need to be taken out and combined, the lifting mechanism 4 is used to drive the frame 1 to move so that the first bearing seat 2 and the second bearing seat 3 are both located below the frame 1 .

[0026] S02. Use a robot to place the wafer boxes containing wafers at the first placement position 101 and the second placement position 102 respectively, so that the lifting mechanism 4 drives the frame 1 to descend relative to the first supporting seat 2 and the second supporting seat 3, so that the first supporting seat 2 and the second supporting seat 3 extend into the wafer box along the bottom opening of the wafer box, so that the wafers in the wafer box are held by the first supporting seat 2 and the second supporting seat 3 respectively.

[0027] S03. Use the lifting mechanism 4 to continue to drive the frame 1 to descend relative to the first supporting seat 2 and the second supporting seat 3, so that the first supporting seat 2 and the second supporting seat 3 are higher than the top opening of the wafer box, and use the translation mechanism 5 to drive the first supporting seat 2 and the second supporting seat 3 to move closer, so that the wafers on the first supporting seat 2 and the second supporting seat 3 are arranged side by side, so as to facilitate the robot to batch transfer the merged wafers as a whole.

[0028] S04. When it is necessary to load the merged wafers into two wafer boxes as a whole, the lifting mechanism 4 is used to drive the frame 1 to descend relative to the first supporting seat 2 and the second supporting seat 3, so that the first supporting seat 2 and the second supporting seat 3 are higher than the top opening of the wafer box, and the translation mechanism 5 is used to drive the first supporting seat 2 and the second supporting seat 3 to move closer.

[0029] S05. Use a robot to load the merged wafers into the first carrier 2 and the second carrier 3, so that the first carrier 2 and the second carrier 3 respectively hold half the number of wafers, move the robot away from the first carrier 2 and the second carrier 3, and the translation mechanism 5 drives the first carrier 2 and the second carrier 3 away from each other, so that the first carrier 2 and the second carrier 3 are respectively located at the opening ends of the wafer box.

[0030] S06. The lifting mechanism 4 is used to drive the frame 1 to rise relative to the first supporting seat 2 and the second supporting seat 3. The inner wall of the wafer box is usually provided with a plurality of recessed grooves adapted to the shape of the wafers so that a plurality of wafers can be clamped and confined in the wafer box. During the rising process of the frame 1 relative to the first supporting seat 2 and the second supporting seat 3, the bottom of the wafer is supported by the wafer box and then detaches from the first supporting seat 2 or the second supporting seat 3, so that the wafers on the first supporting seat 2 and the second supporting seat 3 are respectively supported by the two wafer boxes, so that the two twenty-five wafers are combined into fifty wafers.

[0031] Therefore, the present invention can make the wafers on the first carrier 2 and the second carrier 3 side by side, which is convenient for the robot to quickly grab or place the merged wafers in batches, thereby improving the wafer transfer efficiency; it can automatically realize the wafer batch transfer, avoid the low efficiency, strong subjectivity and high error rate of manual operation, and improve the wafer transmission efficiency.

[0032] refer to Figure 2 , 3As shown, in the present embodiment, the wafer batch transmission method is further provided with a box delivery mechanism 6, the output end of the lifting mechanism 4 is connected with a box pushing mechanism 7, the box pushing mechanism 7 is drivingly connected to the frame 1, and the frame 1 is provided with a first pick-up and drop-out port 103 and a second pick-up and drop-out port 104 corresponding to the first placement position 101 and the second placement position 102 respectively; in actual application, when it is necessary to place the wafer box on the frame 1, the lifting mechanism 4 drives the frame 1 to move above the first supporting seat 2 and the second supporting seat 3, the output end of the box delivery mechanism 6 carries the wafer box, and the box pushing mechanism 7 drives the frame 1 away from the first supporting seat 2, so that the top end of the box delivery mechanism 6 is penetrated into the first pick-up and drop-out port 103 or the second pick-up and drop-out port 104, and the box delivery mechanism 6 places the wafer box at the first placement position 101 or the second placement position 102, and the placement of the wafer box is smoothly realized; similarly, by performing the operation steps of placing the wafer box on the frame 1 in reverse, the frame 1 can be smoothly placed on the wafer box, which is conducive to quickly taking and placing the wafer box.

[0033] refer to Figure 2 , 3 As shown, in this embodiment, the box feeding mechanism 6 includes a box feeding horizontal module 61, a box feeding longitudinal module 62 drivingly connected to the box feeding horizontal module 61, and an output end of the box feeding longitudinal module 62 is connected to a box feeding bearing platform 63, and the box feeding horizontal module 61 drives the box feeding longitudinal module 62 and the box feeding bearing platform 63 to move, so that the box feeding bearing platform 63 corresponds to the first pick-up and release port 103 or the second pick-up and release port 104; refer to Figure 4 As shown, in actual application, when it is necessary to place the wafer box on the rack 1, the lifting mechanism 4 drives the rack 1 to move above the first supporting seat 2 and the second supporting seat 3, and the wafer box is placed on the box delivery platform 63, and the box pushing mechanism 7 drives the rack 1 away from the first supporting seat 2, so that the box delivery platform 63 extends into the rack 1 along the first access opening 103 or the second access opening 104, and the box delivery longitudinal module 62 drives the box delivery platform 63 and the wafer box to approach the first supporting seat 2 or the second supporting seat 3, so that the wafer box is placed in the first placement position 101 or the second placement position 102, so that the wafer The round box is placed on the rack 1, and the wafer box is successfully placed on the rack 1. Specifically, the first placement position 101 and the second placement position 102 are both equipped with four positioning blocks corresponding to the four sides of the bottom of the wafer box. When the bottom of the wafer box is inserted into the positioning blocks, the wafer box is accurately placed in the first placement position 101 or the second placement position 102. The first placement position 101 and the second placement position 102 are both provided with in-place sensors. The in-place sensors detect whether the wafer box is accurately placed in the first placement position 101 or the second placement position 102, so as to facilitate the determination of the loading condition of the wafer box and the rack 1.

[0034] refer to Figure 2 , 3As shown, in this embodiment, the box pushing mechanism 7 includes a box pushing platform 71 and a box pushing horizontal module 72 installed on the box pushing platform 71, the box pushing platform 71 is driven and connected to the lifting mechanism 4, the output end of the box pushing horizontal module 72 is driven and connected to the frame 1, and the frame 1 is slidably connected to the box pushing platform 71; in actual application, the cylinder used in the box pushing horizontal module 72, when it is necessary to place the wafer box on the frame 1, the lifting mechanism 4 drives the frame 1 to move above the first supporting seat 2 and the second supporting seat 3, the output end of the box sending mechanism 6 carries the wafer box, the box pushing horizontal module 72 drives the frame 1 away from the first supporting seat 2, so that the top end of the box sending mechanism 6 is penetrated into the first pick-up and release port 103 or the second pick-up and release port 104, the box sending mechanism 6 places the wafer box in the first placement position 101 or the second placement position 102, and successfully places the wafer box in the first placement position 101 or the second placement position 102.

[0035] refer to Figure 5 As shown, in this embodiment, the translation mechanism 5 adopts a reverse synchronous double slide module, and the two output ends of the translation mechanism 5 are respectively connected to the first support rod 51 and the second support rod 52, and the first support rod 51 and the second support rod 52 are respectively connected to the first bearing seat 2 and the second bearing seat 3; in actual application, the translation mechanism 5 drives the first support rod 51 and the second support rod 52 to move synchronously in the opposite direction, so that the first bearing seat 2 and the second bearing seat 3 move synchronously in the opposite direction. Therefore, when both wafer boxes are loaded with wafers, when the rack 1 descends relative to the first bearing seat 2 and the second bearing seat 3, the wafers in the two wafer boxes can be separated from the wafer boxes at the same time, and the wafers are synchronously held by the corresponding first bearing seat 2 and the second bearing seat 3, respectively, so that the wafers are quickly transferred from the wafer box to the first bearing seat 2 or the second bearing seat 3, thereby improving the wafer transfer efficiency; when the first bearing seat 2 and the second bearing seat 3 are close to each other, the contact surface of the first bearing seat 2 and the second bearing seat 3 is the center of the fifty merged wafers, which is convenient for determining the wafer loading center and improving the wafer transfer efficiency.

[0036] refer to Figure 2 , 7As shown, in this embodiment, a first accommodating space 511 is provided between the first supporting seat 2 and the first support rod 51, and a second accommodating space 521 is provided between the second supporting seat 3 and the second support rod 52; in actual application, when the first supporting seat 2 and the second supporting seat 3 are higher than the top opening of the wafer box, the translation mechanism 5 drives the first supporting seat 2 and the second supporting seat 3 to move closer, so that one end of one of the wafer boxes extends into the first accommodating space 511, and one end of the other wafer box extends into the second accommodating space 521. The structure is compactly arranged, saving space occupancy, and when the first supporting seat 2 and the second supporting seat 3 respectively hold their own twenty-five wafers, the first supporting seat 2 and the second supporting seat 3 are brought closer together to meet the robot's demand for batch transfer of wafers. The structural design is ingenious, which effectively shortens the time consumed in wafer transfer.

[0037] refer to Figure 5 , 6 As shown in Figures 7 and 8, in this embodiment, the first support rod 51 is connected to one of the output ends of the translation mechanism 5 through the first rotating unit 53, and the second support rod 52 is connected to the other output end of the translation mechanism 5 through the second rotating unit 54. In actual application, the first rotating unit 53 and the second rotating unit 54 use a gear set, a belt / chain transmission set or a worm gear transmission set to realize the rotation requirements of the first support rod 51 and the second support rod 52. When it is necessary to turn over the wafer on the first supporting seat 2, the lifting mechanism 4 drives the frame 1 relative to the first supporting seat 2. The supporting seat 2 descends, and the first supporting seat 2 is exposed at the opening end of the corresponding wafer box. The first rotating unit 53 drives the first support rod 51 to rotate, so that the wafer on the first supporting seat 2 is rotated 180° to meet the flipping requirement of the wafer; when it is necessary to flip the wafer on the second supporting seat 3, the lifting mechanism 4 drives the frame 1 to descend relative to the second supporting seat 3, and the second supporting seat 3 is exposed at the opening end of the corresponding wafer box. The second rotating unit 54 drives the second support rod 52 to rotate, so that the wafer on the second supporting seat 3 is rotated 180° to meet the flipping requirement of the wafer.

[0038] refer to Figure 6 As shown, in this embodiment, at least two first supporting parts 21 are symmetrically arranged on the top of the first supporting seat 2, and a plurality of first card grooves 22 adapted to the shape of the wafer and with the grooves facing upwards are arranged at intervals on the first supporting parts 21, so as to facilitate accurate positioning of the wafer; at least two second supporting parts 31 are symmetrically arranged on the top of the second supporting seat 3, and a plurality of second card grooves 32 adapted to the shape of the wafer and with the grooves facing upwards are arranged at intervals on the second supporting parts 31, so as to facilitate accurate positioning of the wafer.

[0039] refer to Figure 6As shown, in this embodiment, the first card slot 22 has an arc-shaped structure, and the centers of every two first card slots 22 that are adapted to the same wafer coincide with each other, so that the wafer can smoothly fit into the inner side of the first card slot 22, and when both ends of the wafer are inserted into the first card slot 22, the center of the wafer coincides with the center of the first card slot 22, which is convenient for improving the insertion stability of the wafer; the second card slot 32 has an arc-shaped structure, and the centers of every two second card slots 32 that are adapted to the same wafer coincide with each other, so that the wafer can smoothly fit into the inner side of the second card slot 32, and when both ends of the wafer are inserted into the second card slot 32, the center of the wafer coincides with the center of the second card slot 32, which is convenient for improving the insertion stability of the wafer.

[0040] refer to Figure 7 As shown, in this embodiment, the distance between two adjacent first card slots 22 is L1, and the distance between two adjacent second card slots 32 is L2; ​​when the first supporting seat 2 and the second supporting seat 3 are close to each other, the minimum distance between the adjacent first card slots 22 and the second card slots 32 is L3; L1, L2 and L3 satisfy L1=L2=L3, so that when the first supporting seat 2 and the second supporting seat 3 are close to each other, the interval between each two adjacent wafers is the same, which is convenient for stable transfer of wafers, helps the robot to quickly locate and grasp the wafers, and improves the wafer transfer efficiency.

[0041] refer to Figure 1 , 2 As shown, the present invention also provides a wafer batch transmission system, including a rack 1, a first placement position 101 and a second placement position 102 arranged on the rack 1 and used to place two wafer boxes respectively, a first carrier seat 2 and a second carrier seat 3 for holding wafers, a lifting mechanism 4 for driving the rack 1 to move up and down, and a translation mechanism 5 for driving the first carrier seat 2 and the second carrier seat 3 to move closer to or away from each other, the first carrier seat 2 and the second carrier seat 3 correspond to the first placement position 101 and the second placement position 102 respectively.

[0042] In actual application, when it is necessary to merge the wafers in the two wafer boxes, the frame 1 is driven to move by the lifting mechanism 4. The lifting mechanism 4 adopts a screw motor module, a cylinder or an electric cylinder, so that the first bearing seat 2 and the second bearing seat 3 are both located below the frame 1, and the wafer boxes containing wafers are placed in the first placement position 101 and the second placement position 102 respectively. Each wafer box has twenty-five wafers when it is filled with wafers. Therefore, after the wafers in the two wafer boxes are merged, a batch transfer of fifty wafers can be provided; the lifting mechanism 4 drives the frame 1 to descend relative to the first bearing seat 2 and the second bearing seat 3, and the first bearing seat 2 and the second bearing seat 3 are opened along the bottom end of the wafer box. The opening is extended into the wafer box, so that the wafers in the wafer box are held by the first supporting seat 2 and the second supporting seat 3 respectively, the lifting mechanism 4 continues to drive the frame 1 to descend relative to the first supporting seat 2 and the second supporting seat 3, so that the first supporting seat 2 and the second supporting seat 3 are higher than the top opening of the wafer box, the translation mechanism 5 drives the first supporting seat 2 and the second supporting seat 3 to move closer, so that the wafers on the first supporting seat 2 and the second supporting seat 3 are arranged side by side, and a robot is used to grab the merged fifty wafers and place them in the corresponding processing steps, so as to automatically realize the batch transfer of wafers, avoid the low efficiency, strong subjectivity and high error rate of manual operation, and improve the wafer transmission efficiency.

[0043] When it is necessary to load the merged wafers into two wafer boxes respectively, a manipulator is used to grab the merged fifty wafers, and the lifting mechanism 4 drives the frame 1 to descend relative to the first supporting seat 2 and the second supporting seat 3, so that the first supporting seat 2 and the second supporting seat 3 are higher than the top opening of the wafer box, and the translation mechanism 5 drives the first supporting seat 2 and the second supporting seat 3 to move closer, and the manipulator drives the merged fifty wafers to descend, so that the fifty wafers are loaded into the first supporting seat 2 and the second supporting seat 3 respectively. Twenty-five wafers are placed on the first supporting seat 2 and the second supporting seat 3 to meet the loading requirements of the wafer box, and the translation mechanism 5 drives the first supporting seat 2 and the second supporting seat 3 They are far away from each other so that the first supporting seat 2 and the second supporting seat 3 are respectively located at the opening ends of the wafer box, and the lifting mechanism 4 drives the frame 1 to rise relative to the first supporting seat 2 and the second supporting seat 3. The inner wall of the wafer box is usually provided with a plurality of recessed grooves adapted to the shape of the wafers so that multiple wafers can be clamped and confined in the wafer box. During the rising process of the frame 1 relative to the first supporting seat 2 and the second supporting seat 3, the bottom of the wafer is supported by the wafer box and then detaches from the first supporting seat 2 or the second supporting seat 3, so that the wafers on the first supporting seat 2 and the second supporting seat 3 are respectively supported by the two wafer boxes, so that each wafer box is smoothly equipped with corresponding twenty-five wafers.

[0044] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A wafer batch transmission method, characterized in that: The invention comprises a frame (1), a first placement position (101) and a second placement position (102) arranged on the frame (1) and used to place a wafer box respectively, a first support seat (2) and a second support seat (3) used to hold wafers, a lifting mechanism (4) used to drive the frame (1) to move up and down, and a translation mechanism (5) used to drive the first support seat (2) and the second support seat (3) to move closer to or away from each other, wherein the first support seat (2) and the second support seat (3) respectively correspond to the first placement position (101) and the second placement position (102); the steps of the wafer batch transmission method are as follows: S01. When it is necessary to take out and merge the wafers in the two wafer boxes, the lifting mechanism (4) is used to drive the frame (1) to move so that the first bearing seat (2) and the second bearing seat (3) are both located below the frame (1); S02, using a robot to place the wafer boxes containing wafers at the first placement position (101) and the second placement position (102), respectively, so that the lifting mechanism (4) drives the frame (1) to descend relative to the first bearing seat (2) and the second bearing seat (3), so that the first bearing seat (2) and the second bearing seat (3) extend into the wafer box along the bottom opening of the wafer box, so that the wafers in the wafer box are respectively held by the first bearing seat (2) and the second bearing seat (3); S03, using the lifting mechanism (4) to continue to drive the frame (1) to descend relative to the first supporting seat (2) and the second supporting seat (3), so that the first supporting seat (2) and the second supporting seat (3) are higher than the top opening of the wafer box, and using the translation mechanism (5) to drive the first supporting seat (2) and the second supporting seat (3) to move closer, so that the wafers on the first supporting seat (2) and the second supporting seat (3) are arranged side by side, so as to facilitate the robot to transfer the combined wafers in batches; S04, when it is necessary to load the combined wafers into two wafer boxes as a whole, the lifting mechanism (4) is used to drive the frame (1) to descend relative to the first bearing seat (2) and the second bearing seat (3), so that the first bearing seat (2) and the second bearing seat (3) are higher than the top opening of the wafer box, and the translation mechanism (5) is used to drive the first bearing seat (2) and the second bearing seat (3) to move closer; S05, using a robot to load the combined wafers into the first supporting seat (2) and the second supporting seat (3), so that the first supporting seat (2) and the second supporting seat (3) respectively hold half the number of wafers, moving the robot away from the first supporting seat (2) and the second supporting seat (3), and using the translation mechanism (5) to drive the first supporting seat (2) and the second supporting seat (3) away from each other, so that the first supporting seat (2) and the second supporting seat (3) are respectively located at the opening ends of the wafer box; S06. Using a lifting mechanism (4) to drive the frame (1) to rise relative to the first supporting seat (2) and the second supporting seat (3), the wafers on the first supporting seat (2) and the second supporting seat (3) are supported by two wafer boxes respectively, so that the two 25 wafers are combined into 50 wafers.

2. The wafer batch transmission method according to claim 1, characterized in that: The wafer batch transmission method is further provided with a box delivery mechanism (6); the output end of the lifting mechanism (4) is connected to a box pushing mechanism (7); the box pushing mechanism (7) is drivingly connected to the frame (1); the frame (1) is provided with a first pick-up and drop-out port (103) and a second pick-up and drop-out port (104) corresponding to the first placement position (101) and the second placement position (102), respectively; When it is necessary to place a wafer box on the rack (1), the lifting mechanism (4) drives the rack (1) to move above the first supporting seat (2) and the second supporting seat (3), the output end of the box delivery mechanism (6) carries the wafer box, and the box pushing mechanism (7) drives the rack (1) away from the first supporting seat (2), so that the top end of the box delivery mechanism (6) is inserted into the first loading and unloading opening (103) or the second loading and unloading opening (104), and the box delivery mechanism (6) places the wafer box at the first placement position (101) or the second placement position (102).

3. The wafer batch transmission method according to claim 2, characterized in that: The box delivery mechanism (6) comprises a box delivery horizontal module (61) and a box delivery longitudinal module (62) drivingly connected to the box delivery horizontal module (61); an output end of the box delivery longitudinal module (62) is connected to a box delivery bearing platform (63); the box delivery horizontal module (61) drives the box delivery longitudinal module (62) and the box delivery bearing platform (63) to move, so that the box delivery bearing platform (63) corresponds to the first pick-up and release port (103) or the second pick-up and release port (104); When it is necessary to place the wafer box on the rack (1), the lifting mechanism (4) drives the rack (1) to move above the first supporting seat (2) and the second supporting seat (3), and the wafer box is placed on the box delivery support platform (63). The box pushing mechanism (7) drives the rack (1) away from the first supporting seat (2), so that the box delivery support platform (63) extends into the rack (1) along the first loading and unloading opening (103) or the second loading and unloading opening (104). The box delivery longitudinal module (62) drives the box delivery support platform (63) and the wafer box to approach the first supporting seat (2) or the second supporting seat (3), so that the wafer box is placed in the first placement position (101) or the second placement position (102), so that the wafer box is placed on the rack (1).

4. The wafer batch transmission method according to claim 2, characterized in that: The box pushing mechanism (7) comprises a box pushing platform (71) and a box pushing horizontal module (72) mounted on the box pushing platform (71); the box pushing platform (71) is drivingly connected to the lifting mechanism (4); the output end of the box pushing horizontal module (72) is drivingly connected to the frame (1); and the frame (1) is slidably connected to the box pushing platform (71); When it is necessary to place a wafer box on the rack (1), the lifting mechanism (4) drives the rack (1) to move above the first supporting seat (2) and the second supporting seat (3), the output end of the box delivery mechanism (6) carries the wafer box, and the box pushing horizontal module (72) drives the rack (1) away from the first supporting seat (2), so that the top end of the box delivery mechanism (6) is inserted into the first loading and unloading opening (103) or the second loading and unloading opening (104), and the box delivery mechanism (6) places the wafer box at the first placement position (101) or the second placement position (102).

5. The wafer batch transmission method according to claim 1, characterized in that: The translation mechanism (5) adopts a reverse synchronous double slide module, and two output ends of the translation mechanism (5) are respectively connected to a first support rod (51) and a second support rod (52), and the first support rod (51) and the second support rod (52) are respectively connected to a first bearing seat (2) and a second bearing seat (3).

6. The wafer batch transmission method according to claim 5, characterized in that: A first accommodating space (511) is provided between the first bearing seat (2) and the first support rod (51), and a second accommodating space (521) is provided between the second bearing seat (3) and the second support rod (52); When the first supporting seat (2) and the second supporting seat (3) are higher than the top opening of the wafer box, the translation mechanism (5) drives the first supporting seat (2) and the second supporting seat (3) to move closer together, so that one end of one of the wafer boxes extends into the first accommodating space (511), and one end of the other wafer box extends into the second accommodating space (521).

7. The wafer batch transmission method according to claim 5, characterized in that: The first support rod (51) is connected to one output end of the translation mechanism (5) via a first rotation unit (53), and the second support rod (52) is connected to the other output end of the translation mechanism (5) via a second rotation unit (54); When it is necessary to turn over the wafer on the first supporting seat (2), the lifting mechanism (4) drives the frame (1) to descend relative to the first supporting seat (2), the first supporting seat (2) is exposed at the opening end of the corresponding wafer box, and the first rotating unit (53) drives the first supporting rod (51) to rotate, so that the wafer on the first supporting seat (2) is rotated by 180 degrees; When it is necessary to turn over the wafer on the second supporting seat (3), the lifting mechanism (4) drives the frame (1) to descend relative to the second supporting seat (3), the second supporting seat (3) is exposed at the opening end of the corresponding wafer box, and the second rotating unit (54) drives the second support rod (52) to rotate, so that the wafer on the second supporting seat (3) is rotated by 180 degrees.

8. The wafer batch transmission method according to claim 1, characterized in that: At least two first support parts (21) are symmetrically arranged on the top of the first bearing seat (2), and a plurality of first clamping grooves (22) adapted to the shape of the wafer and with the notches facing upwards are arranged at intervals on the first support parts (21); At least two second support parts (31) are symmetrically arranged on the top of the second bearing seat (3), and a plurality of second slots (32) matching the shape of the wafer and with the notches facing upwards are arranged at intervals on the second support parts (31); The first clamping slot (22) is an arc-shaped structure, and the centers of two first clamping slots (22) adapted to the same wafer coincide with each other; the second clamping slot (32) is an arc-shaped structure, and the centers of two second clamping slots (32) adapted to the same wafer coincide with each other.

9. The wafer batch transmission method according to claim 8, characterized in that: The distance between two adjacent first card slots (22) is L1, and the distance between two adjacent second card slots (32) is L2; ​​when the first bearing seat (2) and the second bearing seat (3) are brought close together, the minimum distance between adjacent first card slots (22) and second card slots (32) is L3; L1, L2 and L3 satisfy L1=L2=L3.

10. A wafer batch transmission system, characterized in that: A wafer batch transmission method for implementing any one of claims 1 to 9, comprising a rack (1), a first placement position (101) and a second placement position (102) arranged on the rack (1) and used to place a wafer box respectively, a first support seat (2) and a second support seat (3) for holding wafers, a lifting mechanism (4) for driving the rack (1) to move up and down, and a translation mechanism (5) for driving the first support seat (2) and the second support seat (3) to move closer to or away from each other, wherein the first support seat (2) and the second support seat (3) correspond to the first placement position (101) and the second placement position (102), respectively.

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