A semiconductor product handling control method, system and storage medium

Abstract

The present application relates to the technical field of semiconductor manufacturing, and discloses a method, system and storage medium for controlling the handling of semiconductor products. The method obtains the size parameters of the semiconductor to be handled based on the handling instruction, and accordingly obtains the adsorption instruction through the first matching strategy, so that the first actuator adsorbs the product with a preset fixing force. Combining the handling instruction with the size parameters, the motion parameters including the running speed, acceleration and deceleration time are obtained through the second matching strategy. During the handling, the real-time position is obtained, and the running speed is adjusted according to the positive correlation between the deviation from the predetermined position; the direction of movement is identified, and the first preset speed is set when it is consistent, and the second preset speed is set to a larger speed when it is inconsistent; the product shape is identified, and the third preset speed is set for a square, and the fourth preset speed is set for a circle, and the third preset speed is less than the fourth preset speed. This method can improve the accuracy of controlling the handling process of semiconductor products, and improve the handling efficiency and safety.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a method, system and storage medium for controlling the transportation of semiconductor products. Background Art

[0002] In the complex and highly sophisticated field of semiconductor manufacturing, product handling plays a pivotal role. Semiconductor products are known for their extremely delicate and fragile internal structures, which integrate a large number of tiny electronic components, such as transistors and integrated circuits. The size of these components is usually at the nanometer level, and the connections between them are extremely precise. The slightest carelessness may cause component damage or circuit connection failure.

[0003] During the handling process, precise control of the fixing force becomes one of the key factors to ensure product safety. If the fixing force is too strong, it may cause physical damage to the surface of the semiconductor product, such as deformation and breakage of the metal wiring on the surface of the wafer or square piece, thereby affecting the transmission of electronic signals; if the fixing force is insufficient, the product cannot be stably grasped, causing the product to fall during handling and cause serious damage.

[0004] At the same time, precise control of movement speed is also indispensable. If the handling speed is too fast, a large inertial force will be generated, which may cause displacement and falling of internal components of fragile semiconductor products, thereby destroying the integrity of the product. If the handling speed is too slow, it will affect production efficiency and increase production costs. Therefore, in the process of handling semiconductor products, how to achieve precise control of fixing force and movement speed while ensuring product safety has become an important issue that needs to be solved urgently, which has far-reaching significance for improving the quality and efficiency of semiconductor manufacturing. Summary of the invention

[0005] In order to improve the accuracy of control over the semiconductor product handling process, the present application provides a semiconductor product handling control method, system and storage medium.

[0006] In a first aspect, the present application provides a method for controlling the transport of semiconductor products, which adopts the following technical solution:

[0007] A method for controlling the handling of semiconductor products comprises the following steps:

[0008] Based on the preset transport instructions, obtain the size parameters of the semiconductor to be transported;

[0009] Obtaining an adsorption instruction based on a preset first matching strategy according to the size parameter, and the first actuator adsorbing the semiconductor to be transported using a preset fixing force in response to the adsorption instruction;

[0010] According to the transport instruction and the size parameter, motion parameters are matched based on a preset second matching strategy, where the motion parameters include a running speed, an acceleration time, and a deceleration time;

[0011] Obtaining the real-time position of the semiconductor to be transported;

[0012] Calculate the real-time position and compare it with the preset predetermined position, calculate the position deviation between the real-time position information and the predetermined position, and adjust the running speed according to the positive correlation of the position deviation, the larger the position deviation, the larger the running speed, and the smaller the position deviation, the smaller the running speed;

[0013] Identify the moving direction of the semiconductor to be transported, and if the moving direction is consistent with the transport direction, adjust the running speed to a first preset speed; when the moving direction is inconsistent with the transport direction, adjust the running speed to a second preset speed, and the second preset speed is greater than the first preset speed;

[0014] The shape of the semiconductor to be transported is identified. If the shape is square, the running speed is set to a third preset speed; if the shape is round, the running speed is set to a fourth preset speed, and the third preset speed is less than the fourth preset speed.

[0015] By adopting the above technical solutions, the fixing force is accurately controlled based on the size parameters to ensure product safety and avoid damage or falling due to improper fixing force. The motion parameters are obtained based on the handling instructions and size parameters, and the running speed is flexibly adjusted in combination with the real-time position deviation, movement direction and product shape. This not only improves the handling accuracy, but also adapts to different situations to ensure the efficiency and stability of the handling process. While ensuring product safety, it avoids the impact of unreasonable handling speed on production efficiency, thereby improving the overall quality and efficiency of semiconductor manufacturing.

[0016] Optionally, the acquisition of the motion parameters further includes the following sub-steps:

[0017] Acquire the real-time running speed of the semiconductor to be transported, and calculate the real-time acceleration time and the real-time deceleration time according to the real-time running speed;

[0018] Calculating the acceleration difference between the real-time acceleration time and the set acceleration time;

[0019] Calculating the deceleration difference between the real-time deceleration time and the set deceleration time;

[0020] If the acceleration difference is greater than a preset acceleration threshold, the acceleration time is adjusted according to the acceleration difference; the larger the acceleration difference is, the longer the acceleration time is; the smaller the acceleration difference is, the shorter the acceleration time is;

[0021] If the deceleration difference is greater than a preset deceleration threshold, the deceleration time is adjusted according to the deceleration difference; the larger the deceleration difference is, the longer the deceleration time is; the smaller the deceleration difference is, the shorter the deceleration time is;

[0022] If the acceleration difference is less than or equal to a preset acceleration threshold and the deceleration difference is less than or equal to a preset deceleration threshold, then obtaining the gravity parameter of the semiconductor to be transported;

[0023] Calculating a dimension verification parameter according to the gravity parameter;

[0024] The matching degree between the size verification parameter and the size parameter is determined, and if the matching degree is lower than a preset matching threshold, an early warning prompt is issued.

[0025] By adopting the above technical solution, the method for obtaining the size parameters of the semiconductor to be transported can dynamically adjust the acceleration and deceleration time to ensure the stability and accuracy of the transport process by monitoring the running speed in real time, calculating and comparing the difference between the real-time acceleration and deceleration time and the set value. When the acceleration and deceleration differences meet the threshold requirements, the gravity parameters are introduced to calculate the size verification parameters to determine the matching degree with the original size parameters. If the matching degree is low, an early warning is issued, which helps to timely discover possible deviations in the size parameters, avoid the transportation risks caused by inaccurate size parameters in advance, and improve the reliability and safety of the semiconductor product transportation process.

[0026] Optionally, the method for obtaining the size parameters of the semiconductor to be transported includes the following sub-steps:

[0027] Acquiring a real-time image of the semiconductor to be transported;

[0028] identifying target features from the real-time image;

[0029] The pixel ratio of the target feature is calculated, and the size parameter is calculated according to the pixel ratio and the preset calibration parameter.

[0030] By adopting the above technical solution, the measurement accuracy can be greatly improved by identifying the target features in the real-time image and calculating its pixel ratio, and combining the preset calibration parameters to determine the size parameters. Semiconductor products are extremely precise, and the size of internal components is often at the nanometer level. This method can accurately measure to the micron or even nanometer level, providing accurate size data for subsequent handling control, ensuring the accurate setting of key parameters such as fixing force and movement speed during handling, and improving handling safety and reliability. The entire process has a high degree of automation, and the real-time image acquisition and processing speed is fast. It can complete the acquisition of a large number of semiconductor product size parameters in a short time, significantly improving production efficiency, and meeting the needs of large-scale and high-speed production in the semiconductor manufacturing industry.

[0031] Optionally, the method in which the first actuator absorbs the semiconductor to be transported using a preset fixing force in response to the absorption instruction comprises the following sub-steps:

[0032] Obtain the real-time fixing force of the semiconductor to be transported;

[0033] According to the real-time fixing force, the product status value of the semiconductor to be transported is calculated =

[0034] |(Real-time fixing force - preset fixing force)| / preset fixing force;

[0035] The running speed of the semiconductor to be transported is adjusted according to the product status value. The larger the product status value is, the smaller the running speed is, and the smaller the product status value is, the faster the running speed is.

[0036] By adopting the above technical solution, by obtaining the real-time fixing force of the current semiconductor to be transported and calculating the product status value accordingly, the adsorption state of the semiconductor product can be monitored in real time and accurately. In the process of transporting semiconductor products, the product status value directly reflects the degree of deviation between the real-time fixing force and the preset fixing force, providing a quantitative basis for timely understanding the adsorption stability of the product. The running speed of the semiconductor to be transported is adjusted according to the product status value, and a dynamic relationship between the adsorption state and the transport speed is established. When the product status value is larger, it indicates that the deviation between the real-time fixing force and the preset fixing force is larger. At this time, reducing the running speed can effectively reduce the risk of product falling due to unstable adsorption and ensure the safety of the product during the transport process; and when the product status value is smaller, it indicates that the adsorption state is more stable, and correspondingly increasing the running speed will help improve the transport efficiency. Under the premise of ensuring product safety, the overall transport process is optimized. Through this dynamic adjustment mechanism, refined control of the transport process is achieved. In the field of semiconductor manufacturing, which is precise and has extremely high requirements for product quality, the ability to flexibly adjust the transport speed according to the real-time adsorption state of the product helps to reduce potential damage to the product during the transport process and improve the overall quality of the product, which is of great significance to ensuring the smooth progress of the semiconductor manufacturing process and improving production efficiency.

[0037] Optionally, the step of adjusting the running speed of the semiconductor to be transported according to the product status value further includes the following sub-steps:

[0038] Calculate the dispersion coefficient of the product status value within the set time period as a comprehensive value;

[0039] If the comprehensive value is greater than a first predetermined value, determining whether the real-time fixing force is within a first force range;

[0040] If the real-time fixing force is within the first force range, adjusting the acceleration time of the semiconductor to be transported inversely according to the comprehensive value;

[0041] The larger the comprehensive value is, the longer the acceleration time is; the smaller the comprehensive value is, the shorter the acceleration time is.

[0042] By adopting the above technical solution, by calculating the discrete coefficient of the product status value within the set time period as a comprehensive value, the fluctuation of the adsorption state of the product within a period of time can be effectively monitored. Compared with the product status value at a single moment, this comprehensive value provides a more comprehensive and dynamic evaluation of the product adsorption stability, helping to timely discover potential adsorption anomalies. When the comprehensive value is greater than the first predetermined value, it is further determined whether the real-time fixing force is within the first force range. This refined judgment logic can accurately locate the problem. If the real-time fixing force is within this range, it is of great significance to adjust the acceleration time of the semiconductor to be transported according to the anti-correlation of the comprehensive value. The larger the comprehensive value, the more violent the fluctuation of the product status value. At this time, extending the acceleration time can make the handling process smoother, reduce the impact on unstable adsorption products due to excessive acceleration, thereby reducing the risk of product falling or damage, and ensuring product safety. On the contrary, the smaller the comprehensive value, the shorter the acceleration time, which helps to improve the handling efficiency and optimize the overall production rhythm while ensuring safety. This mechanism of dynamically adjusting the acceleration time based on the fluctuation of the product adsorption state greatly improves the stability and controllability of the semiconductor product handling process. In the high-precision environment of semiconductor manufacturing, the potential impact of unstable handling processes on product quality is effectively reduced, providing a strong guarantee for improving the production quality and efficiency of semiconductor products.

[0043] Optionally, the step of calculating the discrete coefficient of the product status value within a set time period as a comprehensive value further includes the following sub-steps:

[0044] If the comprehensive value is less than or equal to the first predetermined value, determining whether the real-time fixing force is within a second force range;

[0045] If the real-time fixing force is within the second force range, adjusting the maximum movement speed of the semiconductor to be transported according to the comprehensive value; wherein the value within the second force range is smaller than the value within the first force range;

[0046] The larger the comprehensive value is, the smaller the maximum movement speed is; and the smaller the comprehensive value is, the larger the maximum movement speed is.

[0047] By adopting the above technical solution, when the calculated comprehensive value is less than or equal to the first predetermined value, it is further determined whether the real-time fixing force is in the second force range, and a comprehensive and detailed product status evaluation system is constructed. This judgment process can formulate differentiated handling strategies for different fixing force conditions to ensure that the handling process is closely adapted to the actual status of the product. If the real-time fixing force is in the second force range, it is of key significance to adjust the maximum movement speed of the semiconductor according to the comprehensive value. Since the value in the second force range is smaller than the first force range, it means that the real-time fixing force on the product is relatively weak. At this time, adjusting the maximum movement speed by the comprehensive value can achieve precise control of the handling process. When the comprehensive value is larger, it means that the product status value is within a relatively stable range but the fluctuation is still obvious. At this time, reducing the maximum movement speed can avoid the risk of displacement and falling of the product under a weak fixing force due to excessive speed, which effectively guarantees the safety and stability of the product during handling. On the contrary, the smaller the comprehensive value, the more stable the product status. Appropriately increasing the maximum movement speed can improve the overall handling efficiency while ensuring product safety, optimize the production process, and make the handling of semiconductor products more efficient and reasonable. This method of dynamically adjusting the maximum movement speed based on the comprehensive value and real-time fixed force range not only improves the adaptability to different product states, but also achieves a balance between production efficiency and safety while ensuring product quality, which plays a strong role in optimizing and protecting the product handling link in the semiconductor manufacturing process.

[0048] Optionally, the method further comprises the following steps:

[0049] Get the fan speed of multiple FFU laminar air supply units in the air purification unit;

[0050] The running speed of the semiconductor to be transported is adjusted according to the positive correlation of the fan speed; the greater the fan speed, the smaller the running speed; the smaller the fan speed, the greater the running speed.

[0051] By adopting the above technical solutions, a clean production environment is crucial in the field of semiconductor manufacturing, because even tiny dust particles may cause damage to delicate semiconductor products. The air purification unit composed of multiple FFU laminar air supply units forms laminar airflow through the operation of the fan, effectively filters impurities in the air, and creates a clean space for the transportation of semiconductor products. According to the positive correlation between the fan speed of the air supply unit, adjusting the running speed of the semiconductor to be transported is a key measure to ensure the balance between product quality and production efficiency. When the fan speed is higher, it means that the air purification unit is operating at full capacity to maintain a highly clean environment. At this time, reducing the running speed of the semiconductor can reduce the airflow disturbance caused by rapid movement, prevent the purified air from being disturbed, ensure that the product is always in a clean airflow environment, minimize the risk of dust particles adhering to the product, and ensure the quality and performance of semiconductor products. On the contrary, the lower the fan speed, the relatively stable environment cleanliness and maintain a low energy consumption state. Appropriately increasing the running speed of the semiconductor can improve the handling efficiency, speed up the production rhythm without affecting the product quality, and improve the overall production efficiency. This adjustment method can also achieve the coordinated optimization of equipment operation. On the one hand, it avoids the reduction of purification effect due to rapid handling of semiconductors when high cleanliness is required. On the other hand, it prevents the waste of production resources due to slow handling speed when the cleanliness is stable, promotes the harmonious operation of the air purification unit and the semiconductor handling process, and improves the stability and reliability of the entire semiconductor manufacturing system.

[0052] Optionally, the method further comprises the following steps:

[0053] Get the air supply angle of the current air supply unit among multiple FFU laminar air supply units in the air purification unit;

[0054] The running speed of the semiconductor to be transported is adjusted inversely according to the air supply angle; the larger the air supply angle, the smaller the running speed; the smaller the air supply angle, the faster the running speed.

[0055] By adopting the above technical solutions, maintaining a clean air environment is crucial to product quality in the semiconductor manufacturing environment. Multiple FFU laminar air supply units can form a specific laminar airflow by precisely controlling the air supply angle, effectively blocking and filtering pollutants such as dust particles in the air to prevent them from contacting delicate semiconductor products. When the air supply angle is larger, the laminar airflow covers a wider range, but the concentration and intensity of the airflow may be relatively weakened. At this time, reducing the running speed of the semiconductor to be transported can ensure that the product has enough time to be protected by stable and effective airflow when passing through the purification area, reducing the airflow disturbance that may be caused by the rapid movement of the product, thereby minimizing the risk of dust particles adhering to the surface of the product, and effectively ensuring the quality and performance of semiconductor products. On the contrary, when the air supply angle is smaller, the airflow is more concentrated and the intensity is greater, and the purification effect is more significant in local areas. In this case, appropriately increasing the running speed of the semiconductor can not only make full use of the efficient purification airflow, but also speed up the handling efficiency, and improve the overall production rhythm without affecting the cleanliness of the product, and avoid the waste of production resources due to too slow a handling speed. In addition, this mechanism of dynamically adjusting the handling speed based on the air supply angle also promotes the coordinated optimization of the air purification unit and the semiconductor handling process. It enables the entire manufacturing system to flexibly adjust operating parameters according to actual purification needs and product handling conditions, improves the stability and reliability of the system, and provides a more efficient and safe environmental guarantee for the semiconductor manufacturing process.

[0056] In a second aspect, the present application provides a semiconductor product handling control system, which adopts the following technical solution:

[0057] A semiconductor product handling control system includes a processor, wherein the processor executes the steps of any one of the semiconductor product handling control methods described above.

[0058] In a third aspect, the present application provides a storage medium, which adopts the following technical solution:

[0059] A storage medium stores a program, wherein the program, when executed by a processor, implements the steps of any one of the above-mentioned methods for controlling the transport of semiconductor products.

[0060] In summary, the present application includes at least one of the following beneficial technical effects:

[0061] Precise handling control: Based on the size parameters of the semiconductor to be handled, the fixing force is precisely controlled through preset strategies to avoid damage or falling of the product due to improper fixing force, ensuring product safety. The motion parameters are obtained by combining the handling instructions with the size parameters, and the running speed is flexibly adjusted according to the real-time position deviation, movement direction and product shape, which improves the handling accuracy, ensures the efficiency and stability of the handling process, and improves the overall quality and efficiency of semiconductor manufacturing.

[0062] Accurate acquisition and verification of dimensional parameters: By real-time monitoring of the running speed, the real-time acceleration and deceleration time is calculated and compared with the set value, and the acceleration and deceleration time is dynamically adjusted to ensure smooth and accurate handling. When the difference between acceleration and deceleration meets the threshold requirements, the gravity parameter is introduced to calculate the dimensional verification parameter, and the matching degree with the original dimensional parameter is judged. When the matching degree is low, an early warning is issued to avoid the handling risks caused by inaccurate dimensional parameters in advance, and improve the reliability and safety of handling. At the same time, the target features are recognized by real-time images and the dimensional parameters are calculated in combination with calibration parameters. The degree of automation is high and the speed is fast. It can be accurately measured to the micron or even nanometer level, meeting the needs of large-scale and high-speed production, and providing accurate data support for handling control.

[0063] Dynamic adjustment based on adsorption state: By calculating the product status value, the adsorption state of semiconductor products is monitored in real time, and the operating speed is adjusted according to it, a dynamic relationship between the adsorption state and the handling speed is established, and the handling process is optimized on the premise of ensuring product safety, and refined control is achieved to reduce potential damage to products during the handling process and improve the overall quality of products. Further, by calculating the discrete coefficient of the product status value as a comprehensive value, the acceleration time and maximum movement speed are dynamically adjusted according to the comprehensive value and the range of the real-time fixing force, which improves the stability, controllability and adaptability of the semiconductor product handling process to different product states, and achieves a balance between production efficiency and safety.

[0064] Co-optimization with the air purification unit: Dynamically adjust the running speed of the semiconductors to be transported based on the fan speed or air supply angle of the air purification unit. While ensuring that the products are in a clean production environment and reducing the risk of dust particles damaging the products, it achieves a balance between product quality and production efficiency, promotes the coordinated operation of the air purification unit and the semiconductor handling process, improves the stability and reliability of the entire semiconductor manufacturing system, and provides a more efficient and safe environmental guarantee for the semiconductor manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 The present invention is a step diagram of a method for controlling the transport of semiconductor products.

[0066] Figure 2 It is a sub-step diagram of a method in which a first actuator uses a preset fixing force to absorb the semiconductor to be transported in response to the absorption instruction.

[0067] Figure 3 It is a step diagram for adjusting the running speed of the semiconductor to be transported according to the product status value. DETAILED DESCRIPTION

[0068] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings.

[0069] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0070] The present application embodiment discloses a method for controlling the transport of semiconductor products. Figure 1 , including the following steps:

[0071] Based on the preset handling instructions, the size parameters of the semiconductor to be handled are obtained by obtaining manually input data. At the same time, the size parameters of the semiconductor to be handled can also be obtained with the help of a visual recognition system or a high-precision measurement sensor. For example, in a semiconductor handling system, an industrial camera equipped with an ultra-high-resolution lens can clearly capture the subtle contours of semiconductor wafers or square pieces, and accurately measure the key size data of the wafers or square pieces, such as length, width, height, and pin spacing.

[0072] According to the acquired size parameters, the adsorption instruction is quickly obtained according to the preset first matching strategy. At this time, the first actuator, that is, the robotic arm, will quickly respond to the adsorption instruction through the vacuum adsorption gripper, and use the preset fixing force to adsorb the semiconductor to be transported. In this embodiment, the semiconductor to be transported is a wafer or a square piece. According to its size, the fixing force of the vacuum adsorption gripper is accurately set to X Newtons through the algorithm to ensure that the wafer or square piece can be firmly grasped without being crushed by excessive fixing force.

[0073] According to the handling instructions and size parameters, with the help of the preset second matching strategy, key motion parameters are matched, including running speed, acceleration time and deceleration time. For example, when transporting a batch of wafers or squares, it is calculated that the running speed is Y meters per minute, the acceleration time is set to Z seconds, and the deceleration time is also set to Z seconds, so as to ensure the smoothness of the handling process and avoid damage to the wafers or squares due to sudden changes in speed.

[0074] During the handling process, the real-time position of the semiconductor to be transported is continuously obtained. By installing high-precision position sensors on the handling equipment, the position information of the semiconductor products can be fed back in real time. For example, the use of laser displacement sensors can accurately measure the position coordinates of the semiconductor in three-dimensional space, and the error is controlled at the micron level.

[0075] The real-time position is carefully compared with the preset position, and the position deviation between the real-time position information and the preset position is accurately calculated. Then, the running speed is adjusted according to the positive correlation of the position deviation, that is, the larger the position deviation, the higher the running speed; the smaller the position deviation, the lower the running speed.

[0076] At the same time, the moving direction of the semiconductor to be transported is identified. If the moving direction is consistent with the transport direction, the running speed is adjusted to the first preset speed; when the moving direction is inconsistent with the transport direction, the running speed is adjusted to the second preset speed, and the second preset speed is greater than the first preset speed. For example, in a semiconductor production line, when the semiconductor product moves forward according to the planned path, it means that the semiconductor product is being transported, and the speed is maintained at Y meters per minute. When the moving direction is inconsistent with the transport direction, it indicates that the transport is completed and the transport robot is in the state of returning to its original position. At this time, there is no semiconductor product on the transport robot, so it can accelerate the movement, and the speed is automatically increased to (Y+C) meters per minute to improve the transport efficiency.

[0077] Identify the shape of the semiconductor to be transported. If the shape is square, set the running speed to the third preset speed; if the shape is round, set the running speed to the fourth preset speed, and the third preset speed is less than the fourth preset speed. For example, for a square semiconductor module, considering its directionality, the square piece should be transported in a set posture, so the running speed is set to D meters per minute. For a round semiconductor wafer, since it does not need to consider the posture during adsorption during transportation, only the center positioning is required, the speed can be set to (D+E) meters per minute, which is faster.

[0078] For example, in an automated production line of a semiconductor manufacturing plant, the handling equipment is responsible for moving semiconductor products from processing station A to assembly station B. The pre-set location information is determined by a precise coordinate system, for example, the coordinates of station A are (100, 200, 50), and the coordinates of station B are (300, 400, 50), in millimeters.

[0079] During the operation of the handling equipment, the position information of the semiconductor products to be handled is obtained in real time through high-precision position sensors, such as laser range finders and gyroscopes. After the handling equipment has been running for a period of time, the real-time position sensor feedbacks that the position coordinates of the product at this time are (150, 230, 50). By comparing with the established position (B station coordinates), the position deviation is calculated using spatial coordinates. On the two-dimensional plane (X and Y axis directions), the position deviation in the X-axis direction is 150-300=-150 mm, and the position deviation in the Y-axis direction is 230-400=-170 mm. The total position deviation is calculated by the Pythagorean theorem to be approximately sqrt(150²+170²)≈226.7 mm, where the sqrt function means square root.

[0080] According to the rule that "the greater the position deviation, the greater the running speed, and the smaller the position deviation, the smaller the running speed", suppose the original running speed of the handling equipment is set to 200 mm per minute. Due to the large current position deviation, the system will automatically increase the running speed. Through the pre-set algorithm, the speed is increased to 300 mm per minute, allowing the handling equipment to approach the set position faster and improve handling efficiency.

[0081] As the handling equipment approaches station B, the real-time position coordinates become (280, 380, 50), and the position deviation is calculated again. The deviation in the X-axis direction is 280-300=-20 mm, and the deviation in the Y-axis direction is 380-400=-20 mm. The total position deviation is approximately sqrt((-20)²+(-20)²)≈28.3 mm. At this time, the position deviation becomes smaller, and the system automatically reduces the operating speed according to the rules, such as adjusting the speed to 150 mm per minute, so as to more accurately transport the product to station B, avoid missing the target position due to excessive speed or causing impact on the equipment and products, thereby ensuring the accuracy and stability of the entire handling process.

[0082] Based on the size parameters, the fixing force is precisely controlled to ensure product safety and effectively avoid damage or falling caused by improper fixing force. The motion parameters are obtained according to the handling instructions and size parameters, and the running speed is flexibly adjusted in combination with the real-time position deviation, movement direction and product shape. This not only improves the handling accuracy, but also adapts to different situations to ensure the efficiency and stability of the handling process. While ensuring product safety, it avoids the impact of unreasonable handling speed on production efficiency, thereby comprehensively improving the overall quality and efficiency of semiconductor manufacturing.

[0083] The acquisition of motion parameters also includes the following sub-steps:

[0084] With the help of high-precision speed monitoring equipment, the real-time running speed of the semiconductors to be transported is continuously obtained. Based on this real-time running speed, the real-time acceleration time and real-time deceleration time can be accurately calculated using a specific kinematic algorithm. For example, by accurately analyzing the speed change rate and combining it with the motion characteristic equation of the transport equipment, the real-time acceleration time that the semiconductor experiences from static to current speed under the current operating conditions, as well as the real-time deceleration time required to decelerate from the current speed to stop can be obtained.

[0085] Subsequently, the calculated real-time acceleration time is compared with the preset acceleration time to calculate the acceleration difference between the two. Similarly, the difference between the real-time deceleration time and the preset deceleration time is also calculated. These differences can intuitively reflect the deviation between the actual acceleration and deceleration process and the ideal setting.

[0086] If the calculated acceleration difference is greater than the preset acceleration threshold, it indicates that the actual acceleration process deviates greatly from the expected one. At this point, the system will adjust the set acceleration time accordingly based on the size of the acceleration difference. Specifically, the larger the acceleration difference, the greater the difference between the actual acceleration process and the ideal state. In order to make the subsequent acceleration process closer to the ideal state and ensure the stability of the handling process, the acceleration time needs to be extended; conversely, the smaller the acceleration difference, the smaller the adjustment of the acceleration time, and the acceleration time is shortened accordingly.

[0087] If the deceleration difference is greater than the preset deceleration threshold, the processing method is similar to the acceleration case. The system will adjust the set deceleration time according to the size of the deceleration difference. The larger the deceleration difference, the longer the deceleration time needs to be in order to avoid the impact on the semiconductor products caused by excessive deceleration, resulting in damage to the internal precision components; the smaller the deceleration difference, the shorter the deceleration time.

[0088] For example, in a semiconductor production line, the handling equipment is responsible for moving semiconductor wafers from one processing area to another. The preset acceleration time is 3 seconds, the deceleration time is 3 seconds, the preset acceleration threshold is 0.5 seconds, and the deceleration threshold is 0.5 seconds. The specific data in the example is only for explaining the principle of the solution and does not involve real data.

[0089] During a handling process, the speed sensor monitors and calculates the real-time acceleration time of the semiconductor wafer to be 4 seconds. The acceleration difference is calculated, that is, 4-3=1 second. 1 second is greater than the preset acceleration threshold of 0.5 seconds, which indicates that the actual acceleration process deviates greatly from expectations. Since the acceleration difference is 1 second, which is relatively large, the system will extend the acceleration time. For example, the acceleration time is extended from the original 3 seconds to 4.5 seconds. In this way, in subsequent handling, the equipment has more time to gradually increase the speed, making the acceleration process closer to the ideal state, ensuring that the wafer will not shake or shift due to excessive acceleration during the handling process, and ensuring smooth handling.

[0090] Looking at the deceleration stage, assume that the preset deceleration time is 3 seconds, and the real-time monitored deceleration time is 2 seconds. Calculate the deceleration difference, 3-2=1 second, 1 second is greater than the preset deceleration threshold of 0.5 seconds. Because the deceleration difference is large, in order to avoid the impact of excessive deceleration on the delicate circuits and components inside the semiconductor wafer, the system decides to extend the deceleration time. For example, extending the deceleration time from 3 seconds to 4 seconds allows the equipment to slow down more slowly, reducing the impact on the wafer and protecting the integrity of the wafer.

[0091] On the contrary, if in another transport, the real-time acceleration time is 3.2 seconds, the acceleration difference is 3.2-3=0.2 seconds, and 0.2 seconds is less than the preset acceleration threshold of 0.5 seconds, then the system will adjust the acceleration time less, and the acceleration time can be shortened to 3.1 seconds, fine-tuning the acceleration process to match the preset state. Similarly, if the real-time deceleration time is 2.8 seconds, the deceleration difference is 3-2.8=0.2 seconds, which is less than the deceleration threshold, the system can shorten the deceleration time to 2.9 seconds, ensuring that the deceleration process is more accurate and efficient.

[0092] When the acceleration difference is less than or equal to the preset acceleration threshold, and the deceleration difference is also less than or equal to the preset deceleration threshold, it means that the current acceleration and deceleration process basically meets the expected settings. At this time, the system will further obtain the gravity parameters of the semiconductor to be transported. This is usually achieved through a high-precision gravity sensor, which can accurately measure the gravity of the semiconductor.

[0093] Based on the acquired gravity parameters, the dimension verification parameters are calculated using specific physical formulas and algorithms. This process involves physical principles such as the density of semiconductor materials, the relationship between gravity and volume. Through the comprehensive calculation of these parameters, the relevant parameter values ​​that can be used to verify the dimensions are obtained.

[0094] Taking wafers as an example, wafers are generally 4 inches, 6 inches, 8 inches, 12 inches, and 18 inches, and each size has a standard thickness, and its thickness is generally as follows:

[0095] 4 inches (100 mm): Thickness is typically about 525 µm.

[0096] 6 inches (150mm): Standard thickness is approximately 675µm, usually between 650µm and 700µm.

[0097] 8 inches (200 mm): Standard thickness is approximately 725 µm, usually between 700 µm and 750 µm.

[0098] 12 inches (300mm): Standard thickness is approximately 775µm, usually between 750µm and 800µm.

[0099] Therefore, since the density of the wafer is consistent, the volume can be calculated based on the volume of the cylinder, and then the corresponding weight can be calculated based on the density. Conversely, the gravity parameters can be matched to the corresponding gravity range, combined with the standard thickness, to calculate the size verification parameters, that is, the size of the wafer.

[0100] For semiconductor wafers, there are also fixed size and thickness specifications, and the calculation method is the same.

[0101] Finally, the calculated dimension verification parameters are compared with the dimension parameters initially obtained to determine the degree of match. If the degree of match between the two is lower than the preset matching threshold, this means that the dimension parameters initially obtained may be deviated. Once this happens, the system will immediately issue an early warning. This early warning can promptly notify the operator to take measures in advance, such as re-measuring the dimension parameters, checking the operating status of the handling equipment, etc., thereby effectively avoiding the handling risks caused by inaccurate dimension parameters and greatly improving the reliability and safety of the semiconductor product handling process.

[0102] The method for obtaining the size parameters of the semiconductor to be transported comprises the following sub-steps:

[0103] Get real-time images of semiconductors to be transported. In actual production scenarios, high-resolution industrial cameras are usually installed at specific locations on handling equipment. For example, on an automated production line in a semiconductor manufacturing plant, these industrial cameras have a resolution of millions of pixels and can capture images at a rate of tens of frames per second. They are precisely adjusted to the best shooting angle to ensure that the full picture of the semiconductor product can be clearly captured, whether it is the subtle texture of the surface or the precise contour of the edge, which can be clearly presented in the real-time image captured.

[0104] After acquiring the real-time image, the next step is to identify the target features from the image. With the help of advanced image recognition algorithms, the system can intelligently analyze the semiconductor products in the image, and the target features are wafers or square pieces.

[0105] After identifying the target feature, calculating the pixel ratio of the target feature is a key step. By counting the number of pixels occupied by the target feature and comparing it with the total number of pixels in the entire image, the pixel ratio of the target feature is obtained. For example, if a wafer or a square occupies 10,000 pixels in the image, and the total number of pixels in the entire image is 1,000,000, then the pixel ratio of the wafer or square is 1%. At the same time, combined with the preset calibration parameters, a specific mathematical model is used to calculate the size parameters. The calibration parameters are determined by photographing and measuring standard samples of known sizes during the equipment installation and commissioning phase. It establishes an accurate correspondence between image pixels and actual physical dimensions. Assuming that the preset calibration parameters indicate that every 1,000 pixels corresponds to an actual length of 1 mm, then based on the pixel ratio of the above wafer or square, it can be calculated that the actual length of the wafer or square is 10 mm.

[0106] The method of determining the size parameters by identifying the target features in the real-time image and calculating its pixel ratio, combined with the preset calibration parameters, has many significant advantages and greatly improves the measurement accuracy. This method can be accurate to micrometers or even nanometers with its high-resolution image acquisition and precise algorithm operation. In practical applications, the size measurement error can be controlled within a very small range. For example, for a wafer or square piece with a size of 100 microns, the measurement error can be controlled within ±0.1 microns. This provides accurate size data for subsequent handling control and ensures the accurate setting of key parameters such as fixing force and movement speed during handling. For example, when determining the size of the fixing force, it is necessary to calculate the appropriate adsorption area according to the precise size of the wafer or square piece, and then set the size of the fixing force to ensure that the wafer or square piece can be firmly adsorbed without causing damage to the wafer or square piece due to excessive fixing force. When setting the movement speed, accurate size parameters help to more accurately calculate factors such as inertial force, so as to reasonably adjust the handling speed and improve the safety and reliability of handling.

[0107] In addition, the entire process is highly automated, and the real-time image acquisition and processing speed is fast. In a large-scale production environment, such as a semiconductor production workshop that needs to move thousands of semiconductor products per hour, this method can respond quickly and complete the acquisition of a large number of semiconductor product size parameters in a short period of time. Industrial cameras quickly capture images, and advanced image recognition algorithms, supported by high-performance computing equipment, can complete target feature recognition and size parameter calculations within milliseconds. Compared with traditional manual measurement or other inefficient measurement methods, it greatly improves production efficiency and significantly meets the needs of large-scale, high-speed production in the semiconductor manufacturing industry.

[0108] Reference Figure 2 The method in which the first actuator uses a preset fixing force to absorb the semiconductor to be transported in response to the absorption instruction comprises the following sub-steps:

[0109] With the help of high-precision force sensors, the real-time fixing force of the semiconductor to be transported can be continuously obtained. This type of force sensor has extremely high sensitivity and accuracy, and can sense and feedback the actual fixing force value of the semiconductor in real time and accurately. For example, on the automated handling line of an advanced semiconductor manufacturing plant, the force sensor is installed at the contact point between the adsorption device and the semiconductor product, and can accurately measure the force change to the millinewton level. Assume that when transporting a common wafer or square piece, the force sensor monitors in real time that the fixing force of the wafer or square piece is 50 millinewton.

[0110] Based on the real-time fixing force obtained, the product status value of the semiconductor to be transported is obtained through a specific calculation formula. The calculation formula is: product status value = | (real-time fixing force - preset fixing force) | / preset fixing force. Continuing with the above-mentioned wafer or square piece as an example, if the preset fixed fixing force is 55 millinewtons, then according to the formula, the product status value of the wafer or square piece = | (50-55) | / 55 ≈ 0.091. This value intuitively and quantitatively reflects the degree of deviation between the real-time fixing force and the preset fixing force.

[0111] Based on the calculated product status value, the running speed of the semiconductor to be transported is intelligently adjusted. The principle of adjustment is that the larger the product status value, the smaller the running speed; the smaller the product status value, the larger the running speed. In the actual handling scenario, when the product status value is large, it means that the real-time fixing force deviates greatly from the preset fixing force, and the adsorption state is unstable. For example, when transporting another semiconductor module of a slightly larger size, the calculated product status value reaches 0.2. At this time, in order to effectively reduce the risk of product falling due to unstable adsorption and ensure the safety of the product during the handling process, the running speed of the handling equipment will be reduced accordingly. Assuming that the original normal operating speed is 10 meters per minute, it will be reduced to 6 meters per minute at this time. On the contrary, when the product status value is small, it indicates that the adsorption state is stable. For example, when transporting a batch of small integrated circuits, the product status value is only 0.03. At this time, increasing the running speed accordingly can help improve the handling efficiency. The original speed is 8 meters per minute, which will be increased to 12 meters per minute. Under the premise of ensuring product safety, the overall handling process is optimized.

[0112] By obtaining the real-time fixing force of the semiconductor to be transported and calculating the product status value based on it, the adsorption state of the semiconductor product can be monitored in real time and accurately. In the process of transporting semiconductor products, the product status value becomes a quantitative indicator that directly reflects the degree of deviation between the real-time fixing force and the preset fixing force. This quantitative basis provides great convenience for operators to understand the adsorption stability of the product in a timely manner, enabling them to make judgments quickly and take corresponding measures. The running speed of the semiconductor to be transported is adjusted according to the product status value, and a dynamic relationship between the adsorption state and the transport speed is successfully established. This dynamic adjustment mechanism realizes the refined control of the transport process. In the field of semiconductor manufacturing, which is precise and has extremely high requirements for product quality, it is of great significance to be able to flexibly adjust the transport speed according to the real-time adsorption state of the product. It helps to reduce potential damage to the product during the transport process, such as avoiding collision and falling of the product due to high-speed transport when the adsorption is unstable, thereby improving the overall quality of the product. From a macro perspective, this plays a key role in ensuring the smooth progress of the semiconductor manufacturing process and improving production efficiency, helping to improve the overall production capacity of the production line, reduce the defective rate, and thus improve the economic benefits and market competitiveness of the enterprise.

[0113] Reference Figure 3 The step of adjusting the running speed of the semiconductor to be transported according to the product status value also includes the following sub-steps:

[0114] During the calculation set period, the dispersion coefficient of the product status value is calculated by a specific algorithm and used as a comprehensive value. The calculation of the dispersion coefficient can measure the dispersion of the product status value during the period. For example, on the automated handling line of a semiconductor manufacturing company, a monitoring period of 10 minutes is set, and the product status value is obtained every 10 seconds during these 10 minutes. Assuming that the product status values ​​obtained in these 60 times are a series of values ​​such as 0.05, 0.06, 0.04, 0.08, etc., the dispersion coefficients of these values ​​are calculated by a professional statistical algorithm. The larger the dispersion coefficient, the greater the fluctuation of the product status value during the period; the smaller the dispersion coefficient, the relatively stable product status value. Compared with the product status value at a single moment, the comprehensive value obtained in this way can more comprehensively and dynamically reflect the adsorption stability of the product over a period of time.

[0115] If the calculated comprehensive value is greater than the first predetermined value, the system will further determine whether the real-time fixing force is within the first force range. The first force range is a reasonable force value range pre-set according to the characteristics and handling requirements of the semiconductor product. For example, for a certain model of semiconductor product, the preset first force range is 40 millinewtons to 60 millinewtons. When the comprehensive value is greater than the first predetermined value, such as the first predetermined value is 0.1, and the calculated comprehensive value is 0.15, the system will monitor the real-time fixing force of the current product in real time. If the real-time fixing force is 45 millinewtons, which is within the first force range of 40 millinewtons to 60 millinewtons, the acceleration time of the semiconductor to be transported will be adjusted inversely according to the comprehensive value.

[0116] This anti-correlation regulation has important practical significance. The larger the comprehensive value, the more violent the fluctuation of the product status value within the set time period, which means that the adsorption state of the product is unstable. For example, when the comprehensive value reaches 0.2, it means that the fixing force of the product changes greatly during this period. At this time, extending the acceleration time can make the handling process smoother. For example, the acceleration time of the original handling equipment is set to 2 seconds, and it is extended to 4 seconds. This can make the equipment slower and more stable during the acceleration process, reduce the impact on unstable adsorption products caused by excessive acceleration, thereby effectively reducing the risk of product falling or damage, and effectively ensuring the safety of the product. On the contrary, when the comprehensive value is smaller, such as the comprehensive value of 0.05, it means that the adsorption state of the product is relatively stable. At this time, shortening the acceleration time will help improve the handling efficiency while ensuring safety. The original acceleration time was 3 seconds, which can be shortened to 2 seconds, thereby speeding up the handling rhythm and optimizing the overall production process.

[0117] By calculating the discrete coefficient of the product status value within the set time period as a comprehensive value, the fluctuation of the adsorption state of the product within a period of time can be effectively monitored. This comprehensive evaluation method provides a more comprehensive and dynamic evaluation of the product adsorption stability, helping operators to promptly discover potential adsorption anomalies. When the comprehensive value is greater than the first predetermined value, it is further determined whether the real-time fixing force is within the first force range. This refined judgment logic can accurately locate the problem. If the real-time fixing force is within this range, the acceleration time of the semiconductor to be transported is adjusted according to the anti-correlation of the comprehensive value, and the acceleration link in the handling process can be flexibly adjusted according to the actual adsorption state of the product. This mechanism of dynamically adjusting the acceleration time based on the fluctuation of the product adsorption state greatly improves the stability and controllability of the semiconductor product handling process. In the high-precision environment of semiconductor manufacturing, the potential impact of the unstable handling process on product quality is effectively reduced, which provides a strong guarantee for improving the production quality and production efficiency of semiconductor products, helps to reduce the defective rate, and improves the overall production capacity and production efficiency of the production line.

[0118] The step of calculating the dispersion coefficient of the product status value within the set time period as a comprehensive value also includes the following sub-steps:

[0119] After calculating the discrete coefficient of the product status value within the set time period to obtain the comprehensive value, a key judgment process will be entered. If the comprehensive value is less than or equal to the first predetermined value, the system will further determine whether the real-time fixing force is within the second force range. Taking a semiconductor production workshop as an example, when a batch of wafers or square pieces are transported and monitored, the set time period is 15 minutes. The discrete coefficient (comprehensive value) of the product status value within the time period is calculated to be 0.08, and the first predetermined value is set to 0.1. At this time, the comprehensive value is less than the first predetermined value. Then, the system begins to judge the range of the real-time fixing force. For the wafer or square piece, the preset first force range is 50 millinewtons to 70 millinewtons, and the second force range is 30 millinewtons to 50 millinewtons. Assume that the real-time monitoring shows that the fixing force on the product is 40 millinewtons, which is within the second force range of 30 millinewtons to 50 millinewtons.

[0120] If the real-time fixing force is within the second force range, it is extremely important to adjust the maximum movement speed of the semiconductor according to the comprehensive value. Since the value in the second force range is smaller than the first force range, it indicates that the real-time fixing force on the product is relatively weak. For example, in the above example, the real-time fixing force of 40 millinewtons is smaller than the lower limit of 50 millinewtons in the first force range, and the adsorption stability of the product is relatively poor at this time. By adjusting the maximum movement speed by the comprehensive value, the handling process can be accurately controlled. When the comprehensive value is larger, although the product status value is in a relatively stable range, the fluctuation is still more obvious. Assuming that the comprehensive value is 0.08, in this case, reducing the maximum movement speed can effectively avoid the risk of displacement and falling of the product under weak fixing force due to excessive speed. For example, the maximum movement speed of the original handling equipment is set to 15 meters per minute. At this time, it is reduced to 10 meters per minute, which effectively guarantees the safety and stability of the product during handling. On the contrary, when the comprehensive value is smaller, the product state is more stable. If the comprehensive value is 0.03, it means that the product is in a good adsorption state. Properly increasing the maximum movement speed can improve the overall handling efficiency while ensuring product safety. For example, increasing the maximum movement speed from 12 meters per minute to 18 meters per minute has optimized the production process and made the handling of semiconductor products more efficient and reasonable.

[0121] When the calculated comprehensive value is less than or equal to the first predetermined value, it is further determined whether the real-time fixing force is within the second force range, and a comprehensive and detailed product status evaluation system is constructed. This judgment process can formulate differentiated handling strategies for different fixing force conditions to ensure that the handling process is closely adapted to the actual status of the product. In the semiconductor manufacturing process, semiconductor products of different batches and models may have differences in fixing force requirements and stability performance due to factors such as manufacturing processes and material properties. Through such a system, the real-time status of the product can be accurately identified and targeted adjustments can be made. If the real-time fixing force is within the second force range, the maximum movement speed of the semiconductor is adjusted according to the comprehensive value, which effectively meets the handling requirements of the product under different fixing force conditions. Through this method of dynamically adjusting the maximum movement speed based on the comprehensive value and the real-time fixing force range, not only the adaptability to different product states is improved, but also the balance between production efficiency and safety is achieved under the premise of ensuring product quality, which plays a strong role in optimizing and protecting the product handling link in the semiconductor manufacturing process. This helps to improve the production yield of semiconductor products, reduce product damage caused by improper handling, and improve the overall operation efficiency of the production line, thereby bringing higher economic benefits and market competitiveness to semiconductor manufacturing companies.

[0122] In the field of semiconductor manufacturing, which is a field with extremely high precision, the cleanliness of the production environment plays a decisive role in product quality. Even extremely small dust particles, once attached to semiconductor products, may cause irreparable damage to the precise circuit structure and tiny components inside, thereby affecting the performance and reliability of the product. In order to ensure the cleanliness of the production environment, many semiconductor manufacturing workshops are equipped with advanced air purification units, among which multiple FFU (FanFilterUnit, fan filter unit) laminar air supply units constitute the core part of the system. In this embodiment, taking three FFU laminar air supply units installed in a semiconductor manufacturing workshop as an example, its key role and related adjustment mechanism in the handling process of semiconductor products are elaborated in detail.

[0123] The FFU laminar air supply unit promotes the air to pass through the high-efficiency filter evenly through the high-efficiency filter through the high-speed operation of the internal fan, thus forming a stable laminar airflow, which can effectively filter out dust particles, microorganisms and other impurities in the air, creating a clean space for the handling process of semiconductor products. For example, in a certain advanced process semiconductor wafer and square wafer manufacturing workshop, the FFU laminar air supply unit can increase the filtration efficiency of particles larger than 0.1 microns in the air to more than 99.99%, providing an extremely clean environment foundation for the handling of wafers and square wafers.

[0124] During the operation of the air purification unit, obtaining the fan speed of the air supply unit and adjusting the operating speed of the semiconductor to be transported according to the positive correlation of the fan speed are key measures to ensure the balance between product quality and production efficiency. The higher the fan speed, the more the air purification unit is operating at full capacity to maintain a highly clean production environment. For example, when wafers and square pieces are transported in the workshop, the fan speeds of the three FFU laminar air supply units are adjusted to the maximum due to the extremely high requirements for environmental cleanliness. At this time, if the semiconductor product is transported at too fast a speed, a strong airflow disturbance will be generated. This disturbance may destroy the purified laminar airflow, giving dust particles that were originally blocked outside the opportunity to mix into the air around the product, increasing the risk of dust particles adhering to the product. Therefore, it is extremely necessary to reduce the operating speed of the semiconductor when the fan speed is at its maximum. For example, reducing the operating speed of the semiconductor handling equipment from the normal 10 meters per minute to 5 meters per minute can effectively reduce the airflow disturbance caused by rapid movement, ensure that the product is always in a clean airflow environment, and maximize the quality and performance of semiconductor products.

[0125] On the contrary, when the fan speed is smaller, it means that the cleanliness of the current production environment is relatively stable, and the air purification unit is in a low energy consumption state. For example, after the workshop completes the production of a batch of semiconductor products with relatively low cleanliness requirements, it enters the regular production maintenance stage. At this time, the fan speeds of the three FFU laminar air supply units are appropriately reduced. In this case, appropriately increasing the operating speed of semiconductors can significantly improve the handling efficiency. Assuming that the original handling speed is 8 meters per minute, increasing it to 12 meters per minute can speed up the production rhythm and improve the overall production efficiency without affecting product quality.

[0126] The method of adjusting the operating speed of semiconductors according to the fan speed of the air supply unit can also achieve coordinated optimization of equipment operation. On the one hand, when high cleanliness is required, by reducing the handling speed of semiconductors, the situation in which the purification effect is greatly reduced due to rapid handling is avoided. When transporting wafers and square pieces, the requirements for environmental cleanliness are extremely stringent. At this time, reducing the handling speed can ensure the efficient operation of the air purification unit, maintain a highly clean environment in the workshop, and ensure high-quality production of wafers and square pieces. On the other hand, when the cleanliness is stable, the handling speed is appropriately increased to prevent the waste of production resources due to slow handling speed.

[0127] In other embodiments, based on the air purification unit installed in the system, the method further includes the following steps:

[0128] The current air supply angle of the air supply unit is acquired in real time with the help of high-precision sensors. These sensors can accurately measure the slightest changes in the air supply angle with an accuracy of ±0.1 degrees. Subsequently, adjustments are made based on the inverse correlation between the air supply angle and the operating speed of the semiconductors to be transported, that is, the larger the air supply angle, the lower the operating speed; the smaller the air supply angle, the higher the operating speed.

[0129] When the air supply angle is larger, the range covered by the laminar airflow can be significantly widened. Taking a semiconductor handling system as an example, when the air supply angle of the FFU laminar air supply unit is adjusted to 60 degrees, the airflow can cover a larger area of ​​the working area. However, as the coverage area expands, the concentration and intensity of the airflow will be relatively weakened. At this time, if the semiconductor to be transported passes through the purification area at a faster speed, the airflow disturbance caused by the rapid movement of the product may destroy the originally stable laminar airflow state, giving dust particles an opportunity to increase the risk of attachment to the surface of the product. Therefore, in this case, reducing the operating speed of the semiconductor to be transported is a key measure to ensure product quality. For example, reducing the operating speed of the semiconductor handling equipment from 12 meters per minute to 6 meters per minute allows the product to have sufficient time to receive stable and effective airflow protection in the purification area, thereby minimizing the possibility of dust particles adhering to the surface of the product, effectively ensuring the quality and performance of semiconductor products.

[0130] On the contrary, when the air supply angle is small, the laminar airflow is more concentrated and the intensity increases significantly. For example, when the air supply angle is reduced to 30 degrees, the airflow can purify the air at a higher speed and with greater force in a local area. In this case, there are many advantages to appropriately increasing the operating speed of semiconductors. On the one hand, it can make full use of the efficient purification airflow to allow the product to quickly pass through the area with significant purification effect, thereby improving production efficiency; on the other hand, without affecting the cleanliness of the product, it speeds up the handling rhythm and avoids the waste of production resources due to slow handling speed. For example, increasing the semiconductor handling speed from 8 meters per minute to 15 meters per minute improves the overall production efficiency while ensuring that product quality is not affected.

[0131] In addition, this mechanism of dynamically adjusting the handling speed based on the air supply angle greatly promotes the coordinated optimization of the air purification unit and the semiconductor handling process. It gives the entire manufacturing system the ability to flexibly adjust operating parameters according to actual purification needs and product handling conditions. For example, when different types of semiconductor products are produced in the workshop, the air supply angle of the FFU laminar air supply unit can be flexibly adjusted according to the different requirements of the product for cleanliness, and the handling speed of the semiconductor can be adjusted accordingly. When producing products with extremely high cleanliness requirements, increase the air supply angle and reduce the handling speed; when producing products with relatively low cleanliness requirements, reduce the air supply angle and increase the handling speed. In this way, the stability and reliability of the entire system are improved, providing a more efficient and safe environmental guarantee for the semiconductor manufacturing process, which helps to improve the production efficiency and product quality of semiconductor manufacturing companies and enhance the competitiveness of companies in the market.

[0132] An embodiment of the present application further discloses a semiconductor product handling control system, comprising a processor, wherein the processor executes the steps of any one of the semiconductor product handling control methods described above.

[0133] An embodiment of the present application further discloses a storage medium, wherein a program is stored in the storage medium, and when the program is executed by a processor, the steps of any one of the above-mentioned methods for controlling the transport of semiconductor products are implemented.

[0134] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A method for controlling the transport of semiconductor products, characterized in that: The steps include: Based on the preset transport instructions, obtain the size parameters of the semiconductor to be transported; Obtaining an adsorption instruction based on a preset first matching strategy according to the size parameter, and the first actuator adsorbing the semiconductor to be transported using a preset fixing force in response to the adsorption instruction; According to the transport instruction and the size parameter, motion parameters are matched based on a preset second matching strategy, where the motion parameters include a running speed, an acceleration time, and a deceleration time; Obtaining the real-time position of the semiconductor to be transported; Calculate the real-time position and compare it with the preset predetermined position, calculate the position deviation between the real-time position information and the predetermined position, and adjust the running speed according to the positive correlation of the position deviation, the larger the position deviation, the larger the running speed, and the smaller the position deviation, the smaller the running speed; Identifying the moving direction of the semiconductor to be transported, and if the moving direction is consistent with the transport direction, adjusting the running speed to a first preset speed; When the movement direction is inconsistent with the transport direction, the running speed is adjusted to a second preset speed, and the second preset speed is greater than the first preset speed; The shape of the semiconductor to be transported is identified. If the shape is square, the running speed is set to a third preset speed; if the shape is round, the running speed is set to a fourth preset speed, and the third preset speed is less than the fourth preset speed.

2. The method for controlling the transport of semiconductor products according to claim 1, wherein: The acquisition of the motion parameters also includes the following sub-steps: Acquire the real-time running speed of the semiconductor to be transported, and calculate the real-time acceleration time and the real-time deceleration time according to the real-time running speed; Calculating the acceleration difference between the real-time acceleration time and the set acceleration time; Calculating the deceleration difference between the real-time deceleration time and the set deceleration time; If the acceleration difference is greater than a preset acceleration threshold, adjusting the set acceleration time according to the acceleration difference; The larger the acceleration difference is, the longer the acceleration time is; the smaller the acceleration difference is, the shorter the acceleration time is; If the deceleration difference is greater than a preset deceleration threshold, adjusting the set deceleration time according to the deceleration difference; The larger the deceleration difference is, the longer the deceleration time is; the smaller the deceleration difference is, the shorter the deceleration time is; If the acceleration difference is less than or equal to a preset acceleration threshold and the deceleration difference is less than or equal to a preset deceleration threshold, then obtaining the gravity parameter of the semiconductor to be transported; Calculating a dimension verification parameter according to the gravity parameter; The matching degree between the size verification parameter and the size parameter is determined, and if the matching degree is lower than a preset matching threshold, an early warning prompt is issued.

3. The method for controlling the transport of semiconductor products according to claim 1, wherein: The method for obtaining the size parameters of the semiconductor to be transported comprises the following sub-steps: Acquiring a real-time image of the semiconductor to be transported; identifying target features from the real-time image; The pixel ratio of the target feature is calculated, and the size parameter is calculated according to the pixel ratio and the preset calibration parameter.

4. The method for controlling the transport of semiconductor products according to claim 1, wherein: The method in which the first actuator uses a preset fixing force to absorb the semiconductor to be transported in response to the absorption instruction comprises the following sub-steps: Obtain the real-time fixing force of the semiconductor to be transported; According to the real-time fixing force, the product status value of the semiconductor to be transported is calculated = |(Real-time fixing force - preset fixing force)| / preset fixing force; The running speed of the semiconductor to be transported is adjusted according to the product status value. The larger the product status value is, the smaller the running speed is, and the smaller the product status value is, the faster the running speed is.

5. The method for controlling the transport of semiconductor products according to claim 4, characterized in that: The step of adjusting the running speed of the semiconductor to be transported according to the product status value also includes the following sub-steps: Calculate the dispersion coefficient of the product status value within the set time period as a comprehensive value; If the comprehensive value is greater than a first predetermined value, determining whether the real-time fixing force is within a first force range; If the real-time fixing force is within the first force range, adjusting the acceleration time of the semiconductor to be transported inversely according to the comprehensive value; The larger the comprehensive value is, the longer the acceleration time is; The smaller the comprehensive value is, the shorter the acceleration time is.

6. The method for controlling the transport of semiconductor products according to claim 5, characterized in that: The step of calculating the dispersion coefficient of the product status value as a comprehensive value within a set time period also includes the following sub-steps: If the comprehensive value is less than or equal to the first predetermined value, determining whether the real-time fixing force is within a second force range; If the real-time fixing force is within the second force range, adjusting the maximum movement speed of the semiconductor to be transported according to the comprehensive value; wherein the value within the second force range is smaller than the value within the first force range; The larger the comprehensive value is, the smaller the maximum movement speed is; and the smaller the comprehensive value is, the larger the maximum movement speed is.

7. The method for controlling the transport of semiconductor products according to claim 1, wherein: The method further comprises the steps of: Get the fan speed of multiple FFU laminar air supply units in the air purification unit; The running speed of the semiconductor to be transported is adjusted according to the positive correlation of the fan speed; the greater the fan speed, the smaller the running speed; the smaller the fan speed, the greater the running speed.

8. The method for controlling the transport of semiconductor products according to claim 1, wherein: The method further comprises the steps of: Get the air supply angle of the current air supply unit among multiple FFU laminar air supply units in the air purification unit; The running speed of the semiconductor to be transported is adjusted inversely according to the air supply angle; the larger the air supply angle, the smaller the running speed; the smaller the air supply angle, the faster the running speed.

9. A semiconductor product handling control system, characterized in that: The method comprises a processor, wherein the steps of the semiconductor product handling control method according to any one of claims 1 to 8 are executed in the processor.

10. A storage medium, characterized in that: The medium stores a program, and when the program is executed by a processor, the steps of the semiconductor product handling control method according to any one of claims 1 to 8 are implemented.

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