Cutting method of packaging sheet

Abstract

The invention belongs to the technical field of semiconductor processing, and discloses a cutting method of a packaging chip, which is used for cutting a packaging chip of a second specification from a packaging chip of a first specification, and comprises the following steps: arranging a placing groove matched with a wafer on the packaging chip of the first specification, arranging a rectangular guide groove of which four edges are tangent to the placing groove, and arranging a cutting groove on the packaging chip of the second specification, the depth of the rectangular guide groove is larger than the depth of the placing groove and smaller than the thickness of the first specification packaging chip, and cutting the first specification packaging chip along the rectangular guide groove to form a second specification packaging chip. Through the arrangement of the rectangular guide groove, the shape of the cut second-specification packaging sheet can be regular, a chip formed after wafer packaging is miniaturized, the arrangement of the rectangular guide groove is equivalent to preliminary cutting of the first-specification packaging sheet, when the cutting knife is used for cutting the second-specification packaging sheet along the rectangular guide groove, the cutting force of the cutting knife can be adjusted to be small, and the cutting efficiency of the cutting knife is improved. And the cutting stress on the cutting point of the placement groove is reduced, so that the risk that the first-specification packaging chip is broken when being cut is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a method for cutting a packaging sheet. Background Art

[0002] At first, the connection between the chip and the external circuit was achieved by bonding metal wires. With the miniaturization of chip size and the expansion of the scale of integrated circuits, wire bonding technology is no longer applicable. Wafer-level chip size packaging technology is a technology that packages the entire wafer and then cuts it to obtain a single finished chip. The size of the packaged chip is consistent with that of the bare die. The existing packaging sheet is too large, called the first-specification packaging sheet. When packaging the wafer, it is necessary to plastic-seal the packaging sheet and the wafer. It is necessary to set a groove for placing the wafer on the first-specification packaging sheet. The wafer is placed in the groove, and the first-specification packaging sheet is cut into a second-specification packaging sheet that meets the requirements according to the size of the groove, where the second-specification packaging sheet is a rectangular packaging sheet. The cut second-specification packaging sheet is then packaged with the wafer. In order to ensure the miniaturization of the chip, the four sides of the second-specification packaging sheet are cut in a way that is tangent to the circumference of the groove. However, when cutting to the cutting point, the first specification packaging sheet has poor strength at the cutting point. When the staff uses a cutting knife to cut the first specification packaging sheet, the cutting stress at the cutting point is too large, and the packaging sheet is prone to breakage. That is, the first specification packaging sheet is prone to breakage when cut into the second specification packaging sheet, resulting in the first specification packaging sheet needing to be scrapped, causing a large amount of resource waste.

[0003] Therefore, a method for cutting a packaging sheet is urgently needed to solve the above technical problems. Summary of the invention

[0004] The purpose of the present invention is to provide a method for cutting a packaging sheet, which can solve the problem in the prior art that when a packaging sheet of a first specification is cut into a packaging sheet of a second specification, the packaging sheet of the first specification is easily broken, resulting in the need to scrap the packaging sheet of the first specification, causing a large amount of resource waste.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A method for cutting a packaging sheet is used to cut a packaging sheet of a second specification from a packaging sheet of a first specification, wherein the area of ​​the packaging sheet of the first specification is larger than the area of ​​the packaging sheet of the second specification, and the method for cutting the packaging sheet comprises the following steps:

[0007] Arrange a placement groove matching the wafer on the surface of the packaging sheet of the first specification;

[0008] A rectangular guide groove is provided, the four sides of which are all tangent to the placement groove, and the depth of the rectangular guide groove is greater than the depth of the placement groove and less than the thickness of the first specification packaging sheet;

[0009] The first-specification packaging sheet is cut along the rectangular guide groove to form a second-specification packaging sheet that meets the requirements.

[0010] As a preferred technical solution of the method for cutting the packaging sheet, the thickness of the first specification packaging sheet is 1.1 mm, the depth of the placement groove is 0.7 mm, and the depth of the rectangular guide groove is 0.8 mm-1 mm.

[0011] As a preferred technical solution of the method for cutting the packaging sheet, the groove width of the rectangular guide groove is 0.03mm-0.04mm.

[0012] As a preferred technical solution for the packaging sheet cutting method, a plurality of placement grooves are provided on the surface of the packaging sheet of the first specification, and the plurality of placement grooves are arranged at intervals on the surface of the packaging sheet of the first specification, and each placement groove corresponds to one of the rectangular guide grooves.

[0013] As a preferred technical solution of the method for cutting the packaging sheet, opposite end points of adjacent rectangular guide grooves are connected by a straight groove.

[0014] As a preferred technical solution of the method for cutting the packaging sheet, the placement groove includes a central portion and a protruding portion that are connected, the shape of the central portion is consistent with the shape of the wafer, and the wafer is placed at the central portion.

[0015] As a preferred technical solution of the method for cutting the packaging sheet, the protrusion extends out from the central portion by a length of 0.5 mm to 1 mm.

[0016] As a preferred technical solution of the method for cutting the packaging sheet, the shape of the protrusion is a rectangle.

[0017] As a preferred technical solution of the method for cutting the packaging sheet, the placement groove includes a plurality of protrusions, and the plurality of protrusions are arranged at intervals around the central portion.

[0018] As a preferred technical solution of the method for cutting the packaging sheet, the placement groove includes four protrusions, and the four protrusions are arranged at intervals around the central part.

[0019] Compared with the prior art, the encapsulation sheet cutting method provided by the present invention has the following technical advantages:

[0020] 1. By providing a rectangular guide groove and the specifications of the rectangular guide groove completely match the specifications of the wafer, it can be ensured that the size of the second specification packaging sheet formed by cutting along the rectangular guide groove is completely compatible with the size of the wafer, thereby realizing the miniaturization of the chip formed after wafer packaging;

[0021] 2. The rectangular guide groove can guide the staff when cutting the first specification packaging sheet, ensuring that the second specification packaging sheet is more regular in shape;

[0022] 3. The depth of the rectangular guide groove is greater than the depth of the placement groove, but less than the thickness of the first specification packaging sheet. Therefore, the setting of the rectangular guide groove is equivalent to a preliminary cutting of the first specification packaging sheet. When the staff uses a cutting knife to cut the second specification packaging sheet along the rectangular guide groove, the cutting force of the cutting knife itself can be reduced. Therefore, the cutting stress at the cutting point of the placement groove becomes smaller, thereby reducing the risk of the first specification packaging sheet breaking when cutting to the cutting point, avoiding the scrapping of too many first specification packaging sheets, and thus avoiding the problem of a large amount of resource waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic flow chart of a method for cutting a packaging sheet provided by the present invention;

[0024] Figure 2 It is a schematic structural diagram of a packaging sheet of the first specification provided by the present invention.

[0025] In the figure:

[0026] 1. A packaging sheet of the first specification; 11. A placement groove; 111. A central portion; 112. A protruding portion; 12. A rectangular guide groove; 13. A linear groove. DETAILED DESCRIPTION

[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0028] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0030] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0031] like Figure 1 As shown, this embodiment provides a method for cutting a packaging sheet, which is used to cut a packaging sheet 1 of a first specification into a packaging sheet of a second specification, wherein the area of ​​the packaging sheet 1 of the first specification is larger than the area of ​​the packaging sheet of the second specification, and the packaging sheet of the second specification is a packaging sheet matching the size of the wafer. The packaging sheet cutting method includes the following steps:

[0032] A placement groove 11 matching the wafer is provided on the surface of the first specification packaging sheet 1. When packaging the wafer, the cut second specification packaging sheet needs to be plastic-sealed with the wafer so that the second specification packaging sheet forms a protective shell for the wafer. The placement groove 11 is provided to accommodate the wafer for subsequent packaging processes.

[0033] A rectangular guide groove 12 is set with four sides tangent to the placement groove 11, and the depth of the rectangular guide groove 12 is greater than the depth of the placement groove 11. Since the four sides of the rectangular guide groove 12 are tangent to the placement groove 11, the specifications of the formed rectangular guide groove 12 are completely matched with the specifications of the wafer.

[0034] The first specification packaging sheet 1 is cut along the rectangular guide groove 12 to form a second specification packaging sheet that meets the requirements. Since the specifications of the rectangular guide groove 12 are completely matched with the specifications of the wafer, it can be ensured that the size of the second specification packaging sheet formed by cutting along the rectangular guide groove 12 is completely compatible with the size of the wafer, thereby realizing the miniaturization of the chip after wafer packaging. Compared with directly cutting the second specification packaging sheet on the first specification packaging sheet 1, the setting of the rectangular guide groove 12 can play a guiding role for the staff when cutting the first specification packaging sheet 1, ensuring that the shape of the formed second specification packaging sheet is more regular. The depth of the rectangular guide groove 12 is greater than the depth of the placement groove 11, but less than the thickness of the first specification packaging sheet 1. Therefore, the setting of the rectangular guide groove 12 is equivalent to a preliminary cutting of the first specification packaging sheet 1. When the staff uses a cutting knife to cut the second specification packaging sheet along the rectangular guide groove 12, the cutting force of the cutting knife itself can be reduced. Therefore, the cutting stress at the cutting point of the placement groove 11 becomes smaller, thereby reducing the risk of the first specification packaging sheet 1 breaking when cutting to the cutting point, avoiding the scrapping of too many first specification packaging sheets 1, and thus avoiding the problem of a large amount of resource waste.

[0035] In this embodiment, the thickness of the first specification packaging sheet 1 is 1.1mm, and the depth of the placement groove 11 is 0.7mm. Since the thickness of a 4-inch wafer is about 0.5mm and the thickness of a 6-inch wafer is about 0.67mm, the depth of the placement groove 11 is set to 0.7mm. The placement groove 11 can accommodate 4-inch wafers and 6-inch wafers, thereby improving the versatility of the second specification packaging sheet after cutting and molding. Furthermore, the depth of the rectangular guide groove 12 is 0.8mm-1mm. As long as the depth of the rectangular guide groove 12 is greater than the depth of the placement groove 11 and the thickness of the first specification packaging sheet 1, there is no specific restriction on the depth of the rectangular guide groove 12.

[0036] Preferably, the slot width of the rectangular guide groove 12 is 0.03mm-0.04mm. Since the thickness of the cutting knife is usually between 0.025mm-0.032mm, setting the slot width of the rectangular guide groove 12 between 0.03mm-0.04mm can ensure that cutting knives of most specifications can enter the rectangular guide groove 12 and cut along the rectangular guide groove 12, thereby improving the versatility of the rectangular guide groove 12.

[0037] In this embodiment, Figure 2As shown in , the surface of the first specification package sheet 1 is provided with a plurality of placement grooves 11. Specifically, the area of ​​the first specification package sheet 1 is a rectangle with a length of 470 mm and a width of 370 mm. The diameter of the wafer is 200 mm, so the area of ​​the second specification package sheet is a square with a side length of 200 mm. In this way, a first specification package sheet 1 can be provided with two placement grooves 11 and cut into two second specification package sheets, thereby improving the utilization rate of the first specification package sheet 1. The plurality of placement grooves 11 are arranged at intervals, that is, two placement grooves 11 are arranged at intervals on the first specification package sheet 1, so that the two placement grooves 11 are reasonably arranged on the first specification package sheet 1. At the same time, each placement groove 11 is provided with a corresponding rectangular guide groove 12, so as to facilitate cutting the first specification package sheet 1 into two second specification package sheets.

[0038] Preferably, the opposite ends of adjacent rectangular guide grooves 12 are connected by a straight groove 13. When the staff cuts the first specification packaging sheet 1, multiple rectangular guide grooves 12 can be cut at one time in the horizontal direction or on the same side in the vertical direction, and the second specification packaging sheets can be cut one by one. The setting of the straight groove 13 can improve the cutting efficiency of the second specification packaging sheet.

[0039] In this embodiment, the placement groove 11 includes a central portion 111 and a protruding portion 112 that are connected. The shape of the central portion 111 is consistent with the shape of the wafer. The wafer is placed at the central portion 111. The setting of the protruding portion 112 makes it easier for the clamping device to place the wafer in the placement groove 11, or makes it easier for the clamping device to clamp the wafer placed in the placement groove 11. The clamping device can be a manipulator. The specific structure and working principle of the manipulator can refer to the prior art and will not be described in detail here. Furthermore, the protruding length of the protruding portion 112 relative to the central portion 111 is 0.5mm-1mm. As long as it is convenient to pick up or place the wafer, there is no specific restriction on the protruding length of the protruding portion 112.

[0040] Preferably, the shape of the protrusion 112 is a rectangle, and the protrusion 112 is designed to be formed into a regular pattern, which is more convenient for processing the placement groove 11. The shape of the protrusion 112 can also be designed as a triangle or a pentagon, and of course it can also be designed as an irregular pattern. As long as it is convenient for placing and taking the wafer, there is no specific restriction on the shape of the protrusion 112. Preferably, the placement groove 11 is provided with a plurality of protrusions 112, and the plurality of protrusions 112 are arranged at intervals around the center portion 111, so that the manipulator can take the wafer placed in the placement groove 11 from different angles or directions, or place the wafer in the placement groove 11, reducing the difficulty of the manipulator's operation. Specifically, the placement groove 11 includes four protrusions 112, and the four protrusions 112 are arranged at intervals, so that the manipulator can clamp or place the wafer from the front, back, left, and right of the placement groove 11.

[0041] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A method for cutting a packaging sheet, used for cutting a packaging sheet of a second specification from a packaging sheet of a first specification (1), wherein the area of ​​the packaging sheet of the first specification (1) is larger than the area of ​​the packaging sheet of the second specification, characterized in that: The encapsulation sheet cutting method comprises the following steps: A placement groove (11) matching the wafer is provided on the surface of the packaging sheet (1) of the first specification; A rectangular guide groove (12) is provided, the four sides of which are all tangent to the placement groove (11), the depth of the rectangular guide groove (12) being greater than the depth of the placement groove (11) and less than the thickness of the packaging sheet (1) of the first specification; The first-specification packaging sheet (1) is cut along the rectangular guide groove (12) to form a second-specification packaging sheet that meets the requirements.

2. The method for cutting a packaging sheet according to claim 1, characterized in that: The thickness of the first specification packaging sheet (1) is 1.1 mm, the depth of the placement groove (11) is 0.7 mm, and the depth of the rectangular guide groove (12) is 0.8 mm-1 mm.

3. The method for cutting a packaging sheet according to claim 2, characterized in that: The rectangular guide groove (12) has a groove width of 0.03 mm to 0.04 mm.

4. The method for cutting a packaging sheet according to claim 1, characterized in that: The surface of the first specification packaging sheet (1) is provided with a plurality of placement grooves (11), the plurality of placement grooves (11) are arranged at intervals on the surface of the first specification packaging sheet (1), and each placement groove (11) is correspondingly provided with a rectangular guide groove (12).

5. The method for cutting a packaging sheet according to claim 4, characterized in that: The opposite end points of the adjacent rectangular guide grooves (12) are connected via a linear groove (13).

6. The method for cutting a packaging sheet according to claim 1, characterized in that: The placement groove (11) comprises a central portion (111) and a protruding portion (112) which are connected to each other. The shape of the central portion (111) is consistent with the shape of the wafer, and the wafer is placed at the position of the central portion (111).

7. The method for cutting a packaging sheet according to claim 6, characterized in that: The protruding portion (112) protrudes from the central portion (111) by a length of 0.5 mm to 1 mm.

8. The method for cutting a packaging sheet according to claim 7, characterized in that: The protrusion (112) is in the shape of a rectangle.

9. The method for cutting a packaging sheet according to claim 6, characterized in that: The placement groove (11) comprises a plurality of protrusions (112), and the plurality of protrusions (112) are arranged at intervals around the central portion (111).

10. The method for cutting a packaging sheet according to claim 9, characterized in that: The placement groove (11) comprises four protrusions (112), and the four protrusions (112) are arranged at intervals around the central portion (111).

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