Cover plate with preset silver-copper solder and preparation method thereof

Abstract

The invention relates to the technical field of preset silver-copper solder cover plates, in particular to a preset silver-copper solder cover plate and a preparation method thereof.The preset silver-copper solder cover plate comprises a jig body, a cover plate body and solder, the jig body comprises a base, an upper cover and a bolt, the upper cover is provided with a first threaded hole, the first threaded hole penetrates through the upper cover, and the upper cover is provided with a second threaded hole; a first threaded hole is formed in the base, a second threaded hole is formed in the base and penetrates through the base, the bolt is in threaded connection with the first threaded hole and the second threaded hole, the cover plate is placed in the base and matched with the inner wall of the base, the welding flux is placed on the top of the cover plate, the bottom of the upper cover extends into the base, and the bottom of the lower cover extends into the base. According to the invention, the cover plate with the preset solder can be produced, the problem of solder dislocation in the packaging process is avoided, and the problem of edge oxidation of the cover plate is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of cover plates pre-set with silver-copper solder, in particular to a cover plate pre-set with silver-copper solder and a preparation method thereof. Background Art

[0002] As is known to all, in today's semiconductor packaging industry, ceramic is a common packaging material. In order to seal the ceramic tube shell, metal solder sealing is a common method. In practical application, the metal solder needs to be placed between the cover plate and the ceramic part. However, the preformed metal solder is very thin, difficult to limit, and prone to misalignment. In order to solve this problem, the existing method is to use a composite material with silver and copper coated on the surface of the kovar. However, after the material is processed and formed, the edge is oxidized, which has an adverse effect on the quality of the package. Therefore, the present invention provides a cover plate with silver and copper solder pre-placed on the surface of the kovar, and avoids the edge oxidation phenomenon. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies in the prior art, the present invention provides a cover plate pre-set with silver-copper solder and a preparation method thereof.

[0005] (II) Technical solution

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a cover plate with pre-set silver-copper solder, comprising a fixture body, a cover plate and solder, the fixture body comprising a base, an upper cover and a bolt, the upper cover is provided with a first threaded hole, the first threaded hole passes through the upper cover, the base is provided with a second threaded hole, the second threaded hole passes through the base, the bolt threadably connects the first threaded hole and the second threaded hole, the cover plate is placed in the base, the cover plate matches the inner wall of the base, the solder is placed on the top of the cover plate, the bottom of the upper cover extends into the base and contacts with the top of the solder.

[0007] In order to avoid wear between the bolt and the upper cover, the present invention is improved in that a gasket is provided on the bolt and the bolt passes through the gasket.

[0008] In order to improve the connection effect, the present invention has the following improvements: a plurality of bolts are provided, a plurality of gaskets are provided, a plurality of first threaded holes are provided, and a plurality of second threaded holes are provided.

[0009] In order to improve the docking effect, the present invention is improved in that the base matches the upper cover.

[0010] The present invention further provides a method for preparing a cover plate pre-set with silver-copper solder, comprising the following steps:

[0011] Step 1: Material selection: Usually two materials, J and J, are used. Solder: It is required to have a suitable melting point, good wettability, and good gap filling ability, so AgCu solder is selected;

[0012] Step 2: Raw material processing: The kovar strip and the silver-copper solder strip are made into the desired shape by stamping, namely the cover plate and solder mentioned in the article;

[0013] Step 3, fixture assembly: put the cover plate and solder into the fixture body in turn, and use the base to limit the horizontal range of movement of the cover plate and solder; then cover the upper cover, limit the vertical range of movement of the cover plate and solder under the action of gravity, and provide force to combine the two; then pass the bolt through the gasket, and then thread the bolt to connect the first threaded hole and the second threaded hole, control the fixture body not to shift during the assembly process, and ensure that the assembled finished product will not be misplaced;

[0014] Step 4: Assemble the cover: put the assembled fixture body into a push boat furnace, pass hydrogen and nitrogen through the push boat furnace to prevent silver and copper from contacting oxygen and to prevent the raw materials from being oxidized; heat the solder to about ℃ to melt the solder and combine it with the cover. After the two are well combined, push the cover out of the high temperature zone and the solder will become solid again;

[0015] Step 5: Wait for the jig and cover to cool down, disassemble the jig, and take out the assembled cover.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the present invention provides a cover plate pre-set with silver-copper solder and a preparation method thereof, which has the following beneficial effects:

[0018] The cover plate with pre-set silver-copper solder and the preparation method thereof can produce a cover plate with pre-set solder, thereby avoiding the problem of solder misalignment during packaging and the problem of oxidation of the cover plate edge; the composition and thickness of the cover plate and the solder can also be flexibly adjusted without purchasing Kovar-silver-copper composite strips of various specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the shaft side structure of the present invention;

[0021] Figure 3 For the present invention Figure 1 A schematic cross-sectional view of the middle fixture body when in use;

[0022] Figure 4 For the present invention Figure 1 A top view of the middle base;

[0023] Figure 5 For the present invention Figure 1 Bottom view of the middle upper cover;

[0024] In the figure: 1. fixture body; 2. base; 3. upper cover; 4. first threaded hole; 5. second threaded hole; 6. bolt; 7. gasket; 8. cover plate; 9. solder. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figure 1-5 A cover plate with pre-set silver-copper solder, comprising a fixture body 1, a cover plate 8 and solder 9, the fixture body 1 comprising a base 2, an upper cover 3 and a bolt 6, the upper cover 3 is provided with a first threaded hole 4, the first threaded hole 4 passes through the upper cover 3, the base 2 is provided with a second threaded hole 5, the second threaded hole 5 passes through the base 2, the bolt 6 is threadedly connected with the first threaded hole 4 and the second threaded hole 5, the cover plate 8 is placed in the base 2, and the cover plate 8 matches the inner wall of the base 2 , the solder 9 is placed on the top of the cover plate 8, and the bottom of the upper cover 3 extends into the base 2 and contacts the top of the solder 9. In this embodiment, by placing the cover plate 8 and the solder 9 into the base 2 in sequence, the horizontal range of movement of the cover plate 8 and the solder 9 can be limited, and then the upper cover 3 is docked with the base 2, and the bottom part of the upper cover 3 will extend into the base 2 and abut against the top of the solder 9 in the base 2. Under the action of gravity, the vertical range of movement of the cover plate 8 and the solder 9 can be limited, and the force to combine the two can also be provided.

[0027] The bolt 6 mentioned above is prone to wear and tear with the upper cover 3. In order to solve this problem, in this embodiment, a gasket 7 is provided on the bolt 6. The bolt 6 passes through the gasket 7. When the bolt 6 is connected to the first threaded hole 4 and the second threaded hole 5, the gasket 7 is now put on the bolt 6. The gasket 7 has a circular hole whose size is slightly larger than the bolt 6, so that the gasket 7 can pass through the bolt 6. Then the bolt 6 is threadedly connected to the first threaded hole 4 and the second threaded hole 5. When the bolt 6 is screwed to a certain position, the gasket 7 on the bolt 6 will be clamped between the upper cover 3 and the bolt 6 to avoid direct contact between the bolt 6 and the upper cover 3, thereby avoiding wear and tear between the bolt 6 and the upper cover 3.

[0028] In order to improve the connection effect, in this embodiment, a plurality of bolts 6 are provided, a plurality of washers 7 are provided, a plurality of first threaded holes 4 are opened, and a plurality of second threaded holes 5 are opened.

[0029] In order to improve the docking effect, in this embodiment, the base 2 matches the upper cover 3.

[0030] The present invention further provides a method for preparing a cover plate 8 pre-set with silver-copper solder 9, comprising the following steps:

[0031] Step 1. Material selection: 4J29 and 4J42 are usually used. Solder 92: It is required to have a suitable melting point, good wettability, and good gap filling ability, so Ag72Cu28 solder 9 is selected;

[0032] Step 2, raw material processing: by means of stamping, the kovar strip and the silver-copper solder 9 strip are made into the desired shape, namely the cover plate 8 and solder 9 mentioned in the text;

[0033] Step 3, jig assembly: put the cover plate 8 and the solder 9 into the jig body 1 in sequence, and use the base 2 to limit the horizontal range of movement of the cover plate 8 and the solder 9; then cover the upper cover 3, limit the vertical range of movement of the cover plate 8 and the solder 9 under the action of gravity, and provide a force to combine the two; then pass the bolt 6 through the gasket 7, and then thread the bolt 6 to connect the first threaded hole 4 and the second threaded hole 5, control the jig body 1 not to shift during the assembly process, and ensure that the assembled finished product will not be misplaced;

[0034] Step 4, assembling the cover plate 8: putting the assembled fixture body 1 into a push boat furnace, passing hydrogen and nitrogen in the push boat furnace to prevent silver and copper from contacting oxygen and preventing the raw materials from being oxidized; heating the solder 9 to about 800°C to melt the solder 92 and combine it with the cover plate 81. After the two are well combined, push the cover plate 8 out of the high temperature zone and the solder 92 becomes solid again;

[0035] Step 5: Wait for the jig and the cover plate 8 to cool down, disassemble the jig, and take out the assembled cover plate 8.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cover plate pre-set with silver-copper solder, comprising a fixture body (1), a cover plate (8) and solder (9), characterized in that: The fixture body (1) comprises a base (2), an upper cover (3) and a bolt (6); a first threaded hole (4) is provided on the upper cover (3), and the first threaded hole (4) passes through the upper cover (3); a second threaded hole (5) is provided on the base (2), and the second threaded hole (5) passes through the base (2); the bolt (6) threadably connects the first threaded hole (4) and the second threaded hole (5); the cover plate (8) is placed in the base (2), and the cover plate (8) matches the inner wall of the base (2); the solder (9) is placed on the top of the cover plate (8), and the bottom of the upper cover (3) extends into the base (2) and contacts the top of the solder (9).

2. The cover plate pre-set with silver-copper solder according to claim 1, characterized in that: A gasket (7) is provided on the bolt (6), and the bolt (6) passes through the gasket (7).

3. The cover plate pre-set with silver-copper solder according to claim 2, characterized in that: A plurality of bolts (6) are provided, a plurality of washers (7) are provided, a plurality of first threaded holes (4) are provided, and a plurality of second threaded holes (5) are provided.

4. The cover plate pre-set with silver-copper solder according to claim 3, characterized in that: The base (2) matches the upper cover (3).

5. The method for preparing a cover plate pre-set with silver-copper solder according to claim 4, characterized in that: The following steps are involved: Step 1, material selection: usually 4J29 and 4J42 are used, solder (9) 2: it is required to have a suitable melting point, good wettability, and good gap filling ability, so Ag72Cu28 solder (9) is selected; Step 2, raw material processing: the kovar strip and the silver-copper solder (9) strip are made into the desired shape by stamping, namely the cover plate (8) and solder (9) mentioned in the text; Step 3, assembling the jig: placing the cover plate (8) and the solder (9) into the jig body (1) in sequence, and using the base (2) to limit the horizontal range of movement of the cover plate (8) and the solder (9); then covering the upper cover (3), limiting the vertical range of movement of the cover plate (8) and the solder (9) under the action of gravity, and providing a force to combine the two; then passing the bolt (6) through the gasket (7), and then threading the bolt (6) to connect the first threaded hole (4) and the second threaded hole (5), controlling the jig body (1) not to shift during the assembly process, and ensuring that the assembled finished product will not be misplaced; Step 4, assembling the cover plate (8): placing the assembled fixture body (1) into a push boat furnace, passing hydrogen and nitrogen through the push boat furnace to prevent silver and copper from contacting oxygen and to prevent the raw materials from being oxidized; heating the solder (9) to about 800° C. to melt the solder (9) 2 and combine it with the cover plate (8) 1. After the two are well combined, push the cover plate (8) out of the high temperature zone, and the solder (9) 2 becomes solid again; Step 5: Wait for the jig and the cover plate (8) to cool down, disassemble the jig, and take out the assembled cover plate (8).

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