Shell assembly, preparation method thereof and electronic equipment

Abstract

The invention provides a shell assembly and a preparation method thereof and electronic equipment, the shell assembly comprises a shell and a conductive structure, the shell comprises a conductive part and an insulating part, the oxidation resistance of the conductive structure is superior to that of the conductive part, and the conductive structure is fixed to the conductive part through a pressing process. According to the invention, the conductive structure is arranged on the conductive part of the shell, so that the conductive structure can be used for conducting the conductive part, or the conductive structure is used for replacing the conductive part to be connected with other parts such as an antenna. According to the invention, the oxidation resistance of the conductive structure is controlled to be better than that of the conductive member, so that the conductive performance reduction caused by the oxidation of the conductive member can be reduced, and the connection reliability between the conductive structure and the connecting part can be ensured. On the basis, the conductive structure provided by the invention is fixed to the conductive piece through a pressing process, so that the connection reliability between the conductive structure and the conductive piece can be improved. And when the shell falls off, the risk that the conductive structure falls off can be reduced, and the use stability is ensured.

Description

Technical Field

[0001] The present application belongs to the field of housing technology, and specifically relates to a housing assembly and a preparation method thereof, and an electronic device. Background Art

[0002] The mobile phone middle frame is usually made of aluminum alloy and plastic. The aluminum alloy needs to be connected to the antenna feed in the circuit board and has the function of transmitting electrical signals. However, aluminum alloy is easy to oxidize, resulting in unstable connection between the aluminum alloy and the antenna shrapnel, and its conductivity will also decrease when the aluminum alloy oxidizes. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a shell assembly, which includes a shell and a conductive structure, the shell includes a conductive part and an insulating part, the conductive structure has better oxidation resistance than the conductive part, and the conductive structure is fixed to the conductive part by a pressing process.

[0004] A second aspect of the present application provides a method for preparing a housing assembly, the method comprising:

[0005] Providing a shell and a conductive structure, wherein the shell includes a conductive part and an insulating part, and the conductive structure has a better oxidation resistance than the conductive part;

[0006] The conductive structure is fixed to the conductive member by a pressing process.

[0007] The third aspect of the present application provides an electronic device, which includes a circuit board and a shell assembly as provided in the first aspect of the present application, wherein the circuit board is arranged in the shell assembly, and the antenna in the circuit board is connected to the conductive structure in the shell assembly.

[0008] The housing assembly and preparation method thereof, and the electronic device provided by the present application, by providing a conductive structure on the conductive part of the housing, can use the conductive structure to conduct the conductive part, or use the conductive structure to replace the conductive part to connect with other parts such as an antenna. The present application first controls the oxidation resistance of the conductive structure to be better than the oxidation resistance of the conductive part, which can not only reduce the degradation of the conductive performance caused by oxidation of the conductive part, but also ensure the connection reliability between the conductive structure and its connecting parts.

[0009] On this basis, the conductive structure provided in the present application is fixed to the conductive member through a pressing process, which can improve the connection reliability between the conductive structure and the conductive member. And when the housing falls, the risk of the conductive structure falling off can be reduced, ensuring the stability of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0011] Figure 1 It is a top view of a shell assembly in one embodiment of the present application.

[0012] Figure 2 for Figure 1 A partial cross-sectional schematic diagram of the housing assembly is shown.

[0013] Figure 3 It is a partial cross-sectional schematic diagram of a shell assembly in another embodiment of the present application.

[0014] Figure 4 It is a partial cross-sectional schematic diagram of a shell assembly in another embodiment of the present application.

[0015] Figure 5 It is a partial cross-sectional schematic diagram of a shell assembly in yet another embodiment of the present application.

[0016] Figure 6 This is a process flow chart of a method for preparing a shell assembly in one embodiment of the present application.

[0017] Figure 7 for Figure 6 The process flow chart of S200 in the method for preparing the shell assembly is shown.

[0018] Figure 8-Figure 10 They are Figure 7 Schematic diagram corresponding to S210, S220, and S230.

[0019] Fig.11 for Figure 7 The process flow chart shown is included in S220 of the method for preparing the shell assembly.

[0020] Fig.12 for Fig.11 Schematic diagram corresponding to S221.

[0021] Fig.13 It is a schematic diagram of the three-dimensional structure of an electronic device in one embodiment of the present application.

[0022] Fig.14 for Fig.13 A schematic cross-sectional view of an electronic device is shown.

[0023] Description of labels:

[0024] Shell assembly-1, circuit board-2, electronic device-3, shell-10, conductive part-11, first sub-conductive part-111, second sub-conductive part-112, insulating part-113, insulating part-12, conductive structure-20, conductive adhesive layer-21, conductive layer-22, protective layer-23, pressing part-30, pressing head-31, buffer part-32, antenna-40. DETAILED DESCRIPTION

[0025] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0026] In view of this, in order to solve the above problems, this application provides a shell assembly, please refer to Figure 1-Figure 2 , Figure 1 It is a top view of a shell assembly in one embodiment of the present application. Figure 2 for Figure 1 The partial cross-sectional schematic diagram of the housing assembly shown. The housing assembly 1 provided in this embodiment includes a housing 10 and a conductive structure 20, the housing 10 includes a conductive member 11 and an insulating member 12, the conductive structure 20 has a better oxidation resistance than the conductive member 11, and the conductive structure 20 is fixed to the conductive member 11 by a pressing process.

[0027] The housing assembly 1 includes a housing 10, which is one of the components in the electronic device, and is mainly used to carry and protect various components, and provide a foundation for the installation of various components. This embodiment only schematically illustrates the housing 10 as the middle frame of the mobile phone. The housing 10 can be composed of a conductive member 11 and an insulating member 12. For example, a part of the housing 10 can be made of a metal material with a conductive function, and the rest can be made of a non-conductive plastic material. Optionally, in this embodiment, the material of the conductive member 11 includes an aluminum alloy, and the material of the insulating member 12 includes plastic.

[0028] It is known from the related art that the middle frame of a mobile phone is usually made of aluminum alloy and plastic. The aluminum alloy needs to be connected to the antenna feed in the circuit board and bear the function of transmitting electrical signals. For example, a spring is provided at the end of the antenna, and the spring is used to connect with the aluminum alloy. However, the aluminum alloy is easy to oxidize, resulting in an unstable connection between the aluminum alloy and the spring of the antenna, and when the aluminum alloy is oxidized, its conductivity will also decrease.

[0029] Based on this, the present embodiment adds a conductive structure 20 on the basis of the housing 10. The conductive structure 20 has a conductive function as expected, and is the same as the conductive member 11 in the housing 10, and can also transmit electrical signals. The present embodiment sets the conductive structure 20 on one side of the conductive member 11 of the housing 10, and can use the conductive structure 20 to conduct the conductive member 11, or use the conductive structure 20 to replace the conductive member 11 to connect with other components such as the antenna. At this time, the spring of the antenna is no longer connected to the conductive member 11, but is connected to the conductive structure 20. In other words, the present embodiment replaces the components connected to the antenna and other components.

[0030] The technical problems in the related art are caused by the easy oxidation of aluminum alloy. Therefore, the present embodiment can first control the oxidation resistance of the conductive structure 20 to be better than the oxidation resistance of the conductive part 11, so that the conductive structure 20 is more difficult to oxidize than the conductive part 11. In other words, the present embodiment replaces the easily oxidized conductive part 11 connected to the antenna and other components with a conductive structure 20 that is not easy to oxidize. In this way, the conductive structure 20 that is not easy to oxidize can be used to transmit electrical signals, which can reduce the decrease in conductivity caused by the oxidation of the conductive part 11. It can also ensure the connection reliability between the conductive structure 20 and its connecting parts.

[0031] Optionally, since the conductive structure 20 is mainly used to contact the antenna to achieve the purpose of antenna feeding point, middle frame screen grounding, etc., the conductive structure 20 only needs to be set above the conductive part 11 that needs to contact the antenna, and there is no need to set it in the whole layer.

[0032] On this basis, the conductive structure 20 provided in this embodiment can also be fixed to the conductive part 11 by a pressing process. The pressing process is a process that connects the conductive structure 20 to the conductive part 11 by pressure. Since the size of the conductive structure 20 is small, if a welding scheme is adopted to weld the conductive structure 20 to the conductive part 11, for example, there is a related technology to weld steel sheets to aluminum alloys, but there are problems such as cold welding, welding deviation, and welding penetration when welding steel sheets, and the cumulative defective rate is 6%-7%. Therefore, the mold factory needs to increase 3-4 manpower toothpick full inspection, which affects production efficiency and increases production costs. At the same time, the welding process is usually spot welding, and the conductive structure 20 and the conductive part 11 are point contact. Therefore, when the whole machine falls, there is also a probability that the conductive structure 20 will fall off, causing a falling defect. This embodiment adopts a pressing process to press the conductive structure 20 onto the conductive part 11, which can solve the problems such as cold welding, welding deviation, and welding penetration caused by the welding process, and can reduce the production line manpower toothpick full inspection, improve production efficiency, reduce production costs, and save more than 0.5 yuan in overall costs. At the same time, since the conductive structure 20 and the conductive member 11 are in surface contact during pressing, the connection reliability between the conductive structure 20 and the conductive member 11 can be improved. When the shell 10 falls, the risk of the conductive structure 20 falling off can be reduced, thereby ensuring the stability of use.

[0033] In summary, this embodiment provides an innovative shell 10 structure, applies mature materials to new scenarios, optimizes poor welding processes, and the connection solution of the pressing process is more reliable than the welding solution. It can completely solve the problem of poor falling and falling off of the whole machine during the welding experiment, ensuring the stability of subsequent mobile phone use, and the conductivity and reliability are very stable.

[0034] Optionally, the material of the conductive structure 20 includes but is not limited to copper. The conductive structure 20 made of copper is more suitable for being fixed to the conductive member 11 by a pressing process.

[0035] Optionally, the conductive structure 20 may be fixed to the conductive member 11 by a thermal curing and pressing process, which may further improve the connection performance between the conductive structure 20 and the conductive member 11 .

[0036] Please refer to Figure 3 , Figure 3 It is a partial cross-sectional schematic diagram of a housing assembly in another embodiment of the present application. In this embodiment, the conductive structure 20 includes a conductive adhesive layer 21 and a conductive layer 22 which are stacked, the conductive adhesive layer 21 is bonded to the conductive member 11 by a lamination process, and the conductive adhesive layer 21 is elastic.

[0037] The conductive structure 20 can be composed of a multilayer structure stacked in layers, and the conductive layer 22 mainly plays the role of conducting electricity and transmitting electrical signals. Optionally, the conductive layer 22 includes but is not limited to copper foil, and the conductive structure 20 can also be referred to as a copper foil conductive adhesive film. The conductive adhesive layer 21 is a structure that has viscosity and also has a conductive function and can transmit electrical signals. Optionally, the conductive adhesive layer 21 includes but is not limited to conductive glue. One side of the conductive adhesive layer 21 is bonded to the conductive layer 22, and the other side of the conductive adhesive layer 21 can be bonded to the conductive part 11 through the above-mentioned lamination process. Since bonding through the lamination process can improve the connection reliability between the conductive adhesive layer 21 and the conductive part 11. Optionally, the conductive adhesive layer 21 is bonded to the conductive part 11 through a thermal curing lamination process, which further improves the connection reliability between the conductive adhesive layer 21 and the conductive part 11. Therefore, the conductive layer 22 is indirectly fixed to the conductive member 11 through the conductive adhesive layer 21 , and the electrical signal is transmitted from the conductive member 11 to the conductive layer 22 through the conductive adhesive layer 21 , and then from the conductive layer 22 to the conductive member 11 through the conductive adhesive layer 21 .

[0038] In addition, this embodiment can also make the conductive adhesive layer 21 elastic, thereby providing a flexible connection between the conductive structure 20 and the conductive member 11. Compared with the rigid connection of two metal parts in the welding scheme, this embodiment can further improve the connection reliability between the conductive structure 20 and the conductive member 11.

[0039] In summary, this embodiment provides a copper foil conductive adhesive film with a heat curing lamination process, which is suitable for free connection between metal surfaces or circuits that need conductive connection through pressurized heat curing, and can be temporarily or permanently connected. It has good bonding strength with PI, copper, and SUS surfaces, and the connection is reliable. Low-temperature short-time lamination has good adhesion and lap resistance, good conductivity, and meets RoHs, halogen-free and other environmental protection requirements.

[0040] In this embodiment, the peel strength of the conductive structure 20 is not less than 3.5 N / cm, the lap resistance is not greater than 60 mΩ, and it is acid and alkali resistant. It can be immersed in 5% hydrochloric acid or 5% sodium hydroxide for 10 minutes without delamination, bubbling, or immersion in chemicals.

[0041] Please refer to Figure 4 , Figure 4 It is a partial cross-sectional schematic diagram of a housing assembly in another embodiment of the present application. In this embodiment, the conductive structure 20 further includes a protective layer 23 , and the protective layer 23 is detachably connected to a side of the conductive adhesive layer 21 away from the conductive layer 22 .

[0042] In addition to the conductive adhesive layer 21 and the conductive layer 22, the conductive structure 20 may also include a protective layer 23. The protective layer 23 is arranged on the side of the conductive adhesive layer 21 facing away from the conductive layer 22. In other words, one side of the conductive adhesive layer 21 is bonded to the conductive layer 22, and the other side of the conductive adhesive layer 21 is bonded to the protective layer 23. Therefore, when the conductive structure 20 has not yet been pressed onto the conductive part 11, the protective layer 23 can be used to protect the other side of the conductive adhesive layer 21.

[0043] In addition, the present embodiment allows the protective layer 23 and the conductive adhesive layer 21 to be detachably connected, that is, the protective layer 23 and the conductive adhesive layer 21 are not fixed, and the protective layer 23 can be torn off from the conductive adhesive layer 21. In this case, the protective layer 23 can also be called a release film. Therefore, when materials are received, the protective layer 23 can be used to protect the other side of the conductive adhesive layer 21. When lamination is required, the protective layer 23 can be removed from the other side of the conductive adhesive layer 21 to expose the other side of the conductive adhesive layer 21, and then the other side of the conductive adhesive layer 21 can be bonded to the conductive member 11.

[0044] Please refer to Figure 5 , Figure 5 This is a partial cross-sectional schematic diagram of a housing assembly in another embodiment of the present application. In this embodiment, the conductive member 11 includes a first sub-conductive member 111 and a second sub-conductive member 112 that are spaced apart, the conductive structure 20 is disposed on one side of the first sub-conductive member 111 and the second sub-conductive member 112, and the conductive structure 20 connects the first sub-conductive member 111 and the second sub-conductive member 112, and the conductive coefficient of the conductive structure 20 is greater than the conductive coefficient of the conductive member 11.

[0045] From the above content, it can be known that in this embodiment, a conductive structure 20 can be set on the conductive part 11. At this time, the conductive part 11 can be complete, that is, the conductive structure 20 is set above the complete conductive part 11, for example, the conductive structure 20 is connected to the spring clip of the antenna. Or as shown in the present embodiment, the conductive part 11 includes two sub-conductive parts 11 set at intervals: a first sub-conductive part 111 and a second sub-conductive part 112. At this time, the conductive part 11 is not complete and coherent, but is disconnected in a certain area. The disconnection setting can be to cut off the original complete conductive part 11, thereby dividing it into a first sub-conductive part 111 and a second sub-conductive part 112, or the conductive part 11 can originally be composed of two first sub-conductive parts 111 and a second sub-conductive part 112 set at intervals.

[0046] The conductive member 11 is set to be disconnected in order to prevent the heat generated by the chip, battery and other components inside the electronic device from being transferred to the conductive member 11 of the housing 10 during operation. The conductive member 11 can use the disconnection setting scheme to isolate the heat and prevent the heat from being transferred to the entire housing 10. However, since the conductive member 11 needs to transmit electrical signals, the conductive structure 20 can be set on one side of the first sub-conductive member 111 and the second sub-conductive member 112 in this embodiment, and the conductive structure 20 connects the first sub-conductive member 111 and the second sub-conductive member 112. In other words, the conductive structure 20 is used in this embodiment to connect the first sub-conductive member 111 and the second sub-conductive member 112. In this way, the electrical signal can be transmitted from the first sub-conductive member 111 to the second sub-conductive member 112 through the conductive structure 20, and the conductive performance can be turned on.

[0047] In addition, this embodiment also controls the conductivity coefficient of the conductive structure 20 to be greater than the conductivity coefficient of the conductive member 11. For example, the conductive structure 20 is made of copper and the conductive member 11 is made of aluminum, which can further improve the conductivity of the conductive structure 20 and better transmit electrical signals.

[0048] However, since the conductive structure 20 is composed of the conductive adhesive layer 21 and the conductive layer 22, although the conductive layer 22 is made of metal material and has a certain thermal conductivity, the conductive adhesive layer 21 is mainly made of glue, and the thermal conductivity of the glue is poor, and the heat is not easily transferred from the first sub-conductive member 111 to the conductive layer 22 and the second sub-conductive member 112 through the conductive adhesive layer 21. Therefore, even if the conductive structure 20 is added, heat isolation can be achieved.

[0049] Optionally, the housing 10 further includes an insulating portion 113, which is disposed between the first sub-conductive member 111 and the second sub-conductive member 112, and the insulating portion 113 connects the first sub-conductive member 111 and the second sub-conductive member 112. After the conductive member 11 is disconnected, the disconnected portion can be supplemented by the insulating portion 113 to improve the structural strength of the housing 10 as a whole.

[0050] In this embodiment, the thickness of the conductive layer 22 is less than the preset thickness, thereby reducing the cross-sectional area of ​​the conductive layer 22. Since the conductive structure 20 is composed of the conductive layer 22 and the conductive adhesive layer 21, the conductive layer 22 has a certain thickness. In this embodiment, the thickness of the conductive layer 22 can be made less than the preset thickness, that is, the thickness of the conductive layer 22 is controlled to be thinner, so that the cross-sectional area of ​​the conductive layer 22 can be reduced, thereby reducing the transmission of heat in the conductive layer 22, thereby further reducing the thermal conductivity of the conductive structure 20.

[0051] In summary, in the conductive structure 20 provided in this embodiment, the conductive adhesive layer 21 has poor thermal conductivity, and the thermal conductivity of the conductive layer 22 can be reduced by controlling the thickness of the conductive layer 22, thereby reducing the overall thermal conductivity of the conductive structure 20.

[0052] In this embodiment, the thickness of the conductive layer 22 is 10μm-35μm; and / or the thickness of the conductive adhesive layer 21 is 40μm-80μm. If the thickness of the conductive layer 22 and the thickness of the conductive adhesive layer 21 are too thin, such as the thickness of the conductive layer 22 is less than 10μm and the thickness of the conductive adhesive layer 21 is less than 40μm, the conductive structure 20 as a whole will be too thin, which is not convenient for processing and assembly, and is easy to shift during bonding or pressing. If the thickness of the conductive layer 22 and the thickness of the conductive adhesive layer 21 are too thick, such as the thickness of the conductive layer 22 is greater than 35μm and the thickness of the conductive adhesive layer 21 is greater than 80μm, the conductive structure 20 as a whole will be too thick, affecting the overall thickness of the shell assembly 1, and then affecting the overall thickness of the whole machine.

[0053] Therefore, in this embodiment, the thickness of the conductive layer 22 is 10 μm-35 μm; and / or the thickness of the conductive adhesive layer 21 is 40 μm-80 μm, which can ensure that the overall thickness of the conductive structure 20 is moderate and is easy to process and assemble.

[0054] Optionally, the thickness of the conductive layer 22 may be 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, or 35 μm. The thickness of the conductive adhesive layer 21 may be 40 μm, 50 μm, 60 μm, 70 μm, or 80 μm.

[0055] Optionally, the thickness of the protective layer 23 is 40 μm-80 μm, for example, the thickness of the protective layer 23 may be 40 μm, 50 μm, 60 μm, 70 μm, or 80 μm.

[0056] Please refer to Figure 2 and Figure 6 , Figure 6 1 is a process flow chart of a method for preparing a housing assembly in an embodiment of the present application. This embodiment provides a method for preparing a housing assembly 1, and the preparation method includes S100 and S200. S100 and S200 are described in detail as follows.

[0057] S100 , providing a housing 10 and a conductive structure 20 , wherein the housing 10 includes a conductive member 11 and an insulating member 12 , and the conductive structure 20 has a better oxidation resistance than the conductive member 11 .

[0058] S200 , fixing the conductive structure 20 to the conductive member 11 through a pressing process.

[0059] In this embodiment, a conductive structure 20 is added to the housing 10. The conductive structure 20 has a conductive function, which is the same as the conductive member 11 in the housing 10 and can also transmit electrical signals. In this embodiment, the conductive structure 20 is set on one side of the conductive member 11 of the housing 10. The conductive structure 20 can be used to conduct the conductive member 11, or the conductive structure 20 can be used to replace the conductive member 11 to connect with other components such as the antenna. At this time, the spring of the antenna is no longer connected to the conductive member 11, but is connected to the conductive structure 20. In other words, this embodiment replaces the components connected to the antenna and other components.

[0060] The technical problems in the related art are caused by the easy oxidation of aluminum alloy. Therefore, the present embodiment can first control the oxidation resistance of the conductive structure 20 to be better than the oxidation resistance of the conductive part 11, so that the conductive structure 20 is more difficult to oxidize than the conductive part 11. In other words, the present embodiment replaces the easily oxidized conductive part 11 connected to the antenna and other components with a conductive structure 20 that is not easy to oxidize. In this way, the conductive structure 20 that is not easy to oxidize can be used to transmit electrical signals, which can reduce the decrease in conductivity caused by the oxidation of the conductive part 11. It can also ensure the connection reliability between the conductive structure 20 and its connecting parts.

[0061] On this basis, the conductive structure 20 provided in this embodiment can also be fixed to the conductive part 11 by a pressing process. The pressing process is a process that connects the conductive structure 20 to the conductive part 11 by pressure. Since the size of the conductive structure 20 is small, if a welding scheme is adopted to weld the conductive structure 20 to the conductive part 11, for example, there is a related technology to weld steel sheets to aluminum alloys, but there are problems such as cold welding, welding deviation, and welding penetration when welding steel sheets, and the cumulative defective rate is 6%-7%. Therefore, the mold factory needs to increase 3-4 manpower toothpick full inspection, which affects production efficiency and increases production costs. At the same time, the welding process is usually spot welding, and the conductive structure 20 and the conductive part 11 are point contact. Therefore, when the whole machine falls, there is also a probability that the conductive structure 20 will fall off, causing a falling defect. This embodiment adopts a pressing process to press the conductive structure 20 onto the conductive part 11, which can solve the problems such as cold welding, welding deviation, and welding penetration caused by the welding process, and can reduce the production line manpower toothpick full inspection, improve production efficiency, reduce production costs, and save more than 0.5 yuan in overall costs. At the same time, since the conductive structure 20 and the conductive member 11 are in surface contact during pressing, the connection reliability between the conductive structure 20 and the conductive member 11 can be improved. When the shell 10 falls, the risk of the conductive structure 20 falling off can be reduced, thereby ensuring the stability of use.

[0062] In summary, this embodiment provides an innovative shell 10 structure, applies mature materials to new scenarios, optimizes poor welding processes, and the connection solution of the pressing process is more reliable than the welding solution. It can completely solve the problem of poor falling and falling off of the whole machine during the welding experiment, ensuring the stability of subsequent mobile phone use, and the conductivity and reliability are very stable.

[0063] Therefore, the present embodiment can first control the oxidation resistance of the conductive structure 20 to be better than that of the conductive member 11, so that the conductive structure 20 is more difficult to oxidize than the conductive member 11. In other words, the present embodiment replaces the easily oxidized conductive member 11 connected to the antenna and other components with the conductive structure 20 that is not easily oxidized. In this way, the conductive structure 20 that is not easily oxidized can be used to transmit electrical signals, which can reduce the decrease in conductivity caused by the oxidation of the conductive member 11. In addition, the connection reliability between the conductive structure 20 and its connected components can be guaranteed.

[0064] Optionally, since the conductive structure 20 is mainly used to contact the antenna to achieve the purpose of antenna feeding point, middle frame screen grounding, etc., the conductive structure 20 only needs to be set above the conductive part 11 that needs to contact the antenna, and there is no need to set it in the whole layer.

[0065] On this basis, the conductive structure 20 provided in this embodiment can also be fixed to the conductive part 11 by a pressing process. The pressing process is a process that connects the conductive structure 20 to the conductive part 11 by pressure. Since the size of the conductive structure 20 is small, if a welding scheme is adopted to weld the conductive structure 20 to the conductive part 11, for example, there is a related technology to weld steel sheets to aluminum alloys, but there are problems such as cold welding, welding deviation, and welding penetration when welding steel sheets, and the cumulative defective rate is 6%-7%. Therefore, the mold factory needs to increase 3-4 manpower toothpick full inspection, which affects production efficiency and increases production costs. At the same time, the welding process is usually spot welding, and the conductive structure 20 and the conductive part 11 are point contact. Therefore, when the whole machine falls, there is also a probability that the conductive structure 20 will fall off, causing a falling defect. This embodiment adopts a pressing process to press the conductive structure 20 onto the conductive part 11, which can solve the problems such as cold welding, welding deviation, and welding penetration caused by the welding process, and can reduce the production line manpower toothpick full inspection, improve production efficiency, reduce production costs, and save more than 0.5 yuan in overall costs. At the same time, since the conductive structure 20 and the conductive member 11 are in surface contact during pressing, the connection reliability between the conductive structure 20 and the conductive member 11 can be improved. When the shell 10 falls, the risk of the conductive structure 20 falling off can be reduced, thereby ensuring the stability of use.

[0066] In summary, the present application provides an innovative shell 10 structure, applies mature materials to new scenarios, optimizes poor welding processes, and the connection solution of the pressing process is more reliable than the welding solution. It can completely solve the problem of poor falling off of the whole machine during the welding experiment, ensuring the stability of subsequent mobile phone use, and the conductivity and reliability are very stable.

[0067] Please refer to Figure 7-10 , Figure 7 for Figure 6 The process flow chart of S200 in the method for preparing the shell assembly is shown. Figure 8-Figure 10 They are Figure 7 Schematic diagram corresponding to S210, S220, and S230. In this embodiment, S200 fixes the conductive structure 20 to the conductive member 11 through a pressing process, including S210, S220, and S230. S210, S220, and S230 are described in detail as follows.

[0068] Please refer to Figure 8 , S210, first bonding the conductive structure 20 to the conductive member 11.

[0069] Please refer to Fig. 9 , S220, provide a pressing piece 30, wherein the pressing piece 30 is provided with a pressing head 31, so that the pressing head 31 abuts against the conductive structure 20.

[0070] Please refer to Fig.10 , S230, applying pressure to the pressing member 30 to press and fix the conductive structure 20 to the conductive member 11.

[0071] The conductive structure 20 may be pre-bonded to the conductive member 11 to confirm the position of the pressing and provide a certain degree of adhesion. Then, a pressing member 30 may be provided and placed above the conductive structure 20. The pressing member 30 is then pressed down so that the pressing head 31 of the pressing member 30 abuts against the conductive structure 20. Finally, pressure (such as Fig.10 As shown in FIG. 5(F), the pressing head 31 of the pressing member 30 applies pressure to the conductive structure 20, so that the conductive structure 20 is pressed and fixed to the conductive member 11, thereby improving the pressing effect of the conductive structure 20.

[0072] In this embodiment, when the conductive structure 20 is pressed onto the conductive member 11 of the housing 10 by heat curing, the constant temperature heating temperature is 100° C.-120° C., and the pressure of the pressing member 30 is 10 kg / cm 2 -20kg / cm 2, the lamination time is 30s-60s. If the process parameters are too small, the bonding force will be poor, and if the process parameters are too large, the efficiency will be reduced and the cost will be increased. Therefore, this embodiment adopts the above process parameters for heat curing lamination, and the conductivity and continuity are reliable.

[0073] Please refer to Figure 11-Figure 12 , Fig.11 for Figure 7 The process flow chart shown is included in S220 of the method for preparing the shell assembly. Fig.12 for Fig.11 In this embodiment, the pressing member 30 further includes a buffer member 32, the buffer member 32 is disposed on the pressing head 31 and the buffer member 32 is elastic, and S220 makes the pressing head 31 abut against the conductive structure 20, including S221. The detailed introduction of S221 is as follows.

[0074] Please refer to Fig.12 , S221, making the buffer member 32 disposed on the pressing head 31 abut against the conductive structure 20.

[0075] In this embodiment, an elastic buffer 32 may be provided on the pressing head 31 so that the buffer 32 abuts against the conductive structure 20 . The elasticity of the buffer 32 may be utilized to evenly apply the pressure of the pressing member 30 to the conductive structure 20 , thereby improving the pressing effect.

[0076] Please refer to Figure 13-14 , Fig.13 It is a schematic diagram of the three-dimensional structure of an electronic device in one embodiment of the present application. Fig.14 for Fig.13 The present embodiment provides an electronic device 3, the electronic device 3 comprises a circuit board 2 and a housing assembly 1 as provided in the above embodiment of the present application, the circuit board 2 is arranged in the housing assembly 1, and the antenna 40 in the circuit board 2 is connected to the conductive structure 20 in the housing assembly 1.

[0077] The electronic device 3 provided in this embodiment includes but is not limited to mobile terminals such as mobile phones, tablet computers, laptop computers, PDAs, personal computers (PCs), personal digital assistants (PDAs), portable media players (PMPs), navigation devices, wearable devices, smart bracelets, pedometers, etc. This embodiment does not limit the types of electronic devices 3, and only uses mobile phones for schematic illustration.

[0078] The electronic device 3 provided in this embodiment can improve the connection effect between the housing 10 and the antenna 40 of the circuit board 2 by adopting the housing assembly 1 provided in the above embodiment of the present application, and avoid the adverse effects caused by oxidation. And the connection reliability between the conductive structure 20 and the housing 10 can be improved by the pressing process.

[0079] In the description of the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0080] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0081] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0082] The above describes the contents provided by the implementation methods of the present application in detail, and describes and illustrates the principles and implementation methods of the present application. These descriptions are only used to help understand the method and its core ideas of the present application. However, the contents of this specification should not be construed as limiting the present application, and those skilled in the art may make various changes and modifications to the present application without departing from the spirit and scope of the present application. These modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents.

Claims

1. A housing assembly, characterized in that: The shell assembly includes a shell and a conductive structure. The shell includes a conductive part and an insulating part. The oxidation resistance of the conductive structure is better than that of the conductive part. The conductive structure is fixed to the conductive part by a pressing process.

2. The housing assembly according to claim 1, wherein: The conductive structure comprises a conductive adhesive layer and a conductive layer which are stacked, the conductive adhesive layer is bonded to the conductive member through a lamination process, and the conductive adhesive layer has elasticity.

3. The housing assembly according to claim 2, wherein: The conductive structure further includes a protective layer, which is detachably connected to a side of the conductive adhesive layer facing away from the conductive layer.

4. The housing assembly according to claim 2, wherein: The conductive member includes a first sub-conductive member and a second sub-conductive member that are spaced apart from each other. The conductive structure is disposed on one side of the first sub-conductive member and the second sub-conductive member, and the conductive structure connects the first sub-conductive member and the second sub-conductive member. The conductive coefficient of the conductive structure is greater than the conductive coefficient of the conductive member.

5. The housing assembly according to claim 4, characterized in that: The thickness of the conductive layer is less than a preset thickness, thereby reducing the cross-sectional area of ​​the conductive layer.

6. The housing assembly according to claim 5, characterized in that: The thickness of the conductive layer is 10 μm-35 μm; and / or the thickness of the conductive adhesive layer is 40 μm-80 μm.

7. A method for preparing a housing assembly, characterized in that: The preparation method comprises: Providing a shell and a conductive structure, wherein the shell includes a conductive part and an insulating part, and the conductive structure has a better oxidation resistance than the conductive part; The conductive structure is fixed to the conductive member by a pressing process.

8. The preparation method according to claim 7, characterized in that: The step of fixing the conductive structure to the conductive member by a pressing process comprises: Bonding the conductive structure to the conductive member first; Providing a pressing piece, wherein the pressing piece is provided with a pressing head, so that the pressing head abuts against the conductive structure; A pressure is applied to the pressing member to press-fit the conductive structure to the conductive member.

9. The preparation method according to claim 8, characterized in that: The pressing member further includes a buffer member, which is disposed on the pressing head and has elasticity, and the pressing head is made to abut against the conductive structure includes: The buffer member disposed on the pressing head is made to abut against the conductive structure.

10. An electronic device, characterized in that: The electronic device comprises a circuit board and a housing assembly as claimed in any one of claims 1 to 6, wherein the circuit board is arranged in the housing assembly, and an antenna in the circuit board is connected to a conductive structure in the housing assembly.

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