Bearing plate for preparing coreless packaging substrate and preparation method and application thereof

Abstract

The invention relates to the technical field of coreless substrate processes, in particular to a bearing plate for preparing a coreless packaging substrate. According to the bearing plate provided by the invention, the material cost of a traditional coreless substrate can be greatly reduced; in addition, the problems that in the traditional coreless substrate machining process, liquid medicine seeps into positioning drilling holes, and the coreless substrate is separated in a layered mode can be well solved.

Description

Technical Field

[0001] The present invention relates to the technical field of coreless substrate technology, and in particular to a carrier plate for preparing a coreless packaging substrate. Background Art

[0002] The thinning of electronic products has given rise to coreless packaging substrates, which are not only thinner than core packaging substrates, but also have better electrical performance. Compared with ordinary core substrates, the biggest advantages of coreless substrates are that the thickness of the substrate is greatly reduced, the signal transmission performance is increased, the hole / wiring density is increased, and the design is more arbitrary. At present, the coreless packaging substrate thin plate is mainly realized by the coreless substrate process (coreless process). In the coreless process, since the substrate made by the coreless layer process has no core layer, a carrier board will be used for processing during the processing, and then the carrier board will be taken out after the main stacking structure and circuit board graphics are completed. The structure of the existing coreless substrate mainly includes copper layer / copper layer / core layer / copper layer / copper layer, in which the copper layers at both ends will enter the product, and the copper layer / core layer / copper layer in the middle will be taken out and thrown away. Since the coreless substrate is expensive, and in the subsequent processing process, the outer frame will cause the positioning drilling to leak medicine and delamination and pull-off due to the positioning drilling, which will lead to the problem of low qualified rate of subsequent processed products. Summary of the invention

[0003] In view of this, the purpose of the present invention is to provide a carrier plate for preparing a coreless packaging substrate, and a preparation method and application thereof. The carrier plate can significantly reduce the material cost of a traditional coreless substrate; and can well solve the problem of drug seepage during positioning drilling during the processing of a traditional coreless substrate, and avoid the problem of delamination and pulling off of the coreless substrate.

[0004] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions: The present invention provides a carrier board for preparing a coreless package substrate, which is obtained by laminating a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer and a third large copper foil which are sequentially stacked; the first large copper foil, the second large copper foil and the third large copper foil have the same size; The first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the first large copper foil, the second large copper foil and the third large copper foil have sizes larger than the first PP layer and the second PP layer; The sizes of the first PP layer and the second PP layer are larger than the sizes of the first small copper foil and the second small copper foil; The edge of the carrier plate is provided with a positioning drilled hole, and the positioning drilled hole passes through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil.

[0005] Preferably, the thickness of the first copper foil is the same as that of the third copper foil; The first small copper foil and the second small copper foil have the same thickness.

[0006] Preferably, the center of the surface where the carrying plate is located is taken as the center point, the direction passing through the center point and parallel to the long side is the X axis, the direction passing through the center point and parallel to the short side is the Y axis, and the direction perpendicular to the plane is the Z axis; The center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the surface where the carrier plate is located; The X-axis and Y-axis of the carrying plate are symmetrical.

[0007] The present invention also provides a method for preparing the carrier plate described in the above technical solution, comprising the following steps: The first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP and the third large copper foil are stacked in sequence, pressed and trimmed in sequence, and holes are drilled at the edge to obtain the carrier board; The positioning drilling allows the obtained positioning drilling to penetrate the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil of the carrier board.

[0008] The present invention also provides the use of the carrier board described in the above technical solution or the carrier board prepared by the preparation method described in the above technical solution in the preparation of a coreless packaging substrate.

[0009] The present invention provides a carrier plate for preparing a coreless package substrate, which is obtained by laminating a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer and a third large copper foil which are stacked in sequence; the first large copper foil, the second large copper foil and the third large copper foil have the same size; the first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil and the third large copper foil are larger than the sizes of the first PP layer and the second PP layer; the sizes of the first PP layer and the second PP layer are larger than the sizes of the first small copper foil and the second small copper foil; the edge of the carrier plate is provided with a positioning drill hole, and the positioning drill hole passes through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil. The present invention uses the laminating carrier plate itself as a carrier, and can continue to add layers; at the same time, the size difference between the copper foils is used to set the positioning drill hole at the difference. Since there is no situation where two adjacent layers of copper foil are together at this position, that is, there is no problem of delamination, it can also solve the problem of drug seepage in the positioning drill hole and avoid the problem of delamination and pulling off. At the same time, the carrier board of the present invention uses the product itself as the carrier board through the stacking design. After the subsequent layer-adding production is completed to prepare the coreless packaging substrate, the first large copper foil and the first small copper foil will become two circuit layers of the carrier board, and the first PP layer will become a dielectric layer of the carrier board; (the third large copper foil, the second small copper foil, and the second PP layer are the same as above); the second large copper foil will be taken out and thrown away after splitting. In addition, the other board making processes of preparing the coreless packaging substrate using the carrier board of the present invention are the same as those of the conventional coreless packaging substrate. DETAILED DESCRIPTION

[0010] The present invention provides a carrier board for preparing a coreless package substrate, which is obtained by laminating a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer and a third large copper foil which are sequentially stacked; the first large copper foil, the second large copper foil and the third large copper foil have the same size; The first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the first large copper foil, the second large copper foil and the third large copper foil have sizes larger than the first PP layer and the second PP layer; The sizes of the first PP layer and the second PP layer are larger than the sizes of the first small copper foil and the second small copper foil; The edge of the carrier plate is provided with a positioning drilled hole, and the positioning drilled hole passes through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil.

[0011] In the present invention, the thickness of the first copper foil is the same as that of the third copper foil; The first small copper foil and the second small copper foil have the same thickness.

[0012] In the present invention, the center of the surface where the carrying plate is located is taken as the center point, the direction passing through the center point and parallel to the long side is the X axis, the direction passing through the center point and parallel to the short side is the Y axis, and the direction perpendicular to the plane is the Z axis; The center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the surface where the carrier plate is located; The X-axis and Y-axis of the carrying plate are symmetrical.

[0013] The present invention does not have any special limitation on the arrangement of the positioning drill holes, and any arrangement well known to those skilled in the art may be used.

[0014] The present invention also provides a method for preparing the carrier plate described in the above technical solution, comprising the following steps: The first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP and the third large copper foil are stacked in sequence, pressed and trimmed in sequence, and holes are drilled at the edge to obtain the carrier board; The positioning drilling allows the obtained positioning drilling to penetrate the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil of the carrier board.

[0015] The present invention does not have any special limitation on the processes of pressing, trimming and positioning drilling, and the processes well known to those skilled in the art can be used.

[0016] The present invention also provides the use of the carrier plate described in the above technical solution or the carrier plate prepared by the preparation method described in the above technical solution in preparing a coreless packaging substrate. The present invention does not have any special limitation on the method of the application, and the method well known to those skilled in the art can be used.

[0017] The technical solutions in the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Example 1 Structure: It is obtained by laminating the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer and the third large copper foil which are stacked in sequence; the first large copper foil, the second large copper foil and the third large copper foil have the same size; the first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the sizes of the first large copper foil, the second large copper foil and the third large copper foil are larger than the sizes of the first PP layer and the second PP layer; the sizes of the first PP layer and the second PP layer are larger than the sizes of the first small copper foil and the second small copper foil; the edge of the carrier plate is provided with positioning holes, and the positioning holes penetrate the first large copper foil, the first PP layer, the second largest copper foil, the second PP layer and the third largest copper foil; the thickness of the first largest copper foil, the second largest copper foil and the third largest copper foil is independently 18μm; the thickness of the first small copper foil and the second small copper foil is independently 12μm; taking the center of the surface where the carrier board is located as the center point, the direction passing through this center point and parallel to the long side is the X-axis, the direction passing through this center point and parallel to the short side is the Y-axis, and the vertical plane direction is the Z-axis; the center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer and the third largest copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the surface where the carrier board is located; the X-axis and Y-axis of the carrier board are symmetrical.

[0019] Preparation method: Take 3 large copper foils (size 520*420mm, thickness 18μm), two PP (size 515*415mm, thickness 40μm) and two small copper foils (size 506*406mm, thickness 12μm); The first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP and the third large copper foil are stacked in sequence (wherein the center points of the first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP and the third large copper foil are located in the same vertical direction), pressed and trimmed in sequence, and then holes are positioned and drilled at the edge to obtain the carrier board.

[0020] The above is only a preferred implementation method of the present invention and does not limit the present invention in any form. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A carrier board for preparing a coreless packaging substrate, characterized in that: The copper foil is obtained by laminating a first large copper foil, a first PP layer, a first small copper foil, a second large copper foil, a second small copper foil, a second PP layer and a third large copper foil which are sequentially stacked; the first large copper foil, the second large copper foil and the third large copper foil have the same size; The first PP layer and the second PP layer have the same size; the first small copper foil and the second small copper foil have the same size; and the first large copper foil, the second large copper foil and the third large copper foil have sizes larger than the first PP layer and the second PP layer; The sizes of the first PP layer and the second PP layer are larger than the sizes of the first small copper foil and the second small copper foil; The edge of the carrier plate is provided with a positioning drilled hole, and the positioning drilled hole passes through the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil.

2. The carrier plate according to claim 1, characterized in that: The thickness of the first copper foil is the same as that of the third copper foil; The first small copper foil and the second small copper foil have the same thickness.

3. The carrier plate according to claim 1, characterized in that: The center of the surface where the bearing plate is located is taken as the center point, the direction passing through the center point and parallel to the long side is the X axis, the direction passing through the center point and parallel to the short side is the Y axis, and the direction perpendicular to the plane is the Z axis; The center points of the first large copper foil, the first PP layer, the first small copper foil, the second large copper foil, the second small copper foil, the second PP layer and the third large copper foil are located in the same vertical direction, and the vertical direction is the Z-axis direction perpendicular to the surface where the carrier plate is located; The X-axis and Y-axis of the carrying plate are symmetrical.

4. The method for preparing a carrier plate according to any one of claims 1 to 3, characterized in that: The following steps are involved: The first large copper foil, the first PP, the first small copper foil, the second large copper foil, the second small copper foil, the second PP and the third large copper foil are stacked in sequence, pressed and trimmed in sequence, and holes are drilled at the edge to obtain the carrier board; The positioning drilling allows the obtained positioning drilling to penetrate the first large copper foil, the first PP layer, the second large copper foil, the second PP layer and the third large copper foil of the carrier board.

5. Use of the carrier board according to any one of claims 1 to 3 or the carrier board prepared by the preparation method according to claim 4 in preparing a coreless packaging substrate.