Glue overflow prevention printed circuit board

Abstract

The glue overflow prevention printed circuit board comprises a mother board, a daughter board and an auxiliary board, a groove is formed in the auxiliary board, the size of the groove is matched with the size of the daughter board, the daughter board is arranged on the mother board, release films are laid on the daughter board and the mother board, the groove in the auxiliary board corresponds to the daughter board, the daughter board is embedded in the groove, the auxiliary board is pressed and fixed on the mother board, and the auxiliary board is arranged on the mother board. High-temperature adhesive tape is attached to the peripheral edge of the outer edge of the groove and corresponds to the combination face of the mother board and the daughter board, so that the auxiliary board locally forms height difference in the edge area of the daughter board, glue is blocked at the edge of the groove, and cushion layers are arranged on the lower surface of the mother board and the upper surface of the auxiliary board. The auxiliary board locally forms a height difference in the edge area of the daughter board through pressing, so that a similar high wall is formed on the edge of the groove and can resist the glue, the release film is not bonded with the glue, the glue cannot be diffused outwards on the mother board during pressing, and glue overflowing is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to an anti-overflow glue printed circuit board. Background Art

[0002] With the increasing complexity of electronic circuit design, circuit boards, which are the basis for carrying electronic components, are developing towards high density and high performance. In order to meet the requirements of signal transmission and reliability, a method for manufacturing Z-direction interconnected printed circuit boards has been developed to achieve high aspect ratio products and reduce processing difficulty. However, sometimes, local "convex" Z-direction interconnection technology is derived without the need for whole-board interconnection, that is, a sub-board or multiple sub-boards are partially interconnected with a larger motherboard through conductive paste and pressed together to form a complete local "convex" Z-direction interconnected printed circuit board.

[0003] Such a "convex" spatial structure means that conventional pressing methods cannot be used, otherwise there will be problems such as uneven pressure on the plates, poor temperature uniformity, uneven force on the steel plates causing bending, etc., which will lead to pressing deviation and uneven pressure on the plates forming voids that affect the bonding.

[0004] In addition, due to the inconsistency in the sizes of the daughter board and the mother board, the prepreg will overflow from the bottom of the daughter board to the mother board surface during lamination, affecting the overall appearance and electrical performance of the circuit board. Summary of the invention

[0005] The object of the present invention is to provide a printed circuit board with anti-overflow glue to solve the problems raised in the above background technology.

[0006] In view of this, the present invention provides an anti-overflow glue printed circuit board, including a motherboard, a daughter board and an auxiliary board, the auxiliary board is grooved, the size of the groove is adapted to the size of the daughter board, the daughter board is arranged on the motherboard, the daughter board and the motherboard are covered with release films, the groove on the auxiliary board corresponds to the daughter board and the daughter board is nested in the groove, so that the auxiliary board is pressed and fixed on the motherboard, high-temperature tape is affixed on the edges of the outer edge of the groove, the high-temperature tape corresponds to the bonding surface of the motherboard and the daughter board, so that the auxiliary board forms a height difference locally in the edge area of ​​the daughter board and then blocks the glue at the edge of the groove, and a cushioning layer is arranged on the lower surface of the motherboard and the upper surface of the auxiliary board.

[0007] In the present invention, a further implementation scheme is that the auxiliary plate is manufactured through the steps of cutting, drilling holes, applying high temperature tape, etching, baking and forming.

[0008] In the present invention, a further implementation scheme is that the auxiliary board is made of copper-free sheet material, and its thickness is 0.1 mm less than the thickness of the sub-board, and the auxiliary board is cut into a size that is the same as the size of the motherboard.

[0009] In a further embodiment of the present invention, the hole drilling includes drilling a positioning hole first and then drilling a fixing hole, wherein the positioning hole is drilled near the edge of the auxiliary plate.

[0010] In the present invention, a further implementation scheme is that the high temperature tape is affixed by affixing a high temperature tape with a thickness of 0.1 mm on the edges around the outer edge of the groove, and the width of the high temperature tape is at least 10 mm, and the high temperature tape corresponds to the bonding surface of the motherboard and the daughterboard.

[0011] In a further embodiment of the present invention, in the etching step, the base copper in other areas of the auxiliary plate where the high temperature tape is not attached is etched to expose the base material portion.

[0012] In the present invention, a further implementation scheme is that during the molding process, a groove is cut on the auxiliary plate by a milling machine, and a single side of the groove is 4 mils away from the edge of the sub-plate.

[0013] In the present invention, a further implementation scheme is that after the sub-board and the motherboard are overlapped, and after the auxiliary board and the motherboard are overlapped, they are fixed using high temperature resistant resin pins.

[0014] In the present invention, a further embodiment is that the release film is pre-opened with fixing holes at the same position as the fixing holes on the motherboard and is laid at the junction of the motherboard and the auxiliary board.

[0015] In the present invention, a further implementation scheme is that the cushioning layer includes aluminum foil, a buffer pad and kraft paper, and the aluminum foil, the buffer pad and the kraft paper are laid on the upper surface of the auxiliary board and the lower surface of the mother board in sequence from the inside to the outside.

[0016] The beneficial effects of the present invention are: The present invention improves the problems of uniform force and glue overflow in pressing by adopting a special plate stacking method. An auxiliary plate is selected, an auxiliary plate without copper sheet material is selected, and grooves and positioning holes are opened. Then, high-temperature tape is affixed to the edges of the grooves on the bottom surface of the auxiliary plate, and the base copper in other areas of the auxiliary plate not affixed with the high-temperature tape is etched away to expose the substrate part. Finally, the inner edge of the groove is milled by a milling machine to increase the size of one side by 4 mil. The daughter board is stacked on the mother board and fixed with high-temperature resistant resin pins, and a layer of release film that can prevent adhesion is laid on the mother board and the daughter board, and then the groove on the auxiliary board is aligned with the daughter board to nest and press it to the release film on the mother board. Similarly, the auxiliary board and the mother board are The auxiliary board is fixed with high-temperature resistant resin pins to prevent it from sliding. Aluminum foil, buffer pad and kraft paper are laid on the upper surface of the auxiliary board and the lower surface of the motherboard from the inside to the outside, which not only increases the height but also keeps the surface flat, plays a role in buffering, heat transfer and pressure. Finally, a small pressing machine is used for pressing, so that the auxiliary board forms a height difference locally in the edge area of ​​the daughter board, thereby forming a high wall at the edge of the groove to resist the glue, and the release film is not bonded to the glue, so that the glue will not spread outward on the motherboard during pressing, avoiding the generation of overflow glue; and the auxiliary board is made to assist the production, without opening an overflow glue groove on the motherboard or the daughterboard to damage the board surface, reducing processing damage to the board surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an overall cross-sectional schematic diagram of the present invention; Figure 2 It is a schematic diagram of the top view of the position between the sub-board and the slot of the present invention; Figure 3 It is a schematic diagram of the position between the auxiliary board and the sub-board of the present invention; Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle; Figure 5 It is a schematic diagram of the process flow of the auxiliary plate manufacturing process of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0019] In the description of the present application, it should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0020] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0021] It should be noted that, in the description of the present application, the orientation or positional relationship indicated by terms such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise stated, these orientation words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inside and outside" refer to the inside and outside relative to the contour of each component itself.

[0022] It should be noted that, in the present application, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises one..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be noted that the scope of the method and device in the embodiment of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0023] A daughter board or a plurality of daughter boards are partially interconnected with a larger mother board through conductive paste and pressed and bonded together to form a complete local "convex" Z-direction interconnected printed circuit board.

[0024] Such a "convex" spatial structure means that conventional pressing methods cannot be used, otherwise there will be problems such as uneven pressure on the plates, poor temperature uniformity, uneven force on the steel plates causing bending, etc., which will lead to pressing deviation and uneven pressure on the plates forming voids that affect the bonding.

[0025] In addition, due to the inconsistency in the sizes of the daughter board and the mother board, the prepreg will overflow from the bottom of the daughter board to the mother board surface during lamination, affecting the overall appearance and electrical performance of the circuit board.

[0026] In the traditional process, overflow of glue is prevented by opening overflow grooves on the motherboard or daughterboard. During pressing, the glue enters the overflow grooves to prevent the glue from spreading outward. This method requires opening grooves on the motherboard or daughterboard, and processing errors often occur, thereby damaging the board itself and causing waste, and the effect is not ideal. Example 1

[0027] In this regard, the present embodiment provides an anti-overflow glue printed circuit board, including a motherboard 1, a daughter board 2 and an auxiliary board 3, the auxiliary board 3 having a groove 30, the size of the groove 30 being adapted to the size of the daughter board 2, the daughter board 2 being arranged on the motherboard 1, and a release film 4 being laid on the daughter board 2 and the motherboard 1, the groove 30 on the auxiliary board 3 corresponding to the daughter board 2 and the daughter board 2 being nested inside the groove 30, so that the auxiliary board 3 is pressed and fixed on the motherboard 1, and high-temperature tape 5 is affixed on the edges around the outer edge of the groove 30, the high-temperature tape 5 corresponding to the bonding surface between the motherboard 1 and the daughter board 2, so that the auxiliary board 3 locally forms a height difference in the edge area of ​​the daughter board 2 and then blocks the glue at the edge of the groove 30, and a cushioning layer is provided on the lower surface of the motherboard 1 and the upper surface of the auxiliary board 3.

[0028] Specifically, the production can be carried out through the following steps: S1, according to the size of the motherboard 1 and the daughterboard 2, the auxiliary board 3 is selected, and a groove 30 is opened in the auxiliary board 3 according to the outer size of the daughterboard 2, so that when the auxiliary board 3 is pressed on the motherboard 1, the daughterboard 2 is embedded in the groove 30, and the size of the groove 30 in this step is consistent with the size of the daughterboard 2; S2, stacking the daughter board 2 and the mother board 1 and fixing them; S3, after step S2, a layer of release film 4 is laid on the daughter board 2 and the mother board 1. The release film 4 is an existing one and will not be described in detail in this embodiment. Since the release film 4 is a low surface energy material, the anti-adhesion performance is extremely strong. When the resin glue overflows during the lamination, it will not adhere to the release film 4, which can play a role in blocking the glue. S4, nesting the groove 30 of the auxiliary plate 3 into the sub-plate 2 and pressing it onto the release film 4; S5, fix the auxiliary board 3 and the mother board 1 to prevent sliding; S6, laying a cushioning layer on the lower surface of the motherboard 1 and the upper surface of the auxiliary board 3 to make the surface flat, and play a role in buffering, heat transfer and pressure; S7 , a laminating machine presses the auxiliary plate 3 and the upper surface of the sub-plate 2 .

[0029] In this embodiment, in detail, in step S1, the manufacturing process of the auxiliary plate 3 includes cutting, drilling, attaching high temperature tape 5, etching, baking and molding.

[0030] In this embodiment, the auxiliary board 3 is made of H / H plate material that does not contain copper plate material, and its thickness is 0.1mm less than the thickness of the sub-board 2, and the auxiliary board 3 is cut into the same size as the motherboard 1. For example, the theoretical thickness of the sub-board 2 is 1mm, and the selected auxiliary board 3 has a thickness of 0.9mm.

[0031] In this embodiment, the hole opening includes first opening a positioning hole and then opening a fixing hole. The positioning hole is opened near the edge of the auxiliary plate 3. Since the general sub-plate 2 is a square plate, the shape of the groove 30 is the same as the shape of the sub-plate 2. The shape and size of the groove 30 opened in this step are completely consistent. The positioning holes are distributed on the edges of the auxiliary plate 3, and mainly play a role in fixing the subsequent auxiliary plate 3 and the motherboard 1, and the fixing holes are located around other holes on the auxiliary plate 3.

[0032] In this embodiment, the high temperature tape 5 is affixed by affixing a high temperature tape 5 with a thickness of 0.1 mm on the edges around the outer edge of the groove 30, and the width of the high temperature tape 5 is at least 10 mm. The high temperature tape 5 corresponds to the bonding surface of the motherboard 1 and the daughterboard 2. The high temperature tape 5 has good high temperature resistance and can withstand the high temperature of the glue during lamination, thereby also being able to play a role in blocking glue to a certain extent.

[0033] In this embodiment, during the etching process, Figure 3 and Figure 4 , the base copper 6 in other areas of the auxiliary board 3 where the high temperature tape 5 is not attached is etched to expose the base material part.

[0034] Furthermore, in this embodiment, Figure 2 In the forming process, a groove 30 is opened on the auxiliary plate 3 by a milling machine. The edge of the groove 30 is 4 mils away from the edge of the sub-plate 2. The size of the groove 30 after processing is larger than the size of the sub-plate 2, so that the distance between the inner edge of the single side of the groove 30 and the outer edge of the sub-plate 2 is 4 mil. In this way, not only can the positioning block on the auxiliary plate 3 be aligned with the sub-plate 2, but the auxiliary plate 3 can also be quickly nested, and it is also convenient to build a high wall later to play the role of blocking glue. Example 2

[0035] A glue overflow prevention printed circuit board comprises a motherboard 1, a daughterboard 2 and an auxiliary board 3, wherein a groove 30 is formed on the auxiliary board 3, and the size of the groove 30 is adapted to the size of the daughterboard 2, the daughterboard 2 is arranged on the motherboard 1, and a release film 4 is laid on the daughterboard 2 and the motherboard 1, the groove 30 on the auxiliary board 3 corresponds to the daughterboard 2 and the daughterboard 2 is nested inside the groove 30, so that the auxiliary board 3 is pressed and fixed on the motherboard 1, and high-temperature adhesive tape 5 is affixed on the edges around the outer edge of the groove 30, and the high-temperature adhesive tape 5 corresponds to the bonding surface of the motherboard 1 and the daughterboard 2, so that the auxiliary board 3 forms a height difference locally in the edge area of ​​the daughterboard 2 and then blocks the adhesive at the edge of the groove 30, and a cushioning layer is provided on the lower surface of the motherboard 1 and the upper surface of the auxiliary board 3.

[0036] Specifically, it can be made by the following steps: S1. Select an auxiliary board 3 according to the size of the motherboard 1 and the daughterboard 2, and open a groove 30 on the auxiliary board 3 according to the outer size of the daughterboard 2, so that when the auxiliary board 3 is pressed on the motherboard 1, the daughterboard 2 is embedded in the groove 30. The size of the groove 30 in this step is consistent with the size of the daughterboard 2; S2, stacking the daughter board 2 and the mother board 1 and fixing them; S3, after step S2, a layer of release film 4 is laid on the daughter board 2 and the mother board 1. The release film 4 is an existing one and will not be described in detail in this embodiment. Since the release film 4 is a low surface energy material, the anti-adhesion performance is extremely strong. When the resin glue overflows during the lamination, it will not adhere to the release film 4, which can play a role in blocking the glue. S4, nesting the groove 30 of the auxiliary plate 3 into the sub-plate 2 and pressing it onto the release film 4; S5, fix the auxiliary board 3 and the mother board 1 to prevent sliding; S6, laying a cushioning layer on the lower surface of the motherboard 1 and the upper surface of the auxiliary board 3 to make the surface flat; S7 , a laminating machine presses the auxiliary plate 3 and the upper surface of the sub-plate 2 .

[0037] In this embodiment, in detail, in step S1, the manufacturing process of the auxiliary plate 3 includes cutting, drilling, attaching high temperature tape 5, etching, baking and molding.

[0038] In this embodiment, the auxiliary board 3 is made of H / H plate material that does not contain copper plate material, and its thickness is 0.1mm less than the thickness of the sub-board 2, and the auxiliary board 3 is cut into the same size as the motherboard 1. For example, the theoretical thickness of the sub-board 2 is 1mm, and the selected auxiliary board 3 has a thickness of 0.9mm.

[0039] In this embodiment, the hole opening includes first opening a positioning hole and then opening a fixing hole. The positioning hole is opened near the edge of the auxiliary board 3. Since the general sub-board 2 is a square board, the shape of the groove 30 is the same as the shape of the sub-board 2. The shape and size of the groove 30 opened in this step are completely consistent. The positioning holes are distributed on the edges of the auxiliary board 3 and mainly play a role in fixing the subsequent auxiliary board 3 and the motherboard 1.

[0040] In this embodiment, the high temperature tape 5 is affixed by affixing a high temperature tape 5 with a thickness of 0.1 mm on the edges around the outer edge of the groove 30, and the width of the high temperature tape 5 is at least 10 mm. The high temperature tape 5 corresponds to the bonding surface of the motherboard 1 and the daughterboard 2. The high temperature tape 5 has good high temperature resistance and can withstand the high temperature of the glue during lamination, thereby also being able to play a role in blocking glue to a certain extent.

[0041] In this embodiment, in the etching process, the base copper 6 in other areas of the auxiliary board 3 where the high temperature tape 5 is not attached is etched to expose the base material portion.

[0042] Moreover, in the present embodiment, in the molding process, a groove 30 is opened on the auxiliary plate 3 by a milling machine, and the edge of the groove 30 is 4 mils away from the edge of the sub-plate 2. The size of the groove 30 after processing is larger than the size of the sub-plate 2, so that the distance between the inner edge of a single side of the groove 30 and the outer edge of the sub-plate 2 is 4 mil. In this way, not only can the auxiliary plate 3 be quickly nested when the positioning block on the auxiliary plate 3 is aligned with the sub-plate 2, but it is also convenient for the subsequent building of a high wall to play the role of blocking glue.

[0043] In the present embodiment, in the steps S2 and S5, the daughter board 2 and the mother board 1 are overlapped, and the auxiliary board 3 and the mother board 1 are overlapped and fixed using high temperature resistant resin pins. After the auxiliary board 3 and the mother board 1 are fixed, during the pressing, the auxiliary board 3 can be prevented from moving, which would cause uneven pressing force and glue blocking errors.

[0044] In this embodiment, the release film 4 is pre-opened with holes at the same positions as the fixing holes, and is laid at the junction of the mother board 1 and the auxiliary board 3, so that the release film 4 plays a role of blocking glue.

[0045] In the final process, Figure 1 The cushioning layer added in step S6 includes aluminum foil 7, buffer pad 8 and kraft paper 9, which are laid on the upper surface of the auxiliary board 3 and the lower surface of the mother board 1 from the inside to the outside, which can level the upper and lower surfaces, improve the uniformity of the force of the pressing, and raise the height at the same time.

[0046] The specific principle is to improve the problems of uniform pressure bearing and overflow of glue by adopting a special stacking method, select the auxiliary board 3, select the auxiliary board 3 without copper sheet material, and open the groove 30 and the positioning hole, the size of the drilled groove 30 is consistent with the sub-board 2, and then affix high-temperature tape 5 to the edges of the groove 30 on the bottom surface of the auxiliary board 3, and etch away the base copper 6 in other areas of the auxiliary board 3 where the high-temperature tape 5 is not affixed to expose the substrate part, and finally use a milling machine to mill the inner edge of the groove 30, and increase the size of one side by 4mil; stack the sub-board 2 on the motherboard 1 and fix it with high-temperature resistant resin pins, and lay a layer of release film 4 that can prevent adhesion on the motherboard 1 and the sub-board 2, and then nest the sub-board 2 in the groove 30 on the auxiliary board 3 and press it onto the motherboard 1 The release film 4 is also fixed between the auxiliary board 3 and the motherboard 1 by high-temperature resistant resin pins to prevent the auxiliary board 3 from sliding. Then, the upper surface of the auxiliary board 3 and the lower surface of the motherboard 1 are covered with aluminum foil 7, buffer pad 8 and kraft paper 9 from the inside to the outside, which not only increases the height but also keeps the surface flat, plays a role in buffering, heat transfer and pressure. Finally, a small pressing machine is used for pressing, so that the auxiliary board 3 forms a height difference locally in the edge area of ​​the daughter board 2, thereby forming a high wall at the edge of the groove 30 to resist the glue, and the release film 4 is not bonded to the glue, so that the glue will not spread outward on the motherboard 1 during pressing, avoiding the generation of overflow glue. The auxiliary board 3 is made to assist the production, and there is no need to open an overflow glue groove on the motherboard 1 or the daughter board 2 to damage the board surface, thereby reducing processing damage to the board surface.

[0047] The embodiments of the present application are described above in conjunction with the accompanying drawings. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An anti-overflow printed circuit board, characterized in that: It includes a motherboard, a daughter board and an auxiliary board. The auxiliary board is grooved, and the size of the groove is adapted to the size of the daughter board. The daughter board is arranged on the motherboard. Release films are laid on the daughter board and the motherboard. The groove on the auxiliary board corresponds to the daughter board and the daughter board is nested in the groove, so that the auxiliary board is pressed and fixed on the motherboard. High-temperature tape is affixed to the edges around the outer edge of the groove, and the high-temperature tape corresponds to the bonding surface between the motherboard and the daughter board, so that the auxiliary board forms a height difference locally in the edge area of ​​the daughter board and then blocks the glue at the edge of the groove. A cushioning layer is arranged on the lower surface of the motherboard and the upper surface of the auxiliary board.

2. The anti-overflow printed circuit board according to claim 1, characterized in that: The auxiliary plate is manufactured through the processes of cutting, drilling, sticking high-temperature adhesive tape, etching, baking and forming.

3. The anti-overflow printed circuit board according to claim 2, characterized in that: The auxiliary board is made of copper-free sheet material, and its thickness is 0.1 mm less than the thickness of the sub-board, and the auxiliary board is cut into the same size as the motherboard.

4. The anti-overflow printed circuit board according to claim 3, characterized in that: The hole drilling includes drilling a positioning hole first and then drilling a fixing hole, wherein the positioning hole is drilled near the edge of the auxiliary plate.

5. The anti-overflow printed circuit board according to claim 4, characterized in that: The high temperature tape is affixed by affixing a high temperature tape with a thickness of 0.1 mm on the edges around the outer edge of the groove, and the width of the high temperature tape is at least 10 mm, and the high temperature tape corresponds to the bonding surface of the motherboard and the daughterboard.

6. The anti-overflow printed circuit board according to claim 5, characterized in that: In the etching process, the base copper in other areas of the auxiliary board where the high temperature tape is not attached is etched to expose the base material portion.

7. The anti-overflow printed circuit board according to claim 2, characterized in that: During the molding process, a milling machine is used to cut grooves on the auxiliary plate, and the distance between one side of the groove and the edge of the sub-plate is 4 mils.

8. The anti-overflow printed circuit board according to claim 1, characterized in that: After the sub-board and the motherboard are overlapped, and after the auxiliary board and the motherboard are overlapped, they are fixed by high temperature resistant resin pins.

9. The anti-overflow printed circuit board according to claim 2, characterized in that: The release film is pre-opened with fixing holes at the same position as the fixing holes on the motherboard and is laid at the junction of the motherboard and the auxiliary board.

10. The anti-overflow printed circuit board according to claim 1, characterized in that: The cushioning layer comprises aluminum foil, a buffer pad and kraft paper, and the aluminum foil, the buffer pad and the kraft paper are sequentially laid on the upper surface of the auxiliary board and the lower surface of the mother board from the inside to the outside.

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