A circuit board packaging structure and its packaging method

Through the combined structure of feeding parts, adsorption parts, positioning parts and extruded parts, the problem of degradation in packaging quality caused by inclination during the packaging process of circuit board parts is solved, and stable assembly and efficient packaging of circuit board parts are achieved.

CN119815715BActive Publication Date: 2025-08-01LIAN SHUI XIAN SU HANG KE JI YOU XIAN GONG SI
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Patent Information

Application Number
CN202510042574.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-10
Publication Date
2025-08-01
Estimated Expiration
2045-01-10

AI Technical Summary

Technical Problem

During the circuit board packaging process, it is difficult for operators to keep the circuit board parts neat under high-strength work, resulting in a decrease in packaging quality.

Method used

The combined structure of feeding parts, adsorption parts, positioning parts and extrusion parts is adopted, and the shaft is driven to rotate through the power device, and the circuit board is adsorbed by the adsorption parts and fixed by the positioning parts and extrusion parts to ensure the stability of the circuit board parts during assembly.

Benefits of technology

Improve the stability of circuit board parts during assembly, avoid packaging damage caused by tilting, and improve packaging efficiency and quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of circuit board packaging, and discloses a circuit board packaging structure and a packaging method thereof, including a bracket, a bottom plate fixedly connected to the bottom of the bracket, and a motor fixedly connected to the top of the bottom plate. It further includes: a feeding component, the feeding component includes a feeding frame, the bottom of the feeding frame is fixedly connected to the top of the bracket, a power device is fixedly connected to the surface of the feeding frame, and a shaft rod is fixedly connected to the output end of the power device. In the present invention, parts such as circuit boards are placed on the top of the feeding component for feeding operations. When the adsorption component starts operating, it will adsorb the circuit board for transportation, and assemble parts such as the circuit board on the surface of the feeding component for packaging operations. When the adsorption component transports parts such as the circuit board, it will squeeze the positioning component to squeeze and fix the circuit board, avoiding the displacement of parts such as the circuit board during assembly.
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Description

Technical Field

[0001] The present invention relates to the technical field of circuit board packaging, and particularly to a circuit board packaging structure and a packaging method thereof. Background Art

[0002] ‌Circuit board packaging (PCB packaging)‌ refers to the process of encapsulating bare integrated circuit chips (ICs) in specific housings or packaging materials for installation on printed circuit boards (PCBs) and communication with other electronic components. Packaging not only provides physical protection but also realizes electrical connection and thermal management functions, which have important impacts on circuit performance, stability, and reliability.

[0003] When packaging a circuit board, an operator needs to place the housing inside the packaging device. When placing the circuit board and the parts required for circuit board packaging inside the packaging device, manual assembly of the circuit board and other parts is also required. During assembly, the circuit board and other parts need to be kept neat to avoid damage during packaging caused by the circuit board tilting. However, the production quantity of circuit boards is large, and it is easy for operators to affect the neatness of assembly under high-intensity work, thus affecting the packaging quality of the circuit board. Summary of the Invention

[0004] The purpose of the present invention is to provide a circuit board packaging structure and a packaging method thereof to solve the problems raised in the above background art.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention is a circuit board packaging structure and a packaging method thereof, including a bracket. The bottom of the bracket is fixedly connected with a bottom plate, and the top of the bottom plate is fixedly connected with a motor. It further includes:

[0007] A feeding component, the feeding component includes a feeding frame. The bottom of the feeding frame is fixedly connected with the top of the bracket. The surface of the feeding frame is fixedly connected with a power device, and the output end of the power device is fixedly connected with a shaft rod.

[0008] An adsorption component, the adsorption component includes a rotating rod. The bottom of the rotating rod is fixedly connected with the output end of the motor. A sliding rod is slidably connected to the top of the rotating rod. Connecting plates are respectively fixedly connected to the surfaces of the sliding rod and the rotating rod. Electric push rods are fixedly connected to one ends of the two connecting plates close to each other.

[0009] Positioning component, the positioning component includes a sliding hole plate, the bottom of the sliding hole plate is fixedly connected to the top of the feeding rack, a moving rod is slidably connected to the inner wall of the sliding hole plate, a bent plate is fixedly connected to the end of the moving rod, an extrusion plate is fixedly connected to the end of the bent plate away from the moving rod, and a rubber pad is fixedly connected to the end of the extrusion plate away from the bent plate;

[0010] An extrusion component is arranged on the surface of the positioning component.

[0011] Further, the feeding component includes a meshing rod, the inner wall of the meshing rod is fixedly connected to the surface of the shaft rod, a groove belt is meshed on the surface of the meshing rod, a feeding belt is fixedly connected to the surface of the groove belt, and a connecting frame is fixedly connected to the bottom of the feeding rack;

[0012] A stabilizing frame is fixedly connected to the bottom of the feeding rack, and the end of the shaft rod away from the power device passes through the feeding rack and is rotatably connected to the inner wall of the feeding rack.

[0013] Further, the number of the feeding racks is three, the number of the connecting frames is two, the three feeding racks are fixedly connected by the two connecting frames, the inner wall of the stabilizing frame is rotatably connected to the surface of the rotating rod, the feeding belt is located inside the feeding rack, and two shaft rods are arranged inside the feeding rack, and the two shaft rods are symmetrically arranged with the feeding belt as the center.

[0014] Further, the adsorption component includes a rotating wheel, the bottom of the rotating wheel is fixedly connected to the top of the sliding rod, mounting frames are fixedly connected to the surface of the rotating wheel, a round tube is fixedly connected to the inner wall of the mounting frame, a negative pressure tube is communicated with the top of the round tube, a suction cup is communicated with the bottom of the round tube, a soft pad is fixedly connected to the bottom of the suction cup, and an electric telescopic rod is fixedly connected to the top of the rotating wheel;

[0015] The top of the electric telescopic rod is fixedly connected to a linkage rod, the end of the linkage rod away from the electric telescopic rod is fixedly connected to a sealing disc, and a sealing pad is fixedly connected to the surface of the sealing disc.

[0016] Further, the end of the linkage rod away from the electric telescopic rod extends into the negative pressure tube, the surface of the sealing pad contacts the inner wall of the negative pressure tube, the end of the mounting frame extends to the outer end of the rotating wheel, and the end of the round tube extends to the outer end of the mounting frame.

[0017] Further, the positioning component includes a push plate, the surface of the push plate is fixedly connected to the end of the moving rod, a bent rod is fixedly connected to the surface of the push plate, a semi-circular frame is hinged to the end of the bent rod away from the push plate, a central frame is hinged to the center of the semi-circular frame, and a rectangular frame is fixedly connected to the surface of the central frame;

[0018] A force-bearing rod is fixedly connected to the upper surface of the rectangular frame. A spring is fixedly connected to the surface of the push plate. One end of the spring away from the push plate is fixedly connected to the surface of the sliding hole plate.

[0019] Further, the bottom of the extrusion plate contacts the top of the feeding belt. One end of the moving rod away from the bent plate extends to the outer end of the sliding hole plate. The push plate is located at the end of the moving rod away from the bent plate. The top of the force-bearing rod contacts the bottom of the rotating wheel. The top of the rectangular frame extends above the semi-circular frame.

[0020] Further, the extrusion component includes a support rod. The end of the support rod is fixedly connected to the surface of the rectangular frame. An extension plate is fixedly connected to the surface of the support rod. One end of the extension plate away from the support rod is hinged with an inclined plate. A pressure rod is fixedly connected to the bottom of the inclined plate.

[0021] A elastic piece is fixedly connected to the bottom of the extension plate. One end of the elastic piece away from the extension plate is fixedly connected to the surface of the inclined plate.

[0022] Further, the bottom of the inclined plate inclines towards the end away from the extension plate. The pressure rod is located above the feeding belt. The extension plate is located above the semi-circular frame.

[0023] Further, a packaging method for a circuit board packaging structure includes the following steps:

[0024] S1: Start the power device to drive the shaft rod to rotate inside the feeding frame. When the rotating rod rotates, it drives the groove belt to rotate inside the feeding frame through the meshing rod. When the groove belt rotates, it drives the feeding belt to perform a feeding operation on parts such as circuit boards.

[0025] S2: When the linkage rod moves, it pushes the sealing disc and the sealing gasket to move inside the negative pressure tube. The pressure in the negative pressure tube will be transmitted to the suction cup through the round tube, improving the stability of the suction cup when transporting parts such as circuit boards.

[0026] S3: When the bending rod moves, it pushes the moving rod to slide inside the sliding hole plate through the push plate. When the moving rod moves, it pushes the extrusion plate towards the center of the semi-circular frame through the bent plate, and squeezes and positions parts such as circuit boards during the movement.

[0027] S4: When the extension plate moves downward, it pushes the pressure rod to contact the top of the feeding belt through the inclined plate. When the pressure rod contacts the surface of the feeding belt, the inclined plate uses the slope to push the pressure rod to move on the surface of the feeding belt, and squeezes and limits parts such as circuit boards through the pressure rod.

[0028] The present invention has the following beneficial effects:

[0029] In the present invention, components such as circuit boards are placed on the top of the feeding component for feeding operations. When the adsorption component starts operating, it adsorbs the circuit board for transportation, and assembles components such as the circuit board on the surface of the feeding component for encapsulation operations. When the adsorption component transports components such as the circuit board, it presses the positioning component to squeeze and fix the circuit board, preventing displacement of components such as the circuit board during assembly. When the positioning component moves downward, it pushes the extrusion component to squeeze and limit components such as the circuit board, further improving the stability of components such as the circuit board during assembly operations, and preventing damage to the circuit board due to its inclination during encapsulation.

[0030] In the present invention, three feeding frames are provided. Three feeding frames are used to classify and transport components such as circuit boards. The power device is started to drive the shaft to rotate inside the feeding frame. When the rotating rod rotates, it drives the groove belt to rotate inside the feeding frame through the meshing rod. When the groove belt rotates, it drives the feeding belt to perform feeding operations on components such as circuit boards, so that the adsorption component can quickly adsorb and assemble components such as circuit boards, improving the encapsulation efficiency of the circuit board.

[0031] When the present invention needs to operate on components such as circuit boards, the motor is started to drive the rotating rod to rotate on the inner wall of the stabilizing frame. When the electric push rod pushes the sliding rod to move inside the rotating rod, the sliding rod will push the rotating wheel downward. When the rotating wheel moves downward, it pushes the suction cup to contact components such as the circuit board and adsorb them. At this time, the electric telescopic rod is started to push the linkage rod upward. When the linkage rod moves, it pushes the sealing disc and the sealing gasket to move inside the negative pressure tube. The pressure in the negative pressure tube is transmitted to the suction cup through the round tube, improving the stability of the suction cup when transporting components such as the circuit board. The rotating wheel will push the suction cup to transport components such as the circuit board in the three feeding frames, and at the same time, after the transportation is completed, it will assemble components such as the circuit board on the top of the feeding belt, improving the encapsulation efficiency of the circuit board.

[0032] When the rotating wheel in the present invention moves downward, it will push the rectangular frame downward through the force-bearing rod. When the rectangular frame moves downward, it pushes the center of the semi-circular frame downward through the center frame. At this time, the end of the semi-circular frame will pull the bending rod to move downward below the rectangular frame. When the bending rod moves, it pushes the moving rod to slide inside the sliding hole plate through the push plate. When the moving rod moves, it pushes the extrusion plate to move toward the center of the semi-circular frame through the bending plate, and squeezes and positions components such as the circuit board during the movement. The extrusion plate is used to limit components such as the circuit board to improve its stability during assembly, preventing displacement of components such as the circuit board during assembly from affecting the encapsulation effect.

[0033] When the rectangular frame of the present invention moves downward, the support rod pushes the extension plate to move downward. When the extension plate moves downward, the inclined plate pushes the pressure rod to contact the top of the feed belt. When the pressure rod contacts the surface of the feed belt, the inclined plate uses the inclination to push the pressure rod to move on the surface of the feed belt, and the pressure rod is used to squeeze and limit the circuit board and other parts, further improving the stability of the circuit board and other parts during assembly. The pressure rod and the extrusion plate cooperate with each other to limit the four directions of the circuit board and other parts, further improving the stability of the circuit board and other parts during assembly, and avoiding dislocation of the circuit board during assembly, which may cause damage to the circuit board during packaging.

[0034] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0037] Figure 2 Schematic diagram of the support structure of the present invention;

[0038] Figure 3 This is a schematic diagram of the overall structure of the feeding component of the present invention;

[0039] Figure 4 This is another structural schematic diagram of the feeding component of the present invention;

[0040] Figure 5 For the present invention Figure 3 A magnified schematic diagram of part A in FIG;

[0041] Figure 6 This is a schematic diagram of the overall structure of the adsorption component of the present invention;

[0042] Figure 7 This is a schematic diagram of the overall structure of the positioning component of the present invention;

[0043] Figure 8 This is a schematic diagram of the overall structure of the extruded component of the present invention;

[0044] Figure 9 It is a schematic diagram of the process structure of the present invention.

[0045] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0046] In the figure: 1, support; 2, bottom plate; 3, feeding component; 4, adsorption component; 5, positioning component; 6, extrusion component; 7, motor; 10, feeding frame; 11, power device; 12, feeding belt; 13, groove belt; 14, connecting frame; 15, stabilizing frame; 16, shaft rod; 17, meshing rod; 20, rotating rod; 21, sliding rod; 22, electric push rod; 23, connecting plate; 24, runner; 25, electric telescopic rod; 26, linkage rod; 27, negative pressure pipe; 28, gasket; 29, mounting frame; 30, suction cup; 31, soft pad; 32, round pipe; 33, sealing disc; 40, push plate; 41, spring; 42, moving rod; 43, extrusion plate; 44, rubber pad; 45, rectangular frame; 46, stress rod; 47, bent plate; 48, bending rod; 49, semi-circular frame; 50, central frame; 51, sliding hole plate; 60, extension plate; 61, inclined plate; 62, pressure rod; 63, elastic sheet; 64, support rod. Specific implementation manner

[0047] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0048] Please refer to Figures 1 - 9 As shown in the figure, the present invention is a circuit board packaging structure and its packaging method, including a support 1, the bottom of the support 1 is fixedly connected with a bottom plate 2, the top of the bottom plate 2 is fixedly connected with a motor 7, and further includes:

[0049]

[0050] The feeding component 3, the feeding component 3 includes a feeding frame 10, the bottom of the feeding frame 10 is fixedly connected with the top of the support 1, the surface of the feeding frame 10 is fixedly connected with a power device 11, and the output end of the power device 11 is fixedly connected with a shaft rod 16;

[0050] The adsorption component 4, the adsorption component 4 includes a rotating rod 20, the bottom of the rotating rod 20 is fixedly connected with the output end of the motor 7, the top of the rotating rod 20 is slidably connected with a sliding rod 21, and the surfaces of the sliding rod 21 and the rotating rod 20 are respectively fixedly connected with a connecting plate 23, and one end of the two connecting plates 23 close to each other is fixedly connected with an electric push rod 22;

[0051] The positioning component 5, the positioning component 5 includes a sliding hole plate 51, the bottom of the sliding hole plate 51 is fixedly connected with the top of the feeding frame 10, the inner wall of the sliding hole plate 51 is slidably connected with a moving rod 42, the end of the moving rod 42 is fixedly connected with a bent plate 47, one end of the bent plate 47 away from the moving rod 42 is fixedly connected with an extrusion plate 43, and one end of the extrusion plate 43 away from the bent plate 47 is fixedly connected with a rubber pad 44;

[0052] The surface of the positioning component 5 is provided with an extrusion component 6. In the present invention, parts such as circuit boards are placed on the top of the feeding component 3 for feeding operations. When the adsorption component 4 starts operating, it adsorbs the circuit board for transportation, and assembles parts such as the circuit board on the surface of the feeding component 3 for encapsulation operations. When the adsorption component 4 transports parts such as the circuit board, it squeezes the positioning component 5 to squeeze and fix the circuit board, preventing displacement of parts such as the circuit board during assembly. When the positioning component 5 moves downward, it pushes the extrusion component 6 to squeeze and limit parts such as the circuit board, further improving the stability of parts such as the circuit board during assembly operations and preventing damage to the circuit board caused by its inclination during encapsulation.

[0053] The feeding component 3 includes a meshing rod 17. The inner wall of the meshing rod 17 is fixedly connected to the surface of the shaft rod 16. The surface of the meshing rod 17 meshes with a groove belt 13. The surface of the groove belt 13 is fixedly connected to a feeding belt 12. The bottom of the feeding frame 10 is fixedly connected to a connecting frame 14;

[0054] The bottom of the feeding frame 10 is fixedly connected to a stabilizing frame 15. One end of the shaft rod 16 away from the power device 11 penetrates the feeding frame 10 and is rotatably connected to the inner wall of the feeding frame 10.

[0055] The number of feeding frames 10 is set to three, and the number of connecting frames 14 is set to two. The three feeding frames 10 are fixedly connected by the two connecting frames 14. In the present invention, the number of feeding frames 10 is set to three. Three feeding frames 10 are used to classify and transport parts such as circuit boards. The power device 11 is started to drive the shaft rod 16 to rotate inside the feeding frame 10. When the rotating rod 20 rotates, it drives the groove belt 13 to rotate inside the feeding frame 10 through the meshing rod 17. When the groove belt 13 rotates, it drives the feeding belt 12 to perform feeding operations on parts such as the circuit board, so that the adsorption component 4 can quickly adsorb and assemble parts such as the circuit board, improving the encapsulation efficiency of the circuit board. The inner wall of the stabilizing frame 15 is rotatably connected to the surface of the rotating rod 20. The feeding belt 12 is located inside the feeding frame 10. There are two shaft rods 16 inside the feeding frame 10, and the two shaft rods 16 are symmetrically arranged with the feeding belt 12 as the center.

[0056] The adsorption component 4 includes a rotating wheel 24. The bottom of the rotating wheel 24 is fixedly connected to the top of a sliding rod 21. The surface of the rotating wheel 24 is fixedly connected to a mounting frame 29. The inner wall of the mounting frame 29 is fixedly connected to a circular tube 32. The top of the circular tube 32 communicates with a negative pressure tube 27. The bottom of the circular tube 32 communicates with a suction cup 30. The bottom of the suction cup 30 is fixedly connected to a soft pad 31. The top of the rotating wheel 24 is fixedly connected to an electric telescopic rod 25;

[0057] The top of the electric telescopic rod 25 is fixedly connected to a linkage rod 26. One end of the linkage rod 26 away from the electric telescopic rod 25 is fixedly connected to a sealing disc 33. The surface of the sealing disc 33 is fixedly connected to a sealing gasket 28.

[0058]

[0058] The end of the linkage rod 26 away from the electric telescopic rod 25 extends into the inside of the negative pressure pipe 27. When the present invention needs to operate on parts such as a circuit board, the motor 7 is started to drive the rotating rod 20 to rotate on the inner wall of the stabilizing frame 15. When the electric push rod 22 pushes the sliding rod 21 to move into the inside of the rotating rod 20, the sliding rod 21 will push the rotating wheel 24 to move downward. When the rotating wheel 24 moves downward, it pushes the suction cup 30 to contact and adsorb parts such as the circuit board. At this time, the electric telescopic rod 25 is started to push the linkage rod 26 to move upward. When the linkage rod 26 moves, it pushes the sealing disc 33 and the sealing gasket 28 to move inside the negative pressure pipe 27. The pressure in the negative pressure pipe 27 will be transmitted to the suction cup 30 through the round pipe 32, improving the stability of the suction cup 30 when transporting parts such as the circuit board. The rotating wheel 24 will push the suction cup 30 to transport parts such as the circuit board in the three feeding frames 10. At the same time, after the transportation is completed, the parts such as the circuit board will be assembled on the top of the feeding belt 12, improving the packaging efficiency of the circuit board. The surface of the sealing gasket 28 contacts the inner wall of the negative pressure pipe 27. The end of the mounting frame 29 extends to the outer end of the rotating wheel 24. The end of the round pipe 32 extends to the outer end of the mounting frame 29.

[0059]

[0059] The positioning member 5 includes a push plate 40. The surface of the push plate 40 is fixedly connected to the end of the moving rod 42. A bent rod 48 is fixedly connected to the surface of the push plate 40. One end of the bent rod 48 away from the push plate 40 is hinged to a semi-circular frame 49. The center of the semi-circular frame 49 is hinged to a center frame 50. A rectangular frame 45 is fixedly connected to the surface of the center frame 50;

[0060]

[0060] A force-bearing rod 46 is fixedly connected to the upper surface of the rectangular frame 45. A spring 41 is fixedly connected to the surface of the push plate 40. One end of the spring 41 away from the push plate 40 is fixedly connected to the surface of the slide hole plate 51.

[0061]

[0061] The bottom of the pressing plate 43 contacts the top of the feeding belt 12. The end of the moving rod 42 away from the bent plate 47 extends to the outer end of the slide hole plate 51. When the rotating wheel 24 moves downward in the present invention, it will push the rectangular frame 45 to move downward through the force-bearing rod 46. When the rectangular frame 45 moves downward, it pushes the center of the semi-circular frame 49 to move downward through the center frame 50. At this time, the end of the semi-circular frame 49 will pull the bent rod 48 to move downward below the rectangular frame 45. When the bent rod 48 moves, it pushes the moving rod 42 to slide inside the slide hole plate 51 through the push plate 40. When the moving rod 42 moves, it pushes the pressing plate

[0062] The extrusion member 6 includes a support rod 64, the end of the support rod 64 is fixedly connected to the surface of the rectangular frame 45, an extension plate 60 is fixedly connected to the surface of the support rod 64, one end of the extension plate 60 away from the support rod 64 is hinged with an inclined plate 61, and a pressure rod 62 is fixedly connected to the bottom of the inclined plate 61;

[0063] A shrapnel 63 is fixedly connected to the bottom of the extension plate 60, and one end of the shrapnel 63 away from the extension plate 60 is fixedly connected to the surface of the inclined plate 61.

[0064] The bottom of the inclined plate 61 slopes away from the extension plate 60. When the rectangular frame 45 of the present invention moves downward, the support rod 64 is used to push the extension plate 60 to move downward. When the extension plate 60 moves downward, the inclined plate 61 is used to push the pressure rod 62 to contact the top of the feeding belt 12. When the pressure rod 62 contacts the surface of the feeding belt 12, the inclined plate 61 uses the slope to push the pressure rod 62 to move on the surface of the feeding belt 12, and the pressure rod 62 is used to squeeze and limit parts such as circuit boards, further improving the stability of parts such as circuit boards during assembly. The pressure rod 62 and the extrusion plate 43 cooperate with each other to limit the four directions of parts such as circuit boards, further improving the stability of parts such as circuit boards during assembly, and avoiding damage to the circuit board during encapsulation due to misalignment during assembly. The pressure rod 62 is located above the feeding belt 12, and the extension plate 60 is located above the semi-circular frame 49.

[0065] A packaging method for a circuit board packaging structure includes the following steps:

[0066] S1: Start the power device 11 to drive the shaft rod 16 to rotate inside the feeding frame 10. When the rotating rod 20 rotates, it drives the groove belt 13 to rotate inside the feeding frame 10 through the meshing rod 17. When the groove belt 13 rotates, it drives the feeding belt 12 to perform a feeding operation on parts such as circuit boards;

[0067] S2: When the linkage rod 26 moves, it pushes the sealing disc 33 and the sealing gasket 28 to move inside the negative pressure tube 27. The pressure in the negative pressure tube 27 will be transmitted to the suction cup 30 through the round tube 32, improving the stability of the suction cup 30 when transporting parts such as circuit boards;

[0068] S3: When the bending rod 48 moves, it pushes the moving rod 42 to slide inside the sliding hole plate 51 through the push plate 40. When the moving rod 42 moves, it pushes the extrusion plate 43 to move towards the center of the semi-circular frame 49 through the bending plate 47, and squeezes and positions parts such as circuit boards during the movement;

[0069] S4: When the extension plate 60 moves downward, it pushes the pressure rod 62 to contact the top of the feeding belt 12 through the inclined plate 61. When the pressure rod 62 contacts the surface of the feeding belt 12, the inclined plate 61 uses the slope to push the pressure rod 62 to move on the surface of the feeding belt 12, and squeezes and positions parts such as circuit boards through the pressure rod 62.

[0070] During use, place parts such as circuit boards on the top of the feeding component 3 for feeding operations. When the adsorption component 4 starts working, it will adsorb the circuit board for transportation, and assemble parts such as the circuit board on the surface of the feeding component 3 for encapsulation operations. When the adsorption component 4 transports parts such as the circuit board, it will squeeze the positioning component 5 to squeeze and fix the circuit board, avoiding displacement of parts such as the circuit board during assembly. When the positioning component 5 moves downward, it will push the extrusion component 6 to perform extrusion and limit on parts such as the circuit board, further improving the stability of parts such as the circuit board during assembly operations, and avoiding damage to the circuit board caused by its inclination during encapsulation. The number of feeding racks 10 is set to three, and three feeding racks 10 are used to classify and transport parts such as circuit boards. Start the power device 11 to drive the shaft rod 16 to rotate inside the feeding rack 10. When the rotating rod 20 rotates, it drives the groove belt 13 to rotate inside the feeding rack 10 through the meshing rod 17. When the groove belt 13 rotates, it drives the feeding belt 12 to perform feeding operations on parts such as the circuit board, so that the adsorption component 4 can quickly adsorb and assemble parts such as the circuit board, improving the encapsulation efficiency of the circuit board. When it is necessary to operate on parts such as the circuit board, start the motor 7 to drive the rotating rod 20 to rotate on the inner wall of the stabilizing frame 15. When the electric push rod 22 pushes the sliding rod 21 to move inside the rotating rod 20, the sliding rod 21 will push the rotating wheel 24 to move downward. When the rotating wheel 24 moves downward, it pushes the suction cup 30 to contact parts such as the circuit board and adsorb them. At this time, start the electric telescopic rod 25 to push the linkage rod 26 to move upward. When the linkage rod 26 moves, it pushes the sealing disc 33 and the sealing gasket 28 to move inside the negative pressure tube 27. The pressure in the negative pressure tube 27 will be transmitted to the suction cup 30 through the round tube 32, improving the stability of the suction cup 30 when transporting parts such as the circuit board. The rotating wheel 24 will push the suction cup 30 to transport parts such as the circuit board in the three feeding racks 10, and at the same time, after the transportation is completed, it will assemble parts such as the circuit board on the top of the feeding belt 12, improving the encapsulation efficiency of the circuit board. When the rotating wheel 24 moves downward, it will push the rectangular frame 45 to move downward through the force-bearing rod 46. When the rectangular frame 45 moves downward, it will push the center of the semi-circular frame 49 to move downward through the center frame 50. At this time, the end of the semi-circular frame 49 will pull the bending rod 48 to move downward below the rectangular frame 45. When the bending rod 48 moves, it will push the moving rod 42 to slide inside the sliding hole plate 51 through the push plate 40. When the moving rod 42 moves, it will push the extrusion plate 43 to move toward the center of the semi-circular frame 49 through the bent plate 47, and squeeze and position parts such as the circuit board during the movement. Use the extrusion plate 43 to limit parts such as the circuit board to improve its stability during assembly, and avoid misalignment of parts such as the circuit board during assembly, which affects the encapsulation effect. When the rectangular frame 45 moves downward, it will push the extension plate 60 to move downward through the support rod 64. When the extension plate 60 moves downward, it will push the pressure rod 62 to contact the top of the feeding belt 12 through the inclined plate 61. When the pressure rod 62 contacts the surface of the feeding belt 12,The inclined plate 61 uses the slope to push the pressure rod 62 to move on the surface of the feeding belt 12, and the pressure rod 62 is used to extrude and limit parts such as the circuit board, further improving the stability of parts such as the circuit board during assembly. The cooperation between the pressure rod 62 and the extrusion plate 43 can limit the four directions of parts such as the circuit board, further improving the stability of parts such as the circuit board during assembly, and avoiding damage to the circuit board during encapsulation due to misalignment during assembly.,

[0071] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A circuit board packaging structure, including a bracket (1), a bottom plate (2) is fixedly connected to the bottom of the bracket (1), and a motor (7) is fixedly connected to the top of the bottom plate (2), characterized in that, It further includes: A feeding component (3), the feeding component (3) includes a feeding frame (10), the bottom of the feeding frame (10) is fixedly connected to the top of the bracket (1), a power device (11) is fixedly connected to the surface of the feeding frame (10), and a shaft rod (16) is fixedly connected to the output end of the power device (11); An adsorption component (4), the adsorption component (4) includes a rotating rod (20), the bottom of the rotating rod (20) is fixedly connected to the output end of the motor (7), a sliding rod (21) is slidably connected to the top of the rotating rod (20), connecting plates (23) are respectively fixedly connected to the surfaces of the sliding rod (21) and the rotating rod (20), and an electric push rod (22) is fixedly connected to one end of the two connecting plates (23) close to each other; A positioning component (5), the positioning component (5) includes a sliding hole plate (51), the bottom of the sliding hole plate (51) is fixedly connected to the top of the feeding frame (10), a moving rod (42) is slidably connected to the inner wall of the sliding hole plate (51), a bent plate (47) is fixedly connected to the end of the moving rod (42), an extrusion plate (43) is fixedly connected to one end of the bent plate (47) away from the moving rod (42), and a rubber pad (44) is fixedly connected to one end of the extrusion plate (43) away from the bent plate (47); An extrusion component (6) is arranged on the surface of the positioning component (5).

2. The circuit board packaging structure according to claim 1, characterized in that: The feeding component (3) includes a meshing rod (17), the inner wall of the meshing rod (17) is fixedly connected to the surface of the shaft rod (16), a groove belt (13) is meshed on the surface of the meshing rod (17), a feeding belt (12) is fixedly connected to the surface of the groove belt (13), and a connecting frame (14) is fixedly connected to the bottom of the feeding frame (10); A stabilizing frame (15) is fixedly connected to the bottom of the feeding frame (10), and one end of the shaft rod (16) away from the power device (11) penetrates through the feeding frame (10) and is rotatably connected to the inner wall of the feeding frame (10).

3. The circuit board packaging structure according to claim 2, characterized in that: The number of the feeding frames (10) is three, the number of the connecting frames (14) is two, the three feeding frames (10) are fixedly connected by the two connecting frames (14), the inner wall of the stabilizing frame (15) is rotatably connected to the surface of the rotating rod (20), the feeding belt (12) is located inside the feeding frame (10), two shaft rods (16) are arranged inside the feeding frame (10), and the two shaft rods (16) are symmetrically arranged with the feeding belt (12) as the center.

4. The circuit board packaging structure according to claim 3, characterized in that: The adsorption component (4) includes a rotating wheel (24), the bottom of the rotating wheel (24) is fixedly connected to the top of the sliding rod (21), a mounting frame (29) is fixedly connected to the surface of the rotating wheel (24), a circular tube (32) is fixedly connected to the inner wall of the mounting frame (29), a negative pressure tube (27) is communicated with the top of the circular tube (32), a suction cup (30) is communicated with the bottom of the circular tube (32), a soft pad (31) is fixedly connected to the bottom of the suction cup (30), and an electric telescopic rod (25) is fixedly connected to the top of the rotating wheel (24); A linkage rod (26) is fixedly connected to the top of the electric telescopic rod (25). One end of the linkage rod (26) away from the electric telescopic rod (25) is fixedly connected to a sealing disc (33), and a sealing gasket (28) is fixedly connected to the surface of the sealing disc (33).

5. A circuit board packaging structure according to claim 4, characterized in that: One end of the linkage rod (26) away from the electric telescopic rod (25) extends into the negative pressure pipe (27). The surface of the sealing gasket (28) contacts the inner wall of the negative pressure pipe (27). The end of the mounting bracket (29) extends to the outer end of the runner (24), and the end of the round pipe (32) extends to the outer end of the mounting bracket (29).

6. A circuit board packaging structure according to claim 5, characterized in that: The positioning component (5) includes a push plate (40). The surface of the push plate (40) is fixedly connected to the end of the moving rod (42). A bent rod (48) is fixedly connected to the surface of the push plate (40). One end of the bent rod (48) away from the push plate (40) is hinged to a semi-circular frame (49). The center of the semi-circular frame (49) is hinged to a central frame (50), and a rectangular frame (45) is fixedly connected to the surface of the central frame (50); A stress rod (46) is fixedly connected to the upper surface of the rectangular frame (45). A spring (41) is fixedly connected to the surface of the push plate (40). One end of the spring (41) away from the push plate (40) is fixedly connected to the surface of the sliding hole plate (51).

7. A circuit board packaging structure according to claim 6, characterized in that: The bottom of the extrusion plate (43) contacts the top of the feeding belt (12). One end of the moving rod (42) away from the bent plate (47) extends to the outer end of the sliding hole plate (51). The push plate (40) is located at one end of the moving rod (42) away from the bent plate (47). The top of the stress rod (46) contacts the bottom of the runner (24). The top of the rectangular frame (45) extends above the semi-circular frame (49).

8. A circuit board packaging structure according to claim 7, characterized in that: The extrusion component (6) includes a support rod (64). The end of the support rod (64) is fixedly connected to the surface of the rectangular frame (45). An extension plate (60) is fixedly connected to the surface of the support rod (64). One end of the extension plate (60) away from the support rod (64) is hinged to an inclined plate (61), and a pressure rod (62) is fixedly connected to the bottom of the inclined plate (61); An elastic sheet (63) is fixedly connected to the bottom of the extension plate (60). One end of the elastic sheet (63) away from the extension plate (60) is fixedly connected to the surface of the inclined plate (61).

9. A circuit board packaging structure according to claim 8, characterized in that: The bottom of the inclined plate (61) is inclined away from the extension plate (60). The pressure rod (62) is located above the feeding belt (12), and the extension plate (60) is located above the semi-circular frame (49).

10. The encapsulation method of a circuit board encapsulation structure according to claim 9, characterized in that, Including the following steps: S1: Start the power device (11) to drive the shaft rod (16) to rotate inside the feeding frame (10). When the rotating rod (20) rotates, it drives the groove belt (13) to rotate inside the feeding frame (10) through the meshing rod (17). When the groove belt (13) rotates, it drives the feeding belt (12) to perform feeding operations on parts such as circuit boards; S2: When the linkage rod (26) moves, it pushes the sealing disc (33) and the gasket (28) to move inside the negative pressure pipe (27). The pressure in the negative pressure pipe (27) will be transmitted to the suction cup (30) through the round pipe (32), improving the stability of the suction cup (30) when transporting parts such as circuit boards. S3: When the bending rod (48) moves, it pushes the moving rod (42) to slide inside the sliding hole plate (51) through the push plate (40). When the moving rod (42) moves, it pushes the extrusion plate (43) towards the center of the semi-circular frame (49) through the bending plate (47), and squeezes and positions parts such as circuit boards during the movement. S4: When the extension plate (60) moves downward, it pushes the pressure rod (62) to contact the top of the feeding belt (12) through the inclined plate (61). When the pressure rod (62) contacts the surface of the feeding belt (12), the inclined plate (61) uses the slope to push the pressure rod (62) to move on the surface of the feeding belt (12), and squeezes and limits parts such as circuit boards through the pressure rod (62).

Citation Information

Patent Citations

  • SMT (Surface Mount Technology) packaging device and packaging method

    CN117750651A

  • A taping attachment of PCB

    KR101281600B1