Manufacturing method of gold finger plate without gold guide wire

Abstract

The invention relates to the technical field of electronic technology, in particular to a method for manufacturing a gold finger board without a gold guide lead, which comprises the following steps of: S1, manufacturing a circuit pattern of a middle layer of a multi-layer gold finger board for an inner layer circuit; s2, pressing: tightly bonding the middle layers of the plurality of manufactured golden finger plates with the outer layer copper foil through modes such as hot-pressing fusion and the like to form a multi-layer plate; s3, drilling, namely drilling holes of various specifications and sizes on the multi-layer golden finger plate according to an originally set program; s4, electroplating: plating copper with required thickness in the drilled holes and on the surface of the multi-layer golden finger plate by adopting an electrolysis mode; and S5, outer-layer circuit manufacturing: manufacturing a circuit pattern on the surface layer of the multi-layer golden finger board as required. According to the manufacturing method of the gold finger board without the gold guide lead, the gold finger PCB without the gold guide lead has good high-frequency performance, and the requirements of high-speed data transmission and high-frequency signal processing can be met.

Description

Technical Field

[0001] The invention relates to the technical field of electronic technology, in particular to a method for manufacturing a gold finger board without gold conductive wires. Background Art

[0002] With the rapid development of electronic technology, circuit boards, as the basic components of electronic devices, have a vital impact on the overall performance of electronic devices through their performance and quality. As a common type of circuit board, a row of gold finger contacts are made near the edge of the circuit board for signal connection between circuit boards. However, in the traditional method of making gold finger boards, after the gold fingers are plated with gold, the gold wires cannot be completely removed and a part of them will remain on the PCB board. This will lead to a decrease in the performance of the gold finger board. Therefore, it is of great practical significance to develop a method for making a gold finger board without gold wires.

[0003] In the previous production technology, after the gold finger board was plated with gold, it was impossible to completely remove the gold guide wires, and some of the gold guide wires would remain at the end of the gold finger. This part of the remaining gold guide wires would have the risk of falling off during use, and would also cause certain losses in the signal transmission between the boards, affecting the performance of the circuit board;

[0004] In view of the above problems, a method for manufacturing a gold finger board without gold conductive wires is provided. Summary of the invention

[0005] The purpose of the present invention is to provide a method for manufacturing a gold finger board without gold conductive wires to solve the problems raised in the above background technology. To achieve the above purpose, the present invention provides the following technical solutions: A method for manufacturing a gold finger board without gold conductive wires, comprising the following steps:

[0006] S1, inner layer circuit, make the middle layer circuit pattern of the multi-layer gold finger board;

[0007] S2, pressing, the middle layer and the outer copper foil of the prepared multiple gold finger boards are tightly bonded together by hot pressing and fusing to form a multi-layer board;

[0008] S3, drilling, drilling holes of various sizes on the multi-layer gold finger board according to the originally set program;

[0009] S4, electroplating, electroplating the required thickness of copper in the drilled holes and on the surface of the multi-layer gold finger board by electrolysis;

[0010] S5, outer layer circuit, on the surface of the multi-layer gold finger board, make the circuit pattern as needed. At this time, the gold finger position made needs to add the upper gold lead wire to facilitate the subsequent process of gold plating the gold finger;

[0011] S6. Print the easily washable selective solder mask ink to expose the gold finger positions that need to be gold plated, and cover the other positions that do not need to be gold plated with the easily washable selective solder mask ink. The characteristic of the selective solder mask ink is that it can effectively protect the positions that do not need to be gold plated from being affected by the gold plating solution, and this part of the ink can be easily washed off after gold plating.

[0012] Preferably, it also includes:

[0013] S7, gold plating, gold plating for the exposed gold finger area;

[0014] S8, remove the selected solder mask ink, and remove the selected solder mask ink covering the board;

[0015] S9, solder mask printing, printing normal solder mask ink; this ink is not easy to be washed off after printing; and can protect the covered area from external attacks;

[0016] S10, covering with a layer of selective dry film, covering the PCB board with a layer of selective dry film, exposing the gold wires temporarily added in S5, and covering all other positions with a layer of selective dry film for protection. The function of the selective dry film is to protect the circuits in other areas from reacting with the chemical solution when removing the gold wires.

[0017] Preferably, the gold thickness requirement in S7 is 3-30U.

[0018] Preferably, it also includes:

[0019] S11, etching, using etching solution to etch away the gold wires temporarily added in S5, and the etching solution will not have any attack effect on other selected dry film covered areas;

[0020] S12, removing the dry film, removing the selected dry film covered by S10;

[0021] S13, Printing text silk screen, printing text logo.

[0022] Preferably, it also includes:

[0023] S14, CNC forming, divides the WORKING PNL board into small units;

[0024] S15, finished product testing, appearance inspection, check the functionality and appearance of the gold finger board;

[0025] S16. Shipment.

[0026] Preferably, the etching solution includes acidic cupric chloride, alkaline cupric chloride, ferric chloride, ammonium persulfate, sulfuric acid / chromic acid, and sulfuric acid / hydrogen peroxide etching solution.

[0027] Preferably, the selected dry film includes an organic silicon dry film, an organic metal dry film, an epoxy dry film, an etching resistant dry film, an electroplating resistant dry film, a solder resist dry film or a solvent-based dry film.

[0028] Preferably, the solder resist ink includes thermal curing solder resist ink, UV curing solder resist ink, and liquid photosensitive solder resist ink.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. High frequency performance: The gold finger PCB without gold lead has good high frequency performance and can meet the needs of high-speed data transmission and high-frequency signal processing.

[0031] 2. Anti-magnetic interference capability: The gold-finger-free PCB has strong anti-magnetic interference capability and can resist the influence of external magnetic fields on the circuit, thereby improving the reliability and stability of the system.

[0032] 3. High reliability: The gold-finger-free PCB has good reliability and can continue to work uninterruptedly in harsh environments, thereby improving the reliability and durability of the system.

[0033] 4. Cost-effectiveness: Although the manufacturing cost of leadless gold finger PCB may be slightly higher than that of traditional PCB, due to its high integration and reliability, it can reduce the need for additional components and circuit boards, thereby reducing the overall cost. In addition, due to its easy maintenance, it can also reduce long-term maintenance costs.

[0034] 5. Good heat dissipation performance: The design of leadless gold finger PCB is conducive to heat dissipation, reducing the temperature rise of the circuit board and improving the stability of the circuit board. This is especially important for high-power or highly integrated circuits.

[0035] 6. High flexibility: Leadless gold finger PCB can adapt to various complex circuit requirements, including high frequency, high speed and high voltage applications. In addition, due to its highly integrated characteristics, the size and shape of the circuit board can be flexibly adjusted according to needs;

[0036] 7. No gold-conducting wire gold finger PCB, there is no gold-conducting wire at the end of the gold finger, which can effectively reduce the loss during signal transmission;

[0037] 8. No gold-finger PCB, no gold-lead wires extend outside the board at the edge of the PCB. After CNC board division, there will be no copper exposure on the edge of the board, and the appearance of the PCB is more beautiful.

[0038] 9. Use etching to remove the gold wire, the edge of the gold finger is relatively neat, and there will be no unevenness. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a structural schematic diagram of the gold conductive wire of the present invention;

[0040] Figure 2 It is a structural schematic diagram of the gold-plating position of the present invention;

[0041] Figure 3 This is a schematic diagram of the structure of the cover chemical dry film of the present invention;

[0042] Figure 4 It is a schematic diagram of the structure after etching of the present invention. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the present invention.

[0044] See also Figures 1 to 4 The present invention provides a technical solution: a method for manufacturing a gold finger board without gold conductive wires, comprising the following steps:

[0045] S1, inner layer circuit, the middle layer circuit pattern of the multi-layer gold finger board is produced. The inner layer circuit plays a vital role in the production of the multi-layer gold finger board. This level of circuit pattern production not only determines the accuracy and stability of the internal circuit of the gold finger board, but also has a profound impact on the performance of the entire circuit board. The inner layer circuit is the main path of the internal electrical connection of the circuit board. They connect various electronic components through fine wiring to form a complete circuit system. In the multi-layer gold finger board, the inner layer circuit realizes the transmission and electrical connection of signals between different layers, so that the entire circuit board can work normally. The inner layer circuit, as one of the skeletons of the gold finger board, provides the necessary support and stability. Together with the outer layer circuit, insulation layer, etc., it constitutes the overall structure of the gold finger board, ensuring the reliability and durability of the circuit board during use. The wiring design and material selection of the inner layer circuit have an important influence on the signal transmission performance. Through reasonable wiring design and selection of high-quality materials, the loss of signals during transmission can be reduced, and the integrity and stability of signal transmission can be improved. This is especially important for gold finger boards that require high-speed data transmission and high-frequency signal processing. The main wear resistance and corrosion resistance of the gold finger board come from the gold plating layer or other precious metal layer on its surface, but the stability and quality of the inner layer circuit also have a certain impact on the overall wear resistance and corrosion resistance of the gold finger board.

[0046] S2, lamination, the middle layer and the outer copper foil of the prepared multiple gold finger boards are tightly bonded together by hot pressing and fusing to form a multi-layer board. Lamination is to heat and pressurize the multi-layer board to achieve adhesion and solidification between different layers to make it one. This process not only involves precise control of temperature and pressure, but also involves many factors such as expansion, contraction and stress release of the material. During the lamination process, by applying appropriate temperature and pressure, the resin between the layers of material can fully flow and solidify to form a firm bond. This ensures the stability and integrity of the internal structure of the gold finger board. Before lamination, the circuit patterns of each layer need to be accurately aligned to ensure that the circuit patterns between the layers can be accurately connected. During the lamination process, this alignment can be maintained by precisely controlling the temperature and pressure to avoid interlayer slippage during subsequent processing. The laminated multi-layer gold finger board has higher strength and rigidity and can withstand greater mechanical and thermal stress. At the same time, the multi-layer structure also improves the corrosion resistance, wear resistance and electrical performance of the gold finger board. Lamination is an efficient manufacturing process that can complete the bonding of multi-layer boards at one time without multiple processing and assembly. This reduces production costs and improves production efficiency. Pre-pressing:

[0047] Also known as pre-lamination. The main purpose of this stage is to initially bond the layers together in preparation for formal lamination. Preheating and low pressure are used during the pre-lamination process to avoid excessive flow of interlayer materials and prevent the entry of air and impurities. Formal lamination: This stage needs to be completed in a high temperature and high pressure environment to allow the interlayer materials to fully flow and solidify, ultimately forming a solid multi-layer gold finger board. During the formal lamination process, time, temperature and pressure need to be precisely controlled to ensure the complete bonding of each layer of material and the stability of electrical properties.

[0048] S3. Drilling. On the multi-layer gold finger board, holes of various sizes are drilled according to the original set program. By drilling, holes suitable for various component pins or connecting wires can be formed on the gold finger board, so that the components can be firmly fixed on the circuit board and reliably connected to the wires on the circuit board. These holes not only provide installation locations for components, but also ensure the electrical connection between components and circuit boards. Multi-layer gold finger boards usually have internal metal layers and through holes, which allow signal transmission and electrical connection between different layers. Drilling can ensure the accuracy and reliability of these internal connection points, thereby realizing the complex circuit network inside the circuit board. This is crucial to achieving high performance and high reliability of circuit boards. Some devices or circuits generate heat during operation and need to be cooled to maintain normal operating temperature. By drilling holes on the gold finger board, the heat dissipation area can be increased, allowing heat to dissipate from the circuit board to prevent overheating and damage to components. This heat dissipation method is particularly important in high-performance and high-power density circuit boards;

[0049] S4, electroplating, electrolytically plate copper of the required thickness in the drilled holes and on the surface of the multi-layer gold finger board. The electroplated copper layer can also provide a layer of protection for the gold finger board to prevent it from being damaged by environmental factors such as oxidation and corrosion. The copper layer can isolate oxygen and moisture in the air, reduce the contact of the circuit board with these harmful substances, and thus extend the service life of the circuit board. Copper is an excellent conductor with low resistivity and good conductivity. By electroplating copper on the surface and in the holes of the gold finger board, the conductivity of the circuit board can be significantly improved. This is crucial to ensure the stability and reliability of signal transmission and electrical connection on the circuit board. The electroplated copper layer can also increase the mechanical strength of the gold finger board. The copper layer has a strong bonding force with the substrate, which can enhance the overall structural stability of the circuit board. At the same time, the copper layer also has a certain hardness and wear resistance, which can resist the impact and wear of external mechanical stress. The electroplated copper layer can also improve the welding performance of the gold finger board. The wettability between the copper layer and the solder is good, which can ensure a good bond between the solder and the circuit board during the welding process. This helps to improve the reliability and stability of welding and reduce the occurrence of welding defects and failures;

[0050] S5, outer circuit, on the surface of the multi-layer gold finger board, the circuit pattern is made as needed. At this time, the gold finger position needs to be added with gold guide wires to facilitate the gold finger gold plating in the later process. The outer circuit pattern is an important part of the surface of the circuit board, which determines the connection mode and signal transmission path between the circuit board and the external components. In the multi-layer gold finger board, the outer circuit pattern usually connects each electronic component with the outside world through a fine wiring design to form a complete circuit system. The production accuracy and quality of this step have a direct impact on the performance and reliability of the circuit board. The gold finger is a special part on the circuit board, which is usually used for plugging and unplugging with external devices or connectors. Since the gold finger needs to be plugged and unplugged frequently, it has high requirements for its wear resistance, conductivity and oxidation resistance. In order to meet these requirements, gold plating is usually performed in the gold finger area. In order to gold plate, current needs to pass through, so it is necessary to add gold guide wires at the gold finger position. The function of the gold guide wire is to lead the current out from the front end of the gold finger to complete the nickel and gold plating process. After the gold plating is completed, these leads are usually removed to avoid negative impact on the performance of the circuit board. However, in the gold plating process, these leads play a vital role, ensuring that the gold finger area can get a uniform gold plating layer. The main functions of gold finger gold plating include improving conductivity, wear resistance and oxidation resistance. The gold plating layer can reduce the contact resistance between the gold finger and the connector, and improve the efficiency and stability of signal transmission. At the same time, the gold layer also has high hardness and wear resistance, and can resist mechanical wear and scratches during the plugging and unplugging process. In addition, the gold layer also has good oxidation resistance, which can prevent the gold finger from being affected by oxidation corrosion during long-term use;

[0051] S6. Print the easily-removable and selective solder mask ink to expose the gold finger positions that need to be gold-plated, and cover the other positions that do not need to be gold-plated with the easily-removable and selective solder mask ink. The characteristic of the selective solder mask ink is that it can effectively protect the positions that do not need to be gold-plated from being affected by the gold plating solution. After the gold plating is completed, this part of the ink can be easily removed and washed off, which can effectively protect the non-gold-plated areas on the circuit board and prevent the gold plating solution from corroding or contaminating these areas. By accurately covering the non-gold-plated areas, the ink can ensure that the gold plating solution only contacts the gold fingers and other areas that need to be gold-plated, thereby obtaining a high-quality gold-plated layer. After the gold plating is completed, the ink can be easily washed off, thereby simplifying the subsequent processes and improving production efficiency.

[0052] In this embodiment, it also includes:

[0053] S7. Gold plating. Gold plating is done on the exposed gold finger area. The gold finger serves as a connecting bridge between the circuit board and the external device or connector, and its conductive performance is very important. The gold-plated layer can significantly reduce the contact resistance between the gold finger and the connector, thereby improving the efficiency and stability of signal transmission. This is of great significance to ensure the normal operation of the circuit board and improve the performance of the entire electronic system. The gold finger needs to be frequently plugged and unplugged during use, so there are high requirements for its wear resistance and oxidation resistance. The gold-plated layer has high hardness and wear resistance, and can resist mechanical wear and scratches during the plug-in process. At the same time, the gold layer also has good antioxidant properties, which can prevent the gold finger from being affected by oxidation corrosion during long-term use, thereby extending its service life;

[0054] S8. Remove and wash off the selected solder mask ink. Remove and wash off the selected solder mask ink covering the board. Before gold-plating the gold fingers, in order to protect the non-gold-plated areas on the circuit board, selected solder mask ink is usually used to cover them. After the gold plating is completed, these inks are no longer needed, so they need to be removed from the circuit board. Removing and washing off these inks can ensure the neatness and beauty of the circuit board and avoid interference with subsequent processes. The selected solder mask ink plays a protective role during the gold plating process, but if it is not removed in time, it may become an insulating layer on the circuit board and affect the electrical connection between the gold fingers and other electronic components. By removing these inks, it can be ensured that the electrical connection between the gold fingers and other parts is unobstructed, thereby ensuring the normal operation of the circuit board;

[0055] S9, solder mask printing, printing normal solder mask ink; this ink is not easy to be washed off after printing; and can protect the covered area from external attacks;

[0056] S10, cover with selective dry film. Cover the PCB board with a layer of selective dry film to expose the gold wires temporarily added in S5, and cover all other positions with a layer of selective dry film for protection. The function of the selective dry film is to protect the circuits in other areas from reacting with the chemical solution when removing the gold wires.

[0057] In this embodiment, the gold thickness requirement in S7 is 3--30U.

[0058] In this embodiment, it also includes:

[0059] S11, etching, using etching solution to etch away the gold wires temporarily added in S5, and the etching solution will not have any attack effect on other selected dry film covered areas;

[0060] S12, remove the dry film, remove the selected dry film covered by S10;

[0061] S13, Printing text silk screen, printing text logo.

[0062] In this embodiment, it also includes:

[0063] S14, CNC forming, divides the WORKING PNL board into small units;

[0064] S15, finished product testing, appearance inspection, check the functionality and appearance of the gold finger board;

[0065] S16. Shipment.

[0066] In this embodiment, the etching solution includes acidic cupric chloride, alkaline cupric chloride, ferric chloride, ammonium persulfate, sulfuric acid / chromic acid, and sulfuric acid / hydrogen peroxide etching solution.

[0067] In this embodiment, the selected dry film includes an organic silicon dry film, an organic metal dry film, an epoxy dry film, an etching resistant dry film, an electroplating resistant dry film, a solder resist dry film or a solvent-based dry film.

[0068] In this embodiment, the solder resist ink includes thermal curing solder resist ink, UV curing solder resist ink, and liquid photosensitive solder resist ink.

[0069] The above shows and describes the basic principles, main features and advantages of the present invention. Technical personnel in this industry should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for manufacturing a gold finger board without gold conductive wires, characterized in that: The steps include: S1, inner layer circuit, make the middle layer circuit pattern of the multi-layer gold finger board; S2, pressing, the middle layer and the outer copper foil of the prepared multiple gold finger boards are tightly bonded together by hot pressing and fusing to form a multi-layer board; S3, drilling, drilling holes of various sizes on the multi-layer gold finger board according to the originally set program; S4, electroplating, electroplating the required thickness of copper in the drilled holes and on the surface of the multi-layer gold finger board by electrolysis; S5, outer layer circuit, on the surface of the multi-layer gold finger board, make the circuit pattern as needed. At this time, the gold finger position made needs to add the upper gold lead wire to facilitate the subsequent process of gold plating the gold finger; S6. Print the easily washable selective solder mask ink to expose the gold finger positions that need to be gold plated, and cover the other positions that do not need to be gold plated with the easily washable selective solder mask ink. The characteristic of the selective solder mask ink is that it can effectively protect the positions that do not need to be gold plated from being affected by the gold plating solution, and this part of the ink can be easily washed off after gold plating.

2. The method for manufacturing a gold finger board without gold conductive wires according to claim 1, characterized in that: Also includes: S7, gold plating, gold plating for the exposed gold finger area; S8, remove the selected solder mask ink, and remove the selected solder mask ink covering the board; S9, solder mask printing, printing normal solder mask ink; This ink is not easy to be washed off after printing; And it can protect the coverage area from external attacks; S10, covering with a layer of selective dry film, covering the PCB board with a layer of selective dry film, exposing the gold wires temporarily added in S5, and covering all other positions with a layer of selective dry film for protection. The function of the selective dry film is to protect the circuits in other areas from reacting with the chemical solution when removing the gold wires.

3. The method for manufacturing a gold finger board without gold conductive wires according to claim 2, characterized in that: The gold thickness requirement in S7 is 3--30U.

4. The method for manufacturing a gold finger board without gold conductive wires according to claim 1, characterized in that: Also includes: S11, etching, using etching solution to etch away the gold wires temporarily added in S5, and the etching solution will not have any attack effect on other selected dry film covered areas; S12, removing the dry film, removing the selected dry film covered by S10; S13, Printing text silk screen, printing text logo.

5. The method for manufacturing a gold finger board without gold conductive wires according to claim 1, characterized in that: Also includes: S14, CNC forming, divides the WORKING PNL board into small units; S15, finished product testing, appearance inspection, check the functionality and appearance of the gold finger board; S16. Shipment.

6. The method for manufacturing a gold finger board without gold conductive wires according to claim 4, characterized in that: The etching solution includes acidic cupric chloride, alkaline cupric chloride, ferric chloride, ammonium persulfate, sulfuric acid / chromic acid, and sulfuric acid / hydrogen peroxide etching solution.

7. The method for manufacturing a gold finger board without gold conductive wires according to claim 2, characterized in that: The selected dry film includes an organic silicon dry film, an organic metal dry film, an epoxy dry film, an etching resistant dry film, an electroplating resistant dry film, a solder resist dry film or a solvent-based dry film.

8. The method for manufacturing a gold finger board without gold conductive wires according to claim 2, characterized in that: The solder resist ink includes thermal curing solder resist ink, UV curing solder resist ink, and liquid photosensitive solder resist ink.

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