Electronic equipment

Abstract

The invention relates to the technical field of electronic equipment, and discloses electronic equipment which comprises a shell, a cooling circulation assembly, a flow distribution part and a heating component, a cooling cavity used for containing cooling liquid is formed in the shell, and a first opening and a second opening which communicate with the cooling cavity are formed in the shell; the first opening and the second opening are arranged at intervals along the first direction; the cooling circulation assembly comprises a cooling part, a liquid supply pipe and a liquid return pipe, the cooling part is provided with a liquid supply port and a liquid return port, the liquid supply port is communicated with the first opening through the liquid supply pipe, and the liquid return port is communicated with the second opening through the liquid return pipe; the flow distribution part is arranged in the cooling cavity, a liquid channel is formed in the flow distribution part, a liquid inlet and a liquid outlet nozzle are formed in the liquid channel, the liquid inlet is communicated with the liquid supply pipe through the first opening, and the liquid outlet nozzle faces the first direction; the heating part is arranged in the cooling cavity and located between the liquid outlet nozzle and the second opening in the first direction.

Description

Technical Field

[0001] The present application relates to but is not limited to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] At present, many electronic devices are equipped with liquid cooling systems to reduce the temperature of the heat generating components in the electronic devices. In the related art, the liquid cooling system includes a housing and a coolant contained in the housing, and the heat generating components are immersed in the coolant. The heat generated by the heat generating components is taken away by the circulation of the coolant, thereby achieving heat dissipation of the heat generating components. However, as the power of the heat generating components increases, the above liquid cooling system cannot meet the heat dissipation requirements of the heat generating components. Summary of the invention

[0003] The present application provides an electronic device that can improve the heat dissipation effect of heat-generating components.

[0004] The present application provides an electronic device, which includes a shell, a cooling circulation component, a flow distribution component and a heating component. The shell has a cooling cavity for accommodating cooling liquid, and a first opening and a second opening connected to the cooling cavity are formed on the shell, and the first opening and the second opening are arranged at intervals along a first direction; the cooling circulation component includes a cooling component, a liquid supply pipe and a liquid return pipe, the cooling component has a liquid supply port and a liquid return port, the liquid supply port is connected to the first opening through the liquid supply pipe, and the liquid return port is connected to the second opening through the liquid return pipe; the flow distribution component is arranged in the cooling cavity, the flow distribution component has a liquid channel, the liquid channel has a liquid inlet and a liquid outlet, the liquid inlet is connected to the liquid supply pipe through the first opening, and the liquid outlet is oriented in the first direction; the heating component is arranged in the cooling cavity, and in the first direction, the heating component is located between the liquid outlet and the second opening.

[0005] In a possible implementation of the present application, the liquid outlets are spaced apart on the flow distribution member to form at least two columns of liquid outlet arrays, at least two heating components are spaced apart, the heating components are staggered with adjacent columns of liquid outlet arrays, and the second direction is perpendicular to the first direction.

[0006] In a possible implementation of the present application, in the second direction, the heat-generating component has a first side surface and a second side surface that are arranged opposite to each other, and the first side surface and the second side surface are both parallel to the liquid outlet arrays of adjacent columns.

[0007] In a possible implementation of the present application, a mounting position is provided on the flow distribution member, and in the second direction, the mounting position and the liquid outlet array are staggered, and the heat generating component is arranged on the mounting position.

[0008] In a possible implementation of the present application, at least two liquid outlet arrays include a first liquid outlet array and a second liquid outlet array, and the size of the liquid outlets in the first liquid outlet array is different from the size of the liquid outlets in the second liquid outlet array.

[0009] In a possible implementation of the present application, in a first direction, the flow distributor has a first side and a second side that are oppositely arranged, the first side of the flow distributor is connected to the cavity wall of the cooling cavity, and the liquid outlet is located on the second side of the flow distributor.

[0010] In a possible implementation of the present application, the liquid inlet is located on the second side of the flow distributor, and the liquid inlet is arranged close to the edge of the flow distributor.

[0011] In one possible implementation of the present application, the flow distribution component includes a shell, the liquid channel is arranged in the shell, the shell has a liquid inlet hole and a liquid outlet hole, the liquid inlet hole is arranged opposite to the liquid inlet port, and the liquid outlet hole is arranged opposite to the liquid outlet nozzle.

[0012] In a possible implementation of the present application, in the second direction and the third direction, the size of the shell matches the size of the cooling cavity, and the first direction, the second direction and the third direction are perpendicular to each other.

[0013] In a possible implementation of the present application, the electronic device further includes a blocking member, and the blocking member is used to block the liquid outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0015] Figure 2 It is a schematic diagram of the structure of the heating component and the flow distribution component;

[0016] Figure 3 for Figure 1 A side view of the middle shell;

[0017] Figure 4 is a top view of the flow distribution member (first example);

[0018] Figure 5 is a top view of the flow distribution member (second example);

[0019] Figure 6 1 is a top view of the flow distribution element (third example).

[0020] Description of reference numerals:

[0021] 1-shell; 11-first opening; 12-second opening; 2-cooling cycle assembly; 21-cooling element; 22-liquid supply pipe; 23-liquid return pipe; 3-flow distribution element; 31-liquid inlet; 32-liquid outlet array; 32a-first liquid outlet array; 32b-second liquid outlet array; 321-liquid outlet; 33-first side; 34-second side; 35-installation position; 4-heat generating component; 41-first side; 42-second side. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the specific technical scheme of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0024] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0025] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0026] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0027] In the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0028] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0029] In the embodiments of the present application, for the convenience of describing the direction, refer to Figures 1 to 6 There are directions in the figure, wherein the first direction is the height direction of the housing 1, and is also the arrangement direction of the first opening 11 and the second opening 12; the second direction is the length direction of the housing 1, and is also the arrangement direction of the liquid outlet array 32; the third direction is the width direction of the housing 1. It should be noted that the direction markings are only used to describe the present application, but are not used to limit the scope of the present application.

[0030] At present, many electronic devices are equipped with liquid cooling systems to reduce the temperature of the heat generating components in the electronic devices. In the related art, the liquid cooling system includes a housing and a coolant contained in the housing, and the heat generating components are immersed in the coolant. The heat generated by the heat generating components is taken away by the circulation of the coolant, thereby achieving heat dissipation of the heat generating components. However, as the power of the heat generating components increases, the above liquid cooling system cannot meet the heat dissipation requirements of the heat generating components.

[0031] In order to solve the above problems, an embodiment of the present application provides an electronic device. Here, it should be explained that the electronic device mentioned in the embodiment of the present application can be a computer host, a laptop computer, or a game console, and the embodiment of the present application does not limit this. In one possible implementation method provided in the embodiment of the present application, the electronic device is a computer host.

[0032] Reference Figure 1 , Figure 2 and Figure 3In the embodiment of the present application, the electronic device includes a housing 1, a cooling circulation component 2, a flow distribution component 3 and a heating component 4. The housing 1 has a cooling cavity for accommodating a cooling liquid, and the housing 1 is formed with a first opening 11 and a second opening 12 communicating with the cooling cavity, and the first opening 11 and the second opening 12 are arranged at intervals along a first direction; the cooling circulation component 2 includes a cooling component 21, a liquid supply pipe 22 and a liquid return pipe 23, the cooling component 21 has a liquid supply port and a liquid return port, the liquid supply port is communicated with the first opening 11 through the liquid supply pipe 22, and the liquid return port is communicated with the second opening 12 through the liquid return pipe 23; the flow distribution component 3 is arranged in the cooling cavity, the flow distribution component 3 has a liquid channel, the liquid channel has a liquid inlet 31 and a liquid outlet nozzle 321, the liquid inlet 31 is communicated with the liquid supply pipe 22 through the first opening 11, and the liquid outlet nozzle 321 is oriented in the first direction; the heating component 4 is arranged in the cooling cavity, and in the first direction, the heating component 4 is located between the liquid outlet nozzle 321 and the second opening 12.

[0033] In the embodiment of the present application, the functions of the cooling cavity inside the shell 1 include accommodating the coolant and providing a space for the flow distribution component 3 and the heat-generating component 4. Therefore, there are many possibilities for the shape design of the cooling cavity. For example, the shape of the cooling cavity can be rectangular, circular, or irregular, and the embodiment of the present application does not limit this.

[0034] In the embodiment of the present application, the function of the coolant is to absorb and transfer heat. Therefore, the coolant needs to have good thermal conductivity. There are many possible designs of the coolant. For example, the coolant can be an electronic fluorinated liquid, silicone oil, or synthetic oil. The embodiment of the present application does not limit this.

[0035] In the embodiment of the present application, the function of the cooling element 21 is to reduce the temperature of the coolant flowing back through the return pipe 23. In this way, when the heat is dissipated to the heat generating component 4, the coolant flows back to the cooling element 21 through the return pipe 23 after absorbing the heat generated by the heat generating component 4. The cooling element 21 cools the coolant carrying heat, and allows the cooled coolant to flow back to the cooling chamber, thereby achieving the thermal balance of the system. There are many possible ways for the cooling element 21 to cool the coolant. For example, the cooling element 21 can be a heat exchanger, which cools the coolant by transferring heat to the external environment; or, the coolant can undergo a phase change after absorbing heat, that is, from a liquid to a gas. At this time, the cooling element 21 can be a condenser, and the gaseous coolant enters the condenser. The condenser transfers the heat absorbed by the coolant to the external environment. The cooled coolant condenses into a liquid again and flows back to the cooling chamber to continue circulating.

[0036] In the embodiment of the present application, the function of the flow distribution component 3 is to distribute the coolant flowing in through the liquid supply pipe 22 so that the coolant can be sprayed out through the liquid outlet 321, so that the coolant can quickly flow through the heat-generating component 4, thereby improving the heat exchange efficiency between the coolant and the heat-generating component 4.

[0037] In the embodiment of the present application, the heat-generating component 4 refers to a component that generates heat during operation. Therefore, the structural design of the heat-generating component 4 has many possibilities. For example, the heat-generating component 4 can be a motherboard, a graphics processor, or a graphics card. The embodiment of the present application does not limit this.

[0038] In the technical solution provided in the embodiment of the present application, the electronic device includes a shell 1, a cooling cycle component 2, a flow distribution component 3 and a heating component 4, the shell 1 has a cooling cavity for accommodating coolant, the cooling cavity can accommodate coolant and provide accommodating space for the flow distribution component 3 and the heating component 4, and the shell 1 is also formed with a first opening 11 and a second opening 12 connected to the cooling cavity; the cooling cycle component 2 includes a cooling component 21, a liquid supply pipe 22 and a liquid return pipe 23, the cooling component 21 has a liquid supply port and a liquid return port; the flow distribution component 3 has a liquid channel, the liquid channel has a liquid inlet 31 and a liquid outlet nozzle 321, the liquid inlet 31 is connected to the liquid supply pipe 22 through the first opening 11, and the direction of the liquid outlet nozzle 321 is a first direction; the heating component 4 is arranged in the cooling cavity, and in the first direction, the heating component 4 is located between the liquid outlet nozzle 321 and the second opening 12. In this way, when the heat is dissipated from the heat-generating component 4, the coolant is sprayed out through the liquid outlet 321 of the flow distribution component 3, so that the coolant can quickly flow through the heat-generating component 4 to absorb the heat generated by the heat-generating component 4. The coolant carrying the heat flows back to the cooling element 21 through the return pipe 23. The cooling element 21 cools the returned coolant and transports the cooled coolant to the flow distribution component 3 through the liquid supply pipe 22, thereby realizing the circulation of the coolant.

[0039] Compared with the solution in the related art in which the heat-generating component 4 is immersed in the coolant, the electronic device provided in the embodiment of the present application includes a flow distribution component 3. When the heat-generating component 4 is immersed in the coolant, the flow distribution component 3 can force the coolant to convect. In this way, not only can the heat be conducted through the fluid molecules, but the movement of the coolant can also be used to take away the heat, thereby improving the heat exchange efficiency between the coolant and the heat-generating component 4, thereby improving the heat dissipation effect of the heat-generating component 4.

[0040] In the embodiment of the present application, there are many possibilities for the number of the heating components 4. For example, the number of the heating components 4 can be one, two, or five, and the embodiment of the present application does not limit this.

[0041] Reference Figure 2In a possible embodiment provided in the embodiment of the present application, in the second direction, the liquid outlet nozzles 321 are spaced apart to form at least two columns of liquid outlet nozzle arrays 32 on the flow distribution member 3, and the heat generating component 4 is spaced apart with at least two, and the heat generating component 4 is staggered with the liquid outlet nozzle arrays 32 of the adjacent columns, and the second direction is perpendicular to the first direction. Here, the liquid outlet nozzles 321 are spaced apart to form at least two columns of liquid outlet nozzle arrays 32 on the flow distribution member 3, and the heat generating component 4 is spaced apart with at least two, so that the coolant can quickly flow through the multiple heat generating components 4 through the liquid outlet nozzle arrays 32 at the same time, thereby improving the heat exchange efficiency between the coolant and the multiple heat generating components 4 at the same time. The heat generating component 4 and the liquid outlet nozzle arrays 32 of the adjacent columns are staggered in the second direction, which can prevent the coolant sprayed through the liquid outlet nozzles 321 from impacting the heat generating component 4, thereby affecting the speed at which the coolant flows through the heat generating component 4, and further improving the heat exchange efficiency between the coolant and the heat generating component 4.

[0042] In the embodiment of the present application, in the second direction, the liquid outlet nozzle array 32 may include two liquid outlet nozzles 321 , three liquid outlet nozzles 321 , or five liquid outlet nozzles 321 , which is not limited in the embodiment of the present application.

[0043] In the embodiment of the present application, the structural form of the heating component 4 may be various. For example, the heating component 4 may be a plate-like structure, a block-like structure, or a spherical structure, which is not limited in the embodiment of the present application.

[0044] Reference Figure 2 In the embodiment of the present application, in the second direction, the heat generating component 4 has a first side surface 41 and a second side surface 42 that are arranged opposite to each other, and the first side surface 41 and the second side surface 42 are parallel to the liquid outlet nozzle arrays 32 of the adjacent columns. In this way, a flow channel for the coolant to flow through can be formed between adjacent heat generating components 4, and the flow channel is parallel to the corresponding liquid outlet nozzle arrays 32, so that the flow velocity distribution of the coolant in the flow channel is more uniform, so that each area on the heat generating component 4 can be evenly cooled, thereby improving the cooling effect of the heat generating component 4.

[0045] In the embodiment of the present application, there are many possibilities for fixing the position of the heat-generating component 4 in the cooling cavity. For example, the heat-generating component 4 can be fixed on the cavity wall of the cooling cavity; or, the electronic device also includes a mounting bracket arranged in the cooling cavity, and the heat-generating component 4 can be fixed on the mounting bracket. The embodiment of the present application does not limit this.

[0046] Reference Figure 4In a possible embodiment of the present application, the flow distribution member 3 has a mounting position 35, and in the second direction, the mounting position and the liquid outlet array 32 are staggered, and the heat generating component 4 is arranged on the mounting position. Here, the heat generating component 4 is arranged on the mounting position of the flow distribution member 3. On the one hand, the distance between the heat generating component 4 and the liquid outlet 321 can be shortened in the first direction. Since the flow rate of the coolant at the liquid outlet 321 is faster, the speed of the coolant flowing through the heat generating component 4 can be increased, thereby further improving the heat exchange efficiency between the coolant and the heat generating component 4.

[0047] In the embodiment of the present application, there are many possible ways to fix the heat-generating component 4 on the mounting position. For example, the heat-generating component 4 can be fixed on the mounting position by bonding; or, the heat-generating component 4 can also be fixed on the mounting position by snapping; or, the heat-generating component 4 can also be fixed on the mounting position by fasteners, which is not limited in the embodiment of the present application.

[0048] In the embodiment of the present application, the size of the liquid outlet nozzle 321 directly affects the cross-sectional area through which the coolant passes, thereby affecting the flow rate of the coolant. When designing the liquid outlet nozzle 321, the sizes of the liquid outlet nozzles 321 in at least two rows of liquid outlet nozzle arrays 32 can be the same or different, and the embodiment of the present application does not limit this.

[0049] In a possible embodiment of the present application, at least two liquid outlet nozzle arrays 32 include a first liquid outlet nozzle array 32a and a second liquid outlet nozzle array 32b, and the size of the liquid outlet nozzles 321 in the first liquid outlet nozzle array 32a is different from the size of the liquid outlet nozzles 321 in the second liquid outlet nozzle array 32b. In this way, the first liquid outlet nozzle array 32a and the second liquid outlet nozzle array 32b can spray coolant with different flow rates to meet different cooling requirements of the heat-generating component 4, thereby improving the flexibility of the electronic device.

[0050] In the present application, refer to Figure 5 , the size of the liquid outlet nozzle 321 in the first liquid outlet nozzle array 32a can be larger than the size of the liquid outlet nozzle 321 in the second liquid outlet nozzle array 32b; or, the size of the liquid outlet nozzle 321 in the first liquid outlet nozzle array 32a can also be smaller than the size of the liquid outlet nozzle 321 in the second liquid outlet nozzle array 32b, and the embodiment of the present application is not limited to this.

[0051] In the present application, refer to Figure 6 The sizes of the liquid outlets 321 in the same liquid outlet array 32 may be the same or different, and this embodiment of the present application does not limit this.

[0052] In the embodiment of the present application, there are many possible arrangements of the flow distribution member 3 in the cooling cavity. For example, in the first direction, the flow distribution member 3 can be arranged in the middle of the cooling cavity, and the liquid outlets 321 are located on opposite sides of the flow distribution member 3. At least two heat-generating components 4 can be arranged on opposite sides of the flow distribution member 3, so that the liquid outlets 321 on the corresponding sides provide the heat-generating components 4 with the cooling liquid required for cooling.

[0053] Reference Figure 2 In a possible embodiment of the present application, in the first direction, the flow distribution member 3 has a first side 33 and a second side 34 that are arranged opposite to each other, the first side 33 of the flow distribution member 3 is connected to the cavity wall of the cooling cavity, and the liquid outlet 321 is located on the second side 34 of the flow distribution member 3. Here, the first side 33 of the flow distribution member 3 is connected to the cavity wall of the cooling cavity, and a larger installation space can be formed in the direction of the second side 34 of the flow distribution member 3 to meet the installation of a larger size of the heat-generating component 4. The liquid outlet 321 is located on the second side 34 of the flow distribution member 3, so that the liquid outlet 321 on the second side 34 can provide the heat-generating component 4 on the corresponding side with the cooling liquid required for cooling.

[0054] In the embodiment of the present application, there are many possible settings for the liquid inlet 31 on the flow distribution component 3. For example, in the first direction, the liquid inlet 31 can be located on the first side 33 of the flow distribution component 3, or on the second side 34 of the flow distribution component 3; in the second direction, the liquid inlet 31 can be set in the middle of the flow distribution component 3, or close to the edge of the flow distribution component 3. The embodiment of the present application does not limit this.

[0055] Reference Figure 2 In a possible embodiment of the present application, the liquid inlet 31 is located on the second side 34 of the flow distribution member 3, and the liquid inlet 31 is arranged close to the edge of the flow distribution member 3. In this way, when the liquid supply pipe 22 is connected with the liquid inlet 31 through the first opening 11, the communication distance between the liquid inlet 31 and the liquid supply pipe 22 can be shortened, thereby facilitating the connection setting of the liquid supply pipe 22 and the liquid inlet 31.

[0056] In a possible embodiment of the present application, the flow distribution member 3 includes a shell, the liquid channel is arranged in the shell, the shell has a liquid inlet hole and a liquid outlet hole, the liquid inlet hole is arranged in alignment with the liquid inlet port 31, and the liquid outlet hole is arranged in alignment with the liquid outlet nozzle 321. In this way, the shell can provide protection for the liquid channel, thereby improving the structural reliability of the flow distribution member 3.

[0057] In the embodiment of the present application, the size design of the housing has many possibilities. For example, in the second direction and the third direction, the size of the housing can be smaller than the size of the cooling chamber. In a possible embodiment of the present application, in the second direction and the third direction, the size of the housing matches the size of the cooling chamber, and the first direction, the second direction and the third direction are perpendicular to each other. In this way, the size of the flow distribution component 3 can be maximized in the second direction and the third direction, so that the flow distribution component 3 can correspond to a larger cooling area, thereby improving the heat dissipation performance of the electronics.

[0058] In a possible embodiment of the present application, the electronic device further includes a blocking member, which is used to block the liquid outlet 321. In this way, when the electronic device is not in use, the blocking member can be used to block the liquid outlet 321, thereby preventing cooling liquid leakage, helping to maintain the integrity of the electronic device, and extending the service life of the electronic device.

[0059] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. An electronic device, comprising: A housing, wherein the housing has a cooling cavity for containing a cooling liquid, and the housing is formed with a first opening and a second opening communicating with the cooling cavity, wherein the first opening and the second opening are spaced apart along a first direction; A cooling circulation assembly, the cooling circulation assembly comprising a cooling element, a liquid supply pipe and a liquid return pipe, the cooling element having a liquid supply port and a liquid return port, the liquid supply port being connected to the first opening through the liquid supply pipe, and the liquid return port being connected to the second opening through the liquid return pipe; a flow distribution member, the flow distribution member being arranged in the cooling cavity, the flow distribution member being provided with a liquid channel, the liquid channel being provided with a liquid inlet and a liquid outlet, the liquid inlet being connected to the liquid supply pipe through the first opening, and the liquid outlet being oriented in the first direction; A heat-generating component is disposed in the cooling cavity, and in the first direction, the heat-generating component is located between the liquid outlet and the second opening.

2. The electronic device according to claim 1, in the second direction, the liquid outlets are spaced apart to form at least two columns of liquid outlet arrays on the flow distribution component, the heat generating components are spaced apart to form at least two columns of liquid outlet arrays, the heat generating components are staggered with the liquid outlet arrays in adjacent columns, and the second direction is perpendicular to the first direction. 3 . The electronic device according to claim 2 , wherein in the second direction, the heat generating component has a first side surface and a second side surface that are arranged opposite to each other, and the first side surface and the second side surface are both parallel to the liquid outlet arrays in adjacent columns. 4 . The electronic device according to claim 2 , wherein the flow distribution component has a mounting position, and in the second direction, the mounting position and the liquid outlet array are arranged alternately, and the heat generating component is arranged on the mounting position.

5. The electronic device according to claim 2, wherein at least two columns of the liquid outlet arrays include a first liquid outlet array and a second liquid outlet array, and the size of the liquid outlets in the first liquid outlet array is different from the size of the liquid outlets in the second liquid outlet array.

6. An electronic device according to any one of claims 1-5, wherein in the first direction, the flow distribution component has a first side and a second side that are relatively arranged, the first side of the flow distribution component is connected to the cavity wall of the cooling cavity, and the liquid outlet is located on the second side of the flow distribution component. 7 . The electronic device according to claim 6 , wherein the liquid inlet is located on the second side of the flow distribution component, and the liquid inlet is arranged close to an edge of the flow distribution component.

8. An electronic device according to any one of claims 1-5, wherein the flow distribution component comprises a shell, the liquid channel is arranged in the shell, the shell has a liquid inlet hole and a liquid outlet hole, the liquid inlet hole is arranged opposite to the liquid inlet port, and the liquid outlet hole is arranged opposite to the liquid outlet nozzle. 9 . The electronic device according to claim 8 , wherein in the second direction and the third direction, the size of the housing matches the size of the cooling cavity, and the first direction, the second direction and the third direction are perpendicular to each other.

10. The electronic device according to any one of claims 1 to 5, further comprising a blocking member, wherein the blocking member is used to block the liquid outlet.

Images