Three-dimensional temperature equalizing device and radiator

Abstract

The invention provides a temperature equalizing device and a radiator. The temperature equalizing device comprises an evaporation part, a condensation part, a connecting part and a supporting structure, the evaporation part comprises a first shell with a steam outlet and a heat source contact surface, and a first cavity is formed in the first shell; the condensation part comprises a second shell with a steam inlet, and a second cavity is formed in the second shell; the connecting part comprises a third shell internally provided with a through channel, a steam outlet of the evaporation part is connected with a steam inlet of the condensation part, a certain distance is kept between the condensation part and the heat source contact surface of the evaporation part, the first cavity, the second cavity and the through channel are connected to form a closed space, and working fluid is contained in the closed space; and the supporting structure is arranged in the closed space and is connected with the first shell and / or the second shell. The heat dissipation device comprises a temperature equalizing device and a heat dissipation structure arranged on the surface of the temperature equalizing device. The temperature equalizing device and the radiator provided by the invention have higher heat transfer capability and heat dissipation efficiency, and solve the heat dissipation problem of electronic devices.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a temperature equalizing device and a heat sink for dissipating heat from electronic devices. Background Art

[0002] Electronic devices generate heat when they are running. In order to ensure their normal operation and long-term reliability, this heat must be dissipated promptly and effectively to keep the device temperature within an appropriate range.

[0003] As an important thermal management component, radiators are widely used in a variety of electronic products to dissipate heat for electronic devices such as CPUs, GPUs, and switching chips. Radiators enhance the heat dissipation effect by first diffusing the absorbed heat inside them and then releasing the heat into the air using fins. Therefore, enhancing the heat diffusion capacity and increasing the heat dissipation surface area are two important measures to improve the performance of radiators. In the prior art, temperature equalizing components (such as steam chamber flat heat pipes) have been introduced into radiators to enhance the heat diffusion capacity inside the radiator.

[0004] The vapor chamber heat pipe is a highly efficient heat transfer component, which consists of a flat shell, a liquid wick and a fluid medium. The liquid wick is attached to the inner wall of the shell, and is surrounded by a narrow cavity inside. The cavity is evacuated and filled with a certain amount of liquid. When a local area of ​​the vapor chamber heat pipe is heated, the liquid medium in this area absorbs heat and vaporizes to produce steam. The steam flows to the cold area under the pressure. During the flow of the steam in the cavity, the steam releases heat to the shell and condenses into liquid. The condensed liquid is transported back to the evaporation area under the action of the capillary force in the liquid wick and vaporizes again, and the cycle repeats. The vapor chamber heat pipe achieves rapid heat transfer and uniform temperature effect through this phase change cycle. Its characteristics are flat plate design, and its thickness dimension is much smaller than the length and width dimensions, which is suitable for heat diffusion in the plane direction.

[0005] When a heat sink with a steam chamber flat heat pipe is used to dissipate heat from a high-power electronic device, the steam chamber flat heat pipe must be closely attached to the surface of the electronic device. The distance between the steam chamber flat heat pipe and the printed circuit board is very small, and there are other electronic devices on the printed circuit board. It is difficult to set fins on the side facing the printed circuit board. Therefore, the traditional steam chamber flat heat pipe is usually only provided with fins on one side. In order to provide sufficient heat dissipation surface area, the fin height is usually large, which will cause a large temperature difference from the root to the top of the fin, resulting in a decrease in the heat dissipation efficiency of the fin. As an improved structure, the prior art proposes a three-dimensional vapor chamber, which combines a heat pipe and a vapor chamber. The heat pipe is connected to the internal cavity of the vapor chamber, and the working fluid can flow in the two cavities, so that the heat can be diffused in the plane direction along the flat cavity and in the height direction along the heat pipe cavity, thereby realizing a three-dimensional heat diffusion structure. However, due to the small diameter of the heat pipe, multiple heat pipes need to be provided, which makes the manufacturing process complicated. In addition, the fins are combined with the heat pipe using the fin penetration process, and there is hard contact between the fins and the heat pipe. Some small gaps inevitably exist on the contact surface, resulting in a large thermal resistance between the heat pipe and the fins, leading to poor heat dissipation.

[0006] In the prior art, both the traditional steam chamber flat-plate heat pipe and the three-dimensional steam chamber element have a shell that extends in a plane direction in a space with a small height away from the contact surface with the electronic device. When they are used to dissipate heat for electronic devices, they often encounter situations where other taller devices are arranged around the device being dissipated. In order to avoid interference with these tall devices, it is usually necessary to make incisions on the steam chamber flat-plate heat pipe at the position corresponding to the tall device, or even limit its overall size. These measures will significantly affect the thermal expansion performance of the steam chamber flat-plate heat pipe.

[0007] With the rapid development of semiconductor technology, chip integration continues to increase, and power consumption also increases accordingly. The industry urgently needs a more efficient temperature balancing and heat dissipation technology. Summary of the invention

[0008] The present application provides a three-dimensional temperature equalizing device and a heat sink, which can diffuse heat in three dimensions, have good heat transfer capability and heat dissipation efficiency, solve the problem of interference between the temperature equalizing device and the heat sink and other high devices around the device to be cooled when the temperature equalizing device and the heat sink are used to cool electronic devices, and improve the heat dissipation performance.

[0009] According to one aspect of the present application, a three-dimensional temperature equalization device is provided, including an evaporation part, a condensation part, a connection part and a support structure. The evaporation part includes a first shell, a steam outlet is provided on the first shell, a first cavity is formed inside the first shell, and a surface for contacting a heat source is formed; the condensation part includes a second shell, a steam inlet is provided on the second shell, a second cavity is formed inside the second shell; the connection part includes a third shell, a through channel is provided inside the third shell, the connection part connects the steam outlet of the evaporation part and the steam inlet of the condensation part, so that the condensation part maintains a certain distance relative to the surface of the evaporation part for contacting the heat source, and the first cavity, the second cavity and the through channel are connected to form a closed space, and there is a working fluid in the closed space; the support structure is arranged in the closed space and connected to the first shell and / or the second shell.

[0010] In some embodiments, the connecting portion is an extension of the evaporation portion or the condensation portion and is manufactured integrally with the corresponding component.

[0011] In some embodiments, the temperature equalizing device further includes at least one injection channel, which is connected to the closed space. The air in the closed space is discharged through the injection channel and the working fluid is injected. After the working fluid is injected, the injection channel is closed.

[0012] In some embodiments, the inner surface of the first shell and / or the second shell and / or the third shell is provided with a capillary structure.

[0013] In some embodiments, the support structure includes a first support structure, which is in a sheet shape, extends from the evaporation portion to the condensation portion, and simultaneously connects inner surfaces of the first shell and the second shell.

[0014] In some embodiments, the first support structure is made of a capillary structure material or includes a capillary structure material on its surface.

[0015] In some embodiments, a cutout is provided on an outer edge of the first branch structure.

[0016] In some embodiments, the supporting structure includes a second supporting structure, and two ends of the second supporting structure are connected to the lower wall and the side wall of the evaporation part.

[0017] In some embodiments, the supporting structure includes a third supporting structure, and two ends of the third supporting structure are connected to the lower shell and the cover plate of the condensation part.

[0018] According to another aspect of the present application, a radiator is provided, comprising a heat dissipation structure and a temperature equalizing device in any of the above technical solutions, wherein the heat dissipation structure is arranged on the upper surface and / or lower surface of the condensing part of the temperature equalizing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1A three-dimensional exploded schematic diagram of a heat sink in the prior art being applied to heat dissipation of electronic devices;

[0020] Figure 2 This is a structural schematic diagram of a temperature equalizing device in one embodiment of the present application;

[0021] Figure 3 This is a structural schematic diagram of a temperature equalizing device in another embodiment of the present application;

[0022] Figure 4 A schematic diagram of the structure of the evaporation part of the temperature equalizing device in one embodiment of the present application;

[0023] Figure 5 A schematic diagram of the structure of the condensing part of the temperature equalizing device in one embodiment of the present application;

[0024] Figure 6 This is a schematic diagram of a three-dimensional exploded structure of a temperature equalizing device in an embodiment of the present application;

[0025] Figure 7 This is a structural schematic diagram of a first supporting structure of a temperature equalizing device in an embodiment of the present application;

[0026] Figure 8 This is a structural schematic diagram of a radiator in one embodiment of the present application;

[0027] Fig. 9 This is a structural schematic diagram of a radiator in another embodiment of the present application; DETAILED DESCRIPTION

[0028] In order to more clearly show the purpose, technical scheme and advantages of the present application, the technical scheme of the present application is described in detail below in conjunction with the drawings in the embodiments. These embodiments are only to enable those skilled in the art to better understand and implement the present disclosure, and should not be regarded as limiting the scope of the present disclosure. Obviously, these embodiments only represent a part of the present application, and based on these embodiments, all other embodiments obtained by those skilled in the art without making creative work should also be included in the protection scope of the present application.

[0029] The terms "first", "second", etc. in the specification and claims of this application are only used to distinguish similar objects, rather than to describe a specific order or sequence. In addition, the terms "including", "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a product or device containing a series of units is not necessarily limited to those units clearly listed, but may include other units that are not clearly listed or inherent to these products or devices.

[0030] Figure 1The present invention is a schematic diagram of a three-dimensional decomposition structure of applying a heat sink to heat dissipation of electronic devices in the prior art, including a printed circuit board assembly 8 and a heat sink 9. The printed circuit board assembly 8 includes a first electronic device 81 and a plurality of second electronic devices 82. The first electronic device 81 is a device to be cooled, but its height is lower than the second electronic device 82. The heat sink 9 includes a steam cavity flat plate heat pipe 91 and a fin group 92. When the heat sink 9 is used to cool the first electronic device 81, the lower surface 912 of the steam cavity flat plate heat pipe 91 needs to be in contact with the upper surface 812 of the first electronic device 81. However, since there are multiple high devices 82 on the printed circuit board in the area covered by the heat sink 9, in order to avoid interference between the heat sink 9 and the electronic device 82, it is necessary to make multiple cuts 914 at the lower part of the heat sink, especially at the position corresponding to the second electronic device 82 on the steam cavity flat plate heat pipe 91. The introduction of these cuts increases the complexity of the manufacture of the steam cavity flat plate heat pipe and reduces the cross section of the fluid flow in the steam cavity flat plate heat pipe, thereby reducing its temperature uniformity capability. Although some steam cavity flat plate heat pipes in the prior art have protrusions at the parts that contact the heat source, the upper and lower shells of the steam cavity flat plate heat pipes in the prior art are made of complete metal (copper or aluminum) plates. Due to the limitations of materials and processes, these protrusions are usually limited in height, and it is difficult to solve the problem of interference with high devices around the heat dissipated devices. Therefore, in many use occasions, it is still necessary to make cuts on the steam cavity flat plate heat pipe at the bottom of the radiator to avoid interference problems. In addition, the radiator in the prior art is only provided with fins on the opposite side of the steam cavity flat plate heat pipe contacting the heat source surface. If the overall height of the radiator is to be maintained, adding protrusions at the part that contacts the heat source will inevitably require lowering the height of the fins, reducing the area of ​​the fins of the radiator and affecting the overall performance of the radiator.

[0031] Continue to refer Figure 1 The fin group 92 on the radiator 9 absorbs heat from the steam chamber flat heat pipe and dissipates the heat into the air. The total surface area of ​​the fin group 92 largely determines the overall performance of the radiator. In order to improve the performance of the radiator, the fin height is often set to be relatively large. High fins will have a large temperature difference from the root to the top during application, resulting in low heat dissipation efficiency of the fins.

[0032] In order to solve the above problems, the present application provides a three-dimensional temperature equalizing device and a heat sink, which can not only avoid interference between the temperature equalizing device and high devices around the heat dissipated device and maintain the integrity of the temperature equalizing device, but also effectively improve the heat dissipation efficiency of the fins and improve the heat dissipation performance of the heat sink.

[0033] Figure 2 The schematic diagram of the structure of the temperature equalization device in one embodiment of the present application is shown. The device includes an evaporation part 1, a condensation part 2, a connection part 3, and an internal support structure ( Figure 2 not shown).

[0034] The evaporation part 1 has a first shell 10, on which a steam outlet 15 is provided, and a first cavity is formed inside. The bottom surface 121 of the evaporation part is used to contact the surface of the heat source, which is called the heat source contact surface, and this surface usually has a high flatness. The condensation part 2 includes a second shell 20, on which a steam inlet 25 is provided, and a second cavity is formed inside. The connection part 3 includes a third shell 30, and a through channel is provided inside, connecting the steam outlet 15 of the evaporation part 1 and the steam inlet 25 of the condensation part 2, so that the condensation part 2 maintains a certain distance relative to the heat source contact surface of the evaporation part 1, and the first cavity is connected to the second cavity, so that a continuous closed space is formed inside the evaporation part 1, the condensation part 2 and the connection part 3.

[0035] The support structure is arranged inside the first shell 10, the second shell 20 and the third shell 30. The support structure not only enhances the structural strength of the three-dimensional temperature equalizing device, but also promotes heat exchange between the shell of the temperature equalizing device and the fluid. A capillary structure is provided on the surface of the support structure and / or the inner surface of the shell to promote the flow of the liquid fluid.

[0036] like Figure 2 As shown, the temperature equalizing device of this embodiment further includes a liquid injection channel 5. The air in the closed space is discharged through the liquid injection channel 5 and a certain amount of working fluid is injected. After the injection is completed, the liquid injection channel 5 is closed. Specifically, the volume of the injected liquid working fluid is smaller than the volume of the internal continuous closed space.

[0037] The temperature equalizing device of the present application supports a variety of liquids as working fluids, including but not limited to methanol, ethanol, acetone, refrigerants (such as R134a, R-1233zd, etc.), electronic coolants, water and propylene glycol aqueous solutions, etc.

[0038] when Figure 2 When the temperature equalizing device in the embodiment of the present application is used for heat dissipation of electronic devices (hereinafter referred to as heat sources), the bottom surface 121 of the evaporation part 1, i.e., the heat source contact surface, contacts the surface of the heat source and absorbs the heat generated by it. In this process, the working fluid inside the evaporation part 1 absorbs heat and vaporizes to form steam. Due to the increase in local pressure caused by liquid vaporization, the generated steam flows into the condensation part 2 through the connection part 3 under the pressure, and diffuses in the second cavity. While diffusing, the steam evenly diffuses the heat to the entire second cavity, and further transfers it to the shell 20 of the condensation part, so that the surface of the condensation part shell 20 shows good temperature uniformity. At the same time, the steam condenses into liquid in the process of releasing heat, resulting in a decrease in local pressure. The condensed liquid is driven by the capillary force of the capillary structure of the shell and / or the supporting structure wall, and / or under the action of gravity, and returns to the evaporation part 1 through the connection part 3, and then evaporates again to form a cycle, thereby achieving continuous heat transfer and heat dissipation effects.

[0039] In some possible embodiments of the present application, no capillary structure is provided on the inner surface of the shell of the temperature equalizing device, i.e., the first shell 10, the second shell 20 and the third shell 30, and the surface of the supporting structure. When the temperature equalizing device is used for heat dissipation of the heat source, it only needs to be installed in a forward manner, and the device can still work normally even if the condensation part 2 is located above the evaporation part 1. Specifically, the bottom surface 112 of the evaporation part 1, i.e., the heat source contact surface, contacts the heat source and absorbs heat, so that the working fluid inside the evaporation part 1 absorbs heat and vaporizes to generate steam. The vaporization of the liquid causes the pressure in the evaporation area to increase, and the steam flows into the condensation part 2 through the connection part 3 under the pressure, and diffuses in the second cavity. In this process, the steam transfers heat to the shell 20 of the condensation part, so that its surface has good temperature uniformity. At the same time, the steam condenses into liquid after releasing heat, resulting in a decrease in local pressure. The condensed liquid gathers in the condensation part 2, and under the action of gravity, flows back to the evaporation part 1 through the connection part 3, reabsorbs heat and vaporizes, forming a cycle. This cycle process ensures continuous heat transfer and heat dissipation effect.

[0040] like Figure 2 As shown, the evaporation part 1 of the temperature equalization device can be designed to be equivalent to the area of ​​the heat source surface, so as to avoid interference with other high devices around the device to be cooled. The condensation part 2, as the main heat dissipation surface of the temperature equalization device, has a large size. It can be raised to an appropriate height by setting the length of the connection part 3 so that it is located above the device to be cooled and other high devices around it, thereby avoiding the problem of interference between the condensation part and the device. In addition, when the condensation part 2 is set at a height away from the heat source surface, its lower surface 216 and upper surface 236 can be suitable for setting heat dissipation fins. When the fin height required for the radiator is low, it can be selected to set the fins only on the lower surface 216 or the upper surface 236. When the required fin height is large, fins can be set on both the lower surface 216 and the upper surface 236 to share the total height of the fins. This design effectively avoids the problem of low fin heat dissipation efficiency due to excessive fin height on one side, thereby significantly improving the performance of the radiator.

[0041] The connecting portion 3 can be combined with the evaporating portion 1 and the condensing portion 2 in a variety of ways to form a continuous closed shell and a continuous closed cavity inside it. First, the connecting portion 3 can be processed separately as an independent component, and then its two ends are respectively connected to the evaporating portion 1 and the condensing portion 2, so as to form a continuous closed shell together. Secondly, the connecting portion 3 can be designed as a part of the evaporating portion 1 or the condensing portion 2, and manufactured integrally with the corresponding components. In this case, the connecting portion can be considered as an extension of the evaporating portion or the condensing portion. Figure 3A structural schematic diagram of a temperature equalizing device in another embodiment of the present application is shown, wherein the evaporation portion 1 includes a connection portion, and the evaporation portion 1 and the condensation portion 2 are directly combined to form a continuously closed shell of the temperature equalizing device.

[0042] The fluid channel inside the connecting portion 3 may include one or more, and its cross-sectional shape may be diversified, such as rectangular, circular, elliptical, etc. The cross-sectional shape and size of the fluid channel may remain the same or different at both ends and in any cross section along the length direction. That is, the fluid channel may be designed as a uniform cross-sectional structure or a variable cross-sectional structure. The fluid channel with a variable cross-sectional design can better adapt to the situation where the steam outlet of the evaporation portion 1 and the steam inlet of the condensation portion 2 have unequal cross-sectional areas, thereby optimizing the overall performance of the device.

[0043] See also Figure 2 and Figure 4 , the evaporation part 1 includes a shell 10, and a cavity is defined inside the shell 10. The cavity is used to provide space for storage, phase change and transmission of fluid. Specifically, the shell 10 includes a lower wall 12 and a side wall 14. The side wall 14 extends vertically or obliquely upward from the periphery of the lower wall 12, forming a continuous boundary around the lower wall 12, thereby defining the outer contour of the cavity. In addition, the side wall 14 defines a steam outlet 15, which is used to discharge the steam generated by the evaporation part and allow the liquid to flow back to the evaporation part. The height and shape of the side wall 14 can be adjusted according to specific application requirements to optimize system performance. According to the relationship between the profile size of the side wall 14 and the lower wall 12, the entire shell 10 can be designed to be constricted, straight or expanded to adapt to different application scenarios. The lower wall 12 of the shell 10 includes a heat source contact surface 121, which contacts the heat source in actual application and absorbs heat from it.

[0044] See also Figure 2 and Figure 5 The condensation section includes a shell 20, and a cavity is defined inside the shell 20. The cavity is used to provide space for storage, phase change and transmission of the fluid. Specifically, the shell 20 includes a lower shell 21 and a cover plate 23, and these two parts are combined to form the complete structure of the condensation section. A steam inlet 25 is provided on the lower shell 21, through which the condensation section receives steam from the evaporation section. After entering the second cavity, the steam diffuses therein, transfers heat to the shell 20, and condenses into liquid on the surface of the shell. The condensed liquid can be transported out of the condensation section through the steam inlet 25.

[0045] Optionally, an opening 211 is further provided on the lower shell 21 of the condensation part, and the opening 211 is used to connect the liquid injection channel.

[0046] The condensation section provides the main heat dissipation surface of the temperature equalization device, and its size is usually large to ensure sufficient heat dissipation area. According to the specific application requirements, the shape and size of the condensation section can be customized, for example, designed into a rectangular, square or other complex geometric shape to adapt to different installation spaces and heat dissipation requirements. It is worth noting that both the lower surface 216 and the upper surface 236 of the condensation section can be used as the main heat dissipation surface. This design allows for a more flexible heat sink installation form, and the heat sink can be installed on the upper surface, the lower surface, or both at the same time according to the heat dissipation requirements.

[0047] Optionally, the inner walls of the first shell 10, the second shell 20 and the third shell 30 are capillary structures to enhance fluid transmission and phase change efficiency. The capillary structure can be sintered metal powder, grooves, metal wires (nets), fiber wires (nets) and the like.

[0048] Figure 6 A three-dimensional exploded view of an embodiment of the present application is shown. A support structure is provided inside the temperature equalizing device. The support structure can take a variety of forms, such as 41, 42, and 43 shown in the figure. Specifically, the first support structure 41 connects the evaporation part and the condensation part shell at the same time, the second support structure 42 is used for support and connection inside the evaporation part, and the third support structure 43 is used for support and connection inside the condensation part. On the one hand, the support structure enhances the structural strength of the temperature equalizing device, and on the other hand, it improves the heat exchange between the shell and the fluid. It can be understood that in some embodiments, the temperature equalizing device may include only one or two of the above-mentioned support structures. For example, it may include only the first support structure 41, or only the second support structure 42 and / or the third support structure 43.

[0049] Please refer to Figure 6 and Figure 7 , further explained, the side 412 of the first support structure 41 is combined with the inner surface 122 of the lower wall 12 of the evaporation part, the side 414, 415 is combined with the inner surface 215 of the lower shell 21 of the condensation part, and the side 416 is combined with the inner surface 231 of the condensation part cover plate 23. By combining with the evaporation part and the condensation part, the first support structure enhances the structural strength of the overall temperature equalization device to prevent it from being deformed under the internal fluid pressure or external force. In addition, the combination of the first support structure and the lower wall of the evaporation part helps to conduct the heat absorbed by the lower wall to the support structure, and then transfer it to the surrounding fluid by the support structure, thereby enhancing the heat transfer from the evaporation part to the fluid. Inside the condensation part, because the first support structure is connected to the condensation part shell, the heat conduction from the first support structure to the condensation part shell is effectively promoted, so that the heat of the internal fluid of the condensation part can be first transferred to the first support structure, and then conducted to the condensation part shell by the first support structure. Therefore, the setting of the first support structure greatly enhances the heat transfer effect between the shell of the temperature equalization device and the internal fluid.

[0050] Optionally, the first supporting structure may be connected only to the lower shell 21 or the cover plate 23 of the condensation unit.

[0051] Optionally, a plurality of cutouts 418 are further provided on the outer edge of the first supporting structure, and the cutouts 418 can allow the fluid to flow across the first supporting structure, thereby improving the temperature equalization performance of the temperature equalization device.

[0052] Optionally, the first supporting structure may also be connected to the inner surface of the evaporation portion side wall 14 and / or the inner surface of the connecting portion 3 to enhance their strength and heat exchange with the fluid.

[0053] exist Figure 6 and Figure 7 The first supporting structure shown is a sheet-like structure. Optionally, the first supporting structure may also be in other shapes, such as a columnar shape.

[0054] Optionally, the first support structure is made of a capillary structure material (such as foam metal) or its surface contains a material with a capillary structure. The first support structure with a capillary structure can promote the transport of liquid fluid, especially promote the transport of liquid fluid from the condensation part to the evaporation part. The liquid return capacity of the capillary structure inside the temperature equalizing plate largely determines the ultimate heat transfer capacity of the temperature equalizing plate. Multiple first support structures with capillary structures have a large capillary flow cross-section, provide a strong liquid return capacity, and can significantly improve the heat transfer performance of the temperature equalizing device. Therefore, the temperature equalizing device of the present application has excellent heat transfer capacity, which can transfer high-power heat to the condensation part, and at the same time can diffuse the heat to a larger area.

[0055] Please continue to refer to Figure 6 The two end surfaces of the second support structure 42 are respectively connected to the inner surface 122 of the lower wall 12 of the evaporation part and the inner surface of the side wall 14 to increase the structural strength of the evaporation part and strengthen the heat transfer between the evaporation part shell and the fluid.

[0056] like Figure 6 As shown, the second support structure 42 is columnar. It is understandable that the second support structure may also be in other shapes, such as sheet-like.

[0057] like Figure 6 As shown, the two end surfaces of the third supporting structure 43 are respectively connected to the inner surface 215 of the lower shell 21 of the condensation unit and the inner surface 231 of the cover plate 23, thereby increasing the structural strength of the condensation unit and strengthening the heat transfer between the fluid and the condensation unit shell.

[0058] like Figure 6 As shown, the third supporting structure 43 is columnar. It is understandable that the third supporting structure may also be in other shapes, such as sheet-like.

[0059] Optionally, the second support structure and the third support structure are made of a capillary structure material (such as foam metal) or have a material with a capillary structure on the surface. The second support structure and the third support structure with a capillary structure can promote the transmission of liquid fluid inside the evaporation part and the condensation part, thereby improving the performance of the temperature equalization device.

[0060] In the above-mentioned embodiment of the present application, the temperature equalizing device adopts a setting in which one evaporating part corresponds to one condensing part. It should be further explained that the temperature equalizing device of the present application can also be designed so that the number of evaporating parts and condensing parts is not in a one-to-one correspondence. For example, a temperature equalizing device can be set to include one evaporating part and at least two condensing parts, or the temperature equalizing device can also be set to include at least two evaporating parts and one condensing part. The present application does not limit this.

[0061] Figure 8 A schematic structural diagram of a heat sink in an embodiment of the present application is shown, including a temperature equalizing device 100 and a heat dissipation structure 200. The heat dissipation structure 200 is arranged on the lower surface of the condensation portion of the temperature equalizing device 100, that is, the side of the condensation portion facing the electronic device to be dissipated. Specifically, the heat dissipation structure 200 is a heat dissipation fin, which may be in the shape of a sheet or a column. The heat dissipation structure 200 absorbs heat from the condensation portion of the temperature equalizing device 100 and dissipates the heat into the air. Thanks to the large heat dissipation surface of multiple heat dissipation structures 200, the heat dissipation to the air can be accelerated.

[0062] Fig. 9 A schematic diagram of the structure of a radiator in another embodiment of the present application is shown, including a temperature equalizing device 100, a heat dissipation structure 200 and a heat dissipation structure 300. In this embodiment, the heat dissipation structures 200 and 300 are respectively arranged on the lower surface and the upper surface of the condensation part of the temperature equalizing device 100. Specifically, the heat dissipation structures 200 and 300 are heat dissipation fins, which can be in the shape of sheets or columns. The heat dissipation structures 200 and 300 both absorb heat from the condensation part of the temperature equalizing device 100 and dissipate the heat into the air. Multiple heat dissipation structures 200 and 300 have a large area of ​​heat dissipation surface, which can accelerate the dissipation of heat to the air. Compared with the design of the traditional radiator in which the heat dissipation structure is only arranged on one side, in this embodiment, the design in which the heat dissipation structure is arranged on both sides of the temperature equalizing device can effectively reduce the height of the heat dissipation structure, thereby reducing the temperature difference from the root to the top of the heat dissipation structure, improving the heat dissipation efficiency of the heat dissipation structure, and thus improving the overall performance of the radiator.

[0063] Optionally, a heat dissipation structure may also be provided on the outer surface of the evaporation part and / or the connection part of the temperature equalizing device 100 .

[0064] like Figure 8 and Fig. 9As shown, some heat dissipation structures 200 are provided with cutouts 202. By providing cutouts on the heat dissipation structure, the problem of interference with other higher devices around the heat dissipated device when the heat dissipator is used to dissipate heat from electronic devices can be effectively solved. These local small cutouts have little effect on the total heat dissipation area of ​​the heat dissipation structure, and therefore the effect on the overall heat dissipation performance of the heat dissipator can be almost ignored.

[0065] The temperature equalizing device of the aforementioned embodiment of the present application has excellent heat transfer capability, which can transfer the heat of high power consumption to the condensation part, and can diffuse the heat to a larger area. That is, the condensation part can be designed to have a larger surface area. Therefore, the radiator in the embodiment of the present application can be configured with more heat dissipation structures on the surface of the condensation part, thereby achieving better heat dissipation performance.

[0066] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the scope of the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A three-dimensional temperature equalizing device, characterized in that: include: The evaporation part comprises a first shell, wherein the first shell is provided with a steam outlet, a first cavity is formed inside the first shell, and the first shell has a surface for contacting a heat source; The condensation part comprises a second shell, wherein the second shell is provided with a steam inlet and a second cavity is formed inside the second shell; The connecting part comprises a third shell, wherein a through-channel is provided inside the third shell, wherein the connecting part connects the steam outlet of the evaporating part and the steam inlet of the condensing part, so that the condensing part is kept at a certain distance from the surface of the evaporating part for contacting the heat source, and the first cavity, the second cavity and the through-channel form a closed space, wherein the closed space has a working fluid; The supporting structure is arranged in the closed space and connected to the first shell and / or the second shell.

2. The temperature equalizing device according to claim 1, characterized in that: The connecting portion is an extension of the evaporating portion or the condensing portion.

3. The temperature equalizing device according to claims 1 and 2, characterized in that: It also includes at least one injection channel, which is connected to the closed space. The air in the closed space is discharged through the injection channel and the working fluid is injected. After the working fluid is injected, the injection channel is closed.

4. The temperature equalizing device according to claims 1 and 2, characterized in that: The inner surface of the first shell and / or the second shell and / or the third shell is provided with a capillary structure.

5. The temperature equalizing device according to claims 1 and 2, characterized in that: The supporting structure includes a first supporting structure, which is in a sheet shape, extends from the evaporation portion to the condensation portion, and simultaneously connects the inner surfaces of the first shell and the second shell.

6. The temperature equalizing device according to claim 5, characterized in that: The first supporting structure is made of a capillary structure material or includes a capillary structure material on its surface.

7. The temperature equalizing device according to claim 5, characterized in that: A cutout is provided on the outer edge of the first supporting structure.

8. The temperature equalizing device according to claims 1 and 2, characterized in that: The supporting structure includes a second supporting structure, and two ends of the second supporting structure are connected to the lower wall and the side wall of the evaporation part.

9. The temperature equalizing device according to claims 1 and 2, characterized in that: The supporting structure comprises a third supporting structure, and two ends of the third supporting structure are connected to the lower shell and the cover plate of the condensation part.

10. A radiator, characterized in that: It comprises a heat dissipation structure and a temperature equalizing device as described in any one of claims 1 to 9, wherein the heat dissipation structure is arranged on the surface of the temperature equalizing device.

Images