Packaging and cooling device for semiconductor

Abstract

The invention discloses a semiconductor packaging and cooling device, which belongs to the technical field of semiconductor devices and comprises a protective mounting substrate, the upper surface of the protective mounting substrate is provided with a first detachable cooling mechanism for cooling a power semiconductor device, and the upper surface of the protective mounting substrate is provided with a second detachable cooling mechanism for cooling the power semiconductor device. A second detachable cooling mechanism used for cooling the first detachable cooling mechanism is arranged below the protective mounting base plate, and a detachable liquid storage tank used for cooling the second detachable cooling mechanism is arranged at the end, away from the first detachable cooling mechanism, of the protective mounting base plate. A plurality of adjustable injection hoses are arranged at the top of the detachable liquid storage tank; through mutual cooperation of multiple structures, the power semiconductor device is subjected to all-around cooling, so that the cooling effect of the cooling device on the power semiconductor device is better, and the power semiconductor device is prevented from being damaged due to too high temperature.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor devices, and in particular relates to a semiconductor packaging cooling device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Semiconductor packaging modules use corresponding cooling devices when in use. The conventional cooling device includes a heat conducting plate, a bottom shell, a base plate, a heat conducting part, a flow guide plate, a flow divider plate and a power semiconductor device. The advantage of the cooling device is that the heat conducting plate can be used to cool down multiple power semiconductor devices. However, the traditional cooling device can only simply cool down the bottom of the power semiconductor device, resulting in poor cooling effect of the cooling device on the power semiconductor device, making the power semiconductor device easily damaged due to excessive temperature, and urgently needs to be improved. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor package cooling device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor packaging cooling device, comprising a protective mounting substrate, wherein the upper surface of the protective mounting substrate is provided with a first detachable cooling mechanism for cooling the power semiconductor device, a second detachable cooling mechanism for cooling the first detachable cooling mechanism is provided below the protective mounting substrate, a detachable liquid storage tank for cooling the second detachable cooling mechanism is provided at one end of the protective mounting substrate away from the first detachable cooling mechanism, a plurality of adjustable filling hoses are provided on the top of the detachable liquid storage tank, a plurality of adjustable material pumps are provided on the side bottom of the detachable liquid storage tank, and a plurality of first adjustable feeding hoses for feeding the second detachable cooling mechanism are provided at the output end of the adjustable material pump.

[0005] As a further solution of the present invention: the first detachable cooling mechanism includes a first liquid storage and temperature-regulating metal box, a plurality of liquid storage and temperature-regulating metal tubes are arranged on the top of the first liquid storage and temperature-regulating metal box, the liquid storage and temperature-regulating metal tubes are arranged through the top wall of the first liquid storage and temperature-regulating metal box, the first liquid storage and temperature-regulating metal box is fixedly connected to the liquid storage and temperature-regulating metal tubes, the interior of the first liquid storage and temperature-regulating metal box is filled with temperature-regulating coolant, the interior of the liquid storage and temperature-regulating metal tubes is provided with a metal supporting substrate for supporting and cooling the power semiconductor device, and the metal supporting substrate is fixedly connected to the liquid storage and temperature-regulating metal tubes.

[0006] As a further solution of the present invention: a second liquid storage and temperature regulating metal box is arranged above the first liquid storage and temperature regulating metal box, and a plurality of third liquid storage and temperature regulating metal boxes are arranged on the side of the second liquid storage and temperature regulating metal box facing the first liquid storage and temperature regulating metal box, which are used to cooperate with the liquid storage and temperature regulating metal tube to limit, fix and cool the power semiconductor device. The third liquid storage and temperature regulating metal box is slidably connected to the liquid storage and temperature regulating metal tube, and the third liquid storage and temperature regulating metal box passes through the side wall of the second liquid storage and temperature regulating metal box.

[0007] As a further solution of the present invention: a plurality of first hollow infusion connecting tubes are arranged at both ends of the first liquid storage and temperature regulating metal box, and a plurality of second hollow infusion connecting tubes are arranged at both ends of the second liquid storage and temperature regulating metal box for cooperating with the first hollow infusion connecting tubes to fix the second liquid storage and temperature regulating metal box and for conveying the temperature regulating cooling liquid, and the second hollow infusion connecting tubes are sealed and slidably connected to the first hollow infusion connecting tubes.

[0008] As a further solution of the present invention: the top of the first hollow infusion connecting tube is threadedly connected with a plurality of limiting fastening screws for fixing the second hollow infusion connecting tube; an elastic insulating thermally conductive sheet for insulation, heat conduction and buffering is provided on the side of the second liquid storage and temperature regulating metal box facing the first liquid storage and temperature regulating metal box; the elastic insulating thermally conductive sheet is provided at one end of the third liquid storage and temperature regulating metal box away from the second liquid storage and temperature regulating metal box; the elastic insulating thermally conductive sheet is fixedly connected to the third liquid storage and temperature regulating metal box.

[0009] As a further solution of the present invention: the second detachable cooling mechanism includes a fourth liquid storage and temperature-regulating metal box, and a plurality of second adjustable feeding hoses connected with the first hollow infusion connecting tubes for conveying the temperature-regulating coolant are arranged at both ends of the fourth liquid storage and temperature-regulating metal box, and a hollow cooling metal tube for cooling the temperature-regulating coolant is arranged inside the fourth liquid storage and temperature-regulating metal box, and the hollow cooling metal tube runs through the fourth liquid storage and temperature-regulating metal box, and the hollow cooling metal tube is fixedly connected to the fourth liquid storage and temperature-regulating metal box.

[0010] As a further solution of the present invention: a plurality of hollow infusion dispersion tubes connected to the first adjustable feed hose are arranged at both ends of the hollow cooling metal tube, the hollow infusion dispersion tubes are fixedly connected to the hollow cooling metal tube, a plurality of detachable atomizing nozzles are arranged at intervals on the hollow infusion dispersion tubes, and a plurality of limiting metal guide plates for guiding the temperature-regulating coolant are arranged on the hollow cooling metal tube.

[0011] As a further solution of the present invention: a plurality of adjustable cooling components are arranged below the hollow cooling metal tube to cooperate with the fourth liquid storage and temperature regulating metal box to cool the temperature regulating coolant. The plurality of adjustable cooling components are arranged at intervals at both ends of the lower surface of the fourth liquid storage and temperature regulating metal box, and the fourth liquid storage and temperature regulating metal box is fixedly connected to the adjustable cooling components.

[0012] As a further solution of the present invention: a plurality of limiting heat dissipation grooves for heat dissipation and storage are arranged at intervals at the bottom of the hollow cooling metal tube, and a limiting metal guide plate is fixedly connected to the hollow cooling metal tube.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention has a simple structure and is easy to use. When in use, the power semiconductor device is cooled in all directions through the mutual cooperation of multiple structures, so that the cooling effect of the cooling device on the power semiconductor device is better, and the power semiconductor device is prevented from being damaged due to excessive temperature. Secondly, the present invention performs air cooling, water cooling, evaporation cooling and refrigeration cooling on the temperature-regulating coolant through the mutual cooperation of multiple structures. Through the mutual cooperation of the four cooling and cooling methods, the temperature-regulating coolant is cooled quickly and fully, so that the temperature-regulating coolant can be maintained in an efficient cooling state for a long time, thereby improving the cooling effect of the cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of a semiconductor packaging cooling device; Figure 2 It is a structural schematic diagram of a first detachable cooling mechanism in a semiconductor packaging cooling device; Figure 3 It is a schematic structural diagram of a second liquid storage temperature regulating metal box in a semiconductor packaging cooling device; Figure 4 It is a structural schematic diagram of a second detachable cooling mechanism in a semiconductor packaging cooling device; Figure 5 It is a structural cross-sectional view of a fourth liquid storage temperature regulating metal box in a semiconductor packaging cooling device; In the figure: 1-protective mounting substrate, 2-first detachable cooling mechanism, 3-detachable liquid storage tank, 4-adjustable injection hose, 5-adjustable material pump, 6-first adjustable feed hose, 7-second detachable cooling mechanism, 20-first liquid storage temperature adjustment metal box, 21-liquid storage temperature adjustment metal tube, 22-second liquid storage temperature adjustment metal box, 23-first hollow infusion connecting pipe, 24-temperature adjustment cooling liquid, 25-metal lifting substrate, 26-limiting fastening screws, 27-elastic insulating thermal conductive sheet, 28-second hollow infusion connecting pipe, 29-third liquid storage temperature adjustment metal box, 70-detachable atomizing nozzle, 71-hollow infusion dispersion pipe, 72-fourth liquid storage temperature adjustment metal box, 73-second adjustable feed hose, 74-adjustable cooling component, 75-limiting metal guide plate, 76-hollow cooling metal tube, 77-limiting heat dissipation groove. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" and "set" should be understood in a broad sense. For example, it can be fixedly connected or set, or it can be detachably connected or set, or integrally connected or set.

[0017] For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0018] See also Figure 1 The present embodiment provides a semiconductor packaging cooling device, including a protective mounting substrate 1, a first detachable cooling mechanism 2 for cooling a power semiconductor device is arranged on the upper surface of the protective mounting substrate 1, a second detachable cooling mechanism 7 for cooling the first detachable cooling mechanism 2 is arranged below the protective mounting substrate 1, a detachable liquid storage tank 3 for cooling the second detachable cooling mechanism 7 is arranged at one end of the protective mounting substrate 1 away from the first detachable cooling mechanism 2, a plurality of adjustable injection hoses 4 are arranged on the top of the detachable liquid storage tank 3, a plurality of adjustable material pumps 5 are arranged on the bottom of the side of the detachable liquid storage tank 3, the adjustable material pump 5 is a water pump, and a plurality of first adjustable feeding hoses 6 for feeding the second detachable cooling mechanism 7 are arranged at the output end of the adjustable material pump 5, and the first adjustable feeding hose 6 is a rubber hose or a plastic hose.

[0019] See also Figure 1 , Figure 2 and Figure 3 In one embodiment, in order to make the use of the first detachable cooling mechanism 2 more reliable, in this embodiment, preferably, the first detachable cooling mechanism 2 includes a first liquid storage and temperature adjustment metal box 20, and a plurality of liquid storage and temperature adjustment metal tubes 21 are arranged on the top of the first liquid storage and temperature adjustment metal box 20. The liquid storage and temperature adjustment metal tubes 21 are arranged through the top wall of the first liquid storage and temperature adjustment metal box 20, and the liquid storage and temperature adjustment metal tubes 21 are connected to the internal space of the first liquid storage and temperature adjustment metal box 20. The first liquid storage and temperature adjustment metal box 20 is fixedly connected to the liquid storage and temperature adjustment metal tubes 21. The interior of the first liquid storage and temperature adjustment metal box 20 is filled with a temperature adjustment coolant 24, and the temperature adjustment coolant 24 is mineral oil. The interior of the liquid storage and temperature adjustment metal tube 21 is provided with a metal supporting substrate 25 for supporting and cooling the power semiconductor device, and the metal supporting substrate 25 is fixedly connected to the liquid storage and temperature adjustment metal tube 21; See also Figure 2 and Figure 3 In one embodiment, in order to make the functions of the first detachable cooling mechanism 2 more abundant, in this embodiment, preferably, a second liquid storage and temperature adjustment metal box 22 is arranged above the first liquid storage and temperature adjustment metal box 20, and a plurality of third liquid storage and temperature adjustment metal boxes 29 are arranged on the side of the second liquid storage and temperature adjustment metal box 22 facing the first liquid storage and temperature adjustment metal box 20, which are used to cooperate with the liquid storage and temperature adjustment metal tube 21 to limit and fix the power semiconductor device and cool it. The third liquid storage and temperature adjustment metal box 29 is slidably connected to the liquid storage and temperature adjustment metal tube 21, and the third liquid storage and temperature adjustment metal box 29 is arranged to penetrate the side wall of the second liquid storage and temperature adjustment metal box 22, and the internal space of the third liquid storage and temperature adjustment metal box 29 and the second liquid storage and temperature adjustment metal box 22 is connected; See also Figure 2 and Figure 3In one embodiment, in order to make the functions of the first detachable cooling mechanism 2 more abundant, in this embodiment, preferably, a plurality of first hollow infusion connecting tubes 23 are provided at both ends of the first liquid storage and temperature adjustment metal box 20, and a plurality of second hollow infusion connecting tubes 28 are provided at both ends of the second liquid storage and temperature adjustment metal box 22 for cooperating with the first hollow infusion connecting tubes 23 to fix the second liquid storage and temperature adjustment metal box 22 and for conveying the temperature adjustment cooling liquid 24. The second hollow infusion connecting tube 28 is sealed and slidably connected to the first hollow infusion connecting tube 23, and the first The top of the hollow infusion connecting tube 23 is threadedly connected with a plurality of limiting fastening screws 26 for fixing the second hollow infusion connecting tube 28. The second liquid storage and temperature regulating metal box 22 is provided with an elastic insulating thermally conductive sheet 27 for insulation, heat conduction and buffering on the side facing the first liquid storage and temperature regulating metal box 20. The elastic insulating thermally conductive sheet 27 is a thermally conductive silicone sheet. The elastic insulating thermally conductive sheet 27 is arranged at one end of the third liquid storage and temperature regulating metal box 29 away from the second liquid storage and temperature regulating metal box 22, and the elastic insulating thermally conductive sheet 27 is fixedly connected to the third liquid storage and temperature regulating metal box 29.

[0020] In another embodiment, the first detachable cooling mechanism 2 includes a first liquid storage and temperature regulating metal box 20, and a plurality of liquid storage and temperature regulating metal tubes 21 are arranged on the top of the first liquid storage and temperature regulating metal box 20. The liquid storage and temperature regulating metal tubes 21 are arranged to penetrate the top wall of the first liquid storage and temperature regulating metal box 20, and the liquid storage and temperature regulating metal tubes 21 are connected to the internal space of the first liquid storage and temperature regulating metal box 20. The first liquid storage and temperature regulating metal box 20 is fixedly connected to the liquid storage and temperature regulating metal tubes 21. The interior of the first liquid storage and temperature regulating metal box 20 is filled with a temperature regulating coolant 24, and the temperature regulating coolant 24 is water. The interior of the liquid storage and temperature regulating metal tube 21 is provided with a metal support for supporting and cooling the power semiconductor device. The substrate 25 is fixedly connected with the liquid storage and temperature adjustment metal tube 21. A second liquid storage and temperature adjustment metal box 22 is arranged above the first liquid storage and temperature adjustment metal box 20. The second liquid storage and temperature adjustment metal box 22 is provided with a plurality of third liquid storage and temperature adjustment metal boxes 29 on the side facing the first liquid storage and temperature adjustment metal box 20, which are used to cooperate with the liquid storage and temperature adjustment metal tube 21 to limit and fix and cool the power semiconductor device. The third liquid storage and temperature adjustment metal box 29 is slidably connected with the liquid storage and temperature adjustment metal tube 21. The third liquid storage and temperature adjustment metal box 29 is arranged to penetrate the side wall of the second liquid storage and temperature adjustment metal box 22, and the internal space of the third liquid storage and temperature adjustment metal box 29 and the second liquid storage and temperature adjustment metal box 22 is connected; In another embodiment, in order to make the function of the first detachable cooling mechanism 2 more abundant, in this embodiment, preferably, a plurality of first hollow infusion connecting tubes 23 are provided at both ends of the first liquid storage and temperature adjustment metal box 20, and a plurality of second hollow infusion connecting tubes 28 are provided at both ends of the second liquid storage and temperature adjustment metal box 22 for cooperating with the first hollow infusion connecting tubes 23 to fix the second liquid storage and temperature adjustment metal box 22 and for conveying the temperature adjustment cooling liquid 24, and the second hollow infusion connecting tube 28 is sealed and slidably connected to the first hollow infusion connecting tube 23, and the first The top of the hollow infusion connecting tube 23 is threadedly connected with a plurality of limiting fastening screws 26 for fixing the second hollow infusion connecting tube 28. The second liquid storage and temperature regulating metal box 22 is provided with an elastic insulating thermally conductive sheet 27 for insulation, heat conduction and buffering on the side facing the first liquid storage and temperature regulating metal box 20. The elastic insulating thermally conductive sheet 27 is made of thermally conductive silicone grease. The elastic insulating thermally conductive sheet 27 is arranged at one end of the third liquid storage and temperature regulating metal box 29 away from the second liquid storage and temperature regulating metal box 22, and the elastic insulating thermally conductive sheet 27 is fixedly connected to the third liquid storage and temperature regulating metal box 29.

[0021] See also Figure 1 , Figure 4 and Figure 5 In one embodiment, in order to make the use of the second detachable cooling mechanism 7 more reliable, in this embodiment, preferably, the second detachable cooling mechanism 7 includes a fourth liquid storage and temperature adjustment metal box 72, and a plurality of second adjustable feeding hoses 73 connected to the first hollow infusion connecting tube 23 for conveying the temperature adjustment cooling liquid 24 are arranged at both ends of the fourth liquid storage and temperature adjustment metal box 72. The second adjustable feeding hose 73 is a rubber tube, and an insulation tube is sleeved on the second adjustable feeding hose 73. A hollow cooling metal tube 76 for cooling the temperature adjustment cooling liquid 24 is arranged inside the fourth liquid storage and temperature adjustment metal box 72, and the hollow cooling metal tube 76 runs through the fourth liquid storage and temperature adjustment metal box 72, and the hollow cooling metal tube 76 is fixedly connected to the fourth liquid storage and temperature adjustment metal box 72; See also Figure 4 and Figure 5In one embodiment, in order to make the function of the second detachable cooling mechanism 7 more abundant, in this embodiment, preferably, a plurality of hollow infusion dispersion tubes 71 connected to the first adjustable feeding hose 6 are arranged at both ends of the hollow cooling metal tube 76, and the hollow infusion dispersion tubes 71 are fixedly connected to the hollow cooling metal tube 76. A plurality of detachable atomizing nozzles 70 are arranged at intervals on the hollow infusion dispersion tubes 71. When in use, the inner wall of the hollow cooling metal tube 76 is atomized and sprayed by the detachable atomizing nozzle 70, so that the hollow cooling metal tube is sprayed by the flow of air during the movement of the vehicle. 76 performs air cooling and evaporative cooling. Through the cooperation of the two cooling methods, the hollow cooling metal tube 76 is quickly cooled. The hollow cooling metal tube 76 is provided with a plurality of limit metal guide plates 75 for guiding the temperature-adjusting coolant 24. The limit metal guide plates 75 are fixedly connected to the hollow cooling metal tube 76. When in use, the limit metal guide plates 75 are used to guide the temperature-adjusting coolant 24 to change the flow path of the temperature-adjusting coolant 24, thereby extending the moving distance of the temperature-adjusting coolant 24, improving its heat exchange effect, and thus improving the cooling effect of the temperature-adjusting coolant 24. See also Figure 4 and Figure 5 In one embodiment, in order to make the function of the second detachable cooling mechanism 7 more abundant, in this embodiment, preferably, a plurality of adjustable cooling components 74 are arranged below the hollow cooling metal tube 76 for cooperating with the fourth liquid storage temperature regulating metal box 72 to cool the temperature regulating coolant 24. The adjustable cooling component 74 is a semiconductor refrigeration sheet. When in use, the cold end of the adjustable cooling component 74 and the hollow cooling metal tube 76 are cooled, and the hot end of the adjustable cooling component 74 is air-cooled by the air flow generated during the movement of the vehicle. A plurality of adjustable cooling components 74 are arranged at intervals at both ends of the lower surface of the fourth liquid storage temperature regulating metal box 72. The fourth liquid storage temperature regulating metal box 72 is fixedly connected to the adjustable cooling component 74, and a plurality of limiting heat dissipation grooves 77 for heat dissipation and storage are arranged at intervals at the bottom of the hollow cooling metal tube 76. When in use, the liquid sprayed by the detachable atomizing nozzle 70 is temporarily stored by the limiting heat dissipation grooves 77 to prevent the liquid sprayed by the detachable atomizing nozzle 70 from directly sliding off the hollow cooling metal tube 76 under the action of wind, thereby improving the cooling effect of the hollow cooling metal tube 76, and increasing the surface area of ​​the hollow cooling metal tube 76 by opening the limiting heat dissipation grooves 77, thereby further improving the heat exchange effect of the hollow cooling metal tube 76, thereby making the cooling effect of the hollow cooling metal tube 76 better.

[0022] In another embodiment, in order to make the use of the second detachable cooling mechanism 7 more reliable, in this embodiment, preferably, the second detachable cooling mechanism 7 includes a fourth liquid storage and temperature adjustment metal box 72, and a plurality of second adjustable feeding hoses 73 connected to the first hollow infusion connecting tube 23 are arranged at both ends of the fourth liquid storage and temperature adjustment metal box 72 for conveying the temperature adjustment coolant 24. The second adjustable feeding hose 73 is a silicone tube, and an insulation tube is sleeved on the second adjustable feeding hose 73. A hollow cooling metal tube 76 for cooling the temperature adjustment coolant 24 is arranged inside the fourth liquid storage and temperature adjustment metal box 72, and the hollow cooling metal tube 76 runs through the fourth liquid storage and temperature adjustment metal box 72, and the hollow cooling metal tube 76 is fixedly connected to the fourth liquid storage and temperature adjustment metal box 72; In another embodiment, in order to make the function of the second detachable cooling mechanism 7 more abundant, in this embodiment, preferably, a plurality of hollow infusion dispersion tubes 71 connected to the first adjustable feeding hose 6 are arranged at both ends of the hollow cooling metal tube 76, and the hollow infusion dispersion tube 71 is fixedly connected to the hollow cooling metal tube 76, and a plurality of detachable atomizing nozzles 70 are arranged at intervals on the hollow infusion dispersion tube 71. When in use, the inner wall of the hollow cooling metal tube 76 is atomized and sprayed by the detachable atomizing nozzle 70, so that the hollow cooling metal tube is sprayed by the flow of air during the movement of the vehicle. 76 performs air cooling and evaporative cooling. Through the cooperation of the two cooling methods, the hollow cooling metal tube 76 is quickly cooled. The hollow cooling metal tube 76 is provided with a plurality of limit metal guide plates 75 for guiding the temperature-adjusting coolant 24. The limit metal guide plates 75 are fixedly connected to the hollow cooling metal tube 76. When in use, the limit metal guide plates 75 are used to guide the temperature-adjusting coolant 24 to change the flow path of the temperature-adjusting coolant 24, thereby extending the moving distance of the temperature-adjusting coolant 24, improving its heat exchange effect, and thus improving the cooling effect of the temperature-adjusting coolant 24. See also Figure 4 and Figure 5In one embodiment, in order to make the function of the second detachable cooling mechanism 7 more abundant, in this embodiment, preferably, a plurality of adjustable cooling components 74 are arranged below the hollow cooling metal tube 76 for cooperating with the fourth liquid storage temperature regulating metal box 72 to cool the temperature regulating coolant 24. The adjustable cooling component 74 is a semiconductor refrigeration sheet. When in use, the cold end of the adjustable cooling component 74 and the hollow cooling metal tube 76 are cooled, and the hot end of the adjustable cooling component 74 is cooled by air flow generated during the movement of the vehicle. The cooling components 74 are arranged at intervals at both ends of the lower surface of the fourth liquid storage and temperature regulating metal box 72. The fourth liquid storage and temperature regulating metal box 72 is fixedly connected to the adjustable cooling component 74. A plurality of limiting heat dissipation grooves 77 for heat dissipation and storage are arranged at intervals at the bottom of the hollow cooling metal tube 76. When in use, the liquid sprayed by the detachable atomizing nozzle 70 is temporarily stored in the limiting heat dissipation grooves 77 to prevent the liquid sprayed by the detachable atomizing nozzle 70 from directly sliding off the hollow cooling metal tube 76 under the action of wind, thereby improving the cooling effect of the hollow cooling metal tube 76.

[0023] The working principle and use process of the present invention are as follows: when in use, the cooling device is installed on the new energy vehicle, the second detachable cooling mechanism 7 is installed on the lower surface of the vehicle chassis (the user can adjust the thickness of the fourth liquid storage temperature adjustment metal box 72 according to actual needs, so the installation of the fourth liquid storage temperature adjustment metal box 72 will not affect the safety of the vehicle), and the remaining parts are installed inside the new energy vehicle, and the first liquid storage temperature adjustment metal box 20, the liquid storage temperature adjustment metal tube 21, the second liquid storage temperature adjustment metal box 22, the third liquid storage temperature adjustment metal box 29 and the fourth liquid storage temperature adjustment metal box 72 are all filled with temperature adjustment coolant 24; When in use, water is injected into the interior of the detachable liquid storage tank 3 through the adjustable injection hose 4 (commonly used low-temperature resistant coolant can also be injected in a low-temperature environment, and even commonly used low-temperature resistant glass water for automobiles can be injected), the bottom of the power semiconductor device is cooled by the metal support base plate 25 in cooperation with the temperature-adjusting coolant 24, the top of the power semiconductor device is cooled by the elastic insulating heat conductive sheet 27 and the third liquid storage temperature-adjusting metal box 29 in cooperation with the temperature-adjusting coolant 24, and the liquid storage temperature-adjusting metal tube 21 and the third liquid storage temperature-adjusting metal box 29 cooperate with each other to jointly create a low-temperature working environment for the power semiconductor device, so as to achieve all-round cooling of the power semiconductor device; When the car is moving, air passes through the inside of the hollow cooling metal tube 76. At this time, the hollow cooling metal tube 76 is cooled by the flow of air, so that the hollow cooling metal tube 76 cools the temperature-adjusting coolant 24. At the same time, the power supply of the adjustable material pump 5 is turned on, so that the detachable atomizing nozzle 70 is sprayed after atomization. The sprayed water mist is scattered on the inner wall of the hollow cooling metal tube 76, so that the inner wall of the hollow cooling metal tube 76 is evenly moistened, and the water cooling of the hollow cooling metal tube 76 is realized. The flow of air is used to cool the hollow cooling metal tube 76. The water on the metal tube 76 evaporates to achieve evaporation cooling of the hollow cooling metal tube 76, thereby significantly improving the cooling effect of the hollow cooling metal tube 76, so that multiple cooling of the temperature-regulating coolant 24 can be achieved only by the movement of the vehicle. If the cooling effect does not meet the expectations, the power supply of the adjustable cooling component 74 can be turned on to enable the adjustable cooling component 74 to refrigerate and cool the hollow cooling metal tube 76, thereby achieving multiple cooling of the hollow cooling metal tube 76, so that the hollow cooling metal tube 76 can quickly and fully cool the temperature-regulating coolant 24; Therefore, through the mutual cooperation of multiple structures, the power semiconductor devices can be cooled in all directions, so that the cooling effect of the cooling device on the power semiconductor devices is better, and the power semiconductor devices can be avoided from being damaged due to excessive temperature. Secondly, the present invention performs air cooling, water cooling, evaporation cooling and refrigeration cooling on the temperature-regulating coolant 24 through the mutual cooperation of multiple structures. Through the mutual cooperation of the four cooling methods, the temperature-regulating coolant 24 can be cooled quickly and fully, so that the temperature-regulating coolant 24 can be maintained in an efficient cooling state for a long time, thereby improving the cooling effect of the cooling device. In addition, the device can achieve multiple cooling of the temperature-regulating coolant 24 only through the movement of new energy vehicles, making the use of the cooling device more environmentally friendly. In addition, the present invention has a simple structure, is easy to use, has low cost and a low failure rate.

[0024] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0025] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor package cooling device, comprising a protective mounting substrate, characterized in that: A first detachable cooling mechanism for cooling the power semiconductor device is provided on the upper surface of the protective mounting substrate, a second detachable cooling mechanism for cooling the first detachable cooling mechanism is provided below the protective mounting substrate, a detachable liquid storage tank for cooling the second detachable cooling mechanism is provided at one end of the protective mounting substrate away from the first detachable cooling mechanism, a plurality of adjustable filling hoses are provided on the top of the detachable liquid storage tank, a plurality of adjustable material pumps are provided on the bottom of the side of the detachable liquid storage tank, and a plurality of first adjustable feeding hoses for feeding the second detachable cooling mechanism are provided at the output end of the adjustable material pump.

2. The semiconductor package cooling device according to claim 1, characterized in that: The first detachable cooling mechanism includes a first liquid storage and temperature-regulating metal box, a plurality of liquid storage and temperature-regulating metal tubes are arranged on the top of the first liquid storage and temperature-regulating metal box, the liquid storage and temperature-regulating metal tubes are arranged through the top wall of the first liquid storage and temperature-regulating metal box, the first liquid storage and temperature-regulating metal box is fixedly connected to the liquid storage and temperature-regulating metal tubes, the interior of the first liquid storage and temperature-regulating metal box is filled with temperature-regulating coolant, the interior of the liquid storage and temperature-regulating metal tubes is provided with a metal supporting substrate for supporting and cooling the power semiconductor device, and the metal supporting substrate is fixedly connected to the liquid storage and temperature-regulating metal tubes.

3. The semiconductor package cooling device according to claim 2, characterized in that: A second liquid storage and temperature adjustment metal box is arranged above the first liquid storage and temperature adjustment metal box, and a plurality of third liquid storage and temperature adjustment metal boxes are arranged on the side of the second liquid storage and temperature adjustment metal box facing the first liquid storage and temperature adjustment metal box, which are used to cooperate with the liquid storage and temperature adjustment metal tube to limit, fix and cool the power semiconductor device. The third liquid storage and temperature adjustment metal box is slidably connected to the liquid storage and temperature adjustment metal tube, and the third liquid storage and temperature adjustment metal box passes through the side wall of the second liquid storage and temperature adjustment metal box.

4. The semiconductor package cooling device according to claim 3, characterized in that: A plurality of first hollow infusion connecting tubes are arranged at both ends of the first liquid storage and temperature regulating metal box, and a plurality of second hollow infusion connecting tubes are arranged at both ends of the second liquid storage and temperature regulating metal box for cooperating with the first hollow infusion connecting tubes to fix the second liquid storage and temperature regulating metal box and for conveying the temperature regulating cooling liquid. The second hollow infusion connecting tubes are sealed and slidably connected to the first hollow infusion connecting tubes.

5. The semiconductor package cooling device according to claim 4, characterized in that: The top of the first hollow infusion connecting tube is threadedly connected with a plurality of limiting fastening screws for fixing the second hollow infusion connecting tube; an elastic insulating thermally conductive sheet for insulation, heat conduction and buffering is provided on the side of the second liquid storage and temperature regulating metal box facing the first liquid storage and temperature regulating metal box; the elastic insulating thermally conductive sheet is provided at one end of the third liquid storage and temperature regulating metal box away from the second liquid storage and temperature regulating metal box; the elastic insulating thermally conductive sheet is fixedly connected to the third liquid storage and temperature regulating metal box.

6. The semiconductor package cooling device according to claim 5, characterized in that: The second detachable cooling mechanism includes a fourth liquid storage and temperature-regulating metal box, and a plurality of second adjustable feeding hoses connected with the first hollow infusion connecting tube for conveying the temperature-regulating coolant are arranged at both ends of the fourth liquid storage and temperature-regulating metal box. A hollow cooling metal tube for cooling the temperature-regulating coolant is arranged inside the fourth liquid storage and temperature-regulating metal box, and the hollow cooling metal tube runs through the fourth liquid storage and temperature-regulating metal box, and the hollow cooling metal tube is fixedly connected to the fourth liquid storage and temperature-regulating metal box.

7. The semiconductor package cooling device according to claim 6, characterized in that: A plurality of hollow infusion dispersion tubes connected to the first adjustable feed hose are arranged at both ends of the hollow cooling metal tube, the hollow infusion dispersion tubes are fixedly connected to the hollow cooling metal tube, a plurality of detachable atomizing nozzles are arranged at intervals on the hollow infusion dispersion tubes, and a plurality of limiting metal guide plates for guiding the temperature regulating coolant are arranged on the hollow cooling metal tube.

8. The semiconductor package cooling device according to claim 7, characterized in that: A plurality of adjustable cooling components are arranged below the hollow cooling metal tube to cooperate with the fourth liquid storage and temperature regulating metal box to cool the temperature regulating coolant. The plurality of adjustable cooling components are arranged at intervals at both ends of the lower surface of the fourth liquid storage and temperature regulating metal box, and the fourth liquid storage and temperature regulating metal box is fixedly connected to the adjustable cooling components.

9. The semiconductor package cooling device according to claim 8, characterized in that: The bottom of the hollow cooling metal tube is provided with a plurality of limiting heat dissipation grooves for heat dissipation and storage, and the limiting metal guide plate is fixedly connected to the hollow cooling metal tube.

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