Chip mounter for electronic component processing

Abstract

The invention discloses a chip mounter for electronic component processing, and belongs to the technical field of component chip mounting. A chip mounter for electronic component processing comprises a processing table and further comprises a sliding support arranged at the top of the processing table, a spline sleeve shaft is arranged on one side of the top of the sliding support, a positioning shaft is connected to the outer side of the spline sleeve shaft in a sleeving mode, and a negative pressure nozzle is connected to the bottom of the positioning shaft; the quick release structure is arranged at the bottom of the positioning shaft; the quick release structure comprises a wedge-shaped insert key fixedly connected to the bottom of the positioning shaft, a clamping ball which is mounted on the inner side of the top of the negative pressure nozzle and abuts against one side of the wedge-shaped insert key, a compression spring which is mounted on the inner side of the clamping ball and fixedly connected with the inner side of the negative pressure nozzle, and a rotary lifting assembly arranged on the outer side of the positioning shaft in a sleeving manner; through the design of the wedge-shaped insertion key and the clamping ball, connection between the negative pressure nozzle and the positioning shaft is rapid, the negative pressure nozzle is convenient to replace and maintain through the rapid disassembly structure, the production efficiency is improved, and the full-automatic effect is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of component placement, and in particular to a placement machine for processing electronic components. Background Art

[0002] The chip mounter is mainly used to accurately place various types of SMC / SMD (surface mount components) on the corresponding position of the PCB (printed circuit board) surface that has been printed with solder paste or patch adhesive. The chip mounter can achieve accurate placement of electronic components through advanced positioning systems and sensors, meeting the precision requirements of modern electronic products. It adopts automated production methods and can complete the placement of a large number of electronic components in a short time, thereby improving production efficiency.

[0003] When the SMT machine in the prior art performs SMT work, after completing the first solder joint, a limit frame is covered on the solder joint, and then one side of the electronic component is placed. After completing the second solder joint, another limit frame is also covered on the solder joint, and then the other side of the electronic component is placed into the second solder joint. Since the limit frame is provided with an installation opening, and the installation opening is used to place the electronic component, the SMT work of the electronic component is completed.

[0004] The above patent still has the following deficiencies: the device needs to shut down when replacing the nozzle of the placement machine, and then manually remove the screws or clips that fix the nozzle, and align the new nozzle with the installation position of the placement machine, so the degree of automation is low; in addition, although this device grinds the solder joints and prevents them from loosening, since component placement is a pre-process for welding, how to place components accurately and quickly is the main task of the placement machine. This device only places components at the solder joints of the PCB board and cannot ensure the precision of the placement. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the traditional placement machine nozzle needs to be stopped when replacing, and the screws or buckles fixing the nozzle are removed by manual disassembly, and the new nozzle is aligned with the installation position of the placement machine, and the degree of automation is low; in addition, although this device grinds the solder joints and prevents the solder joints from loosening, since component placement is a pre-process for welding, how to place components accurately and quickly is the main task of the placement machine. This device only places components at the solder joints of the PCB board, and cannot ensure the precision of the placement. A placement machine for electronic component processing is proposed.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A chip mounter for processing electronic components, comprising a processing table and:

[0008] A sliding bracket is arranged on the top of the processing table, and a spline sleeve shaft is also arranged on one side of the top of the sliding bracket, a positioning shaft is sleeved on the outer side of the spline sleeve shaft, and a negative pressure nozzle is connected to the bottom of the positioning shaft;

[0009] A quick-release structure is arranged at the bottom of the positioning shaft, wherein the quick-release structure includes a wedge-shaped key fixedly connected to the bottom of the positioning shaft, a clamping ball installed on the inner side of the top of the negative pressure nozzle and in conflict with one side of the wedge-shaped key, a compression spring installed on the inner side of the clamping ball and fixedly connected to the inner side of the negative pressure nozzle, and a rotating lifting assembly sleeved on the outer side of the positioning shaft;

[0010] The limiting structure is arranged on the inner side of the spline sleeve shaft and is used to maintain the rotation of the positioning shaft;

[0011] A lifting bracket is slidably connected to the inner side of the sliding bracket, and a propulsion assembly is arranged below the lifting bracket;

[0012] A storage structure, arranged on the top of the processing table, for storing and replacing the negative pressure nozzle;

[0013] The X-ray detector is rotatably connected to the inner side of the processing table and is used to detect the position of components and the quality of solder joints.

[0014] As a preferred technical solution of the present application, the rotating lifting assembly includes a moving plate movably connected to the outside of the sliding bracket, a stepper motor installed on the top of the moving plate, a first turntable installed on the outside of the output end of the stepper motor and rotatably connected to the moving plate, a second turntable fixedly connected to the outside of the positioning shaft, a sliding lifting plate installed on the top of the positioning shaft, and an electric telescopic rod installed on the top of the sliding lifting plate.

[0015] As a preferred technical solution of the present application, the limiting structure includes an annular inner ring installed on the inner side of the spline sleeve shaft, and a negative pressure ball track installed on the inner side of the annular inner ring.

[0016] As a preferred technical solution of the present application, the storage structure includes a storage box installed on one side of the top of the processing table, a rubber seat installed on the inner side of the storage box, and an insertion slot installed on the inner side of the rubber seat.

[0017] As a preferred technical solution of the present application, the propulsion assembly includes an X-axis sliding table slidably connected above the processing table, a linear motor installed on the top of the X-axis sliding table, a Y-axis connecting frame installed on the outside of the mover end of the linear motor and fixedly connected to one side of the sliding bracket, a servo motor installed on the inside of the processing table, a transmission shaft installed on the top of the servo motor and rotatably connected to both sides of the processing table, a pulley mounted on the top of the transmission shaft, a gear conveyor belt installed on the outside of the pulley, and a support frame installed on one side of the gear conveyor belt and connected to the X-axis sliding table.

[0018] As a preferred technical solution of the present application, the wedge-shaped key is distributed in a ring shape on the top of the positioning shaft, the wedge-shaped key forms a plug-in structure with the card ball through a circular groove opened on the outer surface, and the wedge-shaped key and the inner side of the top of the negative pressure nozzle are embedded in the structure.

[0019] As a preferred technical solution of the present application, the first turntable and the second turntable are connected by a synchronous belt, and the positioning shaft passes through the second turntable and forms a rotational connection with the bottom surface of the sliding lifting plate.

[0020] As a preferred technical solution of the present application, the annular inner ring is distributed at equal intervals on the inner side of the spline sleeve, and the annular inner ring is fixedly connected to the inside of the spline sleeve and does not contact the surface of the positioning shaft.

[0021] As a preferred technical solution of the present application, the sliding lifting plates are distributed at equal intervals on the outside of the sliding bracket, and the sliding lifting plates form a lifting structure through an electric telescopic rod.

[0022] As a preferred technical solution of the present application, the X-ray detectors are distributed at equal intervals inside the processing table, and the X-ray detectors form a rotating structure between the sleeve plate and the processing table.

[0023] Compared with the prior art, the present invention provides a chip mounter for processing electronic components, which has the following beneficial effects:

[0024] 1. The chip mounter for electronic component processing uses the design of wedge-shaped keys and card balls to make the connection between the negative pressure nozzle and the positioning shaft simple and fast. The quick-release structure is not only convenient for replacing and maintaining the negative pressure nozzle, but also improves production efficiency, reduces downtime, and achieves full automation.

[0025] 2. The use of compression springs in this electronic component processing chip mounter ensures close contact between the card ball and the wedge-shaped key, thereby ensuring the stability of the connection. This design makes it difficult for the negative pressure nozzle to fall off or loosen during operation, thereby improving the overall stability and reliability of the chip mounter;

[0026] 3. The design of the rotating lifting assembly of the placement machine for electronic component processing enables the positioning axis and the negative pressure nozzle to flexibly adjust the position and height. The stepper motor drives the first turntable and the second turntable to rotate, realizing the rotation function; and the electric telescopic rod adjusts the height of the positioning axis by sliding the lifting plate, so that the placement machine can adapt to electronic components of different sizes and shapes. With the help of X-rays to see through the PCB board, the solder joints hidden under the components can be detected, ensuring the quality of the solder joints and the accuracy of the component position, thereby improving its versatility and flexibility.

[0027] 4. In the placement machine for electronic component processing, the rubber seat inside the storage box provides good support and protection for the negative pressure nozzle. When the negative pressure nozzle is placed in the insertion slot, the rubber seat can buffer and disperse the impact force to prevent the negative pressure nozzle from being damaged due to collision. By inserting the negative pressure nozzle into the insertion slot in the storage structure and rotating the positioning shaft to separate the wedge-shaped key and the negative pressure nozzle, the negative pressure nozzle can be replaced without manual work. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of a chip mounter for processing electronic components proposed by the present invention;

[0029] Figure 2 A side view of a chip placement machine processing table for processing electronic components proposed by the present invention;

[0030] Figure 3 A distribution diagram of a chip mounter support frame for electronic component processing proposed by the present invention;

[0031] Figure 4 This is an exploded view of a quick-disassembly structure of a chip mounter for processing electronic components proposed by the present invention;

[0032] Figure 5 This is a structural schematic diagram of the back of a sliding bracket of a chip mounter for processing electronic components proposed by the present invention;

[0033] Figure 6 This is a structural schematic diagram of a rotating lifting assembly of a chip mounter for processing electronic components proposed by the present invention;

[0034] Figure 7 A cross-sectional view of a spline sleeve shaft of a chip mounter for processing electronic components proposed by the present invention;

[0035] Figure 8 This is a schematic diagram of the structure of the inner side of a negative pressure nozzle of a chip mounter for processing electronic components proposed by the present invention;

[0036] Fig. 9 This is a distribution diagram of a compression spring of a chip mounter for processing electronic components proposed by the present invention;

[0037] Fig.10 This is a distribution diagram of an X-ray detector of a chip mounter for processing electronic components proposed by the present invention;

[0038] Fig.11 A chip mounter for processing electronic components proposed by the present invention Figure 4 Enlarged view of part A.

[0039] In the figure:

[0040] 1. Processing table; 2. Sliding bracket; 21. Splined sleeve shaft; 22. Positioning shaft; 23. Negative pressure nozzle; 3. Quick release structure; 301. Wedge-shaped key; 302. Card ball; 303. Compression spring; 304. Moving plate; 305. Stepper motor; 306. First turntable; 307. Second turntable; 308. Sliding lifting plate; 309. Electric telescopic rod; 4. Limiting structure; 41. Annular inner ring; 42. Negative pressure ballway; 5. Lifting bracket; 51. Micro vacuum Pump; 52, negative pressure tube; 53, propulsion assembly; 531, X-axis sliding table; 532, linear motor; 533, Y-axis connecting frame; 534, servo motor; 535, transmission shaft; 536, pulley; 537, gear conveyor belt; 538, support frame; 6, storage structure; 61, storage box; 62, rubber seat; 63, insertion slot; 7, X-ray detector; 100, perspective table; 101, sealing rubber block; 102, push cylinder; 103, fitting pad. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0042] Example:

[0043] Reference Figure 1-4 , a chip mounter for processing electronic components, comprising a processing table 1, and also comprising:

[0044] The sliding bracket 2 is arranged on the top of the processing table 1, and a spline sleeve 21 is also arranged on one side of the top of the sliding bracket 2. The outer side of the spline sleeve 21 is sleeved with a positioning shaft 22, and the bottom of the positioning shaft 22 is connected with a negative pressure nozzle 23; the positioning shaft 22 is stabilized by sleeved with the outer side of the spline sleeve 21, so that the positioning shaft 22 can drive the bottom negative pressure nozzle 23 to rotate smoothly when rotating;

[0045] The quick-release structure 3 is arranged at the bottom of the positioning shaft 22, wherein the quick-release structure 3 includes a wedge-shaped key 301 fixedly connected to the bottom of the positioning shaft 22, a clamping ball 302 installed on the inner side of the top of the negative pressure nozzle 23 and in contact with one side of the wedge-shaped key 301, a compression spring 303 installed on the inner side of the clamping ball 302 and fixedly connected to the inner side of the negative pressure nozzle 23, and a rotating lifting assembly sleeved on the outer side of the positioning shaft 22; by aligning and inserting the outwardly protruding wedge-shaped key 301 into the embedding groove of the negative pressure nozzle 23, the clamping ball 302 in the embedding groove can fully abut against the circular groove of the wedge-shaped key 301, so as to strengthen the tightness of the connection between the positioning shaft 22 and the negative pressure nozzle 23;

[0046] The limiting structure 4 is arranged on the inner side of the spline sleeve shaft 21, and is used to keep the rotation of the positioning shaft 22, so that the positioning shaft 22 is connected to the spline sleeve shaft 21 without affecting the rotation of the positioning shaft 22;

[0047] The lifting bracket 5 is slidably connected to the inner side of the sliding bracket 2. A micro vacuum pump 51 is threadedly connected to one side of the top of the lifting bracket 5. A negative pressure tube 52 is sleeved on the outer side of the input end of the micro vacuum pump 51. The negative pressure tube 52 is installed on one side of the bottom of the positioning shaft 22. A propulsion assembly 53 is arranged below the lifting bracket 5. The micro vacuum pump 51 forms a negative pressure in the inner cavity of the negative pressure tube 52, so that the negative pressure nozzle 23 located at the lower end of the positioning shaft 22 can absorb the electrical components and stick them to the designated position of the PCB board.

[0048] The storage structure 6 is arranged on the top of the processing table 1, and is used for storing and replacing the negative pressure nozzle 23; the negative pressure nozzle 23 is moved to the top of the rubber seat 62 and inserted downward into the insertion slot 63, and then the positioning shaft 22 is rotated to facilitate separation of the wedge-shaped key 301 and the negative pressure nozzle 23;

[0049] The X-ray detector 7 is rotatably connected to the inner side of the processing table 1 and is used to detect the position of components and the quality of solder joints. By using X-rays to penetrate the perspective table 100 above the processing table 1 to see through the PCB board, solder joints hidden under the components can be detected to ensure the quality of the solder joints and the accuracy of the component position.

[0050] like Figure 5 and Figure 6 As shown, in one embodiment: the rotating lifting assembly includes a moving plate 304 movably connected to the outside of the sliding bracket 2, a stepper motor 305 installed on the top of the moving plate 304, a first turntable 306 installed on the outside of the output end of the stepper motor 305 and rotatably connected to the moving plate 304, a second turntable 307 fixedly connected to the outside of the positioning shaft 22, a sliding lifting plate 308 installed on the top of the positioning shaft 22, and an electric telescopic rod 309 installed on the top of the sliding lifting plate 308; the sliding lifting plate 308 is pushed by the electric telescopic rod 309 and the moving plate 304 is indirectly pushed, so that the negative pressure nozzle 23 can complete free rotation while moving up and down.

[0051] like Figure 1 and Fig.10 As shown, in one embodiment: the limiting structure 4 includes an annular inner ring 41 installed on the inner side of the spline sleeve 21, and a negative pressure ball track 42 installed on the inner side of the annular inner ring 41, which is in close contact with the positioning shaft 22 through multiple groups of negative pressure ball tracks 42, so that the positioning shaft 22 is not affected in its rotation while being resisted by the negative pressure ball tracks 42.

[0052] like Figure 1and Fig.10 As shown, in one embodiment: the storage structure 6 includes a storage box 61 installed on one side of the top of the processing table 1, a rubber seat 62 installed on the inner side of the storage box 61, and an insertion slot 63 installed on the inner side of the rubber seat 62. The negative pressure nozzle 23 can be separated from the positioning shaft 22 by inserting the negative pressure nozzle 23 to be replaced into the insertion slot 63 of the rubber seat 62, rotating the positioning shaft 22 and cooperating with the lifting effect of the electric telescopic rod 309.

[0053] like Figure 2 and Figure 3 As shown, in one embodiment: the propulsion assembly 53 includes an X-axis sliding table 531 slidably connected above the processing table 1, a linear motor 532 installed on the top of the X-axis sliding table 531, a Y-axis connecting frame 533 installed on the outer side of the mover end of the linear motor 532 and fixedly connected to one side of the sliding bracket 2, a servo motor 534 installed on the inner side of the processing table 1, a transmission shaft 535 installed on the top of the servo motor 534 and rotatably connected to both sides of the processing table 1, a pulley 536 sleeved on the top of the transmission shaft 535, and a servo motor 534 installed on the inner side of the processing table 1. A gear conveyor belt 537 is installed on the outside of the pulley 536, and a support frame 538 is installed on one side of the gear conveyor belt 537 and connected to the X-axis sliding table 531; the gear conveyor belt 537 is meshed with the inner side of the synchronous belt, and the synchronous belt acts on the gear conveyor belt 537 to drive the upper support frame 538 and the X-axis sliding table 531, and cooperates with the linear motor 532 to indirectly drive the negative pressure nozzle 23 located on the outside, so that the negative pressure nozzle 23 can be stably moved along the X, Y and Z axis directions respectively on the top of the processing table 1.

[0054] like Figure 8 , Fig. 9 and Fig.11 As shown, in one embodiment: the wedge-shaped key 301 is distributed in an annular shape on the top of the positioning shaft 22, and the wedge-shaped key 301 forms a plug-in structure with the clamping ball 302 through the circular groove opened on the outer surface, and the wedge-shaped key 301 and the inner side of the top of the negative pressure nozzle 23 are embedded in the structure. Through the design of the wedge-shaped key 301 and the clamping ball 302, when the negative pressure nozzle 23 inserted into the rubber seat 62 is subjected to the rotation effect from the positioning shaft 22, the wedge surface of the wedge-shaped key 301 can be squeezed outward along the gap of the sealing rubber block 101 at the top of the negative pressure nozzle 23, so as to facilitate the rapid separation of the negative pressure nozzle 23 and the wedge-shaped key 301.

[0055] like Figure 4 and Figure 6 As shown, in one embodiment: the first turntable 306 and the second turntable 307 are connected by a synchronous belt, the positioning shaft 22 passes through the second turntable 307 and forms a rotational connection with the bottom surface of the sliding lifting plate 308; the first turntable 306 and the second turntable 307 are always located in the same plane to facilitate the stable rotation of the positioning shaft 22.

[0056] like Figure 7 As shown, in one embodiment: the annular inner ring 41 is distributed at equal intervals on the inner side of the spline sleeve 21 , and the annular inner ring 41 is fixedly connected to the inside of the spline sleeve 21 and does not contact the surface of the positioning shaft 22 .

[0057] like Figure 3 and Figure 4 As shown, in one embodiment: the sliding lifting plates 308 are evenly spaced on the outside of the sliding bracket 2, and the sliding lifting plates 308 form a lifting structure through the electric telescopic rods 309. Multiple groups of electric telescopic rods 309 act on the sliding lifting plates 308 below them to perform lifting and lowering adjustments, so that multiple groups of negative pressure nozzles 23 can adapt to electronic components of different sizes and shapes.

[0058] like Fig.10 As shown, in one embodiment: the X-ray detectors 7 are distributed at equal intervals inside the processing table 1, and the X-ray detectors 7 form a rotating structure with the processing table 1 through the sleeve plate.

[0059] Specifically, when the present electronic component processing chip mounter is in use: the PCB board can be placed on the perspective table 100 of the processing table 1. During the chip mounting process, the pushing cylinder 102 located on the top of the X-axis sliding table 531 can be pre-started to push the bonding pad 103 below, so that the bonding pad 103 and the PCB board are fully pressed together. Then, the negative pressure tube 52 is connected to the bottom of the positioning shaft 22, and the micro vacuum pump 51 on one side of the lifting bracket 5 is started. The micro vacuum pump 51 forms a negative pressure on the inner cavity of the negative pressure tube 52 and the negative pressure nozzle 23, thereby sucking the electrical components. In order to accurately place the components at the specified position of the PCB board, the servo motor 534 on the inner side of the processing table 1 can be started, and its motor shaft drives the transmission shaft 535 above to rotate, and the transmission shaft 535 drives the pulley 536 to rotate. Under the joint action of the two sets of pulleys 536, the gear conveyor belt 537 can drive the support frame 538 engaged in its inner groove to complete the transmission, and the support frame 538 drives the top X-axis sliding The movable table 531 and the adsorbed electrical components are translated, and the linear motor 532 is started to drive the Y-axis connecting frame 533 and the outer sliding bracket 2 to translate along the Y-axis direction until they move to the designated position above the docking PCB board, and then the electric telescopic rod 309 on the top of the sliding bracket 2 is started, and its output end pushes the sliding lifting plate 308. Since the spline sleeve shaft 21 is tightly connected with the positioning shaft 22, this connection method can allow relative sliding or rotation between the shafts while transmitting torque, so that the positioning shaft 22 can drive the spline sleeve shaft 21 to translate up and down without affecting the rotation effect, and the spline sleeve shaft 21 drives the lifting bracket 5 to move down along the slotted surface of the sliding bracket 2. At the same time, the second turntable 307 located below moves down synchronously with the first turntable 306 and the movable plate 304 through the synchronous belt. Finally, the micro vacuum pump 51 is stopped, so that the bottom negative pressure nozzle 23 delivers the components, thereby placing the adsorbed electrical components on the designated station.

[0060] When the negative pressure nozzle 23 needs to be replaced, the negative pressure nozzle 23 is moved to the top of the storage box 61 until it is aligned with the insertion slot 63, and then the electric telescopic rod 309 is started to insert the negative pressure nozzle 23 below into the inner side of the rubber seat 62. When the negative pressure nozzle 23 is placed in the insertion slot 63, the rubber seat 62 can buffer and disperse the impact force to prevent the negative pressure nozzle 23 from being damaged due to collision. The negative pressure nozzle 23 is inserted into the insertion slot 63, and then the stepper motor 305 is started to drive the second turntable 307 and the positioning shaft 22 to rotate. When the negative pressure nozzle 23 after being inserted into the rubber seat 62 is subjected to the rotation effect from the positioning shaft 22, the wedge-shaped insert The wedge-shaped surface of the key 301 can be squeezed outward along the gap of the sealing rubber block 101 at the top of the negative pressure nozzle 23, so that the wedge-shaped key 301 is separated from the inner groove of the negative pressure nozzle 23. Then, the electric telescopic rod 309 is reversed to move the bottom of the positioning shaft 22 out of the negative pressure nozzle 23, and then the bottom of the positioning shaft 22 is aligned with the new negative pressure nozzle 23, and then pressed down to complete the plug-in installation and fix it, so as to achieve the effect of no manual replacement. During this process and the process of placing components, the X-rays of the X-ray detector 7 are used to penetrate the perspective table 100 above the processing table 1 to see through the PCB board, so that the solder joints hidden under the components can be detected to ensure the quality of the solder joints and the accuracy of the component positions.

[0061] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip mounter for processing electronic components, comprising a processing table (1), characterized in that: Also includes: A sliding bracket (2) is arranged on the top of the processing table (1), and a spline sleeve shaft (21) is also arranged on one side of the top of the sliding bracket (2), a positioning shaft (22) is sleeved on the outer side of the spline sleeve shaft (21), and a negative pressure nozzle (23) is connected to the bottom of the positioning shaft (22); A quick-release structure (3) is arranged at the bottom of the positioning shaft (22), wherein the quick-release structure (3) comprises a wedge-shaped key (301) fixedly connected to the bottom of the positioning shaft (22), a clamping ball (302) installed on the inner side of the top of the negative pressure nozzle (23) and in contact with one side of the wedge-shaped key (301), a compression spring (303) installed on the inner side of the clamping ball (302) and fixedly connected to the inner side of the negative pressure nozzle (23), and a rotating lifting component sleeved on the outer side of the positioning shaft (22); A limiting structure (4) is arranged on the inner side of the spline sleeve shaft (21) and is used to maintain the rotation of the positioning shaft (22); The X-ray detector (7) is rotatably connected to the inner side of the processing table (1) and is used to detect the position of components and the quality of solder joints.

2. The chip mounter for processing electronic components according to claim 1, characterized in that: The rotary lifting assembly comprises a moving plate (304) movably connected to the outside of the sliding bracket (2), a stepping motor (305) mounted on the top of the moving plate (304), a first rotating disk (306) mounted on the outside of the output end of the stepping motor (305) and rotatably connected to the moving plate (304), a second rotating disk (307) fixedly connected to the outside of the positioning shaft (22), a sliding lifting plate (308) mounted on the top of the positioning shaft (22), and an electric telescopic rod (309) mounted on the top of the sliding lifting plate (308).

3. The chip mounter for processing electronic components according to claim 2, characterized in that: The limiting structure (4) comprises an annular inner ring (41) installed inside the spline sleeve (21) and a negative pressure ball track (42) installed inside the annular inner ring (41).

4. The chip mounter for processing electronic components according to claim 3, characterized in that: It also includes a storage structure (6) arranged on the top of the processing table (1) and used for storing and replacing the negative pressure nozzle (23), wherein the storage structure (6) includes a storage box (61) installed on one side of the top of the processing table (1), a rubber seat (62) installed on the inner side of the storage box (61), and an insertion slot (63) installed on the inner side of the rubber seat (62).

5. The chip mounter for processing electronic components according to claim 4, characterized in that: The machine tool also comprises a lifting bracket (5) which is slidably connected to the inner side of the sliding bracket (2); a propulsion assembly (53) is arranged below the lifting bracket (5); the propulsion assembly (53) comprises an X-axis sliding table (531) which is slidably connected to the top of the processing table (1); a linear motor (532) mounted on the top of the X-axis sliding table (531); a Y-axis connecting frame (533) mounted on the outer side of the moving end of the linear motor (532) and fixedly connected to one side of the sliding bracket (2); a servo motor (534) mounted on the inner side of the processing table (1); a transmission shaft (535) mounted on the top of the servo motor (534) and rotatably connected to both sides of the processing table (1); a pulley (536) sleeved on the top of the transmission shaft (535); a gear conveyor belt (537) mounted on the outer side of the pulley (536); and a support frame (538) mounted on one side of the gear conveyor belt (537) and connected to the X-axis sliding table (531).

6. The chip mounter for processing electronic components according to claim 2, characterized in that: The wedge-shaped insert key (301) is distributed in a ring shape at the top of the positioning shaft (22); the wedge-shaped insert key (301) forms a plug-in structure with the clamping ball (302) through a circular groove opened on the outer surface; and the wedge-shaped insert key (301) and the inner side of the top of the negative pressure nozzle (23) form an embedded structure.

7. The chip mounter for processing electronic components according to claim 2, characterized in that: The first rotating disk (306) and the second rotating disk (307) are connected via a synchronous belt, and the positioning shaft (22) passes through the second rotating disk (307) and is rotationally connected to the bottom surface of the sliding lifting plate (308).

8. The chip mounter for processing electronic components according to claim 3, characterized in that: The annular inner ring (41) is distributed at equal intervals on the inner side of the spline sleeve (21); the annular inner ring (41) is fixedly connected to the inside of the spline sleeve (21) and does not contact the surface of the positioning shaft (22).

9. The chip mounter for processing electronic components according to claim 2, characterized in that: The sliding lifting plates (308) are distributed at equal intervals on the outside of the sliding bracket (2), and the sliding lifting plates (308) form a lifting structure through an electric telescopic rod (309).

10. The chip mounter for processing electronic components according to claim 1, characterized in that: The X-ray detectors (7) are distributed at equal intervals inside the processing table (1), and the X-ray detectors (7) form a rotating structure with the processing table (1) through a sleeve plate.

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