Display panel

By setting a reverse reduction layer on the packaging layer of the Micro LED display panel to block the top surface of the barrier wall, the problem of lowering contrast of the display panel is solved and the contrast is improved.

CN119816030APending Publication Date: 2025-04-11WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411911986.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-04-11

AI Technical Summary

Technical Problem

The Micro LED display panel has a high reflectivity on the light-out side, resulting in a decrease in contrast of the display screen.

Method used

By providing a reversal layer on one surface of the display panel's packaging layer away from the substrate, the reversal layer includes a plurality of reversal parts, and in the plan view, the reversal part overlaps the retaining wall, thereby covering the top surface of the retaining wall and reducing its reflection to the external ambient light.

Benefits of technology

It effectively improves the contrast of the display screen of the display panel, reduces the reflection of external ambient light, and thus improves the display effect.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119816030A_ABST
    Figure CN119816030A_ABST
Patent Text Reader

Abstract

The invention discloses a display panel which comprises a substrate, a light-emitting device layer, a plurality of retaining walls, a packaging layer and an anti-reflection layer. The light-emitting device layer is arranged on the substrate, the light-emitting device layer comprises a plurality of light-emitting devices, and every two adjacent light-emitting devices are arranged at intervals; the retaining wall is located between two adjacent light-emitting devices; the packaging layer is arranged among the plurality of retaining walls, and the packaging layer covers the plurality of light emitting devices; the anti-reflection layer is arranged on one surface, far away from the substrate, of the packaging layer, and the anti-reflection layer comprises a plurality of anti-reflection parts; in a top view of the display panel, the anti-reflection part is overlapped with the retaining wall. The display panel has the advantages that the reflection of the top surface of the retaining wall to external ambient light can be reduced, so that the contrast of a display picture of the display panel is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel. Background Art

[0002] Micro LED display panels have the technical advantages of high brightness, high transmittance and high contrast, and have attracted more and more attention in recent years. Compared with OLED display panels, Micro LED display panels have more advantages in brightness and transmittance. Compared with Mini LED display panels, Micro LED display panels have the advantages of high resolution and close-range application scenarios. Due to the high reflectivity of the light-emitting side of the Micro LED display panel, the Micro LED display panel will reflect a large amount of external ambient light, resulting in a decrease in the contrast of the display screen of the Micro LED display panel. Summary of the invention

[0003] An embodiment of the present application provides a display panel to improve the contrast of a display image of the display panel.

[0004] In a first aspect, an embodiment of the present application provides a display panel, including:

[0005] substrate;

[0006] A light emitting device layer, wherein the light emitting device layer is disposed on the substrate, the light emitting device layer comprises a plurality of light emitting devices, and two adjacent light emitting devices are disposed at intervals;

[0007] A plurality of retaining walls, wherein the retaining walls are located between two adjacent light emitting devices;

[0008] An encapsulation layer, the encapsulation layer is disposed between the plurality of retaining walls, and the encapsulation layer covers the plurality of light-emitting devices;

[0009] An anti-reflection layer is provided on a surface of the packaging layer away from the substrate, and the anti-reflection layer comprises a plurality of anti-reflection parts; in a top view of the display panel, the anti-reflection parts overlap with the retaining walls.

[0010] Furthermore, the display panel includes a first reflective layer, which is arranged on the substrate, and the first reflective layer includes a plurality of first reflective portions, and the first reflective portions are located between two adjacent light-emitting devices; the plurality of retaining walls are arranged on the first reflective layer; the encapsulation layer is arranged on a surface of the first reflective layer away from the substrate, and the encapsulation layer covers the retaining walls.

[0011] Furthermore, in the thickness direction of the display panel, the top surface of the first reflective layer is not higher than the top surface of the light emitting device layer.

[0012] Furthermore, the encapsulation layer includes a first encapsulation layer and a second encapsulation layer, the first encapsulation layer is arranged on the substrate, and the first encapsulation layer is arranged between the plurality of the light-emitting devices, the second encapsulation layer is arranged on a surface of the first encapsulation layer away from the substrate, and the second encapsulation layer is located between the plurality of retaining walls.

[0013] Furthermore, the reflectivity of the first retaining wall is not less than 60%.

[0014] Furthermore, an area of ​​a side of the retaining wall close to the substrate is larger than an area of ​​a side of the retaining wall far from the substrate.

[0015] Furthermore, in the top view of the display panel, the film layer where the first retaining wall is located is in a mesh shape.

[0016] Furthermore, the display panel also includes a color resist layer, which is arranged on a surface of the encapsulation layer away from the substrate, and the color resist layer includes a plurality of color resists, and the plurality of color resists are arranged at intervals. In the top view of the display panel, the red color resist covers the light emitting device with red light color, the blue color resist covers the light emitting device with blue light color, and the green color resist covers the light emitting device with green light color.

[0017] Furthermore, the display panel also includes a second reflective layer, and the second reflective layer is arranged on the side wall and surrounding side walls of the light-emitting device, wherein the light-emitting device is a Micro LED light-emitting chip.

[0018] Beneficial effects of this application:

[0019] The present application provides a display panel, wherein the anti-reflection layer is arranged on a surface of the packaging layer away from the substrate, and the anti-reflection layer includes a plurality of anti-reflection parts; in a top view of the display panel, the anti-reflection parts overlap with the baffle walls, so that the anti-reflection layer can shield the top surface of the baffle walls, thereby reducing the reflection of the top surface of the baffle walls to the external ambient light, thereby improving the contrast of the display image of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a top view of a display panel according to a first embodiment of the present application;

[0021] Figure 2 yes Figure 1 A cross-sectional view of the display panel shown at A-Aˊ;

[0022] Figure 3 yes Figure 1 A schematic diagram of a light emitting device of a display panel shown;

[0023] Figure 4 is a top view of a display panel according to a second embodiment of the present application;

[0024] Figure 5 yes Figure 4 A cross-sectional view of the display panel shown at point B-Bˊ;

[0025] Figure 6 yes Figure 4 A schematic diagram of a light emitting device of a display panel shown;

[0026] Figure 7 is a top view of a display panel according to a third embodiment of the present application;

[0027] Figure 8 yes Figure 7 A cross-sectional view of the display panel shown at C-Cˊ;

[0028] Fig. 9 is a schematic diagram of a conventional display panel.

[0029] 10-display panel; 100-substrate; 200-light-emitting device layer, 210-light-emitting device; 300-blocking wall; 400-packaging layer, 410-first packaging layer, 420-second packaging layer; 500-anti-reflection layer, 510-anti-reflection part; 600-first reflection layer, 610-first reflection part; 700-color resistance layer, 710-color resistance; 800-second reflection layer; 900-blackening film layer, 910-blackening part.

[0030] 01-substrate; 02-light-emitting device; 03-black oil. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. The technical solutions described below are only used to explain and illustrate the ideas of the present application and should not be regarded as limiting the scope of protection of the present application.

[0032] In addition, the terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different technical features. The term "plurality" and similar words mean two or more, unless otherwise clearly defined.

[0033] The first embodiment of the present application provides a first display panel 10, referring to Figure 1-Figure 3 The display panel 10 includes a substrate 100 , a light emitting device layer 200 , an encapsulation layer 400 , a plurality of retaining walls 300 , and an anti-reflection layer 500 .

[0034] Specifically, the light-emitting device layer 200 is arranged on the substrate 100, and the light-emitting device layer 200 includes a plurality of light-emitting devices 210, and two adjacent light-emitting devices 210 are arranged at intervals; the retaining wall 300 is located between two adjacent light-emitting devices 210; the encapsulation layer 400 is arranged between the plurality of retaining walls 300, and the encapsulation layer 400 covers the plurality of light-emitting devices 210; the anti-reflection layer 500 is arranged on a surface of the encapsulation layer 400 away from the substrate 100, and the anti-reflection layer 500 includes a plurality of anti-reflection parts 510; in the top view of the display panel 10, the anti-reflection part 510 overlaps with the retaining wall 300; wherein, the encapsulation layer 400 includes a first encapsulation layer 410 and a second encapsulation layer 420, the first encapsulation layer 410 is arranged on the substrate 100, and the first encapsulation layer 410 is arranged between the plurality of light-emitting devices 210, the second encapsulation layer 420 is arranged on a surface of the first encapsulation layer 410 away from the substrate 100, and the second encapsulation layer 420 is located between the plurality of retaining walls 300.

[0035] By arranging the anti-reflection layer 500 on a surface of the encapsulation layer 400 away from the substrate 100, the anti-reflection layer 500 includes a plurality of anti-reflection parts 510; in the top view of the display panel 10, the anti-reflection parts 510 overlap with the baffle wall 300, so that the anti-reflection layer 500 can block the top surface of the baffle wall 300, thereby reducing the reflection of the top surface of the baffle wall 300 to the external ambient light, thereby improving the contrast of the display image of the display panel 10.

[0036] In this embodiment, the refractive index of the second encapsulation layer 420 is less than the refractive index of the first encapsulation layer 410. By setting the refractive index of the second encapsulation layer 420 to be less than the refractive index of the first encapsulation layer 410, it is possible to prevent the external ambient light from being totally reflected when passing through the contact surface between the second encapsulation layer 420 and the first encapsulation layer 410, thereby preventing the contrast of the display panel 10 from being reduced.

[0037] In the present embodiment, the top surface of the first encapsulation layer 410 is flush with the top surface of the light emitting device layer 200, wherein the second encapsulation layer 420 covers the light emitting device 210. Since the refractive index of the second encapsulation layer 420 is less than that of the first encapsulation layer 410, that is, the refractive index of the first encapsulation layer 410 is greater than that of the second encapsulation layer 420, the light generated by the light emitting device 210 will be totally reflected when passing through the contact surface between the first encapsulation layer 410 and the second encapsulation layer 420, resulting in a reduction in the light efficiency of the display panel 10. Therefore, the top surface of the first encapsulation layer 410 is set to be flush with the top surface of the light emitting device layer 200, so that the light emitted from the top surface of the light emitting device 210 can directly enter the second encapsulation layer 420 without passing through the first encapsulation layer 410, thereby avoiding the total reflection of the light emitted from the top surface of the light emitting device 210, thereby improving the light efficiency of the display panel 10.

[0038] In this embodiment, the top surface of the first encapsulation layer 410 is higher than the top surface of the light emitting device layer 200. By setting the top surface of the first encapsulation layer 410 higher than the top surface of the light emitting device layer 200, when preparing the display panel 10, the first encapsulation layer 410 can protect the light emitting surface of the light emitting device 210, thereby preventing the light emitting surface of the light emitting device 210 from being damaged.

[0039] In this embodiment, reference Figure 2 The display panel 10 further includes a color resist layer 700, which is disposed on a surface of the encapsulation layer 400 away from the substrate 100. The color resist layer 700 includes a plurality of color resists 710, which are arranged at intervals. In the top view of the display panel 10, the red color resist 710 covers the light emitting device 210 with a red light color, the blue color resist 710 covers the light emitting device 210 with a blue light color, and the green color resist 710 covers the light emitting device 210 with a green light color. By arranging the colored color resist layer 700 on a surface of the encapsulation layer 400 away from the substrate 100, the colored color resist layer 700 includes a plurality of color resists 710, and the plurality of color resists 710 are arranged at intervals. In the top view of the display panel 10, the red color resist 710 covers the light emitting device 210 with red light color, the blue color resist 710 covers the light emitting device 210 with blue light color, and the green color resist 710 covers the light emitting device 210 with green light color. Since the red color resist 710 only allows the red light in the ambient light to pass through, the green color resist 710 only allows the blue light in the ambient light to pass through, and the blue color resist 710 only allows the blue light in the ambient light to pass through, the amount of external ambient light entering the display panel 10 can be reduced, thereby reducing the light reflected by the substrate 100 to the outside world, thereby improving the contrast of the display screen of the display panel 10.

[0040] In this embodiment, reference Figure 3 The second reflective layer 800 is provided on the bottom wall and the surrounding side walls of the Micro LED light-emitting chip, wherein the light-emitting device 210 is a Micro LED light-emitting chip. Since the size of the Micro LED light-emitting chip is smaller than that of the Mini LED light-emitting chip, the second reflective layer 800 can be directly made on the side wall of the Micro LED light-emitting chip, thereby improving the light extraction efficiency of the display panel 10.

[0041] In this embodiment, the reflectivity of the baffle 300 is not less than 60%. By setting the reflectivity of the baffle 300 to be not less than 60%, the baffle 300 has a higher reflectivity, so that the baffle 300 can reflect the light of the light emitting device 210, thereby improving the light extraction efficiency of the display panel 10.

[0042] In this embodiment, the reflectivity of the retaining wall 300 is 60%, 62%, 64%, 66%, 68%, 70%, 72%, 74%, 76%, 78%, 80%, 82% or 84%.

[0043] In this embodiment, the area of ​​the side of the blocking wall 300 close to the substrate 100 is larger than the area of ​​the side of the blocking wall 300 far from the substrate 100 .

[0044] In this embodiment, reference Figure 2 The area of ​​the retaining wall 300 from the side close to the substrate 100 to the side far from the substrate 100 gradually decreases.

[0045] In this embodiment, the retaining wall 300 is trapezoidal.

[0046] In this embodiment, in the top view of the display panel 10 , the film layer where the retaining wall 300 is located is in a mesh shape.

[0047] The second embodiment of the present application provides a second display panel 10, referring to Figure 4-Figure 6 The display panel 10 includes a substrate 100, a light emitting device layer 200, an encapsulation layer 400, a plurality of retaining walls 300, an encapsulation layer 400, an anti-reflection layer 500 and a reflective layer.

[0048] Specifically, the light-emitting device layer 200 is arranged on the substrate 100, and the light-emitting device layer 200 includes a plurality of light-emitting devices 210, and two adjacent light-emitting devices 210 are arranged at intervals; the retaining wall 300 is arranged between the plurality of retaining walls 300, and the encapsulation layer 400 covers the plurality of light-emitting devices 210; the anti-reflection layer 500 is arranged on a surface of the encapsulation layer 400 away from the substrate 100, and the anti-reflection layer 500 includes a plurality of anti-reflection parts 510; in the top view of the display panel 10, the anti-reflection part 510 overlaps with the retaining wall 300; wherein, the first reflective layer 600 is arranged on the substrate 100, and the first reflective layer 600 includes a plurality of first reflective parts 610, and the first reflective parts 610 are located between two adjacent light-emitting devices 210; the plurality of retaining walls 300 are arranged on the first reflective layer 600; the encapsulation layer 400 is arranged on a surface of the first reflective layer 600 away from the substrate 100, and the encapsulation layer 400 covers the retaining wall 300.

[0049] By arranging the anti-reflection layer 500 on a surface of the encapsulation layer 400 away from the substrate 100, the anti-reflection layer 500 includes a plurality of anti-reflection parts 510; in the top view of the display panel 10, the anti-reflection part 510 overlaps with the baffle wall 300, so that the anti-reflection layer 500 can block the top surface of the baffle wall 300, thereby reducing the reflection of the top surface of the baffle wall 300 to the external ambient light, thereby improving the contrast of the display screen of the display panel 10; at the same time, since the first reflective layer 600 is arranged on the substrate 100, the first reflective layer 600 includes a plurality of first reflective parts 610, and the first reflective part 610 is located between two adjacent light-emitting devices 210. On the one hand, the first reflective layer 600 can play a role of packaging, encapsulating the light-emitting device 210, and improving the stability of the light-emitting device 210 on the substrate 100. On the other hand, the first reflective layer 600 can reflect the light on the side wall of the light-emitting device 210, thereby improving the light extraction efficiency of the display panel 10.

[0050] In this embodiment, the light emitting device 210 is a Mini LED light emitting chip. Figure 6 Since the size of the Mini LED light-emitting chip is larger than that of the Micro LED light-emitting chip, when manufacturing the display panel 10 corresponding to the Micro LED light-emitting chip, the second reflective layer 800 can only be manufactured on the bottom wall of the Mini LED light-emitting chip, and it is difficult to manufacture the second reflective layer 800 on the side wall of the Mini LED light-emitting chip. When the light-emitting chip is a Mini LED light-emitting chip, part of the light generated by the Mini LED light-emitting chip will be irradiated from the side wall of the Mini LED light-emitting chip, resulting in a decrease in the light extraction efficiency of the display panel 10. Therefore, the first reflective layer 600 is provided. When manufacturing the Mini LED light-emitting chip, it is not necessary to manufacture the second reflective layer 800 on the side walls around the Mini LED light-emitting chip. On the one hand, it can improve the light extraction efficiency of the display panel 10 corresponding to the Mini LED light-emitting chip, and on the other hand, it can reduce the difficulty of manufacturing the Mini LED light-emitting chip.

[0051] In this embodiment, the reflectivity of the baffle 300 is not less than 60%. By setting the reflectivity of the baffle 300 to be not less than 60%, the baffle 300 has a higher reflectivity, so that the baffle 300 can reflect the light of the light emitting device 210, thereby improving the light extraction efficiency of the display panel 10.

[0052] In this embodiment, the reflectivity of the retaining wall 300 is 60%, 62%, 64%, 66%, 68%, 70%, 72%, 74%, 76%, 78%, 80%, 82% or 84%.

[0053] In this embodiment, in the thickness direction Z of the display panel 10, the top surface of the first reflective layer 600 is not higher than the top surface of the light emitting device layer 200. By setting the top surface of the first reflective layer 600 not higher than the top surface of the light emitting device layer 200, it is possible to avoid blocking the light of the light emitting device 210 due to the excessive thickness of the first reflective layer 600, thereby improving the light extraction efficiency of the display panel 10.

[0054] In this embodiment, in the thickness direction Z of the display panel 10, the top surface of the first reflective layer 600 is flush with the top surface of the light emitting device layer 200. By setting the top surface of the first reflective layer 600 to be flush with the top surface of the light emitting device layer 200, on the one hand, it is ensured that the first reflective layer 600 can minimize the loss of light on the side wall of the light emitting device 210, and on the other hand, it is ensured that the first reflective layer 600 can better fix the light emitting device 210 on the substrate 100, thereby improving the stability of the light emitting device 210 of the display panel 10.

[0055] In the present embodiment, in the thickness direction Z of the display panel 10 , the top surface of the first reflective layer 600 is lower than the top surface of the light emitting device layer 200 .

[0056] In this embodiment, the area of ​​the side of the blocking wall 300 close to the substrate 100 is larger than the area of ​​the side of the blocking wall 300 far from the substrate 100 .

[0057] In this embodiment, the area of ​​the retaining wall 300 from the side close to the substrate 100 to the side far from the substrate 100 gradually decreases.

[0058] In this embodiment, the retaining wall 300 is trapezoidal.

[0059] In this embodiment, reference Figure 5The display panel 10 further includes a color resist layer 700, which is disposed on a surface of the encapsulation layer 400 away from the substrate 100. The color resist layer 700 includes a plurality of color resists 710, which are arranged at intervals. In the top view of the display panel 10, the red color resist 710 covers the light emitting device 210 with a red light color, the blue color resist 710 covers the light emitting device 210 with a blue light color, and the green color resist 710 covers the light emitting device 210 with a green light color. By arranging the colored color resist layer 700 on a surface of the encapsulation layer 400 away from the substrate 100, the colored color resist layer 700 includes a plurality of color resists 710, and the plurality of color resists 710 are arranged at intervals. In the top view of the display panel 10, the red color resist 710 covers the light emitting device 210 with red light color, the blue color resist 710 covers the light emitting device 210 with blue light color, and the green color resist 710 covers the light emitting device 210 with green light color. Since the red color resist 710 only allows the red light in the ambient light to pass through, the green color resist 710 only allows the blue light in the ambient light to pass through, and the blue color resist 710 only allows the blue light in the ambient light to pass through, the amount of external ambient light entering the display panel 10 can be reduced, thereby reducing the light reflected by the substrate 100 to the outside world, thereby improving the contrast of the display screen of the display panel 10.

[0060] The third embodiment of the present application provides a display panel 10, referring to Figure 7-Figure 8 The display panel 10 includes a substrate 100 , a light emitting device layer 200 , a blackening film layer 900 and an encapsulation layer 400 .

[0061] Specifically, the light-emitting device layer 200 is disposed on the substrate 100, and two adjacent light-emitting devices 210 are arranged at intervals; the blackened film layer 900 is disposed on the substrate 100, and the blackened film layer 900 includes a plurality of blackened portions 910, and the blackened portion 910 is located between two adjacent light-emitting devices 210; the encapsulation layer 400 is disposed on a surface of the blackened film layer 900 away from the substrate 100, and the encapsulation layer 400 includes a plurality of encapsulation portions, and the encapsulation portion is located between two adjacent light-emitting devices 210.

[0062] In this embodiment, the light emitting chip is a Micro LED light emitting chip.

[0063] In this embodiment, the blackened film layer 900 is an optical glue doped with carbon black or black dye.

[0064] In the traditional scheme, reference Fig. 9In order to reduce the reflection of light by the metal wire on the substrate 01, black oil is made between the two light-emitting devices 02 to block the metal wire of the substrate 01. When the black oil is made between the two light-emitting chips, it is necessary to ensure that the spacing between the light-emitting devices 02 is large enough. Since the spacing between the Mini LED light-emitting chips is large, the black oil 03 can be made directly between the Mini LED light-emitting chips. However, when the light-emitting chip of the display panel 10 is a Micro LED light-emitting chip, the spacing between the Micro LED light-emitting chips is small. If the black oil 03 is still used for light shielding, the black oil 03 is very easy to cover the contact pins of the Micro LED light-emitting chip, affecting the working stability of the Micro LED light-emitting chip. Therefore, by setting the blackened film layer 900 as an optical glue doped with carbon black or black dye, on the one hand, it is ensured that the blackened film layer 900 can cover the metal wire on the substrate 100 and reduce the problem of light reflection of the display panel 10. On the other hand, it can avoid the problem of reduced working stability of the light-emitting device 210 due to the use of black oil 03.

[0065] The above is a detailed description of the specific implementation of the present application. The above implementation disclosed in the present application is only the preferred implementation of the present application. For ordinary technicians in this field, many modifications and improvements can be made without departing from the concept of the present application. These modifications and improvements all fall within the scope of protection defined by the claims of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A light emitting device layer, wherein the light emitting device layer is disposed on the substrate, the light emitting device layer comprises a plurality of light emitting devices, and two adjacent light emitting devices are disposed at intervals; A plurality of retaining walls, wherein the retaining walls are located between two adjacent light emitting devices; An encapsulation layer, the encapsulation layer is disposed between the plurality of retaining walls, and the encapsulation layer covers the plurality of light-emitting devices; An anti-reflection layer is provided on a surface of the packaging layer away from the substrate, and the anti-reflection layer comprises a plurality of anti-reflection parts; in a top view of the display panel, the anti-reflection parts overlap with the retaining walls.

2. The display panel according to claim 1, characterized in that: The display panel includes a first reflective layer, which is arranged on the substrate. The first reflective layer includes a plurality of first reflective portions, and the first reflective portions are located between two adjacent light-emitting devices; the plurality of retaining walls are arranged on the first reflective layer; the encapsulation layer is arranged on a surface of the first reflective layer away from the substrate, and the encapsulation layer covers the retaining walls.

3. The display panel according to claim 2, characterized in that: In the thickness direction of the display panel, the top surface of the first reflective layer is not higher than the top surface of the light emitting device layer.

4. The display panel according to claim 1, characterized in that: The encapsulation layer includes a first encapsulation layer and a second encapsulation layer, the first encapsulation layer is arranged on the substrate and between the plurality of light-emitting devices, the second encapsulation layer is arranged on a surface of the first encapsulation layer away from the substrate and between the plurality of retaining walls.

5. The display panel according to claim 4, characterized in that: The refractive index of the second encapsulation layer is smaller than the refractive index of the first encapsulation layer.

6. The display panel according to claim 1, characterized in that: The reflectivity of the retaining wall is not less than 60%.

7. The display panel according to claim 1, characterized in that: The area of ​​a side of the blocking wall close to the substrate is larger than the area of ​​a side of the blocking wall far from the substrate.

8. The display panel according to claim 1, characterized in that: In the top view of the display panel, the film layer where the retaining walls are located is in a mesh shape.

9. The display panel according to claim 1, characterized in that: The display panel also includes a color resist layer, which is disposed on a surface of the encapsulation layer away from the substrate. The color resist layer includes a plurality of color resists, and the plurality of color resists are arranged at intervals. In a top view of the display panel, the red color resist covers the light emitting device with red light color, the blue color resist covers the light emitting device with blue light color, and the green color resist covers the light emitting device with green light color.

10. The display panel according to claim 4, characterized in that: The display panel also includes a second reflective layer, which is arranged on the side wall and surrounding side walls of the light-emitting device, wherein the light-emitting device is a Micro LED light-emitting chip.