Substrate processing apparatus and substrate processing method

Abstract

The substrate processing apparatus includes: a substrate holding unit that holds a substrate; a drive mechanism that drives a tool that processes the substrate held by the substrate holding unit; a housing that accommodates the substrate holding portion and the tool; and a sprayer that sprays a liquid into the interior of the housing in a mist form.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background Art

[0002] The surface processing device described in Patent Document 1 includes a housing that accommodates a holding plate and an indexing table, and grinds the substrate with a grindstone while supplying a grinding fluid to the substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-124006 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] A technical solution of the present disclosure provides a technology for suppressing the adhesion of dirt inside a housing.

[0008] Solutions for solving problems

[0009] A substrate processing device of a technical solution disclosed in the present invention comprises: a substrate holding portion that holds a substrate; a driving mechanism that drives a tool that processes the substrate held by the substrate holding portion; a shell that accommodates the substrate holding portion and the tool; and a sprayer that sprays liquid in a mist form into the interior of the shell.

[0010] Effects of the Invention

[0011] According to an aspect of the present disclosure, it is possible to suppress the adhesion of dirt inside the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a top view showing a substrate processing apparatus according to one embodiment.

[0013] Figure 2 It is a cross-sectional view showing an example of a driving mechanism.

[0014] Figure 3 It is magnified Figure 2 A partial cross-sectional view of .

[0015] Figure 4 It is a top view showing an example of a nebulizer. DETAILED DESCRIPTION

[0016] Hereinafter, the embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, the same reference numerals are used for the same or corresponding structures in the drawings, and the description is sometimes omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

[0017] Reference Figure 1 , a substrate processing device 1 according to an embodiment is described. The substrate processing device 1 grinds, for example, a substrate W. Grinding includes lapping. The substrate processing device 1 includes, for example: a rotating table 10; four holding disks 20 that hold the substrate W; three driving mechanisms 30 that drive a tool D that processes the substrate W; a housing 80 that accommodates the holding disks 20 and the tool D inside; and a control device 90.

[0018] The turntable 10 holds four holding disks 20 at equal intervals around the rotation center line R1 and rotates around the rotation center line R1. The four holding disks 20 rotate together with the turntable 10 and move to the feeding and unfeeding position A0, the first processing position A1, the second processing position A2, the third processing position A3, and the feeding and unfeeding position A0 in sequence.

[0019] The carry-in / carry-out position A0 serves as both a position for carrying in the substrate W and a position for carrying out the substrate W. In the present embodiment, the carry-in position and the carry-out position are the same position, but the carry-in position and the carry-out position may be different positions.

[0020] The first processing position A1 is a position for performing one processing (for example, one grinding). The second processing position A2 is a position for performing two processing (for example, two grinding). The third processing position A3 is a position for performing three processing (for example, three grinding).

[0021] The four retaining plates 20 are arranged with their respective rotation center lines R2 (see Figure 2 ) is rotatably mounted on the turntable 10. At the first processing position A1, the second processing position A2, and the third processing position A3, the holding disk 20 rotates around the respective rotation center lines R2.

[0022] One drive mechanism 30 processes the substrate W once at the first processing position A1. Another drive mechanism 30 processes the substrate W twice at the second processing position A2. The remaining drive mechanism 30 processes and grinds the substrate W three times at the third processing position A3.

[0023] The housing 80 prevents machining debris and machining fluid from scattering to the outside. The machining debris is powder or fragments generated by machining the substrate W. The powder includes powder cut from the substrate W and abrasive particles separated from the tool D. The machining fluid is pure water such as DIW (Deionized Water). The machining fluid enters between the tool D and the substrate W to reduce friction resistance and friction heat. The machining fluid is injected from the nozzle 50 (see Figure 2 )supply.

[0024] The housing 80 includes an upper panel 81 located above the holding plate 20 and a side panel 82 located to the side of the holding plate 20. The upper panel 81 is horizontal, and the side panel 82 is vertical. The upper panel 81 is located above the side panel 82. A through hole 81a (see FIG. 1 ) is provided on the upper panel 81 for passing a tool D or the like. Figure 2 ).

[0025] like Figure 1 As shown by the dotted line in , the upper panel 81 covers, for example, the first processing position A1, the second processing position A2, and the third processing position A3. In addition, the upper panel 81 is open above the feeding and unfeeding position A0. For example, the upper panel 81 has a shape of the letter L by cutting off one corner of a rectangle when viewed from above.

[0026] The interior of the housing 80 is divided into a plurality of chambers by a partition wall 83. The partition wall 83 is fixed to the lower surface of the upper panel 81. The partition wall 83 is provided in a cross shape, for example. The partition wall 83, for example, separates the feeding and unfeeding position A0, the first processing position A1, the second processing position A2, and the third processing position A3.

[0027] The control device 90 is, for example, a computer, and includes a computing unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores a program for controlling various processes performed in the substrate processing apparatus 1. The control device 90 controls the operation of the substrate processing apparatus 1 by causing the computing unit 91 to execute the program stored in the storage unit 92.

[0028] The substrate processing apparatus 1 grinds one surface of the substrate W, but may grind both surfaces of the substrate W.

[0029] The substrate processing apparatus 1 is not limited to a grinding apparatus. The substrate processing apparatus 1 may be a cutting apparatus or the like. When the substrate processing apparatus 1 is a grinding apparatus, a grindstone or the like is used as the tool D. When the substrate processing apparatus 1 is a cutting apparatus, an end mill or the like is used as the tool D.

[0030] Next, refer to Figure 2, an example of the driving mechanism 30 is described. The driving mechanism 30 rotates and elevates the tool D. The driving mechanism 30 includes a movable portion 31 on which the tool D is mounted. The tool D is pressed against the substrate W to process the substrate W. The tool D includes, for example, a disc-shaped grinding wheel D1 and a plurality of grinding stones D2 arranged in a ring shape on the lower surface of the grinding wheel D1.

[0031] The movable part 31 includes a motor 32, a vertical spindle 33 rotated by the motor 32, and a flange 34 provided at the lower end of the spindle 33. The flange 34 is arranged horizontally, and a tool D is mounted on its lower surface. The motor 32 rotates the spindle 33, thereby rotating the tool D mounted on the flange 34. The rotation center line R3 of the tool D is the rotation center line of the spindle 33.

[0032] The driving mechanism 30 further includes a lifting unit 35 for lifting the movable unit 31. The lifting unit 35 includes, for example, a vertical Z-axis guide 36, a Z-axis slide 37 that moves along the Z-axis guide 36, and a Z-axis motor 38 that moves the Z-axis slide 37. The motor 32 is fixed to the Z-axis slide 37 via a motor holder 39.

[0033] Next, the main reference Figure 3 , an example of the spindle cover 40 will be described. The drive mechanism 30 includes the spindle cover 40 surrounding the spindle 33. The spindle cover 40 prevents machining chips and machining fluid from adhering to the upper surface of the spindle 33 and the flange 34.

[0034] The spindle cover 40 is fastened to the motor holder 39 by bolts 41 and the like, and is raised and lowered together with the motor 32. The spindle cover 40 includes a first cylindrical portion 51, an upper flange 52 provided at the upper end of the first cylindrical portion 51, and an intermediate flange 53 provided between the upper end and the lower end of the first cylindrical portion 51. The upper flange 52 is fastened to the motor holder 39 by bolts 41 and the like. The upper flange 52 and the intermediate flange 53 are integrated with the first cylindrical portion 51.

[0035] The spindle cover 40 includes: a second cylindrical portion 62 that surrounds the first cylindrical portion 51; and an annular top plate portion 64 that blocks the internal space 63 formed between the first cylindrical portion 51 and the second cylindrical portion 62 from above. The top plate portion 64 is integrated with the second cylindrical portion 62 and is detachably connected to the lower surface of the intermediate flange 53 by bolts or the like. In addition, the intermediate flange 53 may not be provided, and the top plate portion 64 may be integrated with the first cylindrical portion 51. The top plate portion 64 is provided between the upper end and the lower end of the first cylindrical portion 51.

[0036] The outer diameter of the first cylindrical portion 51 is smaller than the outer diameter of the flange 34. The lower end of the first cylindrical portion 51 is disposed above the upper surface of the flange 34 so as not to contact the upper surface of the flange 34.

[0037] The second cylindrical portion 62 is arranged outside the first cylindrical portion 51 and surrounds the flange 34. The inner diameter of the second cylindrical portion 62 is larger than the outer diameter of the flange 34. The second cylindrical portion 62 extends to a position below the upper surface of the flange 34. The second cylindrical portion 62 prevents machining debris from adhering to the upper surface of the flange 34.

[0038] The head 12 of the bolt 11 is provided on the upper surface of the flange 34. The head 12 of the bolt 11 is arranged in the internal space 63. The head 12 of the bolt 11 protrudes from the upper surface of the flange 34. In addition, a recessed portion for accommodating the head 12 of the bolt 11 may be provided on the upper surface of the flange 34.

[0039] The operator assembles and disassembles the tool D by loosening and tightening the bolt 11. A hole for operation, such as a hexagonal hole 13, is formed in the head 12 of the bolt 11. The operator inserts the front end of a hexagonal wrench into the hexagonal hole 13 and rotates the head 12 of the bolt 11 to loosen and tighten the bolt 11.

[0040] The spindle cover 40 prevents machining debris from adhering to the upper surface of the flange 34. This prevents workers from getting dirty when attaching or removing the tool D. Furthermore, machining debris can be prevented from accumulating in the hexagonal hole 13 of the bolt 11, and the hexagonal hole 13 can be prevented from being clogged by machining debris.

[0041] The inventors of the present application studied the reason why machining debris enters the internal space 63 of the spindle cover 40 through airflow simulation and the like. When the motor 32 rotates the spindle 33, the flange 34 rotates. It was found that a swirling airflow is generated by the rotation of the flange 34 or the head 12 of the bolt 11, and a negative pressure is generated in a part of the internal space 63. It was also found that when an obstacle (not shown) exists in the internal space 63, the turbulence of the swirling airflow increases, and the negative pressure generated in the internal space 63 increases.

[0042] In this embodiment, an inlet port 66 is provided for allowing gas (for example, air) to enter the internal space 63 from the external space 65 of the spindle cover 40. The inlet port 66 is provided at the upper portion of the second cylindrical portion 62 or the top plate portion 64 (at the Figure 3 The inlet 66 uses the pressure difference between the external space 65 and the internal space 63 to allow gas to enter the internal space 63 from the external space 65.

[0043] Even if the rotating airflow in the internal space 63 of the spindle cover 40 is disturbed and negative pressure is generated in a part of the internal space 63, gas can enter the internal space 63 through the inlet port 66, thereby forming a downward or oblique downward airflow at the lower end of the internal space 63, which can limit the entry of machining debris into the internal space 63. In addition, a downward flow can be formed near the through port 81a of the upper panel 81, which can suppress the leakage of mist-like liquid described later through the through port 81a.

[0044] The inlet 66 allows gas to enter the internal space 63 from the external space 65 above the upper panel 81 of the housing 80. Clean gas can enter the internal space 63. In order to allow as much clean gas as possible to enter, the inlet 66 is preferably provided as high as possible, and is preferably provided on the top plate 64.

[0045] For example, a plurality of inlet ports 66 are provided at intervals in the circumferential direction of the top plate portion 64. The plurality of inlet ports 66 may be provided at non-equal intervals, but are preferably provided at equal intervals. By providing the plurality of inlet ports 66 at equal intervals, the gas can be uniformly introduced into the internal space 63.

[0046] The intermediate flange 53 is placed on the top plate portion 64 provided with the inlet port 66. The intermediate flange 53 is provided with a communication hole 56 at a position overlapping with the inlet port 66. The gas enters the internal space 63 from the external space 65 through the communication hole 56 and the inlet port 66. In addition, a notch (not shown) may be formed in the intermediate flange 53 in a manner avoiding the inlet port 66.

[0047] Next, the main reference Figure 4 , an example of the sprayer 70 is described. The substrate processing apparatus 1 includes a sprayer 70 that sprays liquid in a mist form into the interior of a housing 80. The sprayer 70 can suppress the drying of the interior of the housing 80 and suppress the fixation of contaminants such as processing debris. In addition, by spraying the liquid in a mist form, the amount of liquid used can be reduced. The liquid sprayed in a mist form is not particularly limited, but it is preferable to use the same liquid as the processing liquid (for example, DIW).

[0048] The sprayer 70 preferably includes a two-fluid nozzle. The two-fluid nozzle uses the pressure of the gas to atomize the liquid and spray it in a mist. By atomizing the liquid, the amount of liquid used can be further reduced. In addition, by atomizing the liquid, the droplets can be made lighter, the droplets in the gas can be suppressed from falling, and the droplets can be evenly supplied to the entire interior of the housing 80.

[0049] The sprayers 70 are provided at the first processing position A1, the second processing position A2, and the third processing position A3, for example (see Figure 1 ). It is possible to suppress the adhesion of dirt such as processing scraps at the first processing position A1, the second processing position A2, and the third processing position A3. The sprayer 70 is not provided at the carrying-in and carrying-out position A0 which is not covered by the upper panel 81.

[0050] For example, the sprayer 70 sprays the liquid in the form of mist into the housing 80 during the period from when the power of the substrate processing apparatus 1 is turned on to when processing of the substrate W is started, or during the period from when processing of one substrate W is finished to when processing of another substrate W is started. The liquid and the tool D can be matched in advance before processing of the substrate W is started, and the variation in processing quality between substrates W can be reduced.

[0051] In addition, during the processing of the substrate W, the processing liquid is scattered inside the housing 80, and the inside of the housing 80 is wetted, so the sprayer 70 does not spray the liquid in a mist form. However, during the processing of the substrate W, the sprayer 70 may spray the liquid in a mist form.

[0052] like Figure 4 As shown, when the sprayer 70 sprays the liquid in a mist form, it is preferred to rotate the tool D. A swirling airflow is generated by the rotation of the tool D. The swirling airflow can be used to spread the mist liquid throughout the entire interior of the housing 80 in a short time. In addition, the spraying of the liquid in a mist form and the rotation of the tool D may not be performed simultaneously, and may be performed alternately, for example. If the ray of the sprayer 70 is deviated from the rotation center line R3 of the tool D when viewed from vertically above, the tool D can also be rotated by the collision of the liquid with the tool D.

[0053] When the sprayer 70 sprays the liquid in the form of mist, it is preferred to rotate the retaining disk 20. A swirling airflow is generated by the rotation of the retaining disk 20. The swirling airflow can be used to spread the mist liquid throughout the entire interior of the housing 80 in a short time. In addition, the spraying of the liquid in the form of mist and the rotation of the retaining disk 20 may not be performed simultaneously, and may be performed alternately, for example.

[0054] Preferably, when viewed from vertically above, the rotation direction of the tool D and the rotation direction of the holding disk 20 are the same direction (in Figure 4 The collision between the swirling airflow caused by the rotation of the tool D and the swirling airflow caused by the rotation of the holding disk 20 can be suppressed, the turbulence of the airflow can be suppressed, and the mist liquid can be evenly distributed throughout the entire interior of the housing 80.

[0055] When viewed from vertically above, the tool D is rotated in a preset direction, and the sprayer 70 sprays the liquid in a mist toward the downstream side of the rotation direction of the tool D, with the straight line L0 connecting the rotation center line R3 of the tool D and the spray port 71 of the sprayer 70 as a reference. The liquid can be sprayed in a mist without going against the swirling airflow caused by the rotation of the tool D.

[0056] When viewed from above, the sprayer 70 is provided outside the holding plate 20 and the tool D, and sprays the liquid in a mist toward the tool D. By directing the beam of the sprayer 70 toward the tool D, it is easy to make the liquid fit the tool D. In particular, if the liquid is sprayed in a mist toward the tool D during the rotation of the tool D, the liquid can also fit the entire circumference of the tool D. Preferably, the sprayer 70 sprays the liquid in a mist in a tangential direction of the outer periphery of the tool D when viewed from above.

[0057] Preferably, the sprayer 70 sprays the liquid in a mist form from the oblique lower side of the tool D toward the tool D (see Figure 2 ). A wide range of the tool D can be surrounded by the mist-like liquid. In addition, the sprayer 70 can also spray the liquid toward the tool D from directly below the tool D in the form of a mist.

[0058] The tool D includes, for example, a grindstone D2. The grindstone D2 includes, for example, abrasive grains and a vitrified binder that binds the abrasive grains. The vitrified binder is easily degraded by liquid. If the liquid is sprayed in a mist form, the amount of liquid used can be reduced, and the degradation of the vitrified binder can be suppressed. In addition, the abrasive grains are not particularly limited, and are, for example, diamond abrasive grains.

[0059] The substrate processing apparatus 1 includes a discharge unit 72 for discharging gas inside the housing 80 to the outside of the housing 80. The discharge unit 72 can maintain a negative pressure inside the housing 80 relative to the outside of the housing 80, thereby preventing leakage of machining chips and machining fluid.

[0060] The discharge unit 72 is provided at, for example, the first processing position A1, the second processing position A2, and the third processing position A3 (see Figure 1 ). The leakage of machining chips and machining fluid can be suppressed at the first machining position A1, the second machining position A2, and the third machining position A3. The discharge portion 72 is not provided at the delivery position A0 which is not covered by the upper panel 81.

[0061] When viewed from vertically above, the tool D is rotated in a predetermined direction, and the gas is discharged from the upstream side of the rotation direction of the tool D to the discharge portion 72 based on the straight line L1 connecting the rotation center line R3 of the tool D and the discharge port 73 of the discharge portion 72. The gas can be discharged without going against the swirling airflow caused by the rotation of the tool D.

[0062] Next, refer to Figure 2 An example of the cleaning liquid nozzle 74 will be described. The cleaning liquid nozzle 74 sprays cleaning liquid toward the spindle cover 40 , the housing 80 , or the tool D. According to this embodiment, since the sprayer 70 suppresses the adhesion of dirt, the cleaning liquid nozzle 74 can efficiently wash away dirt.

[0063] The cleaning liquid nozzle 74 can be fixed or rotated like a shower device. In the latter case, the spindle cover 40, the housing 80 and the tool D can be rinsed of all dirt using one cleaning liquid nozzle 74.

[0064] The cleaning liquid nozzle 74 is provided at the first processing position A1, the second processing position A2, and the third processing position A3, for example. Dirt can be washed away at the first processing position A1, the second processing position A2, and the third processing position A3. The cleaning liquid nozzle 74 is not provided at the feeding and unfeeding position A0 which is not covered by the upper panel 81.

[0065] For example, the cleaning liquid nozzle 74 ejects the cleaning liquid during a period from when processing of one substrate W is completed to when processing of another substrate W is started. After the processing of the substrate W, dirt attached during the processing of the substrate W can be washed away.

[0066] In addition, during the processing of the substrate W, the processing debris scatters inside the housing 80, and the supply of the cleaning liquid is useless, so the cleaning liquid nozzle 74 does not spray the cleaning liquid. However, during the processing of the substrate W, the cleaning liquid nozzle 74 may spray the cleaning liquid.

[0067] The above describes the substrate processing device and substrate processing method of the present disclosure, but the present disclosure is not limited to the above-mentioned embodiments, etc. Various changes, modifications, substitutions, additions, deletions and combinations can be made within the scope of the claims. These are of course also within the technical scope of the present disclosure.

[0068] This application claims the priority based on Japanese Patent Application No. 2022-147678 filed with the Japan Patent Office on September 16, 2022, and all the contents of Japanese Patent Application No. 2022-147678 are incorporated herein by reference.

[0069] Description of Reference Numerals

[0070] 1. Substrate processing device; 20. Holding plate (substrate holding portion); 70. Sprayer; 80. Housing; D. Tool; W. Substrate.

Claims

1. A substrate processing device, wherein: The substrate processing device comprises: a substrate holding portion that holds a substrate; a driving mechanism that drives a tool for processing the substrate held by the substrate holding portion; a housing that accommodates the substrate holding portion and the tool; and A sprayer sprays liquid in the form of mist into the interior of the housing.

2. The substrate processing apparatus according to claim 1, wherein: When viewed from vertically above, the tool is rotated in a preset direction, and the sprayer sprays the liquid in a mist form toward the downstream side of the rotation direction of the tool, based on a straight line connecting the rotation center line of the tool and the spray port of the sprayer.

3. The substrate processing apparatus according to claim 1 or 2, wherein: The sprayer is provided outside the substrate holding portion and the tool when viewed from vertically above, and sprays the liquid in a mist form toward the tool.

4. The substrate processing apparatus according to claim 1 or 2, wherein: The substrate processing apparatus includes a discharge unit for discharging gas inside the housing to the outside of the housing. When viewed from vertically above, the tool is rotated in a preset direction, and gas is discharged to the discharge portion from the upstream side in the rotation direction of the tool with reference to a straight line connecting the rotation center line of the tool and the discharge port of the discharge portion.

5. The substrate processing apparatus according to claim 1 or 2, wherein: The driving mechanism includes a motor, a vertical spindle rotated by the motor, and a spindle cover surrounding the spindle. The housing has an upper panel, and the upper panel is provided with a through hole for the tool to pass through. The spindle cover comprises: a first cylindrical portion surrounding the spindle; a second cylindrical portion surrounding the first cylindrical portion; and an annular top plate portion blocking an internal space formed between the first cylindrical portion and the second cylindrical portion from above. The spindle cover is provided with an inlet port for allowing gas to enter the internal space from an external space above the upper panel.

6. The substrate processing apparatus according to claim 1 or 2, wherein: The driving mechanism includes a motor, a vertical spindle rotated by the motor, and a spindle cover surrounding the spindle. The substrate processing apparatus includes a cleaning liquid nozzle disposed inside the housing and configured to eject cleaning liquid toward the spindle cover, the housing, or the tool.

7. A substrate processing method, wherein: The substrate processing method comprises the following steps: A substrate is processed using the substrate processing apparatus according to claim 1 or 2.

8. The substrate processing method according to claim 7, wherein: The substrate processing method comprises the following steps: The liquid is sprayed into the housing in a mist form by the sprayer during a period from when the power is turned on to when processing of the substrates is started, or during a period from when processing of one substrate is completed to when processing of another substrate is started.

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