Mounting device

Abstract

The invention provides a mounting device which obtains position information of a substrate identification mark and realizes high-precision mounting even when a chip component covers the substrate identification mark during face-down mounting. Specifically, provided is a mounting device comprising: an attachment tool that holds a surface of the chip component opposite to a surface having the chip identification mark; a substrate stage that holds the substrate; a light source for reflection that irradiates light having a wavelength that passes through the chip component from the attachment tool side toward the surface of the substrate; and a recognition unit that recognizes reflected light of the light irradiated by the light source for reflection, the recognition unit acquiring an image based on the light transmitted through the chip component and reflected on the substrate, and acquiring position information of the substrate recognition mark.

Description

Technical Field

[0001] The present invention relates to a mounting device for mounting a chip component on a substrate, and more particularly to a mounting device for mounting the chip component so that an electrode surface of the chip component faces an electrode surface of the substrate. Background Art

[0002] As one method of mounting chip components such as semiconductor chips on a substrate such as a wiring substrate, there is face-down mounting in which the chip component is mounted so that the electrode surface of the chip component faces the electrode surface of the substrate.

[0003] exist Fig.13 FIG. 1 shows an example of a substrate S for face-down mounting, in which chip components are bonded with electrode surfaces facing each other at a plurality of mounting locations SC arranged on the substrate S. At this time, if chip components are not arranged at each mounting location SC of the substrate S with high precision, the electrical connection between the substrate S and the chip components will become incomplete, causing poor quality of the semiconductor device. Therefore, at each mounting location SC of the substrate S, as shown in FIG. Fig.13 As shown in FIG. 1 , a substrate identification first mark AS1 and a substrate identification second mark AS2 are provided on the electrode surface side as substrate identification marks AS. On the other hand, a chip identification first mark AC1 and a chip identification second mark AC2 are also provided on the electrode surface of the chip component as chip identification marks AC. Fig.14 In the state shown, the relative position of the chip component C relative to the installation part SC of the substrate S (in the direction within the surface of the substrate S) is calculated based on the positional relationship between the substrate identification first mark AS1 and the chip identification first mark AC1, as well as the positional relationship between the substrate identification second mark AS2 and the chip identification second mark AC2. By correcting it, the positioning accuracy can be improved.

[0004] Conventionally, when determining the relative position of the chip identification mark AC and the substrate identification mark AS, the Fig.15 As shown in the upper and lower two-view camera 500, the upper field of view 50U of the upper field of view allows the chip recognition first mark AC1 (or chip recognition second mark AC2) to enter the field of view, and the lower field of view 50D allows the substrate recognition first mark AS1 (or substrate recognition second mark AS2) to enter the field of view for shooting.

[0005] By using the upper and lower dual-view camera 500, the relative position (in the in-plane direction of the substrate S) of the chip component C with respect to the mounting location SC of the substrate S is obtained and corrected, thereby enabling mounting with a maximum error of about several μm.

[0006] A maximum error of several μm is sufficient in face-down mounting, known as flip chip mounting, as long as the electrode pitch is 100 μm or more, as when solder bumps are used as electrodes of chip component C. However, there is no margin when the electrode pitch is more than 50 μm, as when Cu column bumps are used. There is also a possibility that the accuracy is insufficient when the electrode pitch becomes narrower due to further high-density mounting.

[0007] Therefore, a dual-view camera is used to achieve higher precision, but Fig.15 In the state shown, even if the chip component C is aligned with respect to the mounting portion SC of the substrate S (in the direction of the substrate S plane) with an error of less than 1 μm, the maximum error at the mounting stage may exceed 1 μm. This is because the chip C Fig.15 When the substrate S is lowered in the state of being held, there is a slight tilt in the descending direction. Therefore, attempts have been made to solve this problem by improving the processing accuracy or rigidity of each part of the mounting device that is perpendicular to the descending direction of the surface holding the substrate S, but this affects the cost of the device. In addition, in the upper and lower dual-field cameras, it is difficult to make the optical axes of the upper camera and the lower camera consistent, resulting in relative offset, so the relative offset needs to be corrected.

[0008] Therefore, in order to achieve high-precision face-down mounting without significantly affecting the device cost, the inventors of the present application have discovered the following method: it is also combined with the alignment method used in face-up mounting, and can align the chip component as close to the substrate as possible (Patent Document 1).

[0009] First, if Fig.16 As shown in FIG. 1 , a tool identification mark is added to the accessory tool 42 holding the chip component C, and the positioning is performed by the tool identification unit. Specifically, the chip position recognition unit 8 is Fig.16 In the state shown in (a), the chip recognition first mark AC1 and the tool recognition first mark AT1 are photographed in the same field of view to obtain relative position information. Fig.16 After obtaining the relative position information of the chip identification second mark AC2 and the tool identification second mark AT2 in the same manner as shown in (b), as shown in FIG. Fig.17 As shown in (a), the positional relationship between the tool recognition first mark AT1 and the substrate recognition first mark AS1 is obtained when the chip component C is close to the substrate S, as shown in FIG. Fig.17 As shown in (b), after the positional relationship between the tool recognition second mark AT2 and the substrate recognition second mark AS2 is obtained, the chip component C and the substrate S are relatively aligned (Patent Document 1). In this method, since the alignment is performed using an image captured by one camera, there is no relative offset problem like that of the upper and lower dual-field cameras.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: Japanese Patent Application No. 2022-007513

[0013] Patent Document 2: Japanese Patent Application Publication No. 2018-093140 Summary of the invention

[0014] Problems to be solved by the invention

[0015] In recent years, such as Fig.18 As shown in FIG. 1 , there is a method of configuring the mounting portion SC on the substrate S with a small gap. In such a method, Fig.13 The substrate identification mark AS shown is located outside the mounting portion SC in different ways, such as Fig.19 As shown, the substrate recognition mark AS is provided in the mounting location SC, and the substrate recognition mark AS is covered by the chip component C in the mounting stage.

[0016] Therefore, in Fig.17 In the stage of alignment in the state shown, the substrate recognition mark AS cannot be observed.

[0017] Therefore, attempts have been made to use light having a wavelength that can transmit silicon (for example, near-infrared light) used in wafer bonding and the like. Fig. 20 The figure shows an example of a device structure used for alignment when bonding silicon wafers to each other. By observing the near-infrared light emitted from the transmission light source 702 using the recognition unit 502 (having sensitivity to near-infrared light), it is possible to Fig.21 (c) Fig.21 (a) shows the identification mark AWB on the lower side of the wafer and Fig.21 The identification mark AWT of the upper wafer shown in (b) (for example, Patent Document 2).

[0018] However, if Fig. 22 As shown, in the method of mounting the chip component C on the substrate S, Fig. 20 The same device structure was observed, but the same observation based on transmitted light as the bonding of silicon wafers could not be performed. This is because the internal wiring CW existing in the substrate S blocks the near-infrared light, so the substrate identification mark AS (and the chip identification mark AC) cannot be recognized. In addition, since most substrate carriers that hold the substrate have a built-in heater, it is also impossible to set a light source under the heater.

[0019] The present invention is completed in view of the above problems and provides a mounting device that, in face-down mounting in which electrode surfaces are mounted opposite to each other, obtains position information of substrate recognition marks to achieve high-precision mounting even when chip components cover substrate recognition marks.

[0020] Means for solving problems

[0021] In order to solve the above-mentioned problems, the invention described in technical solution 1 is a mounting device, which mounts a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment so that the surface having the chip identification mark faces the surface having the substrate identification mark and the substrate identification mark is covered by the chip component, wherein the mounting device has:

[0022] an accessory tool that holds the side of the chip component opposite to the side having the chip identification mark;

[0023] a substrate stage that holds the substrate;

[0024] a reflection light source that irradiates light including a wavelength that transmits the chip component from the accessory tool side toward the surface of the substrate; and

[0025] a recognition unit that recognizes the reflected light of the light irradiated by the reflection light source,

[0026] The recognition unit acquires an image based on light that passes through the chip component and is reflected by the substrate, thereby acquiring position information of the substrate recognition mark.

[0027] The invention described in technical solution 2 is a mounting device according to technical solution 1, wherein:

[0028] The recognition unit obtains an image based on light irradiated from the reflection light source, transmitted through the chip component and reflected from the surface of the chip component having the chip recognition mark, and obtains position information of the chip recognition mark.

[0029] The substrate and the chip are aligned using the position information of the substrate recognition mark and the position information of the chip recognition mark.

[0030] The invention described in technical solution 3 is a mounting device according to technical solution 1, wherein:

[0031] The mounting device further includes a transmission light source, which irradiates light including a wavelength that transmits the chip component toward the chip component from the lower side of the chip component.

[0032] The recognition unit obtains an image based on the light of the wavelength irradiated from the transmission light source and transmitted through the chip component, and obtains the position information of the chip recognition mark.

[0033] The substrate and the chip are aligned using the position information of the substrate recognition mark and the position information of the chip recognition mark.

[0034] The invention described in Technical Solution 4 is a mounting device according to Technical Solution 3, wherein:

[0035] After the recognition unit obtains the position information of the chip recognition mark, the accessory tool is moved toward the substrate stage.

[0036] The position information of the substrate recognition mark is acquired in a state where the chip component is brought close to the substrate so that the substrate recognition mark enters within the depth of field of the recognition unit.

[0037] The invention described in technical solution 5 is a mounting device according to technical solution 4, wherein:

[0038] From the time when the position information of the chip recognition mark is acquired until the time when the position information of the substrate recognition mark is acquired, the relative position of the recognition unit with respect to the attachment tool is maintained.

[0039] The invention described in technical solution 6 is a mounting device according to technical solution 1, wherein:

[0040] The accessory tool has tool identification markings,

[0041] The mounting device further includes a transmission light source, which irradiates light including a wavelength that transmits the chip component toward the chip component from the lower side of the chip component.

[0042] After the recognition unit obtains the position information of the chip recognition mark and the position information of the tool recognition mark based on an image based on the wavelength of light irradiated from the transmission light source and transmitted through the chip component and the accessory tool,

[0043] The recognition unit obtains the position information of the substrate recognition mark and the position information of the tool recognition mark based on an image based on the wavelength of light irradiated from the reflection light source, reflected on the substrate and transmitted through the chip component and the accessory tool,

[0044] The relative position information with respect to the tool recognition mark is used to obtain the positional relationship between the substrate recognition mark and the chip recognition mark, and the substrate and the chip are aligned.

[0045] The invention described in technical solution 7 is a mounting device according to technical solution 6, wherein:

[0046] The position information of the substrate recognition mark and the position information of the tool recognition mark are acquired in a state where the chip component is brought close to the substrate so that both the substrate recognition mark and the tool recognition mark are within the depth of field of the recognition unit.

[0047] Effects of the Invention

[0048] According to the present invention, there is provided a mounting device that acquires position information of a substrate recognition mark and achieves high-precision mounting even when a chip component covers a substrate recognition mark in face-down mounting in which electrode surfaces are mounted facing each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic diagram of a mounting device according to an embodiment of the present invention.

[0050] Figure 2 The optical structure of the embodiment of the present invention is described, (a) is a front view, and (b) is a side view.

[0051] Figure 3 It is a block diagram showing a control system according to an embodiment of the present invention.

[0052] Figure 4 (a) is a diagram showing a state in which the recognition unit of the mounting device according to the embodiment of the present invention obtains position information of a first substrate recognition mark, and (b) is a diagram showing a state in which the position information of a second substrate recognition mark is obtained.

[0053] Figure 5 It is a schematic diagram of Modification 1 of the mounting device according to the embodiment of the present invention.

[0054] Figure 6 (a) is a diagram showing a state in which the recognition unit obtains position information of a first chip recognition mark in variation 1 of the mounting device of an embodiment of the present invention, and (b) is a diagram showing a state in which the position information of a second chip recognition mark is obtained.

[0055] Figure 7 It is a schematic diagram of Modification 2 of the mounting device according to the embodiment of the present invention.

[0056] Figure 8 (a) is a diagram showing a state in which the identification unit obtains the position information of the first mark for chip identification and the position information of the first mark for tool identification in variant example 2 of the installation device of an embodiment of the present invention, and (b) is a diagram showing a state in which the position information of the second mark for chip identification and the position information of the second mark for tool identification are obtained.

[0057] Fig. 9 (a) is a diagram showing a state in which the identification unit obtains the position information of the first mark for substrate identification and the position information of the first mark for tool identification in variant example 2 of the installation device of an embodiment of the present invention, and (b) is a diagram showing a state in which the position information of the second mark for substrate identification and the position information of the second mark for tool identification are obtained.

[0058] Fig.10 (a) is a diagram showing a state of obtaining position information of a chip identification mark in a device structure in which an image acquisition unit is configured for each combination of a substrate identification mark and a chip identification mark as a variation 3 of an embodiment of the present invention, and (b) is a diagram showing a state of obtaining position information of a substrate identification mark.

[0059] Fig.11 (a) is a diagram showing a state of obtaining position information of a chip identification mark in a device structure of a variant example 4 of an embodiment of the present invention, which is provided with an image capture unit having a field of view capable of capturing multiple combinations of substrate identification marks and chip identification marks, and (b) is a diagram showing a state of obtaining position information of a substrate identification mark.

[0060] Fig.12 (a) is a diagram showing the state of picking up a chip component in the device structure of the mounting head that picks up a chip from the chip supply part in the modified example 5 of the embodiment of the present invention, (b) is a diagram showing the state of obtaining the position information of the chip identification mark, and (c) is a diagram showing the state of obtaining the position information of the substrate identification mark.

[0061] Fig.13 The diagram explains the mounting locations of the respective chip components and the respective substrate identification marks of the substrate on which a plurality of chip components are mounted.

[0062] Fig.14 This is a diagram showing a state in which a chip identification mark and a substrate identification mark face each other when a chip component is mounted on a substrate.

[0063] Fig.15 This is a diagram for explaining a conventional example of aligning a chip identification mark of a chip component and a substrate identification mark of a substrate by placing them opposite to each other.

[0064] Fig.16 (a) is a diagram showing a state in which a chip position identification unit obtains position information of a chip identification first mark and position information of a tool identification first mark in an existing example of high-precision alignment, and (b) is a diagram showing a state in which position information of a chip identification second mark and position information of a tool identification second mark are obtained.

[0065] Fig.17(a) is a diagram showing a state in which the identification unit obtains position information of a first mark for substrate identification and position information of a first mark for tool identification in an existing example of high-precision alignment, and (b) is a diagram showing a state in which the position information of a second mark for substrate identification and position information of a second mark for tool identification are obtained.

[0066] Fig.18 The diagram explains the mounting locations of the respective chip components and the respective substrate identification marks of a substrate on which a plurality of chip components are mounted with minute gaps.

[0067] Fig.19 This is a diagram showing a state where a chip identification mark and a substrate identification mark face each other when a plurality of chip components are mounted with a small gap.

[0068] Fig. 20 This is a diagram for explaining alignment using near-infrared light transmission for wafer bonding.

[0069] Fig.21 (a) is a diagram showing an example of the shape of the identification mark of the lower chip used for chip bonding, (b) is a diagram showing an example of the shape of the identification mark of the upper chip, and (c) is a diagram showing a transmission image of the upper and lower identification marks in a state where alignment is possible.

[0070] Fig. 22 This is a diagram for explaining problems when positioning using near-infrared light transmission is applied to mounting chip components on a substrate having internal wiring. DETAILED DESCRIPTION

[0071] Embodiments of the present invention will be described using the drawings. Figure 1 It is a schematic diagram of the mounting device 1 in the embodiment of the present invention.

[0072] The mounting device mounts the chip component on a substrate such as a wiring substrate, but Figure 1 The mounting device 1 is configured to perform face-down mounting in which the electrode surface of the chip component is mounted opposite to the electrode surface of the substrate.

[0073] The mounting device 1 includes a substrate stage 2, a lifting unit 3, a mounting head 4, a recognition unit 5, a chip transport unit 6, and a light source 7 (a reflection light source 71 and, if necessary, a transmission light source 72) as components.

[0074] exist Figure 1 In the mounting device 1, the substrate stage 2 is composed of a stage movement control unit 20 and an adsorption stage 23. The adsorption stage 23 adsorbs and holds the substrate arranged on the surface, and the adsorption stage 23 can be moved in the in-plane direction of the substrate surface by the stage movement control unit 20 while holding the substrate.

[0075] The stage movement control unit 20 is composed of a Y-direction stage movement control unit 22 capable of linearly moving the adsorption stage 23 in the Y direction, and an X-direction stage movement control unit 21 capable of linearly moving the Y-direction stage movement control unit 22 in the X direction and disposed on the base 200. The Y-direction movement control unit 22 carries the adsorption stage 23 on a movable portion disposed on a slide rail, and the movable portion is moved and position-controlled by a Y-direction servo 221. In addition, the X-direction movement control unit 21 carries the Y-direction movement control unit 22 on a movable portion disposed on a slide rail, and the movable portion is moved and position-controlled by an X-direction servo 211.

[0076] The lifting unit 3 is fixed to a door-shaped frame (not shown), and the upper and lower drive shafts are arranged in a vertical direction relative to the adsorption worktable 23, and the mounting head 4 is connected to the upper and lower drive shafts. The lifting unit 3 has the function of driving the mounting head 4 up and down and applying a pressure corresponding to the setting. In addition, in the mounting device 1, the lifting unit 3 is supported from two directions (through the door-shaped frame (not shown) and is linearly connected to the mounting head 4, so it is difficult to apply a lateral force to the mounting head 4 when pressurizing.

[0077] The mounting head 4 holds the chip component C (held on the adsorption workbench 23 of the substrate carrier 2) and performs crimping in a state parallel to the substrate. The mounting head 4 is composed of a head body 40, a heating unit 41, an accessory tool 42 and a tool position control unit 43. The head body 40 is connected to the lifting unit 3 via the tool position control unit 43, and a heating unit 41 is fixedly arranged on the lower side. The heating unit 41 has a heating function and heats the chip component C via the accessory tool 42. In addition, the heating unit 41 has a function of adsorbing and holding the accessory tool 42 using a decompression flow path. The accessory tool 42 adsorbs and holds the chip component C and is replaced according to the shape of the chip component C. The tool position control unit 43 fine-adjusts the position of the head body 40 in the direction in the vertical plane relative to the upper and lower drive shafts of the lifting unit 3, and accordingly adjusts the position (in the XY plane of the figure) of the accessory tool 42 and the chip component C held by the accessory tool 42.

[0078] The tool position control unit 43 includes an X-direction tool position control unit 431, a Y-direction tool position control unit 432, and a tool rotation control unit 433 as components. Figure 1In the illustrated embodiment, the tool rotation control unit 433 adjusts the rotation direction of the head body 40, the Y-direction tool position control unit 432 adjusts the Y-direction position of the tool rotation control unit 433, and the X-direction tool position control unit 431 adjusts the X-direction position of the Y-direction position control unit. However, the present invention is not limited thereto. The tool rotation control unit 433 may also be arranged above the X-direction tool position control unit 431 (on the lifting unit 3 side). In short, as long as the X-direction position, Y-direction position, and rotation angle of the accessory tool 42 can be adjusted, it will suffice.

[0079] Figure 2 The figure mainly shows the periphery of the head main body 40 ( Figure 2 (a) is the main view, Figure 2 (b) is a side view), in the face-down installation of this embodiment, a chip identification mark AC (a chip identification first mark AC1 and a chip identification second mark AC2) are provided at a diagonal position of the electrode surface of the chip component C, and a substrate identification mark AS (a substrate identification first mark AS1 and a substrate identification second mark AS2) are provided at a reference position diagonal to the chip component installation part of the electrode surface of the substrate S. Here, it is preferred that the chip identification mark AC and the substrate identification mark AS have the property of reflecting light of a wavelength transmitted through the chip component C (the material of which is silicon) described later.

[0080] In the mounting device 1, the direction of the substrate identification mark AS and the chip identification mark AC can be observed through the mounting head 4, and the accessory tool 42 is transparent to the light of the wavelength of the chip component, or a through hole is provided which is consistent with the position of the substrate identification mark AS. In addition, the heating part 41 also needs to use a material that allows the substrate identification mark AS to be observed or to provide an opening. In this embodiment, Figure 2 In order to obtain the position information of the substrate identification mark AS and / or the chip identification mark AC with high resolution, it is preferable to perform image acquisition at multiple locations (according to each combination of the substrate identification mark AS and the chip identification mark AC), and a space is required in which the image acquisition unit 50 of the recognition unit 5 can move. In this embodiment, Figure 2 As shown, a head space 40V is provided in the mounting head 4. That is, the head main body 40 is structured by a side plate connected to the heater 41 and a top plate connecting the side plates.

[0081] The recognition unit 5 is sensitive to light of a wavelength that transmits the chip component C, and photographs the substrate recognition mark AS and the chip recognition mark AC. Based on the configuration position information of the recognition unit 5 and the coordinates within the field of view photographed by the recognition unit 5, the position information of the substrate recognition mark AS and the chip recognition mark can be obtained. In this embodiment, the substrate position recognition unit 5 includes an image taking unit 50, an optical path 52, and an imaging unit 53 connected to the optical path 52 as components. Here, the imaging unit 53 is sensitive to light of a wavelength that transmits the chip component C.

[0082] The image taking unit 50 is disposed so as to face the identification target whose image is acquired by the imaging unit 53 , and brings the identification target into its field of view.

[0083] The recognition unit 5 is configured to be able to move the image capture unit 50 in the head space 40V in the plane direction of the substrate S (and the chip component C) by a driving mechanism (not shown). Furthermore, in order to adjust the focus position, it is preferable that the substrate S can also be moved in the vertical direction (Z direction).

[0084] The mounting head 4 moves in a direction perpendicular to the substrate S through the lifting unit 3, but this movement can be performed independently of the movement of the recognition unit 5. Therefore, the head space 40V needs to be designed to a size that does not interfere with the recognition unit 5 entering the head space 40V even if the mounting head 4 moves in the vertical direction.

[0085] In addition, the movable range of the image capture section 50 of the recognition unit 5 is not limited to within the head space 40V, and the image capture section 50 may be moved on the substrate S away from the head space 40V to acquire the position information of the substrate recognition mark AS.

[0086] The chip transport unit 6 is composed of a transport rail 60 and a chip slider 61 . The chip slider 61 slides while holding the chip component C supplied from a chip supply unit (not shown) and transports it to the bottom of the attachment tool 42 .

[0087] Here, the chip supply unit (not shown) configures the chip component C at a predetermined position on the chip slider 61. As required, the chip component C configured on the chip slider 61 can also be identified by a recognition unit (not shown). In addition, the chip conveying unit 6 can also have a position adjustment unit that adjusts the position of the chip component C mounted on the chip slider 61 in the in-plane direction (XY direction). In this way, by controlling the position of the chip slider 61 and the chip component C configured on the chip slider 61, the chip component C can be delivered to the specified range of the accessory tool 42. After the accessory tool 42 holds the chip component C, the chip slider 61 that releases the hold of the chip component C moves to the retreat position.

[0088] As the light source 7, a reflection light source 71 is required. The reflection light source 71 irradiates light from the upper side of the attachment tool 42 toward the substrate S, and the light emitted by the reflection light source includes a wavelength that transmits the chip component C. Here, as the wavelength that transmits the chip component C, the near-infrared region is preferred, but it is not limited thereto.

[0089] Figure 3 The control unit 10 shown in the figure is essentially composed of a CPU and a storage device as main components, and an interface is provided between the devices as required. In addition, the control unit 10 can also perform calculations using acquired data and output corresponding to the calculation results through a built-in program. Furthermore, it is preferred that the control unit 10 also has a function of recording acquired data and calculation results and using them as data for new calculations.

[0090] The control unit 10 is connected to the substrate stage 2, controls the operation of the X-direction stage movement control unit 21 and the Y-direction stage movement control unit 22, and controls the in-plane movement of the adsorption stage 23. In addition, the control unit 10 controls the adsorption stage 23 to control the adsorption holding and release of the substrate S.

[0091] The control unit 10 is connected to the lifting unit 3 and has a function of controlling the position of the mounting head 4 in the up-down direction (Z direction) and controlling the pressure when the chip component C is pressure-bonded to the substrate S.

[0092] The control unit 10 is connected to the mounting head 4, and has the function of controlling the adsorption, holding and release of the chip component C by the accessory tool 42, the heating temperature of the heating unit 41, and the position of the head body 40 (and the heating unit 41, the accessory tool 42) in the XY plane through the tool position control unit 43.

[0093] The control unit 10 is connected to the recognition unit 5, and has a function of controlling the position of the image taking unit 50 in the horizontal direction (in the XY plane) and the vertical direction (Z direction), and controlling the camera unit 53 to obtain image data. Furthermore, the control unit 10 has an image processing function, and has a function of calculating the position of the substrate recognition mark AS and / or the tool recognition mark AT according to the relative position relationship between the substrate recognition mark AS and the tool recognition mark AT and the position information of the image taking unit 50 based on the position information of the image taking unit 50 and the image obtained by the camera unit 53.

[0094] The control unit 10 is connected to the chip transport unit 6 , and has a function of controlling the position of the chip slider 61 that moves along the transport rail 60 .

[0095] The control unit 10 is connected to the reflection light source 71 and has a function of controlling the presence or absence of light irradiation and the irradiation power.

[0096] Hereinafter, a process in which the mounting device 1 aligns the chip component with the mounting portion SC of the substrate S for mounting will be described. Prior to this, the substrate S is held on the substrate stage 2 of the mounting device 1 through a substrate holding process. Here, it is desirable that the configuration information of the substrate S relative to the suction table 23 of the substrate stage 2 is acquired by an image recognition unit or the like and stored in the control unit 10.

[0097] In addition, the chip component C is transported by the chip transport unit 6 and passes through a chip holding process held by the accessory tool 42. Here, the chip component C is held in the accessory tool 42 with a predetermined position accuracy when it is delivered to the chip slider 61 from the chip supply unit (not shown) and delivered from the chip slider 61 to the accessory tool 42.

[0098] Figure 4 1 is a diagram for explaining a process of obtaining the position information of the substrate recognition mark AS. Figure 4 In the embodiment, the reflecting light source 71 irradiates light having a wavelength that transmits the chip component C. Therefore, in Figure 4 In (a), the recognition unit 5 obtains an image of the light of the wavelength of the chip component C reflected on the surface of the substrate S and transmitted through the chip component C, and the position information of the first substrate recognition mark AS1 is obtained based on the image. In addition, by moving the recognition unit 5 horizontally, the position information of the second substrate recognition mark AS2 can also be obtained (similar to the first substrate recognition mark AS1). Through the above process, the configuration state of the substrate S (the mounting portion SC) can be determined.

[0099] Here, sometimes Figure 4 The position information of the chip identification mark AC is obtained in the state. Figure 4 In the case of (a), part of the light entering the chip component C is reflected on the lower surface of the chip, but if the reflectivity of the chip identification first mark AC1 is different from that of other parts, it can be observed simultaneously with the substrate identification first mark AS1. In particular, when the chip component C is brought close to the substrate S, if both the substrate identification first mark AS1 and the chip identification first mark AC1 are observed within the depth of field, accurate position information of the substrate identification first mark AS1 and the chip identification first mark AC1 can be obtained. Figure 4 The same is true for the substrate identification second mark AS2 and the chip identification second mark AC2 in (b), and it is also possible to Figure 4 (a) and Figure 4 The alignment is performed by the action shown in (b).

[0100] However, due to the influence of the insulating layer formed on the electrode surface of the chip component C having the chip identification mark AC, the contrast of the chip identification mark AC is low compared to the substrate identification mark AS, and it is sometimes difficult to identify even using image processing, and sometimes the position information cannot be obtained.

[0101] In such a case, it is necessary to obtain the position information of the chip identification mark AC by other methods. Figure 5 The mounting device 1001 of such a device structure obtains the position information of the chip identification mark AC. Figure 1 The mounting device 1 shown, Figure 5 The difference shown is that there is a transmission light source 72. Here, the transmission light source 72 emits light having a wavelength that transmits the chip component, similarly to the reflection light source 71. The transmission light source 72 is connected to the control unit 10 and is controlled by the control unit 10.

[0102] use Figure 6 A method for obtaining the position information of the chip identification mark using the transmission light source 72 will be described. Figure 6 (a) Figure 6 In (b), the substrate S is retracted from the bottom of the chip component C and the transmission light source 72 is arranged. In this state, the height of the mounting head 4 is Figure 4 The state shown is a state where the chip component C is close to the substrate S. When the recognition unit 5 acquires an image, the reflection light source 71 is not turned on, and the transmission light source 72 irradiates light toward the chip component C.

[0103] exist Figure 6 In the state (a), the recognition unit 5 can obtain a clear image of the chip recognition first mark AC1 from the image acquisition unit 50 using the light of the wavelength that transmits the chip component C, and the control unit 10 that has obtained the image information can obtain the position information of the chip recognition first mark AC1. Figure 6 In the state (b), the position information of the chip identification second mark AC2 can be obtained.

[0104] Here, as mentioned above, Figure 4 and Figure 6The chip component C is in a state close to the substrate S, so the position information of the substrate identification first mark AS1 and the chip identification first mark AC1, and the position information of the substrate identification second mark AS2 and the chip identification second mark AC2 under the same conditions can be obtained, and the position offset of the chip component C relative to the mounting portion SC of the substrate S can be calculated. Therefore, in order to correct the position offset, the position of at least one of the substrate stage 2 and the accessory tool 42 is adjusted to align the chip component C with the mounting portion SC, and then the mounting head 4 is lowered to make the chip component C close to the substrate S for mounting.

[0105] in addition, Figure 4 The position information of the substrate identification mark AS is obtained and Figure 6 The position information of the chip identification mark AC in the state of being obtained can be obtained by either method first, but it is necessary to move the substrate stage 2 in the horizontal direction, and sometimes the mounting head 4 needs to move up and down. Therefore, depending on the repeatability of the mechanism that moves the substrate stage 2 and the mounting head 4, the position offset of the chip component C relative to the mounting part SC will produce an error, and high-precision alignment cannot be guaranteed. In addition, the substrate stage 2 needs to be moved relatively significantly, and its movement time sometimes affects the production rhythm of the installation.

[0106] Figure 7 A modification 2 of the mounting device 1 is shown taking such a situation into consideration. Figure 7 In the mounting device 1002 shown, when the accessory tool 42 is separated from the substrate S and the chip component C is held by the chip slider 61, the transmission light source 72 arranged between the substrate S and the chip component C irradiates light toward the chip component C.

[0107] Specific status such as Figure 8 As shown, in the second modification, a tool identification mark AT is provided on the accessory tool 42. Here, a tool identification first mark AT1 and a tool identification second mark AT2 are added to the accessory tool 42 so that when the accessory tool 42 holds the chip component C, the tool identification first mark AT1 is located near the chip identification first mark AC1, and the tool identification second mark AT2 is located near the chip identification second mark AC2. It should be noted that the tool identification mark AT is drawn using a material with low transmittance (preferably higher reflectivity) to light of the wavelength of the transmitted chip component C included in the wavelength of the transmission light source 72.

[0108] exist Figure 8In the state (a), the recognition unit 5 can obtain the image of the chip recognition first mark AC1 and the tool recognition first mark AT1 by using the light of the wavelength that transmits the chip component C and the accessory tool 42 from the image acquisition unit 50, and the control unit 10 that has obtained the image information can obtain and store the relative position information of the chip recognition first mark AC1 and the tool recognition first mark AT1. Figure 8 In the state (b), the relative position information of the chip identification second mark AC2 and the tool identification second mark AT2 can be obtained and stored. As a result, the chip identification first mark AC1 and the chip identification second mark AC2 can be calculated based on the position information of the tool identification first mark AT1 and the tool identification second mark AT2.

[0109] Next, after the transmission light source 72 (and the chip slider 61) are retracted, Figure 4 Similarly, the chip component C is brought as close as possible to the substrate S but not in contact with the substrate S, and an image is acquired using the reflection light source 71. Fig. 9 This state is shown, but in Fig. 9 In, with Figure 4 In addition to the substrate identification mark AS, the tool identification mark AT is also observed. Fig. 9 In the embodiment, it is preferred that the substrate recognition mark AS and the tool recognition mark AT are located within the depth of field of the recognition unit 5 .

[0110] exist Fig. 9 In the state (a), the recognition unit 5 obtains the images of the substrate recognition mark AS1 and the tool recognition mark AT1 from the image input unit 50, and the control unit 10 that has obtained the image information obtains the relative position information of the substrate recognition first mark AS1 and the tool recognition first mark AT1. Since the relative position relationship between the chip recognition first mark AC1 and the tool recognition first mark AT1 is obtained first, the position information of the substrate recognition first mark AS1 and the chip recognition first mark AC1 can be calculated. Similarly, according to Fig. 9 By observing the state of (b), the position information of the second substrate identification mark AS2 and the second chip identification mark AC2 can be calculated.

[0111] In this way, the position information of the substrate recognition first mark AS1 and the chip recognition first mark AC1, as well as the position information of the substrate recognition second mark AS2 and the chip recognition second mark AC2 can be obtained, and the positional offset of the chip component C relative to the mounting portion SC of the substrate S can be calculated. Therefore, in order to correct the positional offset, the position of at least one of the substrate stage 2 and the accessory tool 42 is adjusted to align the chip component C with the mounting portion SC, and then the mounting head 4 is lowered to make the chip component C close to the substrate S for mounting.

[0112] In this modification 2, the relative positional relationship between the chip identification mark AC and the tool identification mark AT is independent of the distance between the accessory tool 42 and the substrate S, and the chip component C can be aligned in a state close to the substrate S, so that installation based on high-precision alignment with few error factors can be performed. In addition, the positional information of the chip identification mark AC and the tool identification mark AT can be obtained at the height position where the accessory tool 42 receives the chip component C from the chip slider 61, so there is no need to operate the substrate stage 2, and the impact on the production tact of installation is also small.

[0113] In addition, if the relative position of the image taking unit 50 with respect to the attachment 42 is Figure 8 (a) and Fig. 9 The same as in (a), then Figure 8 (a) and Fig. 9 In (a), the image can be obtained at the same position relative to the chip component C. Therefore, the same field of view and the same coordinate pair can be used to obtain the image. Figure 8 The position information of the chip identification first mark AC1 obtained and stored in the state (a) and Fig. 9 The position information of the substrate recognition first mark AS1 obtained in (a) is compared. Therefore, the position information of the tool recognition first mark AT1 is not required. Similarly, if the relative position of the image capture unit 50 to the attachment 42 is Figure 8 (b) and Fig. 9 However, in a device structure where an image taking unit 50 moves in the horizontal direction (in the XY plane) and in the vertical direction (in the Z direction) to obtain the position information of each identification mark, it is difficult to make the relative position of the image taking unit 50 with respect to the attachment 42 Figure 8 (a) and Fig. 9 (a) is completely consistent with ( Figure 8 (b) and Fig. 9 (b) is also the same), so it is preferred to obtain the relative position information of the chip identification mark AC and the substrate identification mark AS via the tool identification mark AT.

[0114] On the other hand, if the image capture unit 50 maintains (fixes) its relative position to the accessory tool 42 from acquiring the position information of the chip recognition mark AC to acquiring the position information of the substrate recognition mark AS, precise positioning can be performed without using the tool recognition mark AT.

[0115] An example of such a structure is Fig.10 The modification example 3 shown. Fig.10In the third variation, an image capture unit 501 for acquiring position information of the first chip identification mark AC1 and the first substrate identification mark AS1, and an image capture unit 502 for acquiring position information of the second chip identification mark AC2 and the second substrate identification mark AS2 are additionally provided. Fig.10 In the state (a), the transmission light source 721 is turned on, and the image is taken from the image taking unit 501 (not shown), and the image of the chip identification first mark AC1 is obtained by the camera unit 531. If the camera unit 531 is connected to the control unit 10, the position information of the chip identification first mark AC1 in the field of view of the camera unit 531 can be obtained and stored through the calculation processing of the control unit 10. Similarly, based on the image of the chip identification second mark AC2 taken from the image taking unit 502 (not shown) and obtained by the camera unit 532 by turning on the transmission light source 722, the position information of the chip identification second mark AC2 in the field of view of the camera unit 532 can be obtained and stored (through the control unit 10 connected to the camera unit 532).

[0116] After that, after the transmission light source 721 and the transmission light source 722 are retracted, the image taking section 501 and the image taking section 502 are maintained (fixed) relative to the head body 40 (and the accessory tool 42), and the chip component C is brought close to the substrate S. Fig.10 (b). Fig.10 In the state (b), the imaging unit 531 obtains the image of the substrate recognition first mark AS1 taken in from the image taking unit 501 by lighting the reflection light source 71 and transmitting the light of the wavelength of the chip component C, and obtains the position information of the substrate recognition first mark AS1 within the field of view of the imaging unit 531 through the control unit 10. Similarly, the imaging unit 532 obtains the image of the substrate recognition first mark AS1 taken in from the image taking unit 502, and obtains the position information of the substrate recognition second mark AS2 within the field of view of the imaging unit 532.

[0117] Therefore, based on the positional relationship between the chip identification first mark AC1 and the substrate identification first mark AS1 and the position information of the chip identification second mark AC2 and the substrate identification second mark AS2 obtained using the same field of view and the same coordinate system, the position offset of the chip component C relative to the substrate S (the rotation angle relative to the XY direction and the Z direction) is calculated, and the position of the accessory tool 42 can be corrected by correcting the position offset through the tool position control unit 43.

[0118] In addition, in the third variant, two camera units are provided, namely, the camera unit 531 for obtaining the position information of the chip identification first mark AC1 and the substrate identification first mark AS1 and the camera unit 532 for obtaining the position information of the chip identification second mark AC2 and the substrate identification second mark AS2. However, as long as the position information of the chip identification first mark AC1 and the substrate identification first mark AS1 and the position information of the chip identification second mark AC2 and the substrate identification second mark AS2 can be obtained with the accuracy required for alignment, the camera unit may be one. That is, in the fourth variant of the embodiment of the present invention, Fig.11 In the state (a), the transmission light source 72 is turned on, and the image is taken from the image taking unit 500 (not shown), and the camera unit 530 obtains the image of the chip identification first mark AC1 and the chip identification second mark AC2. The control unit 10 connected to the camera unit 530 obtains the position information of the chip identification first mark AC1 and the chip identification second mark AC2 and stores it. Then, after the transmission light source 72 is retracted, the image taking unit 500 is made to maintain (fix) the relative position with respect to the head body 40, and the chip component C is brought close to the substrate S. Fig.11 (b). Fig.11 In the state (b), by lighting the reflective light source 71 and transmitting light of the wavelength of the chip component C, the camera unit 530 obtains the image of the substrate identification first mark AS1 and the substrate identification second mark AS2 taken in from the image taking part 500, and the position information of the substrate identification first mark AS1 within the field of view of the camera unit 531 is obtained through the control part 10.

[0119] Next, based on the positional relationship between the chip identification first mark AC1 and the substrate identification first mark AS1 and the position information of the chip identification second mark AC2 and the substrate identification second mark AS2 obtained using the same field of view and the same coordinate system, the position offset (rotation angle relative to the XY direction and the Z direction) of the chip component C relative to the substrate S is calculated, and the position of the accessory tool 42 is adjusted by the tool position control unit 43 to correct the position offset.

[0120] In addition, if Fig.10 and Fig.11 As shown, as long as the image capture portion 50 of the recognition unit 5 is structured so that the relative position is maintained (fixed) relative to the accessory tool 42 from the time the position information of the chip recognition mark AC is obtained until the position information of the substrate recognition mark AS is obtained, the present invention can be implemented even in an apparatus structure in which the mounting head 4 moves greatly.

[0121] As an example, Fig.12 The figure shows a variation 5 of the embodiment. Fig.12 In the device structure, such as Fig.12As shown in (a), after the mounting head 4 picks up the chip component C from the wafer W, it moves to the substrate stage 2 ( Fig.12 (c)), the chip component C is mounted on the substrate S, but it can also be mounted in the middle of the movement of the mounting head 4 (such as Fig.12 (b)) configures a transmission light source 72 to obtain the position information of the chip identification mark AC. Then, Fig.12 The position information of the substrate identification mark AS is obtained in the state (c), but if the relative position of the identification unit 5 (image taking part 50) and the accessory tool 42 is maintained during the movement, the position information of the chip identification mark AC and the substrate identification mark AS can be directly compared using the same coordinate.

[0122] In addition, the present invention is Fig.18 The substrate identification mark AS shown in FIG. 1 is particularly effective when the chip component C is covered by the substrate identification mark AS. Fig.13 The substrate identification mark AS shown is also effective when it is not covered by the substrate. That is, an image of the chip identification mark AC that is transmitted through the chip component C can be obtained, so there is no need Fig.16 The chip position identification unit 8 is shown.

[0123] Description of Reference Numerals

[0124] 1 Installation

[0125] 2 substrate carrier

[0126] 3 Lifting unit

[0127] 4 Mounting head

[0128] 5 Identification Unit

[0129] 6 Chip handling unit

[0130] 7 Light Source

[0131] 10. Control Unit

[0132] 20 Stage movement control unit

[0133] 21 X-direction stage movement control unit

[0134] 22 Y-direction stage movement control unit

[0135] 23 Adsorption workbench

[0136] 40 head body

[0137] 41 Heating unit

[0138] 42 Accessory Tools

[0139] 43 Tool Position Control Unit

[0140] 50 Image acquisition unit

[0141] 52 Light Path

[0142] 53 Camera Unit

[0143] 60 Transport track

[0144] 61 Chip Slider

[0145] 71 Reflection light source

[0146] 72 Transmission light source

[0147] AC, AC1, AC2 chip identification mark

[0148] AS, AS1, AS2 substrate identification mark

[0149] AT, AT1, AT2 tool identification mark

[0150] C Chip Components

[0151] S substrate

[0152] SC (chip component) mounting area

Claims

1. A mounting device, which mounts a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment so that the surface having the chip identification mark faces the surface having the substrate identification mark and the substrate identification mark is covered by the chip component, wherein: The mounting device comprises: an accessory tool that holds the side of the chip component opposite to the side having the chip identification mark; a substrate stage that holds the substrate; a reflection light source for irradiating light including a wavelength that transmits the chip component from the accessory tool side toward the surface of the substrate; as well as a recognition unit that recognizes the reflected light of the light irradiated by the reflection light source, The recognition unit acquires an image based on light that passes through the chip component and is reflected by the substrate, thereby acquiring position information of the substrate recognition mark.

2. The mounting device according to claim 1, wherein: The recognition unit obtains an image based on light irradiated from the reflection light source, transmitted through the chip component and reflected from the surface of the chip component having the chip recognition mark, and obtains position information of the chip recognition mark. The substrate and the chip are aligned using the position information of the substrate recognition mark and the position information of the chip recognition mark.

3. The mounting device according to claim 1, wherein: The mounting device further includes a transmission light source, which is disposed on the lower side of the chip component and irradiates light including a wavelength that transmits the chip component toward the chip component. The recognition unit obtains an image based on the light of the wavelength irradiated from the transmission light source and transmitted through the chip component, and obtains the position information of the chip recognition mark. The substrate and the chip are aligned using the position information of the substrate recognition mark and the position information of the chip recognition mark.

4. The mounting device according to claim 3, wherein: After the recognition unit obtains the position information of the chip recognition mark, the accessory tool is moved toward the substrate stage. The position information of the substrate recognition mark is acquired in a state where the chip component is brought close to the substrate so that the substrate recognition mark enters within the depth of field of the recognition unit.

5. The mounting device according to claim 4, wherein: From the time when the position information of the chip recognition mark is acquired until the time when the position information of the substrate recognition mark is acquired, the relative position of the recognition unit with respect to the attachment tool is maintained.

6. The mounting device according to claim 1, wherein: The accessory tool has a tool identification mark, The mounting device further includes a transmission light source, which irradiates light including a wavelength that transmits the chip component toward the chip component from the lower side of the chip component. After the recognition unit obtains the position information of the chip recognition mark and the position information of the tool recognition mark based on an image based on the wavelength of light irradiated from the transmission light source and transmitted through the chip component and the accessory tool, The recognition unit obtains the position information of the substrate recognition mark and the position information of the tool recognition mark based on an image based on the wavelength of light irradiated from the reflection light source, reflected on the substrate and transmitted through the chip component and the accessory tool, The relative position information with respect to the tool recognition mark is used to obtain the positional relationship between the substrate recognition mark and the chip recognition mark, and the substrate and the chip are aligned.

7. The mounting device according to claim 6, wherein: The position information of the substrate recognition mark and the position information of the tool recognition mark are acquired in a state where the chip component is brought close to the substrate so that both the substrate recognition mark and the tool recognition mark are within the depth of field of the recognition unit.

Images