Wavelength measurement device, data processing device, wavelength measurement method, and program

Abstract

Provided are a wavelength measurement device, a data processing device, a wavelength measurement method, and a program, with which it is possible to contribute to a reduction in measurement time and efficient measurement when a representative wavelength of each light-emitting element chip is measured by exciting light emission of a plurality of light-emitting element chips included in an object to be measured. The present invention is provided with: a unit (3) that disperses light emitted by excitation of light-emitting element chips (101) from a plurality of microsites in a one-dimensional direction of an object to be measured (100) having the plurality of light-emitting element chips (101); a means (300) for scanning at least one of the spectroscopic means and the object to be measured in a direction perpendicular to the one-dimensional direction; a means (5) for receiving the split light of each minute part during each scanning; a means for specifying the position of the light-emitting element chip on an image comprising the light-receiving data for each minute part obtained by the light-receiving means, on the basis of the reference position of the position of the light-emitting element chip with respect to the object to be measured and the scanning amount; and a calculation means (6) for calculating the representative wavelength of the light-emitting element chip on the basis of the received light data corresponding to the specified position of the light-emitting element chip.

Description

Technical Field

[0001] The present invention relates to a wavelength measuring device, a data processing device, a wavelength measuring method and a program for measuring each representative wavelength of a light emitting element chip such as a plurality of LED chips included in a measurement object. Background Art

[0002] For example, the color hue deviation of the backlight LED used in displays such as televisions causes uneven color on the display and other reasons for image quality degradation. Therefore, the luminous color is strictly managed. Therefore, a process called merging is performed to measure the wavelength of each LED chip and classify them by color.

[0003] Conventionally, the wavelength measurement of LED chips in such binning is performed as follows: LED chips larger than 100 μm on one side are powered on and emit light using a probe, and binning is performed using a point spectrometer.

[0004] However, as the size of the LED chip decreases, such as a micro LED chip with a side of 100 μm or less, a larger number of LED chips need to be measured, and thus, it takes time to measure each chip, which is not efficient.

[0005] Furthermore, when measuring on a wafer, if the size of the LED chip is reduced, a plurality of LED chips are included in the measurement area of ​​the point spectrometer, so there is also a problem that high-precision measurement cannot be performed.

[0006] Therefore, the applicant proposed the following technology in Patent Document 1, using a measuring device having multiple light receiving parts to measure the representative wavelengths of multiple LED chips that are stimulated to emit light in a wafer state. Specifically, the light receiving data is separated into data groups corresponding to each LED chip. Next, the representative wavelength of the LED chip is obtained based on the data groups corresponding to each LED chip.

[0007] Patent document 1: International Publication No. WO2022 / 097726.

[0008] However, in the technology described in Patent Document 1, the light receiving data is separated into data groups corresponding to the respective LED chips. Therefore, in the entire data area, the bright area in the image is extracted by image analysis. Therefore, sufficient resolution is required to distinguish the LED elements in image processing, the field of view becomes narrow, and there is a problem that the measurement takes a lot of time. Summary of the invention

[0009] The object of the present invention is to provide a wavelength measuring device, a data processing device, a wavelength measuring method and a program, which can help shorten the measurement time and perform efficient measurement when stimulating multiple light-emitting element chips included in a measurement object to emit light and measuring the representative wavelength of each light-emitting element chip.

[0010] The above objects are achieved by the following units.

[0011] (1) A wavelength measuring device comprising:

[0012] A spectroscopic unit for spectroscopically spectroscopically emitting light when the light emitting element chip is excited, wherein the light is emitted from a plurality of tiny parts in a one-dimensional direction of a measurement object having a plurality of light emitting element chips; a scanning unit for scanning at least one of the spectroscopic unit or the measurement object in a direction perpendicular to the one-dimensional direction;

[0013] A light receiving unit receives light from each of the microscopic parts split by the light splitting unit each time the scanning unit scans;

[0014] a determination unit that determines the position of the light emitting element chip on an image composed of light receiving data of each microscopic portion obtained by the light receiving unit based on the reference position of the light emitting element chip relative to the measurement object and the scanning amount of the scanning unit; and

[0015] The calculation unit calculates a representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined by the determination unit.

[0016] (2) A wavelength measuring device according to the preceding item 1, wherein a representative wavelength of the light-emitting element chip is calculated based on an average value of a plurality of light-receiving data, wherein the plurality of light-receiving data includes light-receiving data corresponding to the position of the light-emitting element chip determined by the determination unit and one or more light-receiving data surrounding the light-emitting element chip.

[0017] (3) The wavelength measuring device according to item 1 or 2 above, wherein the representative wavelength is a luminescence peak wavelength or a centroid wavelength.

[0018] (4) The wavelength measurement device according to the above item 1 or 2, further comprising a light source unit that excites the light emitting element chip to cause the light emitting element chip to emit light.

[0019] (5) A wavelength measuring device according to the preceding item 1 or 2, wherein the result of a rough measurement in which the scanning speed of the scanning unit is relatively accelerated is that in an area where the representative wavelength of the light-emitting element chip calculated by the calculation unit or a characteristic value other than the representative wavelength exceeds a prescribed value, a detailed measurement is performed by relatively slowing down the scanning speed of the scanning unit.

[0020] (6) A wavelength measuring device according to the preceding item 1 or 2, wherein the spectroscopic unit spectroscopically separates the light emitted by the light-emitting element chip when it is excited and passes through the objective lens, and the magnification of the objective lens is variable, so that a coarse measurement can be performed by setting the objective lens to a low magnification and a detailed measurement can be performed by setting the objective lens to a high magnification.

[0021] (7) The wavelength measurement device according to the above item 5, wherein the rough measurement and the detailed measurement are continuously performed in the same measurement area.

[0022] (8) The wavelength measurement device according to the above item 5, wherein an image is generated for aligning the measurement data obtained by the rough measurement and the measurement data obtained by the detailed measurement.

[0023] (9) The wavelength measurement device according to the above item 1 or 2, wherein the calculation unit outputs the characteristic value including the calculated representative wavelength of the light emitting element chip in association with the light emitting element chip.

[0024] (10) The wavelength measurement device according to item 5 above, wherein the scanning speed in the rough measurement and the detailed measurement is determined in accordance with the size of the light emitting element chip.

[0025] (11) The wavelength measuring device according to item 6 above, wherein the magnification of the objective lens in the rough measurement and the detailed measurement is determined in accordance with the size of the light emitting element chip.

[0026] (12) The wavelength measuring device according to the above item 5, wherein the range for detailed measurement is set in advance.

[0027] (13) A data processing device, wherein:

[0028] Hyperspectral devices have:

[0029] A spectroscopic unit for spectroscopically spectroscopically emitting light when the light emitting element chip is excited, the light being light from a plurality of minute locations in a one-dimensional direction of a measurement object having a plurality of light emitting element chips;

[0030] a scanning unit configured to scan at least one of the spectroscopic unit or the object to be measured in a direction perpendicular to the one-dimensional direction; and

[0031] The light receiving unit receives the light of each of the microscopic parts split by the light splitting unit each time the scanning unit scans.

[0032] The data processing device comprises:

[0033] a determination unit that determines the position of the light emitting element chip based on the reference position of the light emitting element chip relative to the measurement object and the scanning amount of the scanning unit on an image composed of the light receiving data of each microscopic part obtained by the light receiving unit of the hyperspectral device; and

[0034] The calculation unit calculates a representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined by the determination unit.

[0035] (14) A data processing device according to the preceding item 13, wherein a representative wavelength of a light-emitting element chip is calculated based on an average value of a plurality of light-receiving data, wherein the plurality of light-receiving data includes light-receiving data corresponding to a position of the light-emitting element chip determined by the determination unit and one or more light-receiving data surrounding the position of the light-emitting element chip.

[0036] (15) A data processing device according to item 13 or 14 above, wherein the representative wavelength is a luminescence peak wavelength or a centroid wavelength.

[0037] (16) A data processing device according to the preceding item 13 or 14, wherein the control unit is provided with a control unit for making the above-mentioned hyperspectral device undergo a rough measurement by relatively accelerating the scanning speed of the above-mentioned scanning unit, and the result of the rough measurement is as follows: in an area where the representative wavelength of the light-emitting element chip or a characteristic value other than the representative wavelength calculated by the above-mentioned calculation unit exceeds a prescribed value, a detailed measurement is performed on the above-mentioned hyperspectral device by relatively slowing down the scanning speed of the above-mentioned scanning unit.

[0038] (17) A data processing device according to item 13 or 14, wherein the spectroscopic unit spectroscopically separates the light emitted by the light-emitting element chip when it is excited and transmitted through the objective lens, and the magnification of the objective lens is variable.

[0039] The hyperspectral device can be used to perform rough measurement by setting the objective lens to a low magnification and detailed measurement by setting the objective lens to a high magnification.

[0040] (18) The data processing device according to item 16 above, wherein the control unit continuously performs the rough measurement and the detailed measurement in the same measurement area.

[0041] (19) The data processing device according to the above item 16, further comprising an image generating unit that generates an image for aligning the measurement data obtained by the rough measurement with the measurement data obtained by the detailed measurement.

[0042] (20) The data processing device according to item 13 or 14, wherein the calculation unit outputs the characteristic value including the calculated representative wavelength of the light-emitting element chip in association with the light-emitting element chip.

[0043] (21) A wavelength measurement method, comprising:

[0044] A step of performing a spectroscopic step of spectroscopically spectroscopically spectroscopically the light from a plurality of microscopic locations in a one-dimensional direction of a measurement object having a plurality of light-emitting element chips and the light emitted by the light-emitting element chips when the light-emitting element chips are excited;

[0045] A scanning step of scanning at least one of the spectroscopic unit or the measurement object in a direction perpendicular to the one-dimensional direction;

[0046] a light receiving step, each time scanning is performed by the scanning step, using a light receiving unit to receive light from each of the above-mentioned microscopic locations split by the above-mentioned splitting step;

[0047] a determination step of determining the position of the light emitting element chip on an image composed of light receiving data of each microscopic part obtained by the light receiving unit based on the position of the light emitting element chip relative to the reference position of the object to be measured and the scanning amount of the scanning unit; and

[0048] The calculation step calculates the representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined in the determination step.

[0049] (22) A program, wherein:

[0050] Hyperspectral devices have:

[0051] A spectroscopic unit for spectroscopically spectroscopically detecting light from a plurality of minute locations in a one-dimensional direction of a measurement object having a plurality of light-emitting element chips and light emitted by the light-emitting element chips when the light-emitting element chips are excited;

[0052] a scanning unit configured to scan at least one of the spectroscopic unit or the object to be measured in a direction perpendicular to the one-dimensional direction; and

[0053] The light receiving unit receives the light of each of the microscopic parts split by the light splitting unit each time the scanning unit scans.

[0054] Make the computer perform the following steps:

[0055] A determination step of determining the position of the light emitting element chip based on the position of the light emitting element chip relative to the reference position of the object to be measured and the scanning amount of the scanning unit on an image composed of the light receiving data of each microscopic part obtained by the light receiving unit of the hyperspectral device; and

[0056] The calculation step calculates the representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined in the determination step.

[0057] According to the invention described in the preceding item (1), light from a plurality of tiny portions in a one-dimensional direction of a measurement object having a plurality of light-emitting element chips and light emitted by the light-emitting element chips when excited is split by a spectroscopic unit. At least one of the spectroscopic unit or the measurement object is scanned in a direction perpendicular to the one-dimensional direction. During each scan, light from each tiny portion split by the spectroscopic unit is received by a light receiving unit.

[0058] Based on the reference position of the light emitting element chip relative to the object to be measured and the scanning amount of the scanning unit, the position of the light emitting element chip is determined on the image composed of the light receiving data of each microscopic part obtained by the light receiving unit. Furthermore, the representative wavelength of the light emitting element chip is calculated based on the light receiving data corresponding to the determined position of the light emitting element chip.

[0059] In this way, the position of the light-emitting element chip is determined on the image composed of the light-receiving data of each tiny part based on the position of the light-emitting element chip relative to the reference position of the measured object and the scanning amount of the scanning unit. The representative wavelength of the light-emitting element chip is calculated based on the light-receiving data corresponding to the determined position. Therefore, it is not necessary to extract the bright area in the image through image analysis in all the measurement data areas in order to separate the light-receiving data into data groups corresponding to each LED chip as in the past. Therefore, image processing with sufficient resolution is not required, and high-speed scanning can be performed. Therefore, the measurement time can be shortened and efficient measurement can be performed.

[0060] According to the invention described in the preceding item (2), the representative wavelength of the light emitting element chip is calculated based on the average value of a plurality of light receiving data, the plurality of light receiving data including the light receiving data corresponding to the position of the light emitting element chip determined by the determining unit and one or more light receiving data around it. Therefore, compared with the case where the representative wavelength is calculated using only one light receiving data corresponding to the determined position of the light emitting element chip, the representative wavelength can be obtained with high accuracy.

[0061] According to the invention described in the aforementioned item (3), it is possible to efficiently obtain the emission peak wavelength or the center of gravity wavelength.

[0062] According to the invention described in the aforementioned item (4), the light emitting element chip can be excited to emit light by the light source unit.

[0063] According to the invention described in the preceding item (5), the result of the rough measurement with a relatively faster scanning speed is that the representative wavelength of the calculated light-emitting element chip or the area where the characteristic value other than the representative wavelength exceeds the specified value is measured in detail with a relatively slower scanning speed. Therefore, it is possible to achieve both high measurement accuracy and good measurement efficiency.

[0064] According to the invention described in the aforementioned item (6), it is possible to perform rough measurement by setting the variable magnification objective lens to a low magnification and detailed measurement by setting it to a high magnification.

[0065] According to the invention described in the preceding item (7), since the rough measurement and the detailed measurement are continuously performed in the same measurement area, it is possible to perform measurement with high position reproducibility. Thus, it is possible to link the measurement data based on the rough measurement with the measurement data based on the detailed measurement with a smaller error.

[0066] According to the invention described in the above item (8), an image for aligning the measurement data obtained by the rough measurement and the measurement data obtained by the detailed measurement is generated. Therefore, the positional deviation of the measurement data can be prevented using this image.

[0067] According to the invention described in the above item (9), the characteristic value including the representative wavelength of the light emitting element chip calculated by the calculation unit is output in association with the light emitting element chip. Therefore, for example, it is possible to store the characteristic value while maintaining the association.

[0068] According to the invention described in the aforementioned item (10), the scanning speed in the rough measurement and the detailed measurement can be determined to an appropriate speed in accordance with the size of the light emitting element chip.

[0069] According to the invention described in the aforementioned item (11), the magnification of the objective lens in the rough measurement and the detailed measurement can be determined to be an appropriate magnification in accordance with the size of the light emitting element chip.

[0070] According to the invention described in the aforementioned item (12), detailed measurement is performed within a preset range.

[0071] According to the invention described in the preceding item (13), the data processing device determines the position of the light emitting element chip on the image composed of the light receiving data of each microscopic part obtained by the hyperspectral device. The representative wavelength of the light emitting element chip is calculated based on the light receiving data corresponding to the determined position of the light emitting element chip. Therefore, the hyperspectral device can be scanned at a high speed, and the measurement time can be shortened to perform efficient measurement.

[0072] According to the invention described in the above item (14), the representative wavelength can be obtained with higher accuracy compared to the case where the representative wavelength is calculated using only one piece of light reception data corresponding to the identified position of the light emitting element chip.

[0073] According to the invention described in the preceding item (15), the data processing device can efficiently obtain the emission peak wavelength or the centroid wavelength.

[0074] According to the invention described in the preceding item (16), the data processing device performs a rough measurement by relatively increasing the scanning speed of the hyperspectral device in the area of ​​the measurement object where the representative wavelength or characteristic values ​​other than the representative wavelength of the light-emitting element chip being calculated do not exceed the prescribed value. In the area of ​​the measurement object where the characteristic values ​​exceed the prescribed value, the scanning speed of the scanning unit is relatively slowed down for detailed measurement.

[0075] According to the invention described in the aforementioned item (17), the data processing device can perform rough measurement with the objective lens set to a low magnification and detailed measurement with the objective lens set to a high magnification.

[0076] According to the invention described in the aforementioned item (18), the data processing device continuously performs the rough measurement and the detailed measurement in the same measurement area.

[0077] According to the invention described in the above item (19), the data processing device can generate an image for aligning the measurement data obtained by the rough measurement with the measurement data obtained by the detailed measurement, and can use this image to correct the positional deviation of the measurement data.

[0078] According to the invention described in the aforementioned item (20), the data processing device can output the characteristic value including the calculated representative wavelength of the light emitting element chip in association with the light emitting element chip.

[0079] According to the invention described in the preceding item (21), the position of the light emitting element chip is determined on an image consisting of light receiving data of each tiny part obtained by the light receiving unit based on the position of the light emitting element chip relative to the reference position of the measured object and the scanning amount of the scanning unit. The representative wavelength of the light emitting element chip is calculated based on the light receiving data corresponding to the determined position of the light emitting element chip. Therefore, it is not necessary to extract the bright area in the image by image analysis in all the measurement data areas in order to separate the light receiving data into data groups corresponding to each LED chip as in the past. Therefore, high-speed scanning can be performed, so that the measurement time can be shortened and efficient measurement can be performed.

[0080] According to the invention described in the preceding item (22), a computer determines the position of a light-emitting element chip on an image formed by light-receiving data of each microscopic part obtained by a hyperspectral device, and enables the computer to perform the following processing: based on the light-receiving data corresponding to the determined position of the light-emitting element chip, a representative wavelength of the light-emitting element chip is calculated. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Figure 1 This is a block diagram showing the structure of a wavelength measurement device according to one embodiment of the present invention.

[0082] Figure 2 Yes means Figure 1 A three-dimensional diagram showing the specific structure of a part of the wavelength measurement device.

[0083] Figure 3 This is a diagram showing the relationship between a plurality of light emitting element chips on a measurement object and an image obtained by a light receiving unit.

[0084] Figure 4 (A) is a schematic top view of a wafer as a measurement object. Figure 4 (B) is composed of Figure 4 Detailed view of the portion surrounded by the dashed-dotted line in (A).

[0085] Figure 5 (A) is a spectrum graph for explaining a method of obtaining a peak wavelength using one light receiving data for each wavelength. Figure 5 (B) is a spectrum graph for explaining a method of obtaining a peak wavelength using an average value of nine light receiving data for each wavelength.

[0086] Figure 6 This is a diagram for explaining a method of obtaining a peak wavelength using an average value of nine light receiving data.

[0087] Figure 7 This is an explanatory diagram of a case where the representative wavelength of the light emitting element chip deviates beyond the limit value.

[0088] Figure 8 (A) is a diagram schematically showing the magnitude of output resolution during rough measurement. Figure 8 (B) is a diagram schematically showing the magnitude of output resolution during detailed measurement. Figure 8 (C) is a diagram schematically showing the comparison between the size of a light-emitting element chip and the output resolution when measured in detail.

[0089] Fig. 9 This is a diagram for explaining a measurement method for a measurement object having a wide measurement range.

[0090] Fig.10 This is an explanatory diagram regarding the alignment of measurement data obtained by rough measurement and measurement data obtained by detailed measurement.

[0091] Fig.11 It is a diagram for explaining the state after the same alignment. DETAILED DESCRIPTION

[0092] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0093] Figure 1 This is a block diagram showing the structure of a wavelength measurement device according to an embodiment of the present invention. In this embodiment, a case where the light emitting element chip is an LED (light emitting diode) chip and the measurement object is a wafer 100 on which a plurality of LED chips are formed is described.

[0094] Figure 1 The wavelength measuring device shown in the figure comprises an excitation light source 1, an objective lens 2 whose magnification can be changed, a spectroscopic unit 3, and an imaging lens 4. The wavelength measuring device further comprises an area sensor 5 which is a two-dimensional imaging element constituted by a CCD sensor or the like, a computing unit 6, an HSI control unit 7, a measurement result display unit 8 constituted by a liquid crystal display device or the like, a storage unit 9, and the like.

[0095] The objective lens 2, the spectroscopic unit 3, the imaging lens 4, and the area sensor 5 constitute a part of a hyperspectral device (HSI device), that is, an HSI system 10. In addition, the computing unit 6, the HSI control unit 7, the measurement result display unit 8, and the storage unit 9 are constituted by a data processing device, that is, a personal computer (hereinafter, also referred to as PC) 20.

[0096] The excitation light source 1 irradiates the multiple LED chips on the wafer 100 with excitation light, and excites the multiple LED chips to emit light. Regarding the wafer that manufactures LED chips through the process, the emission spectrum of the LED chips can be efficiently checked by PL (PhotoLuminescence) excitation to excite the emission compared to power on. For example, if the LED lighting has a wavelength of 340nm, it is suitable to excite the 455nm blue LED chip and the 550nm green LED chip to emit light. In addition, if the LED lighting has a wavelength of 500nm, it is suitable to excite the 640nm red LED chip to emit light. By strengthening the PL emission intensity, the exposure time can be shortened. The PL excitation light source is expected to have a large output, and preferably an LED lighting that can emit light efficiently. Laser-based excitation is also possible.

[0097] In the present embodiment, object lens 2 can for example carry out the magnification change between 3 times and 5 times.Expect the automatic variable of the control based on HSI control unit 7.As described later, by changing to higher magnification after the coarse measurement of low magnification, wavelength distribution can be determined more meticulously.Therefore, the region of the fluctuation of the change of luminous wavelength can be measured in detail.In addition, preferably object lens 2 carries out white correction and wavelength correction under the state that is installed in wavelength measuring device.

[0098] The spectroscopic unit 3 separates the light from each LED chip transmitted through the objective lens 2 into each wavelength. The imaging lens 4 forms an image of the light of each wavelength separated by the spectroscopic unit 3 on the area sensor 5. In this embodiment, the light is separated into each wavelength at a wavelength pitch of 5 nm.

[0099] The area sensor 5 is equivalent to the light receiving unit. Figure 2 As shown, the area sensor 5 includes a plurality of pixels 51 arranged vertically and horizontally. Figure 2 The Y direction of the area sensor 5 means the lateral direction of the physical space. Each lateral pixel 51 corresponds to a plurality of microscopic parts in the lateral direction (one-dimensional direction) of the wafer 100. The length of the area sensor 5 in the Y direction is, for example, 10 mm, and has 1024 pixels (measurement pixels).

[0100] On the other hand, the longitudinal direction ( Figure 2 The brightness (intensity) of each wavelength of light (in the Z direction) corresponds to that of the horizontal pixel column. That is, each pixel 51 of the horizontal pixel column corresponds to a plurality of tiny parts in the one-dimensional direction of the chip 100. Light emitted from each tiny part and decomposed (spectroscopy) by wavelength is received by each pixel 51 of the vertical pixel column. Therefore, in order to perform spectroscopic measurement on each area in the two-dimensional direction (plane) of the chip 100, it is necessary to keep the chip 100 in the same direction as the horizontal pixel column. Figure 2 Alternatively, the light splitting unit 3 may be moved sideways without moving the chip 100. Figure 2 Alternatively, the chip 100 and the spectrometer 3 side may be moved with a speed difference. In short, as long as at least one of the chip 100 and the spectrometer 3 side is moved relative to the other Figure 2 Just move relatively in the Z direction.

[0101] In this embodiment, a moving device 300 is provided as a device for moving the wafer 100. Figure 1As shown, the moving device 300 can move the worktable 200 on which the wafer 100 is placed in the Z direction. The moving device 300 also constitutes a part of the HSI camera 10. The HSI control unit 7 of the data processing device 20 controls the movement direction, movement amount (scanning amount), movement speed (scanning speed) of the moving device 300, or the operation of the HSI system 10 such as the magnification change of the objective lens 2. In this embodiment, the movement speed (scanning speed) of the moving device 300 is variable between 20 mm / sec and 3 mm / sec.

[0102] The HSI system 10 itself is known, which divides the plane of the wafer 100 into microscopic portions of sizes corresponding to the pixels 51 of the area sensor 5 , splits the light from the microscopic portions, and receives the light at the pixels 51 of the area sensor 5 .

[0103] The electrical signals output from each pixel 51 of the area sensor 5 , namely, light receiving data (image data), are converted into digital signals by a current / voltage (IV) conversion circuit or an analog / digital (AD) conversion circuit (not shown) as necessary, and sent to the calculation unit 6 .

[0104] The calculation unit 6 includes a position determination unit 61 and an image generation unit 62. The position determination unit 61 determines the positions of the plurality of LED chips on an image formed by light receiving data sent from the area sensor 5 as described later. The image generation unit 62 generates an image in which the measurement data obtained by the rough measurement is linked with the measurement data obtained by the detailed measurement as described later. The calculation unit 6 calculates representative wavelengths for the plurality of LED chips using the light receiving data corresponding to the determined positions of the LED chips. Details of the determination of the positions of the LED chips on the image and the calculation method of the representative wavelength will be described later.

[0105] The measurement result display unit 8 displays the calculation result by the calculation unit 6. In addition, the calculation unit 6 may convert the light receiving data output from the area sensor 5 into a digital signal.

[0106] The storage unit 9 stores in advance the position information of each LED chip on the wafer 100 to be measured. The storage unit 9 also stores the representative wavelength and other characteristic values ​​of each LED chip to be measured. The storage unit 9 also stores various data required for the program required to start the operation of the wavelength measurement device.

[0107] The calculation unit 6 is composed of the personal computer 20 as described above, but it may also be a dedicated device. In addition, the light receiving data output from the area sensor 5 and processed into a digital signal may also be sent to the calculation unit 6 via the network. In this case, even if the calculation unit 6 is located at a place far away from the measurement site, the representative wavelength of the LED chip can be measured.

[0108] Figure 3 4 is a diagram for explaining the relationship between the plurality of LED chips 101 on the wafer 100 and the image 400 obtained by the area sensor 5. The horizontal axis of the image 400 is Figure 2 The vertical axis is the spatial X direction generated by scanning the LED chip 101 in the wavelength Z direction. The size of one grating is one pixel 401 in the image 400. One pixel 401 corresponds to the size of the pixel 51 of the area sensor 5 and also corresponds to the size of a tiny part. Figure 3 In the following description, the pixel 51 of the area sensor 5 is also referred to as the sensor pixel 51. The pixel 401 on the image is also referred to as the image pixel 401.

[0109] The LED chips 101 are shown in rectangular shapes, and are arranged vertically and horizontally on the wafer 100. The rectangular regions directly serve as the light-emitting surfaces of the LED chips 101.

[0110] For the light-emitting surface of one LED chip 101, the arrangement pitch of the LED chip 101, the pitch of the sensor pixels 51, the magnification of the objective lens 2, etc. are set so that the light receiving data can be obtained by the multiple sensor pixels 51 to form multiple image pixels 401. That is, for the light-emitting surface of one LED chip 101, the arrangement pitch, etc. are set so that the light emitted from multiple tiny parts is received by the corresponding multiple sensor pixels 51 to obtain multiple image pixels 401. In this embodiment, it is set so that the light from the light-emitting surface of one LED chip 101 can be received by more than 3×3=9 sensor pixels 51 to obtain more than 9 image pixels 401.

[0111] Next, through Figure 1 A method for measuring the representative wavelength of each LED chip 101 on the wafer 100 using the wavelength measuring apparatus shown will be described.

[0112] Figure 4 (A) is a schematic top view showing a portion of the wafer 100. Figure 4 Figure (B) is composed of Figure 4 This is an enlarged view of the portion surrounded by the dashed line in (A).

[0113] As shown by the black rectangles in the figure, a plurality of alignment marks 102 are formed on the wafer 100. Figure 4The LED chip 101 is omitted in (A). Each LED chip 101 is aligned with these alignment marks 102 as a reference. That is, the position (center position) of each LED chip 101 when any alignment mark 102 among the plurality of alignment marks 102 is used as a reference is known in advance as a design value. Therefore, information on the position of each LED chip 101 is obtained, for example, the relationship between the reference position and the position of each LED chip 101 is pre-stored in the storage unit 9. In addition, other marks on the chip 100 may be used as a reference instead of the alignment mark 102.

[0114] The light emitted from the tiny part of each LED chip 101 and split is received by the sensor pixel 51 and output as the light receiving data of each wavelength. Therefore, for example, the measurement is started from the reference position on the wafer 100, and the position of each LED chip 101 is determined on the image 200 based on the position of the LED chip 101 and the movement amount (scanning amount) of the moving device 300. In addition, the image pixel 401 corresponding to the position of each LED chip 101 is determined.

[0115] Then, the representative wavelength is calculated by the calculation unit 6 using the light receiving data of each wavelength in the determined image pixel 401. As an example of the calculation, in particular, when the wavelength interval is small, it is performed as follows. That is, the wavelength of the light receiving data with the maximum value (brightest) in the spectral data (brightness data at the wavelength) of each wavelength in the determined image pixel 401 is set as the representative wavelength (light emission peak wavelength) of the LED chip 101.

[0116] In addition, when the wavelength spacing is large, such as Figure 5 As shown in (A), a spectrum chart is prepared based on the spectrum data of each wavelength. In addition, a fitting curve F can be obtained from the spectrum chart by Gaussian fitting or the like, and the wavelength of the peak of the fitting curve F can be used as a representative wavelength.

[0117] In addition, the emission wavelength of the LED chip 101 has a stable variation distribution of several nm (1 to 5 nm) throughout the entire chip 100. Therefore, compared with using only the light receiving data in one image pixel corresponding to the position of the LED chip 101, by averaging the light receiving data of multiple image pixels including the image pixel and one or more image pixels around it, an output result with a higher SN can be obtained.

[0118] exist Figure 6 A specific example is shown in FIG. Assume that an image pixel 410 corresponding to the position of the LED chip 101 is determined on the image 400. After the determination, the light receiving data of the image pixel 410 and one or more image pixels 411 to 418 around it are averaged for each wavelength to obtain the spectrum data of the wavelength. Figure 6In the example of FIG. 4 , the light receiving data of the image pixel 410 and the eight image pixels 411 to 418 surrounding the image pixel 410, which is a total of nine image pixels 410 to 418, are averaged.

[0119] When the wavelength interval is small, the wavelength of the data with the largest value in the averaged spectrum data of each wavelength can be set as the representative wavelength (peak wavelength of light emission) of the LED chip 101. Figure 5 As shown in (B), a spectrum chart is prepared based on the averaged spectrum data of each wavelength. In the prepared spectrum chart, a fitting curve F may be obtained by Gaussian fitting or the like, and the wavelength of the peak of the fitting curve F may be used as a representative wavelength.

[0120] In this way, by averaging the light receiving data of the plurality of image pixels 410 to 418 including the image pixel 410 identified as the position of the LED chip 101 , it is possible to obtain an effect of reducing measurement noise.

[0121] In the above example, the average value of nine image pixels 410 to 418 is used. However, it may be the average value of four image pixels in total, namely, image pixel 410 and surrounding three image pixels 412 to 414. It may be a plurality of average values ​​other than nine or four.

[0122] In addition, the representative wavelength of the LED chip 101 is not limited to the peak wavelength of light emission, and may also be a centroid wavelength, etc. The centroid wavelength refers to the weighted average of the wavelengths using the light emission spectrum as a weight. In other words, the centroid wavelength refers to the value obtained by integrating the product of each wavelength and the intensity of light of the wavelength over the entire region of the light emission wavelength divided by the value obtained by integrating the intensity of light over the entire region of the light emission wavelength.

[0123] Incidentally, the measurement was performed on a 4-inch diameter wafer 100 in which LED chips 101 of 30×50μm in size emitting red light 626nm were arranged at intervals of 40×60μm in the vertical and horizontal directions. The measurement conditions are shown in Table 1 below. In addition, the "jitter amount" in the table is the position jitter amount during movement. The average resolution of 4 pixels and the average resolution of 9 pixels are respectively 2 times and 3 times the spatial resolution in the scanning direction.

[0124] [Table 1]

[0125] Scan speed 20 mm / sec Sensor size 3.3 mm Pixel (VCSEL) 0.003223 mm Fps 680 fps Exposure time 0.001471 sec Jitter Amount 0.029412 mm Spatial resolution in scanning direction 0.032634 mm Average resolution of 4 pixels 0.065269 mm Average resolution of 9 pixels 0.097903 mm

[0126] For any ten LED chips 101, the representative wavelength (peak wavelength) is obtained by the following two methods. As the first method, only the light receiving data of one image pixel 410 determined for each LED chip 101 is used. Figure 5The peak wavelength of light emission can be obtained by the fitting method shown in (A) of FIG. 1 . As a second method, for each LED chip 101, use Figure 6 The average value of the light receiving data in the nine image pixels 410 to 418 shown is obtained by Figure 5 The peak emission wavelength was obtained by the fitting method shown in (B). Then, the obtained peak emission wavelengths were compared. The results are shown in Table 2.

[0127] [Table 2]

[0128] (A) 1 pixel

[0129] No. 1 2 3 4 5 6 7 Peak wavelength 626.61 626.94 626.18 626.78 626.19 627.29 626.74

[0130] No. 8 9 10 max min Δ STDEV ave Peak wavelength 627.33 627.16 627.12 627.33 626.18 1.15 0.42 626.83

[0131] (B) 9 pixels

[0132] No. 1 2 3 4 5 6 7 Peak wavelength 626.7 626.6 626.6 626.82 626.43 626.52 626.81

[0133] No. 8 9 10 max min Δ STDEV ave Peak wavelength 626.81 626.62 626.79 626.82 626.43 0.39 0.14 626.67

[0134] When the representative wavelength is calculated by focusing on only one image pixel 410 in (A) of Table 2, the difference (△) between the maximum value (max) and the minimum value (min) of the representative wavelength is 1.15. In addition, the standard deviation based on the STDEV function is 0.42, and the average value (ave) is 626.83. In contrast, when the representative wavelength is calculated based on the average value of the nine image pixels 410 to 418 in (B) of Table 2, the difference (△) between the maximum value (max) and the minimum value (min) of the representative wavelength is 0.39. In addition, the standard deviation based on the STDEV function is 0.14, and the average value (ave) is 626.67, which is a small deviation.

[0135] As described above, in this embodiment, while measuring, the image pixel 410 corresponding to the position of the LED chip 101 is determined on the image composed of the light receiving data of each microscopic part obtained by the area sensor 5. The image pixel 410 is determined based on the position of the LED chip 101 relative to the reference position of the wafer 100 and the movement amount (scanning amount) of the workbench 200 by the moving device 300. Moreover, the representative wavelength of the LED chip 101 is calculated based on the light receiving data of each wavelength of the determined image pixel 410. Therefore, it is not necessary to extract the bright area in the image by image analysis in all the data areas in order to separate the light receiving data into data groups corresponding to each LED chip 101 as in the past. Therefore, image processing with sufficient resolution is not required, and high-speed scanning can be performed, so that the measurement time can be shortened and efficient measurement can be performed.

[0136] Next, another embodiment of the present invention will be described. The measurement in this embodiment is performed by combining a rough measurement by high-speed scanning and a detailed measurement by low-speed scanning.

[0137] For example Figure 7 As shown, for LED chips 101 located near each other, the representative wavelength or other characteristic values ​​obtained by rough measurement may exceed the specified value and differ. In such a case, by measuring the area of ​​the LED chip 101 again in detail, the representative wavelength and characteristic value can be measured with high accuracy, which can help clarify the cause. Figure 7 In the example, the representative wavelengths of the LED chip 101a marked with single hatching and the LED chip 101b marked with double hatching are different by exceeding the specified value. The brightness of the LED chip 101c indicated by the white frame is insufficient and cannot be measured because it is still outside the specified value.

[0138] In a rough measurement, for example, the size of the area sensor 5 is set to 10 mm (the width in the length direction of the slit of the HSI system 10). The number of pixels in the spatial direction of the area sensor 5 is set to 1024 (the slit is also roughly divided into 1024 measurement areas). The magnification of the objective lens 2 is set to 3 times (the projection spatial area of ​​1 pixel of the area sensor 5 is 3.3 μm). The moving speed (scanning speed) of the moving device 300 relative to the workbench 200 is set to 20 mm / sec, and the exposure time of the area sensor 5 is set to 14.7 msec. Under these conditions, the spatial resolution for 1 pixel is 33 μm (the sum of the pixel projection 3.3 μm and the scanning jitter 29.4 μm). If the light receiving data used for the calculation representing the wavelength is set to the average value of 9 image pixels 410 to 418, the output resolution is per 9.9×96 μm area. Of course, when 4 image pixels are averaged, output can be performed per 6.6×65 μm area. Figure 8 In (A) of FIG. 1 , the magnitude of the output resolution when the nine image pixels 410 to 418 are averaged in the rough measurement is schematically indicated by black filling.

[0139] In the case of detailed measurement, if the scanning speed is set to 3.3mm / sec and the exposure time of the area sensor 5 is set to 14.7msec, the spatial resolution for 1 pixel is 3.3μm (pixel projection 3.3μm and scanning jitter 0.049μm). If the light receiving data is set to the average value of 9 image pixels 410 to 418, the output resolution is per 9.9×9.9μm area. Of course, when averaging 4 image pixels, output can also be performed per 6.6×6.6μm area. In this case, it is easy to understand the measurement situation where the aspect ratio is also consistent. Figure 8(B) schematically shows the magnitude of the output resolution when nine image pixels 410 to 418 are averaged in the detailed measurement.

[0140] When the size of the LED chip 101 is set to 30×50 μm, Figure 8 As shown in (C), it is possible to sufficiently repeatedly output measurement results with high reproducibility only in the light-emitting area of ​​the LED chip 101. Figure 8 In (C), the large black circle indicates the output resolution when the nine image pixels 410 to 418 are averaged. The small black circle indicates the output resolution when the four image pixels 410 and 412 to 414 are averaged.

[0141] In addition, it is also possible to set the object lens 2 to a low magnification (e.g., 3 times) and perform a rough measurement, and then, while the scanning speed is being slowed down or the scanning speed is maintained, change the object lens 2 to a higher magnification (e.g., 3 times) and perform a detailed measurement. The wavelength distribution can be determined more carefully by the detailed measurement, and the region where the wavelength changes and fluctuates violently can be measured in detail.

[0142] The scanning speed and the magnification of the objective lens 2 in the rough measurement and detailed measurement can be determined according to the size of the LED chip 101. Regarding the LED chip 101, there are various sizes and shapes, ranging from about 100 μm for the long side to about 5 μm. It is also difficult to measure LED chips 101 of different sizes under the same measurement conditions. The necessary resolution (half or about 1 / 3) corresponding to the assumed size and spacing of the LED chips 101 is set, and the corresponding spatial resolution is adapted to the rough measurement. In the detailed measurement, by setting a finer spatial resolution (about 1 / 3 or 1 / 10) than the spacing of the LED chips 101, LED chips 101 of various sizes can be measured.

[0143] Next, a specific example of measuring time is described. Fig. 9 As shown, when measuring each row of a wafer 100 with a diameter of 4 inches (100 mm), the width of one row is set to 3.3 mm, and the row with a width of 3.3 mm is scanned and measured. Here, the end 0.5 mm of the field of view is the location of the overlapping image, and the 2.8×2.8 mm 2 The field of view and the area of ​​the wafer are 100, and the number of measurements is 1000. Fig. 9 The symbol 11 in the middle indicates one imaging size of a rectangle of 2.8 mm×2.8 mm.

[0144] The scanning speed during the rough measurement of high-speed scanning is set to 20 mm / sec, and the measurement time is calculated as the integration time. Therefore, when 100 [mm] / 20 [mm / sec] × 100 mm / 2.8 mm = 178 sec, it is about 3 minutes. In addition, the size of the LED chip 101 of this embodiment is set to 30 × 50 μm (the interval between the LED chips 101 is 40 × 60 μm).

[0145] The scanning speed during detailed measurement of low-speed scanning is set to 3.3 mm / sec. Therefore, the measurement time is about 18 minutes when 100 [mm] / 3.3 [mm / sec] × 100 mm / 2.8 mm = 1082 sec. In this embodiment, the detailed measurement area within the chip surface can be limited. Therefore, for example, when the detailed measurement area is 30% in terms of area ratio, if the entire surface of the chip 100 is measured in the rough measurement and 30% of the area is measured in the detailed measurement, it will be 8.4 minutes (18 × 0.3 + 3 = 8.4)), which can achieve high-speed measurement.

[0146] The detailed measurement area is set, for example, as follows. That is, the diameter of the above-mentioned 4-inch wafer 100 is approximately 100 mm. In the rough measurement of high-speed scanning, the field of view is scanned by 3 mm, and approximately 31 lines are scanned. In this case, the peak wavelength of the LED chip 101 is output for each area by scanning every 10 mm. Moreover, in the case where there is an area where the peak wavelength fluctuates drastically, for example, when the peak wavelength changes by more than 1 mm as a specified value, a range of 13 mm including the area 10 mm and the measurement area (for example, 3 mm) is pre-set as a detailed measurement area. When the LED chip 101 is used in a display, a wavelength deviation within 1 to 2 nm is required. Therefore, the specified value can be set to 1 mm in the case of a display. When used for other purposes, the specified value can be set according to its purpose.

[0147] In addition to the peak wavelength, a predetermined value may be set for a certain parameter such as the half value width and the centroid wavelength.

[0148] In addition, if the position reproducibility based on scanning is taken into consideration, it is preferred that when the result of the rough measurement shows that there is a region where the representative wavelength changes dramatically, the detailed measurement of the region is kept in the same row. Moreover, by repeating this operation for each row, the measurement can be performed with higher position reproducibility. Thus, the measurement data based on the rough measurement can be linked to the measurement data based on the detailed measurement with a smaller error.

[0149] Next, the alignment of the measurement data (image) obtained by the rough measurement and the measurement data (image) obtained by the detailed measurement will be described.

[0150] The measurement data obtained by the rough measurement and the measurement data obtained by the detailed measurement are connected through the scanning position, but there is an error of up to about 3 μm due to repeated scanning. Therefore, it is more preferable to produce image data with a small capacity based on the light receiving data of a certain wavelength based on the image obtained by the detailed measurement. As a result, a higher precision connection can be made through image discrimination of both parties. For example, in the detailed measurement area, the light receiving data of all image pixels for a certain wavelength are averaged to produce an 8-bit small capacity image. At the same time, the position (area) of the LED chip 101 is determined based on brightness. Fig.10 (B) shows measurement data 502 obtained by detailed measurement. The leftmost row indicated by the arrow shows the position of the LED chip 101 serving as a reference.

[0151] On the other hand, in the measurement data based on the rough measurement, the LED chips 101 are arranged like the design values, and the positions of the LED chips 101 are directly reflected. Fig.10 (A) shows measurement data 501 obtained by rough measurement. The rightmost row indicated by the arrow shows the position of the LED chip 101 serving as a reference.

[0152] Moreover, if Fig.11 As shown, the two data are linked so that the position of the LED chip 101 at the right end of the measurement data 501 based on the rough measurement overlaps the position of the LED chip 101 at the left end of the measurement data 502 based on the detailed measurement.

[0153] The representative wavelength of the LED chip 101 calculated by the operation unit 6 is output to the measurement result display unit 8 for display, for example. Alternatively, it is output to the storage unit 9 and stored. Alternatively, it can be output to an external device for management. In this embodiment, the relative position of each LED chip 101 on the wafer 100 can be determined. Therefore, data related to the representative wavelength of the LED chip 101 (spectral distribution, peak wavelength, center of gravity wavelength, half-value full width, etc.) can be output in association with each LED chip 101. In this way, management of individual LED chips 101 can be performed.

[0154] This application is accompanied by a priority claim of Japanese patent application No. 2022-147557 filed on September 16, 2022, the disclosure of which directly constitutes a part of this application.

[0155] Industrial Applicability

[0156] The present invention can be utilized as a wavelength measurement device that measures each representative wavelength of a light emitting element chip such as a plurality of LED chips included in a measurement target.

[0157] Description of Reference Numerals

[0158] 1…excitation light source; 2…objective lens; 3…spectrometer; 4…imaging lens; 5…area sensor; 51…pixel (sensor pixel); 6…calculation unit; 61…position determination unit; 7…HSI control unit; 8…measurement result display unit; 10…hyperspectral imaging system; 100…measurement object; 101…light emitting element chip (LED chip); 102…calibration mark; 200…workbench; 300…moving device (scanning device); 401, 410 to 418…pixels (image pixels); 501…measurement data obtained by rough measurement; 502…measurement data obtained by detailed measurement.

Claims

1. A wavelength measuring device, wherein: have: A spectroscopic unit for spectroscopically spectroscopically emitting light when the light emitting element chip is excited, the light being emitted from a plurality of minute locations in a one-dimensional direction of a measurement object having a plurality of the light emitting element chips; a scanning unit configured to scan at least one of the spectroscopic unit or the measurement object in a direction perpendicular to the one-dimensional direction; a light receiving unit for receiving light from each of the microscopic parts split by the light splitting unit each time the scanning unit scans; a determination unit that determines the position of the light emitting element chip on an image composed of light receiving data of each microscopic part obtained by the light receiving unit based on the reference position of the light emitting element chip relative to the measurement object and the scanning amount of the scanning unit; as well as The calculation unit calculates a representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined by the determination unit.

2. The wavelength measuring device according to claim 1, wherein: The representative wavelength of the light emitting element chip is calculated based on an average value of a plurality of light receiving data including the light receiving data corresponding to the position of the light emitting element chip determined by the determination unit and one or more light receiving data around the position of the light emitting element chip.

3. The wavelength measuring device according to claim 1 or 2, wherein: The representative wavelength is the luminescence peak wavelength or the centroid wavelength.

4. The wavelength measuring device according to claim 1 or 2, wherein: A light source unit is further provided, the light source unit exciting the light emitting element chip to cause the light emitting element chip to emit light.

5. The wavelength measuring device according to claim 1 or 2, wherein: The result of the rough measurement that makes the scanning speed of the scanning unit relatively faster is: in the area where the representative wavelength of the light-emitting element chip or the characteristic value other than the representative wavelength calculated by the calculation unit exceeds the specified value, the detailed measurement is performed by making the scanning speed of the scanning unit relatively slower.

6. The wavelength measuring device according to claim 1 or 2, wherein: The spectroscopic unit spectroscopes the light emitted by the light emitting element chip when it is excited and passes through the objective lens, and the objective lens has a variable magnification, and can perform rough measurement by setting the objective lens to a low magnification and detailed measurement by setting the objective lens to a high magnification.

7. The wavelength measuring device according to claim 5, wherein: The rough measurement and the detailed measurement are continuously performed in the same measurement area.

8. The wavelength measuring device according to claim 5, wherein: An image is generated for aligning the measurement data obtained by the rough measurement with the measurement data obtained by the detailed measurement.

9. The wavelength measuring device according to claim 1 or 2, wherein: The calculation unit outputs the calculated characteristic value including the representative wavelength of the light emitting element chip in association with the light emitting element chip.

10. The wavelength measuring device according to claim 5, wherein: The scanning speed in the rough measurement and the detailed measurement is determined in accordance with the size of the light emitting element chip.

11. The wavelength measuring device according to claim 6, wherein: The magnification of the objective lens in the rough measurement and the detailed measurement is determined in accordance with the size of the light emitting element chip.

12. The wavelength measuring device according to claim 5, wherein: The range for detailed measurement is preset.

13. A data processing device, wherein: Hyperspectral devices have: A spectroscopic unit for spectroscopically spectroscopically emitting light when the light emitting element chip is excited, the light being emitted from a plurality of minute locations in a one-dimensional direction of a measurement object having a plurality of the light emitting element chips; a scanning unit configured to scan at least one of the spectroscopic unit or the measurement object in a direction perpendicular to the one-dimensional direction; as well as A light receiving unit receives light from each of the microscopic parts separated by the light separation unit each time the scanning unit scans. The data processing device has: A determination unit that determines the position of the light emitting element chip based on the reference position of the light emitting element chip relative to the measurement object and the scanning amount of the scanning unit on an image composed of the light receiving data of each microscopic part obtained by the light receiving unit of the hyperspectral device; as well as The calculation unit calculates a representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined by the determination unit.

14. The data processing apparatus according to claim 13, wherein: The representative wavelength of the light emitting element chip is calculated based on an average value of a plurality of light receiving data including the light receiving data corresponding to the position of the light emitting element chip determined by the determination unit and one or more light receiving data around the position of the light emitting element chip.

15. The data processing device according to claim 13 or 14, wherein: The representative wavelength is the luminescence peak wavelength or the centroid wavelength.

16. The data processing device according to claim 13 or 14, wherein: A control unit is provided for making the scanning speed of the scanning unit relatively faster for making a rough measurement of the hyperspectral device, and the result of which is: in an area where the representative wavelength of the light-emitting element chip or a characteristic value other than the representative wavelength calculated by the calculation unit exceeds a prescribed value, a detailed measurement is made for the hyperspectral device by making the scanning speed of the scanning unit relatively slower.

17. The data processing device according to claim 13 or 14, wherein: The spectroscopic unit spectroscopically separates the light emitted by the light emitting element chip when it is excited and passes through the objective lens, and the magnification of the objective lens is variable. The hyperspectral device can be configured to perform rough measurement by setting the objective lens to a low magnification and detailed measurement by setting the objective lens to a high magnification.

18. The data processing apparatus according to claim 16, wherein: The control unit continuously performs the rough measurement and the detailed measurement in the same measurement area.

19. The data processing apparatus according to claim 16, wherein: An image generating unit is provided for generating an image for aligning measurement data obtained by the rough measurement with measurement data obtained by the detailed measurement.

20. The data processing apparatus according to claim 13 or 14, wherein: The calculation unit outputs the calculated characteristic value including the representative wavelength of the light emitting element chip in association with the light emitting element chip.

21. A wavelength measurement method, wherein: Include: A step of splitting light by a spectroscopic unit, wherein the light emitted by the light emitting element chip when excited is split, the light being light from a plurality of minute locations in a one-dimensional direction of a measurement object having a plurality of the light emitting element chips; A scanning step of scanning at least one of the spectroscopic unit or the measurement object in a direction perpendicular to the one-dimensional direction; a light receiving step, each time scanning is performed by the scanning step, using a light receiving unit to receive light from each of the microscopic parts separated by the separation step; A determination step of determining the position of the light emitting element chip on an image composed of light receiving data of each microscopic part obtained by the light receiving unit based on the position of the light emitting element chip relative to the reference position of the object to be measured and the scanning amount of the scanning unit; as well as The calculation step calculates a representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined by the determination step.

22. A program, wherein: Hyperspectral devices have: A spectroscopic unit for spectroscopically spectroscopically emitting light when the light emitting element chip is excited, the light being emitted from a plurality of minute locations in a one-dimensional direction of a measurement object having a plurality of the light emitting element chips; a scanning unit configured to scan at least one of the spectroscopic unit or the object to be measured in a direction perpendicular to the one-dimensional direction; as well as A light receiving unit receives light from each of the microscopic parts separated by the light separation unit each time the scanning unit scans. Make the computer perform the following steps: A determination step, in which the position of the light emitting element chip is determined based on the reference position of the light emitting element chip relative to the measured object and the scanning amount of the scanning unit on the image composed of the light receiving data of each microscopic part obtained by the light receiving unit of the hyperspectral device; as well as The calculation step calculates a representative wavelength of the light emitting element chip based on the light receiving data corresponding to the position of the light emitting element chip determined by the determination step.

Images