Vehicle computing unit with intermediate plate architecture

Abstract

An assembly for stacking a plurality of circuit boards of an electronic device package is provided. The assembly may include a base structure, a plurality of first printed circuit boards (PCBs), and a plurality of second PCBs configured to couple to connectors of the plurality of first PCBs that are accessible via connection access points in the base structure. The plurality of first PCBs are positioned on a first side of the base structure and the plurality of second PCBs are positioned on a second side of the base structure. The positioning tolerances of the plurality of second PCBs relative to the plurality of first PCBs are provided by the connectors of the plurality of first PCBs.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and priority under 35 U.S.C. §119(e) to U.S. Provisional Application Serial No. 63 / 397,121, filed on August 11, 2022, entitled “VEHICLE COMPUTE UNIT WITH MIDDLE PLATE STRUCTURE,” the entire disclosure of which is incorporated herein by reference in its entirety for all its teachings and for all purposes. Technical Field

[0002] The present disclosure relates generally to electronic device packages and, more particularly, to midplane architectures for electronic device packages and processing units. Background Art

[0003] Modern electronic component assemblies or electronic device packages (such as printed circuit board assemblies) may include one or more processing units (e.g., microprocessors, chips, integrated circuits, systems on chips (SOCs), etc.) on a printed circuit board (PCB) or other circuit substrate located inside a housing. In some examples, the electronic device package may include a motherboard (e.g., a first circuit board, a main PCB, etc.) and one or more daughter cards (e.g., additional PCBs, additional circuit boards, daughter boards, PCB daughter cards, etc.), wherein the one or more daughter cards are connected to the motherboard (e.g., via pins, pin headers, sockets, board-to-board connectors, or additional types of connectors). One or more daughter cards may provide supplementary or additional functions to the motherboard. For example, one or more daughter cards may include a circuit board type that is inserted into or connected to a motherboard or similar expansion card (e.g., a circuit board) to expand the features and services of the motherboard or similar expansion card.

[0004] Traditionally, mechanical standoffs are used to mount daughter cards to a motherboard to form a sandwich (e.g., layered) structure in which the respective processing units are parallel to each other. One or more daughter cards may be mounted to a main motherboard. In some examples, mechanical standoffs are simple cylindrical metal parts that may or may not have threads for mounting screws used to mount the daughter cards to the motherboard. Mechanical standoffs are controlled to very tight height tolerances to ensure that the connectors between the respective processing units mate correctly with a high degree of precision and accuracy. Summary of the invention

[0005] Example aspects of this disclosure include:

[0006] A middle plate structure for an electronic device package, the middle plate structure comprising: a base structure, the base structure comprising a frame; a plurality of first cavities, the plurality of first cavities being defined within the frame and located on a first side of the base structure, the plurality of first cavities being configured to receive a plurality of first printed circuit boards from a first direction; a plurality of second cavities, the plurality of second cavities being defined within the frame and located on a second side of the base structure, the plurality of second cavities being configured to receive a plurality of second printed circuit boards from a different second direction; and one or more connection entry points, the one or more connection entry points connecting the plurality of second cavities to the plurality of first cavities.

[0007] Any of the aspects herein, wherein the plurality of first cavities are configured to be at least partially shaped to conform to the plurality of first printed circuit boards, wherein the plurality of second cavities are configured to be at least partially shaped to conform to the plurality of second printed circuit boards, and wherein the plurality of second cavities include a surface on which the plurality of second printed circuit boards are positioned.

[0008] In any of the aspects herein, the base structure further comprises one or more dividers, wherein the one or more dividers and the frame define the plurality of second cavities. Optionally, the one or more dividers are formed together with the frame.

[0009] Any of the aspects herein, wherein the plurality of second cavities are configured to receive one or more thermal spacers inserted from a different second direction.

[0010] In any of the aspects herein, the base structure further comprises: at least one aperture within the base structure, wherein the at least one aperture is operable to transfer heat from at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards to the cooling structure for dissipation into the surrounding environment.

[0011] Any of the aspects herein, wherein at least one of: the first printed circuit board is configured to be physically coupled to the second side of the base structure; and the one or more additional printed circuit boards are configured to be physically coupled to the first side of the base structure.

[0012] Any of the aspects of the present invention, wherein a plurality of connectors electrically connect the plurality of first printed circuit boards to the plurality of second printed circuit boards via the one or more connection entry points, and wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by a plurality of connectors on the plurality of first printed circuit boards, the plurality of second printed circuit boards being accessible to the plurality of connectors on the plurality of first printed circuit boards via the one or more connection entry points.

[0013] Any of the aspects herein, wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by at least one positioning feature on the base structure, and wherein the at least one positioning feature is operable to engage at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards.

[0014] Any of the aspects herein, wherein the different second direction is a direction opposite to the first direction.

[0015] An electronic device package comprises: a plurality of first printed circuit boards; a plurality of second printed circuit boards; and an intermediate plate structure, the intermediate plate structure comprising: a base structure, the base structure comprising a frame; a plurality of first cavities, the plurality of first cavities being defined within the frame and located on a first side of the base structure, the plurality of first cavities being configured to receive the plurality of first printed circuit boards from a first direction; a plurality of second cavities, the plurality of second cavities being defined within the frame and located on a second side of the base structure, the plurality of second cavities being configured to receive the plurality of second printed circuit boards from a different second direction; and one or more connection entry points, the one or more connection entry points connecting the plurality of second cavities to the plurality of first cavities.

[0016] Any of the aspects herein, further comprising: a cold plate; a heat pipe assembly; and a bottom cover, wherein alignment of the cold plate with the middle plate structure positions the heat pipe assembly proximate to the second side of the middle plate structure, and wherein the bottom cover is operable to be positioned proximate to the first side of the middle plate structure.

[0017] In any of the aspects herein, the cold plate includes at least one protrusion and the base structure includes at least one aperture located within the base structure, wherein the at least one aperture is operable to transfer heat from at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards via the at least one protrusion to be dissipated to the surrounding environment via the heat pipe assembly.

[0018] Any of the aspects herein, wherein the plurality of second cavities are configured to be at least partially shaped to conform to the plurality of second printed circuit boards.

[0019] Any of the aspects herein, wherein the plurality of first cavities are configured to be at least partially shaped to conform to the plurality of first printed circuit boards, wherein the plurality of second cavities are configured to receive one or more thermal spacers from a different second direction, and wherein the one or more thermal spacers are positioned proximate to the plurality of second printed circuit boards, and wherein the plurality of second cavities include a surface on which the plurality of second printed circuit boards are positioned.

[0020] In any of the aspects herein, the base structure further comprises one or more dividers, wherein the one or more dividers and the frame define the plurality of second cavities. Optionally, the one or more dividers are formed together with the frame.

[0021] Any of the aspects of the present invention, wherein a plurality of connectors electrically connect the plurality of first printed circuit boards to the plurality of second printed circuit boards via the one or more connection entry points, and wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by a plurality of connectors on the plurality of first printed circuit boards, the plurality of second printed circuit boards being accessible to the plurality of connectors on the plurality of first printed circuit boards via the one or more connection entry points.

[0022] Any of the aspects herein, wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by at least one positioning feature on the base structure, and wherein the at least one positioning feature is operable to engage at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards.

[0023] Any of the aspects herein, wherein the different second direction is a direction opposite to the first direction.

[0024] A method for assembling an integrated electronic device package, the method comprising: providing an intermediate board structure, wherein the intermediate board structure comprises: a base structure, the base structure comprising a frame; a plurality of first cavities, the plurality of first cavities being defined within the frame and located on a first side of the base structure; a plurality of second cavities, the plurality of second cavities being defined within the frame and located on a second side of the base structure; and one or more connection entry points, the one or more connection entry points connecting the plurality of second cavities to the plurality of first cavities, aligning a plurality of first printed circuit boards with the plurality of first cavities of the intermediate board structure from a first direction; aligning a plurality of second printed circuit boards with the plurality of second cavities of the intermediate board structure from a different second direction; and connecting the plurality of second printed circuit boards to the plurality of first printed circuit boards via the one or more connection entry points to form a subassembly by the intermediate board structure, the plurality of first printed circuit boards and the plurality of second printed circuit boards.

[0025] Any of the aspects herein, further comprising: aligning the bottom cover with a formed subassembly positioned proximate to a first side of the intermediate plate structure; coupling the bottom cover to the formed subassembly; aligning the cold plate and the heat pipe assembly with the formed subassembly, wherein the alignment of the cold plate and the intermediate plate structure positions the heat pipe assembly proximate to a second side of the intermediate plate structure; and coupling the cold plate and the heat pipe assembly to the formed subassembly.

[0026] In any of the aspects herein, the cold plate includes at least one protrusion and the base structure includes at least one aperture located within the base structure, wherein the at least one aperture is operable to transfer heat from at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards via the at least one protrusion to be dissipated to the surrounding environment via the heat pipe assembly.

[0027] Any of the aspects herein, wherein one or more thermal spacers are positioned within the second plurality of cavities proximate to the second plurality of printed circuit boards prior to coupling the cold plate and heat pipe assembly to the formed subassembly.

[0028] Any of the aspects of the present invention, wherein a plurality of connectors electrically connect the plurality of first printed circuit boards to the plurality of second printed circuit boards via the one or more connection entry points, and wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by a plurality of connectors on the plurality of first printed circuit boards, the plurality of second printed circuit boards being accessible to the plurality of connectors on the plurality of first printed circuit boards via the one or more connection entry points.

[0029] Any of the aspects herein, wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by at least one positioning feature on the base structure, and wherein the at least one positioning feature is operable to engage at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards.

[0030] A component of multiple circuit boards for stacking electronic device packages, the component comprising: a base structure; a first printed circuit board (PCB); and one or more additional PCBs, the one or more additional PCBs configured to be connected to the first PCB, wherein the first PCB is configured to be physically connected to a first side of the base structure, and the one or more additional PCBs are configured to be physically connected to a second side of the base structure, the second side being opposite to the first side.

[0031] Any of the aspects herein, wherein the directional force exerted on the one or more additional PCBs is distributed along the base structure based at least in part on the one or more additional PCBs being physically coupled to the second side of the base structure.

[0032] Any of the aspects herein, wherein the one or more additional PCBs are stacked on top of the first PCB.

[0033] Any of the aspects herein, wherein the base structure is located between the one or more additional PCBs and the first PCB.

[0034] Any of the aspects herein, wherein the first side of the base structure comprises a bottom side of the base structure and the second side of the base structure comprises a top side of the base structure.

[0035] Any of the aspects herein, wherein the first PCB comprises a motherboard and the one or more additional PCBs comprise one or more daughter cards.

[0036] Any of the aspects herein, wherein the base structure comprises one or more connection entry points configured to allow one or more connectors of the first PCB to pass through the base structure.

[0037] Any of the aspects herein, wherein the one or more connectors of the first PCB are configured to provide a connection between the first PCB and the one or more additional PCBs.

[0038] Any of the aspects herein, wherein the coupling between the first PCB and the one or more additional PCBs comprises an electrical coupling, a communication coupling, or a combination thereof.

[0039] An electronic device package includes: a cold plate configured to provide a top cover surface for the electronic device package, wherein the cold plate includes a chamber having an inlet and an outlet for allowing a coolant liquid to flow through the chamber; a heat pipe assembly configured to be connected to the cold plate; an intermediate plate assembly, the intermediate plate assembly including: a base structure; a first PCB; and one or more additional PCBs, the one or more additional circuit boards configured to be connected to the first PCB, wherein the first PCB is configured to be physically connected to a first side of the base structure, and the one or more additional PCBs are configured to be physically connected to a second side of the base structure, the second side being opposite to the first side; and a bottom cover, wherein the bottom cover is attached to the cold plate to provide an airtight seal for the first PCB and the one or more additional PCBs of the intermediate plate.

[0040] Any of the aspects herein, wherein the directional force exerted by the heat pipe assembly on the one or more additional PCBs is distributed along the base structure based at least in part on the one or more additional PCBs being physically coupled to the second side of the base structure.

[0041] Any of the aspects herein, wherein the one or more additional PCBs are stacked on top of the first PCB.

[0042] Any of the aspects herein, wherein the base structure is located between the one or more additional PCBs and the first PCB.

[0043] Any of the aspects herein, wherein the middle plate assembly further comprises: one or more apertures configured to allow one or more protrusions of the cold plate to pass through the middle plate assembly, contact the bottom cover, or a combination thereof.

[0044] Any of the aspects herein, wherein the one or more protrusions of the cold plate are configured to absorb heat generated by the first PCB of the mid-plate assembly.

[0045] Any of the aspects herein, wherein the base structure of the midplane assembly includes one or more connection entry points configured to allow one or more connectors of the first PCB to pass through the base structure.

[0046] Any of the aspects herein, wherein the one or more connectors of the first PCB are configured to provide a connection between the first PCB and the one or more additional PCBs.

[0047] Any of the aspects herein, wherein the coupling between the first PCB and the one or more additional PCBs comprises an electrical coupling, a communication coupling, or a combination thereof.

[0048] A method of assembling an integrated electronic device package, the method comprising: providing an electronic device package, the electronic device package comprising: a cold plate, the cold plate configured to provide a top cover surface for the electronic device package, wherein the cold plate includes a chamber, the chamber having an inlet and an outlet for a coolant liquid to flow through the chamber; a heat pipe assembly, the heat pipe assembly configured to be coupled to the cold plate; an intermediate plate assembly, the intermediate plate assembly comprising: a base structure; a first PCB; and one or more additional PCBs; and a bottom cover; aligning the heat pipe assembly with the cold plate based at least on one or more alignment pins; coupling the heat pipe assembly to cold plate; coupling the first PCB to the middle plate assembly, wherein the first PCB is physically coupled to a first side of a base structure of the middle plate assembly; coupling the one or more additional PCBs to the middle plate assembly to provide a coupling between the first PCB and the one or more additional PCBs, wherein the one or more additional PCBs are physically coupled to a second side of the base structure of the middle plate assembly, the second side being opposite to the first side; coupling the middle plate assembly to a bottom cover; and coupling the bottom cover to the cold plate, wherein coupling the bottom cover to the cold plate provides an airtight seal for the first PCB and the one or more additional PCBs.

[0049] Any of the aspects herein, wherein the directional force exerted by the heat pipe assembly on the one or more additional PCBs is distributed along the base structure based at least in part on the one or more additional PCBs being physically coupled to the second side of the base structure.

[0050] Any aspect in combination with any one or more other aspects.

[0051] Any one or more of the features disclosed herein.

[0052] Any one or more of the features substantially as disclosed herein.

[0053] Any one or more of the features as substantially disclosed herein may be combined with any one or more of the other features as substantially disclosed herein.

[0054] Any one of the aspects / features / embodiments may be combined with any one or more other aspects / features / embodiments.

[0055] The use of any one or more of the aspects or features as disclosed herein.

[0056] It will be understood that any feature described herein may be claimed in combination with any other feature(s) described herein, whether or not such features are from the same described embodiment.

[0057] The details of one or more aspects of the disclosure are set forth in the accompanying drawings and the following description. Other features, objects, and advantages of the techniques described in the disclosure will become apparent from the description and drawings, and from the claims.

[0058] Previously was a simple summary of the disclosure to provide an understanding of some aspects of the disclosure. This summary is neither a broad overview nor an exhaustive overview of the disclosure and its various aspects, embodiments, and configurations. It is neither intended to identify the key or important elements of the disclosure nor to describe the scope of the disclosure, but rather to present the selected concepts of the disclosure in a simple form as an introduction to the more detailed description presented below. As will be appreciated, other aspects, embodiments, and configurations of the disclosure may utilize one or more of the features described above or below in detail, either individually or in combination.

[0059] Numerous additional features and advantages of the present disclosure will become apparent to those skilled in the art after considering the description of the embodiments provided below. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 shows a top perspective view of an electronic device package according to an embodiment of the present disclosure;

[0061] Figure 2 The embodiment according to the present disclosure is shown Figure 1 An exploded perspective view of an electronic device package;

[0062] Figure 3A FIG. 1 shows a first assembled state of an embodiment according to the present disclosure. Figure 1 A top view of an intermediate plate assembly of an electronic device package;

[0063] Figure 3B The second assembly state of the embodiment according to the present disclosure is shown. Figure 1 A top view of an intermediate plate assembly of an electronic device package;

[0064] Figure 3C An unassembled state of an embodiment of the present disclosure is shown. Figure 1 A bottom view of an intermediate plate assembly of an electronic device package;

[0065] Figure 3D FIG. 1 shows a third assembled state according to an embodiment of the present disclosure. Figure 1 A bottom perspective view of an intermediate plate assembly of an electronic device package;

[0066] Figure 3E The embodiment according to the present disclosure is shown Figure 1 A top perspective view of an intermediate plate assembly of an electronic device package;

[0067] Figure 3F The embodiment according to the present disclosure is shown Figure 1 A top perspective view of an intermediate plate assembly of an electronic device package;

[0068] Figure 4 An assembled state of an embodiment according to the present disclosure is shown. Figure 1 A bottom perspective view of a heat pipe assembly of an electronic device package;

[0069] Figure 5 The embodiment according to the present disclosure is shown Figure 1 A top view of a bottom cover of an electronic device package; and

[0070] Figure 6 According to an embodiment of the present disclosure, a Figure 1 A flow chart of a method or process for packaging an electronic device. DETAILED DESCRIPTION

[0071] Before describing in detail any embodiment of the present disclosure, it should be understood that the present disclosure does not limit its application to the construction details and component arrangements set forth in the following description or shown in the accompanying drawings. The present disclosure can have other embodiments and can be practiced or implemented in a variety of different ways. Moreover, it should be understood that the wording and terminology used in this article are for descriptive purposes and should not be considered as restrictive. The use of "including", "comprising," or "having" and its variations herein is intended to cover the items listed thereafter and their equivalents and additional items. Further, the present disclosure can use examples to illustrate one or more aspects thereof. Unless otherwise expressly stated, the use or enumeration of one or more examples (which can be expressed by "for example," "for example," "such as," "for example," or similar language) is not intended to limit and does not limit the scope of the present disclosure.

[0072] The following description provides only embodiments and is not intended to limit the scope, applicability or configuration of the claims. Instead, the following description will provide those skilled in the art with an achievable description for implementing the described embodiments. It will be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the appended claims.

[0073] Various aspects of the disclosure are described herein with reference to the drawings, which may be schematic illustrations of idealized configurations.

[0074] Embodiments of the present disclosure will be described in conjunction with electronic device packages and, in some embodiments, in conjunction with the construction, structure, and arrangement of elements of a midplane architecture that includes a stacked design that supports processing units.

[0075] In some embodiments, the present disclosure describes an electronic device package (e.g., an electronic device module) that includes an intermediate board assembly (e.g., an intermediate board architecture) having a base structure. Additionally, the electronic device package may include a plurality of processing units that include a plurality of first printed circuit boards or PCBs (e.g., motherboards, main circuit boards, etc.) and a plurality of second printed circuit boards or PCBs (e.g., daughter cards, additional circuit boards, PCB daughter cards, etc.), wherein the plurality of second PCBs are coupled or connected to the first PCB (e.g., via pins, pin headers, sockets, board-to-board connectors, or additional types of connectors, etc.). As described herein, the plurality of first PCBs and the plurality of second PCBs are mounted to the base structure of the intermediate board assembly. Accordingly, the base structure can provide spacing between the plurality of first PCBs and the plurality of second PCBs while also distributing any force or load applied to any PCB along the base structure rather than to the coupled / connected PCBs.

[0076] Traditionally, mechanical standoffs are used to mount daughter cards to a motherboard to form a sandwich (e.g., layered) structure in which the respective circuit boards (e.g., PCBs) are parallel to one another. Multiple daughter cards can be mounted to a main motherboard. However, mechanical standoffs may increase the complexity of constructing electronic device modules or packages that include a motherboard and one or more daughter cards that need to be coupled / connected. For example, very tight height tolerances for each individual standoff and between groups of standoffs, and / or possible threads for mounting screws may be necessary in order to mount the daughter cards to the motherboard. In some configurations, the tolerance for the screws may be ±0.01 mm (±3.9 x 10 -4 Inch.). Accordingly, integrated mechanical mounts may not easily allow for the necessary tolerances.

[0077] Additionally, where spring-loaded devices are utilized within the electronic device package to ensure that a minimum or sufficient amount of contact (e.g., thermal contact) occurs between adjacent components, the force supplied by the springs on the daughter card may transfer too much stress to the motherboard through the mechanical mounts. For example, a minimum or sufficient amount of thermal contact may be required between the cooling structure and the daughter card to dissipate heat generated by the daughter card (e.g., to the ambient environment) and prevent premature failures in the electronic device package and / or shorter life of components in the electronic device package.

[0078] As described herein, an electronic device module or package is provided with an intermediate plate assembly, which includes a base structure (e.g., used as a sandwich structure) located between multiple first PCBs (e.g., motherboards or main PCBs) and multiple second PCBs (e.g., daughter cards) to act like a support. In this design, both the motherboard and the daughter card are mounted to the base structure without additional load paths through the PCBs. This design allows for customization of mounting structures or surfaces optimized for each individual board. Mounting the motherboard and daughter card to the base structure of the intermediate plate assembly (rather than using mechanical supports) can reduce assembly tolerances and forces within the entire electronic device module / package. Additionally, this design reduces the number of parts of the electronic device module / package and reduces complexity by integrating the components more highly into a modular assembly or a single component.

[0079] Now go to Figure 1, a top perspective view 100 of an electronic device package 104 according to an embodiment of the present disclosure is provided. In some embodiments, the electronic device package 104 can be designed to provide functionality to a vehicle and / or assist in the operation of the vehicle. For example, the electronic device package 104 can be a computing module for a vehicle. In some examples, the functions provided by the electronic device package 104 may include key functions of the vehicle, such as autonomous driving operations, navigation, radar (RADAR), vehicle control, communication (e.g., vehicle-to-vehicle (V2V) or vehicle-to-everything (V2X) communication), etc. Additionally, the vehicle described herein may include any vehicle or vehicle model, wherein the vehicle is designed for the purpose of moving one or more tangible objects (such as people, animals, cargo, etc.). The term "vehicle" does not require that the vehicle moves or is capable of moving. Typical vehicles may include, but are not limited to, electric vehicles, cars, trucks, motorcycles, buses, automobiles, bicycles, scooters, paved or unpaved ground transportation, trains, rail transportation, boats, ships, marine transportation, submarine transportation, airplanes, spacecraft, aircraft, human-powered transportation, etc.

[0080] As described herein, the electronic device package 104 may include or accommodate multiple high-power processing units (e.g., included on or referred to as a PCB, motherboard, daughter card, or a combination thereof), as described in further detail herein. The high-power processing unit may be referred to as a system on chip (SOC) or an integrated circuit, or may include an SOC. An SOC may be a microchip having all the necessary electronic circuits and parts for a given system, such as a computer chip or a chip that enables / provides a system in a vehicle on a single integrated circuit. For example, an SOC may perform calculations and / or provide other features for operating a vehicle. In some examples, multiple SOCs may operate together (e.g., or in subset form) to provide features for operating a vehicle, and / or a separate SOC may provide separate features for operating a vehicle. Although described in the context of a vehicle, the electronic device package 104 described herein may be used to provide other purposes and in other contexts not explicitly described herein.

[0081] In some embodiments, the electronic device package 104 may be part of an overall system that is space-constrained (e.g., within a vehicle as described above). Thus, it is desirable to minimize the size, shape, and / or overall footprint of the electronic device package 104 to ensure that there is sufficient space for additional components of the overall system. Figure 2 and FIG. 3A to FIG. 3FAs described in more detail, the electronic device package 104 implements a stacked design of a daughter card and a motherboard to reduce the size, shape, and overall footprint of the electronic device package 104. For example, as described in further detail herein, instead of conventional mechanical standoffs (e.g., metal spacers, etc.), the daughter cards and the motherboard can be mounted to a base structure of a midplane assembly in the electronic device package 104 to provide spacing between the daughter cards and the motherboard and to distribute any forces or pressures applied to the daughter cards and the motherboard through the midplane 212 rather than to the daughter cards and / or the motherboard themselves.

[0082] Additionally, the stacked design can enable a more flexible controller layout (e.g., daughter cards can be laid out in different ways), which may be beneficial for future hardware upgrade operations, and this may reduce upgrade costs. For example, the electronic device package 104 can be removed from a system (e.g., a vehicle, a vehicle system, etc.) of which the electronic device package 104 is a part, and the daughter card can be easily accessed for upgrading without having to disassemble the entire electronic device package 104.

[0083] Figure 2 An exploded perspective view 200 of an electronic device package 104 is depicted according to an embodiment of the present disclosure. In some examples, reference Figure 2 The exploded view 200 described may implement Figure 1 For example, the exploded view 200 of the electronic device package may be as shown in FIG. Figure 1 An exploded view of the various components included in the depicted electronics package 104 .

[0084] As shown in the exploded view 200, the electronic device package 104 may include a cold plate 204, a heat pipe assembly 208, a midplane structure (or midplane) 212, a plurality of first printed circuit boards 216 (e.g., including but not limited to a main PCB or first PCB 216) having a connector 218, and a bottom cover 220. The electronic device package 104 may also include a thermal spacer 224 and a plurality of second printed circuit boards 228 (e.g., one or more daughter cards or one or more additional PCBs 228), as described in further detail herein. In some examples, the cold plate 204 may be a top cover and / or include a top cover surface for the electronic device package 104. Additionally, the cold plate 204 may include a chamber having an inlet and an outlet to enable a coolant liquid to flow through the chamber. For example, the coolant liquid can be water or another liquid that absorbs heat generated by other components of the electronic device package 104 (e.g., the middle board 212, the processing unit (such as the main PCB 216 and the daughter card 228), the integrated circuit, the SOC, etc.) to dissipate it to the surrounding environment or elsewhere outside the electronic device package 104. It should be noted herein that the plurality of first printed circuit boards 216 and / or the plurality of second printed circuit boards 228 may include 1, 2... up to N printed circuit boards without departing from the scope of the present disclosure. In addition, it should be noted herein that the term "main PCB" is not intended to necessarily refer to the primary nature of the PCB 216, but rather may reflect the parent / child relationship between the PCB 216 and the PCB 228 in the selected embodiment of the present disclosure. Further, it should be noted herein that the "main PCB" itself may be a secondary PCB to another more central PCB or mother PCB.

[0085] When in use, the electronic device package 104 may generate heat, such as heat typically generated by current flowing through one or more resistive elements and / or components of the electronic device package 104, such as the previously described high power processing unit (e.g., a daughter card, a PCB, a microprocessor, etc.). If the heat generated in the electronic device package 104 (e.g., via the high power processing unit) is not removed efficiently, the temperature of the electronic device package 104 may exceed a normal operating range. In some examples, operating the electronic device package 104 (even periodically) at a temperature outside of the normal operating range may cause premature failure of the electronic device package 104 and / or result in a shorter life of components in the electronic device package 104.

[0086] The heat pipe assembly 208 may represent an assembly for providing cooling to a plurality of integrated circuits (e.g., processing units such as processors, daughter cards, PCBs, etc.). In some embodiments, the heat pipe assembly 208 may be coupled to the underside of the cold plate 204. In some examples, the underside of the cold plate 204 and / or the top side of the heat pipe assembly 208 may have a thermal interface material (TIM) (e.g., thermal grease or another compound or type of TIM) applied to adjacent surfaces thereof, wherein the TIM or similarly performing compound is intended to maximize thermal conductivity between the heat pipe assembly 208 and the cold plate 204. For example, the heat pipe assembly 208 may be configured to absorb heat generated from other components in the electronic device package 104 (e.g., the middle plate 212, processing units (such as the main PCB 216 and other processors), integrated circuits, SOCs, daughter cards, additional PCBs, etc.), and then transfer the absorbed heat to the cold plate 204 based in part on the TIM, wherein the transferred heat is dissipated from the electronic device package 104 via the cold plate 204 as described above.

[0087] In some examples, the cold plate 204 and the heat pipe assembly 208 may be coupled together in a first subassembly of the electronic device package 104. However, it is noted herein that the cold plate 204 and the heat pipe assembly 208 may be singly manufactured (e.g., cast, machined, three-dimensional (3D) printed, etc.) without departing from the scope of the present disclosure.

[0088] Additionally, the electronic device package 104 can include a second subassembly that includes the midplane 212, the main PCB 216, and optionally the thermal isolation member 224 and / or the daughter card 228. For example, the midplane 212 can be coupled to the main PCB 216 so that multiple integrated circuits (e.g., daughter cards 228, multiple SOCs, chips, processors, etc.) can be aligned on the midplane 212 coupled to the main PCB 216 (e.g., physically, electrically, communicatively, etc.).

[0089] It is noted herein that the bottom cover 220 may be a component of the second subassembly, or may be a separate additional subassembly coupled to one or more of the second assembly or the first assembly as described above, without departing from the scope of the present disclosure.

[0090] In some examples, the plurality of integrated circuits of the intermediate board 212 may be portions of corresponding daughter cards 228 and / or the same daughter card 228 that is physically and / or electrically coupled to the main PCB 216. The daughter card(s) 228 may provide supplementary or complementary functionality to the main PCB 216 stored in the electronic device package 104. For example, the daughter card(s) 228 may be a type of processing unit that is inserted or coupled to a motherboard or similar expansion card (e.g., the main PCB 216) to extend the features and services of the motherboard or similar expansion card. That is, the daughter card 228 may supplement or complement the existing functionality of the motherboard or expansion card. The daughter card(s) 228 (and / or the main PCB 216) may partially provide functionality to a vehicle (e.g., an electric vehicle), but is not limited to such examples.

[0091] Additionally, the daughter card(s) 228 may require a significant amount of power to provide supplemental / supplemental functionality, wherein the significant amount of power results in heat being generated in the electronic device package 104 based in part on the flow of electrical current required to supply the significant amount of power through the integrated circuits of the midplane 212 (e.g., and / or other resistive elements and / or components of the midplane 212). Accordingly, the heat pipe assembly 208 may be configured to absorb heat generated from the integrated circuits (e.g., SOC) of the midplane 212 to prevent the temperature of the electronic device package 104 from exceeding a normal operating temperature and thereby reduce the likelihood of premature failure of the electronic device package 104 and / or components within the electronic device package 104.

[0092] In some cases, one or more of the integrated circuits of the middle plate 212 (e.g., the daughter card 228) can be at a different height than the other integrated circuits of the middle plate 212 (e.g., a different height relative to the top surface of the middle plate 212). In this way, the heat pipe assembly 208 can be a spring-loaded heat transfer device. For example, the heat pipe assembly 208 can use springs to ensure contact between each integrated circuit and a corresponding component of the heat pipe assembly 208 that is configured to absorb heat generated from the integrated circuit. For example, the spring can be configured to apply a downward force on a corresponding component of the heat pipe assembly 208 (e.g., a pad, a spreading pad, a spreader, a cooling pad, etc.) to ensure contact between the daughter card and the corresponding component, so that the corresponding component absorbs the generated heat and transfers the heat to the cold plate 204 to be dispersed outside the electronic device package 104.

[0093] However, the downward force applied by the spring can be transferred to the daughter card 228 (e.g., one or more of the integrated circuits of the midplane 212). In the case where the daughter card 228 is mounted to the main PCB 216 via a conventional mechanical standoff or metal spacer, the force applied to the daughter card can be transferred to the main PCB 216, which can potentially cause damage to the main PCB 216. As described herein, the midplane 212 alternatively includes: a base structure 232 to which the daughter card 228 and the main PCB 216 (e.g., on either side of the base structure 232) are mounted; and a secondary base structure 236 (e.g., which can be coupled to the base structure 232 and / or integrated or formed with the base structure 232), wherein the daughter card 228 is located near one or more upper surfaces 240 in one or more upper cavities 244 defined within the base structure 232. For example, the one or more upper cavities 244 can be at least partially shaped to conform to the daughter card 228. Alternatively, the shape of the one or more upper cavities 244 may be independent of the shape of the daughter card 228 .

[0094] It should be noted that secondary base structure 236 may include one or more apertures, raised portions, slotted portions, or other shapes or contours to at least partially conform to components of main PCB 216 and / or daughter card 228, including but not limited to electrical ports.

[0095] It should be noted that the daughter card 228 can rest or rest on one or more upper surfaces 240 within the upper cavity 244 and / or on one or more protrusions 248 extending upward from the one or more upper surfaces 240 so that any pressure or force applied to the daughter card 228 (e.g., via the springs and pads of the spring-loaded heat pipe assembly 208) will be distributed around the middle plate 212 and the base structure 232, rather than directly on the main PCB 216. In some non-limiting examples, where a fastener is used to secure the daughter card 228 to the middle plate 212, the fastener can engage the one or more protrusions 230. The middle plate 212 is referred to as FIG. 3A to FIG. 3F shown and described in more detail.

[0096] It should be noted that the intermediate plate 212 can be manufactured by casting, machining, three-dimensional (3D) printing, welding or other attachment technology, or other manufacturing technology. The intermediate plate 212 can be manufactured in a single step or multiple sets of steps. Before, during and / or after manufacturing, the intermediate plate 212 may require pre-treatment and / or post-treatment.

[0097] The middle plate 212 and the main PCB 216 can be coupled to form a second subassembly. Optionally, without departing from the scope of the present disclosure, when forming the second subassembly, the combined middle plate 212 and the main PCB 216 can be coupled to the bottom cover 220, or the bottom cover 220 is a separate component or a third subassembly to be coupled to the second subassembly. Additionally, any daughter card 228, integrated circuit, processing unit, etc. can be coupled or connected to the main PCB 216 on a different (e.g., opposite) side of the middle plate 212 than the side on which the main PCB 216 is coupled to the middle plate 212. For example, the main PCB 216 can be coupled to the bottom side of the middle plate 212 (e.g., the bottom side of the base structure 232), and the daughter card 228 can be coupled to the top side of the middle plate 212 (e.g., the top side of the base structure 232). It should be noted that the top and bottom sides of the base structure 232 (and therefore the middle plate 212) are different in appearance. FIG. 3A to FIG. 3F In some examples, the daughter card 228 can be coupled to the middle plate 212 before the combined middle plate 212 and the main PCB 216 are coupled to the bottom cover 220. In other examples, the daughter card 228 can be coupled to the middle plate 212 after the combined middle plate 212 and the main PCB 216 are coupled to the bottom cover 220.

[0098] Then, the first subassembly including the cold plate 204 and the heat pipe assembly 208 can be coupled to the second subassembly including the middle plate 212, the main PCB 216, and the optional bottom cover 220 (where the bottom cover 220 is part of the second subassembly). Alternatively, the bottom cover 220 can be coupled to the combined first and second subassembly, rather than being coupled to the second assembly before coupling the first subassembly.

[0099] The electronic device package 104 may also include a plurality of other components mounted between the other components described above. For example, the electronic device package 104 may include one or more gaskets or O-rings 252 (e.g., preformed silicone rings within channels or grooves in the middle plate 212, the cold plate 204, and / or the bottom cover 220), additional thermal isolation members, clamps, and / or other additional components. For example, additional components may be placed between the cold plate 204 and the heat pipe assembly 208 or around the cold plate and the heat pipe assembly. In addition, additional components may be placed between the middle plate 212 and the main PCB 216 or around the middle plate and the main PCB. Further, additional components may be placed between the main PCB 216 and the bottom cover 220 or around the main PCB and the bottom cover, between the first subassembly and the second subassembly or around the first subassembly and the second subassembly (e.g., substantially between the heat pipe assembly 208 and the middle plate 212 or around the heat pipe assembly and the middle plate). Further, additional components may be placed between the second subassembly and the bottom cover 220 or around the second subassembly and the bottom cover (e.g., in the case where the second subassembly does not include the bottom cover 220). In some examples, a plurality of other components may be configured to ensure that fluids (e.g., water, air, etc.) and / or particles (e.g., dust, or other particles) do not enter between any components of the electronic device package 104 (e.g., to provide an airtight seal to the processing unit, integrated circuit, SOC, main PCB 216, daughter card 228, etc.). Additionally, a plurality of other components may provide other forms of protection for the components of the electronic device package 104. For example, a plurality of other components may provide structural support within the electronic device package 104 (e.g., to prevent any component from being compressed or twisted), provide spacing between components (e.g., to prevent heat from being trapped in different areas of the electronic device package 104), provide electromagnetic interference (EMI) protection (e.g., conductive graphite fabric on foam, etc., for the purpose of grounding conduction), or other forms of protection not described herein and outside the scope of the present disclosure. Additionally, the electronic device package 104 may include a plurality of screws that are not expressly listed or described herein for abutting any given component of the electronic device package 104 .

[0100] In some embodiments, the midplane 212 includes one or more positioning features 256. For example, the one or more positioning features 256 can engage with corresponding features on the main PCB 216 and / or the daughter card 228. As another example, the one or more positioning features 256 can engage with corresponding features on the cold plate 204 and / or the bottom cover 220. It should be noted that positional tolerance of the daughter board 228 relative to the main PCB 216 can be provided by the one or more positioning features 256, and the one or more positioning features 256 can engage at least one of the main PCB 216 and the daughter board 228. In this regard, a "floating" connector 218 that allows for component deflection or displacement can be used in conjunction with other rigid or semi-rigid xy positioning or tolerance features (such as positioning features 256) between the main PCB 216 and the daughter card 228. In some non-limiting examples, the positioning features 256 can include, but are not limited to, reference pins or recesses in the midplane 212.

[0101] It should be noted herein that references to first and second, upper and lower, etc., should not be construed as limiting a particular set of printed circuit boards, cavities, directions, etc. For example, without departing from the scope of the present disclosure, the main PCB 216 (or multiple printed circuit boards 216) may be considered as multiple first printed circuit boards or multiple second printed circuit boards inserted into multiple first cavities or multiple second cavities from a first direction or a second direction (or any direction). As another example, without departing from the scope of the present disclosure, the daughter card 228 (or multiple printed circuit boards 228) may be considered as multiple first printed circuit boards or multiple second printed circuit boards inserted into multiple first cavities or multiple second cavities from a first direction or a second direction (or any direction).

[0102] Figure 3A A top view 300 of an intermediate plate assembly of an electronic device package in a first assembled state according to an embodiment of the present disclosure is depicted. Figure 3A The top view 300 described may implement Figure 1 and Figure 2 For example, the top view 300 of the intermediate plate assembly can be as shown in FIG. Figure 2 A view of the intermediate plate 212 is described, which may be as shown in FIG. Figure 1 and Figure 2 A portion of the electronic device package 104 is depicted. In some examples, the midplane 212 can include a base structure 232 as previously described.

[0103] As described herein, the midplane 212 may be implemented to connect one or more daughter cards 304 (eg, as described in reference Figure 2 The daughter card 228 described above is stacked on a motherboard (eg, as shown in FIG. Figure 2 It should be understood that any embodiment directed to daughter card 228 may also be directed to daughter card 304, and vice versa, unless otherwise noted.

[0104] One or more daughter cards 304 (eg, additional PCBs) may be mounted to an upper side 308 (eg, top side) of the base structure 232 of the midplane 212. Figure 3C and Figure 3D As described above, the motherboard (e.g., main PCB 216) can be mounted to the lower side 312 (e.g., bottom side) of the base structure 232 of the middle plate 212 opposite to the upper side 308. Additionally, the middle plate 212 can include one or more apertures 316. For example, the middle plate 212 can include a first aperture 316A and a second aperture 316B located on opposite sides (e.g., left and right sides) of the middle plate 212. In some embodiments, the apertures 316 can be such that as described with reference to Figure 2 The components of the cold plate 204 and / or heat pipe assembly 208 are depicted closer to the motherboard (eg, main PCB 216 ) to absorb heat generated by the motherboard, thereby providing a heat dissipation path for the motherboard (eg, main PCB 216 ).

[0105] exist Figure 3A In a non-limiting example, four (4) daughter cards 304 are mounted to the base structure 232 of the middle plate 212, and these daughter cards include a first daughter card 304A, a second daughter card 304B, a third daughter card 304C and a fourth daughter card 304D. As used herein, the daughter card 304 may include or may be referred to as a processing unit, such as but not limited to a SOC. In some embodiments, the processing units may be located on any number of separate PCBs, or they may all be located on the same PCB (e.g., separate daughter cards or the same daughter card). For example, the number of processing units / SOCs in the electronic device package 104 may be greater than or equal to the number of PCBs in the electronic device package 104. In some embodiments, the plurality of separate processing units may include four (4) processing units. Additionally or alternatively, any given number of processing units (e.g., less than four (4) processing units or more than four (4) processing units) may be included in the electronic device package 104 and mounted to the middle plate 212.

[0106] In some embodiments, the base structure 232 of the midplane 212 includes one or more spacers 320 that are manufactured together with the frame 324 or formed separately and inserted into and / or coupled to the frame 324. The combination of the frame 324 and the one or more spacers 320 for the base structure 232 can segment the upper side 308, which includes specific defined areas for one or more of the daughter cards 304.

[0107] Figure 3B A top view 301 of an intermediate plate assembly of an electronic device package 104 in a second assembled state according to an embodiment of the present disclosure is depicted. Figure 3B The top view 301 described may implement Figure 1 , Figure 2 and Figure 3A For example, the top view 301 of the intermediate plate assembly can be as shown in FIG. Figure 2 and Figure 3A A view of the intermediate plate 212 is described, which may be as shown in FIG. Figure 1 and Figure 2 A portion of an electronics package 104 is depicted.

[0108] In some embodiments, as shown in reference Figure 3A The first assembled state described may include the daughter card 304 being mounted to the base structure 232 of the midplane 212. Figure 3B The second assembly state described and shown in the example of FIG. 1 may include one or more thermal isolation members 328 (e.g., as shown in reference Figure 2 The depicted thermal spacer 224 is coupled to the base structure 232 of the midplane 212 and at least partially surrounds the daughter card 304. It should be understood that any embodiments directed to the thermal spacer 224 may be directed to the thermal spacer 328, and vice versa, unless otherwise noted.

[0109] Thermal spacer 328 may have a TIM applied to its top side to help transfer heat generated from daughter card 304 to heat pipe assembly 208 and cold plate 204, as described and illustrated. Figure 2 Additionally, thermal isolation member 328 can provide physical protection for various components of daughter card 304 .

[0110] exist Figure 3B In the example of FIG. 3 , a corresponding thermal spacer 328 is provided for each of the daughter cards 304. For example, a first thermal spacer 328A is provided for the first daughter card 304A, a second thermal spacer 328B is provided for the second daughter card 304B, a third thermal spacer 328C is provided for the third daughter card 304C, and a fourth thermal spacer 328D is provided for the fourth daughter card 304D. Additionally or alternatively, although not shown, the number of thermal spacers 328 may be less than the number of daughter cards 304. For example, one thermal spacer 328 may be provided for multiple daughter cards 304.

[0111] In some embodiments, the combination of the frame 324 and one or more spacers 320 for the base structure 232 can segment the upper side 308 into specific defined areas for one or more of the daughter cards 304 and corresponding thermal spacers 328 .

[0112] Figure 3C A bottom view 302 of a midplane assembly of an electronic device package in an unassembled state is depicted according to an embodiment of the present disclosure. Figure 3C The bottom view 302 described may implement Figure 1 , Figure 2 , Figure 3A and Figure 3B For example, the bottom view 302 of the intermediate plate assembly can be as shown in reference Figure 2 , Figure 3A and Figure 3B The intermediate plate 212 is shown in FIG. Figure 1 and Figure 2 1. In some examples, bottom view 302 may represent an unassembled state of middle plate 212, where as shown in FIG. Figure 2 , Figure 3A and Figure 3B The depicted daughter card 304 , motherboard (eg, main PCB 216 ), and thermal spacer 328 are not coupled to the midplane 212 .

[0113] like Figure 3C As shown in the example of FIG. 3 , the midplane 212 may include one or more connection entry points 332 (e.g., additional apertures or through holes) within one or more lower surfaces 336 of the underside 312 in one or more lower cavities 340 defined within the base structure 232 (e.g., such as within the frame 324). The one or more connection entry points 332 may enable the daughter card 304 in the one or more upper cavities 244 to be connected or coupled to a motherboard (e.g., such as a motherboard) in the one or more lower cavities 340. Figure 2216) such that the connection entry point 332 is operable as a through hole or connection between one or more upper cavities 244 and one or more lower cavities 340. For example, as previously described, in an assembled state, the midplane 212 may include a daughter card 304 mounted to an upper side 308 of a base structure 232 of the midplane 212 and a motherboard mounted to a lower side 312 of the base structure 232. Accordingly, the one or more connection entry points 332 may allow a connector 218 (e.g., a pin, a pin header, a socket, a board-to-board connector, a high-speed connector, or an additional type of connector) of the motherboard to pass through the base structure 232 of the midplane 212 so that the daughter card 304 can be connected or coupled to the motherboard, and / or allow a connector of the daughter card 304 to pass through the base structure 232 of the midplane 212 to connect with the motherboard. It should be noted herein that the arrangement of the main PCB 216 and the daughter card 304 may be different without departing from the scope of the present disclosure, including but not limited to the main PCB 216 being positioned within one or more upper cavities 244 and the daughter card 304 being positioned within one or more lower cavities 340 .

[0114] Although in Figure 3C 332 (e.g., first connection entry point 332A, second connection entry point 332B, third connection entry point 332C, and fourth connection entry point 332D), but it should be understood that the number of connection entry points 332 can be different from four (4) (e.g., less than or more than 4). In some embodiments, the number of connection entry points 332 can correspond to the number of daughter cards 304 configured, required, or used in the electronic device package 104.

[0115] It should be noted that if Figure 2 The motherboard (e.g., main PCB 216) shown in the figure can rest or rest on one or more lower surfaces 336 and / or on one or more protrusions 344 extending downwardly from one or more lower surfaces 336 so that any pressure or force applied to the motherboard is distributed around the middle plate 212 and the base structure 232. In the case where fasteners are used to secure the motherboard to the middle plate 212, the fasteners can engage one or more protrusions 344.

[0116] Figure 3D A bottom perspective view 303 of an intermediate plate assembly of an electronic device package in a third assembled state according to an embodiment of the present disclosure is depicted. Figure 3D The bottom-up perspective view 303 described may implement Figure 1 , Figure 2 , Figure 3A , Figure 3B and Figure 3CFor example, the bottom perspective view 303 of the intermediate plate assembly can be as shown in reference Figure 2 , Figure 3A , Figure 3B and Figure 3C A view of the intermediate plate 212 is described, which may be as shown in FIG. Figure 1 and Figure 2 A portion of an electronics package 104 is depicted.

[0117] like Figure 3D The third assembly state described in the example may include as reference Figure 2 The depicted main PCB 216 (e.g., motherboard) is mounted to the base structure 232 of the midplane 212. In some embodiments, the main PCB 216 can be mounted (e.g., mounted) directly to the base structure 232 of the midplane 212 in the z-direction to prevent interference with components of the main PCB 216. For example, any connector 218 on the main PCB 216 used to connect between the main PCB 216 and the daughter card 304 can be positioned to align with (e.g., Figure 3C 332) to prevent possible damage or interference to the connector 218 and other components of the main PCB 216. In some embodiments, the third assembly state can be as shown in reference Figure 3A and Figure 3B The first assembly state, the second assembly state, or both described above may be achieved before the first assembly state, the second assembly state, or both. That is, the main PCB 216 may be first mounted to the middle plate 212, then the daughter card 304 may be coupled to the main PCB 216 and mounted to the middle plate 212, and then the thermal isolation member 328 may be mounted to the middle plate 212, at least partially surrounding the daughter card 304. Additionally or alternatively, the first assembly state, the second assembly state, and the third assembly state may be achieved in a different order.

[0118] The main PCB 216 may generate heat similar to the daughter card 304 (e.g., based on current flowing through the resistive elements and / or other components of the main PCB 216). Accordingly, this heat must also be dissipated outside of the electronic device package 104 to prevent possible failure and damage, or to prevent reducing the life of the electronic device package 104. As previously described, the aperture 316 may allow a portion of the cold plate 204 to pass through the base structure 232 of the midplane 212 to absorb heat generated by the main PCB 216 (e.g., the aperture 316 provides a heat dissipation route for the main PCB 216). By allowing a portion of the cold plate 204 to pass through the base structure 232 of the midplane 212, the overall height of the electronic device package 104 may be reduced, which is beneficial because the electronic device package 104 may be mounted into a tighter space while still maintaining the desired qualities in terms of thermal conductivity and heat dissipation.

[0119] Figure 3E A top perspective view 345 of an intermediate plate assembly according to an embodiment of the present disclosure is depicted. In some examples, as shown in FIG. Figure 3E The top view 345 described may implement Figure 1 , Figure 2 , Figure 3A , Figure 3B , Figure 3C and Figure 3D For example, the top perspective view 345 of the intermediate plate assembly can be as shown in reference Figure 2 , Figure 3A , Figure 3B , Figure 3C and Figure 3D The intermediate plate 212 is shown in FIG. Figure 1 and Figure 2 A portion of an electronics package 104 is depicted.

[0120] Figure 3E The middle plate 212 is shown with a frame 324, including an upper surface 240 and a corresponding upper cavity 244, a protrusion 248, a positioning member 256, apertures 316A, 316B, and connection entry points 332A-332D. The frame 324 includes port cavities 360 that are at least partially shaped to conform to a connector 364 (e.g., such as a connector 364) that is part of a printed circuit board (e.g., the main PCB 216). Figure 3D shown).

[0121] Figure 3F A top perspective view 346 of an intermediate plate assembly according to an embodiment of the present disclosure is depicted. In some examples, as shown in FIG. Figure 3F The top view 346 described may implement Figure 1 , Figure 2 , Figure 3A , Figure 3B , Figure 3C Figure 3D and Figure 3E For example, the top perspective view 346 of the intermediate plate assembly can be as shown in reference Figure 2 , Figure 3A , Figure 3B , Figure 3C , Figure 3D and Figure 3E The intermediate plate 212 is shown in FIG. Figure 1 and Figure 2 A portion of an electronics package 104 is depicted.

[0122] Figure 3FThe middle plate 212 is shown with a frame 324, including an upper surface 240 and a corresponding upper cavity 244, a protrusion 248, a positioning member 256, apertures 316A, 316B, connection entry points 332A-332D, and a port cavity 360. The frame 324 includes a cutout 368 that passes through the frame 324 and is located between the upper and lower surfaces of the middle plate 212. In some embodiments, the cutout 368 can be used to allow passage or access of electrical connectors, passage or access of heat transfer components, and / or to allow the assembled cold plate 204 and heat pipe assembly 208 and / or bottom cover 220 (e.g., as Figure 2 368) is positioned relative to the middle plate 212. For example, the cutouts 368 can be used to debug components of the electronic device package 104 when being assembled, when fully assembled, and / or during repair. It should be noted that one or more of the cutouts 368 can be aligned with corresponding cutouts or protrusions of the assembly cold plate 204 and heat pipe assembly 208 and / or bottom cover 220. In addition, it should be noted that one or more of the cutouts 368 can be positioned within the frame 324 so as not to interfere with the positioning of the main PCB 216 and / or daughter cards 228 / 304, as described throughout this disclosure. It should be noted that Figure 3F includes cutout 368, and FIG. 3A to FIG. 3E The cutout 368 is not included, but without departing from the scope of the present disclosure, Figure 3F The intermediate plate 212 including the cutout 368 may be similarly Figure 1 and Figure 2 The electronic device package 104 is used together with the electronic device package 104.

[0123] Figure 4 Depicted is a bottom perspective view 400 of a heat pipe assembly of an electronic device package in an assembled state, according to an embodiment of the present disclosure. Figure 4 Can be implemented Figure 1 , Figure 2 and FIG. 3A to FIG. 3F For example, the bottom-up stereogram 400 may be for reference to Figures 1 to 3D A view of the cold plate 204 and heat pipe assembly 208 assembled together with the electronic device package 104 is depicted.

[0124] The assembled cold plate 204 and heat pipe assembly 208 may include one or more protrusions 404 (eg, a first protrusion 404A and a second protrusion 404B). Figure 3A and Figure 3D As described, the main PCB 216 can generate heat similar to the daughter card 304. Accordingly, the protrusion 404 can be configured to pass through an aperture in the middle plate 212 (e.g., as shown in FIG. FIG. 3A to FIG. 3FThe aperture 316 shown and described in the example of FIG. 4 is provided to be in close proximity to the main PCB 216 so that the protrusion 404 can absorb heat generated by the main PCB 216 and provide a heat dissipation path for the generated heat.

[0125] Figure 5 A top view 500 of a bottom cover of an electronic device package in an assembled state is depicted according to an embodiment of the present disclosure. Figure 5 Can be implemented Figure 1 , Figure 2 , FIG. 3A to FIG. 3F and Figure 4 For example, the top view 500 may be as shown in FIG. Figures 1 to 4 A depicted view of a bottom cover 220 of an electronic device package 104 . In part, the bottom cover 220 can provide structural support to the electronic device package 104 and provide a hermetic seal to prevent fluids or particles from entering the electronic device package 104 .

[0126] Additionally, the bottom cover 220 may include one or more surfaces 504 (eg, a first surface 504A and a second surface 504B). The surface 504 may be Figure 4 The protrusion 404 of the cold plate 204 and the heat pipe assembly 208 described in the example of FIG. 5 provides a proximal contact surface. For example, the protrusion 404 can pass through the aperture 316 of the middle plate 212 and contact or be in close proximity with the surface 504 to help absorb the heat generated by the main PCB 216. For example, a portion of the main PCB 216 can contact the bottom cover 220, wherein the heat generated by the main PCB 216 is distributed on or through the bottom cover 220. Accordingly, the surface 504 can provide a heat dissipation route for the heat generated from the bottom cover 220 and the main PCB 216 to the cold plate 204 so as to dissipate the heat to the outside of the electronic device package 104.

[0127] In some embodiments, the bottom cover 220 and / or the cold plate 204 include one or more apertures that can be used to couple the bottom cover 220 to the cold plate 204 and / or the middle plate 212. For example, a first set of fasteners can pass through the apertures of the bottom cover 220 to engage aligned apertures in the middle plate 212, and a second set of fasteners can pass through the apertures of the cold plate 204 to engage aligned apertures in the middle plate 212.

[0128] Alternatively, fasteners may pass through apertures of the bottom cover 220 to engage the cold plate 204 , including through intervening aligned apertures in the middle plate 212 or with the middle plate 212 at least partially contained within an enclosure formed by the cold plate 204 and the bottom cover 220 .

[0129] Further, fasteners may be passed through apertures of the cold plate 204 to engage the bottom cover 220 , including through intervening aligned apertures in the middle plate 212 or with the middle plate 212 at least partially contained within an enclosure formed by the cold plate 204 and the bottom cover 220 .

[0130] Figure 6 A flow chart of a method or process 600 for assembling an electronic device package according to an embodiment of the present disclosure is depicted. For example, the method or process 600 may be used to form and assemble an electronic device package as described in reference Figure 1 The electronic device package 104 described herein includes at least one of the electronic device packages described herein and with reference to Figures 2 to 5 The intermediate plate 212 described. Although Figure 6 The general order of the steps of method or process 600 is shown in FIG. 6 , but method or process 600 may include more or fewer steps, or may be combined with other steps. Figure 6 The steps shown in the figure may be arranged in different order (including simultaneously, substantially simultaneously or sequentially). Generally, the method or process 600 begins with a start operation 602 and ends with an end operation 622. The method or process 600 may be performed, but is not limited to, as a set of computer executable instructions executed by an assembly machine (e.g., a robotic assembly system, an automated assembly system, a computer-aided drafting (CAD) machine, etc.) and encoded or stored on a computer-readable medium. Hereinafter, reference will be made to the method or process 600 in conjunction with the method or process 600. Figures 1 to 5 The described components, devices, assemblies, environments, etc. are used to explain the method or process 600.

[0131] In step 604, the heat pipe assembly 208 and the cold plate 204 are aligned and coupled based on at least one or more alignment pins. In some examples, before the heat pipe assembly 208 and the cold plate 204 are aligned, multiple sets of springs can be disposed on the top surface of the heat pipe assembly 208 and / or on the bottom surface of the cold plate 204 (generally meaning between the cold plate 204 and the heat pipe assembly 208) such that the multiple sets of springs are in contact with the cold plate 204 to apply a directional force in a direction opposite to the cold plate 204. In some examples, coupling the heat pipe assembly 208 can apply a directional force via the multiple sets of springs to move each of the multiple pads in a direction opposite to the cold plate 204. In some examples, a thermal interface such as a TIM can be inserted between the cold plate 204 and the heat pipe assembly 208. It should be noted herein that the heat pipe assembly 208 and the cold plate 204 form a subassembly when coupled.

[0132] It is noted herein that step 604 may be considered optional, such as in a non-limiting example where the cold plate 204 and the heat pipe assembly 208 are obtained as pre-built components of the electronic device package 104 without departing from the scope of the present disclosure.

[0133] In step 608, the plurality of first PCBs 216 are aligned with the middle plate 212. Optionally, the plurality of first PCBs 216 may be coupled to the middle plate 212.

[0134] In step 612, a plurality of second PCBs (eg, as shown in FIG. Figure 2 and FIG. 3A to FIG. 3F The one or more daughter cards 228 / 304 described herein, integrated circuits, processors, etc.) and the middle plate 212 are aligned and connected to the plurality of first PCBs. For example, the plurality of second PCBs 228 / 304 can be configured to engage with the middle plate 212 and / or the electrical connector 218 on the plurality of first PCBs 216 during / after alignment. Optionally, the plurality of second PCBs 228 / 304 can be connected to the middle plate 212. Accordingly, the plurality of first PCBs 216 and the plurality of second PCBs 228 / 304 can be electrically connected and communicatively connected after both are mounted to the middle plate 212. It should be noted herein that the middle plate 212, the plurality of first PCBs 216, and the plurality of second PCBs 228 / 304 form a subassembly when connected. In addition, it should be noted herein that one or more thermal isolation members 224 / 328 can be aligned and arranged with the plurality of second PCBs 228 / 304 so that the thermal isolation members 224 / 328 are part of the formed subassembly.

[0135] In this regard, the plurality of first PCBs 216 and the plurality of second PCBs 228 / 304 are aligned based on the connectors 218 of the plurality of first PCBs 216 passing through the one or more apertures 316. The connectors 218 can provide xy positioning and tolerance for the plurality of second PCBs 228 / 304, which can access the connectors via the one or more apertures 316. However, it should be noted that the positioning features 256 on the middle plate 212 can provide xy positioning and tolerance for the plurality of first PCBs 216 and / or the plurality of second PCBs 228 / 304 (rather than the connectors 218) without departing from the scope of the present disclosure, including in the case where the connectors 218 are "floating connectors" that can be deflected or displaced in combination with rigid or semi-rigid positioning features 256.

[0136] In this way, the positioning of the plurality of second PCBs 228 / 304 is not dependent on the placement of fasteners that may be used to couple the plurality of first PCBs 216 / multiple second PCBs 228 / 304 to the middle plate 212. Thus, any apertures of fasteners used to couple the plurality of first PCBs 216 / multiple second PCBs 228 / 304 to the middle plate 212 may be made oversized or oversized (e.g., larger than the shaft diameter, but smaller than the washer diameter or head diameter of the fastener) relative to the fastener or positioning member 256, or at least have looser tolerances than in previously known electronic device package configurations. This allows for accounting for manufacturing error tolerances (e.g., viewing the middle plate 212, etc.) and reduces the likelihood of applying stresses and force transfers that could damage the plurality of first PCBs 216 / multiple second PCBs 228 / 304. This also allows the plurality of first PCBs 216 / plurality of second PCBs 228 / 304 to move slightly relative to the middle plate 212, thereby providing a greater chance of alignment with the fastener engagement location, even in the event of possible manufacturing errors.

[0137] Additionally, the positioning of the plurality of first PCBs 216 and the plurality of second PCBs 228 / 304 depending on the connector 218 or the positioning member 256 can address tolerance issues that arise with selected components (e.g., the middle plate 212) during manufacturing, thereby reducing the need for post-processing of the selected components to ensure that the plurality of first PCBs 216 and the plurality of second PCBs 228 / 304 are properly mounted within the electronic device package 104. However, it should be noted that the peripheral walls of the one or more upper cavities 244 and the one or more lower cavities 340 can provide supplemental positioning for the plurality of first PCBs 216 and / or the plurality of second PCBs 228 / 304, wherein the tolerances in the middle plate 212 are correct.

[0138] In step 616, the subassembly from step 612 and the bottom cover 220 are aligned and coupled. It should be noted herein that the bottom cover 220 can be a component of the subassembly from step 612, or a new subassembly can be formed by coupling the bottom cover 220 to the subassembly from step 612 without departing from the scope of the present disclosure.

[0139] In step 620, the subassemblies from step 604 and the subassemblies from step 616 are aligned and coupled. In some cases, coupling bottom cover 220 to cold plate 204 can cause components (e.g., pads) of heat pipe assembly 208 to contact corresponding PCBs of plurality of second PCBs 228 / 304 of middle plate 212 based on multiple sets of springs applying directional forces opposite to cold plate 204. By mounting one or more additional PCBs to middle plate 212, the directional forces applied by the springs to the one or more additional PCBs can be distributed in base structure 232 of middle plate 212 rather than being transferred to plurality of first PCBs 216.

[0140] In some examples, coupling the bottom cover 220 and the cold plate 204 provides an airtight seal for the plurality of first PCBs 216 and the plurality of second PCBs 228 / 304 of the middle plate 212. In some examples, coupling the bottom cover 220 to the cold plate 204 can also provide a heat dissipation route for heat generated by the plurality of first PCBs 216 based on the configuration of the cold plate 204 as a protrusion that passes through an aperture of the middle plate 212, contacts the bottom cover 220, or both.

[0141] It should be noted herein that steps 616 and / or 620 may be considered optional, such as in a non-limiting example, where a subassembly including a plurality of first PCBs 216, a plurality of second PCBs 228 / 304, an intermediate plate 212, and optional thermal isolation members 224 / 328 are constructed and then provided as a stand-alone assembly for further construction at another time or location without departing from the scope of the present disclosure.

[0142] In a non-limiting example, one or more steps (e.g., steps 604, 608, 616) may occur in a first direction (e.g., a first z-direction), while one or more steps (e.g., steps 612, 620) may occur in a second direction (e.g., a second z-direction substantially opposite to the first z-direction). Different z-directions may require flipping or otherwise reorienting different components and subassemblies as described throughout this disclosure.

[0143] It should be noted that the electronic device package 104 as described throughout this disclosure can be disassembled for repair. During repair, some components (e.g., thermal isolation 224 / 328) may need to be reapplied along with any non-working components, but other components of the electronic device package 104 can be reused.

[0144] Exemplary systems and methods of the present disclosure have been described with respect to thermal control of electronic device packages and sealed electronic devices. However, in order to avoid unnecessarily obscuring the present disclosure, the foregoing description omits many known structures and devices. This omission should not be construed as a limitation on the scope of the claimed disclosure. Many specific details are set forth to provide an understanding of the present disclosure. However, it should be understood that the present disclosure can be practiced in a variety of ways beyond the specific details set forth herein.

[0145] Many variations and modifications of the disclosure may be used. Some features of the disclosure may be provided without providing other features. In some embodiments, the disclosure provides an electrical interconnection device that can be used between any power source and a destination. Although the disclosure describes the connection between a battery module and a corresponding management system, the embodiments of the disclosure should not be limited thereto.

[0146] References in the specification to "one embodiment," "an embodiment," "an example embodiment," "some embodiments," etc. indicate that the described embodiments may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in conjunction with one embodiment, it is indicated that the description of such feature, structure, or characteristic may apply to any other embodiment unless so stated and / or unless it is obvious to a person skilled in the art from the specification.

[0147] Although the present disclosure describes the components and functions implemented in the embodiments with reference to specific standards and protocols, the present disclosure is not limited to such standards and protocols. Other similar standards and protocols not mentioned herein exist and are considered to be included in the present disclosure. In addition, the standards and protocols mentioned herein and other similar standards and protocols not mentioned herein are regularly replaced by faster or more effective equivalents with substantially the same functions. Such alternative standards and protocols with the same functions are considered to be equivalents included in the present disclosure.

[0148] The present disclosure includes, in various embodiments, configurations, and aspects, components, methods, processes, systems, and / or devices substantially as depicted and described herein, including various embodiments, subcombinations, and subsets thereof. Those skilled in the art will understand how to make and use the systems and methods disclosed herein after understanding the present disclosure. The present disclosure includes, in various different embodiments, configurations, and aspects, in the absence of matters not depicted and / or described herein, or in its different embodiments, configurations, or aspects, in the absence of such matters that may have been used in previous devices or processes, providing devices and processes, for example, for improving performance, achieving convenience, and / or reducing implementation costs.

[0149] The foregoing discussion of the disclosure has been presented for the purpose of illustration and description. The foregoing is not intended to limit the disclosure to one or more forms disclosed herein. In the above-mentioned specific embodiments, for the purpose of streamlining the disclosure, various features of the disclosure are combined in one or more embodiments, configurations or aspects. The features of the embodiments, configurations or aspects of the disclosure may be combined in alternative embodiments, configurations or aspects other than those discussed above. This approach to the disclosure should not be interpreted as reflecting the following intention: the disclosure claimed for protection requires more features than those explicitly stated in the claims. Rather, as reflected in the appended claims, the creative aspects rely on less than all the features of a single aforementioned disclosed embodiment, configuration or aspect. Therefore, the appended claims are hereby combined in the present specific embodiments, wherein each claim relies on itself as an independent preferred embodiment of the disclosure.

[0150] Moreover, although the description of the present disclosure has included descriptions of one or more embodiments, configurations, or aspects and certain variations and modifications, other variations, combinations, and modifications are also within the scope of the present disclosure, for example, as may be within the skill and knowledge of a person skilled in the art after understanding the present disclosure. It is intended to obtain rights to include alternative embodiments, configurations, or aspects to the extent permitted, including alternative, interchangeable, and / or equivalent structures, functions, ranges, or steps to those claimed, regardless of whether such alternative, interchangeable, and / or equivalent structures, functions, ranges, or steps are disclosed herein, and it is not intended to publicly dedicate any patentable subject matter.

[0151] The phrases "at least one", "one or more", and "and / or" are open-ended expressions that are both conjunctive and disjunctive in operation. For example, each of the expressions "at least one of A, B, and C", "at least one of A, B, or C", "one or more of A, B, and C", "one or more of A, B, or C", and "A, B, and / or C" means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B, and C together. When each of A, B, and C in the above expressions refers to an element (such as X, Y, and Z) or a class of elements (such as X1-X n 、Y1-Y m and Z1-Z o ), the phrase is intended to mean a single element selected from X, Y, and Z, a combination of elements selected from the same class (e.g., X1 and X2), and a combination of elements selected from two or more classes (e.g., Y1 and Z o ).

[0152] The term "a" or "an" entity refers to one or more of that entity. Thus, the terms "a" (or "an"), "one or more" and "at least one" are used interchangeably herein. It should also be noted that the terms "includes," "comprising," and "having" are used interchangeably.

[0153] As used herein, the term "automatic" and variations thereof refer to any process or operation that is completed without significant human input in the performance of the process or operation, which is typically continuous or semi-continuous. However, a process or operation may be automatic if input is received prior to the performance of the process or operation, even if the performance of the process or operation uses significant or insignificant human input. Human input is considered significant if such input affects the manner in which the process or operation is performed. Human input that consents to the performance of the process or operation is not considered "significant."

[0154] As used herein, the terms "determine," "calculate," "infer," and variations thereof are used interchangeably and include any type of methodology, process, mathematical operation, or technique.

Claims

1. An intermediate plate structure for an electronic device package, the intermediate plate structure comprising: a base structure, the base structure comprising a frame; a plurality of first cavities defined within the frame at a first side of the base structure, the plurality of first cavities configured to receive a plurality of first printed circuit boards from a first direction; a plurality of second cavities defined within the frame at a second side of the base structure, the plurality of second cavities configured to receive a plurality of second printed circuit boards from a second, different orientation; as well as One or more connection access points connecting the plurality of first cavities to the plurality of second cavities.

2. The intermediate plate structure according to claim 1, wherein: The plurality of first cavities are configured to be at least partially shaped to conform to the plurality of first printed circuit boards, wherein the plurality of second cavities are configured to be at least partially shaped to conform to the plurality of second printed circuit boards, and wherein the plurality of second cavities include surfaces on which the plurality of second printed circuit boards are positioned.

3. The intermediate plate structure of claim 1, wherein the base structure further comprises one or more spacers, wherein: The one or more dividers and the frame define the plurality of second cavities.

4. The intermediate plate structure according to claim 1, wherein: The plurality of second cavities are configured to receive one or more thermal spacers inserted from the different second direction.

5. The intermediate plate structure of claim 1, wherein the base structure further comprises: At least one aperture is located in the base structure, wherein the at least one aperture is operable to transfer heat from at least one of the first plurality of printed circuit boards and the second plurality of printed circuit boards to a cooling structure for dissipation into an ambient environment.

6. The intermediate plate structure according to claim 1, wherein: A plurality of connectors electrically connect the plurality of first printed circuit boards to the plurality of second printed circuit boards via the one or more connection entry points, and wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by the plurality of connectors on the plurality of first printed circuit boards, and the plurality of second printed circuit boards are able to access the plurality of connectors on the plurality of first printed circuit boards via the one or more connection entry points.

7. The intermediate plate structure according to claim 1, wherein: Position tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by at least one positioning feature on the base structure, and wherein the at least one positioning feature is operable to engage at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards.

8. The intermediate plate structure according to claim 1, wherein: The different second direction is a direction opposite to the first direction.

9. An electronic device package, comprising: a plurality of first printed circuit boards; a plurality of second printed circuit boards; as well as An intermediate plate structure, the intermediate plate structure comprising: a base structure, the base structure comprising a frame; a plurality of first cavities defined within the frame at a first side of the base structure, the plurality of first cavities configured to receive the plurality of first printed circuit boards from a first direction; a plurality of second cavities defined within the frame at a second side of the base structure, the plurality of second cavities configured to receive the plurality of second printed circuit boards from a second, different direction; and One or more connection access points connecting the plurality of first cavities to the plurality of second cavities.

10. The electronic device package of claim 9, further comprising: Cold plate; Heat pipe assembly; as well as Bottom cover, wherein the alignment of the cold plate with the mid-plate structure positions the heat pipe assembly proximate the second side of the mid-plate structure, and Wherein, the bottom cover is operable to be positioned proximate to the first side of the mid-panel structure.

11. The electronic device package of claim 10, the cold plate comprising at least one protrusion, and the base structure comprising at least one aperture in the base structure, in, The at least one aperture is operable to transfer heat from at least one of the first and second plurality of printed circuit boards via the at least one protrusion to be dissipated to an ambient environment via the heat pipe assembly.

12. The electronic device package according to claim 9, wherein: The plurality of first cavities are configured to be at least partially shaped to conform to the plurality of first printed circuit boards, wherein the plurality of second cavities are configured to be at least partially shaped to conform to the plurality of second printed circuit boards, and wherein the plurality of second cavities include surfaces on which the plurality of second printed circuit boards are positioned.

13. The electronic device package of claim 9, the base structure further comprising one or more spacers, wherein: The one or more dividers and the frame define the plurality of second cavities.

14. The electronic device package according to claim 9, wherein: A plurality of connectors electrically connect the plurality of first printed circuit boards to the plurality of second printed circuit boards via the one or more connection entry points, and wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by the plurality of connectors on the plurality of first printed circuit boards, and the plurality of second printed circuit boards are able to access the plurality of connectors on the plurality of first printed circuit boards via the one or more connection entry points.

15. The electronic device package according to claim 9, wherein: Position tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by at least one positioning feature on the base structure, and wherein the at least one positioning feature is operable to engage at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards.

16. The electronic device package according to claim 9, wherein: The different second direction is a direction opposite to the first direction.

17. A method for assembling an integrated electronic device package, the method comprising: An intermediate plate structure is provided, wherein the intermediate plate structure comprises: a base structure, the base structure comprising a frame; a plurality of first cavities defined within the frame on a first side of the base structure; a plurality of second cavities defined within the frame on a second side of the base structure; and one or more connection entry points connecting the plurality of first cavities to the plurality of second cavities, aligning a plurality of first printed circuit boards with the plurality of first cavities of the midplane structure from a first direction; aligning a plurality of second printed circuit boards with the plurality of second cavities of the midplane structure from a second, different direction; and The plurality of second printed circuit boards are coupled to the plurality of first printed circuit boards via the one or more connection entry points to form a subassembly of the midplane structure, the plurality of first printed circuit boards, and the plurality of second printed circuit boards.

18. The method of claim 17, further comprising: aligning a bottom cover with the formed subassembly proximate the first side of the mid-panel structure; coupling the bottom cover to the formed subassembly; aligning a cold plate and a heat pipe assembly with the formed subassembly, wherein the alignment of the cold plate and the mid-plate structure positions the heat pipe assembly proximate the second side of the mid-plate structure; as well as The cold plate and the heat pipe assembly are coupled to the formed subassembly.

19. The method of claim 17, wherein: A plurality of connectors electrically connect the plurality of first printed circuit boards to the plurality of second printed circuit boards via the one or more connection entry points, and wherein a positional tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by the plurality of connectors on the plurality of first printed circuit boards, and the plurality of second printed circuit boards are able to access the plurality of connectors on the plurality of first printed circuit boards via the one or more connection entry points.

20. The method of claim 17, wherein: Position tolerance of the plurality of second printed circuit boards relative to the plurality of first printed circuit boards is provided by at least one positioning feature on the base structure, and wherein the at least one positioning feature is operable to engage at least one of the plurality of first printed circuit boards and the plurality of second printed circuit boards.

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