High-performance copper wire drawing intelligent control method and equipment

Abstract

The invention is suitable for the technical field of copper wire drawing control, and particularly relates to a high-performance copper wire drawing intelligent control method and device. Acquiring a first sound pattern and a second sound pattern; performing analysis according to the mold parameters and the first sound graph to obtain a propagation speed; analyzing according to the propagation speed, the first sound graph and the second sound graph to obtain a collision position; analyzing according to the first sound graph and the propagation speed to obtain sound attenuation; and analyzing according to the collision position, the first sound pattern and the sound attenuation to obtain a wear condition. According to the high-performance copper wire drawing intelligent control method provided by the invention, the wire drawing die does not need to be stripped from a production line for detection, so that the detection time consumption is reduced, the detection efficiency is improved, and real-time online monitoring can be realized.

Description

Technical Field

[0001] The present application belongs to the field of copper wire drawing control technology, and in particular, relates to a high-performance copper wire drawing intelligent control method and equipment. Background Art

[0002] Copper wire drawing refers to the production of copper wire with excellent properties that meet customer needs through production steps such as wire pretreatment, mold installation, parameter setting, monitoring and adjustment, and wire collection. Through precise and stable control of the wire drawing process and stable control of the working state of the wire drawing equipment, the production of copper wire drawing can be maintained at high efficiency and high performance to maintain the production needs of high-performance copper wire.

[0003] In the related technology, the wear condition of the wire drawing die is particularly important, especially when the working state of the wire drawing equipment is stably controlled. During the drawing process, the long-term friction between the wire drawing die and the copper wire will cause the inner diameter surface material of the wire drawing die to wear and consume, and finally increase the wear degree of the wire drawing die. The wear condition of the wire drawing die is generally detected by manual visual inspection or using magnifying glasses, microscopes and other tools to check the wear condition of the inner diameter surface of the wire drawing die. The manual visual inspection of the wear condition of the wire drawing die takes a long time and will affect the production progress. When the wear condition of the wire drawing die is inspected by using tools such as microscopes, it needs to be carried out when the production is stopped, and online real-time monitoring cannot be achieved. Summary of the invention

[0004] The embodiments of the present application provide a high-performance copper wire drawing intelligent control method and device, which can improve the problems of long detection time and inability to achieve online real-time monitoring.

[0005] In a first aspect, an embodiment of the present application provides a high-performance copper wire drawing intelligent control method, comprising:

[0006] Obtaining die parameters; wherein the die parameters are used to reflect the outer diameter circumference of the wire drawing die;

[0007] Acquire a first sound graph and a second sound graph; wherein the first sound graph is used to reflect the sound graph generated when the first sound detection device of the detection device receives a collision between the copper wire and the wire drawing die, and the second sound graph is used to reflect the sound graph generated when the second sound detection device of the detection device receives a collision between the copper wire and the wire drawing die, the first sound detection device and the second sound detection device are set at the outer diameter of the wire drawing die, and the connecting line between the first sound detection device and the second sound detection device is not the diameter of the wire drawing die;

[0008] The propagation speed is obtained by analyzing the die parameters and the first sound graph; wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die;

[0009] The collision position is obtained by analyzing the propagation speed, the first sound pattern and the second sound pattern; wherein the collision position is used to reflect the position where the copper wire collides with the wire drawing die;

[0010] Analyzing the first sound graph and the propagation speed to obtain sound attenuation; wherein the sound attenuation is used to reflect the value of the amplitude of the sound generated when the copper wire collides with the wire drawing die gradually decreasing with increasing distance;

[0011] The wear condition is obtained by analyzing the collision position, the first sound pattern and the sound attenuation.

[0012] The above technical solutions in the embodiments of the present application have at least the following technical effects:

[0013] The high-performance copper wire drawing intelligent control method provided by the embodiment of the present application first obtains the mold parameters for reflecting the outer diameter circumference of the wire drawing die, and then obtains the first sound graph for reflecting the sound graph generated when the first sound detection device of the detection device receives the copper wire and the wire drawing die, and the second sound graph for reflecting the sound graph generated when the second sound detection device of the detection device receives the copper wire and the wire drawing die. The propagation speed is obtained according to the mold parameters and the first sound graph to reflect the speed of the sound generated when the copper wire collides with the wire drawing die along the outer diameter of the wire drawing die. The propagation speed, the first sound graph and the second sound graph are analyzed to obtain the collision position reflecting the position where the copper wire collides with the wire drawing die. The first sound graph and the propagation speed are analyzed to obtain the sound attenuation of the value reflecting that the amplitude of the sound generated when the copper wire collides with the wire drawing die gradually decreases with the increase of distance. Finally, the wear condition is analyzed according to the collision position, the first sound graph and the sound attenuation. This method can effectively analyze the internal wear condition of the wire drawing die through the sound when the copper wire collides with the wire drawing die during wire drawing. There is no need to peel the wire drawing die from the production line for inspection. The wear condition of the wire drawing die can be obtained through the copper wire drawing process, which can reduce the time consumption of inspection, improve the inspection efficiency and realize real-time online monitoring. Through real-time monitoring of the wear condition of the wire drawing die, the working state of the wire drawing die can be controlled, thereby ensuring the wire drawing quality of the copper wire.

[0014] In a possible implementation manner of the first aspect, analyzing the mold parameter and the first sound pattern to obtain a propagation speed includes:

[0015] Analyzing the first sound pattern, obtaining a first time and a second time; wherein the first time is used to reflect the time when a first appearance peak appears in the first sound pattern, and the second time is used to reflect the time when a second appearance peak appears in the first sound pattern, and the propagation path of the sound reflected by the first appearance peak from the position where the copper wire collides with the wire drawing die to the first sound detection device is different from the propagation path of the sound reflected by the second appearance peak from the position where the copper wire collides with the wire drawing die to the first sound detection device;

[0016] The propagation speed is obtained by analyzing the first time, the second time and the die parameters; wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die.

[0017] In a possible implementation manner of the first aspect, analyzing the first time, the second time, and the mold parameter to obtain a propagation speed includes:

[0018] Processing is performed according to the first time and the second time to obtain a time and a sum value for reflecting the sum of the first time and the second time;

[0019] The propagation speed is obtained by processing the time and the mold parameters.

[0020] In a possible implementation manner of the first aspect, analyzing according to the propagation speed, the first sound pattern, and the second sound pattern to obtain the collision position includes:

[0021] Processing is performed according to the first time and the propagation speed reflected by the first sound pattern to obtain a first distance; wherein the first distance is used to reflect the distance between the position of the sound generated when the copper wire collides with the wire drawing die and the first sound detection device;

[0022] Analyze the second sound pattern to obtain a start time; wherein the start time is used to reflect the time when the first peak appears in the second sound pattern;

[0023] Processing is performed according to the starting time and the propagation speed to obtain a second distance; wherein the second distance is used to reflect the distance between the position of the sound generated when the copper wire collides with the wire drawing die and the second sound detection device;

[0024] The collision position is obtained by analyzing the first distance and the second distance.

[0025] In a possible implementation manner of the first aspect, analyzing the first sound pattern and the propagation speed to obtain sound attenuation includes:

[0026] Analyze the first sound pattern to obtain an interval time and an amplitude ratio; wherein the interval time is used to reflect the time interval between the first appearance peak of the first sound pattern and the second appearance peak of the first sound pattern; and the amplitude ratio is used to reflect the ratio between the amplitude of the first appearance peak and the amplitude of the second appearance peak in the first sound pattern;

[0027] An attenuation distance is obtained by analyzing the interval time and the propagation speed; wherein the attenuation distance is used to reflect the difference between the propagation distance from the first peak in the first sound pattern to the first sound detection device and the propagation distance from the second peak in the first sound pattern to the first sound detection device;

[0028] The sound attenuation is obtained by analyzing the attenuation distance and the amplitude ratio.

[0029] In a possible implementation manner of the first aspect, analyzing the collision position, the first sound pattern, and the sound attenuation to obtain the wear condition includes:

[0030] Based on the collision position, an inherent stiffness value is obtained; wherein the inherent stiffness value is used to reflect the ability of the wire drawing die to resist deformation when subjected to an external force at the collision position when the wire drawing die is not worn;

[0031] The wear stiffness value is obtained by analyzing the collision position, the first sound pattern and the sound attenuation; wherein the wear stiffness value is used to reflect the ability of the current wire drawing die to resist deformation when an external force is applied at the collision position;

[0032] The wear degree is obtained by analyzing the wear stiffness value and the inherent stiffness value.

[0033] In a possible implementation manner of the first aspect, analyzing the collision position, the first sound pattern, and the sound attenuation to obtain a wear stiffness value includes:

[0034] Based on the collision position, a reference sound attenuation is obtained; wherein the reference sound attenuation is used to reflect the extent to which the amplitude of the sound at the collision position is lost when the wire drawing die is propagated in the wire drawing die when the wire drawing die is not worn;

[0035] Analyzing the first sound pattern to obtain frequency attenuation; wherein the frequency attenuation is used to reflect the degree to which the frequency of the sound generated when the copper wire collides with the wire drawing die is weakened when propagating in the wire drawing die;

[0036] An attenuation ratio is obtained by analyzing the sound attenuation and the reference sound attenuation; wherein the attenuation ratio is used to reflect the percentage by which the amplitude of the sound generated when the copper wire collides with the wire drawing die is reduced when propagating in the wire drawing die;

[0037] The wear stiffness value is obtained by analyzing the attenuation ratio and the frequency attenuation.

[0038] In a possible implementation manner of the first aspect, analyzing the first sound pattern to obtain frequency attenuation includes:

[0039] Analyze the first sound pattern to obtain multiple durations; wherein the durations are used to reflect the durations of peaks appearing in the first sound pattern;

[0040] Processing is performed according to the multiple durations to obtain multiple frequency values; wherein the frequency value is used to reflect the inverse of the duration;

[0041] Processing is performed according to the multiple frequency values ​​to obtain frequency attenuation.

[0042] In a possible implementation manner of the first aspect, performing processing according to the multiple frequency values ​​to obtain frequency attenuation includes:

[0043] Performing differential calculation according to the multiple frequency values ​​to obtain multiple differential frequencies; wherein the differential frequency is used to reflect the difference between the i-th frequency value and the i-2-th frequency value, and i is a positive integer greater than 0;

[0044] An average value is calculated based on the plurality of differential frequencies to obtain a differential mean value, and the differential mean value is confirmed as frequency attenuation.

[0045] In a second aspect, an embodiment of the present application provides a high-performance copper wire drawing system, comprising:

[0046] The first acquisition module is used to acquire die parameters; wherein the die parameters are used to reflect the outer diameter circumference of the wire drawing die;

[0047] A second acquisition module is used to acquire a first sound pattern and a second sound pattern; wherein the first sound pattern is used to reflect the sound pattern generated when the first sound detection device of the detection device receives the collision between the copper wire and the wire drawing die, and the second sound pattern is used to reflect the sound pattern generated when the second sound detection device of the detection device receives the collision between the copper wire and the wire drawing die, the first sound detection device and the second sound detection device are set at the outer diameter of the wire drawing die, and the connecting line between the first sound detection device and the second sound detection device is not the diameter of the wire drawing die;

[0048] A first analysis module is used to analyze the die parameters and the first sound graph to obtain a propagation speed; wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die;

[0049] The second analysis module is used to analyze according to the propagation speed, the first sound pattern and the second sound pattern to obtain the collision position; wherein the collision position is used to reflect the position where the copper wire collides with the wire drawing die;

[0050] The third analysis module is used to analyze the first sound graph and the propagation speed to obtain sound attenuation; wherein the sound attenuation is used to reflect the value that the amplitude of the sound generated when the copper wire collides with the wire drawing die gradually decreases with the increase of the distance;

[0051] The fourth analysis module is used to analyze according to the collision position, the first sound pattern and the sound attenuation to obtain the wear condition.

[0052] In the third aspect, an embodiment of the present application provides a high-performance copper wire drawing equipment, including a detection device and a control device, the detection device is electrically connected to the control device, the detection device includes a first sound detection device and a second sound detection device, the control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and when the computer program is executed by the processor, it implements the method described in any one of the first aspects above.

[0053] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the first aspects above is implemented.

[0054] In a fifth aspect, an embodiment of the present application provides a computer program. When the computer program is run on a high-performance copper wire drawing device, the high-performance copper wire drawing device executes the high-performance copper wire drawing intelligent control method described in any one of the above-mentioned first aspects.

[0055] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0057] Figure 1 It is a flow chart of a high-performance copper wire drawing intelligent control method provided by an embodiment of the present application;

[0058] Figure 2 It is a schematic diagram of the implementation process of the high-performance copper wire drawing intelligent control method provided by an embodiment of the present application;

[0059] Figure 3 It is a structural schematic diagram of a high-performance copper wire drawing system provided by an embodiment of the present application;

[0060] Figure 4 It is a structural schematic diagram of a control device for high-performance copper wire drawing equipment provided in one embodiment of the present application. DETAILED DESCRIPTION

[0061] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0062] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0063] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0064] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0065] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0066] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0067] In the related technology, especially when the working state of the wire drawing equipment is stably controlled, the wear condition of the wire drawing die is particularly important. During the drawing process, the long-term friction between the wire drawing die and the copper wire will cause the inner diameter surface material of the wire drawing die to wear and consume, and finally increase the wear degree of the wire drawing die. The wear condition of the wire drawing die is generally detected by manual visual inspection or using magnifying glasses, microscopes and other tools to check the wear condition of the inner diameter surface of the wire drawing die. The manual visual inspection of the wear condition of the wire drawing die takes a long time and will affect the production progress. When the wear condition of the wire drawing die is inspected by using tools such as microscopes, it needs to be carried out when the production is stopped, and online real-time monitoring cannot be achieved.

[0068] To solve the above problems, the embodiment of the present application provides a high-performance copper wire drawing intelligent control method. In the method, a mold parameter for reflecting the outer diameter circumference of the wire drawing die is obtained, and then a first sound graph for reflecting the sound graph generated when the first sound detection device of the detection device receives the sound graph generated when the copper wire collides with the wire drawing die and a second sound graph for reflecting the sound graph generated when the second sound detection device of the detection device receives the sound graph generated when the copper wire collides with the wire drawing die are obtained, and then the mold parameter and the first sound graph are analyzed to obtain the propagation speed for reflecting the speed of the sound generated when the copper wire collides with the wire drawing die along the outer diameter of the wire drawing die, and then the propagation speed, the first sound graph and the second sound graph are analyzed to obtain the collision position for reflecting the position where the copper wire collides with the wire drawing die, and then the first sound graph and the propagation speed are analyzed to obtain the sound attenuation of the value that the amplitude of the sound generated when the copper wire collides with the wire drawing die gradually decreases with the increase of the distance, and finally the wear condition is analyzed according to the collision position, the first sound graph and the sound attenuation. This method can effectively analyze the internal wear condition of the wire drawing die through the sound when the copper wire collides with the wire drawing die during wire drawing. There is no need to peel the wire drawing die from the production line for inspection. The wear condition of the wire drawing die can be obtained through the copper wire drawing process, which can reduce the time consumption of inspection, improve the inspection efficiency and realize real-time online monitoring. Through real-time monitoring of the wear condition of the wire drawing die, the working state of the wire drawing die can be controlled, thereby ensuring the wire drawing quality of the copper wire.

[0069] The high-performance copper wire drawing intelligent control method provided in the embodiment of the present application can be applied to high-performance copper wire drawing equipment. In this case, the high-performance copper wire drawing equipment is the executor of the high-performance copper wire drawing intelligent control method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of high-performance copper wire drawing equipment.

[0070] The high-performance copper wire drawing equipment includes a detection device and a control device. The detection device is electrically connected to the control device. The detection device includes a first sound detection device, a second sound detection device and a wire drawing die. The first sound detection device and the second sound detection device are both used to detect the sound generated when the copper wire collides with the wire drawing die. The first sound detection device is set at a first position of the outer diameter of the wire drawing die, and the second sound detection device is set at a second position of the wire drawing die, and the first position is different from the second position, and the line connecting the first position and the second position does not pass through the center of the inner diameter of the wire drawing die. For example, the sound detection device can be a microphone, a sound sensor or a noise meter. The control device is used to supervise and control the process of copper wire drawing.

[0071] For example, the control device can be a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a smart large screen, a smart TV, a handheld device with wireless communication function, a desktop computer, a handheld device with wireless communication function, a computer, a laptop computer, a handheld computing device, a single-chip microcomputer, a microcontroller, an application-specific integrated circuit, etc.

[0072] In order to better understand the high-performance copper wire drawing intelligent control method provided in the embodiment of the present application, the specific implementation process of the high-performance copper wire drawing intelligent control method provided in the embodiment of the present application is exemplarily introduced below.

[0073] Figure 1 and Figure 2 A schematic flow chart of the high-performance copper wire drawing intelligent control method provided by the embodiment of the present application is shown. Figure 1 and Figure 2 , high-performance copper wire drawing intelligent control methods include:

[0074] S100, obtaining die parameters; wherein the die parameters are used to reflect the outer diameter circumference of the wire drawing die.

[0075] Exemplarily, the mold parameters can be manually input. The mold parameters can also be directly obtained through a parameter database. The parameter database refers to a database containing the outer diameter circumferences corresponding to drawing dies with different diameter reduction rates. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining, the collected data is sorted, classified and archived, useful information and rules are extracted, and the relevant data is saved in the database to form a parameter database.

[0076] S200, obtaining a first sound pattern and a second sound pattern; wherein the first sound pattern is used to reflect the sound pattern generated when the first sound detection device of the detection device receives a collision between the copper wire and the wire drawing die, and the second sound pattern is used to reflect the sound pattern generated when the second sound detection device of the detection device receives a collision between the copper wire and the wire drawing die, the first sound detection device and the second sound detection device are set at the outer diameter of the wire drawing die, and the connecting line between the first sound detection device and the second sound detection device is not the diameter of the wire drawing die.

[0077] It is understandable that when drawing copper wire, the front end of the copper wire needs to be manually passed through the wire drawing die, and then a pulling force is applied to the copper wire through the traction wheel to make the copper wire pass through the wire drawing die, and finally the copper wire is drawn into a copper wire of the required size. When the high-performance copper wire drawing equipment starts to draw the copper wire, the copper wire is manually passed through the wire drawing die, and the size of the thin copper wire is smaller than the inner diameter of the wire drawing die. When the copper wire is pulled by the traction wheel, the copper wire will collide with the inner wall of the wire drawing die, thereby generating sound.

[0078] Exemplarily, the collision sound propagated to the first sound detection device when the copper wire collides with the wire drawing die can be obtained by the first sound detection device, and then the first sound graph is finally obtained by creating a graph of the collision sound. The image creation process can be to first perform data processing on the collision sound to remove unnecessary background noise and reduce mutations and jitters in the signal to ensure the accuracy of the collision sound, and then directly draw the collision sound through Python code and matplotlib library. The matplotlib library is a 2D drawing tool in Python code. Similarly, the second sound graph can be obtained in a similar way to the above steps to obtain the first sound graph.

[0079] S300, analyzing the die parameters and the first sound graph to obtain a propagation speed, wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die.

[0080] For example, the first sound pattern can be analyzed to obtain the time when the first peak reflection appears in the first sound pattern and the time when the second peak reflection appears in the first sound pattern, and then the time when the first peak reflection appears in the first sound pattern, the time when the second peak reflection appears in the first sound pattern and the mold parameters are analyzed to finally obtain the propagation speed.

[0081] The second sound pattern can also be analyzed to obtain the time when the first peak reflection appears in the second sound pattern and the time when the second peak reflection appears in the second sound pattern, and then the time when the first peak reflection appears in the second sound pattern and the time when the second peak reflection appears in the second sound pattern are analyzed with the mold parameters to finally obtain the propagation speed.

[0082] In a possible implementation, in step S300, analyzing the mold parameters and the first sound pattern to obtain the propagation speed includes:

[0083] S310, analyzing the first sound graph to obtain a first time and a second time; wherein the first time is used to reflect the time when a first peak appears in the first sound graph, and the second time is used to reflect the time when a second peak appears in the first sound graph, and the propagation path of the sound reflected by the first peak from the position where the copper wire collides with the wire drawing die to the first sound detection device is different from the propagation path of the sound reflected by the second peak from the position where the copper wire collides with the wire drawing die to the first sound detection device.

[0084] It can be understood that when the collision sound propagates along the outer diameter direction of the wire drawing die, the collision sound will propagate along the clockwise and counterclockwise directions of the outer diameter of the annular wire drawing die. When the collision sound is not on the line connecting the first sound detection device and the center of the inner diameter of the wire drawing die, the first sound detection device receives the collision sound propagating in different clockwise directions at different times, and finally different appearance peaks are generated in the first sound graph. When the collision sound is on the line connecting the first sound detection device and the center of the inner diameter of the wire drawing die, the collision sound will propagate along the clockwise and counterclockwise directions of the outer diameter of the annular wire drawing die, and the clockwise and counterclockwise propagation distances are the same. The time it takes to propagate from the clockwise direction to the first sound detection device will be the same as the time it takes to propagate from the counterclockwise direction to the first sound detection device. When the first sound detection device receives the collision sound for the first time, it will propagate along the clockwise and counterclockwise directions of the outer diameter of the annular wire drawing die, and only one appearance peak is displayed in the obtained first sound graph.

[0085] By analyzing the first sound pattern, the appearance time of the first appearance peak in the first sound pattern and the appearance time of the second appearance peak in the first sound pattern are directly obtained, and the appearance time of the first appearance peak is confirmed as the first time, and the appearance time of the second appearance peak is confirmed as the second time.

[0086] S320, analyzing the first time, the second time and the die parameters to obtain a propagation speed, wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die.

[0087] For example, the first time and the second time may be processed to obtain the sum between the first time and the second time, and then the sum between the first time and the second time may be processed with the mold parameters to finally obtain the propagation speed. The first sound pattern may also be analyzed to obtain the time when the first peak reflection in the first sound pattern appears and the time when the third peak reflection in the second sound pattern appears, and then the difference between the time when the first peak reflection in the first sound pattern appears and the time when the third peak reflection in the second sound pattern appears may be processed with the mold parameters to finally obtain the propagation speed.

[0088] With such a setting, the propagation speed of the sound generated when the copper wire collides with the wire drawing die is analyzed through sound graphics, which provides a real-time and accurate data basis for the subsequent analysis of the wear condition of the wire drawing die.

[0089] In a possible implementation, in step S320, the propagation speed is obtained by analyzing the first time, the second time and the mold parameters, including:

[0090] S321, performing processing according to the first time and the second time to obtain time and, wherein time and are used to reflect the sum value between the first time and the second time.

[0091] It can be understood that time and = first time + second time.

[0092] Exemplarily, if the first time is 0.01ms and the second time is 0.017ms, then the time is 0.027(0.01+0.017)ms; if the first time is 0.015ms and the second time is 0.015ms, then the time is 0.03(0.015+0.015)ms, and so on.

[0093] S322, processing is performed according to the time and the mold parameters to obtain the propagation speed.

[0094] It can be understood that propagation speed = mold parameters ÷ time and.

[0095] For example, if the mold parameters are 157 mm, the time is 0.03 ms, the propagation speed is 5233 (157 ÷ 0.03) m / s, and so on.

[0096] This setting can achieve non-destructive evaluation of the internal characteristics of the material through precise time measurement and parameter processing, and can analyze in real time the propagation speed of sound in the drawing die under different degrees of wear.

[0097] S400, analyzing according to the propagation speed, the first sound pattern and the second sound pattern to obtain a collision position; wherein the collision position is used to reflect the position where the copper wire collides with the wire drawing die.

[0098] Exemplarily, the time of the first peak reaction in the first sound graph and the propagation speed can be processed to obtain the distance of the collision sound from the first sound detection device, and then the second sound graph can be analyzed to obtain the time of the first peak in the second sound graph, and then the time of the first peak in the second sound graph and the propagation speed can be processed to obtain the distance of the collision sound from the second sound detection device, and finally the distance of the collision sound from the first sound detection device and the distance of the collision sound from the second sound detection device are analyzed to finally obtain the collision position.

[0099] The second sound graph can also be analyzed to obtain the time when the second peak in the second sound graph appears, and then processed according to the time and propagation speed of the second peak in the second sound graph to obtain the distance of the collision sound from the second sound detection device, and then processed by the second time and propagation speed to obtain the position of the collision sound from the first sound detection device, and finally analyzed by the distance of the collision sound from the first sound detection device and the distance of the collision sound from the second sound detection device to finally obtain the collision position.

[0100] In a possible implementation, in step S400, analyzing the propagation speed, the first sound pattern, and the second sound pattern to obtain the collision position includes:

[0101] S410, processing is performed according to the first time and propagation speed reflected by the first sound pattern to obtain a first distance; wherein the first distance is used to reflect the distance between the position of the sound generated when the copper wire collides with the wire drawing die and the first sound detection device.

[0102] It can be understood that the first distance = first time × propagation speed.

[0103] For example, if the first time is 0.01 ms and the propagation speed is 5233 m / s, the first distance is 52.33 mm, and so on.

[0104] S420, analyzing the second sound pattern to obtain a start time; wherein the start time is used to reflect the time when the first peak appears in the second sound pattern.

[0105] Exemplarily, the second sound pattern may be analyzed to directly obtain the appearance time of the first appearance peak in the second sound pattern, and the appearance time may be confirmed as the start time.

[0106] S430, performing processing according to the start time and the propagation speed to obtain a second distance; wherein the second distance is used to reflect the distance between the position of the sound generated when the copper wire collides with the wire drawing die and the second sound detection device.

[0107] It can be understood that the second distance = starting time × propagation speed.

[0108] For example, if the starting time is 0.017 ms and the propagation speed is 5233 m / s, the second distance is 88.961 mm (0.017 ms×5233 m / s), and so on.

[0109] S440: Analyze the first distance and the second distance to obtain a collision position.

[0110] It can be understood that the first distance and the second distance are the sounds generated when the copper wire collides with the wire drawing die, which propagate clockwise and counterclockwise along the outer diameter of the wire drawing die respectively. The first distance can be used to determine the position of the sound generated when the copper wire collides with the wire drawing die from the first sound detection device. However, the sound generated when the copper wire collides with the wire drawing die can be at the first distance in the clockwise direction from the first sound detection device, or at the first distance in the counterclockwise direction from the first sound detection device. By verifying the common position of the second distance and the first distance, the position of the copper wire when the collision occurs with the wire drawing die can be determined.

[0111] With this arrangement, by precisely measuring the sound wave propagation time and calculating the distance, the collision and wear inside the mold can be monitored and located more accurately. By combining the second distance with the first distance, the collision position can be located at two points, and the sound source position can be determined more accurately.

[0112] S500, analyzing the first sound graph and the propagation speed to obtain sound attenuation; wherein the sound attenuation is used to reflect the value that the amplitude of the sound generated when the copper wire collides with the wire drawing die gradually decreases with increasing distance.

[0113] Exemplarily, the first sound pattern can be analyzed to obtain the time interval between the first appearing peak and the second appearing peak in the first sound pattern and the ratio between the amplitude of the first appearing peak and the amplitude of the second appearing peak. Then, analysis can be performed based on the time interval and the propagation speed to obtain a ratio reflecting the propagation distance from the first appearing peak in the first sound pattern to the first sound detection device and the propagation distance from the second appearing peak in the first sound pattern to the first sound detection device. Finally, sound attenuation can be obtained by analyzing the ratio reflecting the propagation distance from the first appearing peak in the first sound pattern to the propagation distance from the second appearing peak in the first sound pattern to the first sound detection device and the ratio between the amplitude of the first appearing peak in the first sound pattern and the amplitude of the second appearing peak.

[0114] It is also possible to analyze the first sound graph to obtain the time interval between the first peak and the second peak in the first sound graph and the difference between the amplitude of the first peak and the amplitude of the second peak, and then analyze the time interval between the first peak and the second peak in the first sound graph, the difference between the amplitude of the first peak and the amplitude of the second peak and the propagation speed to obtain the sound attenuation.

[0115] In a possible implementation, in step S500, analyzing the first sound pattern and the propagation velocity to obtain sound attenuation includes:

[0116] S510, analyzing the first sound pattern to obtain an interval time and an amplitude ratio; wherein the interval time is used to reflect the time interval between the first appearance peak of the first sound pattern and the second appearance peak of the first sound pattern; and the amplitude ratio is used to reflect the ratio between the amplitude of the first appearance peak and the amplitude of the second appearance peak in the first sound pattern.

[0117] It can be understood that the interval time refers to the ratio between the appearance time of the first appearance peak in the first sound pattern and the appearance time of the second appearance peak in the first sound pattern.

[0118] Exemplarily, the first sound graph can be analyzed to obtain the appearance time of the first peak in the first sound graph and the appearance time of the second peak in the first sound graph, and then the appearance time of the first peak in the first sound graph is compared with the appearance time of the second peak in the first sound graph to finally obtain the interval time.

[0119] The first sound pattern may be analyzed to obtain a first amplitude value of a first peak and a second amplitude value of a second peak in the first sound pattern, and then the first amplitude value is compared with the second amplitude value to finally obtain an amplitude ratio.

[0120] S520, analyzing the interval time and the propagation speed to obtain an attenuation distance; wherein the attenuation distance is used to reflect the difference between the propagation distance from the first peak in the first sound pattern to the first sound detection device and the propagation distance from the second peak in the first sound pattern to the first sound detection device.

[0121] It can be understood that attenuation distance = interval time × propagation speed. The interval time is the difference between the appearance time of the first peak in the first sound pattern and the appearance time of the second peak in the first sound pattern. The appearance time of the first peak in the first sound pattern can be used to reflect the time when the sound generated when the copper wire collides with the drawing die propagates along the outer diameter of the drawing die to the first sound detection device. Similarly, the appearance time of the second peak in the first sound pattern can be used to reflect the time when the sound generated when the copper wire collides with the drawing die propagates along the outer diameter of the drawing die to the first sound detection device. Therefore, the attenuation distance can be obtained by analyzing the interval time and the propagation speed.

[0122] For example, if the interval time is 0.07 ms and the propagation speed is 5233 m / s, the attenuation distance is (0.07 ms×5233 m / s).

[0123] S530, analyzing the attenuation distance and the amplitude ratio to obtain sound attenuation.

[0124] For example, the attenuation can be obtained by processing the amplitude ratio, and then the attenuation and the attenuation distance can be processed to finally obtain the sound attenuation. The attenuation can be processed logarithmically by the amplitude ratio to finally obtain the attenuation. The processing step of obtaining the attenuation can be to process the amplitude ratio logarithmically to obtain the attenuation. The attenuation refers to the reduction in amplitude. The attenuation can be calculated by the formula Where ΔL is the attenuation, 20 is the logarithmic correlation coefficient of the amplitude ratio, and A 0 It refers to the amplitude value of the first peak in the first sound graph, and A refers to the amplitude value of the second peak in the first sound graph. The processing step of sound attenuation can be achieved by comparing the attenuation amount with the attenuation distance, and finally obtaining the sound attenuation. Sound attenuation = attenuation amount ÷ attenuation distance.

[0125] With this setting, by analyzing the amplitude ratio obtained, the information on the energy attenuation of the impact sound when it propagates in the drawing die can be obtained, and the sound attenuation can quantify the wear degree of the drawing die and provide a direct indicator.

[0126] S600: Analyze the collision position, the first sound pattern and the sound attenuation to obtain the wear condition.

[0127] Exemplarily, the collision position can be analyzed to obtain the ability of the wire drawing die to resist deformation when subjected to external force at the collision position when it is not worn. Then, the collision position, the first sound pattern and the sound attenuation can be analyzed to obtain the ability of the current wire drawing die to resist deformation when subjected to external force at the collision position. Finally, the ability of the current wire drawing die to resist deformation when subjected to external force at the collision position is compared with the ability of the wire drawing die to resist deformation when subjected to external force at the collision position when it is not worn, and finally the wear condition of the wire drawing die is obtained.

[0128] The wear condition can also be obtained by training a wear model. That is, the collision position, the first sound pattern and the sound attenuation are input into the wear model, and the wear model then outputs the corresponding wear condition. The training process of the wear model can be performed by processing the collision position, the first sound pattern and the sound attenuation and the corresponding wear condition as the training data set of the wear model, and then the training data set of the wear model is input into the wear model for training and learning, and finally the wear model is obtained.

[0129] In a possible implementation, in step S600, the wear condition is obtained by analyzing the collision position, the first sound pattern and the sound attenuation, including:

[0130] S610, based on the collision position, obtaining an inherent stiffness value; wherein the inherent stiffness value is used to reflect the ability of the wire drawing die to resist deformation when subjected to an external force at the collision position when the wire drawing die is not worn.

[0131] It can be understood that there are different working areas inside the drawing die, and the stiffness values ​​of different working areas of the drawing die are different. Through the collision position, the stiffness value at the collision position in the drawing die without wear is obtained, and this stiffness value is confirmed as the inherent stiffness value. The method for obtaining the inherent stiffness value can be to manually input the inherent stiffness value. The inherent stiffness value can also be directly obtained through the attribute database. The attribute database refers to a database containing the stiffness values ​​of various places inside the drawing die with different diameter reduction rates. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and previous experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form an attribute database.

[0132] S620, analyzing the collision position, the first sound pattern and the sound attenuation to obtain a wear stiffness value; wherein the wear stiffness value is used to reflect the ability of the current wire drawing die to resist deformation when subjected to an external force at the collision position.

[0133] Exemplarily, the collision position can be analyzed to obtain the degree of loss of the amplitude of the sound at the collision position when the wire drawing die is not worn, and then the first sound graph can be analyzed to obtain the degree of attenuation of the frequency of the sound generated when the copper wire collides with the wire drawing die when it propagates in the wire drawing die. Then, the sound attenuation and the degree of attenuation of the frequency of the sound generated when the copper wire collides with the wire drawing die when it propagates in the wire drawing die are analyzed to obtain the percentage of reduction in the amplitude of the sound generated when the copper wire collides with the wire drawing die when it propagates in the wire drawing die. Finally, the wear stiffness value is obtained by analyzing the percentage of reduction in the amplitude of the sound generated when the copper wire collides with the wire drawing die when it propagates in the wire drawing die and the degree of attenuation of the frequency of the sound generated when the copper wire collides with the wire drawing die when it propagates in the wire drawing die.

[0134] Wear stiffness values ​​can also be obtained by training and establishing an analysis model. That is, the collision position, the first sound pattern and the sound attenuation are input into the analysis model, and the analysis model then outputs the corresponding wear stiffness value. The training process of the analysis model can be performed by processing the collision position, the first sound pattern and the sound attenuation, and the corresponding wear stiffness value as the training data set of the analysis model, and then the training data set of the analysis model is input into the analysis model for training and learning, and finally the analysis model is obtained.

[0135] In a possible implementation, in step S610, the wear stiffness value is obtained by analyzing the collision position, the first sound pattern and the sound attenuation, including:

[0136] S611, based on the collision position, obtain a reference sound attenuation; wherein the reference sound attenuation is used to reflect the degree of loss of the amplitude of the sound at the collision position when the wire drawing die is not worn and propagates in the wire drawing die.

[0137] It can be understood that there is a stiffness value corresponding to each location inside the wire drawing die, and the distance from each location inside the wire drawing die to the outer wall of the wire drawing die is different, that is, the thickness of different working areas of the wire drawing die is different. Through the collision position, the sound attenuation at the collision position in the wire drawing die without wear is obtained, and this sound attenuation is confirmed as the baseline sound attenuation. The method for obtaining the baseline sound attenuation can be manually inputting the baseline sound attenuation. The baseline sound attenuation can also be directly obtained through the attenuation database. The attenuation database refers to a database containing the baseline sound attenuation of various locations inside the wire drawing die with different diameter reduction rates. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form an attenuation database.

[0138] S612, analyzing the first sound graph to obtain frequency attenuation; wherein the frequency attenuation is used to reflect the degree to which the frequency of the sound generated when the copper wire collides with the wire drawing die is weakened when propagating in the wire drawing die.

[0139] Exemplarily, the first sound graph can be analyzed to obtain the durations corresponding to multiple peaks in the first sound graph, and then the durations corresponding to the multiple peaks in the first sound graph can be processed to obtain the inverse corresponding to the duration, and finally the inverse corresponding to the duration can be processed to obtain the frequency attenuation.

[0140] It is also possible to perform a fast Fourier transform on the first sound pattern to convert the first sound pattern related to the amplitude into a frequency domain pattern, and then analyze the frequency domain pattern to obtain the difference between the maximum frequency and the minimum frequency in the frequency domain pattern, and confirm the difference between the maximum frequency and the minimum frequency as frequency attenuation.

[0141] In a possible implementation, in step S612, analyzing the first sound pattern to obtain frequency attenuation includes:

[0142] S6121, analyzing the first sound pattern to obtain multiple durations, wherein the duration is used to reflect the duration of a peak appearing in the first sound pattern.

[0143] It can be understood that the duration is the time interval from the time when a peak in the first sound pattern just begins to appear to the time when the amplitude of the peak drops back to 0.

[0144] For example, the peaks in the first sound pattern can be identified and the duration of the peaks can be extracted by using methods such as MATLAB, Python's SciPy library or NumPy library, and multiple durations can be finally obtained by extracting the durations of multiple peaks. SciPy library and NumPy are computing tool libraries in Python.

[0145] S6122, performing processing according to the multiple durations to obtain multiple frequency values; wherein the frequency value is used to reflect the inverse of the duration.

[0146] It can be understood that the frequency value refers to the number of times the peak in the first sound pattern completes a periodic change within a unit time.

[0147] Exemplarily, the inverses corresponding to the multiple durations can be obtained by processing the multiple durations corresponding to the multiple peaks, and the inverses can be confirmed as frequency values. The first sound pattern can also be processed to obtain a spectrogram of the first sound pattern, and then the frequency values ​​corresponding to the multiple peaks in the first sound pattern can be directly obtained through the spectrogram. The process of obtaining the spectrogram of the first sound pattern can be to first convert the first sound pattern into a spectrogram by performing a fast Fourier transform (FFT) on the first sound pattern, and finally directly read multiple frequency values ​​from the spectrogram.

[0148] S6123, performing processing according to the multiple frequency values ​​to obtain frequency attenuation.

[0149] Exemplarily, a difference between the i-th frequency value and the i-2-th frequency value can be obtained by processing a plurality of frequency values, where i is a positive integer greater than 0, and then a frequency attenuation can be obtained by analyzing the plurality of processed frequency values. It is also possible to process a plurality of frequency values ​​and draw a frequency curve, and then analyze the frequency curve to obtain the maximum frequency change rate of the frequency curve, and then confirm the maximum frequency change rate as the frequency attenuation. The maximum frequency change rate refers to the maximum slope of the frequency curve. The drawing process of the frequency curve can be to directly draw a plurality of frequency values ​​by calling the matplotlib library using Python code to obtain the frequency curve.

[0150] In this arrangement, by measuring the duration of the peak appearing in the first sound graph and converting the duration into a frequency value, the analysis is made more comprehensive, and the analysis of frequency attenuation can provide important information for evaluating the performance of the internal wear condition of the wire drawing die. By monitoring the frequency attenuation, signs of material wear or performance degradation can be discovered early, so that maintenance or replacement can be carried out in time, which can provide a non-invasive, high-precision detection method, helping to improve product quality and production efficiency.

[0151] In a possible implementation, in step S6122, processing is performed according to multiple frequency values ​​to obtain frequency attenuation, including:

[0152] S61221, performing differential calculation according to the multiple frequency values ​​to obtain multiple differential frequencies; wherein the differential frequency is used to reflect the difference between the i-th frequency value and the i-2-th frequency value, and i is a positive integer greater than 0.

[0153] It can be understood that the differential calculation refers to the difference between consecutive frequency values ​​in multiple frequency values. The calculation formula for the differential calculation can be ΔX i =X i -X i-2 , where ΔX i is the differential frequency, X iis the ith frequency value among multiple frequency values, X i-2 is the i-2th frequency value among multiple frequency values.

[0154] For example, if multiple frequency values ​​are 40Hz, 37Hz, 32Hz, 28Hz, 24Hz, 21Hz, etc., the first differential frequency is 8 (40-32) Hz, the second differential frequency is 9 (37-28) Hz, the third differential frequency is 8 (32-24) Hz, the fourth differential frequency is 7 (28-21) Hz, and so on.

[0155] S61222, perform mean calculation based on multiple differential frequencies to obtain a differential mean, and confirm the differential mean as frequency attenuation.

[0156] It can be understood that the differential mean refers to the average value between multiple differential frequencies.

[0157] For example, if the multiple differential frequencies are 8 Hz, 9 Hz, 8 Hz, and 7 Hz, the differential mean is 8 (8+9+8+7) Hz, and so on.

[0158] With this setting, the changing trend of the frequency of the collision sound can be identified more accurately through the calculation of the differential frequency, thereby capturing the slight attenuation changes. By calculating the differential mean, the random error in a single measurement is reduced, and the reliability of the frequency attenuation assessment is improved. The quantification of frequency attenuation provides a direct indicator for the wear monitoring of the wire drawing die, which helps to detect signs of wear early and perform maintenance in time.

[0159] S613, analyzing the sound attenuation and the reference sound attenuation to obtain an attenuation ratio; wherein the attenuation ratio is used to reflect the percentage by which the amplitude of the sound generated when the copper wire collides with the drawing die decreases when propagating in the drawing die.

[0160] It can be understood that attenuation ratio = (sound attenuation - reference sound attenuation) ÷ reference sound attenuation.

[0161] For example, if the reference sound attenuation is 20 dB and the sound attenuation is 26.02 dB, the attenuation ratio is 0.301, and so on.

[0162] S614, analyzing the attenuation ratio and the frequency attenuation to obtain a wear stiffness value.

[0163] It can be understood that the wire drawing die has different attenuation ratios corresponding to different frequency attenuation, and the wire drawing die has different stiffness values ​​corresponding to different attenuation ratios.

[0164] Exemplarily, a stiffness analysis model can be constructed by machine learning methods (such as decision trees, random forests, support vector machines, etc.) to obtain the wear stiffness value of the wire drawing die. That is, the attenuation ratio and frequency attenuation are input into the stiffness analysis model, and the stiffness analysis model then outputs the corresponding wear stiffness value. The training process of the stiffness analysis model can first be performed by data cleaning (processing missing values, duplicate values ​​and outliers) of the attenuation ratio and frequency attenuation to remove outliers (for example, outliers may be caused by measurement errors, data entry errors or other abnormal conditions), noise (such as random errors or meaningless interference in historical fault data, which may lead to inaccuracy and reduced usability of the data, to ensure the quality of the attenuation ratio and frequency attenuation, and then the attenuation ratio and frequency attenuation after data processing and the corresponding wear stiffness value are used as training data sets, and the training data sets are input into the stiffness analysis model for training and learning, and finally the stiffness analysis model is obtained.

[0165] With this setup, the wear state of the die can be monitored by comparing the baseline sound attenuation with the actual sound attenuation without downtime or destructive testing. The analysis of frequency attenuation provides additional information about the energy loss of the impact sound when it propagates in the drawing die, which helps to understand the wear of the die more comprehensively. The quantification of the attenuation ratio can provide an intuitive indicator for evaluating the degree of wear of the drawing die, facilitating maintenance decisions. The calculation of the wear stiffness value provides a scientific basis for the evaluation of the mechanical properties of the die, which helps to predict the service life and performance degradation of the die.

[0166] S630, analyzing the wear stiffness value and the inherent stiffness value to obtain the wear degree.

[0167] For example, the wear stiffness value and the inherent stiffness value can be processed to obtain stiffness attenuation, and then the wear degree can be obtained by matching the stiffness attenuation with the attenuation degree set. Different wear degrees of the wire drawing die correspond to a stiffness attenuation. Stiffness attenuation = (intrinsic stiffness value - wear stiffness value) ÷ intrinsic stiffness value. The attenuation degree set includes multiple attenuation degree intervals, and the attenuation degree interval refers to the interval of wear stiffness values ​​corresponding to different wear degrees. If the inherent stiffness value is 500N / μm and the wear stiffness value is 400N / μm, the stiffness attenuation is 0.2[500-400)÷500], and the attenuation degree set can be (0, 0.1), (0.1, 0.3), (0.3, 1), where the wear degree corresponding to (0, 0.1) is light wear, the wear degree corresponding to (0.1, 0.3) is moderate wear, and the wear degree corresponding to (0.3, 1) is heavy wear. When the stiffness attenuation is 0.03, the corresponding wear degree is light wear, and when the stiffness attenuation is 0.2, the corresponding wear degree is moderate wear, and so on.

[0168] With such arrangement, the internal wear condition of the wire drawing die can be analyzed through the sound when the copper wire collides with the wire drawing die during wire drawing. There is no need to peel the wire drawing die from the production line for inspection. The wear condition of the wire drawing die can be obtained through the copper wire drawing process, which can reduce the time consumption of inspection, improve the inspection efficiency and realize real-time online monitoring. Through real-time monitoring of the wear condition of the wire drawing die, the working state of the wire drawing die can be controlled, thereby ensuring the wire drawing quality of the copper wire.

[0169] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0170] Corresponding to the high-performance copper wire drawing intelligent control method described in the above embodiment, the embodiment of the present application also provides a high-performance copper wire drawing system, and each module of the high-performance copper wire drawing system can realize each step of the high-performance copper wire drawing intelligent control method. Figure 3 A structural block diagram of a high-performance copper wire drawing system provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0171] Reference Figure 3 , high-performance copper wire drawing system includes:

[0172] The first acquisition module is used to acquire die parameters; wherein the die parameters are used to reflect the outer diameter circumference of the wire drawing die.

[0173] The second acquisition module is used to acquire the first sound graph and the second sound graph; wherein the first sound graph is used to reflect the sound graph generated when the first sound detection device of the detection device receives the collision between the copper wire and the wire drawing die, and the second sound graph is used to reflect the sound graph generated when the second sound detection device of the detection device receives the collision between the copper wire and the wire drawing die. The first sound detection device and the second sound detection device are set at the outer diameter of the wire drawing die, and the connecting line between the first sound detection device and the second sound detection device is not the diameter of the wire drawing die.

[0174] The first analysis module is used to analyze according to the mold parameters and the first sound graph to obtain the propagation speed; wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die.

[0175] The second analysis module is used to analyze according to the propagation speed, the first sound pattern and the second sound pattern to obtain the collision position; wherein the collision position is used to reflect the position where the copper wire collides with the wire drawing die.

[0176] The third analysis module is used to analyze the first sound graph and the propagation speed to obtain sound attenuation; wherein the sound attenuation is used to reflect the value that the amplitude of the sound generated when the copper wire collides with the drawing die gradually decreases with the increase of distance.

[0177] The fourth analysis module is used to analyze according to the collision position, the first sound pattern and the sound attenuation to obtain the wear condition.

[0178] It should be noted that the information interaction, execution process, etc. between the above-mentioned systems / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0179] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0180] The embodiment of the present application also provides a high-performance copper wire drawing device, which includes a sound detection device and a control device, and the sound detection device is electrically connected to the control device. Figure 4 This is a schematic diagram of the structure of a control device 4 provided in an embodiment of the present application. Figure 4 As shown, the control device 4 of this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown), at least one memory 41 ( Figure 4 Only one is shown) and a computer program 42 stored in the at least one memory 41 and executable on the at least one processor 40. When the processor 40 executes the computer program 42, the control device 4 implements the steps in any of the above-mentioned high-performance copper wire drawing intelligent control method embodiments, or the control device 4 implements the functions of each module / unit in the above-mentioned system embodiment.

[0181] Exemplarily, the computer program 42 may be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to complete the present application. The one or more modules / units may be a series of computer program instruction segments capable of completing specific functions, which are used to describe the execution process of the computer program 42 in the control device 4.

[0182] The control device 4 may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The control device 4 may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will appreciate that Figure 4 It is only an example of the control device 4 and does not constitute a limitation on the control device 4. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0183] The processor 40 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0184] In some embodiments, the memory 41 may be an internal storage unit of the control device 4, such as a hard disk or memory of the control device 4. In other embodiments, the memory 41 may also be an external storage device of the control device 4, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 4. Further, the memory 41 may also include both an internal storage unit and an external storage device of the control device 4. The memory 41 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program. The memory 41 may also be used to temporarily store data that has been output or is to be output.

[0185] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0186] An embodiment of the present application provides a computer program product. When the computer program product is run on a high-performance copper wire drawing device, the high-performance copper wire drawing device implements the steps in any of the above-mentioned method embodiments.

[0187] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. According to this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes a computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying the computer program code to a high-performance copper wire drawing device, a recording medium, a computer memory, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, RandomAccess Memory), an electrical carrier signal, a telecommunication signal, and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a disk or an optical disk.

[0188] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0189] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0190] In the embodiments provided in the present application, it should be understood that the disclosed high-performance copper wire drawing system and equipment can be implemented in other ways. For example, the high-performance copper wire drawing system embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0191] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0192] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A high-performance copper wire drawing intelligent control method, characterized in that: include: Obtaining die parameters; wherein the die parameters are used to reflect the outer diameter circumference of the wire drawing die; Acquire a first sound graph and a second sound graph; wherein the first sound graph is used to reflect the sound graph generated when the first sound detection device of the detection device receives a collision between the copper wire and the wire drawing die, and the second sound graph is used to reflect the sound graph generated when the second sound detection device of the detection device receives a collision between the copper wire and the wire drawing die, the first sound detection device and the second sound detection device are set at the outer diameter of the wire drawing die, and the connecting line between the first sound detection device and the second sound detection device is not the diameter of the wire drawing die; The propagation speed is obtained by analyzing the die parameters and the first sound graph; wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die; The collision position is obtained by analyzing the propagation speed, the first sound pattern and the second sound pattern; wherein the collision position is used to reflect the position where the copper wire collides with the wire drawing die; Analyzing the first sound graph and the propagation speed to obtain sound attenuation; wherein the sound attenuation is used to reflect the value of the amplitude of the sound generated when the copper wire collides with the wire drawing die gradually decreasing with increasing distance; The wear condition is obtained by analyzing the collision position, the first sound pattern and the sound attenuation.

2. The high-performance copper wire drawing intelligent control method according to claim 1, characterized in that: The step of analyzing the mold parameters and the first sound pattern to obtain the propagation speed includes: Analyzing the first sound pattern, obtaining a first time and a second time; wherein the first time is used to reflect the time when a first appearance peak appears in the first sound pattern, and the second time is used to reflect the time when a second appearance peak appears in the first sound pattern, and the propagation path of the sound reflected by the first appearance peak from the position where the copper wire collides with the wire drawing die to the first sound detection device is different from the propagation path of the sound reflected by the second appearance peak from the position where the copper wire collides with the wire drawing die to the first sound detection device; The propagation speed is obtained by analyzing the first time, the second time and the die parameters; wherein the propagation speed is used to reflect the speed at which the sound generated when the copper wire collides with the wire drawing die propagates along the outer diameter of the wire drawing die.

3. The high-performance copper wire drawing intelligent control method according to claim 2, characterized in that: The analyzing the first time, the second time and the mold parameter to obtain the propagation speed includes: Processing is performed according to the first time and the second time to obtain a time and a sum value for reflecting the sum of the first time and the second time; The propagation speed is obtained by processing the time and the mold parameters.

4. The high-performance copper wire drawing intelligent control method according to claim 2, characterized in that: The analyzing according to the propagation speed, the first sound pattern and the second sound pattern to obtain the collision position includes: Processing is performed according to the first time and the propagation speed reflected by the first sound pattern to obtain a first distance; wherein the first distance is used to reflect the distance between the position of the sound generated when the copper wire collides with the wire drawing die and the first sound detection device; Analyze the second sound pattern to obtain a start time; wherein the start time is used to reflect the time when the first peak appears in the second sound pattern; Processing is performed according to the starting time and the propagation speed to obtain a second distance; wherein the second distance is used to reflect the distance between the position of the sound generated when the copper wire collides with the wire drawing die and the second sound detection device; The collision position is obtained by analyzing the first distance and the second distance.

5. The high-performance copper wire drawing intelligent control method according to claim 1, characterized in that: The analyzing the first sound pattern and the propagation speed to obtain sound attenuation includes: Analyze the first sound pattern to obtain an interval time and an amplitude ratio; wherein the interval time is used to reflect the time interval between the first appearance peak of the first sound pattern and the second appearance peak of the first sound pattern; and the amplitude ratio is used to reflect the ratio between the amplitude of the first appearance peak and the amplitude of the second appearance peak in the first sound pattern; An attenuation distance is obtained by analyzing the interval time and the propagation speed; wherein the attenuation distance is used to reflect the difference between the propagation distance from the first peak in the first sound pattern to the first sound detection device and the propagation distance from the second peak in the first sound pattern to the first sound detection device; The sound attenuation is obtained by analyzing the attenuation distance and the amplitude ratio.

6. The high-performance copper wire drawing intelligent control method according to claim 1, characterized in that: The analyzing according to the collision position, the first sound pattern and the sound attenuation to obtain the wear condition includes: Based on the collision position, an inherent stiffness value is obtained; wherein the inherent stiffness value is used to reflect the ability of the wire drawing die to resist deformation when subjected to an external force at the collision position when the wire drawing die is not worn; The wear stiffness value is obtained by analyzing the collision position, the first sound pattern and the sound attenuation; wherein the wear stiffness value is used to reflect the ability of the current wire drawing die to resist deformation when an external force is applied at the collision position; The wear degree is obtained by analyzing the wear stiffness value and the inherent stiffness value.

7. The high-performance copper wire drawing intelligent control method according to claim 6, characterized in that: The analyzing according to the collision position, the first sound pattern and the sound attenuation to obtain the wear stiffness value includes: Based on the collision position, a reference sound attenuation is obtained; wherein the reference sound attenuation is used to reflect the extent to which the amplitude of the sound at the collision position is lost when the wire drawing die is propagated in the wire drawing die when the wire drawing die is not worn; Analyzing the first sound pattern to obtain frequency attenuation; wherein the frequency attenuation is used to reflect the degree to which the frequency of the sound generated when the copper wire collides with the wire drawing die is weakened when propagating in the wire drawing die; An attenuation ratio is obtained by analyzing the sound attenuation and the reference sound attenuation; wherein the attenuation ratio is used to reflect the percentage by which the amplitude of the sound generated when the copper wire collides with the wire drawing die is reduced when propagating in the wire drawing die; The wear stiffness value is obtained by analyzing the attenuation ratio and the frequency attenuation.

8. The high-performance copper wire drawing intelligent control method according to claim 7, characterized in that: The step of analyzing the first sound pattern to obtain frequency attenuation includes: Analyze the first sound pattern to obtain multiple durations; wherein the durations are used to reflect the durations of peaks appearing in the first sound pattern; Processing is performed according to the multiple durations to obtain multiple frequency values; wherein the frequency value is used to reflect the inverse of the duration; Processing is performed according to the multiple frequency values ​​to obtain frequency attenuation.

9. The high-performance copper wire drawing intelligent control method according to claim 8, characterized in that: The processing according to the plurality of frequency values ​​to obtain frequency attenuation includes: Performing differential calculation according to the multiple frequency values ​​to obtain multiple differential frequencies; wherein the differential frequency is used to reflect the difference between the i-th frequency value and the i-2-th frequency value, and i is a positive integer greater than 0; An average value is calculated based on the plurality of differential frequencies to obtain a differential mean value, and the differential mean value is confirmed as frequency attenuation.

10. A high-performance copper wire drawing device, characterized in that: The invention comprises a detection device and a control device, wherein the detection device is electrically connected to the control device, the detection device comprises a first sound detection device and a second sound detection device, the control device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the method according to any one of claims 1 to 9 when executing the computer program.

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