Etching method of conductive color-changing film
By cutting or blocking single-sided ITO on the finished diaphragm of SPD, the complex and lengthy SPD production process in the prior art is solved, and the effects of process simplification, production efficiency improvement and cost reduction are achieved.
Patent Information
- Application Number
- CN202510060854.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2025-04-15
AI Technical Summary
The production process of existing suspended particle conductive color discoloration films (SPDs) is complex and lengthy, resulting in low production capacity, low yield, and increasing production costs.
The partitioning of the diaphragm is achieved by simplifying the process flow by performing single-sided ITO cutting or blocking on the finished diaphragm of SPD using specific UV laser cutting machines and processing processes.
The production process is simplified, the production efficiency and yield rate are improved, the production cost is reduced, and the effect of light transmission in the whole area or light transmission in some areas is achieved.
Smart Images
Figure CN119820127A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of suspended particle conductive color-changing film etching, in particular to a conductive color-changing film etching method. Background Art
[0002] Suspended particle conductive color-changing film is usually used for privacy film or sunshade film, referred to as SPD. It is a colored opaque film, generally gray-black or gray-blue. It is currently mainly used on airplane windows and car sunroofs. When the current is energized, the suspended particles in the SPD are arranged in the same direction to produce a light-transmitting effect.
[0003] The common SPD film production process is as follows: 1. ITO electroplating on the upper PET substrate → 2. Cutting or blocking the conductive layer (ITO) between the PET and the suspended particle layer → 3. Applying the suspended particle layer → 4. Laminating the PET conductive film of the same material as the upper layer (without cutting or blocking ITO) to form an SPD finished product with etching and engraving; However, this process is long and complicated, especially after the ITO is electroplated on the substrate PET film, it is more complicated and troublesome to cut or block the conductive layer (ITO) between PET and the liquid crystal layer. It is difficult to cut or block ITO during the production of ITO electroplated on the roll film. Therefore, the normal process is to electroplated ITO, roll the film material, cut it into sheets, and then cut or block ITO, and then use a PET film sheet with ITO cut or blocked and a PET film sheet without ITO cut or blocked to do the liquid crystal coating process. In this way, not only the production process is complicated and lengthy, resulting in low production capacity and low first-time yield, but also labor-intensive, thereby increasing costs.
[0004] Therefore, a conductive color-changing film etching method is proposed to solve this problem. Summary of the invention
[0005] The purpose of the present invention is to provide an etching method for a conductive color-changing film, which has the advantage that it can be processed by a customized specific laser cutting machine with the aid of key cutting parameters, without the need to start from the basic process of layering. It only needs to perform single-sided ITO cutting or blocking on the finished film of the SPD to achieve partitioning after the SPD is powered on.
[0006] To achieve the above object, the present invention provides the following technical solution: a method for etching a conductive color-changing film, comprising the following steps: Step 1: Fixing the SPD film: Place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, thereby adsorbing and fixing the SPD film on top; Step 2: Import cutting parameters: Set the tested cutting pattern parameters and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser parameters to ensure that the UV laser cutting machine can run according to the parameters; Step 3: Control positioning: Start the (visual positioning + height locator) on the Z axis of the UV laser cutting machine, and then synchronously control the X axis, Y axis, and Z axis to cooperate with each other (visual positioning + height locator), and rely on the above cutting pattern parameters to perform ITO cutting; Step 4: SPD film ITO cutting: Use the ultraviolet laser on the cutting machine for cutting, and cooperate with the visual CCD positioning + laser height positioner + dedicated motion control card on the Z axis to control the processing accuracy. When using the adjusted ultraviolet laser parameters to perform the cutting action, the ultraviolet beam will penetrate the protective film and PET film on the upper layer of the SPD that do not absorb the beam energy and directly cut or block the metal conductive layer ITO that absorbs the beam energy, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the effect of full-area light transmission or partial-area light transmission is achieved by appropriate control method.
[0007] Preferably, in step 1, the SPD film is an SPD finished film sheet containing a protective film, and both the upper and lower layers are laminated with PE or PET protective films.
[0008] Preferably, in step 1, the basis of the SPD finished film is composed of two layers of upper and lower substrate PET films and an upper ITO conductive layer and a lower upper ITO conductive layer electroplated between the two layers of upper and lower substrate PET films, and also includes a suspended electron layer coated between the upper and lower ITO conductive layers and an outermost PE or PET protective film.
[0009] Preferably, in step 3, the parameters of the UV cutting machine have been adjusted to cooperate with the (visual positioning + height positioner) on the Z axis and the transmission X axis, Y axis, and Z axis to perform ITO cutting according to the graphic path.
[0010] Preferably, in step 4, the ultraviolet laser on the ultraviolet laser cutting machine is a ND:YAG laser, and the parameters used are: The wavelength range is 280-375nm; the frequency range is 20-150khz; the energy range is 0.1-3J / sec; The processing thickness range of PDLC is 0.05-0.5 mm; the processing speed range is 10-1500 mm / sec; The partition wire diameter filling density range is 0.002~0.05mm; the processing width range is 0.02~2mm.
[0011] Preferably, in step 4, the ultraviolet laser may also be a picosecond laser or a femtosecond laser; the parameter settings of the picosecond laser and the femtosecond laser are consistent with those of the ND:YAG laser.
[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. The patent of this invention uses a specific laser cutting machine and processing technology to cut off or block the conductive function of the upper or lower conductive layer (ITO) of the SPD finished product (including the protective film); thereby achieving the SPD from the entire surface to an SPD composed of several blocks. After the current is turned on, the effect of full-area light transmission or partial-area light transmission is achieved in a suitable control method. Since there is no need to start from the basic process layering, only single-sided ITO cutting or blocking is performed on the finished SPD film. This method replaces the traditional existing technology of first blocking the ITO in the raw material PET+ITO film and then making the SPD. The lengthy process, therefore, can be simplified to a single process, and the production cycle and production yield are significantly improved compared to the traditional method, greatly reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the SPD finished film of the present invention; Figure 2 It is a schematic diagram of etching and engraving according to the present invention. DETAILED DESCRIPTION
[0014] The present invention will be described in more detail below by way of examples, which are merely illustrative and do not in any way limit the scope of the present invention.
[0015] The present invention provides a technical solution: a method for etching a conductive color-changing film, comprising the following steps: Step 1: Fixing the SPD film: Place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, thereby adsorbing and fixing the SPD film on top; Step 2: Import cutting parameters: Set the tested cutting pattern parameters and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser parameters to ensure that the UV laser cutting machine can run according to the parameters; Step 3: Control positioning: Start the (visual positioning + height locator) on the Z axis of the UV laser cutting machine, and then synchronously control the X axis, Y axis, and Z axis to cooperate with each other (visual positioning + height locator), and rely on the above cutting pattern parameters to perform ITO cutting; Step 4: SPD film ITO cutting: Use the ultraviolet laser on the cutting machine for cutting, and cooperate with the visual CCD positioning + laser height positioner + dedicated motion control card on the Z axis to control the processing accuracy. When using the adjusted ultraviolet laser parameters to perform the cutting action, the ultraviolet beam will penetrate the protective film and PET film on the upper layer of the SPD that do not absorb the beam energy and directly cut or block the metal conductive layer ITO that absorbs the beam energy, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the effect of full-area light transmission or partial-area light transmission is achieved by appropriate control method.
[0016] Embodiment 1: First, fix the SPD film: place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, so as to adsorb and fix the SPD film above; then import the cutting parameters: set the cutting pattern parameters that have been tested, and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser parameters to ensure that the UV laser cutting machine can run according to the parameters; then control positioning: start the (visual positioning + height positioner) on the Z axis of the UV laser cutting machine, and then synchronously control the X axis, Y axis, and Z axis to cooperate with each other (visual positioning + height positioner), and ITO cutting is performed based on the above-mentioned cutting pattern parameters; finally, SPD film ITO cutting is performed: the ultraviolet laser on the cutting machine is used for cutting, and the visual CCD positioning + laser height positioner + dedicated motion control card on the Z axis are used to control the processing accuracy. When the cutting action is performed using the adjusted ultraviolet laser parameters, the ultraviolet beam will penetrate the protective film and PET film on the upper layer of the SPD that do not absorb the beam energy, and directly cut or block the metal conductive layer ITO that absorbs the beam energy, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the effect of full or partial light transmission is achieved by appropriate control methods.
[0017] Embodiment 2: In the first embodiment, the following steps are added: In step 1, the SPD film is an SPD finished film sheet containing a protective film and both the upper and lower layers are adhered with PE or PET protective films; the basic structure of the SPD finished film sheet is an upper and lower layer of substrate PET film and an upper ITO conductive layer and a lower upper ITO conductive layer electroplated between the upper and lower layers of substrate PET film, and also includes a suspended electron layer coated between the upper and lower ITO conductive layers and an outermost PE or PET protective film.
[0018] First, fix the SPD film: place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, so as to adsorb and fix the upper SPD film; the SPD film is a finished SPD film containing a protective film, and the upper and lower layers are both laminated with PE or PET protective films; the basic structure of the finished SPD film is the upper and lower layers of the substrate PET film and the upper ITO conductive layer and the lower upper ITO conductive layer electroplated between the upper and lower layers of the substrate PET film, and also includes the suspended electron layer coated between the upper and lower ITO conductive layers and the outermost PE or PET protective film; then import the cutting parameters: set the cutting pattern parameters completed by the test, and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser parameters to ensure that the UV laser cutting machine can operate according to the parameters; Then control positioning: by starting the (visual positioning + height locator) on the Z axis of the UV laser cutting machine, and then synchronously controlling the X axis, Y axis, and Z axis to cooperate with each other (visual positioning + height locator), and relying on the above-mentioned cutting graphic parameters to perform ITO cutting; finally, SPD film ITO cutting: using the UV laser on the cutting machine for cutting, and at the same time coordinating with the visual CCD positioning + laser height locator + dedicated motion control card on the Z axis to control the processing accuracy, when using the adjusted UV laser parameters to perform the cutting action, the UV beam will penetrate the protective film and PET film on the upper layer of the SPD that do not absorb the beam energy, and directly cut or block the metal conductive layer ITO that absorbs the beam energy, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the effect of full or partial light transmission is achieved in a suitable control method.
[0019] Embodiment three: In the second embodiment, the following steps are added: In step 3, the parameters of the UV cutting machine have been adjusted to cooperate with the (visual positioning + height positioner) on the Z axis and the transmission X axis, Y axis, and Z axis to perform ITO cutting according to the graphic path.
[0020] First, fix the SPD film: place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, so as to adsorb and fix the upper SPD film; the SPD film is a finished SPD film containing a protective film, and the upper and lower layers are both laminated with PE or PET protective films; the basic structure of the finished SPD film is the upper and lower layers of the substrate PET film and the upper ITO conductive layer and the lower upper ITO conductive layer electroplated between the upper and lower layers of the substrate PET film, and also includes the suspended electron layer coated between the upper and lower ITO conductive layers and the outermost PE or PET protective film; then import the cutting parameters: set the cutting pattern parameters completed by the test, and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser laser parameters to ensure that the UV laser cutting machine can run according to the parameters; then control positioning: by starting the (visual positioning + Height locator), and then synchronously control the X-axis, Y-axis, and Z-axis to cooperate with each other (visual positioning + height locator), and rely on the above-mentioned cutting graphic parameters to perform ITO cutting; the adjusted UV cutting machine parameters need to cooperate with the (visual positioning + height locator) on the Z axis and the transmission X-axis, Y-axis, and Z axis to perform ITO cutting according to the graphic path; finally, SPD film ITO cutting: use the ultraviolet laser on the cutting machine for cutting, and cooperate with the visual CCD positioning + laser height locator + dedicated motion control card on the Z axis to control the processing accuracy. When the adjusted UV laser parameters are used to perform the cutting action, the UV beam will penetrate the protective film and PET film on the upper layer of the SPD that do not absorb the beam energy and directly cut or block the metal conductive layer ITO that absorbs the beam energy, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the effect of full-area light transmission or partial-area light transmission is achieved in a suitable control method.
[0021] Embodiment 4: In the third embodiment, the following steps are added: In step 4, the ultraviolet laser on the ultraviolet laser cutting machine is an ND:YAG laser, and the parameters used are: wavelength range is 280-375nm; frequency range is 20-150khz; energy range is 0.1-3J / sec; PDLC processing thickness range is 0.05-0.5 mm; processing speed range is 10-1500mm / sec; partition line diameter filling density range is 0.002-0.05mm; processing width range is 0.02-2 mm; ultraviolet lasers can also use picosecond lasers and femtosecond lasers; the parameter settings of picosecond lasers and femtosecond lasers are consistent with ND:YAG lasers.
[0022] First, fix the SPD film: place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, so as to adsorb and fix the upper SPD film; the SPD film is a finished SPD film containing a protective film, and the upper and lower layers are both laminated with PE or PET protective films; the basic structure of the finished SPD film is the upper and lower layers of the substrate PET film and the upper ITO conductive layer and the lower upper ITO conductive layer electroplated between the upper and lower layers of the substrate PET film, and also includes the suspended electron layer coated between the upper and lower ITO conductive layers and the outermost PE or PET protective film; then import the cutting parameters: set the cutting pattern parameters completed by the test, and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser parameters to ensure that the UV laser cutting machine can run according to the parameters; then control positioning: by starting the (visual positioning + height positioner) on the Z axis of the UV laser cutting machine, and then synchronously control the X axis, Y axis, and Z axis to cooperate with each other (visual positioning + height positioner), and rely on the above cutting pattern parameters to perform ITO cutting is performed; the parameters of the UV cutting machine that have been adjusted need to cooperate with the (visual positioning + height positioner) on the Z axis and the transmission X axis, Y axis, and Z axis to perform ITO cutting according to the graphic path; finally, the SPD film ITO cutting is performed: the UV laser on the cutting machine is used for cutting, and the visual CCD positioning + laser height positioner + dedicated motion control card on the Z axis is used to control the processing accuracy. When the UV laser parameters that have been adjusted are used to perform the cutting action, the UV beam will penetrate the protective layer of the SPD upper layer that does not absorb the beam energy. The film and PET film are directly cut or blocked with the metal conductive layer ITO that absorbs the energy of the light beam, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the full-area or partial-area light-transmitting effect is achieved by appropriate control method; the ultraviolet laser on the ultraviolet laser cutting machine is ND:YAG laser, and the parameters used are: wavelength range is 280-375nm; frequency range is 20-150khz; energy range is 0.1-3J / sec; PDLC processing thickness range is 0.05-0.5mm; processing speed range is 10-1500mm / sec; partition line diameter filling density range is 0.002-0.05mm; processing width range is 0.02-2mm; ultraviolet lasers can also use picosecond lasers and femtosecond lasers; the parameter settings of picosecond lasers and femtosecond lasers are consistent with ND:YAG lasers.
[0023] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A method for etching a conductive color-changing film, characterized in that: The following steps are involved: Step 1: Fixing the SPD film: Place the SPD film on the negative pressure platform of the UV laser cutting machine, and turn on the negative pressure machine to create a negative pressure environment on the platform, thereby adsorbing and fixing the SPD film on top; Step 2: Import cutting parameters: Set the tested cutting pattern parameters and import the cutting pattern parameters into the system of the UV laser cutting machine, and then adjust the UV laser parameters to ensure that the UV laser cutting machine can run according to the parameters; Step 3: Control positioning: Start the (visual positioning + height locator) on the Z axis of the UV laser cutting machine, and then synchronously control the X axis, Y axis, and Z axis to cooperate with each other (visual positioning + height locator), and rely on the above cutting pattern parameters to perform ITO cutting; Step 4: SPD film ITO cutting: Use the ultraviolet laser on the cutting machine for cutting, and cooperate with the visual CCD positioning + laser height positioner + dedicated motion control card on the Z axis to control the processing accuracy. When using the adjusted ultraviolet laser parameters to perform the cutting action, the ultraviolet beam will penetrate the protective film and PET film on the upper layer of the SPD that do not absorb the beam energy and directly cut or block the metal conductive layer ITO that absorbs the beam energy, thereby dividing the SPD film into 2 or more areas, and after the current is turned on, the effect of full-area light transmission or partial-area light transmission is achieved by appropriate control method.
2. The method for etching a conductive color-changing film according to claim 1, characterized in that: In step 1, the SPD film is a SPD finished film sheet containing a protective film, and both the upper and lower layers are laminated with PE or PET protective films.
3. The etching method of a conductive color-changing film according to claim 1, characterized in that: In step 1, the basic structure of the SPD finished film is composed of two layers of substrate PET film and an upper ITO conductive layer and a lower upper ITO conductive layer electroplated between the upper and lower layers of the substrate PET film, and also includes a suspended electron layer coated between the upper and lower ITO conductive layers and an outermost PE or PET protective film.
4. The method for etching a conductive color-changing film according to claim 1, characterized in that: In step 3, the parameters of the UV cutting machine have been adjusted to cooperate with the (visual positioning + height positioner) on the Z axis and the transmission X axis, Y axis, and Z axis to perform ITO cutting according to the graphic path.
5. The method for etching a conductive color-changing film according to claim 1, characterized in that: In step 4, the ultraviolet laser on the ultraviolet laser cutting machine is a ND:YAG laser, and the parameters used are: The wavelength range is 280-375nm; the frequency range is 20-150khz; the energy range is 0.1-3J / sec; The processing thickness range of PDLC is 0.05-0.5 mm; the processing speed range is 10-1500 mm / sec; The partition wire diameter filling density range is 0.002~0.05mm; the processing width range is 0.02~2mm.
6. The method for etching a conductive color-changing film according to claim 1, characterized in that: In step 4, the ultraviolet laser may also be a picosecond laser or a femtosecond laser; the parameter settings of the picosecond laser and the femtosecond laser are consistent with those of the ND:YAG laser.