Automatic wafer processing equipment suitable for monocrystalline silicon packaging

Abstract

The invention discloses automatic wafer processing equipment suitable for monocrystalline silicon packaging, and relates to the technical field of monocrystalline silicon processing, the automatic wafer processing equipment is characterized in that a bearing assembly and a cutting table are arranged in a cutting machine main body, the bottom end of the bearing assembly is fixedly connected with the cutting machine main body, and the bottom end of a cutter is fixedly connected with a cutting rod; the bottom end of the cutting rod is fixedly connected with a cutting head, the air blower is arranged at the side end of the cutting machine body, a plurality of connecting pipes are arranged between the air blower and the cutting machine body, the two ends of each connecting pipe are fixedly connected with the cutting machine body and the air blower respectively, and a plurality of air inlets are formed in the side end of the cutting machine body and communicate with the connecting pipes. Air flow penetrates through the air inlet to enter the cutting machine main body, then flows along the top of the monocrystalline silicon, removes waste chips in the air, and meanwhile, removes the waste chips at the top of the monocrystalline silicon.

Description

Technical Field

[0001] The present invention relates to the technical field of single crystal silicon processing, and in particular to automated wafer processing equipment suitable for single crystal silicon packaging. Background Art

[0002] Single crystal silicon is a crystal formed by silicon atoms arranged in a specific lattice structure. The most common single crystal silicon crystal structure is the diamond cubic crystal structure. Each silicon atom is connected to four adjacent silicon atoms by covalent bonds to form a stable three-dimensional network structure.

[0003] In the prior art, before monocrystalline silicon is packaged, it is often processed using automated processing equipment, wherein the monocrystalline silicon is cut using an automated cutting machine, the monocrystalline silicon is placed on a workbench of the cutting machine via a robotic arm, and the mechanical blade on the cutting machine cuts the monocrystalline silicon, thereby facilitating subsequent processing and packaging of the monocrystalline silicon.

[0004] However, when the mechanical blade cuts the single crystal silicon, fine waste chips will be generated and scattered in the automatic cutting machine. When the single crystal silicon is cut, when the single crystal silicon is taken out of the automatic cutting machine, the waste chips will enter the air, affecting the working environment of the automatic cutting machine. Summary of the invention

[0005] The purpose of the present invention is to provide an automated wafer processing equipment suitable for single crystal silicon packaging, so as to solve the technical problem in the prior art that when a mechanical blade cuts single crystal silicon, fine waste chips will be generated and scattered in the automated cutting machine; when the single crystal silicon is cut, the waste chips will enter the air when the single crystal silicon is taken out of the automated cutting machine, thereby affecting the working environment of the automated cutting machine.

[0006] The technical problem to be solved by the present invention can be achieved by the following technical solutions:

[0007] Automated wafer processing equipment for single crystal silicon packaging, including:

[0008] A cutting machine body, wherein a bearing assembly and a cutting table are arranged inside the cutting machine body, the bottom end of the bearing assembly is fixedly connected to the cutting machine body, the cutting table is arranged on the top of the bearing assembly, and the bottom end of the cutting table is fixedly connected to the cutting machine body;

[0009] A cutter, wherein the cutter is slidably connected to the bottom of the cutting table, a cutting rod is fixedly connected to the bottom end of the cutter, and a cutting head is fixedly connected to the bottom end of the cutting rod;

[0010] A blower is arranged at the side end of the cutting machine body, and a plurality of connecting pipes are arranged between the blower and the cutting machine body. Both ends of the connecting pipes are fixedly connected to the cutting machine body and the blower respectively. A plurality of air inlets are opened at the side end of the cutting machine body, and the air inlets are communicated with the connecting pipes.

[0011] As a further solution of the present invention: feed ports are respectively opened on both sides of the cutting machine body, and blocking doors for blocking the feed ports are respectively slidably connected to both sides of the cutting machine body.

[0012] As a further solution of the present invention: controllers are respectively provided on both sides of the cutting table, the controllers are slidably connected to the inner wall of the cutting machine body, and adsorption plates are fixedly connected to the side ends of the controllers.

[0013] As a further solution of the present invention: a plurality of connecting rods are provided between the blower and the cutter body, the plurality of connecting rods are respectively located around the blower, the two ends of the connecting rods are respectively fixedly connected to the blower and the cutter body, and the cutter body is provided with a collection box at one end away from the blower.

[0014] As a further solution of the present invention: a plurality of filter holes are provided at a side end of the collection box, and an air outlet is provided at an end of the cutting machine body away from the blower, and the air outlet is communicated with the interior of the collection box.

[0015] As a further solution of the present invention: a washer is provided at the side end of the air inlet, and the washer is arranged inside the cutting machine body, the top end of the washer is fixedly connected to the cutting machine body, and the bottom end of the washer is fixedly connected to a cleaning pipe.

[0016] As a further solution of the present invention: the supporting assembly includes: a lifter, a supporting platform, a suction plate and a telescopic rod, the bottom end of the lifter is fixedly connected to the cutting machine body, the supporting platform is fixedly connected to the top of the lifter, a telescopic hole is opened inside the supporting platform, the upper and lower ends of the telescopic rod are respectively fixedly connected to the suction plate and the lifter, and the suction plate is slidably connected to the inner wall of the supporting platform.

[0017] As a further solution of the present invention: a plurality of vacuum holes are provided on the top of the adsorption disk.

[0018] As a further solution of the present invention: a sealing gasket is fixedly connected to the inner wall of the top of the supporting platform.

[0019] As a further solution of the present invention: a positioner and an air jet are respectively provided on both sides of the cutting rod, the top ends of the positioner and the air jet are respectively fixedly connected to the bottom end of the cutter, and the bottom end of the air jet is fixedly connected to a bent air jet pipe.

[0020] Beneficial effects of the present invention:

[0021] 1. When the monocrystalline silicon is placed on the carrier assembly, the top of the monocrystalline silicon is level with the top of the carrier assembly, and the cutter can move at the bottom of the cutting table. When the cutter controls the cutting rod to move downward, the cutting rod moves downward with the cutting head fixed at the bottom. When the cutting head is aligned with the top of the monocrystalline silicon, the cutter moves on the top of the monocrystalline silicon with the cutting head through the cutting rod, and the cutting head cuts the top of the monocrystalline silicon. When the cutting head produces waste chips when cutting the monocrystalline silicon, the blower starts, and the blower introduces clean air into the cutting machine body through the connecting pipe. The airflow passes through the air inlet into the cutting machine body, and then the airflow flows along the top of the monocrystalline silicon. The airflow removes the waste chips in the air. At the same time, the airflow removes the waste chips on the top of the monocrystalline silicon.

[0022] 2. When waste chips are suspended on the cutter, cutting rod and cutting head, the airflow can also clean and remove them. When the cutter runs for a long time, the cutter and the cutting head will generate heat, which will cause the temperature of the cutter and the cutting head to rise. The blower can continuously pass clean air into the cutting machine body, so that the flowing airflow can remove the heat of the cutter and the cutting head, thereby achieving the effect of cooling the cutter and the cutting head. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a top view of the overall structure of the present invention;

[0026] Figure 3 It is the AA cross-sectional view of the overall structure of the present invention;

[0027] Figure 4 For the present invention Figure 3 A schematic diagram of the structure at A;

[0028] Figure 5 It is a schematic diagram of the structure of the carrier platform of the present invention;

[0029] Figure 6 It is a schematic diagram of the cutter structure of the present invention.

[0030] In the figure: 1. Cutting machine body; 2. Blower; 3. Connecting rod; 4. Connecting pipe; 5. Air inlet; 6. Feed inlet; 7. Blocking door; 8. Collecting box; 9. Filter hole; 10. Cleaner; 11. Cleaning pipe; 12. Controller; 13. Adsorption plate; 14. Lifter; 15. Cutting table; 16. Cutter; 17. Air outlet; 18. Cutting rod; 19. Cutting head; 20. Sealing pad; 21. Carrying table; 22. Adsorption plate; 23. Vacuum hole; 24. Telescopic rod; 25. Telescopic hole; 26. Positioner; 27. Injector; 28. Injection pipe. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] like Figure 1-Figure 6 As shown, the automated wafer processing equipment suitable for single crystal silicon packaging includes:

[0033] A bearing assembly and a cutting table 15 are provided inside the cutting machine body 1, wherein the bottom end of the bearing assembly is fixedly connected to the cutting machine body 1, the cutting table 15 is arranged on the top of the bearing assembly, and the bottom end of the cutting table 15 is fixedly connected to the cutting machine body 1, the cutter 16 is slidably connected to the bottom of the cutting table 15, a cutting rod 18 is fixedly connected to the bottom end of the cutter 16, and a cutting head 19 is fixedly connected to the bottom end of the cutting rod 18. When the single crystal silicon is placed on the bearing assembly, the top of the single crystal silicon is flush with the top of the bearing assembly, the cutter 16 can move at the bottom of the cutting table 15, and when the cutter 16 controls the cutting rod 18 to move downward, the cutting rod 18 moves downward with the cutting head 19 fixed at the bottom end, and when the cutting head 19 is aligned with the top of the single crystal silicon, the cutter 16 moves on the top of the single crystal silicon with the cutting rod 18, and the cutting head 19 cuts the top of the single crystal silicon;

[0034] The blower 2 is arranged at the side end of the cutting machine body 1, and a plurality of connecting pipes 4 are arranged between the blower 2 and the cutting machine body 1. The two ends of the connecting pipes 4 are respectively fixedly connected to the cutting machine body 1 and the blower 2. The side end of the cutting machine body 1 is provided with a plurality of air inlets 5, and the air inlets 5 are communicated with the connecting pipes 4. When the cutting head 19 cuts the monocrystalline silicon and generates waste chips, the blower 2 is operated, and the blower 2 passes clean air into the cutting machine body 1 through the connecting pipes 4. The airflow passes through the air inlets 5 and enters the cutting machine body 1. Then the airflow flows along the top of the monocrystalline silicon, and the waste chips in the air are blown into the cutting machine body 1. At the same time, the airflow removes the waste chips on the top of the single crystal silicon. It should be noted that when the waste chips are suspended on the cutter 16, the cutting rod 18 and the cutting head 19, the airflow can also clean and remove them. When the cutter 16 runs for a long time, the cutter 16 and the cutting head 19 will generate heat, which will cause the temperature of the cutter 16 and the cutting head 19 to rise. The blower 2 can continuously pass clean air into the cutting machine body 1, so that the flowing airflow can remove the heat of the cutter 16 and the cutting head 19, thereby achieving the effect of cooling the cutter 16 and the cutting head 19.

[0035] In some specific embodiments, feed ports 6 are respectively opened on both sides of the cutting machine body 1, and sealing doors 7 for sealing the feed ports 6 are respectively slidably connected on both sides of the cutting machine body 1. The single crystal silicon is generally placed on a carrier, and then the carrier is placed in the cutting machine body 1 through the feed port 6. When the single crystal silicon enters the cutting machine body 1, the cutting machine body 1 controls the sealing door 7 to move, and the sealing door 7 blocks the feed port 6, thereby ensuring that the cutting machine body 1 is in a sealed environment. When waste chips are generated during the cutting of the single crystal silicon, the waste chips will not flow out of the cutting machine body 1, thereby preventing the waste chips from polluting the air.

[0036] In some specific embodiments, controllers 12 are respectively provided on both sides of the cutting table 15, and the controllers 12 are slidably connected to the inner wall of the cutting machine body 1, and the side end of the controller 12 is fixedly connected to the adsorption plate 13. When the single crystal silicon is placed on the supporting assembly from the supporting frame, the controller 12 moves along the inner wall of the cutting machine body 1, and the controller 12 controls the adsorption plate 13 to adsorb the single crystal silicon. Then, the controller 12 moves the single crystal silicon to the supporting assembly through the adsorption plate 13. When the single crystal silicon is cut, another controller 12 controls the adsorption plate 13 to unload the single crystal silicon from the supporting assembly.

[0037] In some specific embodiments, a plurality of connecting rods 3 are provided between the blower 2 and the cutting machine body 1, and the plurality of connecting rods 3 are respectively located around the blower 2, and the two ends of the connecting rods 3 are respectively fixedly connected to the blower 2 and the cutting machine body 1, and the cutting machine body 1 is provided with a collecting box 8 at the end away from the blower 2, and a plurality of filter holes 9 are provided at the side end of the collecting box 8, and the cutting machine body 1 is provided with an air outlet 17 at the end away from the blower 2, and the air outlet 17 is interconnected with the interior of the collecting box 8, and the blower 2 is fixed to the side end of the cutting machine body 1 through the connecting rods 3. When the airflow introduced from the blower 2 to the cutting machine body 1 flows in the cutting machine body 1, the flowing airflow passes through the air outlet 17 with waste chips, and the airflow enters the collecting box 8 with the waste chips, and the airflow passes through the filter holes 9, and the waste chips accumulate in the collecting box 8, wherein the filter holes 9 achieve the effect of filtering the waste chips.

[0038] In some specific embodiments, a cleaner 10 is provided at the side end of the air inlet 5, and the cleaner 10 is arranged inside the cutting machine body 1. The top of the cleaner 10 is fixedly connected to the cutting machine body 1, and the bottom of the cleaner 10 is fixedly connected to a cleaning pipe 11. When the cutting of the single crystal silicon is completed, the controller 12 carries the single crystal silicon for unloading through the adsorption plate 13. When the single crystal silicon is moving, the cleaner 10 runs, and the cleaner 10 sprays the cleaning liquid on the single crystal silicon through the cleaning pipe 11. The cleaning liquid can further clean the cut part. When the single crystal silicon is cleaned, the flowing airflow first contacts the cleaned single crystal silicon, and the airflow cleans the cleaning liquid left on the surface of the single crystal silicon, thereby achieving the effect of automatic air drying of the single crystal silicon. When the single crystal silicon is dried, the controller 12 places the single crystal silicon on the carrier through the adsorption plate 13.

[0039] In some specific embodiments, the bearing assembly includes: a lifter 14, a bearing platform 21, a suction plate 22 and a telescopic rod 24, the bottom end of the lifter 14 is fixedly connected to the cutting machine body 1, the bearing platform 21 is fixedly connected to the top of the lifter 14, a telescopic hole 25 is provided inside the bearing platform 21, the upper and lower ends of the telescopic rod 24 are respectively fixedly connected to the suction plate 22 and the lifter 14, the suction plate 22 is slidably connected to the inner wall of the bearing platform 21, a plurality of vacuum holes 23 are provided on the top of the suction plate 22, and a sealing pad 20 is fixedly connected to the inner wall of the top of the bearing platform 21. When the single crystal silicon is placed on the bearing assembly, the single crystal silicon first It is placed on the adsorption plate 22, and the adsorption plate 22 adsorbs the single crystal silicon through the vacuum hole 23. Then, the lifter 14 drives the telescopic rod 24 to move downward, and the telescopic rod 24 drives the adsorption plate 22 to move downward along the inner wall of the supporting platform 21. When the single crystal silicon and the top of the supporting platform 21 are level, the lifter 14 stops running. When the single crystal silicon is cut, the inner wall of the supporting platform 21 can limit the single crystal silicon to avoid the single crystal silicon from shifting. Among them, the sealing gasket 20 fixed on the inner wall of the supporting platform 21 has plasticity. The sealing gasket 20 can protect the single crystal silicon all around to avoid scratches caused by the single crystal silicon and the inner wall of the supporting platform 21.

[0040] In some specific embodiments, a positioner 26 and an air jet 27 are respectively provided on both sides of the cutting rod 18, and the top ends of the positioner 26 and the air jet 27 are respectively fixedly connected to the bottom end of the cutter 16, and the bottom end of the air jet 27 is fixedly connected to a jet pipe 28 in a bent shape. When the cutter 16 controls the cutting head 19 to cut the single crystal silicon, the positioner 26 fixed at the bottom end of the cutter 16 can position the single crystal silicon, thereby transmitting the signal of the cutting head 19 moving on the single crystal silicon to the cutter 16, further ensuring the accuracy of the movement of the cutter 16. When the cutting head 19 cuts the single crystal silicon, the air jet 27 runs, and the air jet 27 blows the airflow through the air jet pipe 28 to the cutting position of the single crystal silicon. The airflow blows the waste chips at the cutting position of the single crystal silicon to the top of the single crystal silicon to avoid the waste chips being left on the single crystal silicon. When the waste chips float on the top of the single crystal silicon, the airflow introduced by the blower 2 takes away the dust.

[0041] Several embodiments of the present invention are described in detail above, but the embodiments of the present invention are not limited thereto and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. Automated wafer processing equipment suitable for single crystal silicon packaging, characterized in that: include: A cutting machine body (1), wherein a bearing assembly and a cutting table (15) are provided inside the cutting machine body (1), wherein the bottom end of the bearing assembly is fixedly connected to the cutting machine body (1), and the cutting table (15) is arranged on the top of the bearing assembly, and the bottom end of the cutting table (15) is fixedly connected to the cutting machine body (1); A cutter (16), wherein the cutter (16) is slidably connected to the bottom of the cutting table (15), a cutting rod (18) is fixedly connected to the bottom end of the cutter (16), and a cutting head (19) is fixedly connected to the bottom end of the cutting rod (18); A blower (2), the blower (2) being arranged at a side end of a cutting machine body (1), a plurality of connecting pipes (4) being arranged between the blower (2) and the cutting machine body (1), the two ends of the connecting pipes (4) being respectively fixedly connected to the cutting machine body (1) and the blower (2), a plurality of air inlets (5) being opened at the side end of the cutting machine body (1), the air inlets (5) being in communication with the connecting pipes (4).

2. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 1, characterized in that: Feed ports (6) are respectively provided on both sides of the cutting machine body (1), and blocking doors (7) for blocking the feed ports (6) are respectively slidably connected to both sides of the cutting machine body (1).

3. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 1, characterized in that: Controllers (12) are respectively provided on both sides of the cutting table (15); the controller (12) is slidably connected to the inner wall of the cutting machine body (1); and a suction plate (13) is fixedly connected to the side end of the controller (12).

4. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 1, characterized in that: A plurality of connecting rods (3) are provided between the blower (2) and the cutting machine body (1); the plurality of connecting rods (3) are respectively located around the blower (2); the two ends of the connecting rods (3) are respectively fixedly connected to the blower (2) and the cutting machine body (1); and a collecting box (8) is provided at one end of the cutting machine body (1) away from the blower (2).

5. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 4, characterized in that: A plurality of filter holes (9) are provided at the side end of the collecting box (8), and an air outlet (17) is provided at the end of the cutting machine body (1) away from the blower (2), and the air outlet (17) is communicated with the interior of the collecting box (8).

6. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 1, characterized in that: A washer (10) is provided at the side end of the air inlet (5), and the washer (10) is arranged inside the cutting machine body (1), the top end of the washer (10) is fixedly connected to the cutting machine body (1), and the bottom end of the washer (10) is fixedly connected to a cleaning pipe (11).

7. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 1, characterized in that: The bearing assembly comprises: a lifter (14), a bearing platform (21), a suction plate (22) and a telescopic rod (24); the bottom end of the lifter (14) is fixedly connected to the cutting machine body (1); the bearing platform (21) is fixedly connected to the top end of the lifter (14); a telescopic hole (25) is provided inside the bearing platform (21); the upper and lower ends of the telescopic rod (24) are respectively fixedly connected to the suction plate (22) and the lifter (14); and the suction plate (22) is slidably connected to the inner wall of the bearing platform (21).

8. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 7, characterized in that: A plurality of vacuum holes (23) are provided on the top of the adsorption disk (22).

9. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 7, characterized in that: A sealing gasket (20) is fixedly connected to the inner wall of the top of the supporting platform (21).

10. The automated wafer processing equipment suitable for single crystal silicon packaging according to claim 1, characterized in that: A positioner (26) and an air jet (27) are respectively provided on both sides of the cutting rod (18); the top ends of the positioner (26) and the air jet (27) are respectively fixedly connected to the bottom end of the cutter (16); and the bottom end of the air jet (27) is fixedly connected to an air jet pipe (28) in a bent shape.

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