Cyanide-free silver-plated palladium alloy stabilizer, preparation device, preparation method and application

Abstract

The invention relates to the technical field of building engineering construction, in particular to a cyanide-free silver-palladium alloy plating stabilizer, a preparation device, a preparation method and application. The stabilizer prepared by mixing 3-aminomethyl-tetrahydrofuran and 2-amino-5-chloro-N, 3-dimethyl benzamide is added into a silver-palladium alloy electroplating solution; the self-decomposition of the plating solution can be inhibited on the basis of not changing the performance of the original plating layer; the coating quality is improved; in the electroplating process, the stabilizing agent can promote the combination between the plating layer and the base body through a certain mechanism, so that the plating layer is more firmly attached to the base body. The method is of great significance in improving the overall performance and prolonging the service life of electroplated products. The performance parameters of viscosity, surface tension and the like of the plating solution can be adjusted by the stabilizer according to specific requirements so as to adapt to different electroplating processes and base materials.

Description

Technical Field

[0001] The present invention relates to the field of electroplating technology, and in particular to a cyanide-free silver-palladium alloy stabilizer, a preparation device, a preparation method and an application thereof. Background Art

[0002] As a surface treatment process, electroplating technology has a long history and is widely used. Among the many electroplating materials, silver and palladium are favored because of their unique physical and chemical properties. Silver occupies an important position in the electronics industry due to its excellent electrical and thermal conductivity, while palladium plays a key role in the chemical and aerospace fields due to its excellent chemical stability and wear resistance. The silver-palladium alloy coating formed by combining these two metals not only inherits the excellent properties of silver and palladium, but also further improves its performance through the alloying effect, making it widely used in many fields such as electronics, communications, aerospace and chemical industry. Especially in key areas such as high-frequency components, electrical contact components and protective decoration, the performance advantages of silver-palladium alloy coatings are particularly obvious. With the continuous advancement of electroplating technology, the technology of electroplating silver-palladium alloy is also constantly developing and improving.

[0003] At present, the technology of electroplating silver-palladium alloy is relatively mature, and a variety of electroplating methods and formulas have been developed for the preparation of silver-palladium alloy coatings. These methods include ammoniacal plating solutions and acidic plating solutions, which can achieve the electrodeposition of silver-palladium alloys under different process conditions. The development of these technologies has made the preparation of silver-palladium alloy coatings more flexible and efficient. However, although the technology of electroplating silver-palladium alloy has made certain progress, it still faces some challenges in practical applications. The stability of the plating solution and the uniformity of the coating are two key technical problems, which directly affect the quality and performance of the coating.

[0004] Although the technology of silver-palladium alloy electroplating has made certain achievements, the existing technology still has some shortcomings. For example, the stability of the plating solution is difficult to control and is easily affected by various factors such as temperature, pH value, impurity content, etc., which may lead to uneven coating quality and performance degradation. Summary of the invention

[0005] The main purpose of the present invention is to provide a cyanide-free silver-palladium alloy stabilizer, a preparation device, a preparation method and an application, aiming to solve the technical problem that the stability of the plating solution in the related technology is difficult to control and is easily affected by various factors such as temperature, pH value, impurity content, etc., which may lead to uneven coating quality and reduced performance.

[0006] To achieve the above objectives, in a first aspect, the present invention provides a cyanide-free silver-plated palladium alloy stabilizer, wherein the stabilizer is prepared by mixing 3-aminomethyl-tetrahydrofuran and 2-amino-5-chloro-N,3-dimethylbenzamide.

[0007] Optionally, in terms of mass concentration, the mass concentration of the 3-aminomethyl-tetrahydrofuran is 2 to 5 g / L, and the mass concentration of the 2-amino-5-chloro-N,3-dimethylbenzamide is 1 to 3 g / L.

[0008] Optionally, in terms of mass ratio, the mass ratio of the 3-aminomethyl-tetrahydrofuran to 2-amino-5-chloro-N,3-dimethylbenzamide is (1.5-2):1.

[0009] Based on the same technical concept, in the second aspect, the present invention also proposes an electroplating solution, which comprises a water-soluble silver salt, a water-soluble palladium salt, the cyanide-free silver-plated palladium alloy stabilizer described in the first aspect and water; in terms of mass concentration, the concentration of the water-soluble silver salt is 1g / L-50g / L, the concentration of the water-soluble palladium salt is 1g / L-50g / L, the concentration of the 3-aminomethyl-tetrahydrofuran is 0.02~0.05g / L, and the concentration of the 2-amino-5-chloro-N,3-dimethylbenzamide is 0.01~0.03g / L.

[0010] Optionally, the electroplating solution also includes water-soluble lithium salt, water-soluble ferrous salt, water-soluble sodium salt and EDTA; in terms of mass concentration, the concentration of the water-soluble lithium salt is 500g / L-700g / L, the concentration of the water-soluble ferrous salt is 0.1g / L-0.5g / L, the concentration of the water-soluble sodium salt is 2g / L-5g / L, and the concentration of the EDTA is 0.1g / L-1g / L.

[0011] Optionally, the pH value of the electroplating solution is 8.9-9.3.

[0012] Based on the same technical concept, in the third aspect, the present invention also proposes a method for preparing a cyanide-free silver-plated palladium alloy stabilizer, which is used to prepare the cyanide-free silver-plated palladium alloy stabilizer described in the first aspect or to prepare the cyanide-free silver-plated palladium alloy stabilizer in the electroplating solution described in the second aspect, and the preparation method comprises the following steps:

[0013] Weigh a first target dose of 3-aminomethyl-tetrahydrofuran, dissolve it in a preset dose of deionized water, and stir evenly to prepare a 3-aminomethyl-tetrahydrofuran solution;

[0014] Weigh a second target dose of 2-amino-5-chloro-N,3-dimethylbenzamide for later use;

[0015] The 2-amino-5-chloro-N,3-dimethylbenzamide is dissolved in the 3-aminomethyl-tetrahydrofuran solution and stirred evenly, and the deionized water is continuously added to a standard dosage to obtain the stabilizer.

[0016] Based on the same technical concept, in a fourth aspect, the present invention further proposes a preparation device for a cyanide-free silver-palladium alloy stabilizer, which is used to perform the preparation method described in the third aspect, and the preparation device comprises:

[0017] a drive mechanism having a mounting position formed thereon;

[0018] A swing mechanism, wherein the swing mechanism is installed at the installation position, and the driving mechanism can move the swing mechanism to adjust the spatial position of the swing mechanism; and

[0019] A material making mechanism is installed on the swing mechanism, and the swing mechanism can drive the material making mechanism to swing to prepare the stabilizer.

[0020] Optionally, the material making mechanism comprises:

[0021] A material preparation tank, the material preparation tank is installed on the swing mechanism, the bottom of the material preparation tank is formed with a discharge port that can connect the inner cavity of the material preparation tank with the external environment, and the top of the material preparation tank is formed with a connection port;

[0022] A stirrer, the stirrer is arranged in the material preparation tank, and at least a part of the stirrer extends upward from the connection port, the stirrer is formed with a material storage cavity arranged vertically through, the top of the stirrer is rotatably matched with the material preparation tank, the top of the material storage cavity is formed with a material feed port, and the bottom of the material storage cavity is formed with a material discharge port;

[0023] A feeding control assembly, wherein the feeding control assembly can be movably disposed in the material storage cavity, the feeding control assembly can slide vertically relative to the material storage cavity and can drive the agitator to rotate and stir, and at least a portion of the feeding control assembly extends downward from the bottom of the agitator to open or close the discharge port, and the top of the feeding control assembly extends from the feed port and is located outside the material preparation tank; and

[0024] The first drive component is installed above the connecting port, and the first drive component can be lowered to connect with the feeding control component to drive the feeding control component to drive the agitator to perform a stirring operation; the first drive component can also continue to descend and drive the feeding control component to descend and open the discharge port, and when the feeding control component opens the discharge port, the first drive component can drive the feeding control component to drive the agitator to perform a stirring operation.

[0025] Optionally, the inner wall of the storage chamber forms a plurality of sliding parts spaced apart along the circumferential direction, and the feeding control part is provided with sliding grooves which are consistent in number with the sliding parts and are arranged one-to-one, and the first driving component can drive the feeding control component to rotate and stir the agitator through the sliding part which slides in cooperation with the sliding groove, and the first driving component can drive the feeding control component to slide in cooperation with the corresponding sliding part through the sliding groove and to rise and fall relative to the agitator.

[0026] Optionally, the swing mechanism comprises:

[0027] A first mounting seat, the first mounting seat is mounted at the mounting position, and a mounting position is formed on a side of the first mounting seat away from the mounting position;

[0028] a first driving member, the first driving member being installed at the installation position, and an output end of the first driving member horizontally extending out of the installation position in a direction away from the installation position;

[0029] A transmission member, one end of which is connected to the output end of the first driving member, and the other end of which forms a hinge hole;

[0030] A swing member, wherein the swing member is mounted on the outer periphery of the material preparation tank, one end of the swing member is rotatably matched with the transmission member through the hinge hole, and the other end of the swing member is formed with an arc-shaped sliding groove; and,

[0031] A guide member, wherein the guide member and the first driving member are spaced apart and distributed on the second mounting seat, and the guide member is slidably matched with the sliding groove.

[0032] Based on the same technical concept, in the fifth aspect, the present invention also proposes the use of the cyanide-free silver-palladium alloy stabilizer described in the first aspect in the preparation of silver-palladium alloy.

[0033] The technical solution of the present invention adds a stabilizer prepared by mixing 3-aminomethyl-tetrahydrofuran and 2-amino-5-chloro-N,3-dimethylbenzamide into the silver-palladium alloy electroplating solution, which can achieve the following advantages without changing the original coating performance:

[0034] 1. Inhibit the self-decomposition of the plating solution: During the electroplating process, some components in the plating solution may undergo self-decomposition reactions due to external factors (such as temperature, pH value changes, impurity introduction, etc.), resulting in the failure of the plating solution. Stabilizers can be adsorbed on the solid surface or mask the catalytic active centers, thereby inhibiting the occurrence of these self-decomposition reactions and extending the service life of the plating solution.

[0035] 2. Improve the quality of the coating: Stabilizers can stabilize the chemical reaction rate in the plating solution, making the coating grow more uniform and dense. This helps reduce defects in the coating (such as pinholes, pitting, etc.) and improve the appearance quality and performance of the coating.

[0036] 3. Enhance the bonding between the coating and the substrate: During the electroplating process, the stabilizer may promote the bonding between the coating and the substrate through some mechanism, making the coating more firmly attached to the substrate. This is of great significance for improving the overall performance and service life of electroplated products.

[0037] 4. Adjust the performance of the plating solution: The stabilizer can also adjust the viscosity, surface tension and other performance parameters of the plating solution according to specific needs to adapt to different electroplating processes and substrate materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0039] Figure 1 The flowchart of the preparation method of the cyanide-free silver-palladium alloy stabilizer of the present invention is exemplified;

[0040] Figure 2 The schematic diagram of the structure of the preparation device of the cyanide-free silver-plated palladium alloy stabilizer according to the present invention;

[0041] Figure 3 for Figure 2 A schematic diagram of the structure of the driving mechanism and the swing mechanism of the example;

[0042] Figure 4 for Figure 2 A structural diagram of the material preparation mechanism as exemplified in FIG.

[0043] Figure 5 for Figure 4 A schematic diagram of the internal structure of the material preparation mechanism shown in FIG.

[0044] Description of reference numerals:

[0045] Label name Label name 100 Driving mechanism 330 Feeding control components 200 Swing mechanism 340 First drive assembly 300 Material making mechanism 341 The third drive 110 Base 342 Second telescopic drive member 120 guide 343 Connecting plate 130 slider 344 Mounting Plate 140 Second driving member 331 Guide column 150 gear 332 spring 160 Second Mount 333 Connecting ring 170 First telescopic drive member 334 Slide 310 Material tank 335 Chute 320 Agitator 210 First Mount 220 First drive member 230 Transmission parts 240 Swinging parts 250 Guide 180 Spur rack 190 Through Hole

[0046] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0051] The inventive concept of the present invention is further described below in conjunction with some specific implementation methods.

[0052] The invention provides a cyanide-free silver-palladium alloy stabilizer, a preparation device, a preparation method and an application thereof.

[0053] like Figures 1 to 5 As shown, an embodiment of the cyanide-free silver-palladium alloy stabilizer, preparation device, preparation method and application of the present invention is proposed.

[0054] The invention discloses a cyanide-free silver-plated palladium alloy stabilizer, which is prepared by mixing 3-aminomethyl-tetrahydrofuran and 2-amino-5-chloro-N,3-dimethylbenzamide.

[0055] Specifically, in terms of mass concentration, the mass concentration of the 3-aminomethyl-tetrahydrofuran is 2 to 5 g / L, and the mass concentration of the 2-amino-5-chloro-N,3-dimethylbenzamide is 1 to 3 g / L.

[0056] In terms of mass ratio, the mass ratio of the 3-aminomethyl-tetrahydrofuran to 2-amino-5-chloro-N,3-dimethylbenzamide is (1.5-2):1.

[0057] Based on the same technical concept, in the second aspect, the present invention also proposes an electroplating solution, which comprises a water-soluble silver salt, a water-soluble palladium salt, the cyanide-free silver-plated palladium alloy stabilizer described in the first aspect and water; in terms of mass concentration, the concentration of the water-soluble silver salt is 1g / L-50g / L, the concentration of the water-soluble palladium salt is 1g / L-50g / L, the concentration of the 3-aminomethyl-tetrahydrofuran is 0.02~0.05g / L, and the concentration of the 2-amino-5-chloro-N,3-dimethylbenzamide is 0.01~0.03g / L.

[0058] The electroplating solution also includes water-soluble lithium salt, water-soluble ferrous salt, water-soluble sodium salt and EDTA; in terms of mass concentration, the concentration of the water-soluble lithium salt is 500g / L-700g / L, the concentration of the water-soluble ferrous salt is 0.1g / L-0.5g / L, the concentration of the water-soluble sodium salt is 2g / L-5g / L, and the concentration of the EDTA is 0.1g / L-1g / L.

[0059] The pH value of the electroplating solution is 8.9-9.3.

[0060] The composition is calculated by mass concentration and is composed of the following components:

[0061] The mass concentration of 3-aminomethyl-tetrahydrofuran is 2-5 g / L, and the mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 1-3 g / L.

[0062] Preferably, the composition is composed of the following components in terms of mass concentration: the mass concentration of 3-aminomethyl-tetrahydrofuran is 2 to 4 g / L, and the mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 1 to 2 g / L.

[0063] Preferably, the mass ratio of 3-aminomethyl-tetrahydrofuran to 2-amino-5-chloro-N,3-dimethylbenzamide is (1.5-2):1.

[0064] Based on the same technical concept, in the third aspect, the present invention also proposes a method for preparing a cyanide-free silver-plated palladium alloy stabilizer, which is used to prepare the cyanide-free silver-plated palladium alloy stabilizer described in the first aspect or to prepare the cyanide-free silver-plated palladium alloy stabilizer in the electroplating solution described in the second aspect, and the preparation method comprises the following steps:

[0065] S100, weighing a first target dose of 3-aminomethyl-tetrahydrofuran, dissolving it in a preset dose of deionized water, and stirring evenly to prepare a 3-aminomethyl-tetrahydrofuran solution;

[0066] The preset dose exemplified in this embodiment is preferably 500 ml.

[0067] S200, weighing a second target dose of 2-amino-5-chloro-N,3-dimethylbenzamide for later use;

[0068] S300, dissolving the 2-amino-5-chloro-N,3-dimethylbenzamide into the 3-aminomethyl-tetrahydrofuran solution and stirring evenly, and continuing to add the deionized water to a standard dosage to obtain the stabilizer.

[0069] In this embodiment, the exemplary standard dose is preferably 1L.

[0070] Embodiment 1:

[0071] The mass concentration ratio of each component of the cyanide-free silver-plated palladium alloy stabilizer described in this embodiment is as follows:

[0072] The mass concentration of 3-aminomethyl-tetrahydrofuran is 2 g / L;

[0073] The mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 1 g / L;

[0074] The stable preparation method of the silver-palladium alloy described in this embodiment is as follows:

[0075] Step 1, prepare 3-aminomethyl-tetrahydrofuran solution: weigh 2g 3-aminomethyl-tetrahydrofuran and add it into 500ml deionized water, stir until a uniform solution is obtained, and set aside;

[0076] Step 2, weighing 2-amino-5-chloro-N,3-dimethylbenzamide: using an analytical balance to weigh 1 g of 2-amino-5-chloro-N,3-dimethylbenzamide for later use;

[0077] Step 3, prepare a cyanide-free silver-plated palladium alloy stabilizer: use the 2-amino-5-chloro-N,3-dimethylbenzamide weighed in step 2 to add to the 3-aminomethyl-tetrahydrofuran solution prepared in step 1, stir well to mix completely, then dilute to 1L with deionized water, and continue stirring to mix evenly.

[0078] The prepared mixed solution was subjected to quality inspection. During the inspection, 10 ml of the stabilizer prepared in Example 1 was added to 1 L of silver-palladium alloy electroplating solution, and the workpiece was placed in the prepared electroplating solution for electroplating. After electroplating, the plated workpiece was taken out, the thickness and palladium content of the coating were measured, and the appearance of the coating was observed. The workpiece is generally a copper part.

[0079] The silver-palladium alloy electroplating solution used in this embodiment is:

[0080] Lithium chloride is 580g / L, palladium chloride is 1.31g / L, silver nitrate is 3.11g / L, ethylenediaminetetraacetic acid (EDTA) is 0.54g / L, ferrous sulfate is 0.32g / L, sodium bicarbonate is 2.56g / L, and sodium dodecyl sulfate is 0.84g / L.

[0081] The electroplating process conditions in this embodiment are:

[0082] The pH value of the plating solution is 9.0, the electroplating temperature is 60°C, the electroplating time is 30 min, the electroplating cathode current density is 0.3 A / dm2, the anode used for electroplating is made of titanium-plated platinum anode mesh, and the stirring method during electroplating is cathode movement (5 m / min).

[0083] The workpieces were electroplated under the same conditions using the same silver-palladium alloy electroplating solution without the above stabilizer, and the thickness and palladium content of the silver-palladium coating were measured using a Fischei tester, and the appearance of the coating was observed.

[0084] The test results are as follows: the thickness of the electroplated workpiece after adding the stabilizer is 5.32μm, the palladium content is 24.68%, the coating appearance is white, bright, smooth, delicate and uniform, the coating is glossy, and the color is uniform silver-white. The thicker the coating thickness, the better the corrosion resistance of the coating. The different palladium content in the silver-palladium alloy will result in different coating appearance colors. Therefore, the ratio of silver to palladium in the coating must be strictly controlled.

[0085] Without adding the above stabilizer, the coating thickness of the electroplated workpiece is 2.86 μm, the palladium content is 19.24%, the coating appearance is dull and uneven, without brightness, and the crystals are rough.

[0086] Embodiment 2:

[0087] The concentration ratios of the stabilizer components described in this embodiment are as follows:

[0088] The mass concentration of 3-aminomethyl-tetrahydrofuran is 3 g / L;

[0089] The mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 1.5 g / L.

[0090] The method for preparing the stabilizer described in this embodiment is the same as that in Example 1, except that the content of each component is calculated according to the above ratio.

[0091] The prepared mixed solution was subjected to a quality inspection. During the inspection, 10 ml of the stabilizer prepared in Example 2 was added to every 1 L of silver-palladium alloy electroplating solution, and the workpiece was placed in the prepared electroplating solution for electroplating. After electroplating, the plated workpiece was taken out, the thickness and palladium content of the coating were determined, and the appearance of the coating was observed.

[0092] The workpieces were electroplated under the same conditions using the silver-palladium alloy electroplating solution without the above stabilizer, and then tested.

[0093] The test results are as follows: the thickness of the electroplated workpiece after adding the stabilizer is 5.52μm, the palladium content is 32.12%, the coating is white, bright, smooth, delicate and uniform, the coating is shiny, and the color is uniform silver-white and bright. In the same electroplating time, the electroplating rate is accelerated, the coating thickness is increased, and the electroplating efficiency is improved.

[0094] Without adding the above stabilizer, the coating thickness of the electroplated workpiece is 1.09 μm, the palladium content is 15.85%, the coating has a rough appearance, is dull and has uneven color.

[0095] Embodiment 3:

[0096] The concentration ratios of the stabilizer components described in this embodiment are as follows:

[0097] The mass concentration of 3-aminomethyl-tetrahydrofuran is 4 g / L;

[0098] The mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 1.8 g / L.

[0099] The method for preparing the stabilizer described in this embodiment is the same as that in Example 1, except that the amounts of the components are calculated according to the above ratios.

[0100] The prepared mixed solution was subjected to a quality inspection. During the inspection, 10 ml of the stabilizer prepared in Example 3 was added to every 1 L of silver-palladium alloy electroplating solution, and the workpiece was placed in the prepared electroplating solution for electroplating. The electroplating conditions in this embodiment were the same as those in Example 1. After electroplating, the plated workpiece was taken out, the thickness and palladium content of the coating were measured, and the appearance of the coating was observed.

[0101] Similarly, the silver-palladium alloy electroplating solution without the above stabilizer was used to electroplate workpieces under the same conditions for parallel comparison and testing.

[0102] The test results obtained are: the coating thickness of the electroplated workpiece after adding the stabilizer is 5.62μm, the palladium content is 32.09%, the coating appearance is bright white, smooth, delicate and uniform, the coating is glossy, and has a uniform silver-white color.

[0103] Without adding the above stabilizer, the coating thickness of the electroplated workpiece is 2.31 μm, the palladium content is 17.94%, and the coating has a rough, dull appearance and uneven color.

[0104] Embodiment 4:

[0105] The concentration ratios of the stabilizer components described in this embodiment are as follows:

[0106] The mass concentration of 3-aminomethyl-tetrahydrofuran is 3.6 g / L;

[0107] The mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 1.5 g / L.

[0108] The method for preparing the stabilizer described in this embodiment is the same as that in Example 1, except that the amounts of the components are calculated according to the above ratios.

[0109] The prepared mixed solution was subjected to a quality inspection. During the inspection, 10 ml of the stabilizer prepared in Example 4 was added to every 1 L of silver-palladium alloy electroplating solution, and the workpiece was placed in the prepared electroplating solution for electroplating. The electroplating conditions in this embodiment were the same as those in Example 1. After electroplating, the plated workpiece was taken out, the thickness and palladium content of the coating were measured, and the appearance of the coating was observed.

[0110] The workpieces were electroplated under the same conditions using the silver-palladium alloy electroplating solution without the above stabilizer, and then tested.

[0111] The electroplating process conditions in this embodiment are:

[0112] The pH value of the plating solution is 9.2, the electroplating temperature is 60°C, the electroplating time is 30 min, the electroplating cathode current density is 0.4 A / dm2, the anode used for electroplating is a titanium-plated platinum anode mesh, and the stirring method during electroplating is cathode movement (5 m / min).

[0113] The test results obtained are: the coating thickness of the electroplated workpiece after adding the stabilizer is 5.94μm, the palladium content is 32.65%, the coating appearance is bright white, smooth, delicate and uniform, the coating is glossy, and has a uniform silver-white color.

[0114] Without adding the above stabilizer, the coating thickness of the electroplated workpiece is 2.15 μm, the palladium content is 21.32%, and the coating has a rough appearance, dullness, and uneven color.

[0115] Embodiment 5:

[0116] The concentration ratios of the stabilizer components described in this embodiment are as follows:

[0117] The mass concentration of 3-aminomethyl-tetrahydrofuran is 4.8g / L

[0118] The mass concentration of 2-amino-5-chloro-N,3-dimethylbenzamide is 2g / L

[0119] The method for preparing the stabilizer described in this embodiment is the same as that in Example 1, except that the amounts of the components are calculated according to the above ratios.

[0120] The prepared mixed solution was subjected to a quality inspection. During the inspection, 10 ml of the stabilizer prepared in Example 5 was added to every 1 L of silver-palladium alloy electroplating solution, and the workpiece was placed in the prepared electroplating solution for electroplating. The electroplating conditions in this embodiment were the same as those in Example 1. After electroplating, the plated workpiece was taken out, the thickness and palladium content of the coating were measured, and the appearance of the coating was observed.

[0121] The workpieces were electroplated under the same conditions using the silver-palladium alloy electroplating solution without the above stabilizer, and then tested.

[0122] The electroplating process conditions in this embodiment are:

[0123] The pH value of the plating solution is 9.3, the electroplating temperature is 55°C, the electroplating time is 30 min, the electroplating cathode current density is 0.3 A / dm2, the anode used for electroplating is a titanium-plated platinum anode mesh, and the stirring method during electroplating is cathode movement (5 m / min).

[0124] After adding the stabilizer, the coating thickness of the electroplated workpiece is 5.84μm, the palladium content is 32.98%, the coating appearance is bright white, smooth, delicate and uniform, the coating is glossy, and has a uniform silver-white color.

[0125] Without adding the above stabilizer, the coating thickness of the electroplated workpiece is 2.11 μm, the palladium content is 23.32%, and the coating appearance is rough, dull and uneven in color.

[0126] In this embodiment, by adding a stabilizer prepared by mixing 3-aminomethyl-tetrahydrofuran and 2-amino-5-chloro-N,3-dimethylbenzamide into the silver-palladium alloy electroplating solution, the following advantages can be achieved without changing the original coating properties:

[0127] 1. Inhibit the self-decomposition of the plating solution: During the electroplating process, some components in the plating solution may undergo self-decomposition reactions due to external factors (such as temperature, pH value changes, impurity introduction, etc.), resulting in the failure of the plating solution. Stabilizers can be adsorbed on the solid surface or mask the catalytic active centers, thereby inhibiting the occurrence of these self-decomposition reactions and extending the service life of the plating solution.

[0128] 2. Improve the quality of the coating: Stabilizers can stabilize the chemical reaction rate in the plating solution, making the coating grow more uniform and dense. This helps reduce defects in the coating (such as pinholes, pitting, etc.) and improve the appearance quality and performance of the coating.

[0129] 3. Enhance the bonding between the coating and the substrate: During the electroplating process, the stabilizer may promote the bonding between the coating and the substrate through some mechanism, making the coating more firmly attached to the substrate. This is of great significance for improving the overall performance and service life of electroplated products.

[0130] 4. Adjust the performance of the plating solution: The stabilizer can also adjust the viscosity, surface tension and other performance parameters of the plating solution according to specific needs to adapt to different electroplating processes and substrate materials.

[0131] Based on the same technical concept, in a fourth aspect, the present invention further proposes a preparation device for a cyanide-free silver-plated palladium alloy stabilizer, which is used to perform the preparation method of the third aspect, and the preparation device comprises:

[0132] A driving mechanism 100, wherein a mounting position is formed on the driving mechanism 100;

[0133] A swing mechanism 200, the swing mechanism 200 is installed at the installation position, and the driving mechanism 100 can move the swing mechanism 200 to adjust the spatial position of the swing mechanism 200; and,

[0134] The material preparation mechanism 300 is installed on the swing mechanism 200. The swing mechanism 200 can drive the material preparation mechanism 300 to swing to prepare the stabilizer.

[0135] In this embodiment, by providing a driving mechanism 100, a swinging mechanism 200 and a material preparation mechanism 300, when in use, the driving mechanism 100 is used to drive the swinging mechanism 200 to drive the material preparation mechanism 300 to move, so as to achieve the function of adjusting the position of the material preparation mechanism 300. More specifically, after the driving mechanism 100 is used to adjust the positions of the swinging mechanism 200 and the material preparation mechanism 300, the swinging mechanism 200 is continued to be used to drive the material preparation mechanism 300 to shake, thereby enabling the present invention to shake the stabilizer solution to be prepared in the material preparation mechanism 300, realizing the function of automatic shaking and improving the preparation efficiency.

[0136] It should be particularly and clearly stated that, in this embodiment, the exemplary driving mechanism 100 includes a base 110, a guide rail 120, a slider 130, a second driving member 140341, a gear 150, a second mounting seat 160, and a first telescopic driving member 170. The exemplary guide rail 120 is vertically arranged on the base 110, and a vertically arranged spur rack 180 is arranged on one side of the guide rail 120. When the slider 130 is vertically slidably installed on the guide rail 120, and a through hole 190 is arranged on the side of the slider 130 facing the slide rail, the second driving member 140341 ​​is installed on the slider 130. The output end of the second driving member 140341 ​​is arranged toward the through hole, the gear 150 is installed at the output end of the second driving member 140341, and the gear 150 can rotatably pass through the through hole and mesh with the spur rack, the second mounting seat 160 is installed on the side of the slider 130 away from the guide rail 120, and the second mounting seat 160 is covered on the outer periphery of the second driving member 140341, the first telescopic driving member 170 is installed on the second mounting seat 160, and the first telescopic driving member 170 extends in the horizontal direction away from the guide rail 120, and the installation position is formed at the output end of the first telescopic driving member 170.

[0137] It should be particularly and clearly stated that the first driving member 220 exemplified in the present embodiment is preferably a motor, and the first telescopic driving member 170 exemplified is preferably a hydraulic cylinder.

[0138] In some specific embodiments, the material making mechanism 300 includes:

[0139] A material preparation tank 310, which is installed on the swing mechanism 200, and a discharge port is formed at the bottom of the material preparation tank 310 to connect the inner cavity of the material preparation tank 310 with the external environment, and a connection port is formed at the top of the material preparation tank 310;

[0140] Agitator 320, the agitator 320 is arranged in the material preparation tank 310, and at least part of the agitator 320 extends upward to form a connection port, the agitator 320 forms a material storage cavity that is vertically penetrated, the top of the agitator 320 is rotatably matched with the material preparation tank 310, the top of the material storage cavity is formed with a material feed port, and the bottom of the material storage cavity is formed with a material discharge port;

[0141] A feeding control assembly 330, which can be movably disposed in the material storage chamber, can slide vertically relative to the material storage chamber and can drive the agitator 320 to rotate and stir, and at least a portion of the feeding control assembly 330 extends downward from the bottom of the agitator 320 to open or close the discharge port, and the top of the feeding control assembly 330 extends from the feed port and is located outside the material preparation tank 310; and,

[0142] The first drive component 340 is installed above the connection port, and the first drive component 340 can be lowered to connect with the feeding control component 330 to drive the feeding control component 330 to drive the agitator 320 to perform a stirring operation; the first drive component 340 can also continue to descend and drive the feeding control component to descend and open the discharge port, and when the feeding control component 330 opens the discharge port, the first drive component 340 can drive the feeding control component 330 to drive the agitator 320 to perform a stirring operation.

[0143] In this embodiment, by setting a material preparation tank 310, an agitator 320, a feeding control assembly 330 and a first driving assembly 340, when in use, the first driving assembly 340 is used to descend to connect with the feeding control assembly 330, and the feeding control assembly 330 is driven to drive the agitator 320 to perform a stirring operation, so that the present invention can automatically stir the material preparation tank 310 when in use. At the same time, since the first driving assembly 340 can continue to descend, the feeding control assembly 330 can descend along the material storage cavity in the agitator 320, so that the feeding control assembly 330 can open the material outlet, and at the same time, in the process of opening the material outlet, the first driving assembly 340 can synchronously drive the agitator 320 to perform a rotation stirring operation, so that the present invention has the function of controlling the opening and closing of the material outlet and stirring.

[0144] It should be particularly and clearly stated that, in the present embodiment, the exemplary first driving component 340 includes a second driving member 140341, a second telescopic driving member 342, a connecting plate 343 and a mounting plate 344. The second telescopic driving member 342 is installed in the opening, the connecting plate 343 is sleeved on the outer periphery of the second telescopic driving member 342, the mounting plate 344 is installed on the output end of the second telescopic driving member 342, and the mounting plate 344 and the connecting plate 343 are spaced apart. The mounting plate 344 is formed with a hole for the position of the opening, and the second telescopic driving member 342 can drive the connecting plate 343 to rise and fall. The second driving member 140341 ​​is installed on the connecting plate 343, so that the output end of the second driving member 140341 ​​passes through the hole and can be connected to the top of the feeding control component 330.

[0145] The example feeding control assembly 330 includes a guide column 331 and a spring 332. A connecting ring 333 is provided near the top of the guide column 331. The bottom of the spring 332 is connected to the connecting ring 333, and the top is connected to the mounting plate 344. A truncated cone-shaped protrusion is formed at the bottom of the guide column 331. When in use, the second driving member 140341 ​​drives the guide column 331 to descend, and enables the guide column 331 to drive the spring 332 to stretch through the connecting ring 333, so that the spring 332 is in an energy storage state. At the same time, the truncated cone-shaped protrusion at the bottom moves downward and can open the discharge port, so that the present invention can realize the function of opening and closing the discharge port through the truncated cone-shaped protrusion. The compactness of the overall structure is ensured.

[0146] It should be particularly and clearly stated that, in this embodiment, the second driving member 140341 ​​is a motor, and the second telescopic driving member 342 is a hydraulic cylinder or a gas cylinder.

[0147] It can be further explained that the inner wall of the storage chamber forms a plurality of sliding members 334 distributed at intervals along the circumferential direction, and the feeding control member is provided with slide grooves 335 which are the same in number and one-to-one corresponding to the sliding members 334. The first drive component 340 can drive the feeding control component 330 to drive the agitator 320 to rotate and stir through the sliding member 334 that slides with the slide groove 335, and the first drive component 340 can drive the feeding control component 330 to slide with the corresponding sliding member 334 through the slide groove 335 and rise and fall relative to the agitator 320.

[0148] In this embodiment, the slide groove 335 and the sliding member 334 enable the present invention to ensure the stability of the overall structure.

[0149] In some specific embodiments, the rocking mechanism 200 includes:

[0150] A first mounting seat 210, the first mounting seat 210 is installed at the mounting position, and a mounting position is formed on one side of the first mounting seat 210 away from the mounting position;

[0151] A first driving member 220, the first driving member 220 is installed at the installation position, and an output end of the first driving member 220 horizontally extends to the outside of the installation position in a direction away from the installation position;

[0152] A transmission member 230, one end of which is connected to the output end of the first driving member 220, and the other end of which forms a hinge hole;

[0153] A swing member 240, which is mounted on the outer periphery of the material preparation tank 310, one end of which is rotatably matched with the transmission member 230 through a hinge hole, and the other end of which is formed with an arc-shaped sliding groove; and,

[0154] The guide member 250 is spaced apart from the first driving member 220 and distributed on the second mounting seat 160 , and the guide member 250 is slidably matched with the sliding groove.

[0155] In this embodiment, by providing the first mounting seat 210, the second driving member 140341, the transmission member 230, the swing member and the guide member 250, when in use, the first driving member 220 drives the transmission member 230 to drive the swing member 240 to swing, so that the material preparation tank 310 connected to the swing member 240 swings, and the function of commanding the stabilizer solution is realized, ensuring the automation effect of the overall structure.

[0156] It should be particularly and clearly stated that the first driving member 220 illustrated in this embodiment is a motor.

[0157] Based on the same technical concept, in the fifth aspect, the present invention also proposes the use of the cyanide-free silver-palladium alloy stabilizer described in the first aspect in the preparation of silver-palladium alloy.

[0158] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A cyanide-free silver-plated palladium alloy stabilizer, characterized in that: The stabilizer is prepared by mixing 3-aminomethyl-tetrahydrofuran and 2-amino-5-chloro-N,3-dimethylbenzamide.

2. The cyanide-free silver-plated palladium alloy stabilizer according to claim 1, characterized in that In terms of mass concentration, the mass concentration of the 3-aminomethyl-tetrahydrofuran is 2-5 g / L, and the mass concentration of the 2-amino-5-chloro-N,3-dimethylbenzamide is 1-3 g / L.

3. The cyanide-free silver-plated palladium alloy stabilizer according to claim 2, characterized in that In terms of mass ratio, the mass ratio of the 3-aminomethyl-tetrahydrofuran and the 2-amino-5-chloro-N,3-dimethylbenzamide is (1.5-2):

1.

4. An electroplating solution, characterized in that The electroplating solution comprises a water-soluble silver salt, a water-soluble palladium salt, a cyanide-free silver-palladium alloy stabilizer as described in any one of claims 1 to 3, and water; in terms of mass concentration, the concentration of the water-soluble silver salt is 1g / L-50g / L, the concentration of the water-soluble palladium salt is 1g / L-50g / L, the concentration of the 3-aminomethyl-tetrahydrofuran is 0.02-0.05g / L, and the concentration of the 2-amino-5-chloro-N,3-dimethylbenzamide is 0.01-0.03g / L.

5. The electroplating solution according to claim 4, characterized in that The electroplating solution further comprises a water-soluble lithium salt, a water-soluble ferrous salt, a water-soluble sodium salt and EDTA; in terms of mass concentration, the concentration of the water-soluble lithium salt is 500 g / L-700 g / L, the concentration of the water-soluble ferrous salt is 0.1 g / L-0.5 g / L, the concentration of the water-soluble sodium salt is 2 g / L-5 g / L, and the concentration of the EDTA is 0.1 g / L-1 g / L; and / or, The pH value of the electroplating solution is 8.9-9.

3.

6. A method for preparing a cyanide-free silver-palladium alloy stabilizer, characterized in that: For preparing the cyanide-free silver-plated palladium alloy stabilizer as described in any one of claims 1 to 3 or for preparing the cyanide-free silver-plated palladium alloy stabilizer in the electroplating solution as described in claim 4 or 5, the preparation method comprises the following steps: Weigh a first target dose of 3-aminomethyl-tetrahydrofuran, dissolve it in a preset dose of deionized water, and stir evenly to prepare a 3-aminomethyl-tetrahydrofuran solution; Weigh a second target dose of 2-amino-5-chloro-N,3-dimethylbenzamide for later use; The 2-amino-5-chloro-N,3-dimethylbenzamide is dissolved in the 3-aminomethyl-tetrahydrofuran solution and stirred evenly, and the deionized water is continuously added to a standard dosage to obtain the stabilizer.

7. A preparation device for a cyanide-free silver-plated palladium alloy stabilizer, characterized in that: For executing the preparation method according to claim 6, the preparation device comprises: a drive mechanism having a mounting position formed thereon; A swing mechanism, wherein the swing mechanism is installed at the installation position, and the driving mechanism can move the swing mechanism to adjust the spatial position of the swing mechanism; and A material making mechanism is installed on the swing mechanism, and the swing mechanism can drive the material making mechanism to swing to prepare the stabilizer.

8. The preparation device of the cyanide-free silver-plated palladium alloy stabilizer according to claim 7, characterized in that, The material making mechanism comprises: A material preparation tank, the material preparation tank is installed on the swing mechanism, the bottom of the material preparation tank is formed with a discharge port that can connect the inner cavity of the material preparation tank with the external environment, and the top of the material preparation tank is formed with a connection port; A stirrer, the stirrer is arranged in the material preparation tank, and at least a part of the stirrer extends upward from the connection port, the stirrer is formed with a material storage cavity arranged vertically through, the top of the stirrer is rotatably matched with the material preparation tank, the top of the material storage cavity is formed with a material feed port, and the bottom of the material storage cavity is formed with a material discharge port; A feeding control assembly, wherein the feeding control assembly can be movably disposed in the material storage cavity, the feeding control assembly can slide vertically relative to the material storage cavity and can drive the agitator to rotate and stir, and at least a portion of the feeding control assembly extends downward from the bottom of the agitator to open or close the discharge port, and the top of the feeding control assembly extends from the feed port and is located outside the material preparation tank; and The first drive component is installed above the connecting port, and the first drive component can be lowered to connect with the feeding control component to drive the feeding control component to drive the agitator to perform a stirring operation; the first drive component can also continue to descend and drive the feeding control component to descend and open the discharge port, and when the feeding control component opens the discharge port, the first drive component can drive the feeding control component to drive the agitator to perform a stirring operation.

9. The preparation device of the cyanide-free silver-plated palladium alloy stabilizer according to claim 7, characterized in that, The swing mechanism comprises: A first mounting seat, the first mounting seat is mounted at the mounting position, and a mounting position is formed on a side of the first mounting seat away from the mounting position; a first driving member, the first driving member being installed at the installation position, and an output end of the first driving member horizontally extending out of the installation position in a direction away from the installation position; A transmission member, one end of which is connected to the output end of the first driving member, and the other end of which forms a hinge hole; A swing member, wherein the swing member is mounted on the outer periphery of the material preparation tank, one end of the swing member is rotatably matched with the transmission member through the hinge hole, and the other end of the swing member is formed with an arc-shaped sliding groove; and, A guide member, wherein the guide member and the first driving member are spaced apart and distributed on the second mounting seat, and the guide member is slidably matched with the sliding groove.

10. Use of the cyanide-free silver-palladium alloy stabilizer according to any one of claims 1 to 3 in the preparation of silver-palladium alloy.

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