Method for preparing micro-nano-scale platinum resistance type temperature sensor

Abstract

The invention discloses a method for preparing a micro-nano-scale platinum resistance type temperature sensor, and the method comprises the steps: 1, enabling a substrate to apply a pulse voltage signal to a platinum electrode in a probe through a fuzzy PID control algorithm based on an MCED technology, enabling the substrate to be connected with a power supply through a wire, and enabling the temperature of the platinum electrode to be measured under the action of the pulse voltage; performing platinum metal deposition on a contact area of the substrate and the probe tip; 2, based on the preset shape of the platinum resistor, programming a control program through a G code, planning a probe moving path, controlling the probe to move, and depositing the platinum resistor with the needed shape and size on the substrate; and 3, wiring the deposited platinum resistor to complete the preparation of the platinum resistor type temperature sensor. According to the method for preparing the micro-nano-scale platinum resistance type temperature sensor, on the basis of an MCED method, the platinum metal thermal resistance temperature sensor is prepared through fuzzy PID control and G codes, and mass production can be achieved while the cost is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the field of temperature detection, and more specifically, to a method for preparing a micro-nano scale platinum resistance temperature sensor. Background Art

[0002] Thermistor temperature sensor is a device that measures temperature based on the property that the resistance of a conductor changes with temperature. Thermistor temperature sensors are widely used in many fields due to their high precision, high stability and good linearity. In the field of industrial automation, thermistor temperature sensors are used to measure the temperature of mechanical equipment; in the field of aerospace, thermistor temperature sensors are used to monitor the temperature of aircraft, rockets and other aircraft to ensure their normal operation in extreme temperature environments; in the field of environmental monitoring, thermistor temperature sensors can be used to measure the temperature of the atmosphere, water bodies and soil, and provide data support for environmental protection and climate change research; in addition, thermistor temperature sensors are also widely used in chemical industry, medical and other fields. Although the current temperature sensor has the advantages of high precision and high stability, it still has certain limitations. In the electronics and semiconductor industry, due to the relatively slow response speed of thermistor temperature sensors, it is impossible to monitor the temperature on the production line in real time, and it is impossible to ensure the stability of the production environment, which affects product quality and production efficiency; in the fields of medical equipment, precision machinery manufacturing, etc., due to the measurement error of thermistor temperature sensors, medical drugs cannot be used normally and precision machinery cannot operate normally.

[0003] Temperature sensors play a vital role in the applications of modern society. From automated process control in industrial production, to intelligent regulation of home appliances, to precise monitoring in the automotive industry, temperature sensors play an indispensable role. Therefore, it is very necessary to prepare a low-cost, widely available platinum metal thermistor temperature sensor.

[0004] In the field of micro-nano manufacturing, the commonly used processing methods for thermal resistor temperature sensors include electron beam lithography and focused ion imprinting technology, but these technologies are relatively cumbersome, especially when making micro-nanoscale products, they involve multi-layer deposition and lithography steps. In addition, the processing cost of preparing temperature sensors by the above methods is high and cannot be achieved in large quantities.

[0005] Since meniscus confined electrochemical deposition (MCED) was proposed by Hu et al. in 2010, the technology has developed rapidly. At present, the MCED method based on glass probe has good geometric freedom and stable deposition rate for depositing metal copper. And studies have shown that Pt metal can be prepared from chloroplatinic acid by electrochemical deposition, so the preparation of Pt metal by MCED method has certain research feasibility. Platinum metal is widely used in temperature sensors, electrode contacts, catalysts and other fields. Summary of the invention

[0006] An object of the present invention is to solve at least the above problems and / or disadvantages and to provide at least the advantages which will be described hereinafter.

[0007] In order to achieve these purposes and other advantages of the present invention, a method for preparing a micro-nano scale platinum resistance temperature sensor is provided, the method comprising:

[0008] Step 1: Based on the MCED technology, the substrate applies a pulse voltage signal to the platinum electrode in the probe through a fuzzy PID control algorithm. The substrate is connected to the power supply through a wire. Under the action of the pulse voltage, platinum metal is deposited in the contact area between the substrate and the probe tip;

[0009] Step 2: Based on the predetermined shape of the platinum resistor, a control program is written through G code to plan the probe movement path, control the probe movement, and deposit a platinum resistor of the desired shape and size on the substrate;

[0010] Step 3: Connect the deposited platinum resistor to complete the preparation of the platinum resistance temperature sensor.

[0011] Preferably, a platinum metal deposition simulation analysis model is established based on the meniscus-limited electrochemical deposition principle, a pulse voltage signal is simulated, an electrochemical reaction is performed, and optimal deposition parameters for depositing platinum metal are obtained;

[0012] The optimal deposition parameters include in step 1: the pulse voltage applied to the platinum electrode, the concentration of the electrolyte solution in the probe and the opening diameter of the probe tip.

[0013] Preferably, the pulse voltage is a pulse square wave signal, and its main parameters are high level 1.5V, low level -1.5V, frequency 1Hz, period 1s, and duty cycle 50%;

[0014] The electrolyte solution is a chloroplatinic acid solution with a chloroplatinic acid concentration of 50 mM.

[0015] Preferably, the platinum metal deposition simulation analysis model includes: chloroplatinic acid electrolyte, gold substrate, platinum metal wire and probe area;

[0016] The platinum metal deposition simulation analysis model is a two-dimensional plane model. The anode is a linear area, the cathode substrate is a rectangular area, and the probe area is filled with electrolyte solution.

[0017] Preferably, in step 1, the adjusted k′ ​​is used in the fuzzy PID control method. p , k′ i , k′ d Parameters are input into the PID controller to control the pulse voltage signal in real time;

[0018] where k′p =k″ p +Δk p , k′ i =k″ i +Δk i , k′ d =k″ d +Δk d , the Δk p , Δk i and Δk d The outputs of the fuzzy controller are the proportional coefficients k p , integration coefficient k i and the differential coefficient k d The increment of k″ p , k″ i and k″ d They are the input parameters of the PID controller last time.

[0019] Preferably, the fuzzy PID control method comprises:

[0020] S1. Input fuzzification: The collected ion current is converted into a voltage signal through A / D and sent to the fuzzy controller, which is compared with the target value to obtain the deviation E and the deviation change EC. Then E and EC are fuzzified to establish fuzzy subsets;

[0021] S2. Determine the membership function: According to the growth shape and size of the deposits during the platinum metal deposition process, as well as the sensitivity requirements for control, select the triangular membership function, and determine the membership of E and EC on the fuzzy subset through the triangular membership function;

[0022] S3. Establish fuzzy control rules: The established fuzzy rule table is used to adjust the proportional coefficient, integral coefficient and differential coefficient. According to the established fuzzy inference rules, the output parameter formula of the fuzzy controller is obtained as follows:

[0023]

[0024] in, k p The minimum value of k p The maximum value of k i The minimum value of k i The maximum value of k d The minimum value of k d The maximum value of

[0025] S4, defuzzification: Defuzzification is performed using the centroid method;

[0026] S5. According to the membership degree, the output parameters of the fuzzy controller are clarified to obtain k′ p , k′ i and k′ d , sent to the PID controller, and the calculated high-level voltage of the pulse voltage is output. By continuously adjusting the high-level voltage of the pulse voltage, the ion current can be kept stable at any time.

[0027] The present invention includes at least the following beneficial effects: based on the MCED method, by introducing a pulse voltage signal, the occurrence of an electrochemical reaction is ensured, and the platinum ions have sufficient time to be replenished to the cathode substrate, thereby achieving platinum metal deposition; by planning and controlling the pulse voltage signal applied by the microprobe and the microprobe trajectory through fuzzy PID control and G code, the problem of current fluctuation during the platinum metal deposition process is effectively solved, constant current control is achieved, and a thermistor temperature sensor for platinum metal is prepared, which can also achieve mass production while greatly reducing costs.

[0028] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of the electrochemical deposition experimental platform device involved in the present invention;

[0030] Figure 2 It is a block diagram of the fuzzy PID control structure involved in the present invention;

[0031] Figure 3 It is a schematic diagram of the preparation process of the temperature sensing structure in the present invention;

[0032] Figure 4 This is a schematic diagram of an external calibration test circuit for a platinum-based resistance temperature sensor prepared in the present invention;

[0033] Figure 5 To realize the preparation flow chart of the present invention;

[0034] Figure 6 To implement the G code flow chart of the present invention.

[0035] Markings in the figure: 1. Micro motor, 2. Piezoelectric ceramic, 3. X-axis coarse adjustment motor, 4. Y-axis coarse adjustment motor, 5. Z-axis coarse adjustment motor, 6. Probe fixture, 7. Optical camera, 8. Camera X-axis lead screw slide, 9. Camera Y-axis lead screw slide, 10. Camera Z-axis lead screw slide, 11. Ideal power supply, 12. Voltmeter. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings so that those skilled in the art can implement the invention with reference to the description.

[0037] Example

[0038] The preparation process of the present invention is as follows Figure 5 As shown, a tape mask is used in the middle area of ​​the non-conductive glass surface, and then gold is sprayed to prepare a special substrate; a platinum metal-based thermistor temperature sensor microstructure is deposited and grown on the special substrate using a meniscus-confined electrochemical deposition (MCED) method, and the deposited platinum metal resistor is wired to complete the preparation of the platinum metal thermistor temperature sensor.

[0039] The technical scheme is: first establish a platinum metal deposition simulation analysis model, analyze the key parameters that affect the quality and stability of platinum metal deposition, study the deposition effect of platinum metal under different deposition parameters, so as to obtain the optimal parameters for depositing platinum metal, and realize platinum metal deposition growth (using the method of limiting electrochemical deposition with a meniscus to realize platinum metal deposition). Secondly, for chloroplatinic acid in the solution as hydrogen ions and chloroplatinate ions, the effect of electromigration is not conducive to the platinum ions obtaining electrons at the cathode, thereby realizing platinum metal deposition. Therefore, this patent introduces a pulse voltage signal, which not only ensures the occurrence of electrochemical reactions, but also ensures that the platinum ions have sufficient time to replenish the cathode substrate (when the pulse voltage signal is negative, the substrate previously used as the cathode becomes the anode, and under the action of the negative pulse, the platinum ions are replenished to the substrate by the effect of electromigration). The present invention introduces a fuzzy PID control method, formulates a fuzzy control table that matches the existing electrochemical deposition system, and adjusts the duty cycle of the applied pulse voltage, so as to maintain the stability of the deposition current during the deposition process, and can accelerate the platinum metal deposition efficiency. Then, by introducing the G code, the path of the deposition structure is planned to realize the automation of the growth sensor structure. Finally, the fuzzy control algorithm and G code are combined to achieve the stable preparation of the resistive temperature sensor structure based on platinum metal.

[0040] Combining MCED technology to prepare comb-shaped thermistor temperature sensors based on platinum metal has unique advantages, which can significantly reduce costs and achieve mass production.

[0041] The simulation model is mainly composed of chloroplatinic acid (H2PtCl6) electrolyte, gold substrate (cathode), metal anode (platinum wire) and insulating glass probe area. In order to better express the electrochemical process, this model simplifies the complex three-dimensional model and converts it into a simpler two-dimensional plane model. The anode is simplified to a line area, the cathode substrate is simplified to a rectangular area, and the glass probe area is filled with electrolyte solution.

[0042] The MCED deposition experimental platform device is as shown in the attached Figure 1As shown, it is mainly composed of XYZ three-axis screw, micro-motor 1, piezoelectric ceramic 2, optical camera 7, etc. The XYZ three-axis screw is driven by X-axis coarse adjustment motor 3, Y-axis coarse adjustment motor 4 and Z-axis coarse adjustment motor 5 respectively; the left part of the device is the three-axis screw for moving the optical camera, including: camera X-axis screw slide 8, camera Y-axis screw slide 9 and camera Z-axis screw slide 10, which are placed vertically in pairs to control the displacement in the XYZ direction respectively. The coarse adjustment motor and micro-motor 1 are placed on the screw platform, and the piezoelectric ceramic 2 is located at the bottom of the deposition plane. The right part is the optical camera device structure, which mainly includes an optical camera and three manual screw slides to adjust the movement of the camera in the XYZ direction. The glass probe is clamped on the probe fixture 6 above the left piezoelectric ceramic by an M6 screw. The probe fixture 6 has a through hole with a diameter of 1.5 mm for placing the probe. The conductive substrate is fixed on the piezoelectric ceramic by a special probe fixture 6. The optical camera 7 is focused on the tip of the glass probe to observe the deposition process. The glass probe is filled with electrolyte, and two wires are drawn from the power supply. One wire is connected to the platinum wire and inserted into the glass probe, and the other wire is connected to the conductive substrate. During the entire experimental process, the corresponding host computer software controls the movement of the three motors on the left, thereby driving the movement of the glass probe to achieve the preparation of the corresponding structure.

[0043] The electro-deposited platinum-based resistive temperature sensor structure is prepared from a chloroplatinic acid solution by the MCED method, and a glass microprobe with a 1 μm aperture is made by using an existing probe puller, and a certain deposition voltage is applied to deposit a platinum-based resistive temperature sensor structure. During the experiment, a 50mM chloroplatinic acid (H2PtCl6) (pH=1) solution is used to insert a metal anode (platinum wire) into a glass probe. According to the electrochemical characteristics of the chloroplatinic acid solution, a pulse voltage is applied, and the trajectory is planned in combination with the G code, and then a corresponding comb-like structure is formed as the probe is pulled. The pulse voltage mentioned above is specifically a pulse square wave signal, and the main parameters of the signal are a high level of 1.5V, a low level of -1.5V, a frequency of 1Hz, a period of 1s, and a duty cycle of 50%.

[0044] The control method of the constant electrochemical deposition current is a closed-loop control algorithm of the constant current based on fuzzy PID control, as shown in the attached Figure 2 As shown. Fuzzy PID is a control method that combines fuzzy logic with PID controller. Through fuzzy processing, fuzzy PID can more flexibly adapt to the nonlinear characteristics and external interference of the system, and improve the robustness and adaptability of the controller. Therefore, by introducing the fuzzy PID feedback control method, the high-level voltage value of the pulse voltage signal applied during the deposition process is adjusted, thereby effectively solving the problem of current fluctuation during platinum metal deposition and realizing constant current control.

[0045] In order to further improve the response or execution speed, an improved fuzzy controller is used. The fuzzy controller originally controls k p , k i and k d These three parameters, and now control k p , k i and k d The increment is Δk p , Δk i and Δk d The changes in these three increments are relatively small, and the amount of calculation required is relatively large. p , k i and k d There is a retainer after the fuzzy controller, which retains the last k p , k i and k d The value of k″ p , k″ i and k″ d , and then add the output value Δk of the fuzzy controller p , Δk i and Δk d , and then act on the controlled object. The initial value of the retainer can be set based on experience. Among them, the membership functions of each fuzzy state include triangular membership function, trapezoidal membership function, normal membership function, Gaussian membership function, etc. The result of fuzzy reasoning, that is, the output variable of the fuzzy controller, is generally a fuzzy set and cannot be used directly to control the controlled object. It needs to be converted into an accurate quantity that the actuator can execute for defuzzification. After processing, three self-tuning parameters k can be obtained p , k i and k d The value of .

[0046] The entire electrochemical deposition control process mainly includes the following steps:

[0047] (1) Input fuzzification: The collected ion current is converted into a voltage signal through A / D and sent to the fuzzy controller, which is compared with the target value to obtain the deviation E and the deviation change EC. Then E and EC are fuzzified and fuzzy subsets are established. This paper divides the interval into eight parts, and the seven internal linguistic variables are NB, NM, NS, ZO, PS, PM, PB

[0048] (2) Determine the membership function: According to the fact that the growth of deposits during the platinum metal deposition process takes about 3-5 minutes, the control sensitivity requirement is not very high. In addition, because the shape of the triangular membership function is only related to its linear slope, the calculation is relatively simple and the memory space occupied is also small, so it is more suitable for fuzzy control with online adjustment of membership functions. Therefore, the triangular membership function is selected, and the membership of E and EC on the fuzzy subset is determined by the triangular membership function.

[0049] (3) Establish fuzzy control rules: The established fuzzy rule table is used for k p , k i and k d Make adjustments.

[0050] k p , k i and k d The fuzzy rule tables are Table 1, Table 2 and Table 3 respectively.

[0051] Table 1

[0052] ΔKp NB NM NS ZO PS PM PB NB PB PB PM PM PS ZO ZO NM PB PB PM PS PS ZO NS NS PM PM PM PS ZO NS NS ZO PM PM PS ZO NS NM NM PS PS PS ZO NS NS NM NM PM PS ZO NS NM NM NM NB PB ZO ZO NM NM NM NB NB

[0053] Table 2

[0054]

[0055]

[0056] Table 3

[0057] ΔKd NB NM NS ZO PS PM PB NB PS NS NB NB NB ZO PS NM PS NS NB NM NM ZO ZO NS ZO NS NM NM NS PS ZO ZO ZO NS NS NS NS PM ZO PS ZO ZO ZO ZO ZO PM ZO PM PB NS PS PS PS PB PB PB PB PM PM PM PS PB PB

[0058] In the control system, k p The value of k is determined by the response speed of the system. In the initial stage of adjustment, a larger k should be selected. p value to improve the response speed. In the middle of the adjustment, k p Then take a smaller value to make the system have a smaller overshoot and ensure a certain response speed; and in the later stage of the adjustment process, k p Adjust the value to a larger value to reduce the static error and improve the control accuracy. i Control is mainly used to eliminate the steady-state deviation of the system. In the early stage of the regulation process, in order to prevent integral saturation, the integral effect is small; in the middle stage of the regulation, in order to avoid affecting stability, the integral effect is moderate; finally, in the late stage of the process, the integral effect is enhanced to reduce the static error of the regulation. d The adjustment is mainly introduced for large inertia processes. In the early stage of adjustment, the differential effect should be increased, so that a smaller or even no overshoot can be obtained; in the middle stage, due to the adjustment characteristics of k d The value of k is very sensitive, so k d The value should be appropriately smaller and should remain fixed; then in the later stage of adjustment, kd The value should be reduced to reduce the braking effect of the controlled process and compensate for the initial adjustment process due to k d The time of the adjustment process is prolonged due to the large value. Based on the above description, the corresponding fuzzy rule table defined in this paper. According to the formulated fuzzy inference rules, the output parameters of the PID controller are expressed as follows:

[0059]

[0060]

[0061] in, k p The minimum value of k p The maximum value of k i The minimum value of k i The maximum value of k d The minimum value of k d The maximum value of .

[0062] (4) Defuzzification: that is, defuzzification. Common defuzzification methods include the maximum membership method, the centroid method, and the weighted average method. Although the centroid method is more difficult to calculate, it has a smoother output result, which is consistent with the goal of fuzzy control. Therefore, the present invention uses the centroid method for defuzzification. The centroid method formula involved is expressed as follows:

[0063] The center of the area covered by the membership function of the fuzzy set C is

[0064]

[0065] Among them, x * is the center of the membership function, C is the fuzzy set, y c (x) is the membership function, and [a,b] is the scope of the domain.

[0066] Finally, the output value is clarified according to the membership degree to obtain k′ p , k′ i and k′ d , sent to the PID controller, and the calculated high-level voltage of the pulse voltage is output. By continuously adjusting the high-level voltage of the pulse voltage, the ion current can be kept stable at any time.

[0067] The G code is a widely used CNC programming language, generally referred to as G instructions in CNC programs. The basic structure of the G code consists of a control command and a numerical parameter. The control command usually starts with the letter "G" followed by a two-digit (or more) integer; for example, 0 is used for rapid positioning, 1 is used for linear interpolation, etc. The G code implementation process of this method is as follows Figure 6 .

[0068] The present invention can be used to prepare a temperature measurement device for the micro-nanoscale field, which is a thermal resistance temperature sensor based on a platinum metal microstructure. The present invention uses the MCED method, utilizes the characteristics of the meniscus limiting electrochemical deposition, controls the diffusion range of chloroplatinate, and limits the diffusion within the meniscus as much as possible, thereby ensuring that sufficient platinate ions are gathered in the contact area between the probe tip and the substrate, thereby ensuring the deposition of platinum metal. Figure 1 As shown in FIG. 1 , it is a schematic diagram of the structure of the meniscus-limited electrochemical deposition experimental platform device of the present invention. Figure 3 As shown, the complex structure deposition process required to be prepared in the present invention is: first, the deposition origin is selected, the experimental parameter conditions are given, the platinum metal deposition phenomenon is realized, and then a height of 20 μm is vertically grown at the starting position, and the current height position is remembered; every 15 μm, platinum columns of the same height are deposited and grown, that is, Figure 3 Then, connect the first and second platinum columns horizontally on a 20 μm height plane. Figure 3 ⑤ in the figure; connect the second and third platinum columns horizontally on the substrate, that is, Figure 3 ⑥ in the figure; and so on, thereby realizing the printing of sensor microstructure; and depositing a complete comb-shaped thermal resistor temperature sensor structure.

[0069] There are three wiring methods for thermal resistor temperature sensors, namely two-wire, three-wire and four-wire. The four-wire system refers to the method of connecting two wires at both ends of the root of the thermal resistor, in which two leads are connected to an ideal power supply 11 by welding to provide a constant current I for the thermal resistor, and the voltmeter 12 is directly added to the two ends of the measured platinum resistor by welding through the other two leads. Figure 4 As shown, the present invention adopts a four-wire wiring method, the required platinum resistance is equal to the quotient of the voltage meter 12 reading and the ammeter reading, and the influence of the lead resistance can be completely eliminated, thereby improving the measurement accuracy. When the external temperature changes, the readings of the ammeter and the voltage meter 12 are recorded, and the data is processed to obtain the relationship between the platinum resistance and the temperature change.

[0070] The use principle of the patent of the present invention is as follows: when the thermistor type micro temperature sensor contacts the object to be measured, heat will be transferred from the object to the thermistor, causing its temperature to change. Since there is a linear relationship between the resistance value of the thermistor and the temperature, the resistance value will change accordingly. The temperature measuring device calculates the change in resistance by applying a certain current to the thermistor and measuring the voltage generated at both ends of the thermistor to obtain the change in temperature. In this way, the sensor can indirectly obtain the temperature information of the object to be measured. The thermal resistor material used in the patent of the present invention is platinum, because platinum metal has very good chemical stability, high purity, excellent resistance-temperature linear relationship, and good heat resistance and corrosion resistance. These characteristics enable platinum metal to provide accurate and reliable temperature measurement under various environmental conditions. This ensures that this patent has certain important uses in the field of temperature sensors. Furthermore, the research results of this patent are also helpful in the development of new temperature sensors based on platinum films and other materials.

[0071] The above solution is only an illustration of a preferred embodiment, but is not limited thereto. When implementing the present invention, appropriate replacement and / or modification can be performed according to user needs.

[0072] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and the embodiments. It can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily realized. Therefore, without departing from the general concept defined by the claims and equivalent scope, the present invention is not limited to the specific details and the illustrations shown and described here.

Claims

1. A method for preparing a micro-nano scale platinum resistance temperature sensor, characterized in that: The method comprises: Step 1: Based on the MCED technology, the substrate applies a pulse voltage signal to the platinum electrode in the probe through a fuzzy PID control algorithm. The substrate is connected to the power supply through a wire. Under the action of the pulse voltage, platinum metal is deposited in the contact area between the substrate and the probe tip; Step 2: Based on the predetermined shape of the platinum resistor, a control program is written through G code to plan the probe movement path, control the probe movement, and deposit a platinum resistor of the desired shape and size on the substrate; Step 3: Connect the deposited platinum resistor to complete the preparation of the platinum resistance temperature sensor.

2. The method for preparing a micro-nano scale platinum resistance temperature sensor according to claim 1, characterized in that: Based on the principle of meniscus-limited electrochemical deposition, a platinum metal deposition simulation analysis model was established to simulate the pulse voltage signal, perform electrochemical reaction, and obtain the optimal deposition parameters for depositing platinum metal. The optimal deposition parameters include in step 1: the pulse voltage applied to the platinum electrode, the concentration of the electrolyte solution in the probe and the opening diameter of the probe tip.

3. The method for preparing a micro-nano scale platinum resistance temperature sensor according to claim 2, characterized in that: The pulse voltage is a pulse square wave signal, and its main parameters are high level 1.5V, low level -1.5V, frequency 1Hz, period 1s, and duty cycle 50%; The electrolyte solution is a chloroplatinic acid solution with a chloroplatinic acid concentration of 50 mM.

4. The method for preparing a micro-nano scale platinum resistance temperature sensor according to claim 2, characterized in that: The platinum metal deposition simulation analysis model includes: chloroplatinic acid electrolyte, gold substrate, platinum wire and probe area; The platinum metal deposition simulation analysis model is a two-dimensional plane model. The anode is a linear area, the cathode substrate is a rectangular area, and the probe area is filled with electrolyte solution.

5. The method for preparing a micro-nano scale platinum resistance temperature sensor according to claim 1, characterized in that: In step 1, the adjusted k′ ​​is used in the fuzzy PID control method. p , k′ i , k′ d Parameters are input into the PID controller to control the pulse voltage signal in real time; where k′ p =k″ p +Δk p , k′ i =k″ i +Δk i , k′ d =k″ d +Δk d , the Δk p , Δk i and Δk d The outputs of the fuzzy controller are the proportional coefficients k p , integration coefficient k i and the differential coefficient k d The increment of k″ p , k″ i and k″ d They are the input parameters of the PID controller last time.

6. The method for preparing a micro-nano scale platinum resistance temperature sensor according to claim 5, characterized in that: Fuzzy PID control methods include: S1, input fuzzification: the collected ion current is converted into a voltage signal through A / D and sent to the fuzzy controller, which is compared with the target value to obtain the deviation E and the deviation change EC, and then E and EC are fuzzified to establish the fuzzy subset; S2. Determine the membership function: According to the growth shape and size of the deposits during the platinum metal deposition process, as well as the sensitivity requirements for control, select the triangular membership function, and determine the membership of E and EC on the fuzzy subset through the triangular membership function; S3. Establish fuzzy control rules: The established fuzzy rule table is used to adjust the proportional coefficient, integral coefficient and differential coefficient. According to the established fuzzy inference rules, the output parameter formula of the fuzzy controller is obtained as follows: in, k p The minimum value of k p The maximum value of k i The minimum value of k i The maximum value of k d The minimum value of k d The maximum value of S4, defuzzification: Defuzzification is performed using the centroid method; S5. According to the membership degree, the output parameters of the fuzzy controller are clarified to obtain k′ p , k′ i and k′ d , sent to the PID controller, and the calculated high-level voltage of the pulse voltage is output. By continuously adjusting the high-level voltage of the pulse voltage, the ion current can be kept stable at any time.

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