Multifunctional chip automatic test equipment

Abstract

The invention belongs to the field of chip testing, and particularly relates to multifunctional chip automatic testing equipment which comprises an outer box body, a conveying mechanism and the like. And a conveying mechanism is connected in the outer box body. The chip is limited through the limiting mold, and the chip is scanned in a multi-angle manner through the 3D scanner in the moving process, so that a complete 3D cloud point diagram is obtained, the chip pins in an inclined state are rapidly detected, the average width of the pins and the distance between every two adjacent pins can be calculated, and the precision of the pins is improved. Each pressing block is made to move to the position between the two corresponding pins on the chip, the pins on the chip are extruded, meanwhile, the two adjacent pins are extruded through a shifting piece on each pressing block, and due to the fact that the width of a straight plate is equal to the distance between the two adjacent pins on the chip, the two adjacent pins are limited through the straight plate, and therefore the pins on the chip can be fixed through the straight plate. Therefore, the pins on the chip are corrected, and the distance between every two adjacent pins is kept consistent.

Description

Technical Field

[0001] The invention belongs to the field of chip testing, and in particular relates to a multifunctional chip automatic testing device. Background Art

[0002] Integrated circuit boards are one of the essential basic components in electronic products. The quality of chip pin welding on integrated circuit boards is an important factor in evaluating the quality of integrated circuit boards. The quality of chip pin welding directly determines the quality of integrated circuit boards and electronic products. Therefore, integrated circuit boards need to undergo multiple chip pin welding quality inspection processes during the production process. Based on the existing technology, it is found that when inspecting the bonded frame and chip, the commonly used inspection items include: abnormal chip mounting (skewed, damaged, missing, wrong, etc.), abnormal wire welding (skewed welding, multiple wires, few wires, wrong wires, broken wires, etc.); the traditional inspection method is to manually load and unload the materials, and then perform an appearance inspection on the outer surface of the chip. This inspection method has certain limitations and cannot detect the welding quality between the wire and the chip. The inspection efficiency is low. In addition, when the existing inspection equipment transfers and grabs the chip, when the chip is adsorbed by hydraulic devices such as cylinders, it will cause downward pressure on the chip, which will cause the chip pins to warp, etc., resulting in the chip pins and the contacts of the power-on detection mechanism being misaligned during the subsequent power-on detection, which can easily affect the subsequent inspection operations. Summary of the invention

[0003] In order to overcome the shortcomings of existing chip testing equipment that the welding quality between the bonding wire and the chip cannot be detected when testing the chip and the detection efficiency is low, the present invention provides a multifunctional chip automatic testing equipment.

[0004] The technical implementation scheme of the present invention is: a multifunctional chip automatic testing equipment, including an outer box body, a conveying mechanism and a scanning mechanism; a reserved hole for installing an external conveyor belt is opened on the left side of the outer box body; a conveying mechanism for conveying chips is connected to the outer box body; a scanning mechanism for 3D scanning of chips is connected to the outer box body; it also includes a driving mechanism, a base plate, a limit mold, a fixed plate, an electric actuator I, an extrusion plate and a pressure block; a driving mechanism is connected to the outer box body, and the driving mechanism is connected to the base plate; the driving mechanism is used to drive the base plate to move; at least three limit molds are fixedly connected to the base plate; at least four fixed plates are fixedly connected to the base plate; at least two electric actuators I are fixedly connected to each fixed plate; all the telescopic parts of the electric actuators I on the same fixed plate are commonly fixedly connected to an extrusion plate; taking the middle part of the base plate as a reference, all the extrusion plates on the left are each fixedly connected to a plurality of pressure blocks.

[0005] Optionally, a paddle is provided on a side of the pressing block away from the corresponding extrusion plate.

[0006] Optionally, a straight plate is provided on one side of the pressing block close to the corresponding extrusion plate, and the width of the straight plate is equal to the interval between two adjacent pins on the chip.

[0007] Optionally, the outer surface of the pressing block is provided with a friction reducing coating.

[0008] Optionally, the conveying mechanism includes an electric slide rail I, an electric slider I, an electric actuator II and a suction cup; the electric slide rail I is fixedly connected to the upper inner part of the outer box body; at least two electric sliders I are slidably connected to the electric slide rail I; an electric actuator II is fixedly connected to the lower part of each electric slider I; and a suction cup is fixedly connected to the telescopic part of each electric actuator II.

[0009] Optionally, the scanning mechanism includes an electric slide rail II, an electric slider II, an electric slide rail III, an electric slider III and a 3D scanner; at least two electric slide rails II are fixedly connected in the outer box; each electric slide rail II is slidably connected to an electric slider II; each electric slider II is fixedly connected to an electric slide rail III; each electric slide rail III is slidably connected to an electric slider III; and a 3D scanner is fixedly connected to the lower part of each electric slider III.

[0010] Optionally, it also includes a dust removal system; the dust removal system is connected to the base plate; the dust removal system includes an L-shaped tube, a conduit, a circular tube and a nozzle; the L-shaped tube is fixedly connected to the base plate; the conduit is connected to the L-shaped tube; at least two circular tubes are connected to the conduit; each circular tube is fixedly connected and connected to a plurality of nozzles; the L-shaped tube and the conduit are passed through adjacent limiting molds.

[0011] Optionally, all nozzles are arranged at an angle, and one end of the nozzle away from the circular tube is arranged in a bell-mouth shape.

[0012] Optionally, a secondary detection system is also included; the secondary detection system is connected to the base plate; the secondary detection system includes a push plate, an electric actuator IV, a pressure plate, a support, a connecting rod, a limit plate and an elastic member; the push plate is fixedly connected to the suction cup on the right; taking the middle of the base plate as a reference, all the fixed plates on the right are fixedly connected to an electric actuator IV; each telescopic part of the electric actuator IV is fixedly connected to a pressure plate; a support is fixedly connected to the right side of the base plate, and the support is located between two adjacent pressure plates; a connecting rod is rotatably connected to the upper part of the support; the limit plate is fixedly connected to the connecting rod; at least two elastic members are sleeved on the outside of the connecting rod, one end of the elastic member is fixedly connected to the support, and the other end of the elastic member is fixedly connected to the limit plate.

[0013] Optionally, the left and right parts of the push plate both protrude from the corresponding suction cups, and a rubber pad is provided on the lower surface of the push plate.

[0014] The advantages and positive effects of the present invention are: (1) The chip is limited by a limiting mold, and the chip is scanned at multiple angles by a 3D scanner during movement, so as to obtain a complete 3D cloud point map, quickly detect the chip pins in a skewed state, and calculate the average width of the pins and the distance between two adjacent pins.

[0015] (2) Each pressing block is moved between the corresponding two pins on the chip and the pins on the chip are squeezed. At the same time, the two adjacent pins are squeezed by the paddles on each pressing block. Since the width of the straight plate is equal to the spacing between the two adjacent pins on the chip, the two adjacent pins are limited by the straight plate, thereby achieving the correct positioning of the pins on the chip, so that the spacing between each two adjacent pins remains consistent.

[0016] (3) The chip pins are cleaned by spraying gas from multiple nozzles to keep the chip pins clean, thereby avoiding impurities remaining on the chip pins, affecting the stability of the electrical connection between the chip and the subsequent power-on detection mechanism, thereby interfering with the test operation and causing large errors in the test results.

[0017] (4) The corresponding extrusion plate cooperates with the corresponding pressure plate to squeeze the pins of the chip into position, thereby reducing the warping of the pins of the chip, and the right part of the chip is squeezed by the push plate to rotate the chip, and all the pins on the left side of the chip are clamped and limited by the extrusion plate and the pressure plate, so that all the pins on the left side of the chip are stretched, and then the chip is scanned and inspected by the 3D scanner on the right, so as to achieve physical testing and inspection of all the pins on the chip, thereby ensuring that only chips that meet the quality requirements enter the market, improving the reliability and stability of the product while reducing the cost of after-sales maintenance and replacement. Compared with the existing chip detection equipment, it can perform physical testing on the pins of the chip after the chip is corrected, so that the chip detection is more comprehensive and the functions are more diversified. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the multifunctional chip automatic testing equipment of the present invention; Figure 2 It is a schematic diagram of the installation position of the multifunctional chip automatic testing equipment conveying mechanism of the present invention; Figure 3 It is a schematic diagram of the combined three-dimensional structure of the conveying mechanism and the scanning mechanism of the multifunctional chip automatic testing equipment of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment bottom plate, the limiting mold, the fixing plate, the electric actuator I and the extrusion plate of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment fixing plate, electric actuator I, extrusion plate and pressing block combination of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the combination of the extrusion plate, the pressing block, the paddle and the straight plate of the multifunctional chip automatic testing equipment of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the chip and the limiting mold combination of the multifunctional chip automatic testing equipment of the present invention; Figure 8 It is a three-dimensional structural schematic diagram of the multifunctional chip automatic testing equipment dust removal system of the present invention; Fig. 9 It is a three-dimensional structural schematic diagram of the secondary detection system of the multifunctional chip automatic test equipment of the present invention; Fig.10 It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment support, connecting rod, limiting plate and elastic member combination of the present invention; Fig.11 A state diagram of the invented multifunctional chip automatic testing equipment in which a push plate squeezes the chip.

[0019] The meanings of the reference numerals in the figure are: 1-outer box, 2-chip, 21-electric slide rail I, 22-electric slider I, 23-electric actuator II, 24-suction cup, 31-electric slide rail II, 32-electric slider II, 33-electric slide rail III, 34-electric slider III, 35-3D scanner, 201-electric actuator III, 202-support frame, 203-bottom plate, 204-limiting mold, 205-fixing plate, 206-electric actuator I, 207-extrusion plate, 208-pressing block, 2081-pick, 2082-straight plate, 301-L-shaped tube, 302-conduit, 303-round tube, 304-nozzle, 401-pushing plate, 402-electric actuator IV, 403-pressure plate, 404-support, 405-connecting rod, 406-limiting plate, 407-elastic member. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby stated that the directional terms such as up, down, left, right, front, back, inside, outside, etc. that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and are not specific limitations of the present invention.

[0021] Embodiment 1: A multifunctional chip automatic testing equipment, based on Figure 1-Figure 7As shown, it includes an outer box body 1, a transmission mechanism and a scanning mechanism; a reserved hole for installing an external conveyor belt is opened on the left side of the outer box body 1; the transmission mechanism is connected inside the outer box body 1; the scanning mechanism is connected inside the outer box body 1; It also includes a driving mechanism, a base plate 203, a limiting mold 204, a fixed plate 205, an electric actuator Ⅰ206, an extrusion plate 207 and a pressure block 208; the outer box body 1 is connected to a driving mechanism, and the driving mechanism is connected to the base plate 203; the driving mechanism is used to drive the base plate 203 to move; three limiting molds 204 are fixedly connected to the base plate 203; four fixed plates 205 are fixedly connected to the base plate 203; two electric actuators Ⅰ206 are fixedly connected to each fixed plate 205, and the electric actuators Ⅰ206 are electric push rods; all the telescopic parts of the electric actuators Ⅰ206 on the same fixed plate 205 are fixedly connected to an extrusion plate 207; taking the middle part of the base plate 203 as a reference, a plurality of pressure blocks 208 are fixedly connected to each of the two extrusion plates 207 on the left.

[0022] A prying piece 2081 is provided on one side of the pressing block 208 away from the corresponding pressing plate 207 , and is used to press the pins of the chip 2 .

[0023] A straight plate 2082 is provided on one side of the pressing block 208 close to the corresponding pressing plate 207 , and the width of the straight plate 2082 is equal to the distance between two adjacent pins on the chip 2 , so as to align the pins on the chip 2 .

[0024] The outer surface of the pressing block 208 is provided with a friction-reducing coating to reduce the friction between the pressing block 208 and the pins of the chip 2 .

[0025] The transmission mechanism includes an electric slide rail Ⅰ21, an electric slider Ⅰ22, an electric actuator Ⅱ23 and a suction cup 24; the electric slide rail Ⅰ21 is fixedly connected to the upper inner side of the outer box body 1; two electric sliders Ⅰ22 are slidably connected to the electric slide rail Ⅰ21; each electric slider Ⅰ22 is fixedly connected to an electric actuator Ⅱ23 at the lower part, and the electric actuator Ⅱ23 is an electric push rod; each electric actuator Ⅱ23 telescopic part is fixedly connected to a suction cup 24.

[0026] The scanning mechanism includes an electric slide rail II31, an electric slider II32, an electric slide rail III33, an electric slider III34 and a 3D scanner 35; two electric slide rails II31 are fixedly connected in the outer box body 1; each electric slide rail II31 is slidably connected to an electric slider II32; each electric slider II32 is fixedly connected to an electric slide rail III33; each electric slide rail III33 is slidably connected to an electric slider III34; a 3D scanner 35 is fixedly connected to the lower part of each electric slider III34.

[0027] The driving mechanism includes an electric actuator III201 and a support frame 202; two electric actuators III201 are fixedly connected to the inner bottom of the outer box body 1, and the electric actuator III201 is an electric push rod; the telescopic parts of all electric actuators III201 are fixedly connected to the bottom plate 203; two support frames 202 are fixedly connected to the inner bottom of the outer box body 1; all support frames 202 are slidably connected to the bottom plate 203.

[0028] In the following descriptions, the terms “located on the left” or “located on the right” are used in the following manner. Figure 3 The middle portion of the bottom plate 203 is shown as a reference for distinguishing parts located in the left area and the right area of ​​the bottom plate 203 .

[0029] The following is the working process of detecting the pins of chip 2: control the operation of the peripheral conveyor belt to convey the neatly placed chips 2 to the left of the bottom plate 203, then control the electric slider II 32 on the left to start moving along the electric slide rail II 31 to the left, the movement of the electric slider II 32 drives the electric slide rail III 33, the electric slider III 34 and the 3D scanner 35 to move synchronously, thereby avoiding the movement of the electric actuator II 23, and then control the electric slider I 22 on the left to move along the electric slide rail I 21 to the left, the electric slider The movement of block I 22 drives the corresponding electric actuator II 23 to move, and the movement of electric actuator II 23 drives the suction cup 24 to move until the suction cup 24 moves to the top of the chip 2, and then the electric actuator II 23 is controlled to start and drive the suction cup 24 to move downward, so that the suction cup 24 adsorbs the chip 2, and then returns to move and reset according to the above reverse working principle. After the electric slider I 22 moves and resets, the electric actuator II 23 is controlled to start and drive the suction cup 24 to move downward, so that the chip 2 is placed in a limiting mold 204 on the far left, as shown in FIG. Figure 7 As shown, the electric slider II 32 on the left is then controlled to move and reset, thereby moving the 3D scanner 35 close to the chip 2, and then controlling the 3D scanner 35 to operate, and controlling the electric slider III 34 to start moving back and forth along the electric slide rail III 33. The movement of the electric slider III 34 drives the 3D scanner 35, so that the 3D scanner 35 scans the chip 2 at multiple angles during the movement, thereby obtaining a complete 3D cloud point map, quickly detecting the chip 2 pins in a skewed state, and being able to calculate the average width of the pins and the distance between two adjacent pins, and then placing the chip 2 whose pins meet the process standards on the limiting mold 204 between the two extrusion plates 207 on the left.

[0030] The following is the working process of aligning the pins of chip 2: when the 3D scanner 35 detects that the pins of chip 2 are skewed, that is, the spacing between two adjacent pins on chip 2 is different, all electric actuators I 206 on the two fixed plates 205 on the left are controlled to start, so that the two squeezing plates 207 on the left move towards each other, and the movement of the two squeezing plates 207 drives the corresponding pressing blocks 208 to move, so that each pressing block 208 moves between the corresponding two pins on chip 2 and squeezes the pins on chip 2, and at the same time, the paddles 2081 on each pressing block 208 align the two adjacent pins. The pressing block 208 is extruded, and since the outer surface of the pressing block 208 is provided with a friction-reducing coating, the friction between the pressing block 208 and the pins of the chip 2 can be reduced, thereby reducing the pressure of the pressing block 208 on the pins. The pressing block 208 pushes the pins to move in the direction of the pressing block 208. When the pressing block 208 continues to move to extrude the pins on the chip 2, since the width of the straight plate 2082 is equal to the spacing between two adjacent pins on the chip 2, the pins are limited by the straight plate 2082 on the pressing block 208 and the extrusion plate 207, thereby realizing the alignment of the pins on the chip 2, so that the spacing between each two adjacent pins remains consistent.

[0031] Embodiment 2: Based on the first embodiment, Figure 4 and Figure 8 As shown, it also includes a dust removal system; the dust removal system is connected to the bottom plate 203; the dust removal system includes an L-shaped tube 301, a conduit 302, a circular tube 303 and a nozzle 304; the L-shaped tube 301 is fixedly connected to the bottom plate 203; the conduit 302 is fixedly connected to and connected to the L-shaped tube 301; two circular tubes 303 are fixedly connected to and connected to the conduit 302; each circular tube 303 is fixedly connected to and connected to a plurality of nozzles 304; the L-shaped tube 301 and the conduit 302 are passed through adjacent limiting molds 204.

[0032] All nozzles 304 are arranged at an inclination, and one end of the nozzle 304 away from the circular tube 303 is arranged in a bell-mouth shape, so as to increase the coverage of the gas.

[0033] The following is the working process of dust removal for chip 2: the peripheral pump is connected to the L-shaped tube 301 in advance. Since the production process of chip 2 is carried out in a highly controlled dust-free workshop, even with an efficient filtering system, there may still be a very small amount of particulate matter in the air, especially in the ventilation process of the dust-free workshop, which may cause the chip 2 to be contaminated with dust and impurities. The impurities will interfere with the electrical connection stability between the chip 2 and the subsequent power-on detection mechanism, thereby interfering with the test operation and causing a large error in the test result. After the chip 2 is placed on the limiting mold 204, the peripheral pump is controlled to start to supply gas to the L-shaped tube 301. The gas enters the conduit 302 along the L-shaped tube 301 and flows to the two circular tubes 303, and finally sprayed to the pins of the chip 2 through multiple nozzles 304, so that the pins of the chip 2 are cleaned by the gas sprayed from the multiple nozzles 304, so that the pins of the chip 2 are kept clean, thereby avoiding the problem that the electrical connection stability between the chip 2 and the subsequent power-on detection mechanism is affected by impurities remaining on the pins of the chip 2, thereby interfering with the test operation and causing a large error in the test result.

[0034] Embodiment three: Based on the second embodiment, according to Figure 9-11 As shown, it also includes a secondary detection system; the secondary detection system is connected to the bottom plate 203; the secondary detection system includes a push plate 401, an electric actuator IV 402, a pressure plate 403, a support 404, a connecting rod 405, a limit plate 406 and an elastic member 407; the push plate 401 is fixedly connected to the suction cup 24 located on the right; based on the middle of the bottom plate 203, an electric actuator IV 402 is fixedly connected to all the fixed plates 205 located on the right, and the electric actuator IV 402 is an electric push rod ; Each electric actuator IV 402 telescopic part is fixedly connected to a pressure plate 403; a support 404 is fixedly connected to the right part of the bottom plate 203, and the support 404 is located between two adjacent pressure plates 403; a connecting rod 405 is rotatably connected to the upper part of the support 404; a limiting plate 406 is fixedly connected to the connecting rod 405; two elastic members 407 are sleeved on the outer side of the connecting rod 405, and the elastic member 407 is a torsion spring, one end of the elastic member 407 is fixedly connected to the support 404, and the other end of the elastic member 407 is fixedly connected to the limiting plate 406.

[0035] The left and right parts of the push plate 401 are both protruding from the corresponding suction cups 24 , and a rubber pad is provided on the lower surface of the push plate 401 to pressurize the chip 2 and prevent the chip 2 from being scratched.

[0036] The following is a description of the work of performing secondary inspection on chip 2: After chip 2 is aligned, the electric slider Ⅰ22 on the right is controlled to start and drive the corresponding electric actuator Ⅱ23 to move to the left. The movement of electric actuator Ⅱ23 drives the suction cup 24 to move, so that the suction cup 24 moves to the top of the aligned chip 2, and then the electric actuator Ⅱ23 is controlled to start and drive the suction cup 24 to move downward, so that the suction cup 24 adsorbs chip 2, and then the electric slider Ⅰ22 on the right is controlled to start and move to the right in the same way as above. Because the existing inspection equipment does not perform physical testing on chip 2 when inspecting chip 2, and physical testing is an indispensable link before chip 2 is commercialized and mass-produced, physical testing can be used to screen out chips 2 with physical defects to ensure that only chips 2 that meet quality requirements enter the market. This can not only improve the reliability and stability of the product, but also reduce the cost of after-sales maintenance and replacement, thereby increasing the company's profits, and the existing inspection equipment When the device absorbs chip 2 through hydraulic devices such as cylinders, it will cause downward pressure on chip 2, which will cause the pins of chip 2 to warp, etc., and then cause the pins of chip 2 to be misaligned with the contacts of the power-on detection mechanism during the subsequent power-on detection of chip 2, which will easily affect the subsequent detection operations. By controlling all electric actuators Ⅰ206 on the right to start, the two extrusion plates 207 on the right are driven to move toward each other, and the two extrusion plates 207 on the right are moved toward the support 404, and then the electric actuator Ⅱ23 on the right is controlled to start and drive the suction cup 24 to move downward, and then drive the chip 2 to move downward, so that the chip 2 is placed on the limiting plate 406. At this time, the inner sides of the pins on both sides of the chip 2 are limited by a squeezing plate 207 respectively, and then the two electric actuators Ⅳ402 are controlled to start and each drive a pressure plate 403 to move, so that the two pressure plates 403 move toward each other and press against the pins of chip 2. Fig.10 As shown, the corresponding pressing plate 207 cooperates with the corresponding pressure plate 403 to press the pins of the chip 2 to adjust the position, thereby reducing the warping of the pins of the chip 2.

[0037] Then control all electric actuators IV 402 to start and drive the corresponding pressure plates 403 to move and reset, control the right electric actuator II 23 to start and drive the suction cup 24 to move upward, and then drive the chip 2 to move upward, and then control all electric actuators I 206 on the right side of the support 404 to start and drive the corresponding extrusion plates 207 to move, so that the extrusion plate 207 on the right side of the support 404 is away from the support 404, so that the pins on the right side of the chip 2 have enough space to move, and then place the chip 2 on the limiting plate 406 in the same way as above, and the extrusion plate 207 and the pressure plate 403 on the left side of the support 404 still clamp and limit the pins on the left side of the chip 2, and then control the suction cup 24 to release the chip 2, and then control the electric slider I 22 on the right to start and drive the corresponding electric actuator II 23 to move, and then drive the suction cup 24 on the right to move, and the movement of the suction cup 24 drives the push plate 401 to move, so that the left part of the push plate 401 moves to the right side of the chip 2, as shown in FIG. Fig.10 As shown, the electric actuator II 23 on the right is controlled to start and drive the suction cup 24 to move downward. The movement of the suction cup 24 drives the push plate 401 to move downward, and then the right part of the chip 2 is squeezed by the push plate 401, thereby driving the limit plate 406 to rotate. The rotation of the limit plate 406 drives the connecting rod 405 to rotate, thereby allowing the two elastic members 407 to store force, thereby allowing the chip 2 to rotate, and all the pins on the left side of the chip 2 are clamped and limited by the squeezing plate 207 and the pressure plate 403, so that when the chip 2 rotates, all the pins on the left side of the chip 2 can be stretched, and then the electric actuator II 23 on the right is controlled to start and drive the suction cup 24 to move upward and reset, so that the push plate 401 no longer squeezes the right part of the chip 2, and at the same time, the connecting rod 405 and the limit plate 406 are rotated and reset by the elastic force generated by the two elastic members 407, thereby driving the chip 2 to reset, and then all the pins on the right side of the chip 2 are reset in the same way as above. The chip 2 is stretched, and then the chip 2 that has passed the stretching test is transferred to the rightmost limiting mold 204, and scanned and tested by the 3D scanner 35 on the right. If all the pins on the chip 2 do not fall off or break after the stretching test, it means that all the pins on the chip 2 are firmly welded and meet the production standards. If several pins on the chip 2 fall off or break, it means that the production quality of the chip 2 does not meet the standards, and the chips 2 that do not meet the standards are removed, thereby realizing physical inspection of the chip 2 to ensure that only chips 2 that meet the quality requirements enter the market, while improving the reliability and stability of the product, it can also reduce the cost of after-sales maintenance and replacement. Compared with the existing chip 2 detection equipment, the multifunctional chip 2 automatic testing equipment can perform physical testing on the pins of the chip 2 after the chip 2 is corrected in the right position, thereby making the chip 2 detection more comprehensive and the function more diversified.

[0038] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multifunctional chip automatic testing device, comprising an outer box (1), a conveying mechanism and a scanning mechanism; a reserved hole for installing an external conveyor belt is opened on the left side of the outer box (1); a conveying mechanism for conveying a chip (2) is connected inside the outer box (1); a scanning mechanism for performing a 3D scan on the chip (2) is connected inside the outer box (1); the characteristics are as follows: The invention also comprises a driving mechanism, a bottom plate (203), a limiting mold (204), a fixing plate (205), an electric actuator I (206), an extrusion plate (207) and a pressing block (208); the outer box body (1) is connected to the driving mechanism, and the driving mechanism is connected to the bottom plate (203); the driving mechanism is used to drive the bottom plate (203) to move; at least three limiting molds (204) are fixedly connected to the bottom plate (203); at least four fixing plates (205) are fixedly connected to the bottom plate (203); at least two electric actuators I (206) are fixedly connected to each fixing plate (205); the telescopic parts of all electric actuators I (206) on the same fixing plate (205) are fixedly connected to an extrusion plate (207); and with the middle of the bottom plate (203) as a reference, a plurality of pressing blocks (208) are fixedly connected to all the extrusion plates (207) located on the left.

2. A multifunctional chip automatic testing equipment according to claim 1, characterized in that: A paddle (2081) is provided on one side of the pressing block (208) away from the corresponding extrusion plate (207).

3. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: A straight plate (2082) is provided on one side of the pressing block (208) close to the corresponding extrusion plate (207), and the width of the straight plate (2082) is equal to the distance between two adjacent pins on the chip (2).

4. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: The outer surface of the pressing block (208) is provided with a friction-reducing coating.

5. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: The transmission mechanism comprises an electric slide rail I (21), an electric slider I (22), an electric actuator II (23) and a suction cup (24); the electric slide rail I (21) is fixedly connected to the upper inner portion of the outer box body (1); at least two electric sliders I (22) are slidably connected to the electric slide rail I (21); an electric actuator II (23) is fixedly connected to the lower portion of each electric slider I (22); and a suction cup (24) is fixedly connected to the telescopic portion of each electric actuator II (23).

6. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: The scanning mechanism comprises an electric slide rail II (31), an electric slider II (32), an electric slide rail III (33), an electric slider III (34) and a 3D scanner (35); at least two electric slide rails II (31) are fixedly connected inside the outer box (1); each electric slide rail II (31) is slidably connected to an electric slider II (32); each electric slider II (32) is fixedly connected to an electric slide rail III (33); each electric slide rail III (33) is slidably connected to an electric slider III (34); and a 3D scanner (35) is fixedly connected to the lower part of each electric slider III (34).

7. A multifunctional chip automatic testing equipment according to any one of claims 1 to 6, characterized in that: The device also comprises a dust removal system; the dust removal system is connected to the bottom plate (203); the dust removal system comprises an L-shaped tube (301), a conduit (302), a circular tube (303) and a nozzle (304); the L-shaped tube (301) is fixedly connected to the bottom plate (203); the conduit (302) is connected to the L-shaped tube (301); at least two circular tubes (303) are connected to the conduit (302); each circular tube (303) is fixedly connected to and communicated with a plurality of nozzles (304); the L-shaped tube (301) and the conduit (302) are inserted into adjacent limiting molds (204).

8. The multifunctional chip automatic testing equipment according to claim 7, characterized in that: All nozzles (304) are arranged at an inclination, and one end of the nozzle (304) away from the circular tube (303) is arranged in a bell-mouth shape.

9. The multifunctional chip automatic testing equipment according to claim 7, characterized in that: The secondary detection system is also included; the secondary detection system is connected to the bottom plate (203); the secondary detection system includes a push plate (401), an electric actuator IV (402), a pressure plate (403), a support (404), a connecting rod (405), a limit plate (406) and an elastic member (407); the push plate (401) is fixedly connected to the suction cup (24) located on the right; with the middle of the bottom plate (203) as a reference, an electric actuator IV (402) is fixedly connected to all the fixed plates (205) located on the right; each electric actuator The telescopic parts of the device IV (402) are fixedly connected to a pressure plate (403); the right part of the bottom plate (203) is fixedly connected to a support (404), and the support (404) is located between two adjacent pressure plates (403); the upper part of the support (404) is rotatably connected to a connecting rod (405); the connecting rod (405) is fixedly connected to a limiting plate (406); at least two elastic members (407) are sleeved on the outer side of the connecting rod (405), one end of the elastic member (407) is fixedly connected to the support (404), and the other end of the elastic member (407) is fixedly connected to the limiting plate (406).

10. The multifunctional chip automatic testing equipment according to claim 9, characterized in that: The left and right parts of the push plate (401) both protrude from the corresponding suction cups (24), and a rubber pad is provided on the lower surface of the push plate (401).

Images