A test device applicable to printed circuit boards of multiple sizes

Abstract

The present invention belongs to the field of printed circuit board testing, and particularly relates to a testing device suitable for multi-size printed circuit boards. A testing device suitable for multi-size printed circuit boards that can position and fix circuit boards of different sizes, including a housing, etc.; a horizontal movement module is installed in the upper part of the housing. The horizontal movement module is composed of an X-axis module and a Y-axis module, and a flying probe testing mechanism is installed on the horizontal movement module. The present invention fixes the circuit board by adsorption, which is convenient and fast; the ejector assembly can automatically release the circuit board, making the equipment more convenient to use; when detecting the circuit board, since there are clamping plates to limit the circuit board in four directions, the circuit board will not displace during the detection process. At the same time, the slider does not restrict the downward movement of the placement hole plate, so that the clamping plate can be suitable for fixing circuit boards of different sizes, and the equipment has strong versatility.

Description

Technical Field

[0001] The present invention belongs to the field of printed circuit board testing, and particularly relates to a testing device applicable to printed circuit boards of multiple sizes. Background Art

[0002] A printed circuit board is one of the important components in the electronics industry, used to support and connect various electronic components. It realizes the circuit connection function by printing conductive patterns on the surface of an insulating substrate and installing and soldering electronic components thereon. In the printed circuit board production industry, printed circuit board testing is an important step to ensure the normal function and defect-free of the circuit board. Effective testing can improve the reliability of the product. It usually includes visual inspection, electrical testing, functional testing, X-ray detection, boundary scan testing, etc. In electrical testing, there are also flying probe testing and in-circuit testing respectively, and flying probe testing is a key step in producing circuit boards. It uses moving probes to contact the test points on the circuit board to detect electrical characteristics such as open circuits, short circuits, and resistance values.

[0003] When the existing flying probe testing device fixes the circuit board, it usually passes positioning rods through the positioning holes at the four corners of the circuit board to achieve the fixation of the circuit board. Although this method can fix the circuit board, there is still much room for improvement. Firstly, the positioning is restricted by many factors. When there are errors in the hole positions, the circuit board is likely to be damaged during fixation. If the positioning holes are larger than the diameter of the positioning rods, the fixation effect will be reduced, and the circuit board is likely to shake when the flying probe moves, resulting in the situation that the flying probe cannot be aligned.

[0004] Therefore, there is an urgent need to develop a testing device applicable to printed circuit boards of multiple sizes that can position and fix circuit boards of different sizes. Summary of the Invention

[0005] In order to overcome the above-mentioned disadvantages of the prior art, the present invention provides a testing device applicable to printed circuit boards of multiple sizes that can position and fix circuit boards of different sizes.

[0006] Technical Solution: A testing device applicable to printed circuit boards of multiple sizes includes a housing, a horizontal movement module, a flying probe testing mechanism, a vertical movement module, and an adsorption component. A horizontal movement module is installed in the upper part of the housing, and a flying probe testing mechanism is installed on the horizontal movement module. The horizontal movement module can drive the test end of the flying probe testing mechanism to move in the X-axis and Y-axis directions. A vertical movement module is arranged at the rear side inside the housing, and an adsorption component is arranged on the vertical movement module. The vertical movement module is used to drive the adsorption component to move in the Z-axis direction. The adsorption component includes an air pump, an adsorption plate, and an air pipe. The air pump is fixedly connected to the lower part of the rear side inside the housing by bolts. The slider of the vertical movement module is connected with the adsorption plate, and an air pipe is connected between the adsorption plate and the air pump.

[0007] Further, the horizontal movement module is composed of an X-axis module and a Y-axis module.

[0008] Further, it further includes a top material component. The top material component is arranged on the adsorption plate. The top material component includes a lifting frame, a placing hole plate, and a limiting plate. The lifting frame is slidably arranged on the edge of the adsorption plate. A placing hole plate is fixedly connected between the tops of the lifting frames. The placing hole plate is above the adsorption plate. A limiting plate is fixedly connected to the outer shell below the lifting frame. The bottom of the lifting frame contacts the top of the limiting plate.

[0009] Further, the top material component further includes a guide rod and a spring I. Guide rods are vertically arranged at four corner positions at the bottom of the adsorption plate. The lifting frame is slidably connected to the guide rods. A spring I is connected between the lifting frame and the adsorption plate.

[0010] Further, it further includes a side limiting component. The side limiting component is arranged on the placing hole plate. The side limiting component includes a track, a slider, a sliding shaft, a spring II, a clamping plate, and a tension spring. Four inclined slots are formed in the adsorption plate. The track is embedded and arranged on the placing hole plate above the inclined slots. The slider is slidably connected in the track. Sliding shafts are arranged on one side of the slider facing the inclined slots. The sliding shafts are above the inclined slots. A spring II is connected between the slider and the track. The clamping plate is slidably connected to the slider. The clamping plate is also slidably connected to the track. A tension spring is connected between the clamping plate and the slider.

[0011] Further, the inclined slots are combined into a cross, and the depth of the inclined slots increases from the outside to the inside.

[0012] Further, the inner side surface of the clamping plate is an inclined surface that slopes downward.

[0013] Further, it further includes an air hole blocking component. The air hole blocking component is arranged in the holes of the placing hole plate. The air hole blocking component includes a blocking block and a spring III. The blocking block is slidably arranged below the holes on the placing hole plate. A spring III is connected between the blocking block and the placing hole plate.

[0014] Further, the air hole blocking component further includes a cushion block. A hemispherical cushion block is arranged at the top end of the blocking block.

[0015] Compared with the prior art, the present invention has the following advantages: The present invention fixes the circuit by adsorption, which is convenient and fast; the top material component can automatically release the circuit board, making the equipment more convenient to use; when detecting the circuit board, since the clamping plate limits the circuit board in four directions, the circuit board will not be displaced during the detection process. At the same time, the slider does not restrict the downward movement of the placing hole plate, so that the clamping plate can be applicable to fixing circuit boards of different sizes, and the equipment has strong versatility. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a three-dimensional structure diagram of the present invention.

[0018] Figure 2 It is a three-dimensional structure diagram of the interior of the present invention.

[0019] Figure 3 It is a three-dimensional structure diagram of the present invention for fixing the circuit board structure.

[0020] Figure 4 It is a three-dimensional structure diagram of the adsorption component of the present invention.

[0021] Figure 5 It is a three-dimensional structure diagram of the ejector component of the present invention.

[0022] Figure 6 For the present invention Figure 5 An enlarged view of A in

[0023] Figure 7 It is a three-dimensional structure diagram of the side limiting component of the present invention.

[0024] Figure 8 For the present invention Figure 7 An enlarged view of B in

[0025] Figure 9 It is a three-dimensional structure diagram of the air hole blocking component of the present invention.

[0026] Figure 10 It is a three-dimensional structure diagram of the plug block, spring III and cushion block of the present invention.

[0027] The meanings of the reference numerals in the drawings: 1. Outer shell, 2. Horizontal moving module, 3. Flying probe testing mechanism, 4. Vertical moving module, 5. Adsorption component, 51. Air pump, 52. Adsorption plate, 53. Air pipe, 6. Ejector component, 61. Lifting frame, 62. Placing hole plate, 63. Limiting plate, 64. Guide rod, 65. Spring I, 7. Side limiting component, 71. Inclined groove, 72. Track, 73. Slide block, 74. Slide shaft, 75. Spring II, 76. Clamping plate, 77. Tensile spring, 8. Air hole blocking component, 81. Plug block, 82. Spring III, 83. Cushion block. Detailed implementation manners

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0029] Thus, a feature pointed out in this specification will be used to illustrate one of the features of one embodiment of the present invention, rather than implying that each embodiment of the present invention must have the feature described. In addition, it should be noted that this specification describes many features. Although some features may be combined to show possible system designs, these features can also be used in other combinations not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0030] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0031] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present application.

[0032] The principle and structure of the present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0033] Embodiment 1: A test device applicable to printed circuit boards of multiple sizes, as Figures 1-4 shown, includes a housing 1, a horizontal movement module 2, a flying probe test mechanism 3, a vertical movement module 4 and a suction assembly 5. A horizontal movement module 2 is installed in the upper part of the housing 1. The horizontal movement module 2 is composed of an X-axis module and a Y-axis module. A flying probe test mechanism 3 is installed on the horizontal movement module 2. The test end of the flying probe test mechanism 3 is connected to the horizontal movement module 2. The horizontal movement module 2 can drive the test end of the flying probe test mechanism 3 to move in the X-axis and Y-axis directions. A vertical movement module 4 is arranged at the rear side inside the housing 1. A suction assembly 5 is arranged on the vertical movement module 4. The vertical movement module 4 is used to drive the suction assembly 5 to move in the Z-axis direction. The suction assembly 5 includes an air pump 51, a suction plate 52 and an air pipe 53. The air pump 51 is fixedly connected to the lower part of the rear side inside the housing 1 by bolts. A suction plate 52 is connected to the slider 73 of the vertical movement module 4. An air pipe 53 is connected between the suction plate 52 and the air pump 51. There is an electromagnetic valve on the air pipe 53.

[0034] When using this device to detect a circuit board, first place the circuit board to be detected above the suction plate 52, then control the air pump 51 to start working, and fix the circuit board by adsorbing it through the suction plate 52. Then, drive the suction plate 52 to move upward to the required height through the vertical movement module 4. Subsequently, control the horizontal movement module 2 to drive the detection end of the flying probe testing mechanism 3 to detect the circuit board. After the circuit board detection is completed, drive the suction plate 52 to move downward to reset through the vertical movement module 4. Then, control the air pump 51 to stop working, and the suction plate 52 no longer adsorbs the circuit board. Subsequently, the detected circuit board can be removed, and a new circuit board can be replaced. Repeat the above operations to continue the monitoring.

[0035] Embodiment 2: On the basis of Embodiment 1, as Figure 5 and Figure 6 shown, it further includes a top material component 6. A top material component 6 is arranged on the suction plate 52. The top material component 6 includes a lifting frame 61, a placing hole plate 62, a limiting plate 63, a guide rod 64 and a spring I 65. The lifting frame 61 is vertically slidably arranged on the edge of the suction plate 52. A placing hole plate 62 is fixedly connected between the tops of the lifting frames 61 by bolts. The placing hole plate 62 is above the suction plate 52. A limiting plate 63 is fixedly connected to the outer shell 1 below the lifting frame 61 by bolts. In the initial state, the bottom of the lifting frame 61 contacts the top of the limiting plate 63. Guide rods 64 are vertically arranged at four corner positions at the bottom of the suction plate 52. The lifting frame 61 is slidably connected with the guide rods 64. A spring I 65 is connected between the lifting frame 61 and the suction plate 52.

[0036] When it is necessary to detect the circuit board, place the circuit board to be detected above the placing hole plate 62. When the vertical movement module 4 drives the suction plate 52 to move upward, the bottom of the lifting frame 61 is no longer restricted by the limiting plate 63. The lifting frame 61 moves downward under the action of its own gravity and the reset of the spring I 65, driving the placing hole plate 62 to move downward. The bottom of the placing hole plate 62 fits with the suction plate 52. Subsequently, the air pump 51 can be controlled to start working to adsorb the circuit board. After the circuit board detection is completed, drive the suction plate 52 to move downward through the vertical movement module 4, thereby driving the lifting frame 61 to move downward. When the lifting frame 61 moves downward to contact the limiting plate 63, it pushes the lifting frame 61 to move upward, thereby driving the placing hole plate 62 to move upward. The spring I 65 is compressed, and the placing hole plate 62 moves upward and separates from the suction plate 52, so that the adsorbed circuit board is automatically released. Subsequently, the detected circuit board can be removed, and a new circuit board can be replaced to repeat the above steps to continue the detection.

[0037] As Figure 7 and Figure 8As shown in the figure, it further includes a side limiting component 7. The side limiting component 7 is arranged on the placement hole plate 62. The side limiting component 7 includes a track 72, a slider 73, a sliding shaft 74, a spring II 75, a clamping plate 76 and a tension spring 77. Four inclined slots 71 are formed on the adsorption plate 52. The inclined slots 71 are combined into a cross. The depth of the inclined slots 71 increases from the outside to the inside. The track 72 is embedded on the placement hole plate 62 above the inclined slots 71. The slider 73 is slidably connected in the track 72. A sliding shaft 74 is arranged on one side of the slider 73 facing the inclined slots 71. The sliding shaft 74 can rotate on the slider 73. The sliding shaft 74 is above the inclined slots 71. A spring II 75 is connected between the slider 73 and the track 72. The clamping plate 76 is slidably connected to the slider 73. The clamping plate 76 is also slidably connected to the track 72. A tension spring 77 is connected between the clamping plate 76 and the slider 73. The inner side of the clamping plate 76 is an inclined surface that slopes downward.

[0038] After the circuit board is placed above the placement hole plate 62, when the vertical moving module 4 drives the adsorption plate 52 to move upward, at this time the placement hole plate 62 moves downward, so that the sliding shaft 74 contacts the surface of the inclined slot 71. At this time, under the action of the downward extrusion force of the placement hole plate 62 on the sliding shaft 74, the sliding shaft 74 moves closer to the middle, driving the slider 73 and the clamping plate 76 to move closer to the middle. The spring II 75 is stretched. When the clamping plate 76 moves inward to contact the circuit board above the placement hole plate 62, the clamping plate 76 pushes the circuit board toward the middle. When the circuit board returns to the middle and cannot move, the clamping plate 76 stops moving. At this time, if the placement hole plate 62 has not reached the lowest position, the slider 73 continues to move inward, and the tension spring 77 is pulled. The slider 73 does not limit the downward movement of the placement hole plate 62. In this way, when detecting the circuit board, because the clamping plate 76 limits the circuit board in four directions, the circuit board will not be displaced during the detection process. At the same time, the slider 73 does not limit the downward movement of the placement hole plate 62, so that the clamping plate 76 can be used to fix circuit boards of different sizes, and the equipment has strong versatility. After the circuit board detection is completed, when the placement hole plate 62 moves downward to reset, under the reset action of the spring II 75 and the tension spring 77, the slider 73 and the clamping plate 76 are driven to reset.

[0039] As Figure 9 and Figure 10 As shown in the figure, it further includes an air hole blocking component 8. The air hole blocking component 8 is arranged in the holes of the placement hole plate 62. The air hole blocking component 8 includes a blocking block 81, a spring III 82 and a cushion block 83. The blocking block 81 is slidably arranged below the holes on the placement hole plate 62. The lower part of the blocking block 81 is frustum-shaped. A spring III 82 is connected between the blocking block 81 and the placement hole plate 62. A hemispherical cushion block 83 is arranged at the top of the blocking block 81.

[0040] When detecting the circuit board, place the circuit board above the spacer block 83. When the inclined surface of the clamping plate 76 contacts the circumference of the circuit board, push the circuit board downward, thereby driving the blocking block 81 downward, stretching the spring III 82. The blocking block 81 moves downward and no longer blocks the holes on the placement orifice plate 62. At this time, the unblocked holes can conduct air, so that the circuit board is fixed. The other blocked holes cannot conduct air, so that the gas will not be released through other hole positions, and the circuit board can be better fixed.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A testing device for printed circuit boards of various sizes, comprising a housing (1), a horizontal moving module (2), a flying probe test mechanism (3), a vertical moving module (4) and an adsorption component (5), wherein the housing (1) is provided with a horizontal moving module (2) on the upper part thereof, the flying probe test mechanism (3) being provided on the horizontal moving module (2), the horizontal moving module (2) being capable of driving a test end of the flying probe test mechanism (3) to move in the directions of the X-axis and the Y-axis, the housing (1) is provided with a vertical moving module (4) on the rear side thereof, the vertical moving module (4) being provided with an adsorption component (5), the vertical moving module (4) being used for driving the adsorption component (5) to move in the direction of the Z-axis, and characterized in that: The adsorption assembly (5) comprises an air pump (51), an adsorption plate (52) and an air pipe (53); the air pump (51) is fixedly connected to the lower rear side of the housing (1) by bolts; the adsorption plate (52) is connected to the slider (73) of the vertical moving module (4); the adsorption plate (52) and the air pipe (53) are connected between the adsorption plate (52) and the air pump (51); and the adsorption assembly (6) is also included; the adsorption plate (52) is provided with the adsorption assembly (6); the adsorption assembly (6) comprises a lifting frame (61), a placement hole plate (62) and a limit plate (63); the edge of the adsorption plate (52) is slidably provided with the lifting frame (61) 1), a placement orifice plate (62) is fixedly connected between the top of the lifting frame (61), the placement orifice plate (62) is above the adsorption plate (52), a limit plate (63) is fixedly connected to the shell (1) below the lifting frame (61), and the bottom of the lifting frame (61) is in contact with the top of the limit plate (63); the lifting assembly (6) also includes a guide rod (64) and a spring I (65), the guide rods (64) are vertically arranged at the four corners of the bottom of the adsorption plate (52), the lifting frame (61) is slidably connected to the guide rods (64), and the lifting frame (61) and the adsorption plate (52) are connected with a spring I (65).

2. A testing device for printed circuit boards of multiple sizes according to claim 1, characterized in that: The horizontal movement module (2) is composed of an X-axis module and a Y-axis module.

3. The testing device for printed circuit boards of various sizes according to claim 1, characterized in that: The device also includes a side limit assembly (7), wherein the side limit assembly (7) is arranged on the placement hole plate (62), and the side limit assembly (7) includes a track (72), a slider (73), a sliding shaft (74), a spring II (75), a clamping plate (76) and a tension spring (77). Four inclined grooves (71) are provided on the adsorption plate (52), and a track (72) is embedded on the placement hole plate (62) above the inclined groove (71). The track (72) is slidably connected with the slider (73), and a sliding shaft (74) is arranged on the side of the slider (73) facing the inclined groove (71). The sliding shaft (74) is above the inclined groove (71), and a spring II (75) is connected between the slider (73) and the track (72). A clamping plate (76) is slidably connected to the slider (73), and the clamping plate (76) is slidably connected to the track (72). A tension spring (77) is connected between the clamping plate (76) and the slider (73).

4. The testing device for printed circuit boards of multiple sizes according to claim 3, characterized in that: The oblique grooves (71) are combined into a cross, and the depth of the oblique grooves (71) increases from the outside to the inside.

5. The testing device for printed circuit boards of multiple sizes according to claim 4, characterized in that: The inner side surface of the clamping plate (76) is a downwardly inclined inclined surface.

6. The testing device for printed circuit boards of various sizes according to claim 5, characterized in that: The device also includes an air hole plugging component (8), the air hole plugging component (8) is arranged in the hole of the placement orifice plate (62), the air hole plugging component (8) includes a blocking block (81) and a spring III (82), the blocking block (81) is slidably arranged below the upper hole of the placement orifice plate (62), and the spring III (82) is connected between the blocking block (81) and the placement orifice plate (62).

7. The testing device for printed circuit boards of multiple sizes according to claim 6, characterized in that: The air hole blocking assembly (8) further comprises a cushion block (83), and a hemispherical cushion block (83) is arranged on the top of the blocking block (81).

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