Internal heat dissipation structure of computer host

Abstract

The application discloses a computer host internal heat dissipation structure, which comprises a case, a mainboard part in the case, a CPU part and a display card part on the mainboard part, a temperature insulation plate installed on the top of the case, a semiconductor refrigeration sheet arranged at the end of the case, a cold end of the semiconductor refrigeration sheet faces inwards, a hot end of the semiconductor refrigeration sheet faces upwards, a double-circulation shunt heat dissipation structure is arranged at the cold end of the semiconductor refrigeration sheet, and the double-circulation shunt heat dissipation structure guides air exchange between the inside and the outside of the case. The heat dissipation structure is simple in design, can efficiently absorb and discharge internal heat in a double-circulation mode, reduces the temperature of the case, ensures stable operation of the system, realizes centralized cooling through optimized pipeline design, effectively prevents heat loss through the heat insulation interlayer, improves overall heat dissipation efficiency, in addition, humidity isolation structure and a waterproof and breathable membrane provide additional waterproof protection, prevent water droplets from flowing out during the cooling process, ensure safe operation of the system in the environment, avoid damage of electronic components, and the design improves the efficiency, safety and reliability of the heat dissipation system, and ensures stable and efficient operation of the computer host in various working environments.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computer heat dissipation, in particular to a computer mainboard internal heat dissipation structure. BACKGROUND

[0002] With the rapid development of information technology, the popularity of computers in various application scenarios has significantly increased, from personal users to enterprise data centers, computer mainboards have become indispensable core devices. In high-performance computing and complex task processing, the working frequency and load of key components such as central processing units (CPUs) and graphics processing units (GPUs) continue to increase, resulting in a large amount of heat. When these components perform complex calculations and process large amounts of data, electrical energy is converted into heat energy, causing their working temperature to rise significantly. Excessive temperature not only causes CPU and GPU to automatically reduce frequency (i.e., performance degradation), affecting the computing speed and response capability of the computer, but also can cause aging and failure of electronic components, shortening the service life of the device.

[0003] The existing computer heat dissipation methods mainly include fan cooling and water cooling. Fan cooling, as the most common cooling method, relies on the flow of air to carry away heat by high-speed rotating fans to expel hot air inside the case. However, fan cooling is often limited in efficiency under high heat load, and multiple fan mounting points need to be set up inside the case, and the installation position needs to be matched with the type and position of the graphics card and fan, which increases the complexity and cost of installation. In addition, the fan directly expels air outward, and the large internal space of the case makes the hot air discharge slow, which limits the heat dissipation effect, and the noise generated by the fan during operation also affects the user experience.

[0004] In contrast, the water cooling system efficiently transfers heat to the radiator and expels it through the high specific heat capacity of the liquid. However, the traditional water cooling system has a complex structure and requires professional skills during installation, especially for high-end graphics card water cooling, which requires disassembly of the graphics card, increasing the difficulty and time of installation. In addition, the water cooling system has the risk of liquid leakage, which may cause serious damage to high-end graphics cards and other electronic components, making it not worth the cost. Therefore, the existing heat dissipation methods still have many shortcomings in efficiency, reliability, and safety, and a new heat dissipation structure is needed to solve the above problems and improve the heat dissipation performance and system stability of the computer mainboard. SUMMARY

[0005] The present application aims to provide a computer mainboard internal heat dissipation structure to solve the problems raised in the background.

[0006] In order to achieve the above object, the present application provides the following technical scheme: a computer host internal heat dissipation structure, comprising a case; a mainboard part inside the case; and a CPU part and a graphics card part on the mainboard part, a temperature insulation plate is arranged on the top of the case, a semiconductor refrigeration fin is arranged at the end of the temperature insulation plate, the semiconductor refrigeration fin has a cold end and a hot end, the cold end of the semiconductor refrigeration fin faces the inside of the case, the hot end of the semiconductor refrigeration fin faces the top of the case, a double-circulation shunt heat dissipation structure for guiding air exchange between the inside of the case and the outside is arranged outside the cold end of the semiconductor refrigeration fin;

[0007] The double-circulation shunt heat dissipation structure comprises:

[0008] A cooling frame is arranged outside the cold end of the semiconductor refrigeration fin, an inlet and two outlets are formed in the cooling frame, the inlet of the cooling frame faces the mainboard part, the cooling frame is arranged at the lower end of the temperature insulation plate, a first heat conductor is arranged at the bottom of the cold end of the semiconductor refrigeration fin, and the first heat conductor has a plurality of fins;

[0009] A temperature insulation arc-shaped plate is arranged at the inlet end of the cooling frame, and the temperature insulation arc-shaped plate is used for reducing the effective area of the inlet of the cooling frame;

[0010] A first temperature guide plate is arranged at the end of the temperature insulation arc-shaped plate;

[0011] A second temperature guide plate is arranged on the inner side surface of the temperature insulation arc-shaped plate;

[0012] A third temperature guide plate is arranged between the first temperature guide plate and the second temperature guide plate, and the distance between the first temperature guide plate, the second temperature guide plate and the third temperature guide plate is equal, a guide part is arranged on the lower end surface of the third temperature guide plate, the guide part is used for guiding air shunt to the two outlets of the cooling frame, the first temperature guide plate, the second temperature guide plate and the third temperature guide plate all have an inclination angle of 1-5 degrees, and the first temperature guide plate, the second temperature guide plate and the third temperature guide plate are arranged in an interlaced arrangement mode with the fins of the first heat conductor;

[0013] An external exhaust pipe group is arranged at the two outlet ends of the cooling frame.

[0014] Preferably, the external exhaust pipe group comprises:

[0015] Two special-shaped adapter pipes are arranged at the two outlet ends of the cooling frame respectively;

[0016] A first external exhaust pipe is connected with one of the special-shaped adapter pipes, and a first side opening for accommodating the CPU part is formed in the side surface of the first external exhaust pipe;

[0017] The second outer discharge pipe is connected with another special-shaped adapter pipe, and a second side opening for accommodating a part of the display card is formed in the side surface of the second outer discharge pipe.

[0018] Preferably, the cooling frame is further provided with a humidity isolation structure.

[0019] The humidity isolation structure comprises:

[0020] The first waterproof and breathable membrane is arranged at the inlet end of the cooling frame and located outside the temperature insulation arc-shaped plate.

[0021] The fixed ring plate is arranged in the two outlet ends of the cooling frame, an annular flow groove is formed in the upper end surface of the fixed ring plate, the bottom of the annular flow groove is provided with an opening, an annular fixed groove is formed in the inner side of the annular flow groove, a raised mesh plate is arranged in the inner side of the annular fixed groove, a second waterproof and breathable membrane is arranged on the upper end surface of the raised mesh plate, and the edge of the second waterproof and breathable membrane is arranged in the annular fixed groove.

[0022] The fixed ring is pressed on the part of the second waterproof and breathable membrane located in the annular fixed groove.

[0023] The collection bottle is arranged between the two outlet ends of the cooling frame and located at the lower end of the annular flow groove, two connecting pipes are arranged at the top of the collection bottle, the connecting pipes are used for communication between the annular flow groove and the collection bottle, the collection bottle is open at the bottom, and a bottle cap is threadedly connected to the bottom of the collection bottle.

[0024] The flow-increasing fan is arranged at the lower end of the fixed ring plate.

[0025] Preferably, the hot end of the semiconductor refrigeration piece is provided with a water cooling structure.

[0026] The water cooling structure comprises:

[0027] The second heat conductor is arranged in close contact with the hot end of the semiconductor refrigeration piece, the second heat conductor is provided with a plurality of arc-shaped fins, and a centrifugal impeller is rotatably arranged in the central part of the arc-shaped fins of the second heat conductor.

[0028] The water cooling shell is arranged outside the second heat conductor, the water cooling shell is filled with cooling liquid, and the water cooling shell is divided into an exhaust part and an intake part by arranging a partition plate.

[0029] The driving motor is fixedly arranged on the water cooling shell, and the output end of the driving motor is connected with the centrifugal impeller.

[0030] A cold row mechanism is arranged inside the water-cooled shell and at the opposite end of the second heat conductor, and is used to lead out the heat of the cooling liquid.

[0031] Preferably, the cold row mechanism comprises:

[0032] A cold row body is arranged at the opposite end of the second heat conductor, and a part of the cold row body is arranged inside the water-cooled shell and another part is arranged outside the water-cooled shell.

[0033] A cooling fan is fixedly arranged at the upper end of the cold row body outside the water-cooled shell.

[0034] Preferably, the outer row pipe group is provided with a support assembly on the outer side.

[0035] The support assembly comprises:

[0036] A plurality of movable vertical rods are fixedly arranged at the lower end of the temperature insulation plate, and the side surface of the movable vertical rod is fixedly connected with the first outer row pipe and the second outer row pipe through a fixed rod, and the bottom of the movable vertical rod is provided with a pulley.

[0037] A plurality of movable plates are arranged at the bottom of the case, and the movable plates are movably connected with the pulleys through the sliding grooves.

[0038] Preferably, the upper end of the mainboard part is provided with a positioning block, the lower end surface of the positioning block is provided with a convex part, and the upper end surface of the temperature insulation plate is provided with a concave part matched with the convex part.

[0039] Preferably, the inner side walls of the first outer row pipe, the second outer row pipe and the cooling frame are all provided with a thermal insulation interlayer.

[0040] Compared with the prior art, the beneficial effects of the present application are:

[0041] The internal heat dissipation structure of the computer host can effectively absorb heat from the inside of the host and discharge the cooled heat, thereby significantly reducing the temperature inside the case and ensuring efficient and stable operation of the computer host. The structure rapidly absorbs and cools the heat generated by the mainboard part through air circulation inside the cooling frame, and then concentrates the cooled air to the radiators of the CPU part and the graphics card part, thereby achieving efficient heat transfer and discharge and maintaining the system working in an appropriate temperature range.

[0042] The computer host internal heat dissipation structure realizes concentrated cooling by optimizing pipeline design, avoids the interaction of the temperature difference between the inside and outside of the pipeline, improves the overall heat dissipation efficiency, the double-circulation shunt heat dissipation structure of the cooling frame body ensures that the cooled air is accurately delivered to the target heat dissipation component through two outer discharge pipes, meanwhile, the setting of the heat preservation interlayer effectively isolates the heat loss of the refrigerated air during the transmission process, reduces the interaction of the temperature difference between the inside and outside air, and further improves the energy efficiency and stability of the heat dissipation system;

[0043] The computer host internal heat dissipation structure is provided with humidity isolation structure and waterproof breathable membrane, which provides additional waterproof design guarantee, ensures the safety of the system during the cooling process, the humidity isolation structure includes waterproof breathable membrane, combined with the collection bottle and the flow increasing fan, effectively prevents the outflow of condensation water drops generated during the cooling process, guarantees the safe operation of the system in high humidity environment, avoids the risk of damage to electronic components caused by water droplet leakage. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 It is a schematic diagram of the internal structure of the case of the application;

[0045] Figure 2 It is a schematic diagram of the overall structure of the heat dissipation structure of the application;

[0046] Figure 3 It is a schematic diagram of the air circulation flow direction of the heat dissipation mechanism in the case;

[0047] Figure 4 It is a schematic diagram of the structure of the first outer discharge pipe of the application;

[0048] Figure 5 It is a schematic diagram of the structure of the second outer discharge pipe of the application;

[0049] Figure 6 It is a schematic diagram of the internal structure of the cold and hot ends of the temperature isolation plate of the application;

[0050] Figure 7 It is an enlarged view of A of the application;

[0051] Figure 8 It is a schematic diagram of the air flow direction in the cooling frame body of the application;

[0052] Figure 9 It is a sectional view of A-A of the application;

[0053] Figure 10 It is a comparison diagram of the first heat conductor and the second heat conductor of the application;

[0054] Figure 11 It is a schematic diagram of the structure of the fixed ring plate part of the application;

[0055] Figure 12 is a top view of the present application;

[0056] Figure 13 is a schematic diagram of a centrifugal impeller part structure of the present application.

[0057] In the figure: 1, case; 2, mainboard part; 3, CPU part; 4, display card part; 5, temperature insulation plate; 6, semiconductor refrigeration sheet; 7, double circulation shunt heat dissipation structure; 701, cooling frame body; 702, first heat conductor; 703, temperature insulation arc plate; 704, first temperature conducting plate; 705, second temperature conducting plate; 706, third temperature conducting plate; 7061, guide part; 707, external exhaust pipe group; 7071, special-shaped adapter pipe; 7072, first external exhaust pipe; 7073, first side port; 7074, second external exhaust pipe; 7075, second side port; 8, humidity isolation structure; 801, first waterproof air-permeable film; 802, fixed ring plate; 803, circulating groove; 804, annular fixed groove; 805, raised mesh plate; 806, second waterproof air-permeable film; 807, fixed ring; 808, collection bottle; 809, connecting pipe; 810, bottle cap; 811, flow-increasing fan; 9, water cooling structure; 901, second heat conductor; 902, centrifugal impeller; 903, water cooling shell; 904, partition plate; 905, driving motor; 906, cooling mechanism; 9061, cooling body; 9062, heat dissipation fan; 10, support assembly; 1001, movable vertical rod; 1002, pulley; 1003, movable plate; 11, positioning block; 12, convex part; 13, concave part; 14, thermal insulation interlayer. DETAILED DESCRIPTION

[0058] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0059] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0060] In the description of the present patent, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "setting" should be understood in a broad sense, for example, can be fixedly connected, set, or detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meaning of the above terms in the present patent can be understood according to the specific circumstances.

[0061] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise explicitly specified and limited. Embodiments

[0062] Please refer to Figures 1-13 As shown in the drawings, the present application provides a kind of computer host internal heat dissipation structure technical scheme: a kind of computer host internal heat dissipation structure, including case 1;The mainboard part 2 in case 1 interior;And CPU part 3 and video card part 4 on mainboard part 2, the top of case 1 is equipped with temperature insulation plate 5, temperature insulation plate 5 end is equipped with semiconductor refrigeration piece 6, semiconductor refrigeration piece 6 has cold end face and hot end face, the cold end face of semiconductor refrigeration piece 6 faces the inside of case 1, the hot end face of semiconductor refrigeration piece 6 faces the top of case 1, the double circulation shunt heat dissipation structure 7 for guiding the mutual exchange of air in case 1 and outside is installed on the cold end outside of semiconductor refrigeration piece 6;

[0063] The double circulation shunt heat dissipation structure 7 comprises a cooling frame 701, a temperature insulation arc-shaped plate 703, a first temperature guide plate 704, a second temperature guide plate 705, a third temperature guide plate 706, and an external exhaust pipe group 707. The cooling frame 701 is provided with an inlet and two outlets. The inlet of the cooling frame 701 is directed to the mainboard part 2. The cooling frame 701 is fixedly installed at the lower end of the temperature insulation plate 5 and located outside the cold end of the semiconductor refrigeration sheet 6. The first heat conductor 702 is installed on the bottom of the cold end of the semiconductor refrigeration sheet 6 after being coated with silicone grease. The first heat conductor 702 is provided with a plurality of fins. The temperature insulation arc-shaped plate 703 is installed at the inlet end of the cooling frame 701. The first temperature guide plate 704 is connected to the end of the temperature insulation arc-shaped plate 703. The second temperature guide plate 705 is connected to the inner side of the temperature insulation arc-shaped plate 703. The third temperature guide plate 706 is located between the first temperature guide plate 704 and the second temperature guide plate 705 and has the same spacing as the first temperature guide plate 704 and the second temperature guide plate 705. The lower end surface of the third temperature guide plate 706 is designed with a guide part 7061. The first temperature guide plate 704, the second temperature guide plate 705, and the third temperature guide plate 706 are all provided with a downward inclination angle of 1-5 degrees. The first temperature guide plate 704, the second temperature guide plate 705, and the third temperature guide plate 706 are arranged in an interleaved manner with the fins of the first heat conductor 702. The external exhaust pipe group 707 is installed at the two outlet ends of the cooling frame 701.

[0064] In the embodiment, the temperature insulation arc-shaped plate 703 is used to reduce the effective area of the inlet of the cooling frame 701, thereby increasing the air flow speed and reducing the condensation phenomenon when cold and hot air interact. The specific structure of the guide part 7061 is shown in Figure 7 , which comprises a downward inclined baffle located at the upper end of the middle position between the two outlets of the cooling frame 701, used for guiding and shunting the air to the two outlets of the cooling frame 701. The temperature insulation arc-shaped plate 703 is a PVC plate, and the temperature guide plate is copper.

[0065] During the normal working process of the computer host, the heat of the mainboard part 2 will be sucked into the cooling frame 701 by the fans of the graphics card and the CPU heat sink, and then cooled. As Figure 8As shown, the air sucked from the mainboard part 2 will immediately pass through the temperature insulation arc-shaped plate 703 after entering the cooling frame 701, and then enter the inside of the cooling frame 701, and then flow downward along the extension direction of the first temperature guide plate 704, and then flow upward along the direction of the third temperature guide plate 706, and then flow downward again along the direction of the second temperature guide plate 705. Finally, under the guidance of the guide part 7061 at the lower end of the third temperature guide plate 706, the air is discharged from the two outlets of the cooling frame 701, enters the exhaust pipe group 707, and is specially used to cool the CPU part 3 and the graphics card part 4, and finally is discharged from the case 1. Due to the exhaust of the internal air, external air will also enter the inside of the case 1, further provide cooling, form a cycle, and reduce the temperature inside the case 1.

[0066] The exhaust pipe group 707 includes two special-shaped adapter pipes 7071, a first exhaust pipe 7072, a second exhaust pipe 7074, and the like. The two special-shaped adapter pipes 7071 are respectively installed at the two outlet ends of the cooling frame 701, the first exhaust pipe 7072 is connected with one of the special-shaped adapter pipes 7071, the side surface of the first exhaust pipe 7072 is provided with a first side opening 7073 for accommodating the CPU part 3, and the second exhaust pipe 7074 is connected with the other special-shaped adapter pipe 7071. The side surface of the second exhaust pipe 7074 is provided with a second side opening 7075 for accommodating the graphics card part 4.

[0067] In this embodiment, the first exhaust pipe 7072 and the second exhaust pipe 7074 provide a cooling path for the flow of the cooled air, and the graphics card and the CPU radiator are both built-in in the two exhaust pipes, which can avoid the outflow of cold air, provide more efficient and concentrated cooling effect, and avoid the accumulation of heat discharged from the graphics card (with a cooling part) and the CPU radiator inside the case 1.

[0068] The cooling frame 701 is provided with a humidity isolation structure 8, which includes a first waterproof and breathable membrane 801, a fixed ring plate 802, a fixed ring 807, a collection bottle 808, and a flow-increasing fan 811. The first waterproof and breathable membrane 801 is installed at the inlet end of the cooling frame 701 and located outside the temperature insulation arc-shaped plate 703. The fixed ring plate 802 is arranged at the two outlet ends of the cooling frame 701. An annular flow groove 803 is formed in the upper end surface of the fixed ring plate 802, and the bottom of the annular flow groove 803 is provided with an opening. An annular fixed groove 804 is formed in the inner side of the annular flow groove 803, and a raised mesh plate 805 is arranged in the inner side of the annular fixed groove 804. A second waterproof and breathable membrane 806 is arranged on the upper end surface of the raised mesh plate 805, and the edge portion of the second waterproof and breathable membrane 806 is arranged in the annular fixed groove 804. The fixed ring 807 is pressed on the portion of the second waterproof and breathable membrane 806 located in the annular fixed groove 804. The collection bottle 808 is arranged between the two outlet ends of the cooling frame 701 and located at the lower end of the annular flow groove 803. Two connecting pipes 809 are arranged at the top of the collection bottle 808. The collection bottle 808 is of an open bottom type, and a bottle cap 810 is threadedly connected to the bottom of the collection bottle 808. The flow-increasing fan 811 is arranged at the lower end of the fixed ring plate 802.

[0069] In this embodiment, the waterproof and breathable membrane is a polytetrafluoroethylene microporous membrane (i.e., an ePTFE membrane), which can further limit the outflow of internal condensation water droplets while ensuring normal gas flow.

[0070] During normal air flow, the narrow opening design of the inlet portion of the cooling frame 701 can prevent water droplets from condensing there. The first waterproof and breathable membrane 801 is used to provide further waterproof protection to improve safety. After the air passes through the temperature insulation arc-shaped plate 703, the space becomes larger and the gas flow rate slows down. Water droplets may condense on the inner side wall of the cooling frame 701. Due to the inclined design of the temperature guide plate, the condensed water droplets will flow downward along the temperature guide plate. If the condensed water is located at the bottom of the third temperature guide plate 706, since the third temperature guide plate 706 has a small curvature and the operation of the flow-increasing fan 811 will generate a low-pressure area in the direction of air flow, the water will be attracted to the outlet end of the cooling frame 701, ensuring the flow of air. After that, the condensed water will reach the second temperature guide plate 705 and flow into the annular flow groove 803 under the guidance of the second temperature guide plate 705. Finally, the condensed water will flow into the collection bottle 808 through the connecting pipes 809. On the other hand, the refrigerated air will pass through the second waterproof and breathable membrane 806 to further concentrate the heat dissipation of the graphics card and the CPU radiator.

[0071] The hot end face of the semiconductor refrigeration piece 6 is provided with a water cooling structure 9, which comprises a second heat conductor 901, a water cooling shell 903, a driving motor 905, a cooling mechanism 906 and the like. The second heat conductor 901 is installed on the hot end face of the semiconductor refrigeration piece 6 after being coated with silicon grease on the bottom face, and is provided with a plurality of arc-shaped fins. A centrifugal impeller 902 is rotationally arranged at the center part of the arc-shaped fins of the second heat conductor 901. The water cooling shell 903 is bolted to the outside of the second heat conductor 901, and is filled with cooling liquid. The inside of the water cooling shell 903 is divided into an exhaust part and an intake part by a partition plate 904. The driving motor 905 is fixedly installed on the water cooling shell 903, and the output end of the driving motor 905 is connected with the centrifugal impeller 902. The cooling mechanism 906 is installed inside the water cooling shell 903 and located at the opposite end of the second heat conductor 901, and is used for leading out the heat of the cooling liquid.

[0072] In the working process of the semiconductor refrigeration piece 6, the heat is led out to the cooling liquid through the second heat conductor 901. In this embodiment, the arc-shaped fins can not only provide a larger surface area to improve the heat dissipation efficiency, but also can guide the cooling liquid to flow more uniformly, reduce the turbulence and dead angle, and enhance the heat exchange effect. In addition, a water retaining frame can be further arranged outside the water cooling shell 903 to further improve the waterproof safety. Meanwhile, the fixed parts of the first heat conductor 702 and the second heat conductor 901 can be staggered to avoid contact, so as to ensure the working efficiency.

[0073] In the heat dissipation of the hot end face, the heat is led out to the cooling liquid through the second heat conductor 901, the driving motor 905 drives the centrifugal impeller 902 to rotate and push the flow of the cooling liquid, and the cooling liquid containing heat is taken away. Next, the cooling liquid will be cooled down under the heat dissipation of the cooling mechanism 906. New cooling liquid will enter the centrifugal impeller 902 and pass through the fin part of the second heat conductor 901 again to take away the heat, so as to circulate. In the whole process, the partition plate 904 separates the cooling liquid with different flow directions to reduce the heat loss and ensure that the cooling water entering the centrifugal impeller 902 can more effectively absorb and take away the heat.

[0074] The cooling mechanism 906 comprises a cooling body 9061 and a heat dissipation fan 9062. The cooling body 9061 is installed at the opposite end of the second heat conductor 901, and a part of the cooling body 9061 is located inside the water cooling shell 903 and the other part is located outside the water cooling shell 903. The heat dissipation fan 9062 is fixedly installed at the upper end of the cooling body 9061 located outside the water cooling shell 903.

[0075] During the cooling process of the cooling water, the cooling row body 9061 is responsible for conducting heat out. At the same time, the cooling fan 9062 located at the upper end of the cooling row body 9061 continuously cools the cooling row body 9061, thereby achieving an effective cooling effect.

[0076] The outer side of the outer row pipe group 707 is provided with a support assembly 10, which includes a plurality of movable vertical rods 1001, a plurality of movable plates 1003, etc. The movable vertical rods 1001 are fixedly installed at the lower end of the heat insulation plate 5, and the side surfaces of the movable vertical rods 1001 are fixedly connected with the first outer row pipe 7072 and the second outer row pipe 7074 through fixing rods, respectively. The bottom of the movable vertical rod 1001 is provided with a pulley 1002, and the movable plate 1003 is arranged at the bottom of the case 1. The movable plate 1003 is movably connected with the pulley 1002 through a sliding groove formed therein.

[0077] In this embodiment, the movable vertical rod 1001 not only provides support for the heat insulation plate 5 and the components thereon, but also provides additional fixing effect for the first outer row pipe 7072 and the second outer row pipe 7074, thereby reducing the shaking during air circulation. The pulley 1002 at the bottom of the movable vertical rod 1001 and the movable plate 1003 can provide path guidance for the movement of the structure, thereby avoiding collision with other computer components during disassembly. In addition, during installation, gaskets can be attached to both sides of the heat insulation plate 5 to achieve more stable fixing effect.

[0078] The upper end of the mainboard part 2 is fixedly provided with a positioning block 11, and the lower end surface of the positioning block 11 is designed with a convex part 12. The upper end surface of the heat insulation plate 5 is provided with a concave part 13 matched with the convex part 12. This design can quickly align the upper end part during installation, shorten the installation time, and improve the installation efficiency.

[0079] The inner side walls of the first outer row pipe 7072, the second outer row pipe 7074 and the cooling frame 701 are filled with a thermal insulation layer 14. The thermal insulation layer 14 can isolate the heat loss of the refrigerated air during transmission to the outside environment, ensure that the cold air can be efficiently transmitted to the target graphics card and CPU heat sink, and improve the overall heat dissipation performance. In addition, the thermal insulation layer 14 can also effectively reduce the noise generated during operation of the cooling system, thereby improving the user experience.

[0080] The working principle of the present application is as follows:

[0081] The computer host internal heat dissipation structure of the embodiment absorbs the heat generated by the mainboard part 2 into the cooling frame body 701 for cooling. The cooling frame body 701 effectively removes heat from the air through the double-circulation shunt heat dissipation structure 7, and the cooled air is then directed to the heat sinks of the CPU part 3 and the graphics card part 4 to ensure that these key components are fully cooled. The air that has absorbed heat through the heat sinks is discharged from the case 1 through the exhaust pipe group 707, forming a continuous air circulation to continuously reduce the temperature inside the case, maintaining the efficient and stable operation of the computer host. At the same time, the design of the heat insulation interlayer 14 and the humidity isolation structure 8 effectively isolates the loss of heat and the outflow of water droplets, further improving the efficiency and safety of the heat dissipation system. The support assembly 10 ensures that the exhaust pipe group 707 operates stably during air circulation, reducing vibration and ensuring the overall stability of the system. The design of the positioning block 11, the convex part 12 and the concave part 13 simplifies the installation process of the heat insulation plate 5, improves the installation efficiency and the overall reliability of the structure. Through the synergistic effect of the water cooling structure 9 and the cooling mechanism 906, the heat of the semiconductor refrigeration sheet 6 is efficiently conducted and discharged, ensuring that key components such as CPUs and graphics cards maintain an appropriate temperature under high load operation, prolonging the service life of the equipment, improving overall performance, and ultimately achieving effective reduction of the temperature inside the case 1, ensuring the efficient and stable operation of the computer host.

[0082] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A computer host internal heat dissipation structure, comprising a chassis (1); a motherboard portion (2) inside the chassis (1); and a CPU portion (3) and a graphics card portion (4) on the motherboard portion (2), characterized in that: The top of the chassis (1) is provided with a thermal insulation plate (5), and the end of the thermal insulation plate (5) is provided with a semiconductor cooling plate (6), the semiconductor cooling plate (6) having a cold end and a hot end, the cold end of the semiconductor cooling plate (6) facing the inside of the chassis (1), and the hot end of the semiconductor cooling plate (6) facing the top of the chassis (1), and a double-circulation shunt heat dissipation structure (7) for guiding the exchange of air inside the chassis (1) and outside is provided on the outside of the cold end of the semiconductor cooling plate (6); The dual-circulation shunt heat dissipation structure (7) includes: A cooling frame (701), wherein the cooling frame (701) is provided with an inlet and two outlets, the inlet of the cooling frame (701) faces the main board portion (2), the cooling frame (701) is arranged at the lower end of the thermal insulation plate (5), and is located outside the cold end of the semiconductor refrigeration plate (6), and a first thermal conductor (702) is provided on the bottom of the cold end of the semiconductor refrigeration plate (6), and the first thermal conductor (702) has a plurality of fins; a heat-insulating arc-shaped plate (703), the heat-insulating arc-shaped plate (703) being arranged at the inlet end of the cooling frame (701), and the heat-insulating arc-shaped plate (703) being used to reduce the effective area of ​​the inlet of the cooling frame (701); a first heat conduction plate (704), the first heat conduction plate (704) being arranged at an end of the heat-insulating arc-shaped plate (703); a second heat conduction plate (705), the second heat conduction plate (705) being arranged on the inner side surface of the heat-insulating arc-shaped plate (703); a third heat conducting plate (706), the third heat conducting plate (706) being arranged between the first heat conducting plate (704) and the second heat conducting plate (705), and being at an equal distance from the first heat conducting plate (704) and the second heat conducting plate (705); a guide portion (7061) being provided on the lower end surface of the third heat conducting plate (706); the guide portion (7061) being used to guide air flow to the two outlets of the cooling frame (701); the first heat conducting plate (704), the second heat conducting plate (705) and the third heat conducting plate (706) all having an inclination angle of 1-5 degrees; the first heat conducting plate (704), the second heat conducting plate (705) and the third heat conducting plate (706) and the fins of the first heat conductor (702) are arranged in a staggered manner; An outer pipe group (707) is provided at two outlet ends of the cooling frame (701).

2. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: The outer pipe group (707) includes: Two special-shaped transfer tubes (7071), the special-shaped transfer tubes (7071) being respectively arranged at two outlet ends of the cooling frame (701); A first outer tube (7072), the first outer tube (7072) being connected to one of the special-shaped transfer tubes (7071), and a first side opening (7073) for accommodating the CPU portion (3) being provided on a side surface of the first outer tube (7072); A second outer tube (7074) is connected to another special-shaped adapter tube (7071), and a second side opening (7075) for accommodating the graphics card portion (4) is provided on the side of the second outer tube (7074).

3. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: The cooling frame (701) is further provided with a humidity isolation structure (8); The humidity isolation structure (8) comprises: a first waterproof and breathable membrane (801), the first waterproof and breathable membrane (801) being arranged at the inlet end of the cooling frame (701) and located outside the thermal insulation arc plate (703); A fixed ring plate (802), the fixed ring plate (802) being arranged in two outlets of the cooling frame (701), a circulation groove (803) being provided on the upper end surface of the fixed ring plate (802), the bottom of the circulation groove (803) being provided with an opening, an annular fixing groove (804) being provided on the inner side of the circulation groove (803), a raised mesh plate (805) being provided on the inner side of the annular fixing groove (804), a second waterproof and breathable membrane (806) being provided on the upper end surface of the raised mesh plate (805), and an edge of the second waterproof and breathable membrane (806) being placed in the annular fixing groove (804); a fixing ring (807), the fixing ring (807) being pressed onto the portion of the second waterproof breathable membrane (806) located in the annular fixing groove (804); A collecting bottle (808), the collecting bottle (808) being arranged between the two outlet ends of the cooling frame (701) and located at the lower end of the circulation trough (803); two connecting pipes (809) being arranged on the top of the collecting bottle (808); the connecting pipes (809) being used for communication between the circulation trough (803) and the collecting bottle (808); the collecting bottle (808) being open at the bottom; and a bottle cap (810) being threadedly connected to the bottom of the collecting bottle (808); A flow-increasing fan (811), wherein the flow-increasing fan (811) is arranged at the lower end of the fixed ring plate (802).

4. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: The hot end of the semiconductor refrigeration plate (6) is provided with a water cooling structure (9); The water cooling structure (9) includes: A second heat conductor (901), the second heat conductor (901) being attached to the hot end of the semiconductor refrigeration plate (6), the second heat conductor (901) having a plurality of arc-shaped fins, and a centrifugal impeller (902) being rotatably provided at the center of the arc-shaped fins of the second heat conductor (901); A water-cooling shell (903), the water-cooling shell (903) being arranged outside the second heat conductor (901), the interior of the water-cooling shell (903) being filled with coolant, and the interior of the water-cooling shell (903) being divided into a discharge portion and a discharge portion by a partition (904); A drive motor (905), wherein the drive motor (905) is fixedly mounted on the water-cooled housing (903), and an output end of the drive motor (905) is connected to the centrifugal impeller (902); A cold discharge mechanism (906) is provided inside the water-cooled housing (903) and is located at the opposite end of the second heat conductor (901). The cold discharge mechanism (906) is used to conduct heat from the cooling liquid.

5. The internal heat dissipation structure of a computer host according to claim 4, characterized in that: The cooling mechanism (906) includes: A cold row body (9061), the cold row body (9061) being arranged at an opposite end of the second heat conductor (901), a portion of the cold row body (9061) being located inside the water-cooling shell (903), and another portion being located outside the water-cooling shell (903); A cooling fan (9062) is fixedly arranged at the upper end of the radiator body (9061) outside the water-cooling shell (903).

6. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: A support assembly (10) is provided on the outside of the outer tube group (707); The support assembly (10) comprises: A plurality of movable vertical rods (1001), wherein the movable vertical rods (1001) are fixedly arranged at the lower end of the thermal insulation board (5), the side surfaces of the movable vertical rods (1001) are fixedly connected to the first outer tube (7072) and the second outer tube (7074) respectively through fixed rods, and a pulley (1002) is provided at the bottom of the movable vertical rods (1001); A plurality of movable plates (1003) are provided at the bottom of the chassis (1), and the movable plates (1003) are movably connected to the pulley (1002) by providing a sliding groove on the movable plates (1003).

7. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: A positioning block (11) is provided at the upper end of the mainboard portion (2), a convex portion (12) is provided at the lower end surface of the positioning block (11), and a concave portion (13) matching the convex portion (12) is provided at the upper end surface of the thermal insulation board (5).

8. The internal heat dissipation structure of a computer host according to claim 2, characterized in that: The first outer row of pipes (7072), the second outer row of pipes (7074), and the inner side wall of the cooling frame (701) are all provided with a thermal insulation interlayer (14).

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