Chip packaging device

Abstract

The invention relates to the technical field of chip packaging, in particular to a chip packaging device which comprises a base, a sliding structure is arranged above the base, an ejector rod structure is arranged on the sliding structure, a supporting frame is arranged on the base, a sliding rail structure is arranged on one side of the supporting frame, a suction cup structure is arranged on one side of the sliding rail structure, the ejector rod structure comprises a connecting table, and a connecting plate is arranged on the connecting table. A rapid heat dissipation structure is arranged on the top of the connecting plate and comprises a first motor, a lead screw is arranged at the output end of the first motor, two limiting grooves are formed in the connecting plate, sliding rails are arranged in the limiting grooves, a supporting plate is arranged on the sliding rails, an air suction opening is formed in the lower portion of the supporting plate, a protective frame is arranged on the supporting plate, an air suction pump is arranged on the supporting plate, and a protruding plate is fixed to the lower side of one end of the supporting plate. Threaded holes in threaded rotary connection with the lead screws are formed in the side faces of the protruding plates. According to the invention, the problem that the normal packaging of the chip is influenced if the heat is not dissipated in time due to the fact that heat dissipation is generally carried out through natural air cooling in the existing chip packaging is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging device. Background Art

[0002] Chip packaging is a crucial step in the semiconductor manufacturing process. It involves encapsulating the bare chip in a protective casing to protect the bare chip from physical and environmental damage and provide a connection method to the external circuit. In this process, the chip mounting, pin connection, and filling and curing of the packaging material will generate heat. If the generated heat is not dissipated in time, it will affect the normal packaging and use of the chip. Summary of the invention

[0003] The technical problem to be solved by the present invention is that the existing chip packaging generally dissipates heat through natural air cooling, but if the heat is not dissipated in time, it will affect the normal packaging of the chip.

[0004] To solve the above problems, the technical solution adopted by the present invention is a chip packaging device, including a base, a sliding structure is provided above the base, a push rod structure is provided above the sliding structure, a support frame is fixed on the upper side of the base near one end, a slide rail structure is provided on one side of the support frame, a suction cup structure is slidably provided on one side of the slide rail structure, the push rod structure includes a connecting platform, a connecting plate is fixed on the upper side of the connecting platform, a rapid heat dissipation structure is provided on the top of the connecting plate, the rapid heat dissipation structure includes a motor 1 fixed on one side of the connecting plate, a screw rod is fixed at the output end of the motor 1, two limiting grooves are provided on the upper side of the connecting plate, a slide rail is provided in the limiting sliding in the limiting groove, a support plate is fixed on the upper side of the slide rail, an exhaust port is provided on the lower side of the support plate, a protective frame is fixed on the upper side of the support plate at the exhaust port, an exhaust pump is fixed on the upper side of the support plate, the exhaust end of the exhaust pump is connected to the inner side of the protective frame, a convex plate is fixed on the lower side of one end of the support plate, and a threaded hole rotatably connected to the screw thread is provided on the side of the convex plate

[0005] As a further solution of the present invention: the sliding structure includes a slide rail platform fixed on the upper side of the base, a motor 2 is fixed at one end of the slide rail platform, a transmission threaded rod is fixed at the output end of the motor 2, a sliding block is rotatably connected to the outer thread of the transmission threaded rod, the upper side of the sliding block is fixed to the lower side of the connecting platform, and the transmission threaded rod can drive the connecting platform to move.

[0006] As a further solution of the present invention: two limit platforms are fixed on the upper side of the slide rail platform, and the transmission threaded rod is limitedly rotated through the two limit platforms.

[0007] As a further solution of the present invention: the suction cup structure includes a through plate, a connecting plate is fixed on the lower side of the through plate, a suction nozzle is provided at the bottom of the connecting plate for installing the chip, the suction nozzle is connected to the through plate, the through plate is connected to the external exhaust system, and one side of the through plate is fixed to one side of the slide rail structure.

[0008] As a further solution of the present invention: a telescopic rod is fixed on the upper side of the connecting platform, a limited sliding structure is fixed on one side of the connecting plate, a right-angle push plate is slidably provided on one side of the limited sliding structure, and a chip placement platform is provided on the top of the right-angle push plate, which can be lifted up by the telescopic rod.

[0009] As a further solution of the present invention: the air exhaust port is located above the chip placement table to facilitate immediate extraction of heat generated when the chip is packaged.

[0010] As a further solution of the present invention: a sensor is provided under the chip placement table for detecting the temperature of the chip.

[0011] As a further solution of the present invention: the motor 1, the motor 2, the sensor, the telescopic rod, and the exhaust pump are electrically connected to an external power supply respectively.

[0012] Compared with the prior art, the present invention has the following advantages: the present patent adds a rapid heat dissipation structure, which can dissipate heat from the chip in a timely manner after the chip is packaged, thereby speeding up the heat dissipation rate of the chip and reducing the damage caused by excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0014] Figure 1 The overall structure of a chip packaging device of the present invention is three-dimensional Figure 1 .

[0015] Figure 2 The overall structure of a chip packaging device of the present invention is three-dimensional Figure 2 .

[0016] Figure 3 A partial structural cross-section of a chip packaging device of the present invention Figure 1 .

[0017] Figure 4 A partial structural cross-section of a chip packaging device of the present invention Figure 2 .

[0018] Figure 5 This is an enlarged view of the structure of section A in a chip packaging device of the present invention.

[0019] Figure 6 This is an enlarged view of the structure of part B in a chip packaging device of the present invention.

[0020] Figure 7 This is an enlarged view of the C-section structure in a chip packaging device of the present invention.

[0021] Figure 8 This is an enlarged view of the D-section structure in a chip packaging device of the present invention.

[0022] In the attached figure:

[0023] 1. Base; 2. Support frame; 3. Connecting platform; 4. Connecting plate; 5. Motor 1; 6. Screw; 7. Slide rail; 8. Support plate; 9. Protective frame; 10. Exhaust pump; 11. Convex plate; 12. Slide platform; 13. Motor 2; 14. Transmission threaded rod; 15. Sliding block; 16. Through plate; 17. Connecting plate; 18. Suction nozzle; 19. Telescopic rod; 20. Right-angle push plate; 21. Chip placement platform; 22. Sensor; 8.1. Exhaust vent. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] The present invention provides a technical solution to solve the existing problems raised in the background technology.

[0026] Combined with Figure 3 , 5 It can be learned that it includes a base 1, a sliding structure is provided above the base 1, a top rod structure is provided above the sliding structure, a support frame 2 is fixed on the upper side of the base 1 near one end, a slide rail structure is provided on one side of the support frame 2, a suction cup structure is provided on one side of the slide rail structure for sliding, the top rod structure includes a connecting platform 3, a connecting plate 4 is fixed on the upper side of the connecting platform 3, a quick heat dissipation structure is provided on the top of the connecting plate 4, the quick heat dissipation structure includes a motor 5 fixed on one side of the connecting plate 4, a lead screw 6 is fixed at the output end of the motor 5, two limit grooves are provided on the upper side of the connecting plate 4, a slide rail 7 is provided in the limit groove for limit sliding, and a A support plate 8 is provided with an air outlet 8.1 on the lower side of the support plate 8, a protective frame 9 is fixed on the upper side of the support plate 8 at the air outlet 8.1, an air pump 10 is fixed on the upper side of the support plate 8, and the air exhaust end of the air pump 10 is connected to the inner side of the protective frame 9, a convex plate 11 is fixed to the lower side of one end of the support plate 8, and a threaded hole is provided on the side of the convex plate 11 for threaded rotation connection with the screw rod 6, the air outlet 8.1 is located above the chip placement table 21, so as to facilitate the immediate extraction of the heat generated when the chip is packaged, and the motor 1 5, the motor 2 13, the sensor 22, the telescopic rod 19, and the air pump 10 are electrically connected to the external power supply respectively;

[0027] Combined with Figure 4 , 6It can be known that the sliding structure includes a slide rail platform 12 fixed on the upper side of the base 1, a motor 2 13 is fixed at one end of the slide rail platform 12, a transmission threaded rod 14 is fixed at the output end of the motor 2 13, a sliding block 15 is rotatably connected to the outer thread of the transmission threaded rod 14, the upper side of the sliding block 15 is fixed to the lower side of the connecting platform 3, and the transmission threaded rod 14 can drive the connecting platform 3 to move; two limit platforms are fixed on the upper side of the slide rail platform 12, and the transmission threaded rod 14 is limited and rotated through the two limit platforms.

[0028] Combined with Figure 1 , 7 It can be known that the suction cup structure includes a through plate 16, a connecting plate 17 is fixed on the lower side of the through plate 16, a suction nozzle 18 is provided at the bottom of the connecting plate 17 for installing the chip, the suction nozzle 18 is connected to the through plate 16, the through plate 16 is connected to the external exhaust system, and one side of the through plate 16 is fixed to one side of the slide rail 7 structure.

[0029] Combined with Figure 3 , 8 It can be seen that a telescopic rod 19 is fixed on the upper side of the connecting platform 3, a limited sliding structure is fixed on one side of the connecting plate 4, a right-angle push plate 20 is slidably provided on one side of the limited sliding structure, and a chip placement platform 21 is provided on the top of the right-angle push plate 20. The chip placement platform 21 can be lifted up by the telescopic rod 19, and a sensor 22 is provided under the chip placement platform 21 for detecting the temperature of the chip.

[0030] The working principle of the present application is as follows: when installing the chip, the chip is first driven to be located above the slide rail structure through the suction cup structure, and then the motor 2 13 is started to drive the transmission threaded rod 14 to rotate, so as to drive the connecting table 3 to move, so that the connecting table 3 drives the chip placement table 21 to move to the bottom of the suction cup, and then the telescopic rod 19 is started to lift the chip placement table 21 to package the chip. After the packaging is completed, the motor 1 5 is started to drive the screw 6 to rotate, so as to drive the connecting plate 4 to move, so that the exhaust port 8.1 is located directly above the chip placement table 21, and then the exhaust pump 10 is started to immediately dissipate heat.

[0031] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A chip packaging device, comprising a base (1), characterized in that: A sliding structure is provided above the base (1), and a top rod structure is provided above the sliding structure. A support frame (2) is fixed on the upper side of the base (1) near one end, a slide rail structure is provided on one side of the support frame (2), and a suction cup structure is slidably provided on one side of the slide rail structure. The top rod structure includes a connecting platform (3), a connecting plate (4) is fixed on the upper side of the connecting platform (3), and a quick heat dissipation structure is provided on the top of the connecting plate (4). The quick heat dissipation structure includes a motor (5) fixed on one side of the connecting plate (4), a screw rod (6) is fixed at the output end of the motor (5), and a suction cup structure is provided on the upper side of the connecting plate (4). Two limit grooves are provided, and a slide rail (7) is provided in the limit groove for limit sliding. A support plate (8) is fixed on the upper side of the slide rail (7), and an air outlet (8.1) is provided on the lower side of the support plate (8). A protective frame (9) is fixed on the upper side of the support plate (8) at the air outlet (8.1). An air pump (10) is fixed on the upper side of the support plate (8), and the air outlet end of the air pump (10) is connected to the inner side of the protective frame (9). A convex plate (11) is fixed on the lower side of one end of the support plate (8), and a threaded hole is provided on the side of the convex plate (11) for threaded rotation connection with the screw rod (6).

2. The chip packaging device according to claim 1, characterized in that: The sliding structure comprises a slide rail platform (12) fixed on the upper side of the base (1), a second motor (13) being fixed to one end of the slide rail platform (12), a transmission threaded rod (14) being fixed to the output end of the second motor (13), a sliding block (15) being rotatably connected to the outer side of the transmission threaded rod (14), and the upper side of the sliding block (15) being fixed to the lower side of the connecting platform (3).

3. The chip packaging device according to claim 2, characterized in that: Two limit platforms are fixed on the upper side of the slide rail platform (12), and the transmission threaded rod (14) is limitedly rotated through the two limit platforms.

4. The chip packaging device according to claim 1, characterized in that: The suction cup structure comprises a through plate (16), a connecting plate (17) is fixed on the lower side of the through plate (16), a suction nozzle (18) is provided at the bottom of the connecting plate (17), the suction nozzle (18) is connected to the through plate (16), the through plate (16) is connected to an external air extraction system, and one side of the through plate (16) is fixed to one side of the slide rail (7) structure.

5. The chip packaging device according to claim 2, characterized in that: A telescopic rod (19) is fixed on the upper side of the connecting platform (3), a limited sliding structure is fixed on one side of the connecting plate (4), a right-angle push plate (20) is slidably provided on one side of the limited sliding structure, and a chip placement platform (21) is provided on the top of the right-angle push plate (20).

6. The chip packaging device according to claim 1, characterized in that: The air exhaust port (8.1) is located above the chip placement platform (21).

7. The chip packaging device according to claim 5, characterized in that: A sensor (22) is provided below the chip placement platform (21).

8. The chip packaging device according to claim 7, characterized in that: The motor 1 (5), the motor 2 (13), the sensor (22), the telescopic rod (19), and the exhaust pump (10) are electrically connected to an external power source respectively.

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