Wafer post-processing device and method

Abstract

The present invention discloses a wafer post-processing device and method, which belong to the field of semiconductor manufacturing technology. The wafer post-processing device includes: a box body; a support assembly, which is arranged in the box body and includes a driving wheel and a driven wheel to vertically support and drive the wafer to rotate; a cleaning brush, which is horizontally arranged in the box body and rotates around an axis to brush the wafer; a gasket is provided inside the driven wheel, and the outer peripheral wall of the gasket is provided with a groove for clamping the edge of the wafer; the first inner side wall and the second inner side wall of the groove are provided with a texture structure to enhance the reliability of the wafer clamping.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular to a wafer post-processing device and method. Background Art

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in driving the transformation and upgrading of the manufacturing industry towards digitalization and intelligentization. Chips are the carriers of integrated circuits. Chip manufacturing involves a series of processes, including chip design, wafer fabrication, wafer processing, electrical measurement, dicing, packaging, and testing. Chemical Mechanical Planarization (CMP), a wafer manufacturing process, is an ultra-precision surface processing technology that achieves global flatness.

[0003] Wafers that have completed chemical mechanical polishing require post-processing, such as cleaning and drying, to prevent contamination of semiconductor devices by trace ions and metal particles, thereby ensuring their performance and yield. Wafer cleaning methods include roller brush cleaning and megasonic cleaning. Roller brush cleaning is the most widely used, but it also presents some challenges.

[0004] During the roller brush cleaning process, a pair of driving wheels and driven wheels are used to form a support assembly to vertically support and drive the wafer to rotate. The driven wheel is arranged between the pair of driving wheels, and a speed measuring module is usually configured at the end of the driven wheel to indirectly detect the rotation state of the wafer through the rotation speed of the driven wheel.

[0005] The driven wheel is usually equipped with a washer, such as Figure 17 As shown, the gasket is usually configured with a groove structure to vertically support the wafer; a liquid film ( Figure 18 As shown), the rotating wafer uses the adhesion of the liquid film to drive the driven wheel to rotate; since the adhesion of the liquid film is limited, the gasket will wear or deform during use, which will affect the adhesion of the liquid film, resulting in insufficient friction between the gasket and the wafer and frequent speed drop alarms, affecting the stability of the wafer scrubbing module. Summary of the Invention

[0006] In view of this, embodiments of the present application provide a wafer post-processing device and method to at least partially solve the above-mentioned problems.

[0007] According to a first aspect of an embodiment of the present application, there is provided a wafer post-processing apparatus, comprising:

[0008] Box;

[0009] A support assembly is provided in the box body and includes a driving wheel and a driven wheel to vertically support and drive the wafer to rotate;

[0010] A cleaning brush is horizontally arranged in the box and rotates around an axis to clean the wafer;

[0011] A washer is provided inside the driven wheel, and the outer peripheral wall of the washer is configured with a groove for clamping the edge of the wafer; the first inner side wall and the second inner side wall of the groove are configured with a texture structure to enhance the reliability of wafer clamping.

[0012] In some embodiments, the texture structure is a concave-convex structure that is evenly distributed along the circumference of the gasket.

[0013] In some embodiments, the texture structure includes a plurality of protrusions distributed at intervals, and adjacent protrusions form recesses.

[0014] In some embodiments, the recess is a straight groove, a centerline of which passes through the center of the gasket.

[0015] In some embodiments, the recess is an oblique groove, and a line connecting the inner midpoint of the groove and the center of the gasket forms an angle with the center line of the recess, and the angle is 15-65°.

[0016] In some embodiments, the recess is an arrowhead groove, the direction of which is consistent with the rotation direction of the driven wheel.

[0017] In some embodiments, the protrusions of the first inner sidewall and the second inner sidewall are arranged opposite to each other.

[0018] In some embodiments, the protrusions of the first inner sidewall and the second inner sidewall are circumferentially staggered.

[0019] In some embodiments, the opposing surfaces of the protrusions of the first inner sidewall and the second inner sidewall are parallel to each other, and the opposing surfaces are symmetrically arranged along a center line in a thickness direction of the gasket.

[0020] In some embodiments, the opposing surfaces of the protrusions of the first inner sidewall and the second inner sidewall are inclined to each other, and the opposing surfaces are symmetrically arranged along a center line in a thickness direction of the gasket.

[0021] In some embodiments, opposite surfaces of the protrusion form a placement cavity that is wide outside and narrow inside to limit the edge of the wafer.

[0022] In some embodiments, the washer is a split structure, which includes a first washer and a second washer, and the two were fixed together by pin connection.

[0023] In some embodiments, the first gasket and the second gasket are configured with an annular groove, and the annular groove is connected to the recess.

[0024] In some embodiments, the depth of the annular groove is greater than the depth of the recess.

[0025] In some embodiments, the recess is a straight groove or an oblique groove, and its longitudinal section is rectangular.

[0026] In some embodiments, the recess is a straight groove or an oblique groove, the longitudinal section of which is trapezoidal, and the width thereof gradually decreases from the inside to the outside along the radial direction.

[0027] In some embodiments, the gasket is made of polyetheretherketone, polyphenylene sulfide, polytetrafluoroethylene, polyoxymethylene, or polyvinylidene fluoride.

[0028] In some embodiments, outer edges of the first inner sidewall and the second inner sidewall of the groove are configured with guide portions, and the guide portions are inclined surfaces or arc surfaces.

[0029] In some embodiments, the number of the protrusions is 150-450.

[0030] According to a first aspect of an embodiment of the present application, a wafer post-processing method is provided, which uses the wafer post-processing apparatus described above, including:

[0031] The wafer to be processed is placed on the support assembly of the box, and the driving wheel drives the wafer to rotate around the axis;

[0032] The spray bar sprays chemical liquid and / or deionized water toward the wafer surface;

[0033] The cleaning brush moves relatively to abut against the wafer surface, and the cleaning brush rotates around the axis to brush the wafer surface;

[0034] During wafer post-processing, the groove of the washer of the driven wheel engages the edge of the wafer to drive the driven wheel to rotate, and then the speed of the wafer is measured by a speed measurement module configured on the driven wheel.

[0035] The beneficial effects of the present invention include:

[0036] a. In the provided wafer post-processing device, the inner gasket of the driven / driving pulley has a groove on its outer periphery for receiving the wafer. The inner wall of the groove is provided with a textured structure to increase the friction between the wafer and the gasket, thereby maintaining the wafer rotation speed and ensuring good post-processing results.

[0037] b. The texture structure includes multiple protrusions spaced apart, with adjacent protrusions forming recesses. The recesses are straight or oblique grooves, which facilitate puncturing the liquid film formed in the grooves, thereby promptly draining the liquid from the gasket and preventing contaminants containing particulate matter from reattaching to the wafer surface and causing secondary contamination.

[0038] c. The recessed portion in the gasket's textured structure is an arrowhead groove, which is oriented in the same direction as the rotation of the driven wheel to drive the liquid in the groove outward, preventing contaminants from accumulating inside the groove and contaminating the wafer.

[0039] d. The gasket can be split to facilitate the processing of the texture structure of the inner wall of the groove. At the same time, the split gasket also facilitates the replacement of excessively worn parts and controls the cost of wafer post-processing.

[0040] e. The first inner side wall of the gasket groove and the second inner side wall of the protrusions are circumferentially staggered, and the relative protrusions partially overlap, so that a small amount of liquid accumulated inside the gasket is discharged;

[0041] f. The first and second gaskets are configured with an annular groove, which is concentrically disposed on the side surfaces of the first and second gaskets and communicates with the recess. The depth of the annular groove is greater than the depth of the recess, so that liquid containing particulate matter that enters the groove through the recess can be collected in the annular groove and then concentratedly sucked to the outside of the gasket;

[0042] g. The gasket is provided with a drain hole, the drain hole is provided along the thickness direction of the first gasket and the second gasket, and the drain hole is connected to the annular groove, and the liquid accumulated in the annular groove can be discharged through the drain hole to the gasket and the front cover and rear cover;

[0043] h. The depth H of the wafer W inserted into the washer, the lateral width Wh1 of the outer end of the second guide portion, and the lateral width Wh2 of the inner end of the second guide portion 434b are crucial. A reasonable combination of these parameters can accommodate wafers with thicknesses within varying tolerances, maintaining the wafer rotational speed and preventing wafer speed drops. The depth H of the wafer W inserted into the washer ranges from 0.75 mm, 1 mm, 1.25 mm, and 1.5 mm. The lateral width Wh1 of the outer end of the second guide portion ranges from 0.5 to 0.9 mm, and the lateral width Wh2 of the inner end of the second guide portion ranges from 0.3 to 0.7 mm.

[0044] i. The outer edges of the first inner sidewall and the second inner sidewall of the groove are provided with two guide portions, namely, a first guide portion and a second guide portion, both of which are inclined surfaces, and the angle formed by the first guide portion is greater than the angle formed by the second guide portion, so that the wafer can quickly enter the gasket through the first guide portion;

[0045] j. The gasket is made of polyetheretherketone, polyphenylene sulfide, polytetrafluoroethylene, polyoxymethylene or polyvinylidene fluoride to enhance the acid and alkali resistance of the gasket, inhibit the aging of the gasket and extend the service life of the gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0047] Figure 1 A schematic diagram of a wafer post-processing device provided in an embodiment of the present application;

[0048] Figure 2 is a schematic diagram of a driven wheel provided by an embodiment of the present invention;

[0049] Figure 3 is a schematic diagram of a gasket provided in one embodiment of the present invention;

[0050] Figure 4 yes Figure 3 A partial enlarged view of point A in the middle;

[0051] Figure 5 is a schematic diagram of the split structure of a gasket provided in one embodiment of the present invention;

[0052] Figure 6 is a schematic diagram of corresponding protrusions and recesses of a gasket provided in one embodiment of the present invention;

[0053] Figure 7 is a schematic diagram of corresponding protrusions and recesses of a gasket provided in another embodiment of the present invention;

[0054] Figure 8 is a schematic diagram of one of the split structures of a gasket provided in one embodiment of the present invention;

[0055] Figure 9 is a schematic diagram of one of the split structures of a gasket provided in another embodiment of the present invention;

[0056] Figure 10 1 is a schematic diagram of the positional relationship between the protrusions of the first washer and the second washer provided in one embodiment of the present invention;

[0057] Figure 11 is a partial longitudinal cross-sectional view of a gasket provided in one embodiment of the present invention;

[0058] Figure 12 is a partial longitudinal cross-sectional view of a gasket provided in another embodiment of the present invention;

[0059] Figure 13 is a partial longitudinal sectional view of a gasket provided in yet another embodiment of the present invention;

[0060] Figure 14is a partial longitudinal sectional view of a gasket provided in yet another embodiment of the present invention;

[0061] Figure 15 is a schematic diagram of a first gasket with a drainage hole provided by an embodiment of the present invention;

[0062] Figure 16 is a flow chart of a wafer post-processing method provided by one embodiment of the present invention;

[0063] Figure 17 is a schematic diagram of a conventional driven wheel configuration with washers vertically supporting a wafer;

[0064] Figure 18 yes Figure 17 A partial enlarged view of point B in the middle. DETAILED DESCRIPTION

[0065] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0066] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0067] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] Figure 1 1 is a schematic diagram of a wafer post-processing device 100 provided in one embodiment of the present invention. The wafer post-processing device 100 includes a box body 10 , a support assembly and a cleaning brush 20 . The cleaning brush 20 and the support assembly are arranged in the box body 10 .

[0069] The box 10 is a substantially rectangular shell structure with an opening at the top. The transport robot places the wafers W to be cleaned inside the box 10 through the opening or transfers the cleaned wafers W to the outside of the box 10 .

[0070] The cleaning brush 20 is equipped with a drive motor, which is arranged outside the box body 10. Its output shaft is connected to the cleaning brush 20 to drive the cleaning brush 20 to rotate around its axis. A spray rod 50 is provided on the upper part of the tank body 10 to spray DIW and / or cleaning liquid onto the wafer W.

[0071] exist Figure 1 In the illustrated embodiment, a support assembly is disposed within a housing 10 and is used to rotatably support a wafer W to be cleaned. Specifically, the wafer is vertically disposed within the support assembly so that cleaning brushes 20 on both sides can be used to clean contaminants from the wafer surface. The support assembly includes a driving wheel 30 and a driven wheel 40, each of which is provided with a retaining groove disposed along the outer periphery of the roller body. Two driving wheels 30 are symmetrically disposed on either side of the driven wheel 40, and are disposed along the outer contour of the wafer W so that the outer edge of the wafer W abuts the bottom surface of the retaining groove. The driving wheel 30 is equipped with a rotary motor, which drives the vertically disposed wafer W to rotate about the wafer's axis. The main body of the rotary motor is disposed outside the housing 10, and its output shaft is connected to the driving wheel 30. A speed sensor (not shown) is disposed on the driven wheel 40 to detect the rotational speed of the wafer during the cleaning process and monitor the wafer cleaning status.

[0072] Typically, the line connecting the installation positions of the two driving wheels 30 and the driven wheel 40 forms an isosceles triangle, the symmetry line of the isosceles triangle passes through the center of the wafer to be cleaned, and then three points of stable support are used to ensure the smooth rotation of the wafer.

[0073] When cleaning the wafer, a pair of driving wheels 30 rotates driven by a rotating motor (not shown). Under the action of friction, the wafer W vertically arranged in the slot of the driving wheel 30 rotates around the axis of the wafer; the cleaning brush 20 abuts against the surface of the wafer W and rotates around the axis of the cleaning brush 20.

[0074] The cleaning brush 20 is typically made of a porous material such as polyvinyl alcohol. It is capable of absorbing a large amount of cleaning liquid used to scrub the surface of the wafer W. Before wafer cleaning, liquid is passed into the interior of the cleaning brush 20 to soften it. The rolling cleaning brush 20 contacts the rotating wafer W to remove contaminants from the wafer W surface.

[0075] Figure 2FIG4 is a schematic diagram of a driven pulley 40 according to an embodiment of the present invention. The driven pulley 40 includes a front cover 41, a rear cover 42, and a washer 43. The washer 43 is an annular structure that is concentrically engaged between the front cover 41 and the rear cover 42. The outer wall of the washer 43 is provided with a groove 431 to engage the edge of the wafer.

[0076] In the present invention, since wafer post-processing uses strongly acidic or alkaline chemical solutions, the gasket 43 needs to have good corrosion resistance. That is, the gasket 43 has the property of resisting corrosion and deformation, and can withstand long-term immersion in the required acidic or alkaline environment without deformation or deformation within an allowable range.

[0077] At the same time, the gasket 43 is also resistant to infrared spectrum irradiation, that is, after long-term irradiation with infrared spectrum, the shape of the gasket 43 will not be deformed.

[0078] In addition, metal ions may be introduced during the manufacturing process of the gasket 43. For example, during the molding process of the gasket 43, a mold made of metal material may be used. During the molding process of the gasket 43, a small amount of metal ions will enter the interior of the gasket 43; during the use of the gasket 43, the metal ions will be freed from the gasket 43 to the surface of the wafer, causing metal ion contamination of the wafer, which will seriously affect the manufacturing quality of the wafer.

[0079] It is understood that the gasket 43 also needs to have good wear resistance. That is, it will not wear out or deform due to the compression and friction of the wafers during long-term use. At the same time, the wear resistance of the gasket 43 is closely related to its service life. Good wear resistance can extend the service life, reduce the frequency of gasket 43 replacement, and improve the overall operating efficiency of the wafer post-processing device 100.

[0080] The above discussion is the basic requirement for the design and manufacture of the gasket 43. During actual use, the gasket 43 may experience varying degrees of wear or deformation, which will affect the adhesion of the liquid film between the inner wall of the gasket 43 and the wafer, resulting in insufficient friction between the gasket 43 and the wafer, causing the driven wheel 40 to lose speed and frequently alarm, which will cause the wafer post-processing device to shut down due to the alarm.

[0081] In order to solve the above-mentioned technical problems, the inner sidewall of the groove 431 of the gasket 43 provided by the present invention is configured with a texture structure to increase the friction between the gasket 43 and the wafer, thereby enhancing the reliability of the wafer clamping. Specifically, the interior of the groove 431 has a first inner sidewall 431a and a second inner sidewall 431b ( Figure 10 As shown), the two are arranged relative to each other and are configured with a texture structure, and the side surface of the wafer contacts the texture structure of the inner wall of the groove 431 to increase the friction between the two.

[0082] In the present invention, the texture structure arranged on the inner wall of the groove 431 is a concave-convex structure, which is evenly distributed along the circumference of the gasket 43 to ensure that the force applied to the gasket 43 at various positions along the circumference of the wafer is balanced. Correspondingly, the reverse force applied by the gasket 43 to the wafer is also uniform, and the rotation state of the wafer is accurately reflected by the rotation state of the driven wheel 40.

[0083] Figure 3 This is a schematic diagram of a gasket 43 provided in an embodiment of the present invention. In order to more clearly show the texture structure of the inner wall of the groove 431, the gasket 43 is partially cut to show the specific structure of the inner wall corresponding to the groove 431 of the gasket 43.

[0084] Specifically, the texture structure includes a plurality of protrusions 432 distributed at intervals, such as Figure 4 As shown, adjacent protrusions 432 form recesses 433. The side of the wafer contacts the protrusions 432, creating sufficient friction between them to effectively prevent the rotating wafer from slowing down. Liquid on the rotating wafer surface flows toward the recesses 433, forming intervals of liquid film adhesion on the inner sidewall of the gasket 43. This balances the friction coefficient between the inner sidewall of the grooves 431 and the wafer, preventing excessive friction between the protrusions 432 and the wafer from scratching the wafer edge.

[0085] In the present invention, the gasket 43 may be an integral structure, such as Figure 3 As shown, the same material is used for processing and forming to ensure the consistency of the corresponding characteristics of the gasket 43, especially the elastic deformation characteristics of the gasket 43, thereby ensuring that the gasket 43 has good performance.

[0086] In order to facilitate processing and forming, the washer 43 can also adopt a split structure, such as Figure 5 As shown, the gasket 43 includes a first gasket 43A and a second gasket 43B, with a pin and a pin hole configured on their opposing surfaces to secure them together. The pin and the pin hole achieve strict alignment between the parts through geometric shapes, eliminating gaps and enabling precise assembly. Furthermore, pinning is suitable for cleaning rotating wafers, which can apply dynamic loads to the separate gasket 43. Pinning effectively prevents the separate structures from disassembling during operation, which could affect the wafer cleaning effect.

[0087] Specifically, a side wall of the first washer 43A is provided with a pin shaft and a pin hole, and the pin shaft and the pin hole are symmetrically arranged along the center of the first washer 43A; at the same time, the corresponding side wall of the second washer 43B is provided with a pin hole and a pin shaft, and the pin hole and the pin shaft of the second washer 43B are matched with the pin shaft and pin hole of the first washer 43A to ensure the reliability of the fixation of the first washer 43A and the second washer 43B.

[0088] Figure 5In the embodiment shown, the pin is a cylindrical structure to limit the radial displacement of the split structure. It is understood that the pin can also be a conical pin to simultaneously constrain axial and radial displacement to ensure the stability of the washer 43.

[0089] Figure 5 In the embodiment, the recess 433 is a straight groove, and the center line of the recess 433 passes through the center of the gasket 43 to ensure that the interaction force between the gasket 43 and the wafer is uniform at all positions on the circumference. At the same time, the setting of the straight groove recess 433 is conducive to puncturing the liquid film formed in the groove 431, thereby timely draining the liquid in the gasket 43, and preventing the contaminants containing particulate matter from adhering to the wafer surface again and forming secondary contamination. It should be noted that in the present invention, the "outside" and "inside" are relative to the groove 431 of the gasket 43. The position where the groove 431 is located is the "inside", and the side wall of the gasket 43 away from the groove 431 is the "outside".

[0090] In this embodiment, the number of protrusions 432 is 150 to 450. Figure 6 As shown, the longitudinal cross-section of recess 433 is rectangular, with a width of 0.15-2 mm and a depth of 0.3-2.5 mm. The arrangement of multiple rectangular recesses 433 allows a small amount of liquid on the surface of the rotating wafer to enter the recesses 433, forming a spaced liquid film on the sidewalls of the grooves 431, thereby balancing the friction coefficient between the wafer and the gasket 43. After the gasket 43 stops rotating, the spaced protrusions 432 can puncture the liquid film formed in the grooves 431, draining the liquid from the gasket 43 and preventing contaminants from being retained in the grooves 431.

[0091] As Figure 6 In a variation of the embodiment, the longitudinal section of the recess 433 is trapezoidal, as shown in FIG. Figure 7 shown.

[0092] Figure 7 In the left figure, the concave portion 433 is a trapezoid with a wide outside and a narrow inside, wherein the bottom width of the concave portion 433 is 0.5-4 mm, and the top width of the concave portion 433 is 0.3-2 mm; Figure 7 In the right figure, the recess 433 is a trapezoid with a narrow outside and a wide inside, wherein the bottom width of the recess 433 is 0.3-2 mm and the top width of the recess 433 is 0.5-4 mm. It should be noted that the bottom width of the recess 433 refers to the width of the very root of the recess 433.

[0093] Figure 7 In the embodiment of the right figure, the inner top surface area of ​​the protrusion 432 is smaller, and correspondingly, the inner top area of ​​the recess 433 is larger, so as to increase the adhesion between the wafer and the inner wall of the gasket 43 and balance the friction coefficient between the two.

[0094] Figure 8 This is a schematic diagram of one of the split structures of the gasket 43 provided in one embodiment of the present invention. In this embodiment, the recess 433 is an oblique groove, and the line connecting the midpoint of the inner side of the recess 433 and the center of the gasket 43 forms an angle θ with the center line of the recess 433, and the angle θ is 15~65°; preferably, the angle θ between the midpoint of the inner side of the recess 433 and the center of the gasket 43 and the center line of the recess 433 is 30~45°.

[0095] In this embodiment, the number of recesses 433 formed by the oblique groove is 150-450, which are evenly distributed on the inner wall of the groove 431; the width of the recess 433 is 0.15-2 mm, and the depth of the recess 433 is 0.5-3 mm.

[0096] Figure 8 In the illustrated embodiment, the inclination direction of the recess 433 is consistent with the rotation direction of the wafer, so that the liquid in the gasket 43 can be smoothly discharged outward along the recess 433 under the action of centrifugal force.

[0097] Figure 9 This is a schematic diagram of one of the split structures of a gasket 43 provided in another embodiment of the present invention. In this embodiment, the inner wall of the gasket 43 is evenly distributed with multiple protrusions 432, and adjacent protrusions 432 form a recess 433. The recess 433 is an arrow-shaped groove, that is, the top view of the recess 433 is a V-shaped structure; the angle formed by the recess 433 is δ, and the angle δ is between 90 and 135 degrees. The arrangement of the arrow-shaped recess 433 facilitates the outward discharge of liquid in the groove, preventing contaminants from accumulating inside the groove and contaminating the wafer.

[0098] During wafer cleaning, the rotating wafer is clamped in groove 431 of gasket 43. A small amount of liquid on the wafer surface will seep into groove 431 and then into recess 433 indicated by the arrow. To prevent the liquid from counteracting and causing contaminants in groove 431 to adhere back to the wafer surface, recess 433 is oriented in the same direction as the rotation of driven wheel 40.

[0099] In the present invention, the first inner side wall 431a and the second inner side wall 431b of the groove 431 of the gasket 43 are both provided with corresponding protrusions 432, such as Figure 10 As shown, adjacent protrusions 432 form a recess 433 .

[0100] Figure 10 In the left figure, the protrusions 432 of the first inner sidewall 431a and the second inner sidewall 431b are arranged opposite each other, that is, the protrusions 432 are symmetrical along the centerline of the thickness direction of the gasket 43. The relative arrangement of the protrusions 432 helps to ensure uniform friction on the side of the wafer, thereby ensuring stable rotation of the wafer.

[0101] Figure 10In the right figure, the protrusions 432 of the first inner sidewall 431a and the second inner sidewall 431b are circumferentially staggered, with the opposing protrusions 432 partially overlapping. This arrangement facilitates the discharge of small amounts of liquid accumulated within the gasket 43. Preferably, the width of the overlapping protrusions 432 is 1 / 5 to 1 / 2 of the width of the protrusions 432. The circumferential staggered arrangement of the protrusions 432 weakens the stability of the liquid film in the groove 431, facilitating the protrusions 432 to disrupt the liquid film in the gasket 43, thereby discharging contaminants such as particulate matter from the groove 431 and preventing contaminants from accumulating within the gasket 43.

[0102] Figure 11 This is a partial longitudinal cross-sectional view of a gasket 43 according to an embodiment of the present invention. In this embodiment, the opposing surfaces of the protrusions 432 of the first inner sidewall 431a and the second inner sidewall 431b are parallel to each other, forming a placement cavity with a rectangular longitudinal section, into which a wafer (not shown) is secured. It should be noted that the placement cavity herein is a portion of the groove 431, specifically the gap between the opposing protrusions 432.

[0103] Furthermore, the opposite surfaces are symmetrically arranged along the center line of the thickness direction of the gasket 43, so that the mass distribution of the driven wheel 40 formed by the gasket 43 in the horizontal direction is relatively uniform, and thus the driven wheel 40 can rotate uniformly with the wafer.

[0104] It should be noted that the lateral width of the placement cavity matches the wafer thickness T. In some embodiments, the lateral width of the placement cavity may be 0.25 mm less than the wafer thickness T. In some embodiments, the lateral width of the placement cavity may be 0.1 mm greater than the wafer thickness T. That is, the lateral width of the placement cavity is T-0.25 mm to T+0.1 mm.

[0105] Figure 12 yes Figure 11 A variation of the embodiment in this embodiment is that the outer edges of the first inner side wall 431a and the second inner side wall 431b of the groove 431 are provided with a guide portion 434 , which is an inclined surface to facilitate accurate clamping of the wafer in the groove 431 .

[0106] In this embodiment, the first gasket 431a and the second gasket 431b are provided with an annular groove 435, which is concentrically arranged on the side of the first gasket 43A and the second gasket 43B. The assembly formed by the first gasket 43A and the second gasket 43B enables the chamber formed by the corresponding annular groove 435 to be connected to the groove 431.

[0107] Furthermore, the annular groove 435 is connected to the concave portion 433, and the depth of the annular groove 435 is greater than the depth of the concave portion 433, so that the liquid containing particulate matter entering the groove 431 through the concave portion 433 can be gathered in the annular groove 435 and then concentratedly sucked to the outside of the gasket 43. Specifically, the bottom surface of the annular groove 435 is located at the bottom surface of the concave portion 433 ( Figure 12 The outer side of the annular groove 435 is formed by the concave portion 433 and the middle dotted line), so that the liquid containing the particles converges toward the annular groove 435 through the concave portion 433.

[0108] As one aspect of this embodiment, a vacuum channel may be provided inside the gasket 43 to draw the liquid gathered in the annular groove 435 to the outside of the gasket 43 .

[0109] When the gasket 43 is made of a flexible material, the annular groove 435 can increase the flexibility of the outer edge of the gasket 43 , so that the wafer can be adaptively clamped inside the groove 431 , thereby increasing the reliability of the wafer being set in the gasket 43 .

[0110] Figure 11 In the embodiment, the distance L between the bottom surfaces of the annular grooves 435 is T±0.15 mm. It should be noted that the bottom surfaces of the annular grooves 435 refer to the bottom surfaces of the annular grooves 435 of the first gasket 43A and the bottom surfaces of the annular grooves 435 of the second gasket 43B, which are located on the inner sides of the first gasket 43A and the second gasket 43B. Figure 11 It can be seen that the distance L between the bottom surfaces of the annular grooves 435 is the horizontal distance of the groove structure at the lower part of the cavity.

[0111] In the present invention, the width of the placement cavity is generally 0.5 to 1 mm, which is suitable for the gasket 43 to be an integral structure or a split structure. That is, the wafer W can be inserted into different depths H ( Figure 13 ), in order to maintain the rotation speed of the wafer and avoid the wafer from slowing down.

[0112] As an embodiment of the present invention, the gasket 43 is provided with a drainage hole 436 ( Figure 15 As shown), the drainage hole 436 is set through the thickness direction of the first gasket 43A and the second gasket 43B, and the drainage hole 436 is connected to the annular groove 435, which is set through the groove 431.

[0113] In some embodiments, the drainage hole 436 is a long hole, such as Figure 15 As shown, there are multiple annular grooves 435 that are evenly distributed along the circumference of the gasket 43 . The liquid accumulated in the annular groove 435 can be discharged to between the gasket 43 and the front cover plate 41 and the rear cover plate 42 through the drainage holes 436 .

[0114] As one aspect of this embodiment, the drainage holes 436 located in the first gasket 43A and the drainage holes 436 located in the second gasket 43B are arranged opposite each other to facilitate liquid drainage. It is understood that the drainage holes 436 of the first gasket 43A and the second gasket 43B can also be staggered circumferentially, that is, the opposing drainage holes 436 partially overlap in the circumferential direction, to appropriately control the drainage rate of the liquid accumulated in the groove 431.

[0115] It is understandable that Figure 12 The guide portion 434 shown may also be an arc surface, so that the wafer can be quickly inserted into the groove 431 of the gasket 43 .

[0116] Figure 13 yes Figure 11 A variation of the embodiment, in which the outer edges of the first inner side wall 431a and the second inner side wall 431b of the groove 431 are provided with two guide portions 434, namely a first guide portion 434a and a second guide portion 434b, both of which are inclined surfaces, wherein the first guide portion 434a is located on the outer side of the gasket 43.

[0117] Furthermore, the angle formed by the first guide portions 434 a corresponding to the first gasket 43A and the second gasket 43B is greater than the angle formed by the second guide portions 434 b , so that the wafer can quickly enter the gasket 43 through the first guide portions 434 a .

[0118] In some embodiments, the lateral width Wh1 of the outer end of the second guide portion 434b can be 0.1 mm larger than the thickness T of the wafer. Similarly, the lateral width Wh1 of the outer end of the second guide portion 434b can also be 0.15 mm smaller than the thickness T of the wafer; the lateral width Wh2 of the inner end of the second guide portion 434b can be 0.2~0.45 mm smaller than the thickness T of the wafer.

[0119] Figure 13 In the illustrated embodiment, when the lateral width Wh1 of the outer end of the second guide portion 434b is greater than the thickness of the wafer, and the lateral width Wh2 of the inner end of the second guide portion 434b is less than the thickness of the wafer, the processed surface of the wafer edge contacts the second guide portion 434b, and the textured structure configured in the groove 431 of the washer 43 can increase the friction between the wafer and the second guide portion 434b. During wafer cleaning, the cleaning brushes 20 on both sides of the wafer twist the wafer. The downward pressure of the cleaning brushes 20 on the wafer forces the washer 43 to deform, allowing the wafer to be inserted deeper into the groove 431. The wafer is securely inserted into the washer 43 of the driven wheel 40, preventing the wafer from slipping in the groove 431 of the washer 43 and reducing the wafer rotation speed.

[0120] When the lateral width Wh1 of the outer end of the second guide portion 434b is smaller than the thickness of the wafer, as described above, the cleaned wafer is subjected to the downward pressure of the cleaning brush 20 to force the gasket 43 to deform, so that the wafer is inserted into the groove 431 having a textured structure on the inner wall to increase the friction between the wafer and the gasket 43, thereby effectively preventing the wafer from losing speed during the cleaning process.

[0121] Figure 13 In the illustrated embodiment, the depth H of the wafer W inserted into the washer 43, the lateral width Wh1 of the outer end of the second guide portion 434b, and the lateral width Wh2 of the inner end of the second guide portion 434b are crucial. A reasonable combination of these parameters allows for wafers with thicknesses within varying tolerances, maintaining the wafer's rotational speed and preventing wafer speed drops. Specifically, the depth H of the wafer W inserted into the washer 43 ranges from 0.75 mm, 1 mm, 1.25 mm, and 1.5 mm. The lateral width Wh1 of the outer end of the second guide portion 434b ranges from 0.5 to 0.9 mm, and the lateral width Wh2 of the inner end of the second guide portion 434b ranges from 0.3 to 0.7 mm.

[0122] When the depth H of the wafer W inserted into the washer 43 is 1.5 mm, the lateral width Wh1 of the outer end of the second guide portion 434 b is 0.8-0.9 mm, and the lateral width Wh2 of the inner end of the second guide portion 434 b is 0.6-0.7 mm.

[0123] When the depth H of the wafer W inserted into the washer 43 is 1.25 mm, the lateral width Wh1 of the outer end of the second guide portion 434 b is 0.7-0.9 mm, and the lateral width Wh2 of the inner end of the second guide portion 434 b is 0.5-0.7 mm.

[0124] When the depth H of the wafer W inserted into the washer 43 is 1.0 mm, the lateral width Wh1 of the outer end of the second guide portion 434 b is 0.5-0.8 mm, and the lateral width Wh2 of the inner end of the second guide portion 434 b is 0.3-0.6 mm.

[0125] When the depth H of the wafer W inserted into the washer 43 is 0.75 mm, the lateral width Wh1 of the outer end of the second guide portion 434 b is 0.5-0.7 mm, and the lateral width Wh2 of the inner end of the second guide portion 434 b is 0.3-0.5 mm.

[0126] Figure 14 This is a partial longitudinal cross-sectional view of a gasket 43 provided in another embodiment of the present invention. In this embodiment, the opposing surfaces of the protrusion 432 of the first inner wall 431a and the second inner wall 431b are inclined to each other, and the opposing surfaces are symmetrically arranged along the center line of the thickness direction of the gasket 43.

[0127] The placement cavity formed by the opposing protrusions 432 is wide on the outside and narrow on the inside, allowing the wafer to be smoothly inserted into the groove 431 of the gasket 43 and clamped by the lower end of the protrusion 432, allowing the rotating wafer to rotate with the driven wheel 40. In this embodiment, the wafer contacts the inner side of the protrusion 432 of the gasket 43, and the contact area is relatively small, which increases the friction between the protrusion 432 and the wafer. At the same time, a thick liquid film is formed between the wafer protrusion 432 and the wafer, balancing the friction coefficient between the wafer and the gasket 43.

[0128] Figure 14 In the embodiment, the distance L between the bottom surfaces of the annular grooves 435 is T-0.25 mm to T+0.15 mm, where T is the thickness of the wafer.

[0129] In the present invention, the gasket 43 can be made of polyetheretherketone, polyphenylene sulfide, polytetrafluoroethylene, polyoxymethylene or polyvinylidene fluoride to enhance the acid and alkali resistance of the gasket 43, inhibit aging of the gasket 43, and extend its service life.

[0130] It should be noted that in the wafer post-processing device provided by the present invention, a gasket 43 can also be configured inside the driving wheel 30, and the structure and characteristics of the gasket 43 are the same or similar to the structure and characteristics of the gasket 43 configured in the driven wheel 40, so as to maintain the rotation speed of the wafer and ensure a good post-processing effect. If the gasket 43 of the present invention is applied to the driving wheel 30, the wafer to be cleaned needs to be clamped to the bottom of the groove 431 of the gasket 43, that is, the edge (arc-shaped portion) of the wafer contacts the bottom surface of the groove 431; and when the gasket 43 is applied to the driven wheel 40, the edge of the wafer needs to reserve a certain distance from the bottom surface of the groove 431 to prevent the driven wheel 40 from acting on the wafer and pushing the wafer upward, which will seriously affect the smooth rotation of the wafer.

[0131] In addition, the present invention also provides a wafer post-processing method, which uses Figure 1 The wafer post-processing apparatus 100 is shown, and its flow chart is as follows: Figure 16 As shown, the wafer post-processing method includes:

[0132] The wafer to be processed is placed on the support assembly of the box 10, and a pair of driving wheels 30 in the box 10 drives the wafer to rotate around the axis;

[0133] The spray rods 50 spray chemical liquid and / or deionized water toward the surface of the wafer. In the present invention, there is a pair of spray rods 50 , which are disposed in the box 10 to spray liquid toward both sides of the wafer to be processed.

[0134] The cleaning brush 20 moves relatively to abut against the wafer surface, and the cleaning brush 20 rotates around the axis to brush the wafer surface;

[0135] Specifically, before the robot places the wafer into the box 10, the cleaning brush 20 is in the standby position, that is, the distance between the axes of the cleaning brush 20 is larger, so that the robot can place the wafer on the support assembly; when the wafer is placed vertically, the cleaning brushes 20 move toward each other so that the cleaning brushes 20 abut against the side of the wafer.

[0136] During wafer post-processing, the groove 431 of the washer 43 of the driven wheel 40 engages the edge of the wafer to drive the driven wheel 40 to rotate, and the speed measuring module disposed on the driven wheel 40 measures the rotation speed of the wafer.

[0137] In the present invention, the inner side wall of the groove 431 of the washer 43 configured for the driven wheel 40 is configured with a texture structure, and the protrusion 432 is in direct contact with the side of the wafer to increase the friction between the wafer W and the washer 43, effectively maintaining the wafer rotation speed and preventing the wafer rotation speed from decreasing.

[0138] During wafer post-processing, the wafer can rotate within the range of 5prm~50prm without slowing down, so as to avoid frequent alarms of the wafer post-processing device and affecting its operating time.

[0139] At the same time, the driven wheel 40 also has the function of adjusting the posture of the rotating wafer. Specifically, the wafer rotates around its own axis under the drive of the driving wheel 30, and it will swing in the vertical plane where the wafer is located, which will inevitably affect the cleaning effect of the wafer. In the present invention, a gasket 43 is provided in the driven wheel 40, and the inner side wall of the groove 431 of the gasket 43 has a texture structure, which can enhance the posture correction of the rotating wafer, so that the wafer rotates normally in its plane, thereby obtaining a wafer whose surface cleanliness meets the process requirements.

[0140] Those skilled in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of this application.

[0141] The above implementation methods are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A wafer post-processing device, characterized in that: include: Box; A support assembly is provided in the box body and includes a driving wheel and a driven wheel to vertically support and drive the wafer to rotate; A cleaning brush is horizontally arranged in the box and rotates around an axis to clean the wafer; A washer is disposed inside the driven wheel, and a groove is configured on the outer peripheral wall of the washer for clamping the edge of the wafer; a texture structure is configured on the first inner sidewall and the second inner sidewall of the groove to enhance the reliability of wafer clamping; the texture structure is a concave-convex structure and is evenly distributed along the circumference of the washer; the texture structure includes a plurality of protrusions distributed at intervals, with adjacent protrusions forming a concave portion; the protrusions pierce the liquid film formed in the groove to discharge the liquid in the washer; The gasket is provided with a drainage hole, which is arranged through the groove and is connected to the annular groove. The annular groove is concentrically arranged on the side of the gasket. The depth of the annular groove is greater than the depth of the recess, so that the liquid containing particulate matter entering the groove through the recess is gathered in the annular groove and discharged to the outside of the gasket through the drainage hole.

2. The wafer post-processing device according to claim 1, characterized in that: The recess is a straight groove, a center line of which passes through the center of the gasket.

3. The wafer post-processing device according to claim 1, wherein: The recess is an oblique groove, and a line connecting the inner midpoint of the groove and the center of the gasket forms an angle with the center line of the recess, and the angle is 15-65 degrees.

4. The wafer post-processing device according to claim 1, wherein: The recessed portion is an arrowhead groove, and its direction is consistent with the rotation direction of the driven wheel.

5. The wafer post-processing device according to claim 1, wherein: The protrusions of the first inner side wall and the second inner side wall are arranged opposite to each other.

6. The wafer post-processing device according to claim 1, wherein: The protrusions of the first inner side wall and the second inner side wall are circumferentially staggered.

7. The wafer post-processing device according to claim 1, wherein: The opposing surfaces of the protrusions of the first inner side wall and the second inner side wall are parallel to each other, and the opposing surfaces are symmetrically arranged along a center line in a thickness direction of the gasket.

8. The wafer post-processing device according to claim 1, wherein: The opposing surfaces of the protrusions of the first inner side wall and the second inner side wall are inclined to each other, and the opposing surfaces are symmetrically arranged along a center line in a thickness direction of the gasket.

9. The wafer post-processing device according to claim 8, characterized in that: The opposite surfaces of the protrusion form a placement cavity that is wide outside and narrow inside to limit the edge of the wafer.

10. The wafer post-processing device according to claim 1, wherein: The washer is a split structure, which includes a first washer and a second washer, and the two are fixed into one by pin connection.

11. The wafer post-processing device according to claim 10, wherein: The first gasket and the second gasket are configured with an annular groove, and the annular groove is communicated with the recess.

12. The wafer post-processing device according to claim 11, wherein: The depth of the annular groove is greater than the depth of the recess.

13. The wafer post-processing device according to claim 1, wherein: The recessed portion is a straight groove or an oblique groove, and its longitudinal section is a rectangle.

14. The wafer post-processing device according to claim 1, wherein: The recessed portion is a straight groove or an oblique groove, and its longitudinal section is trapezoidal, and its width gradually decreases from the inside to the outside along the radial direction.

15. The wafer post-processing device according to claim 1, wherein: The gasket is made of polyetheretherketone, polyphenylene sulfide, polytetrafluoroethylene, polyoxymethylene or polyvinylidene fluoride.

16. The wafer post-processing device according to claim 1, wherein: The outer edges of the first inner side wall and the second inner side wall of the groove are provided with guide portions, and the guide portions are inclined surfaces or arc surfaces.

17. The wafer post-processing device according to claim 1, wherein: The number of the protrusions is 150 to 450.

18. A wafer post-processing method, characterized in that: The wafer post-processing device according to any one of claims 1 to 17 comprises: The wafer to be processed is placed on the support assembly of the box, and the driving wheel drives the wafer to rotate around the axis; The spray bar sprays chemical liquid and / or deionized water toward the wafer surface; The cleaning brush moves relatively to abut against the wafer surface, and the cleaning brush rotates around the axis to brush the wafer surface; During wafer post-processing, the groove of the washer of the driven wheel engages the edge of the wafer to drive the driven wheel to rotate, and then the speed of the wafer is measured by a speed measurement module configured on the driven wheel.

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