Semiconductor product handling equipment

Abstract

The present application discloses a semiconductor product handling equipment, which relates to the field of semiconductor inspection, including a chassis, a material feeding and discharging mechanism is provided on one side of the chassis, a detection port is provided on the other side of the chassis, a mechanical arm is provided in the chassis, a moving mechanism is provided in the chassis, a wafer edge finding mechanism is provided in the chassis, and a square piece edge finding mechanism is provided in the chassis. The present application utilizes a wafer edge finding mechanism and a square piece edge finding mechanism, and the moving mechanism drives the mechanical arm to move to the material feeding and discharging mechanism, the mechanical arm grabs a wafer or a liquid crystal square piece, and places the wafer on the wafer edge finding mechanism, and places the liquid crystal square piece on the square piece edge finding mechanism, after the wafer and the liquid crystal square piece complete edge finding, the mechanical arm then transports the wafer or the liquid crystal square piece to the detection port, and the detection mechanism detects the wafer or the liquid crystal square piece, and a handling device can simultaneously carry the wafer or the liquid crystal square piece, thereby reducing the production cost of the wafer and the liquid crystal square piece.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing, and in particular to a semiconductor product handling device. Background Art

[0002] Wafers are the core raw materials of the semiconductor industry and are used to manufacture integrated circuits and various semiconductor devices. Liquid crystal squares are key components of semiconductor display technology, realizing the image display function of liquid crystal displays. Both are indispensable semiconductor products for modern electronic devices.

[0003] At present, both wafers and LCD panels need to be transported and tested during the production process. Traditional semiconductor handling equipment can only handle one of the products, wafers or LCD panels. When producing wafers and LCD panels, two sets of handling equipment are required to handle wafers and LCD panels respectively, which increases the production cost of wafers and LCD panels. Summary of the invention

[0004] In order to reduce the production cost of wafers and liquid crystal square pieces, the present application provides a semiconductor product handling equipment.

[0005] The semiconductor product handling equipment provided in this application adopts the following technical solution:

[0006] A semiconductor product handling device comprises a chassis, one side of the chassis is provided with two feeding and discharging mechanisms, the other side of the chassis is provided with an inspection port, a mechanical arm is provided in the chassis, a moving mechanism for driving the mechanical arm to reciprocate and translate between the feeding and discharging mechanisms and the inspection port is provided in the chassis, a wafer edge-finding mechanism is provided in the chassis, and a square piece edge-finding mechanism is provided in the chassis, and the wafer edge-finding mechanism and the square piece edge-finding mechanism are both located between the feeding and discharging mechanisms and the inspection port.

[0007] By adopting the above technical solution, the wafer and the liquid crystal square are placed in two feeding and discharging mechanisms, the moving mechanism drives the mechanical arm to move to the feeding and discharging mechanism, the mechanical arm grabs a wafer and places it on the wafer edge finding mechanism, the wafer edge finding mechanism finds the edge of the wafer, the mechanical arm then transports the wafer after edge finding to the detection port, the detection mechanism then detects the wafer, or the mechanical arm grabs a liquid crystal square and places it on the square edge finding mechanism, the square edge finding mechanism finds the edge of the liquid crystal square, the mechanical arm then transports the liquid crystal square after edge finding to the detection port, the detection mechanism then detects the liquid crystal square. In this way, one handling device can carry wafers and liquid crystal squares at the same time, thereby reducing the production cost of wafers and liquid crystal squares.

[0008] Preferably, the square piece edge-finding mechanism includes a first housing, an X-axis moving part, a Y-axis moving part, a first rotating part, a moving platform and a first camera, the first housing is arranged in a chassis, the X-axis moving part is arranged in the first housing, the Y-axis moving part is arranged at the moving end of the X-axis moving part, the first rotating part is arranged at the moving end of the Y-axis moving part, the moving platform is arranged at the rotating end of the first rotating part, the liquid crystal square piece is placed on the moving platform, and the first camera is arranged on the first housing and located above the liquid crystal square piece.

[0009] By adopting the above technical solution, the robotic arm places the liquid crystal square on the moving table, and the X-axis moving part and the Y-axis moving part in the first housing drive the moving table to move freely on the horizontal plane, so that the edge of the liquid crystal square moves to directly below the first camera, and the first rotating part then drives the liquid crystal square to rotate through the moving table, and the first camera collects the image of the liquid crystal square, so as to find the edge of the liquid crystal square.

[0010] Preferably, the wafer edge-finding mechanism includes a second housing, a translation part, a second rotating part, a rotating table and a second camera. The second housing is arranged in a chassis, the translation part is arranged in the second housing, the second rotating part is arranged at a moving end of the translation part, the rotating table is arranged at a rotating end of the second rotating part, the wafer is placed on the rotating table, and the second camera is arranged on the second housing and located above the wafer.

[0011] By adopting the above technical solution, the robotic arm places the wafer on the rotating table, and the translation part in the second housing drives the rotating table to move through the second rotating part, so that the edge of the wafer moves to directly below the second camera. The second rotating part then drives the wafer to rotate through the rotating table, and the second camera collects the image of the wafer, thereby being able to find the edge of the wafer.

[0012] Preferably, a purification air supply mechanism is provided on the top of the chassis, and a plurality of ventilation holes are provided at intervals on the bottom wall of the chassis.

[0013] By adopting the above technical solution, during the transportation of wafers and liquid crystal square pieces, the purification air supply mechanism purifies the external air and blows it into the chassis, and the air in the chassis is then blown out from the ventilation holes, thereby blowing out the dust in the chassis and improving the cleanliness of the transportation equipment.

[0014] Preferably, a first material table is provided in the chassis, two recovery crystal boxes are placed on the first material table, and a sealing door is rotatably installed on the side wall of the chassis close to the first material table.

[0015] By adopting the above technical solution, qualified wafers and liquid crystal squares are sent back to the loading and unloading mechanism along the original route, and unqualified wafers and liquid crystal squares are sent to the recycling crystal box on the first material table. When the recycling crystal box is full, the sealing door is opened to replace the recycling crystal box.

[0016] Preferably, the mechanical arm includes a mounting seat, a lifting column, a first rotating arm, a second rotating arm, a third rotating arm and a bracket, the mounting seat is arranged at the moving end of the moving mechanism, the lifting column is lifted and lowered in the mounting seat, the first rotating arm is rotatably arranged at the top end of the lifting column, the second rotating arm is rotatably arranged at an end of the first rotating arm away from the lifting column, the third rotating arm is rotatably arranged at an end of the second rotating arm away from the first rotating arm, and the bracket is fixedly arranged at an end of the third rotating arm away from the second rotating arm.

[0017] By adopting the above technical solution, the moving mechanism drives the mounting base to move, and the lifting column, the first rotating arm, the second rotating arm and the third rotating arm drive the bracket to move freely in three-dimensional space, so that the bracket can hold up the wafer and the liquid crystal square piece, thereby being able to transport the wafer and the liquid crystal square piece.

[0018] Preferably, a first driving member is fixedly arranged in the third rotating arm, a sliding plate is arranged at the driving end of the first driving member, the sliding plate is slidably arranged on the bracket, a second driving member is arranged on the sliding plate, a push plate is arranged at the driving end of the second driving member, the push plate is slidably arranged on the bracket, two limiting members are arranged on the end of the bracket away from the third rotating arm and on the push plate, four limiting members abut and limit the wafer, two sliding grooves are arranged at intervals along a direction perpendicular to the moving direction of the sliding plate, the sliding plate is located in the sliding groove and is provided with a slider which is slidably arranged, two rotating rods are rotatably arranged on the two sliding rods, a rotating member for driving the rotating rod to rotate is arranged on the sliding rod, a limiting rod is arranged at the end of the rotating rod away from the sliding rod, the four limiting members and the two limiting rods abut and limit the four sides of the liquid crystal square piece, a guide groove is symmetrically inclined along the width direction of the bracket on the top wall, and the two guide grooves are inclined in a direction away from each other near the end of the third rotating arm, a guide block is fixedly arranged on the bottom wall of the slider, and the guide block is slidably arranged in the guide groove along the inclined direction of the guide groove.

[0019] By adopting the above technical solution, when the bracket holds up the wafer, the second driving member drives the two limiting members to move through the push plate, so that the four limiting members abut against the wafer to limit the position. When the bracket holds up the liquid crystal square, the second driving member drives the two limiting members to move through the push plate, and the four limiting members abut against the two opposite sides of the liquid crystal square. The rotating member then drives the limiting rod to move through the rotating rod, and the two limiting members abut against the other two sides of the liquid crystal square, and then abut against the four sides of the liquid crystal square, so that the wafer and the liquid crystal square are not easy to move during the movement of the bracket. The first driving member drives the slide plate to move, and the slide plate drives the push plate to move, and the distance between the four limiting members is adjusted, so that the four limiting members can limit the wafers and liquid crystal squares of different sizes. During the movement of the slide plate, the slider is driven to move in the slide groove, and the slider drives the guide block to move in the guide groove, so that the position of the slider on the slide is adjusted synchronously, so that the two limiting rods can limit the liquid crystal squares of different sizes.

[0020] Preferably, the slide plate is provided with two cover plates slidably and detachably above the two sliders, and two hooks are fixedly installed at the ends of the two cover plates close to each other, four slots are provided in the slide plate, the four hooks are engaged in the four slots and fix the two cover plates to the slide plate, an unlocking block is fixedly provided on the side wall of the third rotating arm close to the slide plate, two unlocking plates are provided in the slide plate, one unlocking plate abuts against two hooks, when the slide plate moves to be close to one end of the first driving member, the unlocking block is inserted into the slide plate and pushes the hook to unlock through the unlocking plate, and a plurality of first elastic members are provided in the slide plate, the plurality of first elastic members abut against the two cover plates and are used to push the two cover plates to slide in a direction away from each other.

[0021] By adopting the above technical solution, the two cover plates press down the two sliders, making the sliding of the sliders more stable. When the slider, rotating rod, rotating part or limit rod needs to be repaired and replaced, the first driving part drives the slider to move toward the direction close to the third rotating arm, the unlocking block is inserted into the slider and pushes the hook to unlock through the unlocking plate, and the first elastic part pushes the two cover plates to slide away from each other, thereby facilitating the removal of the cover plates and the removal of the sliders. After the repair and replacement is completed, the two cover plates are slid toward each other, and the hooks on the cover plates are engaged in the slots, so that the cover plates can be quickly installed.

[0022] Preferably, the limiting member includes a rod body, a limiting plate and an elastic reset member, the rod body is fixedly mounted on the push plate and the bracket, the limiting plate is rotatably arranged on the rod body, the elastic reset member is arranged in the rod body and is used to drive the limiting plate to rotate and reset, a groove is formed on the side wall of the limiting plate, and elastic pads are arranged on the side wall and the groove of the limiting plate, the side wall of the wafer abuts against the groove of the limiting plate, and the side wall of the liquid crystal square abuts against the side wall of the limiting plate.

[0023] By adopting the above technical scheme, when the four limit members abut and limit the liquid crystal square, the side wall of the limit plate abuts against the side wall of the liquid crystal square; when the four limit members abut and limit the wafer, the wafer will push the limit plate to rotate on the rod body, so that the side wall of the wafer enters the groove, increasing the contact area between the limit plate and the wafer, thereby improving the stability of the abutment of the limit members; when the wafer is removed, the elastic reset member drives the limit plate to rotate and reset, thereby facilitating the abutment and limiting of the liquid crystal square again, and the elastic pad protects the abutment between the wafer and the liquid crystal square, reducing the damage to the wafer and the liquid crystal square.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. Using the wafer edge-finding mechanism and the square piece edge-finding mechanism, the wafer and the liquid crystal square piece are placed in two feeding and discharging mechanisms, the moving mechanism drives the mechanical arm to move to the feeding and discharging mechanism, the mechanical arm grabs a wafer and places it on the wafer edge-finding mechanism, the wafer edge-finding mechanism performs edge-finding on the wafer, the mechanical arm then places the wafer at the detection port of the wafer conveying device after edge-finding, and the detection mechanism then detects the wafer, or the mechanical arm grabs a liquid crystal square piece and places it on the square piece edge-finding mechanism, the square piece edge-finding mechanism performs edge-finding on the liquid crystal square piece, the mechanical arm then places the wafer at the detection port of the liquid crystal square conveying device after edge-finding, and the detection mechanism then detects the liquid crystal square piece, one handling device can simultaneously carry the wafer and the liquid crystal square piece, thereby reducing the production cost of the wafer and the liquid crystal square piece;

[0026] 2. With the help of the purification air supply mechanism, during the transportation of wafers and LCD squares, the purification air supply mechanism purifies the external air and blows it into the chassis, and the air in the chassis is then blown out from the ventilation holes, thereby blowing out the dust in the chassis and improving the cleanliness of the transportation equipment;

[0027] 3. The wafer and the liquid crystal square are abutted and limited by four limit members and two limit rods, so that the wafer and the liquid crystal square will not move during the movement of the bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall structure of the semiconductor product handling equipment in Example 1 of the present application;

[0029] Figure 2 This is a partial structural schematic diagram of the semiconductor product handling equipment in Example 1 of the present application;

[0030] Figure 3 For this application Figure 2 The enlarged schematic diagram at A in the middle;

[0031] Figure 4 This is a schematic diagram of the structure of the semiconductor product handling equipment in Example 1 of the present application to highlight the edge-finding mechanism of the square piece;

[0032] Figure 5 This is a schematic diagram of the structure of the semiconductor product handling equipment in Example 1 of the present application to highlight the wafer edge finding mechanism;

[0033] Figure 6 This is a schematic diagram of the structure of Example 2 of the present application;

[0034] Figure 7 This is a structural cross-sectional view of Example 2 of the present application;

[0035] Figure 8 This is a partial structural exploded diagram of Example 2 of the present application;

[0036] Fig. 9 This is a partial structural cross-sectional view of Example 2 of the present application;

[0037] Fig.10 This is a partial structural exploded view of Example 2 of the present application, which is used to highlight the limiting member;

[0038] Fig.11 This is a partial structural cross-sectional view of Example 2 of the present application, which is used to highlight the connection between the hook and the slot;

[0039] Fig.12 For this application Fig.11 The enlarged schematic diagram at C in the middle;

[0040] Fig.13 For this application Figure 8 The enlarged schematic diagram of point B in the middle;

[0041] Fig.14 This is a structural diagram of Example 2 of the present application, which highlights the first limit block and the second limit block.

[0042] Figure numerals: 1, chassis; 2, material inlet and outlet mechanism; 3, detection port; 4, mechanical arm; 41, mounting seat; 42, lifting column; 43, first rotating arm; 44, second rotating arm; 45, third rotating arm; 46, bracket; 5, moving mechanism; 6, wafer edge-finding mechanism; 61, second housing; 62, translation part; 63, second rotating part; 64, rotating table; 65, second camera; 7, wafer edge-finding mechanism; 71, first housing; 72, X-axis moving part; 73, Y-axis moving part; 74, first rotating part; 75, moving table; 76, first camera; 8, purification air supply mechanism; 9, ventilation hole; 10, first material table; 11, recovery crystal box; 12, sealing door; 13, first driving member; 14, slide plate; 15, a second driving member; 16, a push plate; 17, a limiting member; 171, a rod body; 172, a limiting plate; 173, an elastic reset member; 18, a slide groove; 19, a slider; 20, a rotating rod; 21, a rotating member; 22, a limiting rod; 23, a guide groove; 24, a guide block; 25, a cover plate; 26, a hook; 27, a slot; 29, an unlocking block; 30, an unlocking plate; 31, a first elastic member; 32, a groove; 33, an elastic pad; 34, a second material platform; 35, a movable frame; 36, a supporting pad; 37, a limiting strip; 38, a limiting groove; 39, a trigger block; 40, a push block; 401, a slot; 402, a withdrawal slot; 403, a mounting block; 404, a second elastic member; 405, a first limiting block; 406, a second limiting block. DETAILED DESCRIPTION

[0043] The following is combined with Figure 1-Figure 14 This application is described in further detail.

[0044] Embodiment 1:

[0045] The embodiment of the present application discloses a semiconductor product handling device.

[0046] Reference Figure 1 and Figure 2 A semiconductor product handling device includes a chassis 1, two feeding and discharging mechanisms 2 are installed at one end of the chassis 1 in the length direction, and a detection port 3 is opened at the other end of the chassis 1 in the length direction. A moving mechanism 5 is installed in the chassis 1, and a mechanical arm 4 is fixedly installed on the moving end of the moving mechanism 5. The moving mechanism 5 drives the mechanical arm 4 to reciprocate in the chassis 1 along the length direction of the chassis 1. In this application, the feeding and discharging mechanism 2 can be selected as a wafer handling machine, and the moving mechanism 5 can be selected as a linear module.

[0047] A first material table 10 and a second material table 34 are fixedly installed in the chassis 1 at one end close to the material inlet and outlet mechanism 2 and on both sides of the movable mechanism 5. A wafer edge-finding mechanism 6 and a square piece edge-finding mechanism 7 are installed on the second material table 34. Two recovery crystal boxes 11 are placed on the first material table 10, and two sealing doors 12 are rotatably installed on the side wall of the chassis 1 close to the first material table 10.

[0048] Wafers and liquid crystal squares of different sizes are placed in two crystal boxes, and the two crystal boxes are placed in two feeding and discharging mechanisms 2. The feeding and discharging mechanisms 2 send the crystal boxes into the chassis 1. The moving mechanism 5 drives the mechanical arm 4 to move to the feeding and discharging mechanism 2. The mechanical arm 4 grabs a wafer or a liquid crystal square, and places the wafer on the wafer edge-finding mechanism 6, and places the liquid crystal square on the square edge-finding mechanism 7. After the wafer and the liquid crystal square complete the edge-finding, the mechanical arm 4 then transports the wafer or the liquid crystal square to the detection port 3, and the detection mechanism detects the wafer or the liquid crystal square. The mechanical arm 4 then sends the qualified wafer or the liquid crystal square back to the crystal box of the feeding and discharging mechanism 2, and transports the unqualified wafer or the liquid crystal square to the recycling crystal box 11. This allows one handling device to carry wafers and liquid crystal squares at the same time, thereby reducing the production cost of wafers and liquid crystal squares. When the recycling crystal box 11 is full, the sealing door 12 can be opened to replace the recycling crystal box 11.

[0049] Reference Figure 2 and Figure 3 Specifically, the mechanical arm 4 includes a mounting seat 41, a lifting column 42, a first rotating arm 43, a second rotating arm 44, a third rotating arm 45 and a bracket 46. The mounting seat 41 is fixedly mounted on the moving end of the moving mechanism 5. The lifting column 42 is mounted on the middle of the top end of the mounting seat 41 to lift and slide in the vertical direction. The first rotating arm 43 is rotatably mounted on the top end of the lifting column 42 and is perpendicular to the lifting column 42. The second rotating arm 44 is rotatably mounted on the first rotating arm 43, and the second rotating arm 44 is located at one end of the first rotating arm 43 away from the lifting column 42. The third rotating arm 45 is rotatably mounted on the second rotating arm 44, and the third rotating arm 45 is located at one end of the second rotating arm 44 away from the first rotating arm 43. The bracket 46 is fixedly mounted on the third rotating arm 45, and the bracket 46 is located at one end of the third rotating arm 45 away from the second rotating arm 44. The bracket 46 is U-shaped, and the U-shaped open end of the bracket 46 is located on the side away from the third rotating arm 45, and three supporting pads 36 are fixedly mounted on the bracket 46.

[0050] The moving mechanism 5 drives the mounting seat 41 to move back and forth in the chassis 1 along the length direction of the chassis 1. The mounting seat 41 drives the lifting column 42, the first rotating arm 43, the second rotating arm 44, the third rotating arm 45 and the bracket 46 to move. The first rotating arm 43, the second rotating arm 44 and the third rotating arm 45 can drive the bracket 46 to move freely on the horizontal plane, so that the bracket 46 can extend into the crystal box. At this time, the bracket 46 is located below the wafer or liquid crystal square to be moved. The lifting column 42 can drive the bracket 46 to move up and down. After the bracket 46 rises, it holds up the wafer or liquid crystal square. The first rotating arm 43, the second rotating arm 44 and the third rotating arm 45 then drive the bracket 46 to move on the horizontal plane, so that the wafer and the liquid crystal square can be transported, thereby reducing the production cost of the wafer and the liquid crystal square.

[0051] Reference Figure 2 and Figure 4 The square edge-finding mechanism 7 includes a first housing 71, an X-axis moving part 72, a Y-axis moving part 73, a first rotating part 74, a moving platform 75 and a first camera 76. The first housing 71 is mounted on the second material platform 34, the X-axis moving part 72 is fixedly mounted in the first housing 71, the Y-axis moving part 73 is fixedly mounted on the translation end of the X-axis moving part 72, the first rotating part 74 is fixedly mounted on the translation end of the Y-axis moving part 73, and the moving platform 75 is fixedly mounted on the rotation end of the first rotating part 74. The first camera 76 is fixedly mounted on the first housing 71 through a column, and the first camera 76 is located above the moving platform 75. In the present application, both the X-axis moving part 72 and the Y-axis moving part 73 can be composed of a combination of a servo motor and a screw module, and the first rotating part 74 can be selected as a servo motor.

[0052] The robot arm 4 places the liquid crystal square on the moving table 75, and the X-axis moving part 72 and the Y-axis moving part 73 in the first housing 71 drive the moving table 75 to move freely on the horizontal plane, so that the edge of the liquid crystal square moves directly under the first camera 76, and the first rotating part 74 drives the liquid crystal square to rotate, and the first camera 76 collects the image of the liquid crystal square, so as to find the edge of the liquid crystal square.

[0053] Reference Figure 2 and Figure 5 The wafer edge-finding mechanism 6 includes a second housing 61, a translation part 62, a second rotating part 63, a rotating table 64 and a second camera 65. The second housing is mounted on the second material table 34, the translation part 62 is fixedly mounted in the second housing 61, the second rotating part 63 is fixedly mounted at the translation end of the translation part 62, and the rotating table 64 is fixedly mounted at the rotating end of the second rotating part 63. The second camera 65 is fixedly mounted on the second housing 61 through a column, and the second camera 65 is located above the rotating table 64. In the present application, the translation part 62 can be composed of a servo motor and a screw module, and the second rotating part 63 can be selected as a servo motor.

[0054] The robot arm 4 places the wafer on the rotating table 64, and the translation part 62 in the second housing 61 drives the wafer to translate, so that the edge of the wafer moves to directly below the second camera 65, and the second rotating part 63 drives the wafer to rotate, and the second camera 65 collects the image of the wafer, so as to find the edge of the wafer.

[0055] Reference Figure 1 and Figure 2 On the top wall of the chassis 1, three purification air supply mechanisms 8 are fixedly installed at equal intervals along its length direction, and on the bottom wall of the chassis 1, a plurality of ventilation holes 9 are spaced apart. In the present application, the purification air supply mechanism 8 can be selected as an FFU laminar air supply device. During the transportation of wafers and liquid crystal squares, the purification air supply mechanism 8 purifies the external air and blows it into the chassis 1, and the air in the chassis 1 is then blown out from the ventilation holes 9, thereby blowing out the dust in the chassis 1 and improving the cleanliness of the transportation equipment.

[0056] The implementation principle of a semiconductor product handling device in the embodiment of the present application is as follows: the moving mechanism 5 drives the mechanical arm 4 to move to the feeding and discharging mechanism 2, the mechanical arm 4 grabs a wafer or a liquid crystal square, and places the wafer on the wafer edge finding mechanism 6, and places the liquid crystal square on the square edge finding mechanism 7. After the wafer and the liquid crystal square complete edge finding, the mechanical arm 4 then transports the wafer or the liquid crystal square to the detection port 3, and the detection mechanism detects the wafer or the liquid crystal square. The mechanical arm 4 then returns the qualified wafer or liquid crystal square to the crystal box of the feeding and discharging mechanism 2, and transports the unqualified wafer or liquid crystal square to the recycling crystal box 11. This allows a handling device to simultaneously transport wafers or liquid crystal squares, thereby reducing the production cost of wafers and liquid crystal squares.

[0057] Embodiment 2:

[0058] Reference Figure 6 and Figure 7 The difference between this embodiment and the first embodiment is that the first driving member 13 is fixedly installed in the third rotating arm 45, the slide plate 14 is slidably installed on the bracket 46 along its length direction, the moving frame 35 is fixedly installed on the side wall of the slide plate 14, the moving frame 35 slides through the third rotating arm 45, and the driving end of the first driving member 13 is threaded through the moving frame 35. In the present application, the first driving member 13 can be selected as a servo motor, and when the first driving member 13 rotates, it can drive the slide plate 14 to move on the bracket 46 along the length direction of the bracket 46 through the moving frame 35.

[0059] A second driving member 15 is fixedly mounted in the middle of the top wall of the slide plate 14, and a push plate 16 is fixedly mounted on the driving end of the second driving member 15. The push plate 16 is located on the side of the slide plate 14 away from the first driving member 13. In the present application, the second driving member 15 can be selected as a cylinder, and the second driving member 15 can drive the push plate 16 to reciprocate along the length direction of the bracket 46. Limiting members 17 are installed on both sides of the bracket 46 close to the U-shaped opening end and on both ends of the side wall of the push plate 16 away from the slide plate 14.

[0060] When the bracket 46 moves upward to hold up the wafer, the second driving member 15 drives the two limiting members 17 to move through the push plate 16, so that the four limiting members 17 abut against the wafer to limit the position, so that the wafer will not move during the movement of the robot 4. When transporting wafers of different sizes, the first driving member 13 drives the slide plate 14 to move through the moving frame 35, and then drives the second driving member 15 and the push plate 16 to move along the length direction of the bracket 46, so that the four limiting members 17 can be suitable for limiting the position of wafers of different sizes.

[0061] Reference Figure 7 and Figure 8 Two slide grooves 18 are symmetrically provided on the slide plate 14 along its length direction. A slider 19 is slidably installed in each slide groove 18 of the slide plate 14. A rotating rod 20 is rotatably installed on the top wall of the two sliders 19 at one end away from each other. A limit rod 22 is fixedly installed on the end of the rotating rod 20 away from the slider 19. A rotating member 21 is fixedly installed on the top wall of the two sliders 19 at one end away from each other. The rotating end of the rotating member 21 is fixedly connected to the rotating rod 20. In the present application, the rotating member 21 can be selected as a rotary cylinder.

[0062] When the bracket 46 moves upward to lift the liquid crystal square, the second driving member 15 drives the two limiting members 17 to move through the push plate 16, so that the four limiting members 17 abut against and limit the opposite side walls of the liquid crystal square. After the bracket 46 drives the liquid crystal square to move out of the crystal box, the two rotating members drive the two rotating rods 20 to rotate, and the two rotating rods 20 drive the two limiting rods 22 to move, and the two limiting rods 22 abut against and limit the other two opposite side walls of the liquid crystal square, and then abut against and limit the four sides of the liquid crystal square, so that the liquid crystal square will not move during the movement of the mechanical arm 4.

[0063] Reference Figure 7 , Figure 8 and Fig. 9Two guide grooves 23 are formed on the top wall of the bracket 46. The two guide grooves 23 are formed symmetrically along the width direction of the bracket 46. The guide grooves 23 are formed obliquely. The distance between the two guide grooves 23 near the opening end of the U-shaped bracket 46 is smaller than the distance between the two guide grooves 23 far from the opening end of the U-shaped bracket 46. A guide block 24 is fixedly mounted on the bottom wall of the slider 19. The guide block 24 is slidably mounted in the guide groove 23 along the length direction of the guide groove 23. The cross sections of the guide block 24 and the guide groove 23 are both T-shaped.

[0064] When transporting liquid crystal squares of different sizes, the first driving member 13 drives the slide plate 14 to move through the moving frame 35, and then drives the second driving member 15 and the push plate 16 to move along the length direction of the bracket 46, so that the four limiting members 17 can be used to limit the liquid crystal squares of different sizes. During the movement of the slide plate 14, the slider 19 is driven to move, and the slider 19 drives the guide block 24 to move in the guide groove 23. Under the action of the guide block 24 and the guide groove 23, the slider 19 moves in the slide groove 18, thereby driving the rotating rod 20 to move. The ratio of the moving distance of the slide plate 14 to the sliding distance of the slider 19 in the slide groove 18 is 2:1, so that when the two rotating rods 20 drive the limiting rod 22 to rotate, the limiting rod 22 can be used to limit the liquid crystal squares of different sizes.

[0065] Reference Figure 6 , Figure 7 and Fig.10 The limiting member 17 includes a rod body 171, a limiting plate 172 and an elastic reset member 173. Two mounting blocks 403 are fixedly mounted on the side wall of the push plate 16. The two rod bodies 171 are fixedly mounted on the top wall of the bracket 46. The two rod bodies 171 are fixedly mounted on the bottom walls of the two mounting blocks 403. The limiting plate 172 is rotatably mounted on the end of the rod body 171. The elastic reset member 173 is installed in the rod body 171 and is fixedly connected to the rotating shaft of the limiting plate 172. In the present application, the elastic reset member 173 can be selected as a torsion spring.

[0066] The middle part of the side wall of the limiting plate 172 near the wafer and the liquid crystal square is inwardly concave to form a groove 32, and the side wall of the limiting plate 172 near the wafer and the liquid crystal square and the groove 32 are fixedly installed with an elastic pad 33. The side wall of the wafer abuts in the groove 32 of the limiting plate 172, and the side wall of the liquid crystal square abuts on the side wall of the limiting plate 172.

[0067] When the four limiting members 17 abut against the liquid crystal square, the side wall of the limiting plate 172 abuts against the side wall of the liquid crystal square. When the four limiting members 17 abut against the wafer, the wafer will push the limiting plate 172 to rotate on the rod 171, so that the side wall of the wafer enters the groove 32, increasing the contact area between the limiting plate 172 and the wafer, thereby improving the stability of the abutment of the limiting member 17. The elastic pad 33 protects the abutment between the wafer and the liquid crystal square, reducing the damage to the wafer and the liquid crystal square. When the wafer is removed, the elastic reset member 173 drives the limiting plate 172 to rotate and reset, so as to facilitate the abutment and limiting of the liquid crystal square or wafer again.

[0068] Reference Figure 8 Two cover plates 25 are slidably and detachably mounted on the slide plate 14. The cover plates 25 are U-shaped, and the open ends of the two U-shaped cover plates 25 are located at one end close to each other. Two limiting bars 37 are fixedly mounted on the bottom wall of each cover plate 25. Four limiting grooves 38 are opened on the top wall of the slide plate 14. The limiting bars 37 are slidably mounted in the limiting grooves 38 along the length direction of the slide plate 14. When the cover plate 25 slides on the slide plate 14, the limiting bars 37 slide in the limiting grooves 38 and limit the sliding of the cover plate 25, so that the sliding of the cover plate 25 is more stable.

[0069] Reference Figure 8 , Fig.11 and Fig.12 Two hooks 26 are fixedly installed on the side wall of the open end of each cover plate 25, and four slots 27 are opened in the slide plate 14. When the cover plate 25 is slidably installed on the slide plate 14, the four hooks 26 are inserted into the four slots 27, so that the cover plate 25 can be quickly installed on the slide plate 14.

[0070] Reference Figure 8 and Fig.13 The end of the slide plate 14 in the limiting groove 38 is provided with a first elastic member 31, and the first elastic member 31 abuts against the end of the limiting strip 37. In the present application, the first elastic member 31 can be a spring. When the cover plate 25 is installed on the slide plate 14, the limiting strip 37 moves to squeeze the first elastic member 31 to shrink and deform.

[0071] Reference Figure 7 , Figure 8 , Fig.11 and Fig.12Two unlocking plates 30 are slidably installed in the slider 19. Push blocks 40 are formed on both sides of the ends of the two unlocking plates 30 away from each other. The four push blocks 40 abut against the four hooks 26. A trigger block 39 is formed in the middle of the side walls of the two unlocking plates 30 close to each other. Two second elastic members 404 are installed between the two unlocking plates 30. In this application, the second elastic member 404 can be selected as a spring. An unlocking block 29 is fixedly installed on the side wall of the third rotating arm 45 close to the slide plate 14. A slot 401 is opened in the middle of the side wall of the slider 19 close to the third rotating arm 45. The two trigger blocks 39 are located in the slot 401. An exit slot 402 is opened at one end of the slide plate 14 located at the guide groove 23 away from the opening of the bracket 46.

[0072] When the slider 19, the rotating rod 20, the rotating member 21 or the limiting rod 22 needs to be repaired and replaced, the first driving member 13 drives the slide plate 14 to move toward the first rotating arm 43, the unlocking block 29 is inserted into the slot 401 of the slide plate 14, the unlocking block 29 drives the two unlocking plates 30 to move away from each other through the two triggering blocks 39, and the two unlocking plates 30 push the hook 26 to move through the push block 40, so that the hook 26 is disengaged from the slot 27, and the first elastic member 31 pushes the two cover plates 25 to slide away from each other, so as to facilitate the quick removal of the cover plates 25. And the exit slot 402 facilitates the guide block 24 to exit the guide slot 23.

[0073] Reference Fig.14 , the side walls of the two mounting blocks 403 that are away from each other are fixedly mounted with first limit blocks 405, the first limit blocks 405 are in an inverted F shape, and the two first limit blocks 405 are slidably mounted on the two side walls in the width direction of the bracket 46. When the push plate 16 moves, the two first limit blocks 405 limit the movement of the push plate 16, so that the movement of the push plate 16 is more stable. Four second limit blocks are fixedly mounted on the bottom wall of the slide plate 14, the second limit blocks are in an L shape, and the four second limit blocks 406 are slidably mounted on the two side walls in the width direction of the bracket 46 respectively. When the slide plate 14 moves, the four second limit blocks 406 limit the movement of the slide plate 14, so that the movement of the slide plate 14 is more stable.

[0074] The implementation principle of Example 2 of the present application is as follows: when the bracket 46 moves upward to hold up the wafer, the second driving member 15 drives the two limiting members 17 to move through the push plate 16, so that the four limiting members 17 abut against and limit the wafer, so that the wafer will not move during the movement of the robot 4. When the bracket 46 moves upward to hold up the liquid crystal square, the second driving member 15 drives the two limiting members 17 to move through the push plate 16, so that the four limiting members 17 abut against and limit the opposite side walls of the liquid crystal square. After the bracket 46 drives the liquid crystal square to move out of the crystal box, the two rotating members drive the two rotating rods 20 to rotate, and the two rotating rods 20 drive the two limiting rods 22 to move, and the two limiting rods 22 abut against and limit the other two opposite side walls of the liquid crystal square, and then abut against and limit the four sides of the liquid crystal square, so that the liquid crystal square will not move during the movement of the robot 4.

[0075] The above are only optional embodiments of the present disclosure and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A semiconductor product handling device, characterized in that: The invention comprises a chassis (1), wherein two feeding and discharging mechanisms (2) are arranged on one side of the chassis (1), a detection port (3) is opened on the other side of the chassis (1), a mechanical arm (4) is arranged inside the chassis (1), a moving mechanism (5) is arranged inside the chassis (1) for driving the mechanical arm (4) to move back and forth between the feeding and discharging mechanisms (2) and the detection port (3), a wafer edge finding mechanism (6) is arranged inside the chassis (1), and a square piece edge finding mechanism (7) is arranged inside the chassis (1), and the wafer edge finding mechanism (6) and the square piece edge finding mechanism (7) are both located between the feeding and discharging mechanisms (2) and the detection port (3); The mechanical arm (4) comprises a mounting seat (41), a lifting column (42), a first rotating arm (43), a second rotating arm (44), a third rotating arm (45) and a bracket (46); the mounting seat (41) is arranged at the moving end of the moving mechanism (5); the lifting column (42) is arranged in the mounting seat (41) for lifting; the first rotating arm (43) is rotatably arranged at the top end of the lifting column (42); the second rotating arm (44) is rotatably arranged at an end of the first rotating arm (43) away from the lifting column (42); the third rotating arm (45) is rotatably arranged at an end of the second rotating arm (44) away from the first rotating arm (43); and the bracket (46) is fixedly arranged at an end of the third rotating arm (45) away from the second rotating arm (44); A first driving member (13) is fixedly arranged inside the third rotating arm (45), a slide plate (14) is arranged at the driving end of the first driving member (13), the slide plate (14) is slidably arranged on the bracket (46), a second driving member (15) is arranged on the slide plate (14), a push plate (16) is arranged at the driving end of the second driving member (15), the push plate (16) is slidably arranged on the bracket (46), two limiting members (17) are arranged on one end of the bracket (46) away from the third rotating arm (45) and on the push plate (16), the four limiting members (17) are used to abut and limit the wafer, two sliding grooves (18) are arranged on the slide plate (14) at intervals along a direction perpendicular to the moving direction of the slide plate (14), and the slide plate (14) is slidably arranged in the sliding groove (18) A slider (19), two sliders (19) are both rotatably provided with a rotating rod (20), the slider (19) is provided with a rotating member (21) for driving the rotating rod (20) to rotate, a limiting rod (22) is provided at one end of the rotating rod (20) away from the slider (19), the four limiting members (17) and the two limiting rods (22) are used to abut and limit the four sides of the liquid crystal square plate, a guide groove (23) is symmetrically inclined along its width direction on the top wall of the bracket (46), the two guide grooves (23) are inclined in a direction away from each other at one end close to the third rotating arm (45), a guide block (24) is fixedly provided on the bottom wall of the slider (19), and the guide block (24) is slidably arranged in the guide groove (23) along the inclined direction of the guide groove (23).

2. The semiconductor product handling equipment according to claim 1, characterized in that: The square piece edge-finding mechanism (7) comprises a first housing (71), an X-axis moving part (72), a Y-axis moving part (73), a first rotating part (74), a moving platform (75) and a first camera (76); the first housing (71) is arranged in the chassis (1); the X-axis moving part (72) is arranged in the first housing (71); the Y-axis moving part (73) is arranged at the moving end of the X-axis moving part (72); the first rotating part (74) is arranged at the moving end of the Y-axis moving part (73); the moving platform (75) is arranged at the rotating end of the first rotating part (74); the liquid crystal square piece is placed on the moving platform (75); and the first camera (76) is arranged on the first housing (71) and is located above the liquid crystal square piece.

3. The semiconductor product handling equipment according to claim 1, characterized in that: The wafer edge-finding mechanism (6) comprises a second housing (61), a translation part (62), a second rotating part (63), a rotating table (64) and a second camera (65); the second housing (61) is arranged in the chassis (1); the translation part (62) is arranged in the second housing (61); the second rotating part (63) is arranged at the moving end of the translation part (62); the rotating table (64) is arranged at the rotating end of the second rotating part (63); the wafer is placed on the rotating table (64); and the second camera (65) is arranged on the second housing (61) and is located above the wafer.

4. The semiconductor product handling equipment according to claim 1, characterized in that: A purification air supply mechanism (8) is provided on the top of the chassis (1), and a plurality of ventilation holes (9) are provided at intervals on the bottom wall of the chassis (1).

5. The semiconductor product handling equipment according to claim 1, characterized in that: A first material table (10) is arranged in the machine case (1), two recovery crystal boxes (11) are placed on the first material table (10), and a sealing door (12) is rotatably mounted on the side wall of the machine case (1) close to the first material table (10).

6. The semiconductor product handling equipment according to claim 1, characterized in that: The slide plate (14) is provided with two cover plates (25) above the two sliders (19) and can be slidably disassembled. Two hooks (26) are fixedly mounted on the ends of the two cover plates (25) close to each other. Four card slots (27) are provided in the slide plate (19). The four hooks (26) are engaged in the four card slots (27) and fix the two cover plates (25) on the slide plate (14). An unlocking block (29) is fixedly arranged on the side wall of the third rotating arm (45) close to the slide plate (14). Two unlocking plates (30) are arranged in the block (19), and one of the unlocking plates (30) abuts against two hooks (26). When the slide plate (14) moves close to one end of the first driving member (13), the unlocking block (29) is inserted into the slide plate (14) and pushes the hooks (26) to unlock through the unlocking plate (30). A plurality of first elastic members (31) are arranged in the slide plate (14), and the plurality of first elastic members (31) abut against the two cover plates (25) and are used to push the two cover plates (25) to slide in a direction away from each other.

7. The semiconductor product handling equipment according to claim 1, characterized in that: The limiting member (17) comprises a rod body (171), a limiting plate (172) and an elastic reset member (173); the rod body (171) is fixedly mounted on the push plate (16) and the bracket (46); the limiting plate (172) is rotatably mounted on the rod body (171); the elastic reset member (173) is arranged in the rod body (171) and is used to drive the limiting plate (172) to rotate and reset; a groove (32) is formed on the side wall of the limiting plate (172); an elastic pad (33) is arranged on the side wall and the groove (32) of the limiting plate (172); the side wall of the wafer abuts against the groove (32) of the limiting plate (172); and the side wall of the liquid crystal square plate abuts against the side wall of the limiting plate (172).

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