Electronic package and fabrication method thereof
By providing support on the substrate structure, combining it with the packaging structure, and forming conductive elements during the heating process, the problem of solder unwetted and contact bridged in the prior art is solved, and a more stable electronic packaging effect is achieved.
Patent Information
- Application Number
- CN202311344272.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-12
- Filing Date
- 2023-10-17
- Publication Date
- 2025-04-15
AI Technical Summary
Existing electronic packages are prone to warping at high temperatures, resulting in unbonding of solder and pre-solder or unwetting problems, or short circuits caused by contact bridging.
A plurality of support members are provided on the substrate structure so that when the packaging structure is pressed down to the substrate structure, the support members can be flattened with the packaging structure, and subsequently heat the conductive material to form a conductive element, so that the height of the conductive element and the conductive bump is equal to the height of the support.
It effectively avoids the problem of unwetting and contact bridge after solder heating, and prevents short circuits.
Smart Images
Figure CN119833480A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to an electronic package and a manufacturing method thereof, in particular to an electronic package and a manufacturing method thereof which can avoid solder not being wetted or bridging with a contact. Background Art
[0002] With the development of semiconductor technology, semiconductor products have developed different packaging product types. In the process of placing a semiconductor device on a substrate, the semiconductor device electrically connects the active surface of the chip to the circuit structure through a plurality of solder bumps, and a plurality of conductive elements that can serve as input / output (I / O) terminals are planted on the other surface of the circuit structure to configure the semiconductor device on the substrate through the conductive elements.
[0003] like Figure 1 In the conventional electronic package 1 shown, a package structure 10 is first provided, wherein a plurality of electronic components 12 are disposed on a first side 11a of a circuit structure 11 by flip-chip bonding, and a plurality of conductive bumps 13 are disposed on a second side 11b of the circuit structure 11. Next, a jig 18 is used to vacuum-absorb the package structure 10 to dispose the package structure 10 on a substrate structure 15, wherein a solder material 14 is formed on the plurality of conductive bumps 13, and a pre-solder 17 is formed on a plurality of electrical contact pads 16 of the substrate structure 15, and the solder material 14 is connected to the pre-solder 17 to align and bond the package structure 10 and the substrate structure 15.
[0004] However, the package structure 10 is prone to warpage at high temperatures, which makes it impossible for the jig 18 to vacuum-suck the package structure 10. After the package structure 10 is set on the substrate structure 15 using the jig 18, the solder material 14 and the pre-solder 17 are easily not bonded, resulting in a non-wetting problem after heating (as shown in the virtual frame X), or the solder material 14 on the adjacent conductive bumps 13 and the pre-solder 17 on the adjacent electrical contact pads 16 are bonded to each other, resulting in a contact bridge after heating to form a short circuit problem (as shown in the virtual frame Y).
[0005] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention
[0006] In view of the various deficiencies of the above-mentioned prior art, the present invention provides an electronic package, comprising: a substrate structure having a first side and a second side opposite to each other, wherein a plurality of electrical contact pads are arranged on the first side, and an area outside the plurality of electrical contact pads is defined as an open area; a plurality of support members are disposed on the open area on the first side of the substrate structure; and a packaging structure having a plurality of conductive bumps, wherein the plurality of conductive bumps are electrically connected to the plurality of electrical contact pads via a plurality of conductive elements, thereby enabling the packaging structure to be disposed on the first side of the substrate structure and enabling the plurality of support members to be flush with the packaging structure.
[0007] As in the aforementioned electronic package, the heights of the plurality of support members are equal to the heights of the plurality of conductive bumps and the plurality of conductive elements.
[0008] As in the aforementioned electronic package, the plurality of support members are virtual contact bumps or virtual contact columns.
[0009] As in the aforementioned electronic package, the plurality of support members are in the shape of discontinuous rings, irregular polygons, regular polygons or curved contours.
[0010] As in the aforementioned electronic package, each of the plurality of support members is located between at least any two of the plurality of electrical contact pads.
[0011] As in the aforementioned electronic package, the plurality of support members are separated from each other.
[0012] As in the aforementioned electronic package, the plurality of support members are adjacent to the outermost ones of the plurality of electrical contact pads, or adjacent to the central ones of the plurality of electrical contact pads.
[0013] The present invention also provides a method for manufacturing an electronic package, comprising: providing a substrate structure, wherein the substrate structure has a first side and a second side opposite to each other, a plurality of electrical contact pads are arranged on the first side, and the area outside the plurality of electrical contact pads is defined as an open area; a plurality of support members are arranged on the open area on the first side of the substrate structure; and a packaging structure is provided, and the packaging structure is arranged on the first side of the substrate structure, wherein the packaging structure has a plurality of conductive bumps, the plurality of conductive bumps are electrically connected to the plurality of electrical contact pads via a plurality of conductive elements, and the plurality of support members are made flat against the packaging structure.
[0014] As in the aforementioned method for manufacturing an electronic package, the packaging structure is disposed on the first side of the substrate structure via a thermal compression bonding process.
[0015] As in the aforementioned method for manufacturing an electronic package, before the thermocompression bonding process, a plurality of first conductive materials are respectively disposed on the plurality of electrical contact pads, and a plurality of second conductive materials are respectively disposed on the plurality of conductive bumps.
[0016] As in the aforementioned method for manufacturing electronic packages, the thermal compression bonding process first presses the packaging structure downward to make the multiple support members flat against the packaging structure, and allows the multiple second conductive materials to be connected to the multiple first conductive materials, and then heats the multiple first conductive materials and the multiple second conductive materials to weld to form the multiple conductive elements.
[0017] As in the aforementioned method for manufacturing an electronic package, the heights of the plurality of support members are equal to the heights of the plurality of conductive bumps and the plurality of conductive elements.
[0018] As in the aforementioned method for manufacturing an electronic package, the plurality of support members are virtual contact bumps or virtual contact columns.
[0019] As in the aforementioned method for manufacturing an electronic package, the plurality of support members are in the shape of discontinuous rings, irregular polygons, regular polygons or curved contours.
[0020] As in the aforementioned method for manufacturing an electronic package, each of the plurality of support members is located between at least any two of the plurality of electrical contact pads.
[0021] As in the aforementioned method for manufacturing an electronic package, the plurality of support members are separated from each other.
[0022] As in the aforementioned method for manufacturing an electronic package, the plurality of support members are adjacent to the outermost ones of the plurality of electrical contact pads, or adjacent to the central ones of the plurality of electrical contact pads.
[0023] In summary, the electronic package and its manufacturing method of the present invention are provided with a plurality of supporting members on the substrate structure so that when the package structure is pressed down and combined to the substrate structure, the plurality of supporting members have a height standard and can be flat against the package structure. The conductive material is subsequently heated to form a plurality of conductive elements, so that the height of the conductive elements and the conductive bumps can be equal to the height of the supporting members, thereby avoiding the problem of non-wetting and contact bridging to form a short circuit after the solder is heated. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a cross-sectional schematic diagram of an existing electronic package.
[0025] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.
[0026] FIG. 3A to FIG. 3C Schematic top views of different embodiments of the support member in the electronic package of the present invention.
[0027] Main component symbols
[0028] 1.2 Electronic packaging
[0029] 10, 22 Package structure
[0030] 11, 223 Line Structure
[0031] 11a, 20a, 223a first side
[0032] 11b, 20b, 223b Second side
[0033] 12.221 Electronic components
[0034] 13, 224 Conductive bumps
[0035] 14 Solder materials
[0036] 15, 20 Substrate structure
[0037] 200 Dielectric layer
[0038] 201 Line Layer
[0039] 21 Support
[0040] 221a Action surface
[0041] 221b Non-active surface
[0042] 222 Encapsulation Layer
[0043] 225 Conductive element
[0044] 225a First conductive material
[0045] 225b Second conductive material
[0046] 226 Primer
[0047] 227 Strong Firmware
[0048] 228 Solder Bumps
[0049] 16, 202 electrical contact pads
[0050] 17 Pre-soldering
[0051] 18, 23 Jig
[0052] A. Open area
[0053] C, D Ring
[0054] X, Y virtual box. DETAILED DESCRIPTION
[0055] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0056] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment of size should still fall within the scope of the technical contents disclosed by the present invention without affecting the technical effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.
[0057] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention.
[0058] like Figure 2A As shown, a packaging structure 22 is provided. The packaging structure 22 includes at least one electronic element 221 , a packaging layer 222 , a circuit structure 223 and a plurality of conductive bumps 224 .
[0059] The electronic component 221 may be an active component, wherein the active component is, for example, a semiconductor chip with a telecommunication processing function. In this embodiment, two electronic components 221 are shown, which are semiconductor chips, each having an active surface 221a and an inactive surface 221b opposite to each other.
[0060] The circuit structure 223 has a first side 223a and a second side 223b opposite to each other, and can be formed by a circuit redistribution layer (RDL) process. The electrode pad of the active surface 221a of the electronic component 221 is disposed on the first side 223a of the circuit structure 223 in a flip-chip manner through a plurality of conductive bumps such as solder balls, metal pillars (pillar) or others, and is electrically connected to the circuit layer of the circuit structure 223. Alternatively, the electronic component 221 can be electrically connected to the circuit layer of the circuit structure 223 by bonding through a plurality of welding wires (not shown). Alternatively, the electronic component 221 can directly contact the circuit layer of the circuit structure 223 (such as Cu-Cu heterogeneous bonding technology; Cu-Cu hybrid bonding). There are many ways for the electronic component 221 to be electrically connected to the circuit structure 223, and it is not limited to the above-mentioned embodiments.
[0061] The packaging layer 222 is formed on the first side 223a of the circuit structure 223 to cover the electronic component 221. In this embodiment, the material forming the packaging layer 222 is an insulating material, such as a packaging colloid of polyimide (PI) or epoxy resin, which can be formed by molding, lamination or coating. Furthermore, the packaging layer 222 can cover the inactive surface 221b of the electronic component 221, and then undergo a flattening process (such as grinding, cutting or etching) to make the inactive surface 221b of the electronic component 221 flush with the upper surface of the packaging layer 222.
[0062] The conductive bump 224 is disposed on the second side 223 b of the circuit structure 223 and is electrically connected to the circuit layer of the circuit structure 223 and the electronic component 221 .
[0063] In other embodiments, the packaging structure 22 can also be made in combination with a carrier (e.g., a plate made of semiconductor material such as silicon or glass) and a bonding layer thereon (as a sacrificial release layer). For example, the electronic component 221 is disposed on the carrier with its non-active surface 221b, and the packaging layer 222 is disposed on the carrier and covers the electronic component 221. The active surface 221a of the electronic component 221 is exposed through a flattening process (e.g., grinding, cutting or etching), and the circuit structure 223 is disposed on the active surface 221a of the electronic component 221 and the packaging layer 222 with its first side 223a. Afterwards, a plurality of conductive bumps 224 are disposed on the second side 223b of the circuit structure 223, and after removing the carrier and the bonding layer, the packaging structure 22 of the present invention can be obtained. There are many methods for making the packaging structure 22, and it is not limited to the above-mentioned embodiments.
[0064] See also Figure 2B , a substrate structure 20 is provided, and a packaging structure 22 is vacuum-absorbed by a fixture 23 to dispose the packaging structure 22 on the substrate structure 20 .
[0065] The substrate structure 20 has a first side 20a and a second side 20b opposite to each other, and includes a dielectric layer 200 and a circuit layer 201 combined with the dielectric layer 200, wherein the outermost dielectric layer 200 can be used as a solder mask, and the outermost circuit layer 201 is exposed on the solder mask located on the first side 20a to provide an electrical contact pad 202, such as a micro pad (commonly known as μ-pad).
[0066] Furthermore, the material forming the circuit layer 201 is copper, and the material forming the dielectric layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc., or a solder mask material such as green paint and ink.
[0067] In this embodiment, if Figure 3A , Figure 3B or Figure 3C As shown, the plurality of electrical contact pads 202 on the first side 20a of the substrate structure 20 are arranged in an array, and the area outside the plurality of electrical contact pads 202 on the first side 20a can be defined as an open area A. A plurality of support members 21 are disposed on the open area A on the first side 20a of the substrate structure 20 .
[0068] In this embodiment, the support member 21 may be a dummy bump or a dummy pillar without electrical function.
[0069] In one embodiment, each support member 21 is located between at least any two electrical contact pads 202 , and each support member 21 is separated from each other.
[0070] In one embodiment, each support member 21 may be Figure 3A The curved contour shape (such as circle, ellipse) shown in FIG. Figure 3B A regular polygon (such as a rectangle, star, triangle) or an irregular polygon (such as a cone, trapezoid, star, triangle) as shown, or Figure 3C The shape of the support member 21 is not limited to the discontinuous ring with a gap shown in the figure.
[0071] In one embodiment, each support member 21 may be disposed at any position in the open area A, but at least adjacent to the outermost one of the plurality of electrical contact pads 202, such as Figure 3A As shown, the ring C formed by the plurality of support members 21 is located between the outermost circle of electrical contact pads 202 and the adjacent second circle of electrical contact pads 202. Alternatively, at least adjacent to the center of the plurality of electrical contact pads 202, such as Figure 3A As shown in FIG. 1 , the ring D formed by the plurality of support members 21 surrounds the electrical contact pad 202 at the center. In addition, the ring C of the plurality of support members 21 may be changed to Figure 3B or Figure 3C The distribution pattern of the multiple support members 21 is not limited to the above, as long as the distribution of the multiple support members 21 is conducive to flattening the packaging structure 22 in the subsequent process.
[0072] In one embodiment, each of the plurality of support members 21 may have the same height.
[0073] Next, the package structure 22 is vacuum-adsorbed by a jig 23, and the package structure 22 is disposed on a substrate structure 20 for a thermal compression bonding (TCB) process. Before the thermal compression bonding process, a plurality of first conductive materials 225a are disposed on the plurality of electrical contact pads 202, and the plurality of first conductive materials 225a are spaced apart from the plurality of support members 21. In addition, a plurality of second conductive materials 225b are disposed on the plurality of conductive bumps 224.
[0074] It should be understood that the above Figure 2A The process of the packaging structure 22 is Figure 2B There is no sequence for the manufacturing process of the substrate structure 20 . The manufacturing process of the package structure 22 or the substrate structure 20 can be performed first or simultaneously according to the demand.
[0075] like Figure 2C As shown, the package structure 22 is pressed down by the jig 23 so that the second conductive materials 225 b are respectively placed on the first conductive materials 225 a , and the support members 21 are flat against the package structure 22 , that is, flat against the second side 223 b of the circuit structure 223 .
[0076] like Figure 2D As shown, the heating causes the first conductive materials 225a and the second conductive materials 225b to melt and weld to form the conductive elements 225, so that the conductive bumps 224 can be electrically connected to the electrical contact pads 202 via the conductive elements 225. At this time, the heights of the conductive elements 225 and the conductive bumps 224 are equal to the heights of the supporting members 21, thereby avoiding the problem of non-wetting and bridged contacts to form short circuits after the solder is heated.
[0077] like Figure 2E As shown, after removing the jig 23, the electronic package 2 of the present invention can be obtained, and a base glue 226 can be formed as required to cover the conductive element 225 and the conductive bump 224, or a reinforcing member 227 (such as a metal frame, which can eliminate stress concentration and prevent the electronic package 2 from warping) can be formed on the first side 20a of the substrate structure 20 as required, or a plurality of solder bumps 228 can be formed on the second side 20b of the substrate structure 20 as required.
[0078] The present invention further provides an electronic package 2 , which includes a substrate structure 20 , a plurality of support members 21 and a package structure 22 .
[0079] The substrate structure 20 has a first side 20a and a second side 20b opposite to each other, and includes a dielectric layer 200 and a circuit layer 201 combined with the dielectric layer 200, wherein the outermost dielectric layer 200 can be used as a solder mask, and the outermost circuit layer 201 is exposed from the solder mask on the first side 20a to serve as an electrical contact pad 202. In addition, the area outside the electrical contact pad 202 on the first side 20a of the substrate structure 20 can be defined as an open area A.
[0080] The support member 21 is disposed on the empty area A of the first side 20a of the substrate structure 20. In this embodiment, the support member 21 may be a dummy bump or a dummy pillar without electrical function.
[0081] In one embodiment, each support member 21 is located between at least any two electrical contact pads 202 , and each support member 21 is separated from each other and has the same height.
[0082] In one embodiment, each support member 21 may be Figure 3A The curved contour shape (such as circle, ellipse) shown in FIG. Figure 3B A regular polygon (such as a rectangle, star, triangle) or an irregular polygon (such as a cone, trapezoid, star, triangle) as shown, or Figure 3C The discontinuous ring with gaps shown, etc.
[0083] In one embodiment, each support member 21 may be disposed at any position in the open area A, but at least adjacent to the outermost ones of the plurality of electrical contact pads 202 , or at least adjacent to the center ones of the plurality of electrical contact pads 202 .
[0084] The packaging structure 22 includes at least one electronic component 221, a packaging layer 222, a circuit structure 223 and a plurality of conductive bumps 224. The circuit structure 223 has a first side 223a and a second side 223b opposite to each other, the electronic component 221 has an active surface 221a and an inactive surface 221b opposite to each other, and the active surface 221a of the electronic component 221 is disposed on the first side 223a of the circuit structure 223 in a flip-chip manner. The packaging layer 222 is formed on the first side 223a of the circuit structure 223 to cover the electronic component 221. The conductive bumps 224 are disposed on the second side 223b of the circuit structure 223 and are electrically connected to the circuit layer of the circuit structure 223 and the electronic component 221.
[0085] In this embodiment, the conductive bumps 224 are electrically connected to the electrical contact pads 202 via the conductive elements 225 , so that the package structure 22 is disposed on the first side 20 a of the substrate structure 20 and the support members 21 are flush with the second side 223 b of the circuit structure 223 .
[0086] In one embodiment, the heights of the plurality of conductive elements 225 and the plurality of conductive bumps 224 are equal to the heights of the plurality of support members 21 .
[0087] In summary, the electronic package and its manufacturing method of the present invention are provided with a plurality of supporting members on the substrate structure so that when the package structure is pressed down and combined to the substrate structure, the plurality of supporting members have a height standard and can be flat against the package structure. The conductive material is subsequently heated to form a plurality of conductive elements, so that the height of the conductive elements and the conductive bumps can be equal to the height of the supporting members, thereby avoiding the problem of non-wetting and contact bridging to form a short circuit after the solder is heated.
[0088] The above embodiments are only used to illustrate the principles and technical effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the inventive concept and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.
Claims
1. An electronic package, comprising: The substrate structure has a first side and a second side opposite to each other, a plurality of electrical contact pads are disposed on the first side, and an area outside the plurality of electrical contact pads is defined as an open area; A plurality of support members are disposed on the open area of the first side of the substrate structure; as well as The packaging structure has a plurality of conductive bumps which are electrically connected to the plurality of electrical contact pads via a plurality of conductive elements, thereby enabling the packaging structure to be disposed on the first side of the substrate structure and enabling the plurality of support members to be flush with the packaging structure.
2. The electronic package according to claim 1, wherein: The heights of the plurality of support members are equal to the heights of the plurality of conductive bumps and the plurality of conductive elements.
3. The electronic package of claim 1, wherein: The plurality of support members are virtual connection protrusions or virtual connection columns.
4. The electronic package of claim 1, wherein: The plurality of support members are in the shape of discontinuous rings, irregular polygons, regular polygons or curved contours.
5. The electronic package of claim 1, wherein: Each of the plurality of support members is located between at least any two of the plurality of electrical contact pads.
6. The electronic package of claim 1, wherein: The plurality of support members are separated from each other.
7. The electronic package of claim 1, wherein: The plurality of support members are adjacent to the outermost ones of the plurality of electrical contact pads, or adjacent to the center ones of the plurality of electrical contact pads.
8. A method for manufacturing an electronic package, comprising: A substrate structure is provided, wherein the substrate structure has a first side and a second side opposite to each other, a plurality of electrical contact pads are disposed on the first side, and an area outside the plurality of electrical contact pads is defined as an open area; Disposing a plurality of support members on the open area of the first side of the substrate structure; and A packaging structure is provided and arranged on the first side of the substrate structure, wherein the packaging structure has a plurality of conductive bumps, the plurality of conductive bumps are electrically connected to the plurality of electrical contact pads via a plurality of conductive elements, and the plurality of support members are made flat against the packaging structure.
9. The method for manufacturing an electronic package as claimed in claim 8, wherein: The packaging structure is disposed on the first side of the substrate structure through a thermal compression bonding process.
10. The method for manufacturing an electronic package according to claim 9, wherein: Before the thermal compression bonding process, a plurality of first conductive materials are respectively disposed on the plurality of electrical contact pads, and a plurality of second conductive materials are respectively disposed on the plurality of conductive bumps.
11. The method for manufacturing an electronic package according to claim 10, wherein: The thermal compression bonding process first presses the packaging structure downward to make the multiple support members flat against the packaging structure and make the multiple second conductive materials contact the multiple first conductive materials, and then heats to weld the multiple first conductive materials and the multiple second conductive materials to form the multiple conductive elements.
12. The method for manufacturing an electronic package as claimed in claim 8, wherein: The heights of the plurality of support members are equal to the heights of the plurality of conductive bumps and the plurality of conductive elements.
13. The method for manufacturing an electronic package as claimed in claim 8, wherein: The plurality of support members are virtual connection protrusions or virtual connection columns.
14. The method for manufacturing an electronic package as claimed in claim 8, wherein: The plurality of support members are in the shape of discontinuous rings, irregular polygons, regular polygons or curved contours.
15. The method for manufacturing an electronic package as claimed in claim 8, wherein: Each of the plurality of support members is located between at least any two of the plurality of electrical contact pads.
16. The method for manufacturing an electronic package as claimed in claim 8, wherein: The plurality of support members are separated from each other.
17. The method for manufacturing an electronic package as claimed in claim 8, wherein: The plurality of support members are adjacent to the outermost ones of the plurality of electrical contact pads, or adjacent to the center ones of the plurality of electrical contact pads.