Sensor packaging structure, preparation method and electronic equipment

Abstract

The invention provides a sensor packaging structure, a preparation method and electronic equipment, and the preparation method comprises the steps: providing a substrate and a waterproof film, the first side of the substrate is provided with a mounting groove, the bottom of the mounting groove is provided with a first sound hole, and the waterproof film is disposed in the mounting groove and shields the first sound hole; preparing a supporting sheet by adopting an etching process, wherein the supporting sheet is provided with a second sound hole; mounting the supporting sheet on the first side of the substrate, enabling the supporting sheet to cover the mounting groove in the substrate, and enabling the second sound hole to correspond to the mounting groove; at least part of a sensor assembly is installed on the side, away from the waterproof membrane, of the supporting piece; and mounting a housing on the first side of the substrate to obtain the sensor packaging structure.

Description

Technical Field

[0001] The present application relates to the technical field of packaging structures, and more specifically, to a sensor packaging structure and a preparation method and an electronic device. Background Art

[0002] The packaging structure of a MEMS microphone mainly includes a substrate, a waterproof membrane, a support sheet, a sensor assembly, and a cover. The support sheet is usually made by a punching process to protect the waterproof membrane and provide a chip mounting position. However, the support sheet of the punching process has poor precision, and burrs and flanging are easily generated around the sound hole, resulting in a decrease in acoustic performance. In addition, the stamping process requires a special mold, which has a high mold change cost and low production efficiency. Summary of the invention

[0003] The present application provides a new technical solution for a method for preparing a sensor packaging structure, which can at least solve the problem of low acoustic performance of existing packaging structures.

[0004] The present application also provides a new technical solution for a sensor packaging structure.

[0005] The present application also provides a new technical solution for electronic equipment.

[0006] According to the first aspect of the present application, a method for preparing a sensor packaging structure is provided, comprising: providing a substrate and a waterproof film, wherein a mounting groove is provided on a first side of the substrate, a first sound hole is provided at the bottom of the mounting groove, and the waterproof film is provided in the mounting groove and blocks the first sound hole; preparing a support sheet by an etching process, wherein the support sheet is provided with a second sound hole; installing the support sheet on the first side of the substrate so that the support sheet covers the mounting groove on the substrate and the second sound hole corresponds to the mounting groove; installing at least part of the sensor assembly on a side of the support sheet away from the waterproof film; and installing a cover shell on the first side of the substrate to obtain a sensor packaging structure.

[0007] Optionally, the method of preparing the support sheet by using an etching process includes: providing a mother material; adhering the mother material to a carrier film; and etching the mother material of the carrier film by using an etching process to obtain one or more support sheets.

[0008] Optionally, the carrier film is configured as a UV tape.

[0009] Optionally, the carrier film is adhered with a plurality of the mother materials.

[0010] Optionally, the method of installing the support sheet on the first side of the substrate includes: transferring the support sheet on the carrier film to a carrier for a die bonder; and installing the support sheet on the first side of the substrate using the die bonder.

[0011] Optionally, the method of installing the support sheet on the first side of the substrate includes: separating the support sheet from the carrier film and installing it on a carrier tape of a placement machine; and installing the support sheet on the first side of the substrate using the placement machine.

[0012] Optionally, the thickness of the base material is 30um to 100um.

[0013] According to a second aspect of the present application, a sensor packaging structure is provided, which is manufactured by any of the above-mentioned manufacturing methods.

[0014] Optionally, the roughness of the inner wall surface of the second sound hole is 0.17um to 0.19um.

[0015] According to a third aspect of the present application, an electronic device is provided, comprising the sensor packaging structure described in any one of the above items.

[0016] According to the preparation method of the sensor packaging structure of the present application, by adopting the etching process to prepare the support sheet, the production cost can be effectively reduced, and the dimensional accuracy of the support sheet can be optimized, thereby avoiding the need to reserve additional space due to dimensional errors, improving its assembly accuracy, and being conducive to realizing the miniaturization of the product, or making the back cavity of the product larger at the same size, thereby improving the acoustic performance of the product; in addition, the use of this process can also optimize the position and dimensional accuracy of the second sound hole, which can effectively guarantee the acoustic performance of the product; at the same time, the etching process can also reduce the roughness of the inner wall surface of the second sound hole, thereby reducing the acoustic resistance at the second sound hole, and then improving the acoustic performance of the product; and the use of the etching process can avoid burrs and flanging on the support sheet, which can effectively improve the acoustic performance of the product.

[0017] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0019] Figure 1 is a flow chart of a method for preparing a sensor packaging structure according to an embodiment of the present application;

[0020] Figure 2 It is a structural schematic diagram of a sensor packaging structure according to an embodiment provided in the present application.

[0021] Reference numerals

[0022] 100. Sensor packaging structure;

[0023] 10. Base plate; 11. Mounting groove; 12. First sound hole;

[0024] 20. Waterproof membrane;

[0025] 30. Support sheet; 31. Second sound hole;

[0026] 40. Sensor components; 41. MEMS chips; 42. ASIC chips;

[0027] 50. Cover. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0029] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0030] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0031] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0032] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0033] like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a method for preparing a sensor packaging structure 100, including: S100 to S500.

[0034] S100, providing a substrate 10 and a waterproof membrane 20, wherein a mounting groove 11 is provided on a first side of the substrate 10, a first sound hole 12 is provided at the bottom of the mounting groove 11, and the waterproof membrane 20 is provided in the mounting groove 11 and covers the first sound hole 12;

[0035] In detail, the substrate 10 can be made of a PCB board. First, a mounting groove 11 can be formed on a first side (for example, the upper side) of the PCB board, and then a first sound hole 12 can be formed through the bottom of the mounting groove 11. Then, the waterproof membrane 20 can be fixed to the bottom of the mounting groove 11, and the position of the waterproof membrane 20 can be made to correspond to the position of the first sound hole 12, so that the waterproof membrane 20 can block the first sound hole 12 in the mounting groove 11.

[0036] S200, preparing a support sheet 30 by an etching process, wherein the support sheet 30 is provided with a second sound hole 31;

[0037] Specifically, the support plate 30 can be prepared by an etching process, which can optimize the position and dimensional accuracy of the second sound hole 31 of the support plate 30 and optimize the roughness of the inner wall surface of the second sound hole 31, thereby reducing the acoustic resistance at the second sound hole 31.

[0038] It should be noted that step S200 may be performed before step S100 or simultaneously with step S100, and those skilled in the art may adjust the order of the steps according to actual production conditions and requirements.

[0039] S300, installing the support sheet 30 on the first side of the substrate 10, so that the support sheet 30 covers the mounting groove 11 on the substrate 10, and the second sound hole 31 corresponds to the mounting groove 11;

[0040] In detail, after the support sheet 30 is prepared, the support sheet 30 can be bonded to the first side of the substrate 10, and during bonding, it is necessary to ensure that the position of the support sheet 30 corresponds to the mounting groove 11, so that the support sheet 30 can cover the top of the mounting groove 11. At the same time, during bonding, it is necessary to ensure that the second sound hole 31 on the support sheet 30 corresponds to the position of the mounting groove 11, so that the sound can be transmitted to the second sound hole 31 through the first sound hole 12 and the mounting groove 11.

[0041] S400, installing at least a portion of the sensor assembly 40 on a side of the support sheet 30 facing away from the waterproof membrane 20;

[0042] Specifically, the sensor assembly 40 mainly includes a MEMS chip 41 (e.g., a sensor chip) and an ASIC chip 42 (e.g., a signal processing chip). After the support sheet 30 is installed, the MEMS chip 41 can be bonded and fixed to the support sheet 30. During bonding, it is necessary to ensure that the vibration cavity of the MEMS chip 41 corresponds to the position of the second sound hole 31. The ASIC chip 42 can also be bonded and fixed to the support sheet 30. After bonding, the MEMS chip 41 and the ASIC chip 42 can be electrically connected together by wires, and the MEMS chip 41 and the ASIC chip 42 and the PCB board can be electrically connected together by wires.

[0043] S500 , mounting the cover 50 on the first side of the substrate 10 to obtain a sensor packaging structure 100 .

[0044] That is to say, after the sensor assembly 40 is installed, the open end of the cover 50 can be bonded and fixed to the first side of the substrate 10 to obtain the desired sensor packaging structure 100. In the sensor packaging structure 100, the cover 50 and the substrate 10 cooperate to form a receiving cavity, and the waterproof membrane 20, the support sheet 30 and the sensor assembly 40 are all located in the receiving cavity. The side of the support sheet 30 away from the waterproof membrane 20 forms a rear cavity, and the sensor assembly 40 is located in the rear cavity.

[0045] Therefore, according to the preparation method of the sensor packaging structure 100 provided in this embodiment, by adopting the etching process to prepare the support sheet 30, the production cost can be effectively reduced, and the dimensional accuracy of the support sheet 30 can be optimized, thereby avoiding the need to reserve additional space due to dimensional errors, improving its assembly accuracy, and being conducive to achieving product miniaturization, or making the back cavity of the product larger at the same size, thereby improving the acoustic performance of the product; in addition, the use of this process can also optimize the position and dimensional accuracy of the second sound hole 31, which can effectively ensure the acoustic performance of the product; at the same time, the etching process can also reduce the roughness of the inner wall surface of the second sound hole 31, thereby reducing the acoustic resistance at the second sound hole 31, and thereby improving the acoustic performance of the product; and the use of the etching process can avoid burrs and flanging on the support sheet 30, which can effectively improve the acoustic performance of the product.

[0046] According to one embodiment of the present application, the method for preparing the support sheet 30 by using an etching process includes: S210 to S230.

[0047] S210, providing a base material;

[0048] S220, pasting the base material to the carrier film;

[0049] S230 , etching the mother material of the carrier film by using an etching process to obtain one or more supporting sheets 30 .

[0050] That is to say, the method of preparing the support sheet 30 by etching process mainly includes the following steps: first, the mother material can be selected according to actual needs, and the mother material can be a steel sheet, a silicon sheet or a sheet made of other materials with a certain rigidity and hardness such as hard plastic polymer materials; then the mother material is pasted on the carrier film, for example, the carrier film can be a film body with an adhesive layer on one side, and the mother material can be bonded to the adhesive layer on one side of the carrier film; then an etching process (i.e., silk screen printing, exposure, development, etching) is used to etch the mother material of the carrier film, and after etching, it is cleaned and the photosensitive glue on the surface is removed, and then a plurality of required support sheets 30 can be obtained.

[0051] In this embodiment, by bonding the mother material to the carrier film, not only one side of the mother material can be protected, but also the multiple support sheets 30 formed by etching are fixed on the carrier film, which is beneficial for quickly removing the support sheets 30 from the etching solution and facilitating the subsequent unified processing of the multiple support sheets 30 on the carrier film, thereby effectively improving production efficiency.

[0052] In some embodiments of the present application, the carrier film is configured as a UV tape.

[0053] Specifically, in order to facilitate the separation of the support sheet 30 and the carrier film, a UV tape can be used for the carrier film. This UV tape has high viscosity before being exposed to UV light, and can be reliably connected to the mother sheet, so that the mother sheet and the carrier film can be prevented from being separated during the etching process, thereby ensuring the yield rate of the support sheet 30. When the UV tape is irradiated with UV light, the viscosity will be sharply reduced, so that when the support sheet 30 and the carrier film are subsequently separated, the UV tape only needs to be irradiated with UV light to greatly reduce the adhesion between them, so that the support sheet 30 can be easily detached from the carrier film.

[0054] In an optional example of the present application, a plurality of base materials are attached to the carrier film. This method allows processing of a plurality of base materials at one time, thereby effectively improving production efficiency.

[0055] According to one embodiment of the present application, a method for mounting the support sheet 30 on the first side of the substrate 10 includes: S310 and S320.

[0056] S310, separating the support sheet 30 from the carrier film and installing them on the carrier tape of the placement machine;

[0057] S320 , mounting the support sheet 30 on the first side of the substrate 10 using a chip mounter.

[0058] In other words, the support sheet 30 can be mounted on the substrate 10 using a chip mounter. Specifically, first, the support sheet 30 is separated from the carrier film. When the carrier film is a UV tape, the carrier film can be irradiated with UV light to significantly reduce the viscosity of the carrier film, so that the support sheet 30 can be separated from the carrier film by a clamp or other structure; then, the support sheet 30 is mounted on the carrier tape used by the chip mounter by a loading device or manually, and then the support sheet 30 can be mounted on the first side of the substrate 10 by the chip mounter.

[0059] In the embodiment, by using a chip mounter, the support sheet 30 installation process can be automated, which reduces the complexity and labor intensity of manual operations and can effectively ensure the production efficiency and assembly accuracy of the product.

[0060] In some optional examples of the present application, the method of mounting the support sheet 30 on the first side of the substrate 10 includes: S310 ′ and S320 ′.

[0061] S310', transferring the support sheet 30 on the carrier film to a carrier for a die bonding machine;

[0062] S320 ′, mounting the support sheet 30 on the first side of the substrate 10 using a die bonding machine.

[0063] That is to say, the support sheet 30 can be installed on the substrate 10 by using a die bonding machine. Specifically, the die bonding machine has a carrier for carrying the components to be installed, and the carrier can have a blue film, and the multiple support sheets 30 on the carrier film can be transferred to the blue film of the carrier at one time. When the carrier film is a UV tape, before transferring the support sheet 30, the carrier film can be irradiated with UV light so that the bonding force between the carrier film and the support sheet 30 is much smaller than the bonding force between the support sheet 30 and the carrier, so that the support sheet 30 can be reliably transferred to the carrier; after the support sheet 30 is transferred, the support sheet 30 can be installed on the first side of the substrate 10 by using a die bonding machine.

[0064] In this example, the support sheet 30 can be quickly installed on the carrier of the die bonding machine by transferring, thereby effectively improving the production efficiency of the product. Moreover, the die bonding machine has higher assembly accuracy than the chip mounting machine. Therefore, using the die bonding machine to install the support sheet 30 can further improve the assembly accuracy of the support sheet 30, thereby effectively improving the acoustic performance of the product.

[0065] According to one embodiment of the present application, the thickness of the base material is 30 um to 100 um.

[0066] Specifically, if the thickness of the parent material is too small, the thickness of the support sheet 30 will be too small, resulting in insufficient rigidity of the support sheet 30, thereby affecting the acoustic performance of the product; if the thickness of the parent material is too large, the thickness of the support sheet 30 will be too large, resulting in a reduction in the back cavity of the product, thereby affecting the acoustic performance of the product. In this embodiment, the thickness of the parent material is 30um to 100um. For example, the thickness of the parent material can be 30um, 50um, 70um, 90um, and 100um. When the parent material is within this range, it is conducive to preparing a support sheet 30 with a thickness of 30um to 100um, ensuring that the support sheet 30 has sufficient rigidity, avoiding insufficient performance due to being too thin, and also preventing the back cavity space of the product from being affected by being too thick, thereby ensuring the acoustic performance of the product.

[0067] In summary, according to the preparation method of the sensor packaging structure 100 of the embodiment of the present application, the support sheet 30 is prepared by adopting an etching process, which can effectively reduce the production cost and optimize the dimensional accuracy of the support sheet 30, thereby avoiding the need to reserve additional space due to dimensional errors, improving its assembly accuracy, and being conducive to achieving product miniaturization, or making the back cavity of the product larger at the same size, thereby improving the acoustic performance of the product; in addition, the use of this process can also optimize the position and dimensional accuracy of the second sound hole 31, which can effectively ensure the acoustic performance of the product; at the same time, the etching process can also reduce the roughness of the inner wall surface of the second sound hole 31, thereby reducing the acoustic resistance at the second sound hole 31, and thereby improving the acoustic performance of the product; and the use of the etching process can avoid burrs and flanging on the support sheet 30, which can effectively improve the acoustic performance of the product.

[0068] The embodiment of the present application further provides a sensor packaging structure 100, which is manufactured by the manufacturing method of the sensor packaging structure 100 described in any of the above embodiments. Since the manufacturing method of the sensor packaging structure 100 according to the embodiment of the application has the above technical effects, the sensor packaging structure 100 implemented according to the present application also has the corresponding technical effects, which will not be described in detail in this embodiment.

[0069] According to an embodiment of the present application, the roughness of the inner wall surface of the second sound hole 31 is 0.17 um to 0.19 um.

[0070] Specifically, if the roughness of the inner wall surface of the second acoustic hole 31 is too small, the processing difficulty will increase; if the roughness is too large, the acoustic resistance will increase, resulting in a decrease in the acoustic performance of the product. In this embodiment, the roughness of the inner wall surface of the second acoustic hole 31 is configured to be 0.17um to 0.19um, for example, it can be 0.17um, 0.18um or 0.19um, etc. Such a roughness range can ensure the operability of the etching process and avoid excessive acoustic resistance that affects the acoustic performance of the product.

[0071] The embodiment of the present application also provides an electronic device, including the electronic device of any of the above embodiments. Since the preparation method of the sensor packaging structure 100 according to the embodiment of the application has the above technical effects, the electronic device according to the embodiment of the present application also has the corresponding technical effects, which will not be described in detail in this embodiment.

[0072] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A method for preparing a sensor packaging structure, characterized in that: include: A substrate and a waterproof membrane are provided, wherein a mounting groove is provided on a first side of the substrate, a first sound hole is provided at the bottom of the mounting groove, and the waterproof membrane is provided in the mounting groove and covers the first sound hole; The supporting sheet is prepared by etching process, wherein the supporting sheet is provided with a second sound hole; Installing the support sheet on the first side of the substrate so that the support sheet covers the mounting groove on the substrate and the second sound hole corresponds to the mounting groove; Mounting at least a portion of the sensor assembly on a side of the support sheet facing away from the waterproof membrane; The cover is mounted on the first side of the substrate to obtain a sensor packaging structure.

2. The preparation method according to claim 1, characterized in that: The method for preparing a support sheet by etching process comprises: Provide parent material; Pasting the base material onto the carrier film; The mother material of the carrier film is etched by an etching process to obtain one or more supporting sheets.

3. The preparation method according to claim 2, characterized in that: The carrier film is configured as a UV tape.

4. The preparation method according to claim 2, characterized in that: The carrier film is bonded with a plurality of the parent materials.

5. The preparation method according to claim 2, characterized in that: The method of mounting the support sheet on the first side of the substrate comprises: Transferring the support sheet on the carrier film to a carrier for a die bonder; The support sheet is mounted on the first side of the substrate using the die bonding machine.

6. The preparation method according to claim 2, characterized in that: The method of mounting the support sheet on the first side of the substrate comprises: Separating the support sheet from the carrier film and mounting them on a carrier tape of a chip mounter; The support sheet is mounted on the first side of the substrate using the chip mounter.

7. The preparation method according to claim 2, characterized in that: The thickness of the base material is 30um to 100um.

8. A sensor packaging structure, characterized in that: Prepared by the preparation method according to any one of claims 1 to 7.

9. The sensor packaging structure according to claim 8, characterized in that: The roughness of the inner wall surface of the second sound hole is 0.17um to 0.19um.

10. An electronic device, characterized in that: Comprising the sensor packaging structure according to claim 8 or 9.

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