Printed circuit board, display device and temperature control method

Abstract

The invention provides a printed circuit board, a display device and a temperature control method, and the printed circuit board comprises n conductor layers, the n conductor layers comprise a first conductor layer and a second conductor layer which are located at the outer layer, and n-2 third conductor layers located between the first conductor layer and the second conductor layer, the temperature sensing unit is located on the third conductor layer, the control and regulation unit is located on the first conductor layer, the control and regulation unit outputs a driving signal to drive a target object and generates heat power consumption, the heat power consumption causes temperature change of the printed circuit board, and the temperature sensing unit senses the temperature change of the printed circuit board. The control unit controls the control unit to synchronously and dynamically adjust the size of the driving signal according to the induction signal, so that the output adjusting effect is achieved, the temperature rise problem is solved, the cooling efficiency is high, meanwhile, all the units are arranged on the printed circuit board, and compared with structures such as a cooling fan and cooling fins, the size and the cost of equipment are effectively reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and in particular, relates to a printed circuit board, a display device and a temperature control method. Background Art

[0002] With the continuous development of science and technology, electronic devices will generate a lot of heat energy when working. If the heat cannot be effectively dissipated or the power consumption of the device cannot be reduced, it will cause the device to overheat, thus affecting the performance and service life of the device. As an important part of electronic equipment, the thermal management of printed circuit boards has a vital impact on the overall performance and stability of the device.

[0003] In existing solutions, thermal management of printed circuit boards is mainly achieved through cooling fans, heat sinks, thermal grease, etc. However, these methods cannot effectively and substantially reduce the temperature of PCBAs, especially some solutions will increase the size of the equipment, resulting in an increase in space and cost. Summary of the invention

[0004] The purpose of the present application is to provide a printed circuit board, aiming to solve the problems of low effectiveness, increased space and cost in the traditional heat dissipation method of the printed circuit board.

[0005] A first aspect of an embodiment of the present application provides a printed circuit board, comprising:

[0006] n conductor layers, including a first conductor layer and a second conductor layer located at the outer layer, and a third conductor layer of n-2 layers located between the first conductor layer and the second conductor layer, wherein n≥3;

[0007] A temperature sensitive unit is disposed on one of the third conductor layers, and is used to sense the temperature change of the first conductor layer and output a sensing signal;

[0008] A control and adjustment unit is arranged on the first conductor layer and connected to the temperature sensitive unit, and is used to output a driving signal to a target object and adjust the size of the driving signal according to the sensing signal, and the driving signal is correlated with the sensing signal.

[0009] Optionally, the temperature sensitive unit is a stress sensing processing unit, and the stress sensing processing unit is used to sense the deformation of the first conductor layer caused by temperature change and output the sensing signal.

[0010] Optionally, the stress sensing processing unit includes:

[0011] A stress sensing unit, the stress sensing unit is used to sense the deformation of the printed circuit board caused by temperature change and output a changed stress signal;

[0012] A data processing unit is connected to the control and regulation unit and the stress sensing unit respectively, and the data processing unit is used to compare the stress signal with a stress threshold and output the sensing signal to the control and regulation unit when the stress signal reaches the stress threshold.

[0013] Optionally, the stress threshold includes a plurality of stress intervals, and the data processing unit stores a mapping relationship between each stress interval and a sensing signal of different magnitude;

[0014] The data processing unit is specifically used for:

[0015] Determine whether the stress signal reaches the stress threshold, and if not, stop outputting the sensing signal;

[0016] When the stress signal reaches the stress threshold, the stress interval in which the stress signal is located is determined, and a sensing signal of a corresponding magnitude is determined and output based on the stress interval and the mapping relationship.

[0017] Optionally, the stress interval includes a plurality of high-temperature stress intervals and a plurality of low-temperature stress intervals, the sensing signal includes a plurality of first sensing signals of different sizes and second sensing signals of different sizes, and the first sensing signal is not equal to the second sensing signal;

[0018] The data processing unit stores a first mapping relationship between each high temperature stress interval and a first sensing signal of different magnitude, and stores a second mapping relationship between each low temperature stress interval and a second sensing signal of different magnitude;

[0019] The data processing unit is configured to determine and output a first sensing signal of corresponding magnitude based on the high temperature stress interval and the first mapping relationship when detecting that the stress signal falls into the high temperature stress interval;

[0020] And when it is detected that the stress signal falls into the low temperature stress interval, a second sensing signal of corresponding magnitude is determined and output based on the low temperature stress interval and the second mapping relationship.

[0021] Optionally, the control and adjustment unit includes:

[0022] a controller connected to the stress sensing processing unit, the controller being configured to output a corresponding first enable signal according to each of the first sensing signals received, and to output a corresponding second enable signal according to the second sensing signal received;

[0023] The regulating unit is connected to the controller and the target object, and is used to output a driving signal to the target object, and to reduce the driving signal according to a corresponding decreasing curve according to the first enabling signal, and to increase the driving signal according to a corresponding increasing curve according to the second enabling signal.

[0024] Optionally, the stress sensing unit includes a pressure sensitive element.

[0025] A second aspect of an embodiment of the present application provides a display device, including a display panel and a printed circuit board as described above, wherein the printed circuit board is correspondingly connected to the display panel.

[0026] A third aspect of the embodiments of the present application provides a temperature control method, which is applied to the printed circuit board as described above. The temperature control method includes:

[0027] A control and adjustment unit is configured on the first conductor layer of the printed circuit board, and a temperature sensitive unit is configured on the third conductor layer of the printed circuit board;

[0028] The control and adjustment unit is used to output a driving signal to a target object, and the temperature sensitive unit is used to sense a temperature change of the first conductor layer and output a sensing signal;

[0029] The control and adjustment unit is used to adjust the magnitude of the driving signal according to the sensing signal, and the driving signal is correlated with the sensing signal.

[0030] Optionally, the temperature sensitive unit is a stress sensing processing unit, and the stress sensing processing unit includes a stress sensing unit and a data processing unit;

[0031] The step of using the temperature sensitive unit located in the third conductor layer to sense the temperature change of the first conductor layer and outputting the sensing signal specifically includes:

[0032] The stress sensing unit is used to sense the deformation of the printed circuit board caused by temperature change, and output a changed stress signal;

[0033] The data processing unit is used to compare the stress signal with a stress threshold, and when the stress signal reaches the stress threshold, the sensing signal is output to the control and regulation unit;

[0034] The stress threshold includes a plurality of stress intervals, and the data processing unit stores a mapping relationship between each stress interval and a sensing signal of different magnitude;

[0035] The stress interval includes a plurality of high-temperature stress intervals and a plurality of low-temperature stress intervals, the sensing signal includes a plurality of first sensing signals of different magnitudes and a second sensing signal of different magnitudes, and the first sensing signal is not equal to the second sensing signal;

[0036] Each high temperature stress interval forms a first mapping relationship with a first sensing signal of different magnitude, and each low temperature stress interval forms a second mapping relationship with a second sensing signal of different magnitude.

[0037] Compared with the prior art, the embodiments of the present application have the following beneficial effects: the above-mentioned printed circuit board includes n conductor layers, the n conductor layers include a first conductor layer and a second conductor layer located on the outer layer and a third conductor layer of n-2 layers located between the first conductor layer and the second conductor layer, the printed circuit board also includes a temperature sensitive unit located on the third conductor layer and a control and adjustment unit located on the first conductor layer, the control and adjustment unit outputs a driving signal for driving a target object, the control and adjustment unit generates thermal power consumption, the thermal power consumption causes the temperature of the printed circuit board to change, the temperature sensitive unit senses the temperature change of the printed circuit board and outputs a sensing signal, the control and adjustment unit synchronously and dynamically adjusts the size of the driving signal according to the sensing signal, so as to achieve the effect of adjusting the output, improve the temperature rise problem, and have high cooling efficiency. At the same time, each unit is arranged on the printed circuit board, which effectively reduces the volume and cost of the equipment compared with the arrangement of cooling fans, heat sinks and other structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0039] Figure 1 A schematic diagram of the first structure of a printed circuit board provided in Example 1 of the present application;

[0040] Figure 2 A second structural schematic diagram of a printed circuit board provided in Example 1 of the present application;

[0041] Figure 3 A third structural schematic diagram of the printed circuit board provided in Example 1 of the present application;

[0042] Figure 4 A waveform diagram of the reduction curve provided in Example 1 of the present application;

[0043] Figure 5 A waveform diagram of the amplification curve provided in Example 1 of the present application;

[0044] Figure 6 A schematic diagram of a first structure of a display device provided in Embodiment 2 of the present application;

[0045] Figure 7 A second structural schematic diagram of the display device provided in Embodiment 2 of the present application;

[0046] Figure 8 A schematic diagram of a temperature control method according to the third embodiment of the present invention;

[0047] Fig. 9 for Figure 8 FIG. 1 is a flow chart of step S20 in the temperature control method shown in FIG.

[0048] Among them, the reference numerals in the figures are:

[0049] 10. Printed circuit board; 2. Display panel; 20. Temperature sensitive unit; 30. Control and adjustment unit; 21. Stress sensing processing unit; 211. Stress sensing unit; 212. Data processing unit; 31. Controller; 32. Adjustment unit; 311. Timing controller; 321. Source driving circuit; 322. Gate driving circuit. DETAILED DESCRIPTION

[0050] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0051] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0052] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0054] Embodiment 1

[0055] The first aspect of an embodiment of the present application proposes a printed circuit board 10, which is connected to a target object and is used to output a driving signal to the target object, thereby driving the target object to perform corresponding target behaviors, such as performing corresponding actions or displaying corresponding image information.

[0056] Among them, when outputting the driving signal, the functional components on the printed circuit board 10 will generate corresponding heat energy, for example, the control chip will generate heat power consumption. When thermal management is not performed, the accumulation of heat energy will cause the printed circuit board 10 or even the corresponding device or equipment to overheat, resulting in damage or burning of the circuit, device, equipment, etc. In order to solve this problem, this embodiment proposes a printed circuit board 10, such as Figure 1 As shown, the printed circuit board 10 includes:

[0057] n conductor layers, including a first conductor layer 11 and a second conductor layer 12 located at the outer layer, and a third conductor layer 13 of n-2 layers located between the first conductor layer 11 and the second conductor layer 12, wherein n≥3;

[0058] A temperature sensitive unit 20 is disposed on one of the third conductor layers 13, and the temperature sensitive unit 20 is used to sense the temperature change of the first conductor layer 11 and output a sensing signal;

[0059] The control and adjustment unit 30 is disposed on the first conductor layer 11 and connected to the temperature sensitive unit 20. The control and adjustment unit 30 is used to output a driving signal to the target object and adjust the size of the driving signal according to the sensing signal. The driving signal is correlated with the sensing signal.

[0060] In this embodiment, the n adjacent conductor layers of the printed circuit board 10 include the conductor layer of the first layer to the conductor layer of the nth layer, the first conductor layer 11 is the conductor layer of the first layer, the second conductor layer 12 is the conductor layer of the nth layer, and the third conductor layer 13 includes the conductor layer of the second layer to the conductor layer of the n-1th layer, wherein the temperature sensitive unit 20 can be arranged in any third conductor layer 13 from the conductor layer of the second layer to the conductor layer of the n-1th layer, and the control and adjustment unit 30 can be arranged in the first conductor layer 11.

[0061] The control and adjustment unit 30 outputs a driving signal for driving the target object, thereby driving the target object to perform a corresponding target behavior, such as performing a corresponding action or displaying corresponding image information.

[0062] Under a certain working environment, as the working time changes, components such as the control and adjustment unit 30 generate heat power consumption at the same time. The temperature of the printed circuit board 10 will change due to the heat power consumption of the control and adjustment unit 30. The temperature change will be transmitted to the temperature sensitive unit 20, and the temperature sensitive unit 20 will convert it into a changing sensing signal.

[0063] Among them, a corresponding temperature threshold may also be set in the temperature sensitive unit 20, and whether it is necessary to output a sensing signal may be determined based on the detected temperature and the temperature threshold. For example, the temperature sensitive unit 20 sets a high temperature threshold. When the detected temperature is lower than the high temperature threshold, it indicates that over-temperature protection is not currently required. At this time, the temperature sensitive unit 20 may not output a sensing signal. When the detected temperature reaches the high temperature threshold, it indicates that the temperature of the current printed circuit board 10 is too high. The temperature sensitive unit 20 chooses to output a first sensing signal representing overtemperature, and may output first sensing signals of different sizes based on temperatures at different high temperatures. The size of the first sensing signal is positively correlated or negatively correlated with the size of the temperature at the high temperature. The change of the first sensing signal may change according to the temperature interval change or change proportionally according to the temperature value change. The specific change method is not limited.

[0064] Correspondingly, when the temperature of the printed circuit board 10 is too low, the components on the printed circuit board 10 may have the problem of low-temperature failure, resulting in failure to work normally. For this reason, the temperature sensitive unit 20 can also set a low-temperature threshold. When the temperature is detected to be higher than the low-temperature threshold, it indicates that low-temperature protection is not currently required. At this time, the temperature sensitive unit 20 can choose not to output the sensing signal, and when it is detected that the temperature drops to the low-temperature threshold, it indicates that the current temperature of the printed circuit board 10 is too low. The temperature sensitive unit 20 chooses to output a second sensing signal representing the low temperature, and can output second sensing signals of different sizes based on the temperature at different low temperatures. The size of the second sensing signal is positively correlated or negatively correlated with the size of the temperature at the low temperature. Similarly, the change of the second sensing signal can change according to the temperature interval change or change proportionally according to the temperature value change. The specific change method is not limited. Among them, the first sensing signal and the second sensing signal can be electrical signals of different sizes, such as voltage signals and current signals. For example, the first sensing signal is a changing positive voltage signal, and the second sensing signal is a changing negative voltage signal.

[0065] By setting a temperature threshold, selecting to output a sensing signal corresponding to a temperature below the threshold, and not outputting a sensing signal at a temperature within an acceptable range, the amount of computational work of the back-end control and adjustment unit 30 can be reduced, and the efficiency of temperature detection feedback can be improved.

[0066] The sensing signal representing the temperature change is transmitted to the control and adjustment unit 30. After receiving the sensing signal transmitted by the temperature sensitive unit 20, the control and adjustment unit 30 analyzes the sensing signal. When the temperature sensitive unit 20 does not compare the temperature threshold, the sensing signal output by the temperature sensitive unit 20 represents the temperature of the current printed circuit board 10 in real time. At this time, the control and adjustment unit 30 analyzes the sensing signal and determines the temperature of the current printed circuit board 10 based on the sensing signal. The corresponding threshold data can be set inside the control and adjustment unit 30, and the determined temperature data is compared with the threshold data to determine whether the received sensing signal reaches the range of the threshold data, wherein the threshold data can be a single threshold interval or multiple threshold intervals, and whether it is necessary to adjust the size of the drive signal or shut down the output according to the comparison result to achieve over-temperature or low-temperature protection.

[0067] For example, the threshold data includes high temperature threshold data. When it is determined that the obtained temperature data reaches the high temperature threshold data, it indicates that the current printed circuit board 10 has a high temperature. At this time, the control and adjustment unit 30 reversely adjusts the size of the drive signal according to the temperature data. The higher the over-temperature, the smaller the adjusted output drive signal. At the same time, the falling speed of the drive signal can also be adjusted. For example, the higher the over-temperature, the faster the falling speed of the drive signal. Similarly, when the temperature exceeds the peak data, the control and adjustment unit 30 can also directly shut down the output of the drive signal to avoid over-temperature damage to the device, and restart the output when the temperature drops to the preset data.

[0068] Correspondingly, the high temperature threshold data can set one or more threshold intervals, and different adjustment output methods can be selected according to the interval in which the temperature data falls, so as to flexibly adjust the size of the driving signal at each temperature and improve the cooling efficiency.

[0069] In addition, the threshold data may also include low temperature threshold data. When it is determined that the obtained temperature data reaches the low temperature threshold data, it indicates that the current printed circuit board 10 has a low temperature. At this time, the control and adjustment unit 30 positively adjusts the size of the drive signal according to the temperature data. The lower the overtemperature, the larger the adjusted output drive signal is, so as to maintain the temperature of the current printed circuit board 10 to the preset threshold. At the same time, the rising speed of the drive signal can also be adjusted. For example, the lower the low temperature, the faster the rising speed of the drive signal. Similarly, when the temperature exceeds the low temperature peak data, the control and adjustment unit 30 can also directly shut down the output of the drive signal to avoid excessive low temperature damage to the device, and restart the output when the temperature rises to the preset data.

[0070] Correspondingly, the low temperature threshold data can set one or more threshold intervals, and different adjustment output methods can be selected according to the interval in which the temperature data falls, so as to flexibly adjust the size of the driving signal at each temperature and improve the heating efficiency.

[0071] Alternatively, when the temperature sensitive unit 20 has previously performed a temperature threshold comparison, the temperature sensitive unit 20 outputs a sensing signal representing overtemperature or low temperature, and the control and adjustment unit 30 can directly identify and analyze the size and type of the received sensing signal, and determine the control strategy of the driving signal based on the sensing signal and the internal program, by inputting the sensing signal into the corresponding program or mapping table output or reading the corresponding control strategy and adjusting the change mode of the driving signal based on the control strategy, thereby changing the size of the driving signal and the temperature of the printed circuit board 10.

[0072] For example, when a first sensing signal representing high temperature is received, a first control strategy is determined based on the size of the received first sensing signal, and when another first sensing signal of different size is received, a second control strategy is determined based on the other first sensing signal. The first control strategy is different from the second control strategy. For example, the first control strategy is to control the driving signal to reduce the size of the driving signal with an acceleration of a1, and the second control strategy is to reduce the size of the driving signal with an acceleration of a2, thereby adjusting the different decreasing modes of the driving signal according to the first sensing signals of different sizes, and then reducing the temperature of the printed circuit board 10 in different cooling modes, thereby achieving separate cooling treatment of the printed circuit board 10 and improving the cooling efficiency. For example, a first temperature represented by a first sensing signal is greater than a second temperature represented by another sensing signal, and correspondingly, a1 and a2 are negative values, and a1 is less than a2, that is, at the first over-temperature, the driving signal decreases at a faster rate, and correspondingly, the temperature of the printed circuit board 10 decreases at a faster rate, thereby reducing the output power consumption, thereby reducing the thermal power consumption generated by the control and adjustment unit 30.

[0073] Similarly, for example, when a second sensing signal representing a low temperature is received, a third control strategy is determined based on the size of a received second sensing signal, and when another second sensing signal of a different size is received, a fourth control strategy is determined based on the other second sensing signal. The third control strategy is different from the fourth control strategy. For example, the third control strategy is to control the drive signal to increase the size of the drive signal with a b1 acceleration, and the fourth control strategy is to increase the size of the drive signal with a b2 acceleration, thereby adjusting the different decreasing modes of the drive signal according to the second sensing signals of different sizes, and then increasing the temperature of the printed circuit board 10 in different heating modes, thereby achieving separate heating treatment of the printed circuit board 10 and improving the heating efficiency. For example, a third temperature represented by a second sensing signal is lower than a fourth temperature represented by another sensing signal, and correspondingly, b1 and b2 are positive values, and b1 is greater than b2, that is, at the third temperature of the low temperature, the drive signal rises at a faster rate, and correspondingly, the temperature of the printed circuit board 10 rises at a faster rate, thereby increasing the output power consumption, thereby maintaining the thermal power consumption generated by the control and adjustment unit 30.

[0074] The control and adjustment unit 30 synchronously and dynamically adjusts the size of the driving signal according to the sensing signal to achieve the effect of adjusting the output, improve the temperature rise problem, and have high cooling efficiency. At the same time, each unit is arranged on the printed circuit board 10, which effectively reduces the size and cost of the equipment compared to setting up cooling fans, heat sinks and other structures.

[0075] Furthermore, in order to facilitate the perception of temperature changes in the printed circuit board 10 and avoid the problem of poor sensing accuracy, in an optional embodiment, the temperature sensitive unit 20 and the control and adjustment unit 30 are arranged in adjacent layers, that is, when the control and adjustment unit 30 is arranged in the first conductor layer 11 of the printed circuit board 10, the temperature sensitive unit 20 is arranged in the conductor layer of the second layer of the printed circuit board 10. By arranging the temperature sensitive unit 20 adjacent to each other, the temperature changes in the first conductor layer 11 of the printed circuit board 10 can be more easily perceived, thereby improving the temperature regulation efficiency.

[0076] In order to avoid the increase of cost and space due to the excessive thickness of the printed circuit board 10, in an optional embodiment, as shown in FIG. Figure 1 As shown, n=3, the temperature sensitive unit 20 is disposed on the second conductor layer, and the control and adjustment unit 30 can be disposed on the first conductor layer.

[0077] Among them, the temperature sensitive unit 20 and the control and adjustment unit 30 can be connected through interlayer cross-over wires or through vias. In an optional embodiment, in order to simplify the circuit structure, the temperature sensitive unit 20 arranged on the third conductor layer 13 of the printed circuit board 10 is connected to the control and adjustment unit 30 arranged on the first conductor layer 11 of the printed circuit board 10 through a via. A connecting wire or a welding circuit is arranged in the via, and the temperature sensitive unit 20 and the control and adjustment unit 30 are connected to transmit the sensing signal.

[0078] The temperature sensitive unit 20 may adopt a corresponding stress detection structure, a thermistor or the like, and may specifically select a corresponding sensitive device according to the interlayer pressure change or temperature change between the printed circuit boards 10 .

[0079] like Figure 2 As shown, in an optional embodiment, the temperature sensitive unit 20 is a stress sensing processing unit 21, and the stress sensing processing unit 21 is used to sense the deformation of the first conductor layer 11 caused by temperature change and output a sensing signal.

[0080] When the control and adjustment unit 30 and other components generate heat power consumption, the temperature of the printed circuit board 10 will change to a certain extent due to the heat power consumption of the control and adjustment unit 30. The change is the change of the thermal signal. After the thermal signal changes, the printed circuit board 10 will produce a certain deformation. The stress change caused by the change of the deformation will be transmitted to the stress sensing processing unit 21, and the stress sensing processing unit 21 will indirectly sense the change of temperature after processing. The stress sensing processing unit 21 receives the changed stress and indirectly senses the change of temperature based on the stress change. After the stress sensing processing unit 21 receives the changed stress signal, it can determine whether to output the sensing signal based on the size of the stress signal, and can set the corresponding stress threshold. The stress threshold corresponds to the temperature threshold. Based on the size of the detected stress and the stress threshold, the current temperature of the printed circuit board 10 and the temperature threshold are determined. The stress sensing processing unit 21 can determine whether it is necessary to output a sensing signal based on the size of the temperature threshold. For example, the stress sensing processing unit 21 sets a high temperature stress threshold. When the detected stress is less than the high temperature stress threshold, it indicates that the current temperature of the printed circuit board 10 is less than the high temperature threshold, indicating that over-temperature protection is not required at present. At this time, the stress sensing processing unit 21 may not output a sensing signal. When it is detected that the stress reaches the high temperature stress threshold, it indirectly indicates that the current temperature of the printed circuit board 10 is too high. The stress sensing processing unit 21 chooses to output a sensing signal representing overtemperature, and can output sensing signals of different sizes based on temperatures at different high temperatures. The size of the sensing signal is positively correlated or negatively correlated with the size of the temperature at the high temperature. The change of the sensing signal can change according to the temperature interval change or change proportionally according to the temperature value change. The specific change method is not limited.

[0081] Correspondingly, in order to realize the detection and processing of stress, as Figure 3 As shown, in an optional embodiment, the stress sensing processing unit 21 includes:

[0082] A stress sensing unit 211, the stress sensing unit 211 is used to sense the deformation of the printed circuit board 10 caused by temperature change and output a changed stress signal;

[0083] The data processing unit 212 is connected to the control and regulation unit 30 and the stress sensing unit 211 respectively. The data processing unit 212 is used to compare the stress signal with the stress threshold and output a sensing signal to the control and regulation unit 30 when the stress signal reaches the stress threshold.

[0084] In this embodiment, when the printed circuit board 10 is deformed due to temperature changes, the stress sensing unit 211 senses the change in deformation, which may be a direct data change of the deformation or a difference change. For example, the deformation data is detected to change from X1 to X2, or the difference X3 is detected, where X3 is equal to the difference between X1 and X2. The stress sensing unit 211 outputs a stress signal of corresponding magnitude according to the detected change, and the stress signal may be positively correlated or negatively correlated with the deformation data. After receiving the changed stress signal, the data processing unit 212 indirectly senses the change in temperature based on the stress change, and sets a corresponding stress threshold, which corresponds to the temperature threshold. Based on the received stress signal and the stress threshold, the current temperature of the printed circuit board 10 and the temperature threshold are determined, and then it is determined whether it is necessary to output the sensing signal. When the stress signal does not reach the stress threshold, it indicates that the current temperature of the printed circuit board 10 is within the temperature threshold. At this time, there is no need to adjust the output of the drive signal, that is, the data processing unit 212 does not output the sensing signal. When it is detected that the stress signal reaches the stress threshold, it indicates that the current temperature of the printed circuit board 10 reaches the temperature threshold, and high temperature or low temperature occurs. At this time, the temperature of the printed circuit board 10 needs to be adjusted, and the data processing unit 212 outputs the sensing signal to the control and adjustment unit 30.

[0085] The control and adjustment unit 30 synchronously and dynamically adjusts the size of the driving signal according to the sensing signal to achieve the effect of adjusting the output, improve the temperature rise problem, and have high cooling efficiency. At the same time, each unit is arranged on the printed circuit board 10, which effectively reduces the size and cost of the equipment compared to setting up cooling fans, heat sinks and other structures.

[0086] The stress sensing unit 211 may adopt a stress sensitive element or other stress detection modules. In an optional embodiment, in order to simplify the stress detection method, the stress sensing unit 211 includes a pressure sensitive element. When the printed circuit board 10 is deformed, the pressure data on the pressure sensitive element arranged on the third conductor layer 13 changes, and an electrical signal corresponding to the change is output.

[0087] In order to improve the temperature control efficiency of the printed circuit board 10, in an optional embodiment, the stress threshold includes multiple stress intervals, and the data processing unit 212 stores a mapping relationship between each stress interval and a sensing signal of different magnitude;

[0088] The data processing unit 212 is specifically configured to:

[0089] Determine whether the stress signal reaches the stress threshold, if not, cut off the output of the sensing signal;

[0090] When the stress signal reaches the stress threshold, the stress interval in which the stress signal is located is determined, and the corresponding magnitude of the sensing signal is determined and output based on the stress interval and the mapping relationship.

[0091] In this embodiment, the data processing unit 212 compares the received stress signal with the stress threshold. When the detected stress signal does not reach the stress threshold, it indicates that the current temperature of the printed circuit board 10 is within an acceptable normal temperature range. For example, the normal temperature corresponding to the stress signal is 20°C to 40°C. At this time, there is no need to adjust the temperature of the printed circuit board 10, that is, the drive signal can maintain the current output size.

[0092] When it is detected that the stress signal reaches the stress threshold, it indicates that the current temperature of the printed circuit board 10 is high or low temperature, for example, the temperature reaches 40°C. At this time, the temperature of the printed circuit board 10 needs to be adjusted. At the same time, the data processing unit 212 determines the stress interval where the current stress signal is located. For example, the stress threshold includes three stress intervals. The temperature range corresponding to the first stress interval is 40°C to 50°C, and corresponds to the first sensing signal. The temperature range corresponding to the second stress interval is 50°C to 60°C, and corresponds to the second sensing signal. The temperature range corresponding to the third stress interval is 60°C to 70°C, and corresponds to the third sensing signal. When it is detected that the stress signal falls into the first stress interval, the data processing unit 212 determines the stress interval where the current stress signal is located. For example, the stress threshold includes three stress intervals. The temperature range corresponding to the first stress interval is 40°C to 50°C, and corresponds to the first sensing signal. The temperature range corresponding to the second stress interval is 50°C to 60°C, and corresponds to the second sensing signal. The temperature range corresponding to the third stress interval is 60°C to 70°C, and corresponds to the third sensing signal. The data processing unit 212 outputs a first sensing signal, and the control and adjustment unit 30 adjusts the output of the current driving signal according to the first sensing signal. When it is detected that the stress signal falls into the second stress interval, the data processing unit 212 outputs a second sensing signal, and the control and adjustment unit 30 adjusts the output of the current driving signal according to the second sensing signal. When it is detected that the stress signal falls into the third stress interval, the data processing unit 212 outputs a third sensing signal, and the control and adjustment unit 30 adjusts the output of the current driving signal according to the third sensing signal. Different sensing signals correspond to different descending curves or descending accelerations of corresponding driving signals. The higher the temperature, the faster the descending speed of the driving signal, thereby improving the reduction efficiency.

[0093] Correspondingly, when the temperature is lower, the rising curve or rising acceleration of the driving signal is larger, and the rising speed of the driving signal is faster, thereby improving the heating efficiency.

[0094] The stress interval may be set with a high temperature threshold and a low temperature threshold according to the temperature protection threshold. In an optional embodiment, the stress interval includes a plurality of high temperature stress intervals and a plurality of low temperature stress intervals. The sensing signal includes a plurality of first sensing signals of different sizes and second sensing signals of different sizes. The first sensing signal is not equal to the second sensing signal.

[0095] The data processing unit 212 stores a first mapping relationship between each high temperature stress interval and a first sensing signal of different magnitude, and stores a second mapping relationship between each low temperature stress interval and a second sensing signal of different magnitude;

[0096] The data processing unit 212 is used to determine and output a first sensing signal of a corresponding magnitude based on the high temperature stress interval and the first mapping relationship when it is detected that the stress signal falls into a high temperature stress interval;

[0097] When it is detected that the stress signal falls into a low-temperature stress interval, a second sensing signal of corresponding magnitude is determined and output based on the low-temperature stress interval and the second mapping relationship.

[0098] In this embodiment, the high temperature stress interval and the low temperature stress interval may include multiple ones respectively, for example, three high temperature stress intervals and three low temperature stress intervals, the first high temperature stress interval corresponds to a temperature range of 40°C to 50°C, and corresponds to a first sensing signal, the second high temperature stress interval corresponds to a temperature range of 50°C to 60°C, and corresponds to another first sensing signal, the third high temperature stress interval corresponds to a temperature range of 60°C to 70°C, and corresponds to another first sensing signal, the first low temperature stress interval corresponds to a temperature range of -10°C to 0°C, and corresponds to a second sensing signal, the second low temperature stress interval corresponds to a temperature range of -20°C to -10°C, and corresponds to another second sensing signal, and the third low temperature stress interval corresponds to a temperature range of -30°C to -20°C, and corresponds to another second sensing signal.

[0099] When it is detected that the stress signal falls into one of the high-temperature stress intervals, the data processing unit 212 outputs a first sensing signal of corresponding size to the control and adjustment unit 30 according to the first mapping relationship. The control and adjustment unit 30 reduces the size of the driving signal with different descending curves or descending accelerations according to the sensing signal of corresponding size, thereby reducing the temperature of the printed circuit board 10 and improving the cooling efficiency.

[0100] Correspondingly, when it is detected that the stress signal falls into one of the low-temperature stress intervals, the data processing unit 212 outputs a second sensing signal of corresponding size to the control and adjustment unit 30 according to the second mapping relationship. The control and adjustment unit 30 increases the size of the driving signal with different rising curves or rising accelerations according to the sensing signal of corresponding size, thereby quickly increasing the temperature of the printed circuit board 10 and improving the heating efficiency, so that the temperature of the printed circuit board 10 is maintained within an acceptable normal temperature range.

[0101] Correspondingly, the control and adjustment unit 30 may adopt a corresponding control unit, output unit, etc. In an optional embodiment, as Figure 3 As shown, the control and adjustment unit 30 includes:

[0102] A controller 31 connected to the stress sensing processing unit 21, the controller 31 is used to output a corresponding first enabling signal according to each received first sensing signal, and output a corresponding second enabling signal according to each received second sensing signal;

[0103] The regulating unit 32 is connected to the controller 31 and the target object, and is used to output a driving signal to the target object, and to reduce the driving signal according to a first enabling signal corresponding to a decreasing curve, and to increase the driving signal according to a second enabling signal corresponding to an increasing curve.

[0104] In this embodiment, it is assumed that the high temperature stress interval includes three. Correspondingly, when the stress signal reaches the high temperature stress threshold, the data processing unit 212 outputs first sensing signals of different magnitudes, and the controller 31 outputs a first enabling signal of a corresponding magnitude to the adjustment unit 32 based on the received first sensing signal. The adjustment unit 32 is provided with different reduction curves, for example Figure 4 As shown, it is assumed that three reduction curves corresponding to high temperature stress intervals are included, each high temperature stress interval corresponds to a reduction curve through a first sensing signal and a first enabling signal, and the functions of each reduction curve are different. It is assumed that the driving signal is a voltage signal. When detecting high temperature, at different high temperatures, one of the reduction curves is selected through the first sensing signal and the first enabling signal, and the voltage signal is reduced from the first voltage signal to the second voltage signal. The reduction time required for each reduction curve is different.

[0105] Correspondingly, the adjustment unit 32 also has different internal amplification curves, such as Figure 5 As shown, it is assumed that three amplification curves corresponding to the low-temperature stress interval are included, each low-temperature stress interval corresponds to an amplification curve through the second sensing signal and the second enabling signal, and the functions of each amplification curve are different. It is assumed that the driving signal is a voltage signal. When detecting low temperature, at different low temperatures, one of the amplification curves is selected through the second sensing signal and the second enabling signal, and rises from the third voltage signal to the fourth voltage signal, and the rising time of each amplification curve is different.

[0106] By detecting different stress changes of the printed circuit board 10, different amplification curves or reduction curves can be selected as needed to adjust the size of the driving signal, so that the higher the temperature, the higher the cooling efficiency, and the lower the temperature, the higher the heating efficiency, thereby improving the efficiency of temperature control.

[0107] Compared with the prior art, the embodiments of the present application have the following beneficial effects: the printed circuit board 10 includes n conductor layers, the n conductor layers include a first conductor layer 11 and a second conductor layer 12 located on the outer layer, and a third conductor layer 13 of n-2 layers located between the first conductor layer 11 and the second conductor layer 12; the printed circuit board 10 also includes a temperature sensitive unit 20 located on the third conductor layer 13 and a control and adjustment unit 30 located on the first conductor layer 11; the control and adjustment unit 30 outputs a driving signal for driving a target object, the target object generates thermal power consumption, and the thermal power consumption causes the temperature of the printed circuit board 10 to change; the temperature sensitive unit 20 senses the temperature change of the printed circuit board 10 and outputs a sensing signal; the control and adjustment unit 30 synchronously and dynamically adjusts the size of the driving signal according to the sensing signal to achieve the effect of adjusting the output, improve the temperature rise problem, and have high cooling efficiency; at the same time, each unit is arranged on the printed circuit board 10, and compared with the arrangement of cooling fans, heat sinks and other structures, the volume and cost of the equipment are effectively reduced.

[0108] Embodiment 2

[0109] The present application also proposes a display device, such as Figure 6 As shown, the display device includes a display panel 2 and a printed circuit board 10. The specific structure of the printed circuit board 10 refers to the above embodiment. Since the display device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the printed circuit board 10 is connected to the display panel 2 accordingly.

[0110] In this embodiment, the printed circuit board 10 is a display panel driving circuit, and the output driving signal includes a source driving signal and a gate driving signal output to the display panel 2. The display panel 2 realizes line-by-line scanning according to the gate driving signal, and displays the corresponding image information according to the source driving signal. At the same time, the printed circuit board 10 also outputs a control signal to the display panel 2, such as outputting a common electrode voltage signal to the display panel 2, and providing a common electrode voltage signal to the display panel 2.

[0111] Corresponding to the structure of the target object, in an optional embodiment, such as Figure 7 As shown, the controller 31 of the printed circuit board 10 is a timing controller 311, and the adjustment unit 32 includes a source driving circuit 321 and a gate driving circuit 322;

[0112] The timing controller 311 is connected to the display panel 2 , the source driving circuit 321 and the gate driving circuit 322 , respectively. The source driving circuit 321 and the gate driving circuit 322 are connected to the display panel 2 , respectively.

[0113] In this embodiment, the timing controller 311 is used to output different drive control signals to the source drive circuit 321 and the gate drive circuit 322. The source drive circuit 321 and the gate drive circuit 322 output corresponding source drive signals and gate drive signals to the display panel 2. The display panel 2 realizes line-by-line scanning according to the gate drive signal, and displays corresponding image information according to the source drive signal. At the same time, the timing controller 311 also outputs corresponding enable signals to the source drive circuit 321 and the gate drive circuit 322 according to the sensing signal, thereby changing the voltage of the source drive signal and the gate drive signal output to the display panel 2, changing the display screen of the display panel 2, and changing the thermal power consumption of the display panel drive circuit.

[0114] At the same time, the timing controller 311 is also connected to the display panel 2, and is used to provide a control signal to the display panel 2, such as providing an output common electrode voltage signal to the display panel 2, and providing a common electrode voltage signal for the display panel 2. At the same time, the timing controller 311 also adjusts the size of the control signal output by itself according to the sensing signal, further changes the thermal power consumption of the display panel driving circuit, and dynamically adjusts the temperature rise of the printed circuit board 10.

[0115] Embodiment 3

[0116] A third aspect of the embodiment of the present application provides a temperature control method, which is applied to the printed circuit board 10 as described above. Figure 8 As shown, the temperature control method includes:

[0117] Step S10, configuring a control and adjustment unit 30 on the first conductor layer 11 of the printed circuit board 10 and configuring a temperature sensitive unit 20 on the third conductor layer 13 of the printed circuit board 10;

[0118] Step S20, using the control and adjustment unit 30 to output a driving signal to the target object, and using the temperature sensing unit 20 to sense the temperature change of the first conductor layer 11 and output a sensing signal;

[0119] Step S30: using the control and adjustment unit 30 to adjust the magnitude of the driving signal according to the sensing signal, the driving signal is correlated with the sensing signal.

[0120] In this embodiment, the n adjacent conductor layers of the printed circuit board 10 include the conductor layer of the first layer to the conductor layer of the nth layer, the first conductor layer 11 is the conductor layer of the first layer, the second conductor layer 12 is the conductor layer of the nth layer, and the third conductor layer 13 includes the conductor layer of the second layer to the conductor layer of the n-1th layer, wherein the temperature sensitive unit 20 can be set in any third conductor layer 13 from the conductor layer of the second layer to the conductor layer of the n-1th layer, and the control and adjustment unit 30 can be set in the first conductor layer 11.

[0121] The configuration control and adjustment unit 30 is used to output a driving signal to drive the target object, thereby driving the target object to perform a corresponding target behavior, such as performing a corresponding action or displaying corresponding image information.

[0122] Under a certain working environment, as the working time changes, components such as the control and adjustment unit 30 generate heat power consumption at the same time. The temperature of the printed circuit board 10 will change due to the heat power consumption of the control and adjustment unit 30. The temperature change will be transmitted to the temperature sensitive unit 20, and the temperature sensitive unit 20 will convert it into a changing sensing signal.

[0123] Among them, a corresponding temperature threshold may also be set in the temperature sensitive unit 20, and whether it is necessary to output a sensing signal may be determined based on the detected temperature and the temperature threshold. For example, the temperature sensitive unit 20 sets a high temperature threshold. When the detected temperature is lower than the high temperature threshold, it indicates that over-temperature protection is not currently required. At this time, the temperature sensitive unit 20 may not output a sensing signal. When the detected temperature reaches the high temperature threshold, it indicates that the temperature of the current printed circuit board 10 is too high. The temperature sensitive unit 20 chooses to output a first sensing signal representing overtemperature, and may output first sensing signals of different sizes based on temperatures at different high temperatures. The size of the first sensing signal is positively correlated or negatively correlated with the size of the temperature at the high temperature. The change of the first sensing signal may change according to the temperature interval change or change proportionally according to the temperature value change. The specific change method is not limited.

[0124] Correspondingly, when the temperature of the printed circuit board 10 is too low, the components on the printed circuit board 10 may have the problem of low-temperature failure, resulting in failure to work normally. For this reason, the temperature sensitive unit 20 can also set a low-temperature threshold. When the temperature is detected to be higher than the low-temperature threshold, it indicates that low-temperature protection is not currently required. At this time, the temperature sensitive unit 20 can choose not to output the sensing signal, and when it is detected that the temperature drops to the low-temperature threshold, it indicates that the current temperature of the printed circuit board 10 is too low. The temperature sensitive unit 20 chooses to output a second sensing signal representing the low temperature, and can output second sensing signals of different sizes based on the temperature at different low temperatures. The size of the second sensing signal is positively correlated or negatively correlated with the size of the temperature at the low temperature. Similarly, the change of the second sensing signal can change according to the temperature interval change or change proportionally according to the temperature value change. The specific change method is not limited. Among them, the first sensing signal and the second sensing signal can be electrical signals of different sizes, such as voltage signals and current signals. For example, the first sensing signal is a changing positive voltage signal, and the second sensing signal is a changing negative voltage signal.

[0125] By setting a temperature threshold, selecting to output a sensing signal corresponding to a temperature below the threshold, and not outputting a sensing signal at a temperature within an acceptable range, the amount of computational work of the back-end control and adjustment unit 30 can be reduced, and the efficiency of temperature detection feedback can be improved.

[0126] The sensing signal representing the temperature change is transmitted to the control and adjustment unit 30. After receiving the sensing signal transmitted by the temperature sensitive unit 20, the control and adjustment unit 30 analyzes the sensing signal. When the temperature sensitive unit 20 does not compare the temperature threshold, the sensing signal output by the temperature sensitive unit 20 represents the temperature of the current printed circuit board 10 in real time. At this time, the control and adjustment unit 30 analyzes the sensing signal and determines the temperature of the current printed circuit board 10 based on the sensing signal. The corresponding threshold data can be set inside the control and adjustment unit 30, and the determined temperature data is compared with the threshold data to determine whether the received sensing signal reaches the range of the threshold data, wherein the threshold data can be a single threshold interval or multiple threshold intervals, and whether it is necessary to adjust the size of the drive signal or shut down the output according to the comparison result to achieve over-temperature or low-temperature protection.

[0127] In an optional embodiment, the temperature sensitive unit 20 is a stress sensing processing unit 21, and the stress sensing processing unit 21 includes a stress sensing unit 211 and a data processing unit 212;

[0128] Step S20 includes:

[0129] Step S21, using the stress sensing unit 211 to sense the deformation of the printed circuit board 10 caused by temperature change, and outputting a changed stress signal;

[0130] Step S22, using the data processing unit 212 to compare the stress signal with the stress threshold, and outputting a sensing signal to the control and adjustment unit 30 when the stress signal reaches the stress threshold;

[0131] The stress threshold includes multiple stress intervals, and the data processing unit 212 stores a mapping relationship between each stress interval and a sensing signal of different magnitude;

[0132] The stress interval includes a plurality of high-temperature stress intervals and a plurality of low-temperature stress intervals, the sensing signal includes a plurality of first sensing signals of different magnitudes and second sensing signals of different magnitudes, and the first sensing signal is not equal to the second sensing signal;

[0133] Each high temperature stress interval forms a first mapping relationship with a first sensing signal of different magnitude, and each low temperature stress interval forms a second mapping relationship with a second sensing signal of different magnitude.

[0134] In this embodiment, when the control and adjustment unit 30 and other components generate heat power consumption, the temperature of the printed circuit board 10 will change to a certain extent due to the heat power consumption of the control and adjustment unit 30. The change is a change in the thermal signal. After the thermal signal changes, the printed circuit board 10 will produce a certain deformation. The stress change brought about by the change in deformation will be transmitted to the stress sensing processing unit 21, and the stress sensing processing unit 21 will indirectly sense the change in temperature after processing. The stress sensing processing unit 21 receives the changed stress and indirectly senses the change in temperature based on the stress change. After receiving the changed stress signal, the stress sensing processing unit 21 can determine whether to output the sensing signal based on the size of the stress signal, that is, set the corresponding stress threshold. The stress threshold corresponds to the temperature threshold. Based on the detected stress and the size of the stress threshold, the current temperature of the printed circuit board 10 and the size of the temperature threshold are determined, and then it is determined whether the sensing signal needs to be output.

[0135] The data processing unit 212 is used to compare the received stress signal with the stress threshold. When the detected stress signal does not reach the stress threshold, it indicates that the current temperature of the printed circuit board 10 is within an acceptable normal temperature range. For example, the normal temperature corresponding to the stress signal is 20°C to 40°C. At this time, there is no need to adjust the temperature of the printed circuit board 10, that is, the drive signal can maintain the current output size.

[0136] When it is detected that the stress signal reaches the stress threshold, it indicates that the current temperature of the printed circuit board 10 is high or low. At this time, the temperature of the printed circuit board 10 needs to be adjusted. At the same time, the data processing unit 212 determines the stress interval where the current stress signal is located.

[0137] Among them, the high temperature stress interval and the low temperature stress interval may include multiple ones respectively, for example, including three high temperature stress intervals and three low temperature stress intervals, the temperature range corresponding to the first high temperature stress interval is 40℃~50℃, and corresponds to a first sensing signal, the temperature range corresponding to the second high temperature stress interval is 50℃~60℃, and corresponds to another first sensing signal, the temperature range corresponding to the third high temperature stress interval is 60℃~70℃, and corresponds to another first sensing signal, the temperature range corresponding to the first low temperature stress interval is -10℃~0℃, and corresponds to a second sensing signal, the temperature range corresponding to the second low temperature stress interval is -20℃~-10℃, and corresponds to another second sensing signal, and the temperature range corresponding to the third low temperature stress interval is -30℃~-20℃, and corresponds to another second sensing signal.

[0138] When it is detected that the stress signal falls into one of the high-temperature stress intervals, the data processing unit 212 outputs a first sensing signal of corresponding size to the control and adjustment unit 30 according to the first mapping relationship. The control and adjustment unit 30 reduces the size of the driving signal with different descending curves or descending accelerations according to the sensing signal of corresponding size, thereby reducing the temperature of the printed circuit board 10 and improving the cooling efficiency.

[0139] Correspondingly, when it is detected that the stress signal falls into one of the low-temperature stress intervals, the data processing unit 212 outputs a second sensing signal of corresponding size to the control and adjustment unit 30 according to the second mapping relationship. The control and adjustment unit 30 increases the size of the driving signal with different rising curves or rising accelerations according to the sensing signal of corresponding size, thereby quickly increasing the temperature of the printed circuit board 10 and improving the heating efficiency, so that the temperature of the printed circuit board 10 is maintained within an acceptable normal temperature range.

[0140] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A printed circuit board, characterized in that: include: n conductor layers, including a first conductor layer and a second conductor layer located at the outer layer, and a third conductor layer of n-2 layers located between the first conductor layer and the second conductor layer, wherein n≥3; A temperature sensitive unit is disposed on one of the third conductor layers, and is used to sense the temperature change of the first conductor layer and output a sensing signal; A control and adjustment unit is arranged on the first conductor layer and connected to the temperature sensitive unit, and is used to output a driving signal to a target object and adjust the size of the driving signal according to the sensing signal, and the driving signal is correlated with the sensing signal.

2. The printed circuit board according to claim 1, characterized in that The temperature sensitive unit is a stress sensing processing unit, and the stress sensing processing unit is used to sense the deformation of the first conductor layer caused by temperature change and output the sensing signal.

3. The printed circuit board according to claim 2, characterized in that The stress sensing processing unit comprises: A stress sensing unit, the stress sensing unit is used to sense the deformation of the printed circuit board caused by temperature change and output a changed stress signal; A data processing unit is connected to the control and regulation unit and the stress sensing unit respectively, and the data processing unit is used to compare the stress signal with a stress threshold and output the sensing signal to the control and regulation unit when the stress signal reaches the stress threshold.

4. The printed circuit board according to claim 3, characterized in that The stress threshold includes a plurality of stress intervals, and the data processing unit stores a mapping relationship between each stress interval and a sensing signal of different magnitude; The data processing unit is specifically used for: Determine whether the stress signal reaches the stress threshold, and if not, stop outputting the sensing signal; When the stress signal reaches the stress threshold, the stress interval in which the stress signal is located is determined, and a sensing signal of a corresponding magnitude is determined and output based on the stress interval and the mapping relationship.

5. The printed circuit board according to claim 4, characterized in that The stress interval includes a plurality of high-temperature stress intervals and a plurality of low-temperature stress intervals, the sensing signal includes a plurality of first sensing signals of different magnitudes and a second sensing signal of different magnitudes, and the first sensing signal is not equal to the second sensing signal; The data processing unit stores a first mapping relationship between each high temperature stress interval and a first sensing signal of different magnitude, and stores a second mapping relationship between each low temperature stress interval and a second sensing signal of different magnitude; The data processing unit is configured to determine and output a first sensing signal of corresponding magnitude based on the high temperature stress interval and the first mapping relationship when detecting that the stress signal falls into the high temperature stress interval; And when it is detected that the stress signal falls into the low temperature stress interval, a second sensing signal of corresponding magnitude is determined and output based on the low temperature stress interval and the second mapping relationship.

6. The printed circuit board according to claim 5, characterized in that The control and adjustment unit comprises: a controller connected to the stress sensing processing unit, the controller being configured to output a corresponding first enable signal according to each of the first sensing signals received, and to output a corresponding second enable signal according to the second sensing signal received; The regulating unit is connected to the controller and the target object, and is used to output a driving signal to the target object, and to reduce the driving signal according to a corresponding decreasing curve according to the first enabling signal, and to increase the driving signal according to a corresponding increasing curve according to the second enabling signal.

7. The printed circuit board according to claim 3, characterized in that: The stress sensing unit includes a pressure sensitive element.

8. A display device, characterized in that: It comprises a display panel and a printed circuit board as claimed in any one of claims 1 to 7, wherein the printed circuit board is connected to the display panel accordingly.

9. A temperature control method, applied to a printed circuit board as claimed in any one of claims 1 to 7, characterized in that: The temperature control method comprises: A control and adjustment unit is configured on the first conductor layer of the printed circuit board, and a temperature sensitive unit is configured on the third conductor layer of the printed circuit board; The control and adjustment unit is used to output a driving signal to a target object, and the temperature sensitive unit is used to sense a temperature change of the first conductor layer and output a sensing signal; The control and adjustment unit is used to adjust the magnitude of the driving signal according to the sensing signal, and the driving signal is correlated with the sensing signal.

10. The temperature control method according to claim 9, characterized in that: The temperature sensitive unit is a stress sensing processing unit, and the stress sensing processing unit includes a stress sensing unit and a data processing unit; The step of using the temperature sensitive unit located in the third conductor layer to sense the temperature change of the first conductor layer and outputting the sensing signal specifically includes: The stress sensing unit is used to sense the deformation of the printed circuit board caused by temperature change, and output a changed stress signal; The data processing unit is used to compare the stress signal with a stress threshold, and when the stress signal reaches the stress threshold, the sensing signal is output to the control and regulation unit; The stress threshold includes a plurality of stress intervals, and the data processing unit stores a mapping relationship between each stress interval and a sensing signal of different magnitude; The stress interval includes a plurality of high-temperature stress intervals and a plurality of low-temperature stress intervals, the sensing signal includes a plurality of first sensing signals of different magnitudes and a second sensing signal of different magnitudes, and the first sensing signal is not equal to the second sensing signal; Each high temperature stress interval forms a first mapping relationship with a first sensing signal of different magnitude, and each low temperature stress interval forms a second mapping relationship with a second sensing signal of different magnitude.

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