A double-capillary-core microchannel heat exchanger with double-layer spatial independent parallel drive

By adopting a double-capillary core structure with independent parallel drive in the microchannel heat exchanger, the problems of liquid supply uneven and steam blockage under high heat flow density in the prior art are solved, and more efficient heat dissipation and starting speed are achieved.

CN119835921BActive Publication Date: 2025-05-30CHINA JILIANG UNIV
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Patent Information

Application Number
CN202510295241.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-13
Publication Date
2025-05-30
Estimated Expiration
2045-03-13

AI Technical Summary

Technical Problem

The existing microchannel heat exchangers have problems such as uneven liquid distribution, easy immersion of capillary cores and steam channels, resulting in steam blockage, and excessive flow resistance under high heat flow density, resulting in poor heat dissipation effect.

Method used

A double-capillary microchannel heat exchanger is driven independently parallel to the double-layer space. The internal space is divided into upper and lower double-layer spaces through the middle space, and a compensation cavity, a phase change zone and a gas collection chamber are independently set up. Combined with a micro precision flow control valve, it achieves precise flow control and active independent liquid supply.

Benefits of technology

The space utilization rate of the heat exchanger is improved, uneven liquid distribution and steam blockage are avoided, and the heat dissipation capacity and starting speed are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a double-capillary-core microchannel heat exchanger with double-layer space independent parallel drive, which is evenly divided into upper and lower double-layer spaces by an intermediate partition layer, and a compensation cavity, a phase change region and a gas collecting chamber are independently arranged in each layer of space. Compared with the conventional single-capillary-core microchannel heat exchanger, the overall space utilization rate is effectively improved, the utilization of multiple layers of space inside the microchannel heat exchanger is realized, and at the same time, the phenomena of uneven liquid supply distribution, easy immersion of the capillary core and the steam channel and even gas blockage in the conventional double-capillary-core heat exchanger are avoided; due to the characteristics of the layered structure and due to the micro-precision flow control valves arranged at the upper and lower liquid inlets and the upper and lower steam outlets, precise flow control, active independent liquid supply and independent gas transmission are realized to meet the microelectronic thermal control requirements and situations of different heat flux densities.
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Description

Technical Field

[0001] The present invention belongs to the field of thermal control management of microelectronic devices, and particularly relates to a double-capillary-core microchannel heat exchanger with double-layer spatially independent parallel driving. Background Art

[0002] The microelectronics industry has developed rapidly. The current development trend of microelectronics technology is that the characteristic sizes of micro-integrated electronic systems and micro-semiconductor systems are continuously decreasing, and the integration degree continues to increase. Although the power of each component is very small, the high integration degree makes the heat flux density increase sharply, which poses a problem for the reasonable design of thermal control management technology.

[0003] For a conventional single-layer capillary-core microchannel heat exchanger, usually a compensation chamber and a steam channel are provided, and a layer of capillary core is arranged between the two. By utilizing the driving effect of capillary force, the steam generated by the vaporization of the liquid working medium is provided with a conveying power. However, when controlling the temperature and dissipating heat of the high-heat-flux density interface of a high-power thermal control object, due to the intense evaporation degree and the limited volume space provided by the single-layer structure for the gas-liquid two-phase working medium, it is not only easy to cause insufficient liquid storage in the compensation chamber and dry burning phenomenon. At the same time, the heat exchange area provided for the evaporation and vaporization of the working medium is very limited, and several common steam channel structures cannot smoothly realize the active transportation and collection of steam. On the contrary, the randomness of the steam transportation path is relatively large, making the steam unable to be discharged in time or even blocked by steam, thereby causing a sharp increase in the local temperature. Therefore, for the microchannel heat exchanger with a single-layer capillary-core structure, although the start-up time is greatly shortened and the operation stability is also greatly improved by adopting the mechanical pump driving mode compared with the capillary force self-starting mode, the overall effective utilization rate of the space inside the heat exchanger is relatively low, and the uniformity and stability of the gas-liquid two-phase transportation need to be further improved. In addition, when dealing with the heat dissipation condition of a large heat flux density, the heat exchanger effectiveness problem is serious.

[0004] For a conventional multi-layer capillary-core microchannel heat exchanger, usually a layer of capillary core and a layer of steam channel are symmetrically arranged on the upper side and the lower side inside it (the two layers of capillary cores are on the inner side, and the two layers of steam channels are on the outer side), and a compensation chamber is arranged between the two layers of capillary cores to supply liquid to the capillary cores adjacent to its upper and lower interfaces. Although this structure helps to enhance the conveying power of the steam working medium and the space effective utilization rate is improved to a certain extent, it is easy to cause the heat dissipation function failure of the lower half-layer structure of the heat exchanger, that is, when the compensation chamber supplies liquid to the capillary core adjacent to the lower side, the liquid working medium is easily immersed in the entire lower capillary core channel under the action of gravity, thereby blocking the steam generation holes. At the same time, the liquid working medium will pass through the capillary core and continue to immerse the bottom steam channel, thus increasing the steam flow resistance, and finally resulting in poor heat exchange effect in the lower layer space of the microchannel heat exchanger.

[0005] Therefore, for a multi-capillary microchannel heat exchanger, special attention needs to be paid to the issues of stratified independent liquid supply and gas transportation within the space. At the same time, when multiple compensation chambers are set, how to achieve active liquid supply for each layer and further solve the problem of uneven liquid supply distribution remains to be solved. Summary of the Invention

[0006] In view of the defects or improvement requirements of the prior art, the present invention proposes a double-capillary microchannel heat exchanger with double-layer space independent parallel drive, which not only helps to improve the technical defects such as uneven liquid supply distribution, easy immersion of the capillary core and steam channels and even steam blockage, and excessive flow resistance generated by the channels involved in the prior art, but also is expected to greatly improve the heat dissipation capacity of the heat exchanger.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0008] The present invention provides a double-capillary microchannel heat exchanger with double-layer space independent parallel drive, including an upper end cover, a lower end cover and an intermediate partition layer.

[0009] The heat exchanger is clamped by the fixing groove of the upper end cover and the fixing protrusion of the lower end cover to form an internal space inside. The intermediate partition layer is fixed in the internal space through the inner wall surfaces of the upper and lower end covers and divides the internal space into upper and lower double-layer spaces.

[0010] The intermediate partition layer is provided with an upper gas collecting chamber baffle, a lower gas collecting chamber baffle and a lower compensation chamber baffle. The upper end cover is provided with a slot for the upper gas collecting chamber baffle, and the lower end cover is provided with a slot for the lower gas collecting chamber baffle and a slot for the lower compensation chamber baffle.

[0011] The upper gas collecting chamber baffle, the lower gas collecting chamber baffle and the lower compensation chamber baffle are respectively fixed in the corresponding slots, and the intermediate partition layer is placed on the inner wall surface of the lower end cover and fixed in the horizontal direction at the same time.

[0012] The intermediate partition layer divides the upper space into an upper compensation chamber, an upper phase change region and an upper gas collecting chamber, and divides the lower space into a lower compensation chamber, a lower phase change region and a lower gas collecting chamber.

[0013] When the double-capillary microchannel heat exchanger with double-layer space independent parallel drive provided by the present invention is applied to the thermal control management system of high heat flux density microelectronic devices, it has the following remarkable characteristics:

[0014] 1) Achieve stratified independent liquid supply and gas transportation, precise and controllable

[0015] The microchannel heat exchanger provided by the present invention is evenly divided into upper and lower double-layer spaces by an intermediate partition layer, and a compensation chamber, a phase change region, and a gas collection chamber are independently arranged in each layer of space. Compared with the conventional single-layer capillary wick microchannel heat exchanger, the overall space utilization rate is effectively improved, the utilization of multiple layers of space inside the microchannel heat exchanger is realized, and at the same time, the problems of uneven liquid supply distribution in the conventional double-layer capillary wick heat exchanger, and the capillary wick and steam channels are easily submerged or even vapor blockage are avoided; due to the characteristics of the layered structure, and due to the micro-precision flow control valves arranged at the upper and lower liquid inlets and upper and lower steam outlets, precise flow control, active independent liquid supply, and independent gas transmission are realized to meet the microelectronic thermal control requirements and situations of different heat flux densities.

[0016] 2) Improve the heat dissipation capacity of the heat exchanger

[0017] The upper and lower end covers of the microchannel heat exchanger provided by the present invention are both made of metal materials with high thermal conductivity. The top of the upper end cover is the heat receiving surface. Since the phase change regions are independently arranged in the upper and lower double-layer spaces, heat is transferred from the upper and lower steam channels to the upper and lower capillary wicks. The liquid working medium in the double-layer capillary wicks can share the heat of the heat source, increasing the evaporation intensity and the amount of steam, thereby improving the heat dissipation capacity of the heat exchanger.

[0018] 3) Improve the startup speed of the heat exchanger

[0019] Since the liquid working medium in the upper and lower capillary wicks both undergoes phase change to generate steam, the steam side pressure in the upper and lower gas collection chambers increases more rapidly than that of the conventional single-layer capillary wick microchannel heat exchanger, that is, it reaches the conditions for successful system startup faster: the pressure difference on both sides of the evaporation interface is sufficient to overcome the flow resistance of the working medium in the system. Brief Description of the Drawings

[0020] Figure 1 is the assembly drawing of the microchannel heat exchanger provided by the present invention;

[0021] Figure 2 is the three-dimensional drawing of the microchannel heat exchanger provided by the present invention;

[0022] Figure 3 is the three-dimensional front sectional view A-A of the microchannel heat exchanger provided by the present invention;

[0023] Figure 4 is the front sectional view A-A (removing internal fillers and external valve parts) of the microchannel heat exchanger provided by the present invention;

[0024] Figure 5 is the front sectional view of the upper end cover of the microchannel heat exchanger provided by the present invention (the dotted line is the placement position of the intermediate partition layer);

[0025] Figure 6 is the three-dimensional front sectional view of the upper end cover of the microchannel heat exchanger provided by the present invention (the dotted line is the placement position of the intermediate partition layer);

[0026] Figure 7 It is the upward perspective view of the upper end cover plane of the microchannel heat exchanger provided by the present invention;

[0027] Figure 8 It is the front sectional view of the lower end cover plane of the microchannel heat exchanger provided by the present invention (the dotted line is the placement position of the middle interlayer);

[0028] Figure 9 It is the front sectional view of the three-dimensional view of the lower end cover of the microchannel heat exchanger provided by the present invention (the dotted line is the placement position of the middle interlayer);

[0029] Figure 10 It is the top view of the lower end cover plane of the microchannel heat exchanger provided by the present invention (the dotted line is the placement position of the middle interlayer);

[0030] Figure 11 It is the partial sectional view of the three-dimensional view of the middle interlayer of the microchannel heat exchanger provided by the present invention;

[0031] Figure 12 It is the front view of the middle interlayer plane of the microchannel heat exchanger provided by the present invention;

[0032] Figure 13 It is the upward perspective view of the middle interlayer plane of the microchannel heat exchanger provided by the present invention;

[0033] Figure 14 It is the three-dimensional view of the upper and lower capillary cores of the microchannel heat exchanger provided by the present invention;

[0034] Figure 15 It is the three-dimensional view of the upper and lower porous stainless steel support frames of the microchannel heat exchanger provided by the present invention.

[0035] Explanation of reference numerals:

[0036] 100 - upper end cover, 101 - upper liquid inlet, 102 - outer wall surface liquid inlet, 103 - outer wall surface of the upper end cover, 104 - fixing groove, 105 - inner wall surface liquid inlet, 106 - inner wall surface of the upper end cover, 107 - upper compensation chamber baffle, 108 - liquid supply port of the upper compensation chamber baffle, 109 - upper steam channel, 110 - upper gas collecting chamber baffle slot, 111 - upper steam outlet, 112 - inner wall surface steam outlet, 113 - outer wall surface steam outlet, 114 - upper compensation chamber, 115 - upper phase change region, 116 - upper gas collecting chamber;

[0037] 200 - Lower end cover, 201 - Lower liquid inlet, 202 - Outer wall surface of the lower end cover, 203 - Lower end cover section of the upper liquid inlet, 204 - Protrusion for fixing, 205 - Inner wall surface of the lower end cover, 206 - Liquid supply port of the lower compensation chamber baffle, 207 - Slot position of the lower compensation chamber baffle, 208 - Slot position of the lower gas collection chamber baffle, 209 - Lower end cover section of the upper steam outlet, 210 - Lower steam outlet, 211 - Lower compensation chamber, 212 - Lower phase change region, 213 - Lower gas collection chamber;

[0038] 300 - Intermediate layer, 301 - Upper gas collection chamber baffle, 302 - Lower gas collection chamber baffle, 303 - Lower steam channel, 304 - Lower compensation chamber baffle, 305 - Vent hole of the upper gas collection chamber baffle, 306 - Vent hole of the lower gas collection chamber baffle;

[0039] 400 - Upper capillary wick, 500 - Lower capillary wick;

[0040] 600 - Upper porous stainless steel support frame, 601 - Through hole of the upper support frame, 602 - Support feet of the upper support frame; 700 - Lower porous stainless steel support frame, 701 - Through hole of the lower support frame, 702 - Support feet of the lower support frame;

[0041] 800 - Micro-precision flow control valve. Specific embodiments

[0042] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0043] As Figure 1 and Figure 2 shown, the present application example provides a multi-layer capillary force-driven microchannel heat exchanger for solving the problem of high heat flux interface temperature control and heat dissipation, specifically:

[0044] A double-layer space-independent parallel-driven double-capillary wick microchannel heat exchanger, including an upper end cover 100, a lower end cover 200, an intermediate layer 300, an upper capillary wick 400, a lower capillary wick 500, an upper porous stainless steel support frame 600, a lower porous stainless steel support frame 700, and a micro-precision flow control valve 800.

[0045] As Figure 3As shown in the figure, an upper liquid inlet 101, a lower liquid inlet 201, an upper steam outlet 111, and a lower steam outlet 210 are respectively provided on the side walls of both sides of the heat exchanger. Among them, the upper liquid inlet 101 and the upper steam outlet 111 are formed by opening holes at the same position on the inner wall surface 106 of the upper end cover, the outer wall surface 103 of the upper end cover, and the fixing protrusion 204 of the lower end cover. Therefore, the upper liquid inlet is divided into three parts: the outer wall surface liquid inlet 102, the lower end cover section 203 of the upper liquid inlet, and the inner wall surface liquid inlet 105. The upper steam outlet is divided into three parts: the inner wall surface steam outlet 112, the lower end cover section 209 of the upper steam outlet, and the outer wall surface steam outlet 113.

[0046] As Figures 4 - 7 shown, the side wall of the upper end cover is divided into the outer wall surface 103 of the upper end cover, the fixing groove 104, and the inner wall surface 106 of the upper end cover, and its cross-sectional shape is like an inverted concave character. As Figures 8 - 10 shown, the side wall of the lower end cover is divided into the outer wall surface 202 of the lower end cover, the fixing protrusion 204, and the inner wall surface 205 of the lower end cover, and its cross-sectional shape is like a convex character.

[0047] Furthermore, both the upper and lower end covers are made of a metal material with a high thermal conductivity coefficient.

[0048] The fixing groove 104 of the upper end cover is clamped with the fixing protrusion 204 of the lower end cover, and then fixed by bolt connection to form a space inside the heat exchanger. Among them, the height of the inner wall surface 106 of the upper end cover is shorter than that of the outer wall surface 103 of the upper end cover, and the height of the inner wall surface 205 of the lower end cover is shorter than that of the outer wall surface 202 of the lower end cover. When the upper and lower end covers are assembled, the intermediate layer 300 is clamped up and down through the inner wall surface 106 of the upper end cover and the inner wall surface 205 of the lower end cover, that is, the intermediate layer is fixed in the vertical direction, and at the same time, the internal space is evenly divided into upper and lower double-layer spaces.

[0049] As Figure 11 shown, the intermediate layer is provided with an upper gas collecting chamber baffle 301, a lower gas collecting chamber baffle 302, and a lower compensation chamber baffle 304. As Figure 5 shown, the inner wall surface 106 of the upper end cover is provided with an upper gas collecting chamber baffle slot 110. As Figure 8 shown, the inner wall surface 205 of the lower end cover is provided with a lower gas collecting chamber baffle slot 208 and a lower compensation chamber baffle slot 207. By respectively fixing the upper gas collecting chamber baffle 301, the lower gas collecting chamber baffle 302, and the lower compensation chamber baffle 304 in the corresponding slots 110, 208, and 207, that is, placing the intermediate layer on the inner wall surface 205 of the lower end cover, the intermediate layer is fixed in the horizontal direction when the upper and lower end covers are clamped.

[0050] As Figure 3As shown in the figure, a compensation chamber baffle 107 is provided on the lower surface of the top of the upper end cover. The compensation chamber baffle 107 and the upper gas collecting chamber baffle 301 of the intermediate layer 300 divide the upper cavity into an upper compensation chamber 114, an upper phase change region 115, and an upper gas collecting chamber 116. A plurality of parallel micro-channel grooves are formed on the lower surface of the top of the upper end cover to form an upper steam channel 109. An upper porous stainless steel support frame 600 and an upper capillary wick 400 are arranged in the upper phase change region 115, and the upper capillary wick 400 is tightly connected to the upper porous stainless steel support frame 600 and the upper steam channel 109 respectively.

[0051] The lower compensation chamber baffle 304 and the lower gas collecting chamber baffle 302 of the intermediate layer divide the lower cavity into a lower compensation chamber 211, a lower phase change region 212, and a lower gas collecting chamber 213. A plurality of parallel micro-channel grooves are formed on the lower surface of the intermediate layer 300 between the lower compensation chamber baffle 304 and the lower gas collecting chamber baffle 302 to form a lower steam channel 303. A lower porous stainless steel support frame 700 and a lower capillary wick 500 are arranged in the lower phase change region, and the lower capillary wick 500 is tightly connected to the lower porous stainless steel support frame 700 and the lower steam channel 303 respectively.

[0052] Among them, the upper and lower porous stainless steel support frames control the liquid working medium level, transfer heat, and play a supporting role for the upper capillary wick 400 and the lower capillary wick 500 at the same time. The liquid working medium in the upper and lower capillary wicks absorbs heat and undergoes a phase change, and the generated steam is transported through the upper steam channel 109 and the lower steam channel 303 respectively, and then enters the upper gas collecting chamber 116 and the lower gas collecting chamber 213. The steam working medium in the upper and lower gas collecting chambers is finally output from the heat exchanger through the upper steam outlet 111 and the lower steam outlet 210, and is collected and enters the external cooling device.

[0053] In this embodiment, as Figure 5 and Figure 10 the upper steam channel 109 and the lower steam channel 303, their cross-sections can be rectangular, triangular, Ω-shaped, semi-circular, upper trapezoidal or lower trapezoidal, and the basic size range of the channels is within 1mm×1mm.

[0054] In this embodiment, as Figure 3 the height of the upper compensation chamber baffle 107 and the lower compensation chamber baffle 304 is 1-2mm shorter than the upper and lower spaces, and an upper liquid supply port 108 and a lower liquid supply port 206 are respectively formed with the upper surface of the intermediate layer 300 and the upper surface of the bottom of the lower end cover 200, for transporting the liquid working medium from the upper compensation chamber 114 and the lower compensation chamber 211 into the upper phase change region 115 and the lower phase change region 212.

[0055] In this embodiment, as Figure 10, at the positions of the upper plenum baffle 301 and the lower plenum baffle 302 corresponding to the upper steam channel 109 and the lower steam channel 303, an upper plenum baffle vent hole 305 and a lower plenum baffle vent hole 306 are respectively provided. Steam enters the upper plenum 116 and the lower plenum 213 through the upper and lower vent holes, and the cross-sectional shape of the vent hole is the same as that of the steam channel.

[0056] In this embodiment, as Figure 12 and Figure 14 shown, the upper wick 400 and the lower wick 500 are made of sintered metal powder. The liquid working medium absorbs heat on the surfaces of the upper and lower wicks and undergoes a phase change, and the capillary suction force provides power for the operation of the working medium in the system.

[0057] In this embodiment, as Figure 13 and Figure 15 shown, the upper porous stainless steel support frame 600 and the lower porous stainless steel support frame 700 are uniformly provided with upper support through holes 601 and lower support through holes 701 with slightly larger diameters on their surfaces. Their shapes can be rectangular or circular, and upper support feet 602 and lower support feet 702 are provided at the four ends. The surfaces of the upper and lower porous stainless steel support frames are used to support the wicks, and the liquid working medium is evenly distributed into the wicks through the upper and lower support through holes. The heights of the upper and lower support feet limit the liquid level of the liquid working medium in the wicks, so that the liquid wets but does not submerge the wicks.

[0058] In this embodiment, as Figure 1 , the micro-precision flow control valve 800 can be fixed at the positions of the upper liquid inlet 101, the lower liquid inlet 201, the upper steam outlet 111 and the lower steam outlet 210 by welding or threaded connection, so as to independently control the flow rate of the liquid working medium and adjust the gas transmission size according to the evaporation degree. The micro-precision flow control valve is connected to external devices such as a cooling device and a pump through a hose, which plays a role in shock absorption and three-dimensional space layout.

[0059] In this embodiment, the type of the working medium is reasonably selected according to the heat flux density and the operating temperature of the use occasion. Working media with relatively small latent heat of vaporization such as R123 are suitable for operating in occasions with relatively low temperature and small heat flux density. Working media with relatively large latent heat of vaporization such as ethanol, methanol and water are suitable for operating in occasions with relatively high temperature and large heat flux density.

[0060] The assembly process of the double-wick microchannel heat exchanger with double-layer space independent parallel drive provided by the example of this application is as follows:

[0061] First, place the lower porous stainless steel support frame 700 in the lower phase change region 212 of the lower end cover 200, and lay the lower capillary wick 500 on top of the lower porous stainless steel support frame 700. Align the lower compensation chamber baffle 304 and the lower gas collecting chamber baffle 302 of the intermediate layer 300 with the lower compensation chamber baffle slot 207 and the lower gas collecting chamber baffle slot 208 respectively and place them in, thereby placing the intermediate layer on the inner wall surface 205 of the lower end cover.

[0062] After that, place the upper porous stainless steel support frame 600 in the upper phase change region 115, and lay the upper capillary wick 400 on top of the upper porous stainless steel support frame. Then, align the upper gas collecting chamber baffle slot 110 on the inner wall surface of the upper end cover 100 with the upper gas collecting chamber baffle 301 of the intermediate layer and place it in. Clamp the upper end cover 100 and the lower end cover 200 together. At this time, the fixing groove 104 on the upper end cover cooperates with the fixing protrusion 204 on the lower end cover for clamping. The inner wall surface of the upper end cover presses the intermediate layer, fixing the intermediate layer up and down, and fixedly connecting the upper end cover and the lower end cover with bolts.

[0063] Finally, install the micro-precision flow control valve 800 at the upper and lower liquid inlets and the upper and lower steam outlets to complete the assembly.

[0064] The working process of the heat exchanger of the present invention is specifically described below:

[0065] Adjust the micro-precision flow control valve 800 to an appropriate flow position, so that the liquid working medium flows into the upper and lower compensation chambers from the upper and lower liquid inlets, stands still uniformly in the upper and lower compensation chambers, and then enters the upper and lower phase change regions through the upper and lower liquid supply ports at the upper and lower compensation chamber baffles, wetting the upper and lower capillary wicks placed on the upper and lower porous stainless steel support frames.

[0066] The top of the upper end cover of this heat exchanger is the heat receiving surface. During operation, the heat receiving surface is in direct contact with the heat load surface and absorbs heat through heat conduction. The heat is quickly transferred to the upper capillary wick 400 through the fins of the upper steam channel 109 of the upper end cover, causing the liquid working medium in the upper capillary wick to vaporize due to heat. The formed steam is then transported through the upper steam channel 109 and enters the upper gas collecting chamber 116 through the ventilation holes 305 of the upper gas collecting chamber baffle.

[0067] Due to the heat conduction phenomenon on the side wall of the heat exchanger, the heat is transferred to the lower steam channel 303 through the intermediate layer 300 and then to the lower capillary wick 500, causing the liquid working medium in the lower capillary wick to vaporize due to heat. The formed steam is then transported through the lower steam channel 303 and enters the lower gas collecting chamber 213 through the ventilation holes 306 of the lower gas collecting chamber baffle. The steam working media in the upper and lower gas collecting chambers are respectively output from the heat exchanger through the upper and lower steam outlets, enter the external cooling device after being aggregated, release sensible heat and latent heat and then condense into subcooled liquid working medium, and flow back into the microchannel heat exchanger to complete the cycle.

[0068] As can be seen from the above, the double-capillary-core microchannel heat exchanger with double-layer space independent parallel drive provided by the present invention overcomes the deficiencies of the existing double-capillary-core heat exchangers and improves the working performance.

[0069] It is easy for those skilled in the art to understand that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A double-layer space independently parallel driven double capillary wick microchannel heat exchanger, characterized in that: It includes an upper end cover, a lower end cover and a middle partition; The heat exchanger is clamped by the fixing groove of the upper end cover and the fixing protrusion of the lower end cover, so as to form an internal space inside; the middle partition is fixed in the internal space through the inner wall surface of the upper end cover and the lower end cover, and divides the internal space into an upper and a lower double space; The middle partition is provided with an upper air collecting chamber baffle, a lower air collecting chamber baffle and a lower compensation chamber baffle; the upper end cover is provided with an upper air collecting chamber baffle slot, and the lower end cover is provided with a lower air collecting chamber baffle slot and a lower compensation chamber baffle slot; The upper air collecting chamber baffle, the lower air collecting chamber baffle and the lower compensation chamber baffle are fixed to the corresponding slots respectively, and the middle partition is placed on the inner wall surface of the lower end cover, and the middle partition is fixed in the horizontal direction at the same time; The middle partition layer divides the upper space into an upper compensation cavity, an upper phase change zone and an upper gas collection chamber, and divides the lower space into a lower compensation cavity, a lower phase change zone and a lower gas collection chamber; An upper liquid inlet, a lower liquid inlet, an upper steam outlet and a lower steam outlet are respectively provided on the wall surfaces on both sides of the heat exchanger; The lower surface of the top of the upper end cover is provided with a plurality of parallel micro grooves to form an upper steam groove. An upper porous stainless steel support frame and an upper capillary wick are arranged in the upper phase change zone. The upper capillary wick is tightly connected to the upper porous stainless steel support frame and the upper steam groove respectively. An upper compensation cavity baffle is also provided on the lower surface of the top of the upper end cover. The middle partition layer is provided with a plurality of parallel micro-grooves on the lower surface between the lower compensation chamber baffle and the lower gas collecting chamber baffle to form a lower steam channel, and a lower porous stainless steel support frame and a lower capillary wick are arranged in the lower phase change zone, and the lower capillary wick is tightly connected to the lower porous stainless steel support frame and the lower steam channel respectively; The upper compensation cavity baffle and the lower compensation cavity baffle respectively form an upper liquid delivery port and a lower liquid delivery port with the upper surface of the middle partition layer and the upper surface of the bottom of the lower end cover; The micro precision flow control valves are respectively fixed at the upper liquid inlet, the lower liquid inlet, the upper steam outlet and the lower steam outlet, so as to independently control the flow of the liquid working medium.

2. The double capillary wick microchannel heat exchanger according to claim 1, characterized in that: The cross-sections of the upper steam channel and the lower steam channel are both rectangular, triangular, Ω-shaped, semicircular, upper trapezoidal or lower trapezoidal, and the basic size range of the channel is within 1mm×1mm.

3. The double capillary wick microchannel heat exchanger according to claim 2, characterized in that: An upper vent hole is provided at a position corresponding to the upper steam channel and the upper air collecting chamber baffle, and the cross-sectional shape of the upper vent hole is consistent with the cross-sectional shape of the upper steam channel; Lower ventilation holes are respectively opened at positions corresponding to the lower air collecting chamber baffle and the lower steam channel, and the cross-sectional shape of the lower ventilation holes is consistent with the cross-sectional shape of the lower steam channel.

4. The double capillary wick microchannel heat exchanger according to claim 1, characterized in that: The upper porous stainless steel support frame and the lower porous stainless steel support frame are evenly provided with through holes on their surfaces for supporting the capillary core and evenly diverting the liquid working medium into the capillary core; The upper porous stainless steel support frame and the lower porous stainless steel support frame are provided with supporting feet at four ends, and the height of the supporting feet limits the liquid level of the liquid working medium in the capillary core, so that the liquid infiltrates but does not immerse the capillary core.

5. The double capillary wick microchannel heat exchanger according to claim 1, characterized in that: The heights of the upper compensation cavity baffle and the lower compensation cavity baffle are both 1-2 mm lower than the upper and lower spaces.

6. The double capillary wick microchannel heat exchanger according to claim 1, characterized in that: The micro precision flow control valve is connected to external equipment through a hose and is used for shock absorption and three-dimensional spatial arrangement.

7. The double capillary wick microchannel heat exchanger according to claim 1, characterized in that: The upper end cover and the lower end cover are both made of metal material with high thermal conductivity.

Citation Information

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