Image sensing module

Abstract

The invention provides an image sensing module which comprises an image sensing wafer, a supporting piece, a light-transmitting layer and a shielding layer. The image sensing wafer includes an image sensing region. The supporting piece is arranged on the upper surface of the image sensing wafer and surrounds the image sensing area. The light-transmitting layer is arranged on the upper surface of the supporting piece, the lower surface of the light-transmitting layer faces the image sensing wafer, the light-transmitting layer comprises a light-transmitting area and a shielding area surrounding the light-transmitting area, the light-transmitting area corresponds to the image sensing area, and the projection of the shielding area in the normal direction of the lower surface of the light-transmitting layer does not overlap with the image sensing area. The shielding layer is formed in the shielding area and comprises a frame-shaped part and a plurality of reinforcing parts, and the reinforcing parts are individually located at the corners of the frame-shaped part.

Description

Technical Field

[0001] The present disclosure relates to an image sensing module, and more particularly to a packaging structure of the image sensing module. Background Art

[0002] In the packaging structure of a conventional image sensor chip, a glass layer is fixed to the image sensor chip by adhesive, and the adhesive surrounds the periphery of the image sensor chip. However, when light enters the interior of the packaging structure and irradiates components other than the image sensor, it may cause the light to be focused at a specific position in the image sensing area due to reflection or refraction, resulting in flare. In order to improve the aforementioned flare phenomenon, an opaque sealant may be provided on the sides of the glass layer and the adhesive to prevent external light from passing through the adhesive through the sides of the packaging structure and entering the interior of the packaging structure. At the same time, a rectangular black frame (black matrix) may be provided between the contact surface of the glass layer and the adhesive to prevent external light from passing through the glass layer through the front of the packaging structure and irradiating components other than the adhesive or the image sensor.

[0003] As the market continues to demand for the sensing capabilities of image sensors, while still hoping that the packaging structure will maintain or even reduce its volume, the current image sensor packaging structure has gradually increased its image sensing area and gradually shrunk its adhesive layer, resulting in a continuous shortening of the distance between the image sensing area and the adhesive layer, and the impact of the flare phenomenon has become increasingly difficult to ignore. Experiments have found that the cause of the flare phenomenon is at least partly due to the fact that after the miniaturization of the packaging structure, the traditional black frame cannot completely cover the adhesive. Summary of the invention

[0004] In view of the above, the applicant proposes an image sensing module, comprising an image sensing chip, a support, a light-transmitting layer and a shielding layer. The image sensing chip comprises an image sensing area. The support is disposed on the upper surface of the image sensing chip and surrounds the image sensing area. The light-transmitting layer is disposed on the upper surface of the support, the light-transmitting layer comprises an upper surface and a lower surface, the lower surface faces the image sensing chip and comprises a light-transmitting area and a shielding area surrounding the light-transmitting area, the light-transmitting area corresponds to the image sensing area, and the projection of the shielding area along the normal direction of the lower surface of the light-transmitting layer does not overlap with the image sensing area. The shielding layer is formed in the shielding area of ​​the lower surface of the light-transmitting layer and is located between the light-transmitting layer and the support, the shielding layer comprises a frame-shaped portion and a plurality of reinforcing portions, each of the reinforcing portions is individually located at a corner of the frame-shaped portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1A FIG. 1 is a top view of an image sensing module without a light-transmitting layer according to an embodiment of the present disclosure.

[0006] Figure 1B This is revealed Figure 1A A schematic cross-sectional view along the X1-X1 tangent line in the embodiment.

[0007] Figure 1C This is revealed Figure 1A A partial enlarged schematic diagram of the framed portion A in the embodiment.

[0008] Figure 2A FIG. 4 is a schematic top view of an image sensing module according to a first embodiment of the present disclosure.

[0009] Figure 2B This is revealed Figure 2A A schematic cross-sectional view along the X2-X2 tangent line in the embodiment.

[0010] Figure 3 FIG. 4 is a schematic top view of an image sensing module according to a second embodiment of the present disclosure.

[0011] Figure 4 FIG. 4 is a schematic top view of an image sensing module according to a third embodiment of the present disclosure.

[0012] Figure 5 FIG. 4 is a schematic top view of an image sensing module according to a fourth embodiment of the present disclosure.

[0013] Wherein, the reference numerals are:

[0014] 1a, 1b, 1c, 1d, 1e: Image sensor module

[0015] 11: Shielding layer

[0016] 111: frame part

[0017] 1111: forward shielding segment

[0018] 1112: Inner shielding section

[0019] 1113: Outer shielding section

[0020] 112: Reinforcement

[0021] 12: Adhesive layer

[0022] 121: Rubber Spinning Department

[0023] 13: Support

[0024] 14: Image sensor chip

[0025] 141: Image sensing area

[0026] 142: Solder pad

[0027] 15: Translucent layer

[0028] 16: Encapsulation layer

[0029] 17: Substrate layer

[0030] 18: Welding feet

[0031] D1,D2: length DETAILED DESCRIPTION

[0032] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

[0033] Figure 1A is a top view schematic diagram of an image sensing module without a light-transmitting layer in one embodiment of the present disclosure; Figure 1B This is revealed Figure 1A Please refer to the cross-sectional diagram along the X1-X1 tangent line in the embodiment. Figure 1A and Figure 1B The image sensing module 1a includes an adhesive layer 12, a support member 13, an image sensing chip 14, a packaging layer 16, a substrate layer 17, and solder pins 18. In this embodiment, the image sensing module 1a does not include a light-transmitting layer 15 (see Figure 2B ) and is not sealed yet. Figure 1A The top view of the image sensing module 1a can directly see the adhesive layer 12 and the image sensing chip 14 inside. The image sensing chip 14 includes an image sensing area 141 and is disposed on the upper surface of the substrate layer 17. The support member 13 is disposed on the upper surface of the image sensing chip 14 and surrounds the image sensing area 141. The adhesive layer 12 is disposed on the upper surface of the support member 13 and surrounds the image sensing area 141. The packaging layer 16 is disposed on the upper surface of the substrate layer 17 and surrounds the adhesive layer 12, the support member 13 and the image sensing chip 14.

[0034] The image sensor chip 14 is an integrated circuit chip, which can be a COMS image sensor chip 14 for visible light or invisible light. The image sensor chip 14 can be connected to the substrate layer 17 by flip chip connection or wire bonding. The substrate layer 17 can include a plurality of solder pins 18, which are suitable for soldering the image sensor module 1a with an electronic component (not shown) so that the image sensor chip 14 disposed on the substrate layer 17 is electrically connected to the electronic component. The substrate layer 17 can be composed of resin (or a mixture with glass fiber), ceramic, or glass. In some embodiments, the material of the substrate layer 17 can be a mixture of one or more ceramic materials selected from the group consisting of silicon nitride (Si3N4), aluminum oxide (Al2O3), aluminum nitride (AlN), zirconium oxide (ZrO2), zirconium oxide toughened alumina (ZTA) and beryllium oxide (BeO).

[0035] The upper and lower sides of the support member 13 are used to connect the light-transmitting layer 15 and the image sensing chip 14, respectively. The support member 13 keeps the light-transmitting layer 15 and the image sensing chip 14 at a distance. In this embodiment, the upper surface of the image sensing chip 14 includes a solder pad 142, which is buried at the bottom of the support member 13 and electrically connected to the substrate layer 17 through wire bonding. In other embodiments, the solder pad 142 on the upper surface of the image sensing chip 14 can also be disposed on the outside of the support member 13. The support member 13 surrounds the image sensing area 141 and forms a closed space with the image sensing chip 14 and the light-transmitting layer 15, allowing only light to enter the image sensing module from the light-transmitting layer 15. The material of the support member 13 can be a mixture of one or more materials selected from the group consisting of polyurethane (PU), polyacrylonitrile (PAN), polyvinyl alcohol (PVA), polylactic acid (PLA), polyethylene oxide (PEO), polyethylene terephthalate (PET), polyvinyl pyrrolidone (PVP), polyvinyl chloride (PV), cellulose acetate (CA), poly(lactic-co-glycolic acid) (PLGA), polycaprolactone (PCL), polyethylene glycol (PEG), polydimethylsiloxane (PDMS), glass fiber, PS, PMMA, PA and PA6.6. The material of the light-transmitting layer 15 can be a mixture of one or more materials selected from the group consisting of glass, poly(methyl methacrylate) (PMMA), polystyrene (PS), polycarbonate (PC), polydiallyl glycol carbonates (CR-39), styrene-acrylonitrile copolymer (SAN), poly(4-methyl-1-pentene) (TPX) and transparent polyamide (PA).

[0036] The encapsulation layer 16 may be made of epoxy, polyimide (PI) or silicone to cover and protect the inner image sensing area 141, prevent moisture from entering the closed space of the image sensing module, or form an opaque layer to prevent external light from passing through the encapsulation layer 16 and causing photosensitive noise. The method for forming the encapsulation layer 16 may be a glue pouring process, so that the uncured high-flow glue covers the structure to be encapsulated.

[0037] The adhesive layer 12 is disposed around the image sensing area 141 to fix the light-transmitting layer 15 and the supporting member 13. Figure 1A As shown, the adhesive layer 12 roughly presents a square frame surrounding the image sensing area 141. The method for forming the adhesive layer 12 can adopt a dispensing process so that the sealant covers the support member 13 around the image sensing area 141. In detail, the support member 13 is arranged on the upper surface of the image sensing chip 14, and the nozzle of the dispensing equipment moves along the frame direction of the support member 13 to apply the sealant. The applicant found in the research process that when the dispensing equipment changes the moving direction, the adhesive is pulled by the dispensing nozzle and the adhesive is easily thrown off. For example, if Figure 1A As shown, the glue throwing phenomenon occurs at the four corner parts of the frame shape of the adhesive layer 12.

[0038] Figure 1C This is revealed Figure 1A Please refer to the partial enlarged schematic diagram of the frame A part in the embodiment. Figure 1C . The inner angle of the adhesive layer 12 is not a 90-degree corner, but has an umbrella-shaped glue-spinning portion 121, which causes the adhesive layer 12 to be closer to the image sensing area 141 at the corner. In some embodiments, a shielding layer can be provided between the adhesive layer 12 and the light-transmitting layer 15 to prevent light from penetrating the light-transmitting layer 15 and irradiating the adhesive layer 12. However, although the square-shaped shielding layer prevents light from irradiating the frame portion of the adhesive layer 12, it cannot prevent light from irradiating the glue-spinning portion 121 at the frame-shaped corner of the adhesive layer 12. Therefore, the corner portion of the image sensing area 141 is affected by the glue-spinning portion 121, and glare is prone to occur.

[0039] Figure 2A is a schematic top view of an image sensing module according to a first embodiment of the present disclosure; Figure 2B This is revealed Figure 2A Please refer to the cross-sectional diagram along the X2-X2 tangent line in the embodiment. Figure 2A and Figure 2BThe image sensing module 1b includes a shielding layer 11, an adhesive layer 12, a support member 13, an image sensing chip 14, a light-transmitting layer 15, a packaging layer 16, a substrate layer 17 and a solder pin 18, and is in a sealed state. The light-transmitting layer 15 includes an upper surface and a lower surface. The lower surface of the light-transmitting layer 15 faces the image sensing chip 14 and includes a light-transmitting area and a shielding area surrounding the light-transmitting area. The light-transmitting area is correspondingly arranged directly above the image sensing area 141 of the image sensing chip 14, and the projection of the shielding area along the normal direction of the lower surface of the light-transmitting layer 15 does not overlap with the image sensing area 141. In other words, when light is emitted from directly above the image sensing module 1b to the light-transmitting layer 15, only the light that passes through the light-transmitting area can reach the image sensing area 141. The shielding layer 11 is formed in the shielding area on the lower surface of the light-transmitting layer 15 and is located between the light-transmitting layer 15 and the support member 13. The light-transmitting layer 15 is bonded to the shielding layer 11 to form a black-frame glass, and the black-frame glass is bonded to the supporting member 13 via an adhesive layer 12 .

[0040] The shielding layer 11 is suitable for blocking light of a specific wavelength. For example, the image sensing chip 14 is a visible light image sensor, and the image sensing module can be provided with a shielding layer 11 that blocks light of a visible light wavelength (380nm to 780nm). The shielding layer 11 includes a frame-shaped portion 111 and a plurality of reinforcing portions 112. The frame-shaped portion 111 is disposed above the support member 13 to prevent light from irradiating the support member 13 or the adhesive layer 12. Each reinforcing portion 112 is individually located at a corner of the frame-shaped portion 111. The corner may refer to the inner angle of the corner section of the frame-shaped portion 111. In the first embodiment, the four corners of the frame-shaped portion 111 are provided with reinforcing portions 112. In other embodiments, the reinforcing portion 112 may be selectively disposed at one or more of the four corners of the frame-shaped portion 111. In addition, the frame-shaped portion 111 is not limited to a rectangle. The reinforcing portion 112 of the shielding layer 11 prevents light from irradiating the glue-spinning portion 121 at the frame-shaped corner of the adhesive layer 12, thereby avoiding the glare problem at the corner of the image sensing area 141. As mentioned above, the glue-spinning portion 121 of the adhesive layer 12 is roughly umbrella-shaped, that is, the hypotenuse of the triangle is concave toward the vertex to form a geometric shape with an arc. In the first embodiment, the reinforcing portion 112 of the shielding layer 11 extends inward from the corner of the frame portion 111 to form a triangle, and its hypotenuse portion protrudes inwardly relative to the arc portion of the umbrella-shaped glue-spinning portion 121 (closer to the image sensing area 141), thereby preventing light from irradiating the inner edge of the glue-spinning portion 121. In this embodiment, the light-transmitting area of ​​the light-transmitting layer 15 is roughly octagonal, and the projection of the octagonal light-transmitting area along the normal direction of the lower surface of the light-transmitting layer 15 completely covers the image sensing area 141. In other words, the frame-shaped portion 111 and the plurality of reinforcement portions 112 of the shielding layer 11 are all located outside the image sensing area 141 .

[0041] One advantage of the triangular reinforcement portion 112 is that it is easy to form, and only the corner blocks need to be retained during the process of cutting the shielding layer 11. In some embodiments, the appearance of the glue-spinning portion 121 of the adhesive layer 12 is related to the viscosity of the sealant, the moving speed and direction of the dispensing equipment, and has nothing to do with the length or width of the outer frame portion of the support 13, so the glue-spinning portion 121 is roughly symmetrical. Umbrella-shaped; based on this, the reinforcement portion 112 is designed as an isosceles triangle to achieve the maximum shielding effect. In some embodiments, the distance between the boundary of the reinforcement portion 112 of the shielding layer 11 and the boundary of the image sensing area 141 is less than the distance between the boundary of the frame portion 111 of the shielding layer 11 and the boundary of the image sensing area 141. The distance can refer to the shortest straight-line distance between the boundaries, or it can refer to the projection distance projected on the upper surface of the image sensing chip 14. For example, the distance between the boundary of the frame portion 111 of the shielding layer 11 and the boundary of the image sensing area 141 is a length D1, and the distance between the boundary of the reinforcement portion 112 of the shielding layer 11 (i.e., any point on the hypotenuse of the triangle) and the boundary of the image sensing area 141 is a length D2, wherein the length D1 is greater than the length D2. In this way, the reinforcement portion 112 extends inwardly relative to the corner of the frame portion 111, and is sufficient to cover the inwardly protruding glue-spinning portion 121 of the adhesive layer 12.

[0042] The difference between the length D1 and the length D2 needs to be considered in terms of the protrusion of the glue-spinning portion 121. Using a low-viscosity sealant may cause the glue layer 12 to have a more serious glue-spinning problem at the corners. In this case, using a shielding layer 11 with a larger difference between the length D1 and the length D2 is beneficial for increasing coverage. For example, Figure 3 is a top view schematic diagram of an image sensing module of the second embodiment of the present disclosure, please refer to Figure 3 . In the second embodiment, the reinforcement portion 112 of the shielding layer 11 of the image sensing module 1c extends inward from the corner of the frame-shaped portion 111 to form a fan-shape, and its arc portion protrudes inward relative to the arc portion of the umbrella-shaped glue-spinning portion 121 to prevent light from irradiating the inner edge of the glue-spinning portion 121. The arc portion of the fan-shaped reinforcement portion 112 protrudes more inward relative to the hypotenuse portion of the triangular reinforcement portion 112, thereby increasing the difference between the length D1 and the length D2 to achieve a better corner coverage effect. The fan-shape is not limited to a geometric shape composed of an arc and two straight lines of the same radius, but may also refer to a geometric shape composed of an arc and two straight lines of different lengths. For example, Figure 3 The fan-shaped portion shown includes two straight lines of different lengths. In other embodiments, the reinforcement portion 112 is designed as a fan-shaped portion with a constant radius to enhance the shielding effect.

[0043] Increasing the protrusion of the reinforcement portion 112 helps to shield the rubber-spinning portion 121; however, when the frame portion 111 of the shielding layer 11 is closer to the image sensing area 141 (i.e., the length D1 is shorter), the use of a more protruding reinforcement portion 112 may cause the corners of the image sensing area 141 to be covered, resulting in black shadows appearing at the corners of the image. Therefore, the selection of the structure of the reinforcement portion 112 still needs to consider the size of the image sensing area 141. In order to take into account the coverage of the reinforcement portion 112 and increase the range of the image sensing area 141, in some embodiments, the reinforcement portion 112 extends inward from the corners of the frame portion 111 to form an umbrella shape. For example, Figure 4 is a top view of an image sensing module according to a third embodiment of the present disclosure. Figure 4 In the third embodiment, the reinforcing portion 112 of the shielding layer 11 of the image sensing module 1d is formed into an umbrella shape, and its arc portion is aligned with or slightly protrudes inward relative to the arc portion of the umbrella-shaped glue-spinning portion 121, thereby preventing light from irradiating the inner edge of the glue-spinning portion 121. The umbrella shape may refer to a geometric shape formed by the arc and two straight lines formed by the hypotenuse of a triangle being concave toward the vertex. The lengths of the two straight lines may be the same or different.

[0044] In some embodiments, considering that the protrusion of the rubber-spinning portion 121 is difficult to control, a large-area reinforcement portion 112 is used to ensure that the rubber-spinning portion 121 is covered. Figure 5 is a top view of an image sensing module according to a fourth embodiment of the present disclosure. Figure 5 In the fourth embodiment, the reinforcing portion 112 of the shielding layer 11 of the image sensing module 1e extends inward from the corner of the frame-shaped portion 111 to form a rectangle, and the inner corner of the rectangle protrudes inward relative to the arc portion of the umbrella-shaped glue-spinning portion 121 to prevent light from irradiating the inner edge of the glue-spinning portion 121. The rectangular reinforcing portion 112 can ensure to the greatest extent that the glue-spinning portion 121 does not exceed the coverage area of ​​the shielding layer 11, but also limits the range of the image sensing area 141. The inner angle of the rectangle can be greater than or equal to 90 degrees, and the lengths of the two straight lines forming the inner angle can be the same or different.

[0045] In some embodiments, the frame portion 111 of the shielding layer 11 includes a forward shielding segment, which is disposed directly above the support member 13, and the reinforcement portion 112 extends inward from the corner of the frame portion 111. In this embodiment, the forward shielding segment covers directly above the support member 13, and the reinforcement portion 112 protrudes inwardly. In this way, when light is emitted from directly above the image sensor module toward the shielding layer 11, the forward shielding segment prevents the light from being irradiated directly onto the adhesive layer 12 or the support member 13, and the reinforcement portion 112 prevents the light from being irradiated directly onto the glue-spinning portion 121 of the adhesive layer 12.

[0046] In other embodiments, the frame portion 111 of the shielding layer 11 includes a forward shielding section and an inner shielding section, the forward shielding section is disposed directly above the support member 13, the inner shielding section extends inwardly from the forward shielding section, and the reinforcing portion 112 extends inwardly from a corner of the inner shielding section of the frame portion 111. In this embodiment, the forward shielding section is attached directly above the support member 13, while the inner shielding section and the reinforcing portion 112 protrude inwardly. For example, please refer to Figure 2B The frame-shaped portion 111 of the shielding layer 11 of the image sensor module 1b of the first embodiment includes a forward shielding section 1111, an inner shielding section 1112, and an outer shielding section 1113. The inner shielding section 1112 extends inward from the forward shielding section 1111, while the outer shielding section 1113 extends outward from the forward shielding section 1111. The inner shielding section 1112 is useful for preventing obliquely incident light from irradiating the adhesive layer 12 or the support member 13, the reinforcement portion 112 prevents light from irradiating the glue-spinning portion 121 of the adhesive layer 12 in the forward or oblique direction, and the outer shielding section 1113 prevents light from irradiating the outer packaging layer 16.

[0047] In summary, the shielding layer 11 of the image sensing module includes a frame-shaped portion 111 and a plurality of reinforcement portions 112, and each reinforcement portion 112 is individually located at the corner of the frame-shaped portion 111. In this way, the reinforcement portion 112 is sufficient to shield the glue-spinning portion 121 formed by the glue dispensing equipment at the corner of the adhesive layer 12. By providing the reinforcement portion 112, a larger turning space is provided for the adhesive layer 12 at the corner without exceeding the shielding area of ​​the shielding layer 11. In addition, the reinforcement portion 112 allows the adhesive layer 12 to have a larger coating space at the corner, thereby improving the reliability of the structure. In some embodiments, the present disclosure allows the use of reinforcement portions 112 of different shapes when designing the shielding layer 11, so as to provide the shielding layer 11 with a shielding ability for the glue-spinning portion 121 of the adhesive layer 12 or to prevent the shielding layer 11 from covering the range of the image sensing area 141.

[0048] It should be understood that the terms "upper", "lower", "inner" and "outer" used in the contents recorded in this disclosure are only used to illustrate the technical contents of the embodiments of this disclosure or the relative relationship of the components, and are not used to limit the absolute positional relationship of the components in space when implementing this disclosure. Although this disclosure has been disclosed as above by the embodiments, the embodiments contained in the specification and drawings are not used to limit this disclosure. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of this disclosure. The scope of protection of this disclosure shall be determined by the scope of the attached patent application.

Claims

1. An image sensing module, characterized in that: Include: An image sensing chip including an image sensing area; A support member is disposed on the upper surface of the image sensing chip and surrounds the image sensing area; a light-transmitting layer disposed on the upper surface of the supporting member, the light-transmitting layer comprising an upper surface and a lower surface, the lower surface facing the image sensing chip and comprising a light-transmitting area and a shielding area surrounding the light-transmitting area, the light-transmitting area corresponding to the image sensing area, and the projection of the shielding area along the normal direction of the lower surface of the light-transmitting layer does not overlap with the image sensing area; as well as A shielding layer is formed in the shielding area of ​​the lower surface of the light-transmitting layer and is located between the light-transmitting layer and the supporting member. The shielding layer includes a frame-shaped portion and a plurality of reinforcing portions, and each of the reinforcing portions is individually located at a corner of the frame-shaped portion.

2. The image sensing module according to claim 1, wherein: The plurality of reinforcing parts extend inwardly from the corners of the frame-shaped part to form a triangle.

3. The image sensing module as claimed in claim 2, wherein: The triangle is an isosceles triangle.

4. The image sensing module as claimed in claim 1, wherein: The plurality of reinforcing parts extend inward from the corners of the frame-shaped part to form a fan shape.

5. The image sensing module as claimed in claim 1, wherein: The plurality of reinforcing parts extend inwardly from the corners of the frame-shaped part to form an umbrella shape.

6. The image sensing module as claimed in claim 1, wherein: The plurality of reinforcing parts extend inwardly from the corners of the frame-shaped part to form a rectangle.

7. The image sensing module as claimed in claim 1, wherein: The distance between the boundary of each reinforcement portion and the boundary of the image sensing area is smaller than the distance between the boundary of the frame portion and the boundary of the image sensing area.

8. The image sensing module as claimed in claim 1, wherein: The frame-shaped portion comprises a forward shielding section and an inner lateral shielding section. The forward shielding section is arranged directly above the support component, and the inner lateral shielding section extends inwardly from the forward shielding section.

9. The image sensing module as claimed in claim 1, wherein: The invention further comprises a packaging layer, which surrounds the light-transmitting layer, the supporting component and the side surface of the image sensing chip.

10. The image sensing module as claimed in claim 1, wherein: It further comprises an adhesive layer, which is bounded between the light-transmitting layer and the supporting member, and comprises a frame portion and a plurality of adhesive-spinning portions, and the projection of the shielding layer along the normal direction of the lower surface of the light-transmitting layer overlaps the frame portion and the plurality of adhesive-spinning portions.

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