A power module including semiconductor module components and alignment portions, and a method for forming the power module.

Abstract

A power module (100) is provided, comprising a semiconductor module component (10) and an alignment portion (20), wherein the alignment portion (20) is fixed to a lateral top surface (10T) of the semiconductor module component (10) and includes at least one recessed portion (20R). The semiconductor module component (10) includes at least one terminal (12, 13), which is vertically oriented at least in some places relative to the lateral top surface (10T) of the semiconductor module component (10) and is at least partially located within at least one recessed portion (20R) for alignment along the lateral direction. Along the vertical direction, at least one terminal (12, 13) protrudes beyond at least one recessed portion (20R). At least one recessed portion (20R) is located on the side surface (20S) of the alignment portion (20), wherein the at least one recessed portion (20R) is a vertical groove as an open recess on the side surface (20S) of the alignment portion (20), and wherein the groove is not a through hole completely surrounded in the lateral direction by the inner wall (20W) of the at least one recessed portion (20R). Furthermore, a method for forming a power module (100) including a semiconductor module component (10) is provided.

Description

Technical Field

[0001] This disclosure relates to a power module including semiconductor module components and alignment portions, and a method for forming such a power module. Background Technology

[0002] When power modules (e.g., power semiconductor modules) are implemented in various applications, the power modules should be mechanically and electrically connected to control electronics (e.g., gate drivers or other integrated circuits configured to control the power modules). The control electronics can be arranged on an assembly board, such as a control board that may be a printed circuit board. Such an assembly board can be arranged on top of the power modules. Electrical connections between one or more power semiconductor modules and the assembly board can be provided by terminals of one or more power modules, such as main terminals (e.g., in the form of power terminals) and / or auxiliary terminals in the form of control terminals.

[0003] Therefore, it is necessary to accurately position one or more power modules relative to the assembly board to facilitate the process of mechanically and electrically interconnecting the power modules to the assembly board. Furthermore, when terminals are inserted or pressed into contact holes in the assembly board, sufficient mechanical support for the terminals is desired so that they can be inserted into the contact holes safely and efficiently. Using integrated alignment features can help provide an efficient and simplified method for accurately positioning one or more power modules relative to the assembly board, such as for accurately positioning the terminals of one or more power modules (e.g., in the form of main terminals and / or auxiliary terminals) relative to the contact holes in the assembly board.

[0004] Document US2021 / 358869 A1 describes a semiconductor device including a semiconductor module, a printed circuit board (PCB), and a positioning member. The semiconductor module includes a housing for receiving components, wherein the housing has a front surface on which electrode terminals, control terminals (external terminals), and reference pins are formed. The PCB includes terminal holes and is electrically connected to control terminals passing through and attached to these terminal holes. Each of the four reference pins of the semiconductor module passes through a corresponding corner of the PCB. Furthermore, positioning elements of the positioning member pass through the PCB. The positioning member is positioned between the semiconductor module and the PCB. The positioning member has a front surface on which positioning elements are formed. The control terminals and reference pins of the semiconductor module pass through the positioning member. Summary of the Invention

[0005] The embodiments disclosed herein, such as those claimed in the independent claims, address, in whole or in part, the above-mentioned disadvantages in the art. Other embodiments of the power modules and methods for forming power modules with integrated alignment, as well as methods for interconnecting one or more power modules to an assembly board (e.g., a control board), are the subject of the other claims.

[0006] According to one embodiment of a power module, a semiconductor module component and an alignment portion are included. The alignment portion is fixed to the top surface of the semiconductor module component. The alignment portion includes at least one recessed portion. The semiconductor module component includes at least one terminal. The terminal is oriented perpendicular to the top surface of the semiconductor module component at least in some locations. For alignment purposes in the lateral direction, the terminal is at least partially located within the at least one recessed portion. In the vertical direction, the at least one terminal protrudes beyond the at least one recessed portion.

[0007] Since the alignment portion is fixed to the semiconductor module component, it is an integral part of the power module. If the power module is mechanically and electrically connected to the assembly board, the alignment portion is located, for example, between the semiconductor module component and the assembly board. Using the alignment portion, the lateral position of the terminals can be accurately adjusted to, for example, the lateral position of the contact holes on the assembly board. Furthermore, the alignment portion provides mechanical support for the terminals, allowing them to be safely and easily inserted or pressed into the contact holes on the assembly board. In this respect, proper alignment of one or more terminals (e.g., pin terminals) of the power module with one or more contact holes on the assembly board (e.g., a control board) can be guaranteed. Therefore, it is avoided that some terminals may be bent or misaligned and thus unable to be fitted into the contact holes on the assembly board.

[0008] In this document and hereinafter, for clarity and simplicity, features of the power module and method are sometimes described in conjunction with only one recessed portion and / or only one terminal. However, it should be understood that these features may also be applied separately to multiple recessed portions and / or multiple terminals. Different recessed portions may be formed identically or differently. Terminals may be formed identically or differently. The power module may include more than one module component, such as more than one semiconductor module component. Alignment portions may be arranged on a single module component or on several module components. For example, alignment portions may be arranged on several module components that are laterally arranged relative to each other to form, for example, a six-pack module, wherein the module components (e.g., three module components) are arranged in a row on a cooler.

[0009] Therefore, it is possible that the alignment portion includes multiple recessed portions, including at least one of the recessed portions mentioned above. The recessed portions may be spaced apart from each other along a lateral direction, such as a horizontal direction. The semiconductor module component may include multiple terminals, including at least one terminal mentioned above. The terminals may be spaced apart from each other along a lateral direction, such as a horizontal direction.

[0010] The vertical direction should be understood as the direction perpendicular to the top surface of the semiconductor module component. The lateral direction should be understood as the direction parallel to the top surface of the semiconductor module component. The vertical and lateral directions are orthogonal to each other. The top surface of the semiconductor module component is a lateral surface, which can be defined by two vectors, for example, pointing in the horizontal and vertical directions. The horizontal direction can be the lateral direction along which the recessed portion of the alignment part is spaced apart from each other by the terminals of the semiconductor module component or power module. The vertical direction can be another lateral direction along which the terminals protrude from the side surface of the semiconductor module component. The recess can extend along the vertical direction.

[0011] Along a transverse direction perpendicular to the horizontal direction, i.e., along the longitudinal direction, at least one or more terminals may be positioned at a lateral location on the side surface of the semiconductor module component. The terminals may also extend vertically from the body of the module component. For alignment purposes along the transverse direction and for mechanical support purposes along the vertical direction, each of the multiple terminals may be at least partially located within one of the recessed portions.

[0012] According to another embodiment of the power module, at least one or more recessed portions are located on the side surface of the alignment portion. In a plan view of the top surface of the semiconductor module component, the at least one recessed portion and the at least one terminal may be located outside the top surface of the semiconductor module component, for example, outside the periphery of the top surface of the semiconductor module component.

[0013] At least one recessed portion is formed as a groove extending vertically through the alignment portion. The groove is, for example, an opening on the side surface of the alignment portion. The groove may extend partially or completely through the alignment portion vertically. However, the groove is not a through-hole completely surrounded by the inner wall of the recessed portion in the transverse direction. The groove is an open recess on the side surface of the alignment portion. The groove may have a retaining structure or a supporting structure for supporting the terminal in the vertical direction and providing alignment of the terminal. The supporting structure is not, for example, on the entire bottom of the groove. The supporting structure may have the form of a step, but is not limited thereto. Moreover, the bottom portion of the terminal may have a tension structure. After the terminal is aligned, the retaining structure or supporting structure is located, for example, below the terminal if it is on the bottom surface. If the retaining structure or supporting structure has the form of a step on the side wall of the groove, a transverse tension structure (e.g., a crossbar of the terminal) is arranged on the surface of the step.

[0014] According to another embodiment of the power module, at least one recessed portion includes a retaining structure configured to mechanically support at least one terminal when pressed or inserted in a vertical, forward direction (e.g., towards the direction pointed to by the terminal tip). Thus, the retaining structure can provide vertical alignment of at least one terminal. For example, the entire terminal or at least a portion of the terminal is held or carried by the retaining structure of the recessed portion. Alignment of at least one terminal is achieved in two ways: moving a module component with one or more terminals toward a fixed assembly plate, and moving the assembly plate toward a fixed module component with one or more terminals.

[0015] According to another embodiment of the power module, the retaining structure is provided by a stepped structure on the inner wall of at least one recessed portion. At least one terminal may include a laterally extending structure, for example, in the form of a single-sided bar or a crossbar, wherein the laterally extending structure is arranged on the stepped surface of the stepped structure. Additionally or alternatively, the retaining structure may also be provided by a bottom region of at least one recessed portion. The lower portion of at least one terminal may be arranged on the bottom region of at least one recessed portion. For insertion of at least one terminal, the retaining structure or the lower bottom region does not extend across the entire cross-section of the recessed portion. The lower portion of at least one terminal may be, for example, a horizontal portion, which may have an extension to contact the retaining structure or the lower bottom region of the recessed portion.

[0016] According to another embodiment of the power module, the alignment portion is electrically insulating. For example, the alignment portion is made of an electrically insulating material. The alignment portion may include a body made of an electrically insulating material.

[0017] According to another embodiment of the power module, the power module includes a shielding layer configured to protect semiconductor module components from electromagnetic interference and / or protect the assembly board from electromagnetic interference with the power module (e.g., in high-voltage applications). The shielding layer may be embedded within an alignment portion. The shielding layer may be a layer made of conductive material. However, since the shielding layer is not configured to assign any polarity to the power module, the alignment portion remains electrically insulated even though the shielding layer is embedded within it. For example, when the shielding layer is embedded within the alignment portion, the shielding layer does not have any portion accessible from the outside. In other words, the shielding layer is completely embedded within the alignment portion. The shielding layer may also be disposed on the top or bottom surface of the alignment portion. However, in a top view, it is conceivable that the shielding layer does not completely cover the top and / or bottom surfaces of the alignment portion. Generally, the shielding layer should not contact any electrical parts other than ground contacts.

[0018] According to another embodiment of the power module, for example after an alignment process, the alignment portion is mechanically connected to the semiconductor module component via a bonding layer. The bonding layer may be an adhesive layer, bonding layer, etc. Alternatively or additionally, the alignment portion may be mechanically connected to the semiconductor module component via a snap-fit ​​connection or a clamping connection. Furthermore, additionally or as another alternative, the alignment portion may be mechanically connected to the semiconductor module component via a pin hole connection or via one or more screws.

[0019] According to another embodiment of the power module, at least one terminal is a pin terminal or a press-fit terminal. A press-fit terminal can be inserted into or pressed into a contact hole in the assembly board and mechanically secured to the contact hole without the use of additional connecting devices.

[0020] According to another embodiment of the power module, the alignment portion includes a plurality of recessed portions, each including at least one recessed portion. The semiconductor module component may include a plurality of terminals, each including at least one terminal. The terminals may be main terminals and / or auxiliary terminals. For alignment purposes in the lateral direction and for mechanical support purposes in the vertical direction, each of the plurality of terminals may be at least partially located within one of the plurality of recessed portions. The plurality of terminals may belong to a single module component or several module components. Therefore, each module component may be fixed to only one alignment portion, or several module components may be fixed to a common alignment portion.

[0021] According to an embodiment of a method for securing an alignment portion (e.g., an electrically insulating alignment portion) including at least one recessed portion to a semiconductor module component including at least one terminal, the method includes the steps of: positioning the alignment portion in an inclined orientation relative to the top surface of the semiconductor module component to insert at least one terminal into at least one recessed portion of the alignment portion, the at least one terminal being oriented perpendicular to the top surface of the semiconductor module component at least in some places, wherein the recessed portion is located at an edge region of the alignment portion.

[0022] The method further includes the step of moving the alignment portion toward the top surface of the semiconductor module component such that the alignment portion achieves a horizontal orientation relative to the top surface of the semiconductor module component, wherein, along the vertical direction, at least one terminal protrudes beyond at least one recessed portion, and wherein the at least one recessed portion is configured to align at least one terminal in the lateral direction and to provide additional mechanical support for at least one terminal in the vertical direction. Therefore, alignment in the vertical direction can also be provided. Furthermore, the method includes securing the alignment portion to the semiconductor module component to form a power module including the alignment portion and the semiconductor module component.

[0023] To prevent misalignment or unwanted bending of one or more terminals, the alignment portion and / or module component may have additional alignment structures to support proper alignment between the module component and the alignment portion. The alignment portion can be aligned with the power module or one or more module components using pins and holes in the terminal or mold body, or vice versa. The alignment portion can also be aligned on one side of the mold body or elsewhere. Furthermore, to align the alignment portion with the power module or module component (e.g., between the alignment portion and the mold body of the module component), a bedstop structure or guide structure can be used in the alignment portion or module component. Additionally, a combination of alignment and securing methods using snap-fit ​​connections and / or screw connections is feasible. Regarding vertical alignment, it should be noted that if the terminal is low and positioned vertically, vertical alignment is possible. If the terminal is too high, the alignment tool will still act as a support, pressing the assembly plate against one or more terminals.

[0024] According to another embodiment of the method, in order to electrically connect a power module to an assembly board, the method includes the steps of: positioning the power module and the assembly board vertically with one above the other, wherein the assembly board has at least one contact hole for receiving at least one terminal of a semiconductor module component. Furthermore, at least one terminal is inserted into the at least one contact hole, wherein at least one recessed portion of the alignment portion includes a retaining structure that carries and mechanically supports the at least one terminal when it is pressed into the at least one contact hole. Here, the alignment of the at least one terminal can be achieved in two ways: by moving a module component with one or more terminals toward the fixed assembly board, and by moving the assembly board toward the fixed module component with one or more terminals.

[0025] Therefore, an arrangement is provided that includes a power module and an assembly board according to any example or embodiment described herein, wherein the power module and the assembly board are arranged vertically such that one is above the other. The assembly board has at least one or more contact holes into which at least one terminal of a plurality of terminals of a semiconductor module component is inserted.

[0026] This disclosure includes several aspects based on embodiments and examples of power modules comprising at least one semiconductor module component and an alignment portion, and methods for forming such power modules. Each feature described with respect to one of these aspects is also disclosed herein with respect to another aspect, even if the corresponding feature is not explicitly mentioned in the context of a particular aspect. For example, the methods described in this disclosure are directed to methods for forming the power modules described herein. Therefore, the described features and advantages associated with the methods can be used in power modules, and vice versa. Attached Figure Description

[0027] The accompanying drawings are included to provide further understanding. In the drawings, elements with the same structure and / or function may be given the same reference numerals. It will be understood that the examples shown in the drawings are illustrative and not necessarily drawn to scale.

[0028] Figure 1A A general concept of a power module according to an embodiment of the present invention is schematically shown in a cross-sectional view.

[0029] Figure 1B The terminal within the recess of the alignment portion according to an embodiment of the present invention is shown in the top view.

[0030] Figure 2A and Figure 2B A power module according to another embodiment of the present invention is shown.

[0031] Figure 3 An example of a semiconductor module component of a power module according to the present invention is shown.

[0032] Figure 4A and Figure 4B An example of a terminal located in a recessed portion of the alignment portion is shown when the terminal is inserted into a contact hole of an assembly plate according to the present invention.

[0033] Figure 4C and Figure 4D Some exemplary layouts of the recessed portion of the alignment portion according to the present invention are shown.

[0034] Figure 5 and Figure 6 Some examples of power modules interconnected to an assembly board according to the present invention are shown.

[0035] Figure 7A , Figure 7B , Figure 7C , Figure 7D , Figure 8A , Figure 8B and Figure 8C Some method steps according to the present invention for fixing an alignment portion to the top surface of a semiconductor module component are shown. Detailed Implementation

[0036] Figure 1 shows a cross-sectional view of a power module 100 according to one embodiment. The power module 100 includes at least one module component 10, such as a semiconductor module component 10. The module component 10 may be or includes, but is not limited to, electronic chips, semiconductor chips, sensors (e.g., for measuring temperature or motion), switching devices (e.g., IGBTs), power MOSFETs made of silicon, silicon carbide, gallium nitride, or other semiconductor materials, diodes, discrete devices (e.g., resistors), capacitors, inductors, or transistors.

[0037] The power module 100 also includes an alignment portion 20. The alignment portion 20 is disposed on at least one semiconductor module component 10. For example, the alignment portion 20 is mechanically fixed to the top surface 10T of the module component 10. The mechanical fixing of the alignment portion 20 to the module component 10 can be achieved, for example, by gluing, screwing, riveting, or by a snap-fit ​​connection or clamping connection between the alignment portion 20 and the module component 10, but is not limited thereto.

[0038] The alignment portion 20 may be electrically insulating. For example, the alignment portion 20 may be formed of an electrically insulating material. The alignment portion 20 may be manufactured by a molding process, such as by plastic injection molding. The alignment portion 20 includes at least one recessed portion 20R. The recessed portion 20R is formed on the side surface 20S of the alignment portion 20. The recessed portion 20R is a vertical groove. The vertical groove is, for example, a notch on the side surface 20S of the alignment portion 20. For example, the recessed portion 20R is formed as a vertical groove extending through the alignment portion 20 in a vertical direction.

[0039] like Figure 1A As shown, the recessed portion 20R is formed at the end portion of the alignment portion 20. In the plan view of the top surface 10T of the module component 10, the recessed portion 20R may not overlap with the top surface 10T of the module component 10. Therefore, the alignment portion 20 is fixed to the module component 10 in such a way that, in the top view, the recessed portion 20R is located on the side of the top surface 10T of the module component 10. Except Figure 1A In addition, it is conceivable that the recessed portion 20R overlaps with the top surface 10T of the module component 10, such that in a top view, the recessed portion 20R is located on the top surface 10T of the module component 10.

[0040] Module component 10 includes at least one terminal 12 or multiple terminals 12. Terminal 12 may be an auxiliary terminal, such as a control terminal, and will be connected to a control board. Terminal 12 may also be a power terminal or a main terminal. Terminal 12 has a lateral portion and a vertical portion, wherein the lateral portion and the vertical portion can be provided by bending the terminal 12, that is, bending a portion of the lateral portion so that the bent portion of the lateral portion becomes a vertical portion.

[0041] The vertical portion may have a press-fit connector at its vertical end. For example... Figure 1A As shown, the lateral portion of terminal 12 is parallel to the top surface 10T of module component 10 and protrudes laterally beyond the side surface 10S of module component 10. Therefore, the lateral portion points vertically relative to the side surface 10S of module component 10. The vertical portion of terminal 12 is perpendicular to the top surface 10T of module component 10. Therefore, at least in some places, terminal 12 is oriented perpendicular to the top surface 10T of semiconductor module component 10.

[0042] For alignment purposes in the lateral direction, terminal 12, or the vertical portion of terminal 12, is at least partially located within at least one recessed portion 20R. The recessed portion 20R may have a side opening for receiving terminal 12. Once terminal 12 is located within the recessed portion 20R, any lateral displacement of terminal 12 is restricted, resulting in alignment of terminal 12. In the vertical direction, terminal 12 (e.g., the tip of the vertical portion of terminal 12) protrudes beyond the recessed portion 20R and is freely accessible. In a plan view of the top surface 10T of the semiconductor module component 10, the recessed portion 20R and terminal 12 are located outside the top surface 10T of the semiconductor module component 10.

[0043] Figure 2A The power module 100 shown is Figure 1A The power module 100 shown is basically the same, except that... Figure 2A A bonding layer 40 is shown disposed between the alignment portion 20 and the module component 10. The bonding layer 40 may be an adhesive layer or glue layer for mechanically connecting the alignment portion 20 to the module component 10. Alternatively, snap-fit ​​connections or screws may be used to mechanically connect the alignment portion 20 to the module component 10. This is illustrated, for example, in… Figure 5 and Figure 6 As shown in the image.

[0044] Another difference between Figure 1 and Figure 2 is that, according to Figure 2A The power module 100 includes a shielding layer 50 configured to protect module components 10 from electromagnetic interference or to protect the assembly board 30 from interference with the power module 100. The shielding layer 50 may be embedded within an alignment portion 20. The shielding layer 50 may be formed of a conductive material. For example, a sheet of metal or a partially conductive plastic material may be embedded within the alignment portion 20. Alternatively, the assembly board 30 may be mounted on top of the power module 100, for example on... Figure 5 and Figure 6 As shown in the diagram, assembly board 30 may be a printed circuit board that includes control electronics.

[0045] Figure 2BThe power module 100 shown is Figure 2A The power module 100 shown is essentially the same, except that the shielding layer 50 is arranged on the top surface of the alignment portion 20. Except Figure 2B Alternatively, the shielding layer 50 can be disposed on the bottom surface of the alignment portion 20. In the latter case, the shielding layer 50 is disposed between the alignment portion 20 and the module component 10.

[0046] Figure 3 An example of module component 10 of power module 100 is shown, which power module will be interconnected to, for example, in Figure 4A and Figure 4B The assembly plate 30 is shown in the figure. For simplicity, the alignment portion 20 on the top surface 10T of the module component 10 is not shown here.

[0047] The module component 10 has a plurality of terminals 12, such as auxiliary terminals 12, on its side surface 10S. For example, the terminals 12 are pin-shaped terminals. The terminals 12 have a vertical portion pointing in the vertical Z direction. The module component 10 further includes additional terminals 13, such as main terminals 13, extending in the lateral direction, which are configured, for example, for electrically connecting the module component 10. Except as shown in the figures of this disclosure, similar to the terminals 12, the main terminals 13 may have lateral and vertical portions. Therefore, the main terminals 13 can be bent. Alignment portions 20 can also be used to align the main terminals 13.

[0048] At least one main terminal 13 may have an opening 13H. The opening 13H may be configured to receive a snap-fit ​​portion 20H of the alignment portion 20 for forming a snap-fit ​​connection between the alignment portion 20 and the module component 10. This is, for example, in… Figure 5 and Figure 7A As shown in the image.

[0049] Once the alignment portion 20 is attached to the top surface 10T of the module component 10, each terminal 12 is located in a corresponding recess 20R of the alignment portion 20. Therefore, the terminals 12 can be positioned and aligned relative to the recess 20R of the alignment portion 20 in both the horizontal X direction and the vertical Y direction.

[0050] like Figure 4A and Figure 4B As shown, when the terminals 12 are inserted into the contact holes 30H of the assembly plate 30, the alignment portion 20 provides mechanical support for these terminals. Regarding... Figure 4A The auxiliary terminal 12 shown has a lateral extension structure 12B in the form of a crossbar 12B, or as shown in the figure. Figure 4BAs shown in the diagram, the horizontal portion of terminal 12 requires considerable mechanical force to insert into the press-fit terminal 12. The assembly board 30 can be, for example, a control board implemented as a printed circuit board.

[0051] like Figure 4A and Figure 4B As schematically shown, the assembly plate 30 can be arranged in a vertical position on top of the power module 100. With the alignment portion 20 present, the terminals 12 or the vertical portions of the terminals can be positioned and aligned relative to the contact holes 30H of the assembly plate 30 in the lateral X and Y directions. For electrical interconnection between the power module 100 and the assembly plate, the terminals 12 (e.g., as shown in the diagram) are... Figure 4A and Figure 4B The terminal 12 shown is formed as a press-fit terminal and is inserted or pressed into the contact hole 30H of the assembly plate 30.

[0052] Terminal 12 is formed of a conductive material or has an external metallization. For example... Figure 4A and Figure 4B As shown, the assembly plate 30 may be provided with a contact layer 30C for electrical contact with the terminal 12, both inside and partially outside the contact hole 30H. The contact layer 30C may be a metallized portion, for example, made of copper with an optional coating.

[0053] Terminal 12 or the vertical portion of terminal 12 includes an upper portion 12A and a lower portion 12L. Only the upper portion 12A protrudes beyond the recessed portion 20R of the alignment portion 23 and is inserted into the contact hole 30C. The lower portion 12L of terminal 12 is located inside the recessed portion 20R, for example, completely inside the recessed portion 20R.

[0054] like Figure 4A and Figure 4B As shown, terminal 12 includes a laterally extending structure 12B, for example, in the form of a crossbar 12B. The crossbar 12B may have a larger lateral cross-section or extension than the upper portion 12A and / or lower portion 12L of terminal 12. For example, the crossbar 12B has the largest lateral cross-section or extension of terminal 12 or the vertical portion of terminal 12. The crossbar 12B is configured to mechanically support and / or anchor terminal 12 to alignment portion 20. Here, alignment portion 20 has a corresponding support or retaining structure for receiving the crossbar 12B. Except... Figure 4A and Figure 4B In addition, the lateral extension structure 12B can also have another geometry, such as being formed as a single-sided rod.

[0055] The recessed portion 20R of the alignment portion 20 may include a retaining structure 20M configured to retain and mechanically support the terminal 12, for example, when the terminal 12 is pressed forward in a vertical direction (e.g., towards the assembly plate 30). Alternatively, the assembly plate 30 may be pressed against one or more terminals 12.

[0056] like Figure 4A As shown, the retaining structure 20M is provided by a stepped structure of the inner wall 20W of the recessed portion 20R. This stepped structure can form a receiving portion for receiving and retaining the terminal 12. In this case, the crossbar 12B of the terminal 12 is arranged on the stepped surface 20Z of the stepped structure or can be suspended on the stepped surface 20Z of the stepped structure. Therefore, the recessed portion 20R or the alignment portion 20 provides mechanical support for the terminal 12, for example, when the alignment portion 20 is pressed along the vertical Z direction, and for example, when the press-fit portion of the terminal is inserted into the contact hole 30H of the assembly plate 30, or vice versa, as in Figure 4A As shown on the right side. Therefore, the recessed portion 20R provides alignment of the terminal 12 along the Z direction.

[0057] like Figure 4B As shown, the retaining structure 20M can be provided by the bottom region 20B of the recessed portion 20R. In this case, the lower horizontal portion 12L of the terminal 12 can be arranged on the bottom region 20B of the recessed portion 20R and is therefore mechanically supported by the bottom region 20B.

[0058] Here, it should be noted that if terminal 12 is a flexible auxiliary terminal 12, it should be supported vertically on the transverse extension structure 12B, for example, on the crossbar 12B near the press-fit area, for example at the stepped surface 20Z of the inner wall 20W (e.g. Figure 4A (As shown in the diagram) to avoid the risk of deformation of the flexible auxiliary terminal 12 during insertion and / or pressing into the contact hole 30H. Figure 4B As shown, the support on the bottom region 20B can be used for standard pin terminals or mechanically stabilized terminals, such as for main terminal 13 or thicker terminals.

[0059] Figure 4C and Figure 4D Some exemplary layouts of the recessed portion 20R in the XY plane are shown. The recessed portion 20R can be formed as follows: Figure 4C The groove shown has a rectangular shape with straight walls, or is formed as follows: Figure 4D The groove shown has a trapezoidal shape. However, the layout of the cross-section of the recessed portion 20R is not limited to... Figure 4C and Figure 4D The layout is shown in the figure. For example, the recessed portion 20R can also be formed as having curved walls or a V-shaped groove.

[0060] Therefore, as Figures 4A to 4DAs shown, the recessed portion 20R, formed as a vertical groove, can be used to position and align the terminal 12 in the lateral X and Y directions, and to mechanically support and align the terminal 12 in the vertical Z direction. Positioning and alignment of the terminal 12 in the lateral X and Y directions can be provided by the sidewalls and endwalls of the recessed portion 20R. Mechanical support for the terminal 12 in the vertical Z direction can be provided by the bottom region 20B and / or a receiving portion (also referred to as a boss), which, for example, is formed as a stepped structure on the inner wall of the recessed portion 20R. Figure 4A As shown, the receiving portion is configured to receive the lateral extension structure 12B, for example, in the form of a crossbar 12B of a terminal 12.

[0061] Figure 5 A snap-fit ​​connection between module component 10 and alignment portion 20 is shown. The snap-fit ​​connection can be formed by a snap-fit ​​portion 20H of alignment portion 20 and a snap-fit ​​opening of main terminal 13. Snap-fit ​​portion 20H is, for example, a button-like protrusion of alignment portion 20. Snap-fit ​​portion 20H can be inserted into the snap-fit ​​opening 13H of main terminal 13. For example, snap-fit ​​portion 20H is made of an elastic material and has a larger cross-section in some places than the snap-fit ​​opening 13H of main terminal 13. Snap-fit ​​portion 20H can be temporarily deformed when inserted into the snap-fit ​​opening 13H of main terminal 13. In a plan view of the top surface 10T of module component 10, the snap-fit ​​connection is implemented outside the top surface 10T. This snap-fit ​​connection also provides proper alignment of alignment portion 20 with respect to module component 10.

[0062] The mechanical fastening of the power module 100 to the assembly plate 30 can also be achieved by screws, for example, by means of screws such as screws. Figure 5 The first screw 41 shown is implemented. The first screw 41 extends vertically through the assembly plate 30 and into the alignment portion 20. However, the first screw 41 does not extend through the alignment portion 20.

[0063] according to Figure 5 The module component 10 is arranged on the carrier 11. The carrier 11 may be a base plate, a cooler, or a radiator, but is not limited to these.

[0064] Figure 6Another configuration of a power module 100 connected to an assembly board 30 is shown, wherein the power module 100 includes at least one module component 10 and an alignment portion 20. The power module 100 further includes a printed circuit board 14 and a carrier 11, wherein the printed circuit board 14 is disposed between the carrier 11 and the module component 10. For additional securing, additional screws, such as a second screw 42, can be used, wherein the second screw 42 secures the assembly board 30 not only to the alignment portion 20 but also to the module component 10 and the printed circuit board 14. Thus, along the vertical direction, the shared second screw 42 extends through the assembly board 30, the alignment portion 20, and the module component 10 and into the printed circuit board 14.

[0065] The alignment portion 20 can also be secured to module component 10 using screws (screws to the module body or to the main terminals, similar to a snap-fit ​​connection). Similar to... Figure 6 The screws can extend to the carrier 11 below the power module 100, so that the entire setup is secured by screws. Other possible methods for securing and / or aligning the alignment portion 20 to the power module 100 or module component 10 include, for example, clamping connections, pin-hole connections, snap-fit ​​connections, the use of stop structures, and / or the use of guide structures (such as guide rails).

[0066] In addition, except for Figure 1 to Figure 6 In addition, the alignment portion 20 may include a plurality of recesses 20R for receiving a plurality of terminals 12. Each of the plurality of terminals 12 may be arranged within one of the recesses 20R for alignment purposes along the lateral X and Y directions and for mechanical support purposes along the vertical Z direction. An alignment portion 20 may be attached to more than one module component 10, for example, to three module components 10 (as arranged in a row) to form a so-called six-unit module, which may include three module components 10 mounted on a carrier 11 serving as a cooler. The alignment portion 20 is held on top of one or more module components 10 before and after the power module 100 is mounted to the assembly plate 30. For example, the alignment portion 20 may be located between the assembly plate 30 and one or more module components 10, or between the assembly plate 30 and the module housing of the power module 100 or the module housing of one or more module components 10.

[0067] Figure 7A , Figure 7B , Figure 7C and Figure 7D The diagram illustrates some method steps for securing the alignment portion 20 to the module component 10 using a snap-fit ​​connection. In addition to the snap-fit ​​connection, other screws may be used, such as... Figure 8C The third screw 43 shown or as Figure 2A or Figure 2BThe bonding layer 40 is shown. Screws can also be used between the alignment portion 20 and the terminals 12 / 13.

[0068] like Figure 7A and Figure 7B As shown, the alignment portion 20 is moved laterally in an oblique orientation toward the terminal 12 or toward a row of terminals 12, such that one or more terminals 12 (e.g., one or more press-fit terminals 12) can be inserted into the recessed portion 20R of the alignment portion 20. The recessed portion 20R provides alignment in a direction orthogonal to the orientation of the terminals 12. Subsequently, the alignment portion 20 is moved to a horizontal direction, as... Figure 7C and Figure 7D As shown in the diagram. Therefore, one or more possible lateral extension structures 12B of one or more terminals 12 can be inserted into one or more receiving portions of one or more recesses 20R, and the one or more possible lateral extension structures 12B of one or more terminals 12 are located on corresponding bosses or recesses of one or more receiving portions. First

[0069] Figure 7C The top view shows some different positions of the terminal 12 relative to the recess 20R of the alignment portion 20. Figure 7C The different positions of the terminal 12 shown relative to the recess 20R of the alignment portion 20 can correspond to Figure 7B The terminal 12 shown is positioned relative to the alignment portion 20 at different locations.

[0070] Terminal 12 has a lateral extension structure 12B in the form of a crossbar. Recess 20R has a stepped surface 20Z for receiving and supporting the lateral extension structure 12B. Once the lateral extension structure 12B is arranged on the stepped surface 20Z, alignment of terminal 12 is achieved not only in the lateral direction but also in the vertical direction.

[0071] according to Figure 7D When the alignment portion 20 reaches a horizontal orientation, the terminal 12 has correct alignment in a direction parallel to the orientation of the terminal 12 and in a vertical direction. Finally, the alignment portion 12 (which also forms a support portion for one or more terminals 12) is mechanically secured to one or more main terminals 13 (which may be formed as power terminals) by one or more snap-fit ​​engagements in one or more holes formed in one or more snap-fit ​​engagement openings 13H of one or more main terminals 13, or by one or more snap-fit ​​engagements on the sides of one or more main terminals 13. Afterwards, the assembly plate 30 can be mounted to the power module 100.

[0072] Figure 8A , Figure 8B and Figure 8CSome method steps for securing the alignment portion 20 to one or more module components 10 using screws 43 are shown. Figure 8A and Figure 8B The methods and steps described in the text are as follows: Figure 7A and Figure 7B The steps of the method shown are basically the same, except that the alignment portion 20 does not have one or more snap-fit ​​portions 20H.

[0073] according to Figure 8C The alignment plate 20 can be secured by screws to one or more module components 10, such as screws to one or more packages or to the main terminals 13 of one or more module components 10. The screws (here, the third screw 43) extend vertically through the alignment portion 20 and into one or more module components 10. Other or additional methods for securing the alignment portion 20 are also possible; for example, the alignment portion 20 can be glued to one or more module components 10 or clamped to one or more module components 10 in any manner. These securing methods are also applicable to other mountings of the alignment plate 20.

[0074] Figure Labels

[0075] 100 power module

[0076] 10 Semiconductor Module Components

[0077] Side surface of 10S semiconductor module component

[0078] Top surface of 10T semiconductor module component

[0079] 11 carriers

[0080] 12 Semiconductor module components terminals

[0081] Upper part of 12A terminal

[0082] Lateral extension structure or crossbar of 12B terminal

[0083] The lower part of the 12L terminal

[0084] 13. Main terminals of semiconductor module components

[0085] 13H Main Terminal / Semiconductor Module Component Snap-fit ​​Opening

[0086] 14 circuit boards

[0087] 20 Alignment Section

[0088] 20H Alignment Part Snap-fit ​​Part

[0089] The recessed part of the 20R alignment section

[0090] 20S Alignment Part Side Surface

[0091] The bottom area of ​​the recessed portion of 20B

[0092] 20M recessed / alignment retention structure

[0093] Inner wall of the 20W recessed portion

[0094] Stepped surface of the inner wall of 20Z

[0095] 30 assembly boards

[0096] 30C assembly board contact layer

[0097] Contact holes of 30H assembly board

[0098] 40 bonding layer

[0099] 41 First screw

[0100] 42 Second screw

[0101] 43 Third screw

[0102] 50 shielding layers

[0103] X (horizontal direction) / (horizontal direction)

[0104] Y (horizontal / vertical direction)

[0105] Z (vertical direction)

Claims

1. A power module (100) comprising a semiconductor module component (10) and an alignment portion (20), wherein, - The alignment portion (20) is fixed on the top surface (10T) of the semiconductor module component (10) and includes at least one recessed portion (20R). - The semiconductor module component (10) includes at least one terminal (12, 13) having a vertical portion perpendicular to the top surface (10T) of the semiconductor module component (10) and thus oriented vertically relative to the top surface (10T) of the semiconductor module component (10), wherein the at least one terminal is at least partially located within the at least one recessed portion (20R) for the purpose of alignment along a lateral direction parallel to the top surface (10T) of the semiconductor module component (10) and for providing additional mechanical support for the at least one terminal (12, 13) in the vertical direction. - The at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R) along the vertical direction perpendicular to the top surface (10T) of the semiconductor module component (10). - The at least one recessed portion (20R) is located on the side surface (20S) of the alignment portion (20), wherein, in a plan view of the top surface (10T) of the semiconductor module component (10), the at least one recessed portion (20R) and the at least one terminal (12, 13) are located outside the top surface (10T) of the semiconductor module component (10), wherein the at least one recessed portion (20R) is formed as a groove extending through the alignment portion (20) along the vertical direction, characterized in that the groove is an open recess on the side surface (20S) of the alignment portion (20), and wherein the groove is not a through hole completely surrounded by the inner wall (20W) of the at least one recessed portion (20R) in the lateral direction, and - wherein the at least one recessed portion (20R) includes a retaining structure (20M) configured to mechanically support the at least one terminal (12, 13) when pressed or inserted in the forward direction along the vertical direction.

2. The power module (100) according to claim 1. in, The alignment portion (20) is electrically insulated.

3. The power module (100) according to claim 1, wherein, - The terminal (12) also includes a transverse portion, and - The lateral portion is parallel to the top surface (10T) of the semiconductor module component (10) and protrudes laterally beyond the side surface (10S) of the semiconductor module component (10), and thus points vertically relative to the side surface (10S) of the semiconductor module component (10).

4. The power module (100) according to claim 1. in, - The retaining structure (20M) is provided by a stepped structure of the inner wall (20W) of the at least one recessed portion (20R), and - The at least one terminal (12, 13) includes a laterally extending structure (12B) disposed on the stepped surface (20Z) of the stepped structure.

5. The power module (100) according to claim 1. in, - The retaining structure (20M) is provided by the bottom region (20B) of the at least one recessed portion (20R), and - The lower portion (12L) of the at least one terminal (12, 13) is disposed on the bottom region (20B) of the at least one recessed portion (20R).

6. The power module (100) according to any one of claims 1 to 5, the power module comprising a shielding layer (50) configured to protect the semiconductor module components (10) from electromagnetic interference, wherein, The shielding layer (50) is embedded in the alignment portion (20) or disposed on the top or bottom surface of the alignment portion (20).

7. The power module (100) according to any one of claims 1 to 5. in, The alignment portion (20) is mechanically connected to the semiconductor module component (10) via a bonding layer (40).

8. The power module (100) according to any one of claims 1 to 5, wherein, The alignment portion (20) is mechanically connected to the semiconductor module component (10) by a snap-fit ​​connection, a clamping connection, a pin hole connection, or a screw (42, 43).

9. The power module (100) according to any one of claims 1 to 5, wherein, The at least one terminal (12, 13) is a pin terminal or a press-fit terminal.

10. The power module (100) according to any one of claims 1 to 5, wherein, - The alignment portion (20) includes a plurality of recessed portions (20R), the plurality of recessed portions including the at least one recessed portion (20R). - The semiconductor module component (10) includes a plurality of terminals (12, 13), the plurality of terminals including at least one of the terminals (12, 13). - For the purpose of alignment along the said lateral direction and for the purpose of mechanical support along the said vertical direction, each of the plurality of terminals (12, 13) is located at least partially within one of the recesses (20R).

11. An arrangement comprising an assembly plate (30) and a power module (100) according to any one of claims 1 to 10, wherein, - The power module (100) and the assembly plate (30) are arranged along the vertical direction with one above the other, and - The assembly board (30) has at least one contact hole (30H), and at least one terminal (12, 13) of the semiconductor module component (10) is inserted into the at least one contact hole.

12. A method for securing an alignment portion (20) including at least one recessed portion (20R) to a semiconductor module component (10) including at least one terminal (12, 13), the method comprising: - The alignment portion (20) is positioned in an inclined orientation relative to the top surface (10T) of the semiconductor module component (10) to at least partially insert the at least one terminal (12, 13) into the at least one recessed portion (20R) of the alignment portion (20), the at least one terminal having a vertical portion perpendicular to the top surface (10T) of the semiconductor module component (10) and thus oriented perpendicular to the top surface (10T) of the semiconductor module component (10), wherein the at least one recessed portion (20R) is located on the side surface (20S) of the alignment portion (20), wherein, in a plan view of the top surface (10T) of the semiconductor module component (10) The at least one recessed portion (20R) and the at least one terminal (12, 13) are located outside the top surface (10T) of the semiconductor module component (10), wherein the at least one recessed portion (20R) is formed as a groove extending through the alignment portion (20) in a vertical direction, the groove being an open recess on the side surface (20S) of the alignment portion (20), and wherein the groove is not a through hole completely surrounded by the inner wall (20W) of the at least one recessed portion (20R) in a lateral direction parallel to the top surface (10T) of the semiconductor module component (10), and wherein the vertical direction is perpendicular to the top surface (10T) of the semiconductor module component (10). - Move the alignment portion (20) toward the top surface (10T) of the semiconductor module component (10) such that the alignment portion (20) achieves a horizontal orientation relative to the top surface (10T) of the semiconductor module component (10), wherein, along the vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R), and wherein the at least one recessed portion (20R) is configured for aligning the at least one terminal (12, 13) along the lateral direction and for providing additional mechanical support for the at least one terminal (12, 13) along the vertical direction; and - The alignment portion (20) is fixed to the semiconductor module component (10) to form a power module (100) including the alignment portion (20) and the semiconductor module component (10), wherein the at least one recessed portion (20R) of the alignment portion (20) includes a retaining structure (20M) that carries and mechanically supports the at least one terminal (12) when the at least one terminal (12, 13) is inserted or pressed into the at least one contact hole (30H).

13. The method of claim 12, further comprising electrically connecting the power module (100) to the assembly board (30), the method comprising: - Position the power module (100) and the assembly board (30) along the vertical direction with one above the other, wherein the assembly board (30) has at least one contact hole (30H) for receiving at least one terminal (12, 13) of the semiconductor module component (10), and - Insert the at least one terminal (12, 13) into the at least one contact hole (30H).

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