Electronic device including antenna structure connected to housing

Abstract

According to one embodiment, an electronic device may include: a housing including a plurality of side surfaces, the plurality of side surfaces including a conductive portion for communicating with an external electronic device; a printed circuit board in the housing; and a flexible printed circuit board including a first region in contact with the printed circuit board, a second region disposed on the conductive portion, and a third region extending from the first region to the second region. The flexible printed circuit board may include: a first outer surface; a second outer surface opposite the first outer surface; a plurality of layers between the first outer surface and the second outer surface; and a second conductive via disposed in the second region. The second conductive via may include: a first portion in contact with the first outer surface; a second portion in contact with the conductive portion by protruding from the second outer surface; and a third portion extending from the first portion to the second portion.

Description

Technical Field

[0001] Embodiments to be described later relate to an electronic device including an antenna structure connected to a housing. Background Art

[0002] A portable electronic device such as a smartphone or a tablet personal computer (PC) can establish a communication channel with an external electronic device such as a base station of a mobile communication network or another portable electronic device. The magnitude of a signal transmission loss may vary depending on a component of the electronic device provided in a path through which a signal received from or transmitted to the external electronic device passes. Summary of the invention

[0003] An electronic device according to an embodiment may include a housing, the housing including a front surface, a rear surface opposite to the front surface, and a plurality of side surfaces between the front surface and the rear surface including a conductive portion for communicating with an external electronic device. The electronic device may include a printed circuit board in the housing. The electronic device may include a flexible printed circuit board, the flexible printed circuit board including a first area in contact with the printed circuit board, a second area disposed on the conductive portion, and a third area extending from the first area to the second area. The flexible printed circuit board may include a first outer surface, a second outer surface opposite to the first outer surface, and a plurality of layers between the first outer surface and the second outer surface. The flexible printed circuit board may include a plurality of conductive vias penetrating the plurality of layers, the plurality of conductive vias including a first conductive via disposed in the first area for electrical connection with the printed circuit board and a second conductive via disposed in the second area. The second conductive via may include a first portion in contact with the first outer surface, a second portion in contact with the conductive portion by protruding from the second outer surface for electrical connection with the conductive portion, and a third portion extending from the first portion to the second portion for electrical connection with at least a portion of the plurality of layers.

[0004] An electronic device according to an embodiment may include a housing, the housing including a front surface, a rear surface opposite to the front surface, and a plurality of side surfaces between the front surface and the rear surface including a conductive portion for communicating with an external electronic device. The electronic device may include a printed circuit board in the housing. The electronic device may include a flexible printed circuit board, the flexible printed circuit board including a first area in contact with the printed circuit board, a second area arranged on the conductive portion, and a third area extending from the first area to the second area. The flexible printed circuit board may include a plurality of layers, the plurality of layers including a first metal layer and a second metal layer. The flexible printed circuit board may include a first outer surface partially surrounding the first metal layer, a second outer surface partially surrounding the second metal layer and opposite to the first outer surface. The flexible printed circuit board may include a plurality of conductive vias penetrating the plurality of layers, the plurality of conductive vias including a first conductive via arranged in the first area for electrically connecting to the printed circuit board and a second conductive via arranged in the second area. The thickness of the second area may be less than the thickness of the first area. The second conductive via may include a first portion contacting the first outer surface, a second portion contacting the conductive portion by protruding from the second outer surface for electrical connection with the conductive portion, and a third portion extending from the first portion to the second portion for electrical connection with at least a portion of the multiple layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment.

[0006] Figure 2 is a block diagram of an electronic device for supporting traditional network communication and 5G network communication according to an embodiment.

[0007] Figure 3 is a diagram showing an electronic device according to an embodiment.

[0008] Figure 4 is an exploded perspective view of an electronic device according to an embodiment.

[0009] Figure 5 A portion of an exemplary electronic device is shown.

[0010] Figure 6a is a top plan view of a flexible printed circuit board of an exemplary electronic device.

[0011] Figure 6b is a partial cross-sectional view of an exemplary electronic device.

[0012] Figure 7a A portion of an exemplary electronic device is shown.

[0013] Figure 7b is a partial cross-sectional view of an exemplary electronic device.

[0014] Figure 8a An example electronic device is shown in an unfolded state.

[0015] Figure 8b A folded state of an exemplary electronic device is shown.

[0016] Figure 8c is an exploded view of an exemplary electronic device. DETAILED DESCRIPTION

[0017] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0018] refer to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101. In some embodiments, some components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) may be implemented as a single component (eg, display module 160 ).

[0019] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently of the main processor 121 or operable in cooperation with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as a part of the main processor 121.

[0020] The auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display module 160, sensor module 176, or communication module 190) among the components of the electronic device 101 instead of the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or control at least some of the functions or states related to at least one component (e.g., display module 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as a part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. Such learning may be performed, for example, by the electronic device 101 that performs artificial intelligence or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recursive deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. The artificial intelligence model may additionally or alternatively include a software structure in addition to a hardware structure.

[0021] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, input data or output data of software (e.g., the program 140) and commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0022] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0023] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0024] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a part of the speaker or as a part of the speaker.

[0025] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0026] The audio module 170 may convert sound into an electrical signal, and vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly coupled to the electronic device 101.

[0027] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0028] The interface 177 may support one or more dedicated protocols for the electronic device 101 to be directly (e.g., wired) or wirelessly coupled to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0029] The connection terminal 178 may include a connector via which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

[0030] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or movement) or electric stimulation that can be recognized by the user via his tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric component, or an electric stimulator.

[0031] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0032] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0033] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently of the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in a communication network such as the first network 198 or the second network 199.

[0035] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or higher), a loss coverage for implementing mMTC (e.g., 164 dB or lower), or a U-plane latency for implementing URLLC (e.g., 0.5 ms or lower, or 1 ms or lower round trip for both downlink (DL) and uplink (UL).

[0036] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation component composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. Then, a signal or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation component may be additionally formed as a part of the antenna module 197.

[0037] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., millimeter wave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0038] At least some of the above components may be coupled to each other and transmit signals (eg, commands or data) therebetween via an inter-peripheral communication scheme (eg, a bus, general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0039] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via a server 108 coupled to the second network 199. Each of the electronic devices 102 or 104 may be a device of the same type or a different type as the electronic device 101. According to an embodiment, all or some operations to be run at the electronic device 101 may be run at one or more of the external electronic devices 102, 104 or 108. For example, if the electronic device 101 should automatically or in response to a request from a user or another device to perform a function or service, the electronic device 101 may request one or more external electronic devices to perform at least a part of the function or service without running the function or service, or the electronic device 101 may request one or more external electronic devices to perform at least a part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform at least a part of the requested function or service or perform additional functions or additional services related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a part of the reply to the request with or without further processing of the result. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0040] Figure 2 A block diagram 200 of an electronic device 101 for supporting both traditional network communications and 5G network communications is shown according to various embodiments.

[0041] Reference Figure 2 , the electronic device 101 may include a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may also include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may also include Figure 1 At least one of the components shown in the figure, and the network 199 may further include at least one other network. According to an embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may constitute at least a part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as a part of the third RFIC 226.

[0042] The first communication processor 212 may support establishing a communication channel of a frequency band to be used for wireless communication with the first cellular network 292 and performing traditional network communication through the established communication channel. According to various embodiments, the first cellular network 292 may be a traditional network including a second generation (2G), a third generation (3G), a fourth generation (4G) and / or a long term evolution (LTE) network. The second communication processor 214 may support establishing a communication channel corresponding to a designated frequency band (e.g., about 6 GHz to about 60 GHz) to be used for wireless communication with the second cellular network 294 among a plurality of frequency bands, and performing 5G network communication through the established communication channel. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. In addition, according to an embodiment, the first communication processor 212 or the second communication processor 214 may support establishing a communication channel corresponding to another designated frequency band (e.g., about 6 GHz or lower) to be used for wireless communication with the second cellular network 294 among a plurality of frequency bands, and performing 5G network communication through the established communication channel. According to an embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be implemented in a single chip or a single package. Figure 1The processor 120, the coprocessor 123, or the communication module 190 are formed together in a single chip or a single package.

[0043] When transmitting, the first RFIC 222 may convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz for the first cellular network 292 (e.g., a legacy network). When receiving, the RF signal may be obtained from the first cellular network 292 (e.g., a legacy network) through an antenna (e.g., the first antenna module 242) and may be pre-processed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 may convert the pre-processed RF signal into a baseband signal for processing by the first communication processor 212.

[0044] When transmitting, the second RFIC 224 may convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter, referred to as a 5G Sub6 RF signal) of a Sub6 frequency band (e.g., about 6 GHz or less) used in the second cellular network 294 (e.g., a 5G network). When receiving, the 5G Sub6 RF signal may be obtained from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., the second antenna module 244) and may be pre-processed by an RFFE (e.g., the second RFFE 234). The second RFIC 224 may convert the pre-processed 5G Sub6 RF signal into a baseband signal so as to be processed by a corresponding processor in the first communication processor 212 or the second communication processor 214.

[0045] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal in a 5G Above6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., 5G network) (hereinafter, referred to as a "5G Above6 RF signal"). Upon reception, the 5G Above6 RF signal may be obtained from the second cellular network 294 (e.g., 5G network) through an antenna (e.g., antenna 248) and may be pre-processed by the third RFFE 236. For example, the third RFFE 236 may perform pre-processing of the signal by using a phase shifter 238. The third RFIC 226 may convert the pre-processed 5G Above6 RF signal into a baseband signal so as to be processed by the second communication processor 214. According to an embodiment, the third RFFE 236 may be formed as a part of the third RFIC 226.

[0046] According to an embodiment, the electronic device 101 may include a fourth RFIC 228 that is separate from the third RFIC 226 or as at least a part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, referred to as an intermediate frequency (IF) signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz), and then send the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above 6 RF signal. Upon reception, a 5G Above 6 RF signal may be received from a second cellular network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248), and the 5G Above 6 RF signal may be converted into an IF signal through the third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal so as to be processed by the second communication processor 214.

[0047] According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of multiple corresponding frequency bands.

[0048] According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (e.g., a main PCB). In this case, the third RFIC 226 may be disposed in a partial area (e.g., a lower surface) of a second substrate (e.g., a sub-PCB) separated from the first substrate, and the antenna 248 may be disposed in another partial area (e.g., an upper surface) to form the third antenna module 246. According to an embodiment, the antenna 248 may include, for example, an antenna array that can be used for beamforming. By disposing the third RFIC 226 and the antenna 248 on the same substrate, the length of the transmission line between them can be reduced. This can, for example, reduce the loss (e.g., attenuation) of signals in a high frequency band (e.g., about 6 GHz to about 60 GHz) for 5G network communication due to the transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (e.g., a 5G network).

[0049] The second cellular network 294 (e.g., a 5G network) may operate independently of the first cellular network 292 (e.g., a traditional network) (e.g., standalone (SA)), or connected to the first cellular network 292 (e.g., a traditional network) and operate (e.g., non-standalone (NSA)). For example, in a 5G network, there may be only an access network (e.g., a 5G radio access network (RAN) or a next generation RAN (NG RAN)) without a core network (e.g., a next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (e.g., the Internet) under the control of the core network (e.g., an evolved encapsulated core (EPC)) of the traditional network. Protocol information for communicating with a traditional network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio (NR) protocol information) may be stored in the memory 230 and may be accessed by other components (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

[0050] Figure 3 is a diagram showing an electronic device according to an embodiment.

[0051] Reference Figure 3 According to the electronic device 300 of the embodiment (for example, Figure 1 The electronic device 101 may include a housing 310 forming the exterior of the electronic device 300. For example, the housing 310 may include a front surface 300A, a rear surface 300B, and a side surface 300C surrounding a space between the front surface 300A and the rear surface 300B. According to an embodiment, the housing 310 may refer to a structure (e.g., Figure 5 frame structure 340).

[0052] The electronic device 300 according to the embodiment may include a substantially transparent front plate 302. According to the embodiment, the front plate 302 may form at least a portion of the front surface 300A. According to the embodiment, the front plate 302 may include, for example, a glass plate or a polymer plate having various coatings, but is not limited thereto.

[0053] The electronic device 300 according to an embodiment may include a substantially opaque back plate 311. According to an embodiment, the back plate 311 may form at least a portion of the back surface 300B. According to an embodiment, the back plate 311 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials.

[0054] The electronic device 300 according to the embodiment may include a side frame structure (or side member) 318 (eg, Figure 5 According to an embodiment, the side frame structure 318 may be coupled to the front plate 302 and / or the rear plate 311 to form at least a portion of the side surface 300C of the electronic device 300. For example, the side frame structure 318 may form the entire side surface 300C of the electronic device 300, and for another example, the side frame structure 318 may form the side surface 300C of the electronic device 300 together with the front plate 302 and / or the rear plate 311.

[0055] Unlike the illustrated embodiment, when the side surface 300C of the electronic device 300 is partially formed by the front plate 302 and / or the rear plate 311, the front plate 302 and / or the rear plate 311 may include an area that is bent from its outer edge toward the rear plate 311 and / or the front plate 302 and extends seamlessly. The extension area of ​​the front plate 302 and / or the rear plate 311 may be located at both ends of, for example, a long side of the electronic device 300, but is not limited to the examples described above.

[0056] According to an embodiment, the side frame structure 318 may include metal and / or polymer. According to an embodiment, the rear plate 311 and the side frame structure 318 may be integrally formed and may include the same material (e.g., a metal material such as aluminum, etc.), but are not limited thereto. For example, the rear plate 311 and the side frame structure 318 may be formed in separate configurations and / or may include different materials.

[0057] According to an embodiment, the electronic device 300 may include at least one of a display 301, audio modules 303, 304, 307, a sensor module (not shown), camera modules 305, 312, 313, a key input device 317, a light emitting device (not shown), and / or a connector hole 308. In another embodiment, the electronic device 300 may omit at least one of these components (e.g., the key input device 317 or the light emitting device (not shown)), or may further include another component.

[0058] According to an embodiment, the display 301 (eg, Figure 1 The display module 160 of the front panel 302 may be visually exposed through a large portion of the front panel 302. For example, at least a portion of the display 301 may be visible through the front panel 302 forming the front surface 300A. According to an embodiment, the display 301 may be disposed on the rear surface of the front panel 302.

[0059] According to an embodiment, the appearance of the display 301 may be formed substantially the same as the appearance of the front plate 302 adjacent to the display 301. According to an embodiment, in order to expand the visually exposed area of ​​the display 301, the distance between the outside of the display 301 and the outside of the front plate 302 may be formed to be substantially the same.

[0060] According to an embodiment, the display 301 (or the front surface 300A of the electronic device 300) may include a screen display area 301A. According to an embodiment, the display 301 may provide visual information to the user through the screen display area 301A. In the illustrated embodiment, when the front surface 300A is observed from the front, the screen display area 301A is illustrated as being spaced apart from the outside of the front surface 300A and located inside the front surface 300A, but is not limited thereto. In another embodiment, when the front surface 300A is observed from the front, at least a portion of the outer edge of the screen display area 301A may substantially coincide with the outer edge of the front surface 300A (or the front plate 302).

[0061] According to an embodiment, the screen display area 301A may include a sensing area 301B configured to obtain biometric information of the user. Here, the meaning of "the screen display area 301A includes the sensing area 301B" may be understood to mean that at least a portion of the sensing area 301B may overlap on the screen display area 301A. For example, the sensing area 301B may refer to an area that can display visual information through the display 301 like other areas of the screen display area 301A and can additionally obtain biometric information (e.g., fingerprint) of the user. In another embodiment, the sensing area 301B may be formed in the key input device 317.

[0062] According to an embodiment, the display 301 may include a front camera 305 (eg, Figure 1 The area where the camera module 180 of the display 301 is located. According to an embodiment, an opening may be formed in this area of ​​the display 301, and the front camera 305 (e.g., a punch hole camera) may be at least partially disposed in the opening to face the front surface 300A. In this case, the screen display area 301A may surround at least a portion of the outer edge of the opening. In another embodiment, the front camera 305 (e.g., an under-screen camera (UDC)) may be disposed below the display 301 to overlap with this area of ​​the display 301. In this case, the display 301 may provide visual information to the user through this area, and in addition, the front camera 305 may obtain an image corresponding to a direction facing the front surface 300A through this area of ​​the display 301.

[0063] According to an embodiment, the display 301 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus.

[0064] According to an embodiment, the audio modules 303, 304, and 307 (eg, Figure 1 The audio module 170 ) may include microphone holes 303 and 304 and a speaker hole 307 .

[0065] According to an embodiment, the microphone holes 303 and 304 may include a first microphone hole 303 formed in a partial area of ​​the side surface 300C and a second microphone hole 304 formed in a partial area of ​​the rear surface 300B. A microphone (not shown) for obtaining external sound may be provided inside the microphone holes 303 and 304. The microphone may include a plurality of microphones to detect the direction of the sound.

[0066] According to an embodiment, the second microphone hole 304 formed in a partial area of ​​the rear surface 300B may be disposed adjacent to the camera modules 305, 312, and 313. For example, the second microphone hole 304 may obtain sound according to the operation of the camera modules 305, 312, and 313. However, it is not limited thereto.

[0067] According to an embodiment, the speaker hole 307 may include an external speaker hole 307 and a receiver hole for calls (not shown). The external speaker hole 307 may be formed on a portion of the side surface 300C of the electronic device 300. In another embodiment, the external speaker hole 307 may be implemented as one hole with the microphone hole 303. Although not shown, the receiver hole for calls (not shown) may be formed on another portion of the side surface 300C. For example, the receiver hole for calls may be formed on the opposite side of the external speaker hole 307 on the side surface 300C. For example, based on Figure 3 , the external speaker hole 307 may be formed on the side surface 300C corresponding to the lower end of the electronic device 300, and the receiver hole for calling may be formed on the side surface 300C corresponding to the upper end of the electronic device 300. However, the present invention is not limited thereto, and in another embodiment, the receiver hole for calling may be formed at a position other than the side surface 300C. For example, the receiver hole for calling may be formed by the space between the front plate 302 (or the display 301) and the side frame structure 318.

[0068] According to an embodiment, the electronic device 300 may include at least one speaker (not shown) configured to output sound to the outside of the housing 310 through the external speaker hole 307 and / or a receiver hole (not shown) for a call.

[0069] According to an embodiment, a sensor module (not shown) (eg, Figure 1The sensor module 176 of the electronic device 300 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 300. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illumination sensor.

[0070] According to an embodiment, the camera modules 305, 312, and 313 (e.g., Figure 1 The camera module 180 may include a front camera 305 disposed to face the front surface 300A of the electronic device 300 , a rear camera 312 disposed to face the rear surface 300B, and a flash 313 .

[0071] According to an embodiment, the rear camera 312 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the rear camera 312 is not necessarily limited to include a plurality of cameras and may include one camera.

[0072] Depending on the embodiment, the front camera 305 and the rear camera 312 may include one or more lenses, image sensors and / or image signal processors.

[0073] According to an embodiment, the flash 313 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 300 .

[0074] According to an embodiment, the key input device 317 (eg, Figure 1 The input module 150 of the electronic device 300 may be provided on the side surface 300C of the electronic device 300. In another embodiment, the electronic device 300 may not include some or all of the key input devices 317, and the key input devices 317 not included may be implemented on the display 301 in another form such as soft keys.

[0075] According to an embodiment, the connector hole 308 may be formed on the side surface 300C of the electronic device 300 to accommodate a connector of an external device. The connection terminal (eg, Figure 1 The connection terminal 178 of the embodiment may be provided in the connector hole 308. The electronic device 300 according to the embodiment may include an interface module (eg, Figure 1 The interface 177 is used to process the electrical signals sent and received through the connection terminals.

[0076] According to an embodiment, the electronic device 300 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the front surface 300A of the housing 310. The light emitting device (not shown) may provide status information of the electronic device 300 in the form of light. In another embodiment, when the front camera 305 is working, the light emitting device (not shown) may provide a light source. For example, the light emitting device (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0077] Figure 4 is an exploded perspective view of an electronic device according to an embodiment.

[0078] Hereinafter, repeated descriptions of components having the same reference numerals as those described above will be omitted.

[0079] Reference Figure 4 , the electronic device 300 according to the embodiment may include a frame structure 340, a first printed circuit board 350, a second printed circuit board 352, a cover plate 360 ​​and a battery 370 (eg, Figure 1 Battery 189).

[0080] According to an embodiment, the frame structure 340 may include: forming the exterior of the electronic device 300 (eg, Figure 3 The frame structure 340 may include a side wall 341 of the display 301 and a support portion 343 extending inwardly from the side wall 341. According to an embodiment, the frame structure 340 may be disposed between the display 301 and the rear plate 311. According to an embodiment, the side wall 341 of the frame structure 340 may surround a space between the rear plate 311 and the front plate 302 (and / or the display 301), and the support portion 343 of the frame structure 340 may extend from the side wall 341 within the space.

[0081] According to an embodiment, the frame structure 340 may support or accommodate other components included in the electronic device 300. For example, the display 301 may be provided on one surface of the frame structure 340 facing one direction (e.g., +z direction), and the display 301 may be supported by the support portion 343 of the frame structure 340. For another example, the first printed circuit board 350, the second printed circuit board 352, the battery 370, and the rear camera 312 may be provided on another surface of the frame structure 340 facing a direction opposite to the one direction (e.g., -z direction). The first printed circuit board 350, the second printed circuit board 352, the battery 370, and the rear camera 312 may be mounted on a recess defined by the sidewall 341 and / or the support portion 343 of the frame structure 340.

[0082] According to an embodiment, the first printed circuit board 350, the second printed circuit board 352, and the battery 370 may be respectively coupled to the frame structure 340. For example, the first printed circuit board 350 and the second printed circuit board 352 may be fixedly disposed in the frame structure 340 by a coupling member such as a screw. For example, the battery 370 may be fixedly disposed on the frame structure 340 by an adhesive member (e.g., a double-sided tape). However, it is not limited to the examples described above.

[0083] According to an embodiment, the cover plate 360 ​​may be disposed between the first printed circuit board 350 and the rear plate 311. According to an embodiment, the cover plate 360 ​​may be disposed on the first printed circuit board 350. For example, the cover plate 360 ​​may be disposed on a surface of the first printed circuit board 350 facing the -z direction.

[0084] According to an embodiment, the cover plate 360 ​​may at least partially overlap the first printed circuit board 350 with respect to the z-axis. According to an embodiment, the cover plate 360 ​​may cover at least a partial area of ​​the first printed circuit board 350. Thus, the cover plate 360 ​​may protect the first printed circuit board 350 from physical impact or prevent a connector coupled to the first printed circuit board 350 from being separated.

[0085] According to an embodiment, the cover plate 360 ​​may be fixedly disposed on the first printed circuit board 350 by a coupling member (eg, a screw), or may be coupled to the frame structure 340 together with the first printed circuit board 350 by a coupling member.

[0086] According to an embodiment, the display 301 may be disposed between the frame structure 340 and the front plate 302. For example, the front plate 302 may be disposed on one side (eg, +z direction) of the display 301, and the frame structure 340 may be disposed on the other side (eg, -z direction).

[0087] According to an embodiment, the front panel 302 may be coupled to the display 301. For example, the front panel 302 and the display 301 may be bonded to each other with an optical bonding member (eg, optically clear bonding (OCA) or optically clear resin (OCR)) interposed therebetween.

[0088] According to an embodiment, the front plate 302 may be coupled to the frame structure 340. For example, the front plate 302 may include an outer portion extending outside the display 301 when viewed along the z-axis direction, and may be bonded to the frame structure 340 by an adhesive member (e.g., double-sided tape) provided between the outer portion of the front plate 302 and the frame structure 340 (e.g., the side wall 341). However, it is not limited to the examples described above.

[0089] According to an embodiment, the first printed circuit board 350 and / or the second printed circuit board 352 may be equipped with a processor (eg, Figure 1 processor 120), memory (e.g., Figure 1 Memory 130), and / or interfaces (e.g., Figure 1 Interface 177). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an embodiment, the first printed circuit board 350 and the second printed circuit board 352 may be operably connected or electrically connected to each other by a connecting member (e.g., a flexible printed circuit board).

[0090] According to an embodiment, the battery 370 may supply power to at least one component of the electronic device 300. For example, the battery 370 may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery 370 may be disposed on substantially the same plane as the first printed circuit board 350 and / or the second printed circuit board 352.

[0091] The electronic device 300 according to the embodiment may include an antenna module (not shown) (eg, Figure 1 According to an embodiment, the antenna module may be provided between the rear plate 311 and the battery 370. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device, or wirelessly transmit and receive power to and from an external device.

[0092] According to an embodiment, the front camera 305 may be disposed in at least a portion of the frame structure 340 (eg, the support portion 343) so that the lens can be viewed through a portion of the front panel 302 (eg, Figure 3 The camera area 337) receives external light.

[0093] According to an embodiment, a rear camera 312 (e.g., a rear camera) may be disposed between the frame structure 340 and the rear plate 311. According to an embodiment, the rear camera 312 may be electrically connected to the first printed circuit board 350 through a connecting member (e.g., a connector). According to an embodiment, the rear camera 312 may be disposed so that a lens may receive external light through a camera region 384 of the rear plate 311 of the electronic device 300.

[0094] According to an embodiment, the camera area 384 may be formed on a surface of the rear plate 311 (eg, Figure 3 According to an embodiment, the camera area 384 may be formed to be at least partially transparent so that external light can be incident on the lens of the rear camera 312. According to an embodiment, at least a portion of the camera area 384 may protrude from the surface of the rear plate 311 to a predetermined height. However, not limited thereto, in another embodiment, the camera area 384 may form a substantially same plane as the surface of the rear plate 311.

[0095] According to an embodiment, the housing (eg, Figure 3 The housing 310 of the electronic device 300 may refer to the construction or structure of at least a portion of the exterior of the electronic device 300. In view of this, at least a portion of the front plate 302, the frame structure 340, and / or the rear plate 311 forming the exterior of the electronic device 300 may be referred to as the housing of the electronic device 300.

[0096] Figure 5 A portion of an exemplary electronic device is shown.

[0097] refer to Figure 5 , the electronic device 300 (for example, Figure 1 The electronic device 101 in the embodiment may include a housing 310 , a first printed circuit board 350 , and a flexible printed circuit board 520 .

[0098] According to an embodiment, the housing 310 may include a front surface (eg Figure 3 a front surface 300A), a rear surface opposite to the front surface 300A (eg Figure 3 The front surface 300A, the rear surface 300B, and the side surface 300C between the front surface 300A and the rear surface 300B may provide an internal space for components in the electronic device 300.

[0099] According to an embodiment, the housing 310 may include a plurality of side surfaces 300C-1 and 300C-2. The plurality of side surfaces 300C-1 and 300C-2 may include a plurality of side surfaces for connecting with an external electronic device (eg, Figure 1 The conductive portion 510 may be used to communicate with the electronic device 104 in the first side surface 300C-1. For example, the first side surface 300C-1 may include the conductive portion 510. The conductive portion 510 may be used as an antenna of the electronic device 300 (eg, Figure 2 The conductive portion 510 may be configured to allow the electronic device 300 to communicate with the external long-range wireless communication network (eg, Figure 1 The second network 199) is connected to an external electronic device (for example, Figure 1 electronic device 104) and / or a server (e.g., Figure 1 For example, the second communication processor (eg, the second communication processor 214) in the electronic device 300 may be configured to send the baseband signal generated by the second communication processor 214 to the third RFIC (eg, Figure 2 The third RFIC 226 in the first side surface 300C-1). The third RFIC 226 may be configured to convert the baseband signal transmitted from the second communication processor 214 into an RF signal in a millimeter wave frequency band (e.g., a 28 GHz to 39 GHz frequency band). The third RFIC 226 may transmit the converted RF signal to an external electronic device (e.g., Figure 1 The conductive portion 510 may be configured to receive an RF signal from an external electronic device and / or server 108. The conductive portion 510 may be configured to transmit the received RF signal to the third RFIC 226. The third RFIC 226 may be configured to convert the RF signal transmitted from the conductive portion 510 into a baseband signal and transmit the converted baseband signal to the second communication processor 214.

[0100] It has been described that the electronic device 300 is connected to an external electronic device (eg, Figure 1 The electronic device 300 may include a plurality of conductive portions included in each of a plurality of side surfaces (e.g., a first side surface 300C-1 and a second side surface 300C-2). Each of the plurality of conductive portions may be configured so that the electronic device 300 can communicate with an external electronic device and / or the server 108.

[0101] According to an embodiment, the first printed circuit board 350 may be disposed in the housing 310. The first printed circuit board 350 may include an antenna module (eg, Figure 1 The antenna module 197 in the first printed circuit board 350 includes a second communication processor 214 and a third RFIC 226. The first printed circuit board 350 may be configured to send a baseband signal generated by the second communication processor 214 to the third RFIC 226 through a communication circuit in the first printed circuit board 350. The first printed circuit board 350 may be configured to send a baseband signal converted by the third RFIC 226 to the second communication processor 214 through a communication circuit in the first printed circuit board 350.

[0102] According to an embodiment, the flexible printed circuit board 520 may include a first region 521, a second region 522, and a third region 523 extending from the first region 521 to the second region 522. The first region 521 may be in contact with the first printed circuit board 350. The second region 522 may be disposed on the conductive portion 510. In this specification, when an element is referred to as being "on" another element, it should be understood that it is directly on the other element mentioned above or there may be an intermediate element between the two. For example, in this specification, "B is disposed on A" may mean "B is disposed above A". For example, in this specification, "B is disposed on A" may mean "B is away from A". For example, "a second region disposed on the conductive portion" may refer to "a second region in contact with the inner surface of the conductive portion". For example, "a second region disposed on the conductive portion" may refer to "a second region away from the inner surface of the conductive portion". The first region 521 may be electrically connected to the first printed circuit board 350. The second region 522 may be electrically connected to the conductive portion 510. Regarding the first region 521 being electrically connected to the first printed circuit board 350, and the second region 522 being electrically connected to the conductive portion 510, it will be described later. Figure 6a and Figure 6b By connecting the conductive portion 510 and the first printed circuit board 350, the flexible printed circuit board 520 can configure a portion of a signal transmission line that is configured to be able to transmit signals between the electronic device 300 and an external electronic device (eg, Figure 1 The first region 521 of the flexible printed circuit board 520 may be electrically connected to the first printed circuit board 350 and may extend toward the first side surface 300C-1 of the housing 310. The third region 523 of the flexible printed circuit board 520 may electrically connect the first region 521 to the second region 522 by extending from the first region 521 of the flexible printed circuit board 520 to the second region 522 electrically connected to the conductive portion 510 of the first side surface 300C-1.

[0103] For example, the RF signal transmitted from the external electronic device and / or the server 108 to the conductive portion 510 may be transmitted to the second region 522 electrically connected to the conductive portion 510. The RF signal transmitted to the second region 522 may be transmitted to the first region 521 through the third region 523. The RF signal transmitted to the first region 521 may be transmitted to the first printed circuit board 350 electrically connected to the first region 521. The RF signal transmitted to the first printed circuit board 350 may be transmitted to the third RFIC 226 in the first printed circuit board 350 through the communication circuit in the first printed circuit board 350.

[0104] For example, the converted RF signal from the third RFIC 226 in the first printed circuit board 350 may be transmitted to the first region 521 electrically connected to the first printed circuit board 350 through the communication circuit in the first printed circuit board 350. The RF signal transmitted to the first region 521 may be transmitted to the second region 522 electrically connected to the conductive portion 510 through the third region 523. The RF signal transmitted to the second region 522 may be transmitted to the external electronic device and / or the server 108 through the conductive portion 510 electrically connected to the second region 522.

[0105] According to the above-described embodiment, by using a device that can be used as an antenna (for example, Figure 2 The electronic device 300 includes a conductive portion 510 of the antenna 248 in the electronic device 300 and a flexible printed circuit board 520 that connects the conductive portion 510 and the first printed circuit board 350. The electronic device 300 may provide a transmission line that connects the first printed circuit board 350 and the conductive portion 510 that are spaced apart from each other in the electronic device 300. The electronic device 300 may be configured to be able to communicate with an external electronic device (e.g., Figure 1 electronic devices in the device) and / or communicate with server 108.

[0106] Figure 6a is a top plan view of a flexible printed circuit board of an exemplary electronic device. Figure 6b is a partial cross-sectional view of an exemplary electronic device.

[0107] Reference Figure 6a and Figure 6b , the electronic device 300 (for example, Figure 1 The electronic device 101 in FIG. 1 may include a housing 310 having a first side surface 300C-1 and a flexible printed circuit board 520. The flexible printed circuit board 520 may include a first region 521, a second region 522, a third region 523, a first outer surface 520a, a second outer surface 520b opposite to the first outer surface 520a, a plurality of layers 630, and a plurality of conductive vias 600.

[0108] According to an embodiment, the width w2 of the second region 522 of the flexible printed circuit board 520 may be greater than the width w1 of the first region 521 of the flexible printed circuit board 520. For example, the second region 522 may be attached to the conductive portion 510 of the first side surface 300C-1. Since the width w2 of the second region 522 is greater than the width w1 of the first region 521, the flexible printed circuit board 520 may reduce the peeling of the second region 522 from the conductive portion 510. Since the width w2 of the second region 522 is greater than the width w1 of the first region 521, the flexible printed circuit board 520 may increase the area in which the second region 522 is attached to the conductive portion 510.

[0109] According to an embodiment, the direction along which the first region 521 of the flexible printed circuit board 520 extends may be perpendicular to the direction along which the second region 522 of the flexible printed circuit board 520 extends. The third region 523 extending from the first region 521 to the second region 522 may include at least one bending portion 523a for connecting the first region 521 and the second region 522. For example, the first region 521 may extend toward the first side surface 300C-1 along the -y direction. The second region 522 may extend on the conductive portion 510 along the +z direction perpendicular to the -y direction. The third region 523 may include at least one bending portion 523a bent in the third region 523 for connecting the first region 521 and the second region 522. However, the second region 522 is not limited to being perpendicular to the first region 521, and may be arranged at an angle less than or greater than 90 degrees relative to the first region 521. This arrangement of the flexible printed circuit board 520 can allow the second region 522 of the flexible printed circuit board 520 to come into contact / approach with the conductive portion 510 without directly increasing the thickness of the electronic device 300 by the second region 522. In addition, the arrangement can also allow the attachment / connection mechanism between the flexible printed circuit board 520 and the conductive portion 510 to be located in a direction different from the thickness of the electronic device 300, thereby reducing any increase in thickness caused by the attachment / connection of the flexible printed circuit board 520 to the conductive portion 510.

[0110] Although the third region 523 has been described as including at least one bent portion 523a, it is not limited thereto. The third region 523 may include a plurality of bent portions for connecting the first region 521 extending toward the first side surface 300C-1 and the second region 522 disposed on the conductive portion 510 of the first side surface 300C-1. The third region 523 may connect the first region 521 and the second region 522 by including a plurality of bent portions. For example, one or more bent portions in different directions may be included in the third region 523 between the first region 521 and the second region 522.

[0111] According to an embodiment, the plurality of layers 630 may be disposed between the first outer surface 520a and the second outer surface 520b. For example, the first outer surface 520a of the flexible printed circuit board 520 may be a surface of one layer among the plurality of layers 630. The second outer surface 520b opposite to the first outer surface 520a of the flexible printed circuit board 520 may be a surface of another layer different from the one layer among the plurality of layers 630. The second outer surface 520b opposite to the first outer surface 520a may be spaced apart from the conductive portion 510 of the first side surface 300C-1. The second outer surface 520b may face the conductive portion 510.

[0112] According to an embodiment, the plurality of conductive vias 600 may penetrate one or more layers 630 of the plurality of layers 630. The plurality of conductive vias 600 may include a first conductive via 610 and a second conductive via 620. The first conductive via 610 may be disposed in the first region 521 of the flexible printed circuit board 520 for connection with the first printed circuit board (e.g., Figure 4 The second conductive via 620 may be disposed in the second region 522 of the flexible printed circuit board 520 .

[0113] For example, the first conductive via 610 may electrically connect at least some of the plurality of layers 630 disposed in the first region 521 to each other by penetrating the plurality of layers 630 disposed in the first region 521. When viewed from above, the electronic device 300 may include a conductive member (e.g., solder) overlapping the first conductive via 610 and connected between the first region 521 and the first printed circuit board 350. The first printed circuit board 350 may be electrically connected to at least some of the plurality of layers through the conductive member and the first conductive via 610. For example, the first conductive via 610 may penetrate the plurality of layers 630 disposed in the first region 521 and contact the first printed circuit board 350. At least some of the plurality of layers 630 may be electrically connected to the first printed circuit board 350 through the first conductive via 610 contacting the first printed circuit board 350.

[0114] For example, the second conductive vias 620 may electrically connect at least some of the plurality of layers 630 disposed in the second region 522 to each other by penetrating the plurality of layers 630 disposed in the second region 522. The electronic device 300 may reduce damage to the plurality of conductive vias 600 due to bending of the third region 523 by not including the plurality of conductive vias 600 in the third region 523 extending from the first region 521 to the second region 522.

[0115] Although it has been described that the plurality of conductive vias 600 include the first conductive vias 610 and the second conductive vias 620, it is not limited thereto. The plurality of conductive vias 600 may include the plurality of first conductive vias disposed in the first region 521 of the flexible printed circuit board 520 and the plurality of second conductive vias disposed in the second region 522 of the flexible printed circuit board 520. By including the plurality of first conductive vias and the second conductive vias, the plurality of conductive vias 600 may reduce the number of electronic devices 300 and external electronic devices (e.g., Figure 1 electronic device 104) and / or a server (e.g. Figure 1 Signal loss in communication between the servers 108).

[0116] According to an embodiment, the second conductive via 620 may include a first portion 621, a second portion 622, and a third portion 623. The first portion 621 may be in contact with the first outer surface 520a of the flexible printed circuit board 520. The second portion 622 may be in contact with the conductive portion 510 of the first side surface 300C-1 by protruding from the second outer surface 520b opposite to the first outer surface 520a of the flexible printed circuit board 520. The third portion 623 may extend from the first portion 621 to the second portion 622 for electrical connection with at least some of the plurality of layers 630. The flexible printed circuit board 520 may be electrically connected to the conductive portion 510 through the portion 621, the portion 622, and the portion 623 of the second conductive via 620.

[0117] For example, when observing the first outer surface 520a of the flexible printed circuit board 520, the first portion 621 may be exposed through the first outer surface 520a. The second outer surface 520b opposite to the first outer surface 520a may be spaced apart from the conductive portion 510. The second outer surface 520b may face the conductive portion 510. The second portion 622 may protrude from the second outer surface 520b opposite to the first outer surface 520a of the flexible printed circuit board 520 and extend toward the conductive portion 510 to contact the conductive portion 510. The third portion 623 may penetrate the plurality of layers 630 included in the second region 522 by extending from the first portion 621 to the second portion 622. The first portion 621 and the third portion 623 may electrically connect at least some of the plurality of layers 630 to each other. The second portion 622 may electrically connect the conductive portion 510 to at least some of the plurality of layers 630 by extending from the third portion 623 to the conductive portion 510. The second conductive via 620 may electrically connect the flexible printed circuit board 520 including the second region 522 and the conductive portion 510 by electrically connecting at least some of the plurality of layers 630 and the conductive portion 510. The second conductive via 620 may also provide a mechanical connection between two or more of the second region 522, at least some of the plurality of layers 630, and the conductive portion 510. For example, the second conductive via 620 may be formed by welding, wherein the welding may be performed using a laser.

[0118] According to an embodiment, the thickness d2 of the second region 522 of the flexible printed circuit board 520 may be less than the thickness d1 of the first region 521 of the flexible printed circuit board 520. For example, the plurality of layers 630 disposed in the first region 521 may include at least one more layer than the plurality of layers 630 disposed in the second region 522. Since the thickness d2 of the second region 522 is less than the thickness d1 of the first region 521, the flexible printed circuit board 520 may be configured such that the conductive via 620 disposed in the second region 522 contacts the conductive portion 510. Since the thickness d1 of the first region 521 is greater than the thickness d2 of the second region 522, the flexible printed circuit board 520 may reduce signal loss of the first region 521 due to at least one electronic component of the electronic device 300 overlapping the first region 521 when the first region 521 is viewed from above.

[0119] According to an embodiment, the thickness d2 of the second region 522 of the flexible printed circuit board 520 may be greater than or equal to 90 um and less than or equal to 130 um. Since the thickness d2 of the second region 522 is within the range of greater than or equal to 90 um and less than or equal to 130 um, the flexible printed circuit board 520 may be configured so that the second conductive via 620 disposed in the second region 522 contacts the conductive portion 510.

[0120] According to an embodiment, the electronic device 300 may further include an adhesive layer 640 disposed between the second region 522 of the flexible printed circuit board 520 and the conductive portion 510 of the first side surface 300C-1. The adhesive layer 640 may be penetrated by the second conductive via 620 disposed in the second region 522. For example, the second outer surface 520b opposite to the first outer surface 520a of the flexible printed circuit board 520 may be separated from the conductive portion 510 in the second region 522. The second outer surface 520b may face the conductive portion 510. The adhesive layer 640 may be disposed between the second region 522 and the second outer surface 520b to attach the second region 522 to the conductive portion 510. For example, the adhesive layer 640 may include a first adhesive layer 641 and a second adhesive layer 642. The first adhesive layer 641 may contact the second conductive via 620. The first adhesive layer 641 may be penetrated by the second portion 622 of the second conductive via 620. According to an embodiment, the first adhesive layer 641 or the second adhesive layer 642 may be omitted. The electronic device 300 may reduce peeling of the second region 522 from the conductive portion 510 by including the adhesive layer 640. For example, the second adhesive layer 642 may be in the form of an adhesive tape.

[0121] According to an embodiment, the thickness of the adhesive layer 640 may be greater than or equal to 10 um and less than or equal to 20 um. The adhesive layer 640 may be configured to make the second conductive via 620 of the second region 522 contact the conductive portion 510 by having a thickness greater than or equal to 10 um and less than or equal to 20 um.

[0122] According to an embodiment, the plurality of layers 630 may include a first metal layer 631 and a second metal layer 632, but other metal layers may also be present, and the metal layers may be formed of any suitable metal, such as copper or nickel. The first metal layer 631 may be partially covered by the first outer surface 520a. The second metal layer 632 may be partially covered by the second outer surface 520b. The first portion 621 of the second conductive via 620 may be in contact with the first metal layer 631 for electrical connection with the first metal layer 631. The second portion 622 of the second conductive via 620 may be in contact with the second metal layer 632 for electrical connection between the second metal layer 632 and the conductive portion 510. For example, the first outer surface 520a of the flexible printed circuit board 520 may include one surface of the first metal layer 631 and at least a portion of the first portion 621. The second outer surface 520b opposite to the first outer surface 520a of the flexible printed circuit board 520 may include one surface of the second metal layer 632 and at least a portion of the second portion 622. The third portion 623 may penetrate the plurality of layers 630 including the first metal layer 631 and the second metal layer 632 to connect the first portion 621 and the second portion 622. The first metal layer 631 and the second metal layer 632 may be electrically connected to each other through the third portion 623, and the third portion 623 connects the first portion 621 in contact with the first metal layer 631 and the second portion 622 in contact with the second metal layer 632. At least a portion of the plurality of layers 630 including the first metal layer 631 and the second metal layer 632 may be electrically connected to each other through the portion 621, the portion 622, and the portion 623 of the second conductive via 620. At least a portion of the plurality of layers 630 including the first metal layer 631 and the second metal layer 632 may be electrically connected to the conductive portion 510 through the second portion 622.

[0123] According to an embodiment, the thickness of the first metal layer 631 and the thickness of the second metal layer 632 may be greater than or equal to 12 um and less than or equal to 18 um, respectively. Since the thickness of the first metal layer 631 and the thickness of the second metal layer 632 are greater than or equal to 12 um and less than or equal to 18 um, respectively, the third region 523 of the flexible printed circuit board 520 may be bent to include at least one bent portion 523a for connecting the first region 521 and the second region 522 of the flexible printed circuit board 520.

[0124] According to an embodiment, the plurality of layers 630 may further include a dielectric layer 633 disposed between the first metal layer 631 and the second metal layer 632. The dielectric layer 633 may be penetrated by the third portion 623 of the second conductive via 620. The plurality of layers 630 may increase the rigidity of the flexible printed circuit board 520 by further including the dielectric layer 633. The plurality of layers 630 may include a dielectric layer 633 for connecting the electronic device 300 and an external electronic device (e.g., Figure 1 electronic device 104) and / or a server (e.g. Figure 1 The circuits in multiple layers 630 for communication between servers 108).

[0125] According to an embodiment, the second region 522 of the flexible printed circuit board 520 may further include a through-hole 650 in which at least a portion of the second conductive via 620 is disposed. The through-hole 650 may penetrate the plurality of layers 630. The third portion 623 of the second conductive via 620 may cover the inner peripheral surface 650a of the through-hole 650. The second portion 622 of the second conductive via 620 may electrically connect at least some of the plurality of layers 630 (e.g., the first metal layer 631 and / or the second metal layer 632) and the conductive portion 510 through the first portion 621 and the third portion 623 of the second conductive via 620. For example, the first portion 621 of the second conductive via 620 may protrude from the through-hole 650 toward the first outer surface 520a and contact the first outer surface 520a. The second portion 622 of the second conductive via 620 may protrude from the through hole 650 toward the second outer surface 520b opposite to the first outer surface 520a, and contact the second outer surface 520b and the conductive portion 510. The third portion 623 of the second conductive via 620 extending from the first portion 621 to the second portion 622 may contact the inner circumferential surface 650a of the through hole 650 penetrating the plurality of layers 630. The third portion 623 may contact the plurality of layers 630 by contacting the inner circumferential surface 650a of the through hole 650. The third portion 623 may be electrically connected to at least a portion of the plurality of layers 630 by contacting the plurality of layers 630. The second portion 622 may be electrically connected to at least some of the plurality of layers 630 through the first portion 621 and the third portion 623. At least some of the plurality of layers 630 may be electrically connected to the conductive portion 510 through the third portion 623 and the second portion 622 contacting the conductive portion 510. However, any of the first, second, and third portions of the second conductive via 620, and the combination of connections between the surface, layer, FPCB, and conductive portion overlapping the second region 522 are not limited to those described above, but any appropriate combination of connections may be implemented according to the desired circuit layout. Similarly, the second conductive via 620 may completely or partially penetrate any combination of the surface, layer, adhesive layer, FPCB, and conductive portion overlapping the second region 522 according to the desired structure.

[0126] According to an embodiment, the second conductive via 620 may fill the space in the via hole 650. For example, the third portion 623 of the second conductive via 620 may fill the space in the via hole 650 surrounded by the inner peripheral surface 650a of the via hole 650. Since the second conductive via 620 fills the space in the via hole 650, in the case of connecting the electronic device 300 with an external electronic device (e.g., Figure 1 electronic device 104) and / or a server (e.g., Figure 1 When a signal (eg, a signal with a frequency band of 28 GHz or more and 39 GHz or less) communicated between the server 108 in the example embodiment passes through the second conductive via 620, the signal loss can be reduced. Therefore, the transmission efficiency and / or signal quality can be improved.

[0127] According to an embodiment, the second conductive via 620 and / or the through-hole 650 may be formed by a laser. For example, a laser may be used to form the through-hole 650 while also melting one or more metal layers of the second region 522 so that the metal flows into the through-hole 650 to form a connection through the flexible printed circuit board 520. The metal may coat the inner peripheral surface 650a of the through-hole 650 and / or may (partially or completely) fill the through-hole 650. The melting of the metal may also facilitate the formation of a weld between one or more of the plurality of layers 630 and the conductive portion 510.

[0128] According to the above-described embodiment, by including the second conductive via 620 that electrically connects the second region 522 of the flexible printed circuit board 520 and the conductive portion 510, the electronic device 300 can be included in the electronic device 300 and an external electronic device (eg, Figure 1 The second conductive via 620 can electrically connect at least a portion of the plurality of layers 630 to the conductive portion 510 by including the portion 621, the portion 622, and the portion 623. The second conductive via 620 can fix the second region 522 to the conductive portion 510 by including the second portion 622 protruding from the second outer surface 520b and contacting the conductive portion 510.

[0129] Figure 7a A portion of an exemplary electronic device is shown. Figure 7b is a partial cross-sectional view of an exemplary electronic device.

[0130] Reference Figure 7a , the electronic device 300 (for example, Figure 1The electronic device 101 may include a housing 310, a flexible printed circuit board 520, and a camera module 180, wherein the housing 310 includes a front surface 300A, a rear surface 300B, and a plurality of side surfaces 300C-1, 300C-2. The flexible printed circuit board 520 may include a first region 521, a second region 522, and a third region 523. The first side surface 300C-1 may include a conductive portion 510. The first side surface 300C-1 may include a conductive portion 510.

[0131] According to an embodiment, the camera module 180 may include a rear camera 312 disposed along a first side surface 300C-1 including a conductive portion 510. The rear camera 312 may include a first camera 312a and a second camera 312b. At least a portion of the first camera 312a and the second camera 312b may be exposed through the rear surface 300B of the housing 310. When the rear surface 300B is observed from above, at least a portion of the first area 521 of the flexible printed circuit board 520 may overlap with the second camera 312b. For example, the first camera 312a and the second camera 312b may be arranged in a direction parallel to a direction (e.g., a +x direction or a -x direction) along which the first side surface 300C-1 extends. The first area 521 of the flexible printed circuit board 520 may overlap with the first area 521 of the first printed circuit board (e.g., Figure 4 The portion of the flexible printed circuit board 520 that contacts the first printed circuit board 350 in the conductive portion 510 extends across the second camera 312b of the electronic device 300 in a direction (e.g., a -y direction) toward the first side surface 300C-1 including the conductive portion 510. The first region 521 may extend in a direction parallel to the second side surface 300C-2 that is perpendicular to the first side surface 300C-1. The second region 522 of the flexible printed circuit board 520 may be disposed on the conductive portion 510 through the first region 521 extending toward the conductive portion 510.

[0132] According to an embodiment, the conductive portion 510 of the first side surface 300C-1 may face the second camera 312b. For example, the conductive portion 510 may extend from a portion of the first side surface 300C-1 facing the second camera 312b. The conductive portion 510 may be disposed so that the flexible printed circuit board 520 spanning the space below the second camera 312b faces the conductive portion 510 by facing the second camera 312b.

[0133] Reference Figure 7b, the camera module 180 may further include a step 180a facing the front surface 300A between the first camera 312a and the second camera 312b. The first region 521 of the flexible printed circuit board 520 may span the space between the second camera 312b and the front surface 300A formed by the step 180a of the camera module 180 and face the first side surface 300C-1. For example, each of the first camera 312a and the second camera 312b may be arranged in the housing 310 so that the heights of the portions exposed through the rear surface 300B are the same as each other. The thickness d3 of the first camera 312a may be greater than the thickness d4 of the second camera 312b. Due to the difference between the thickness d3 and the thickness d4, the camera module (e.g., Figure 7a The camera module 180 in the embodiment of the present invention may include a step 180a between the first camera 312a and the second camera 312b. The first region 521 of the flexible printed circuit board 520 may extend in a direction parallel to the second side surface 300C-2 across a space between the second camera 312b and the front surface 300A formed by the step 180a of the camera module 180, and toward a first side surface (e.g., Figure 7a The first side surface 300C-1) extends.

[0134] According to the above-described embodiment, the flexible printed circuit board 520 may be configured such that the second region 522 of the flexible printed circuit board 520 is disposed on the conductive portion 510 by overlapping at least a portion of the second camera 312b facing the conductive portion 510 when the rear surface 300B is viewed from above and including the first region 521 extending toward the conductive portion 510. The camera module 180 may provide a space between the second camera 312b and the front surface 300A for the first region 521 to pass through by including a step 180a between the first camera 312a and the second camera 312b.

[0135] Figure 8a An example electronic device is shown in an unfolded state. Figure 8b A folded state of an exemplary electronic device is shown. Figure 8c is an exploded view of an exemplary electronic device.

[0136] Reference Figure 8a , Figure 8b and Figure 8c , the electronic device 300 (eg Figure 1 The electronic device 101 may include a housing 310 having a first housing 810 and a second housing 820, a flexible display 830 (eg Figure 1 The display module 160, Figure 3 display 301), at least one camera 840 (e.g. Figure 1camera module 180), a hinge structure 850 and / or at least one electronic component 860.

[0137] The first housing 810 and the second housing 820 may form at least a portion of the outer surface of the electronic device 300 that may be held by a user. When the electronic device 300 is used by the user, at least a portion of the outer surface of the electronic device 300 defined by the first housing 810 and the second housing 820 may contact a portion of the user's body. According to an embodiment, the first housing 810 may include a first surface 811, a second surface 812 facing the first surface 811 and spaced apart from the first surface 811, and a third side surface 813 covering at least a portion of the first surface 811 and the second surface 812. The third side surface 813 may connect the outer edge of the first surface 811 and the outer edge of the second surface 812. The first surface 811, the second surface 812, and the third side surface 813 may define the internal space of the first housing 810. According to an embodiment, the first housing 810 may provide a space formed by the first surface 811, the second surface 812, and the third side surface 813 as a space for arranging components of the electronic device 300.

[0138] According to an embodiment, the second housing 820 may include a third surface 821, a fourth surface 822 facing the third surface 821 and spaced apart from the third surface 821, and a fourth side surface 823 covering at least a portion of the third surface 821 and the fourth surface 822. The fourth side surface 823 may connect the outer edge of the third surface 821 and the outer edge of the fourth surface 822. The third surface 821, the fourth surface 822, and the fourth side surface 823 may define an internal space of the second housing 820. According to an embodiment, the second housing 820 may provide a space formed by the third surface 821, the fourth surface 822, and the fourth side surface 823 surrounding at least a portion of the third surface 821 and the fourth surface 822 as a space for installing components of the electronic device 300. According to an embodiment, the second housing 820 may be coupled to the first housing 810 so as to be rotatable relative to the first housing 810.

[0139] According to an embodiment, the first housing 810 and the second housing 820 may each include a first protective member 814 and a second protective member 824, respectively. The first protective member 814 and the second protective member 824 may be provided on the first surface 811 and the third surface 821 along the outer edge of the flexible display 830. According to an embodiment, the first protective member 814 and the second protective member 824 may prevent foreign matter (e.g., dust or moisture) from flowing in through the gaps between the flexible display 830, the first housing 810, and the second housing 820. For example, the first protective member 814 may surround the outer edge of the first display area 831 of the flexible display 830, and the second protective member 824 may surround the outer edge of the second display area 832 of the flexible display 830. The first protective member 814 may be formed by being attached to the third side surface 813 of the first housing 810, or may be formed integrally with the third side surface 813. The second protective member 824 may be formed by being attached to the fourth side surface 823 of the second housing 820, or may be formed integrally with the fourth side surface 823.

[0140] According to an embodiment, the third side surface 813 and the fourth side surface 823 may include a conductive material, a non-conductive material, or a combination thereof. For example, the fourth side surface 823 may include at least one conductive member 825 (eg, Figure 5 The at least one conductive member 825 may include a plurality of conductive members that are spaced apart from each other. The at least one non-conductive member 826 may be disposed between the plurality of conductive members. The plurality of conductive members may be disconnected from each other by at least one non-conductive member 826 disposed between the plurality of conductive members. According to an embodiment, the plurality of conductive members and the plurality of non-conductive members may together form an antenna radiator. The electronic device 300 may communicate with an external electronic device through an antenna radiator formed by the plurality of conductive members and the plurality of non-conductive members. The antenna radiator may also be formed by a single conductive member.

[0141] The flexible display 830 may be configured to display visual information. According to an embodiment, the flexible display 830 may be arranged on the first surface 811 of the first housing 810 and the third surface 821 of the second housing 820 across the hinge structure 850. For example, the flexible display 830 may include a first display area 831 arranged on the first surface 811 of the first housing, a second display area 832 arranged on the third surface 821 of the second housing, and a third display area 833 arranged between the first display area 831 and the second display area 832. The first display area 831, the second display area 832, and the third display area 833 may form the front surface of the flexible display 830. According to an embodiment, the flexible display 830 may also include a sub-display panel 835 arranged on the fourth surface 822 of the second housing 820. For example, the flexible display 830 may be referred to as a flexible display. According to an embodiment, the flexible display 830 may include a window exposed toward the outside of the electronic device 300. The window may transmit visual information provided by the flexible display 830 to the outside of the electronic device 300 by protecting the surface of the flexible display 830 and including a substantially transparent material. For example, the window may include glass (eg, ultra-thin glass (UTG)) and / or polymer (eg, polyimide (PI), but is not limited thereto.

[0142] The at least one camera 840 may be configured to obtain an image based on receiving light from an object outside the electronic device 300. According to an embodiment, the at least one camera 840 may include a third camera 841 (eg, Figure 3 The rear camera 312, Figure 7a The first housing 810 may include a first camera 312a, a second camera 312b), a fourth camera 842, and a fifth camera 843. The third camera 841 may be disposed in the first housing 810. For example, the third camera 841 may be disposed inside the first housing 810, and at least a portion of the third camera 841 may be visible through the second surface 812 of the first housing 810. The third camera 841 may be supported by a bracket (not shown) in the first housing 810. When the electronic device 300 is viewed from above, the first housing 810 may include at least one opening 841a overlapping with the third camera 841. The third camera 841 may obtain an image based on receiving light from outside the electronic device 300 through the at least one opening 841a.

[0143] According to an embodiment, the fourth camera 842 may be provided in the second housing 820. For example, the fourth camera 842 may be provided inside the second housing 820 and may be visible through the sub-display panel 835. When the electronic device 300 is observed from above, the second housing 820 may include at least one opening 842a overlapping with the fourth camera 842. The fourth camera 842 may obtain an image based on receiving light from outside the electronic device 300 through the at least one opening 842a.

[0144] According to an embodiment, the fifth camera 843 may be provided in the first housing 810. For example, the fifth camera 843 may be provided inside the first housing 810, and at least a portion of the fifth camera 843 may be visible through the first surface 811 of the first housing 810. For another example, the fifth camera 843 may be provided inside the first housing 810, and at least a portion of the fifth camera 843 may be visible through the first display area 831 of the flexible display 830. When the flexible display 830 is observed from above, the first display area 831 of the flexible display 830 may include at least one opening overlapping with the fifth camera 843. The fifth camera 843 may obtain an image based on receiving light from outside the flexible display 830 through the at least one opening.

[0145] According to an embodiment, the fourth camera 842 and the fifth camera 843 may be disposed below the flexible display 830 (e.g., in a direction toward the inside of the first housing 810 or the inside of the second housing 820). For example, the fourth camera 842 and the fifth camera 843 may be under-screen cameras (UDC). In the case where the fourth camera 842 and the fifth camera 843 are under-screen cameras, the area of ​​the flexible display 830 corresponding to the respective positions of the fourth camera 842 and the fifth camera 843 may not be an inactive area. The inactive area of ​​the flexible display 830 may mean an area of ​​the flexible display 830 that does not include pixels or emits light to the outside of the electronic device 300. For another example, the fourth camera 842 and the fifth camera 843 may be punch hole cameras. In the case where the fourth camera 842 and the fifth camera 843 are punch hole cameras, the area of ​​the flexible display 830 corresponding to the respective positions of the fourth camera 842 and the fifth camera 843 may be an inactive area.

[0146] According to an embodiment, the hinge structure 850 may rotatably connect the first housing 810 and the second housing 820. The hinge structure 850 may be disposed between the first housing 810 and the second housing 820 of the electronic device 300 so that the electronic device 300 may be bent, curved or folded. For example, the hinge structure 850 may be disposed between a portion of the third side surface 813 and a portion of the fourth side surface 823 facing each other. The hinge structure 850 may enable the electronic device 300 to be changed to an unfolded state in which the first surface 811 of the first housing 810 and the third surface 821 of the second housing 820 face the same direction, or a folded state in which the first surface 811 and the third surface 821 face each other. When the electronic device 300 is in a folded state, the first housing 810 and the second housing 820 may be stacked or overlapped by facing each other.

[0147] According to an embodiment, when the electronic device 300 is in a folded state, the direction facing the first surface 811 and the direction facing the third surface 821 may be different from each other. For example, when the electronic device 300 is in a folded state, the direction facing the first surface 811 and the direction facing the third surface 821 may be opposite to each other. For another example, when the electronic device 300 is in a folded state, the direction facing the first surface 811 and the direction facing the third surface 821 may be tilted relative to each other. In the case where the direction facing the first surface 811 is tilted relative to the direction facing the third surface 821, the first housing 810 may be tilted relative to the second housing 820.

[0148] According to an embodiment, the electronic device 300 may be foldable based on a folding axis f. The folding axis f may mean a virtual line extending in a direction parallel to the longitudinal direction of the electronic device 300 and passing through the hinge cover 851, but is not limited thereto. For example, the folding axis f may be a virtual line extending in a direction perpendicular to the longitudinal direction of the electronic device 300. In the case where the folding axis f extends in a direction perpendicular to the longitudinal direction of the electronic device 300, the hinge structure 850 may extend in a direction parallel to the folding axis f to connect the first housing 810 and the second housing 820. The first housing 810 and the second housing 820 may be rotatable by the hinge structure 850 extending in a direction perpendicular to the longitudinal direction of the electronic device 300.

[0149] According to an embodiment, the hinge structure 850 may include a hinge cover 851, a first hinge plate 852, a second hinge plate 853, and a hinge module 854. The hinge cover 851 may surround the internal components of the hinge structure 850 and may form the outer surface of the hinge structure 850. According to an embodiment, when the electronic device 300 is in a folded state, at least a portion of the hinge cover 851 surrounding the hinge structure 850 may be exposed to the outside of the electronic device 300 through the space between the first housing 810 and the second housing 820. According to an embodiment, when the electronic device 300 is in an unfolded state, the hinge cover 851 may be covered by the first housing 810 and the second housing 820 without being exposed to the outside of the electronic device 300.

[0150] According to an embodiment, the first hinge plate 852 and the second hinge plate 853 may be respectively coupled to the first housing 810 and the second housing 820 to rotatably connect the first housing 810 and the second housing 820. For example, the first hinge plate 852 may be coupled to the first front surface bracket 815 of the first housing 810, and the second hinge plate 853 may be coupled to the second front surface bracket 827 of the second housing 820. Since the first hinge plate 852 and the second hinge plate 853 are respectively coupled to the first front surface bracket 815 and the second front surface bracket 827, the first hinge plate 810 and the second housing 820 may be rotatable according to the rotation of the first hinge plate 852 and the second hinge plate 853.

[0151] The hinge module 854 can rotate the first hinge plate 852 and the second hinge plate 853. For example, the hinge module 854 can rotate the first hinge plate 852 and the second hinge plate 853 based on the folding axis f by including rotatable gears that mesh with each other. According to an embodiment, the hinge module 854 can be a plural number. For example, a plurality of hinge modules 854 can be spaced apart from each other at both ends of the first hinge plate 852 and the second hinge plate 853, respectively.

[0152] According to an embodiment, the first housing 810 may include a first front surface bracket 815 and a rear surface bracket 816, and the second housing 820 may include a second front surface bracket 827. The first front surface bracket 815 and the rear surface bracket 816 may be disposed inside the first housing 810, and may support components of the electronic device 300. The second front surface bracket 827 may be disposed inside the second housing 820, and may support components of the electronic device 300. For example, the flexible display 830 may be disposed on one surface of the first front surface bracket 815 and one surface of the second front surface bracket 827. The rear surface bracket 816 may be disposed on another surface of the first front surface bracket 815 facing the one surface of the first front surface bracket 815.

[0153] According to an embodiment, a portion of the first front surface bracket 815 may be surrounded by the third side surface 813, and a portion of the second front surface bracket 827 may be surrounded by the fourth side surface 823. For example, the first front surface bracket 815 may be formed integrally with the third side surface 813, and the second front surface bracket 827 may be formed integrally with the fourth side surface 823. For another example, the first front surface bracket 815 may be formed separately from the third side surface 813, and the second front surface bracket 827 may be formed separately from the fourth side surface 823.

[0154] At least one electronic component 860 may be implemented to provide various functions for the user. According to an embodiment, the at least one electronic component 860 may include a first printed circuit board 350, a second printed circuit board 352, a flexible printed circuit board 520, a battery 370 (eg, Figure 1 battery 189), and / or antenna 248 (e.g., Figure 1 The first printed circuit board 350 and the second printed circuit board 352 may respectively form electrical connections for components in the electronic device 300. For example, components for implementing the overall functions of the electronic device 300 (e.g., Figure 1 The processor 120 in the fourth surface 822 may be disposed on the first printed circuit board 350, and electronic components for implementing certain functions of the first printed circuit board 350 may be disposed on the second printed circuit board 352. For another example, components for operating the sub-display panel 835 disposed on the fourth surface 822 may be disposed on the second printed circuit board 352.

[0155] According to an embodiment, the first printed circuit board 350 may be disposed in the first housing 810. For example, the first printed circuit board 350 may be disposed on one surface of the first front surface bracket 815. According to an embodiment, the second printed circuit board 352 may be disposed in the second housing 820. For example, the second printed circuit board 352 may be spaced apart from the first printed circuit board 350 and disposed on one surface of the second front surface bracket 827. The flexible printed circuit board 520 may connect the first printed circuit board 350 and the second printed circuit board 352. For example, the flexible printed circuit board 520 may extend from the first printed circuit board 350 to the second printed circuit board 352.

[0156] The battery 370 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 370 may be disposed on substantially the same plane as the first printed circuit board 350 or the second printed circuit board 352.

[0157] The antenna 248 may be configured to receive power or signals from outside the electronic device 300. According to an embodiment, the antenna 248 may be disposed between the rear surface bracket 816 and the battery 370. The antenna 248 may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna 248 may, for example, perform short-range communication with an external device, or wirelessly transmit and receive power required for charging.

[0158] refer to Figures 5 to 7b The arrangement of the flexible printed circuit board 520 described can be found in reference Figures 8a to 8c The foldable electronic device described herein is implemented, but not limited to, for communication of signals transmitted via antenna / conductive portion. The bending of the flexible printed circuit board 520 and its transmission via conductive vias (e.g. Figure 6b The second conductive via 620 of the first and second housings is attached to another conductive component, which means that signals can be communicated using a compact arrangement and with relatively low loss, which can help reduce the thickness of the foldable electronic device and also improve the efficiency of signal transmission within the foldable electronic device. This can be particularly advantageous for foldable devices due to the use of a flexible printed circuit board that communicates signals across the hinge connecting the first and second housings.

[0159] Some exemplary embodiments are described below and may be combined in any suitable form. Detailed information on features presented in the exemplary embodiments described below has been described above.

[0160] According to the above-mentioned embodiments, the electronic device (for example, Figure 1 Electronic Devices 101, Figure 3 The electronic device 300 may include a housing (eg, Figure 3 The housing 310 includes a front surface (eg, Figure 3 a front surface 300A), a rear surface opposite to the front surface (eg, Figure 3 The rear surface 300B), and between the front surface and the rear surface includes a portion for connecting to an external electronic device (e.g., Figure 1 The conductive portion (e.g., Figure 5 The conductive portion 510 has a plurality of side surfaces (eg, Figure 3 The side surface 300C, Figure 5 The electronic device may include a printed circuit board (eg, Figure 3 The electronic device may include a flexible printed circuit board (eg, Figure 5 The flexible printed circuit board 520 includes a first area (eg, Figure 5A first region 521 of the conductive portion, a second region (eg, Figure 5 a second region 522) and a third region extending from the first region to the second region (eg, Figure 5 The flexible printed circuit board may include a first outer surface (eg, Figure 6b a first outer surface 520a), a second outer surface opposite to the first outer surface (eg Figure 6b a second outer surface 520b), a plurality of layers between the first outer surface and the second outer surface (eg Figure 6b The flexible printed circuit board may include a plurality of conductive vias (eg, Figure 6a The plurality of conductive vias 600 include a first conductive via (eg, a first conductive via disposed in the first region and electrically connected to the printed circuit board) Figure 6a ), and a second conductive via (eg, Figure 6a The second conductive via 620 may include a first portion (eg, Figure 6b The first portion 621 of the embodiment of the present invention is provided, and the second portion (eg, Figure 6b A second portion 622 of the first layer, and a third portion (eg, a second portion 622 of the first layer) extending from the first portion to the second portion for electrical connection with at least a portion of the plurality of layers. Figure 6b According to the above-described embodiment, the electronic device may provide a transmission line for communicating with an external electronic device and / or an external server, connecting the conductive portion and the printed circuit board, by including the flexible printed circuit board. The flexible printed circuit board may electrically connect the conductive portion and the flexible printed circuit board by including the second conductive via including the first portion, the second portion, and the third portion. The second conductive via may fix the second region to the conductive portion by including the second portion. The above-described embodiment may have various effects including the above-described effects.

[0161] According to an embodiment, the thickness of the second region (eg, Figure 6b The thickness d2) is less than the thickness of the first region (eg, Figure 6b According to the above embodiment, since the thickness of the second region is less than the thickness of the first region, the flexible printed circuit board can be configured so that the second conductive via contacts the conductive portion. The above embodiment can have various effects including the above effects.

[0162] The electronic device according to the embodiment may further include an adhesive layer (eg, Figure 6bAccording to the above embodiment, the electronic device can reduce the peeling of the second region from the conductive portion by further including an adhesive layer. The above embodiment can have various effects including the above effects.

[0163] According to an embodiment, the thickness of the adhesive layer may be greater than or equal to 10 um and less than or equal to 20 um. According to the above embodiment, the adhesive layer may be configured to contact the second conductive via of the second region with the conductive portion by having a thickness greater than or equal to 10 um and less than or equal to 20 um. The above embodiment may have various effects including the above effects.

[0164] According to an embodiment, the direction along which the first region extends may be perpendicular to the direction along which the second region extends. The third region may include at least one bending portion (e.g., Figure 6b According to the above embodiment, the third region may be configured to connect the first region and the second region perpendicular to each other by including at least one bending portion. The above embodiment may have various effects including the above effects.

[0165] The electronic device according to the embodiment may further include a camera module (eg, Figure 1 The camera module 180 includes a first camera (eg, Figure 7a The first camera 312a and the second camera (eg, Figure 7a The second camera 312b) and along one side surface including the conductive portion among the plurality of side surfaces (eg, Figure 5 When the rear surface is viewed from above, at least a portion of the first area may overlap with the second camera. According to the above embodiment, the first area may extend toward the conductive portion by overlapping with the second camera when the rear surface is viewed from above. The above embodiment may have various effects including the above effects.

[0166] According to an embodiment, the camera module may further include a step (eg, Figure 7b The first region may span the space between the second camera and the front surface formed by the step of the camera module and may face one side surface. According to the above embodiment, the camera module may be configured such that the first region extends toward the conductive portion across the space between the second camera and the front surface by including the step. The above embodiment may have various effects including the above effects.

[0167] According to an embodiment, the conductive portion may face the second camera. According to the above-described embodiment, the conductive portion may be configured such that, by facing the second camera, the first area of ​​the space between the front surface and the second camera passing under the second camera extends toward the conductive portion. The above-described embodiment may have various effects including the above-described effects.

[0168] According to an embodiment, the plurality of layers may include a first metal layer (eg, Figure 6b The first metal layer 631) and the second metal layer partially covered by the second outer surface (eg Figure 6b The first portion may contact the first metal layer to be electrically connected to the first metal layer, and the second portion may contact the second metal layer for electrical connection between the second metal layer and the conductive portion. According to the above-described embodiment, by including the first metal layer and the second metal layer, a plurality of layers may be electrically connected to the conductive portion through the second conductive via. The above-described embodiment may have various effects including the above-described effects.

[0169] According to an embodiment, the plurality of layers may further include a dielectric layer (eg, Figure 6b According to the above-described embodiment, the plurality of layers may increase the rigidity of the flexible printed circuit board by further including a dielectric layer. By including the dielectric layer, the plurality of layers may include circuits within the plurality of layers for communication between the electronic device and an external electronic device and / or a server. The above-described embodiment may have various effects including the above-described effects.

[0170] According to an embodiment, each of the thickness of the first metal layer and the thickness of the second metal layer may be greater than or equal to 12um and less than or equal to 18um. According to the above embodiment, since the thickness of the first metal layer and the second metal layer is greater than or equal to 12um and less than or equal to 18um, the flexible printed circuit board may be configured so that the third region may include at least one bending portion. The above embodiment may have various effects including the above effects.

[0171] According to an embodiment, the width of the second region (eg, Figure 6a The width w2) may be greater than the width of the first region (eg, Figure 6a According to the above embodiment, since the width of the second region is greater than the width of the first region, the flexible printed circuit board can increase the area where the second region is disposed on the conductive portion. Since the width of the second region is greater than the width of the first region, the flexible printed circuit board can reduce the peeling of the second region from the conductive portion. The above embodiment can have various effects including the above effects.

[0172] According to an embodiment, the second region may also include a through-hole (eg, Figure 6b The third portion may surround the inner peripheral surface of the through hole (eg, Figure 6b The inner circumferential surface 650a of the through hole is formed by the second portion, and the second portion can electrically connect at least a portion of the plurality of layers to the conductive portion through the first portion and the third portion. According to the above embodiment, the third portion can electrically connect at least a portion of the plurality of layers to the conductive portion by surrounding the inner circumferential surface of the through hole. The above embodiment can have various effects including the above effects.

[0173] According to an embodiment, the second conductive via may fill the space in the via hole. According to the above embodiment, by filling the space in the via, the second conductive via may reduce signal loss in the case where a signal for communication between the electronic device and the external electronic device passes through the second conductive via. The above embodiment may have various effects including the above effects.

[0174] According to an embodiment, the thickness of the second region may be greater than or equal to 90um and less than or equal to 130um. According to the above embodiment, since the thickness of the second region is greater than or equal to 90um and less than or equal to 130um, the flexible printed circuit board may be configured so that the second conductive via disposed in the second region contacts the conductive member. The above embodiment may have various effects including the above effects.

[0175] An electronic device according to an embodiment may include a housing including a front surface, a rear surface opposite to the front surface, and a plurality of side surfaces between the front surface and the rear surface including a conductive portion for communicating with an external electronic device. The electronic device may include a printed circuit board in the housing. The electronic device may include a flexible printed circuit board including a first area in contact with the printed circuit board, a second area disposed on the conductive portion, and a third area extending from the first area to the second area. The flexible printed circuit board may include a plurality of layers having a first metal layer and a second metal layer. The flexible printed circuit board may include a first outer surface partially surrounding the first metal layer, a second outer surface partially surrounding the second metal layer and opposite to the first outer surface. The flexible printed circuit board may include a plurality of conductive vias penetrating the plurality of layers, the plurality of conductive vias including a first conductive via disposed in the first area for electrically connecting to the printed circuit board and a second conductive via disposed in the second area. The thickness of the second area may be less than the thickness of the first area. The second conductive via may include a first portion in contact with the first outer surface, a second portion contacting the conductive portion by protruding from the second outer surface for electrically connecting to the conductive portion, and a third portion extending from the first portion to the second portion for electrically connecting to at least a portion of the plurality of layers. According to the above-mentioned embodiments, the electronic device can provide a transmission line connecting the conductive part and the printed circuit board for communicating with an external electronic device and / or an external server by including a flexible printed circuit board. The flexible printed circuit board can electrically connect the conductive part and the flexible printed circuit board by including a second conductive via including the first part, the second part and the third part. The second conductive via can fix the second area to the conductive part by including the second part. The above-mentioned embodiments can have various effects including the above-mentioned effects.

[0176] The electronic device according to the embodiment may further include an adhesive layer disposed between the second region and the conductive portion and penetrated by the second portion of the second conductive via. According to the above embodiment, the electronic device may reduce the peeling of the second region from the conductive portion by further including the adhesive layer. The above embodiment may have various effects including the above effects.

[0177] According to an embodiment, the direction along which the first region extends is perpendicular to the direction along which the second region extends. The third region may include at least one bending portion for connecting the first region and the second region. According to the above embodiment, the third region may be configured to connect the first region and the second region perpendicular to each other by including at least one bending portion. The above embodiment may have various effects including the above effects.

[0178] According to an embodiment, the plurality of layers may further include a dielectric layer disposed between the first metal layer and the second metal layer and penetrated by the third portion of the second conductive via. According to the above-described embodiment, the plurality of layers may increase the stiffness of the flexible printed circuit board by further including a dielectric layer. By including a dielectric layer, the plurality of layers may include circuits within the plurality of layers for communication between the electronic device and an external electronic device and / or a server. The above-described embodiment may have various effects including the above-described effects.

[0179] According to an embodiment, each of the thickness of the first metal layer and the thickness of the second metal layer may be greater than or equal to 12um and less than or equal to 18um. According to the above embodiment, since the thickness of the first metal layer and the second metal layer is greater than or equal to 12um and less than or equal to 18um, the flexible printed circuit board may be configured so that the third region may include at least one bending portion. The above embodiment may have various effects including the above effects.

[0180] The electronic device according to the embodiment may further include a camera module including a first camera and a second camera arranged along one side surface including a conductive portion among the side surfaces and at least partially exposed through the rear surface. When the rear surface is observed from above, at least a portion of the first area may overlap with the second camera. According to the above embodiment, the first area may extend toward the conductive portion by overlapping with the second camera when the rear surface is observed from above. The above embodiment may have various effects including the above effects.

[0181] According to an embodiment, the camera module may further include a step facing the front surface between the first camera and the second camera. The first region may be configured to span the space between the second camera and the front surface formed by the step of the camera module and face one side surface. According to the above embodiment, the camera module may be configured such that the first region extends toward the conductive portion across the space between the second camera and the front surface by including the step. The above embodiment may have various effects including the above effects.

[0182] The electronic device according to various embodiments disclosed in this specification may be various types of devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. The electronic device according to one embodiment of this document is not limited to the above devices.

[0183] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but should be understood to include various changes, equivalent forms or replacement forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the noun in the singular form corresponding to the project may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled to another element (e.g., a second element)”, “coupled to another element (e.g., the second element)”, “connected to another element (e.g., the second element)”, or “connected to another element (e.g., the second element)”, with or without the term “operably” or “communicatively”, it means that the element may be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0184] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0185] The various embodiments set forth herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor (e.g., processor 120) of a machine (e.g., electronic device 101), the processor may call and run at least one of the one or more instructions stored in the storage medium with or without one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0186] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a relay server).

[0187] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be performed or omitted in a different order, or one or more other operations may be added.

Claims

1. An electronic device (101; 300), comprising: A housing (310), the housing comprising a front surface (300A), a rear surface (300B) opposite to the front surface (300A), and a plurality of side surfaces (300C; 300C-1; 300C-2) between the front surface (300A) and the rear surface (300B), the plurality of side surfaces (300C; 300C-1; 300C-2) comprising a conductive portion (510) for communicating with an external electronic device; A printed circuit board (350), the printed circuit board being located in the housing (310); as well as A flexible printed circuit board (520), the flexible printed circuit board comprising a first area (521) in contact with the printed circuit board (350), a second area (522) disposed on the conductive portion (510), and a third area (523) extending from the first area (521) to the second area (522); Wherein, the flexible printed circuit board (520) further comprises: a first outer surface (520a); a second outer surface (520b), the second outer surface being opposite to the first outer surface (520a); a plurality of layers (630), the plurality of layers (630) being located between the first outer surface (520a) and the second outer surface (520b); and a plurality of conductive vias (600), the plurality of conductive vias (600) penetrating the plurality of layers (630) and comprising a first conductive via (610) disposed in the first region (521) for electrically connecting to the printed circuit board (350) and a second conductive via (620) disposed in the second region (522); and Wherein, the second conductive through hole (620) comprises: a first portion (621), the first portion being in contact with the first outer surface (520a); a second portion (622), the second portion being in contact with the conductive portion (510) by protruding from the second outer surface (520b) so as to be electrically connected to the conductive portion (510); and A third portion (623) extends from the first portion (621) to the second portion (622) for electrical connection with at least a portion of the plurality of layers (630).

2. The electronic device (101; 300) according to claim 1, in, The thickness (d2) of the second region (522) is smaller than the thickness (d1) of the first region (521).

3. The electronic device (101; 300) according to claim 1, further comprising: An adhesive layer (640; 641; 642), the adhesive layer (640; 641; 642) being disposed between the second region (522) and the conductive portion (510) and being penetrated by the second portion (622) of the second conductive via (620).

4. The electronic device (101; 300) according to claim 3, in, The thickness of the adhesive layer (640; 641; 642) is greater than or equal to 10 um and less than or equal to 20 um.

5. The electronic device (101; 300) according to claim 1, in, The direction along which the first region (521) extends is perpendicular to the direction along which the second region (522) extends, and Wherein, the third region (523) comprises at least one bent portion (523a) for connecting the first region (521) and the second region (522).

6. The electronic device (101; 300) according to claim 1, further comprising: A camera module (180), the camera module comprising a first camera (312a) and a second camera (312b) at least partially exposed through the rear surface (300B), and arranged along a side surface (300C-1) including the conductive portion (510) among the plurality of side surfaces (300C; 300C-1; 300C-2); Wherein, when the rear surface (300B) is observed from above, at least a portion of the first area (521) overlaps with the second camera (312b).

7. The electronic device (101; 300) according to claim 6, in, The camera module (180) further includes a step (180a) between the first camera (312a) and the second camera (312b) facing the front surface (300A), and The first area (521) spans a space between the second camera (312b) formed by the step (180a) of the camera module (180) and the front surface (300A) and faces the one side surface (300C-1).

8. The electronic device (101; 300) according to claim 6, in, The conductive portion (510) faces the second camera (312b).

9. The electronic device (101; 300) according to claim 1, in, The plurality of layers (630) include: a first metal layer (631), the first metal layer (631) being partially covered by the first outer surface (520a); and a second metal layer (632), the second metal layer (632) being partially covered by the second outer surface (520b); and wherein the first portion (621) contacts the first metal layer (631) for electrical connection with the first metal layer (631), and The second portion (622) contacts the second metal layer (632) for electrical connection between the second metal layer (632) and the conductive portion (510).

10. The electronic device (101; 300) according to claim 9, in, The plurality of layers (630) further include a dielectric layer (633) disposed between the first metal layer (631) and the second metal layer (632) and penetrated by the third portion (623) of the second conductive via (620).

11. The electronic device (101; 300) according to claim 9, in, Each of the thickness of the first metal layer (631) and the thickness of the second metal layer (632) is greater than or equal to 12 um and less than or equal to 18 um.

12. The electronic device (101; 300) according to claim 1, in, The width (w2) of the second region (522) is greater than the width (w1) of the first region (521).

13. The electronic device (101; 300) according to claim 1, in, The second region (522) further includes: a through-hole (650) penetrating the plurality of layers (630) and in which at least a portion of the second conductive via (620) is disposed; and wherein the third portion (623) surrounds an inner peripheral surface (650a) of the through hole (650) penetrating the plurality of layers (630), and The second portion (622) electrically connects at least a portion of the multiple layers (630) and the conductive portion (510) through the first portion (621) and the third portion (623).

14. The electronic device (101; 300) according to claim 13, in, The second conductive via (620) fills the space in the via hole (650).

15. The electronic device (101; 300) according to claim 1, in, The thickness (d2) of the second region (522) is greater than or equal to 90 um and less than or equal to 130 um.

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