Cleaning process and cleaning device for laser printing carrier plate

Abstract

The application discloses a cleaning process and cleaning device for a carrier plate used for laser printing, and relates to the technical field of laser printing. The cleaning process for the carrier plate used for laser printing comprises the following steps: conveying the carrier plate to a cleaning station, adjusting a solvent pool to immerse the carrier plate, starting a laser emitter and an ultrasonic vibration source to perform cleaning, and conveying the cleaned carrier plate into a production line. The technical scheme in the application designs a cleaning process and cleaning device for the carrier plate used for laser printing, which is improved on the basis of laser wet cleaning technology, combines laser impact, solvent dissolution and ultrasonic vibration, and reasonably controls specific parameters of related devices or equipment according to the specific shape of the carrier plate used for laser printing and the location of residual slurry. The cleaning process can complete the cleaning of the carrier plate in a very short time, is an online cleaning scheme, can keep the carrier plate clean while the laser printing system continuously and uninterruptedly works, and has good application value.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser printing, in particular to a cleaning process and cleaning device for a laser printing carrier plate. BACKGROUND

[0002] In a solar cell manufacturing process, laser printing is a technology that forms a grid electrode on a solar cell by irradiating a transparent carrier plate loaded with metal paste with a laser, causing the metal paste to fall off from the groove of the carrier plate and transfer to the solar cell.

[0003] After the metal paste falls off from the groove of the carrier plate, a small amount of metal paste particles will still remain in the groove of the carrier plate. The cleaning method in the related art is to place the carrier plate in a solvent for cleaning. However, after cleaning, a small amount of stubborn metal paste particles will still remain in the groove, and the cleaning time is too long to meet the production efficiency requirements of the production line. SUMMARY

[0004] The main purpose of the present application is to develop a cleaning process and cleaning device for a laser printing carrier plate, which can clean and remove the residual paste in the groove of the laser printing carrier plate in a very short time, and the cleaning process can be matched with the production cycle of the solar cell, thereby ensuring the efficient production of the solar cell.

[0005] To achieve the above purpose, the present application provides a cleaning process for a laser printing carrier plate, which comprises the following steps:

[0006] S10, adjusting the transmission device to send the carrier plate after laser printing to a cleaning station, the cleaning station being located above a solvent pool;

[0007] S20, adjusting the solvent pool to rise so that the carrier plate is immersed in the solvent of the solvent pool;

[0008] S30, starting an ultrasonic vibration source located at the bottom of the solvent pool and a laser emitter located above the cleaning station, so that the laser emitted by the laser emitter hits the groove of the carrier plate, and the residual paste in the groove of the carrier plate is cleaned;

[0009] S40, adjusting the solvent pool to reset, and sending the carrier plate cleaned in step S30 to a drying station for drying treatment by the transmission device;

[0010] S50, adjusting the transmission device to convey the carrier plate after drying treatment in step S40 to a subsequent station, and sending the next carrier plate to be cleaned to the cleaning station for cleaning operation.

[0011] In an embodiment, in step S10, the laser-printed carrier plate is sent to the cleaning station, and the direction of the carrier plate is adjusted so that the grooves of the carrier plate face downward.

[0012] In an embodiment, in step S20, the rising of the solvent pool is adjusted so that the depth of the carrier plate immersed in the solvent is 0.1mm-2mm.

[0013] In an embodiment, in step S30, the laser emitter is selected from any one of a continuous laser emitter, a quasi-continuous laser emitter, and a pulsed laser emitter.

[0014] In an embodiment, in step S30, the emission power of the laser emitter is 100W-2000W.

[0015] In an embodiment, in step S30, the width of the spot output by the laser emitter on the carrier plate is 30μm-10mm.

[0016] In an embodiment, in step S30, the wavelength of the laser emitted by the laser emitter is 248nm-2000nm.

[0017] In an embodiment, in step S30, the distance between the laser emitter and the carrier plate is 270mm-600mm.

[0018] In an embodiment, the ultrasonic vibration source comprises at least one vibration device, and the vibration devices are uniformly distributed in a rectangular lattice at the bottom of the solvent pool.

[0019] In an embodiment, in step S30, the vibration frequency of the vibration device is 80kHz-200kHz.

[0020] In an embodiment, in step S30, the distance between the plane where the vibration device is located and the carrier plate is 30mm-200mm.

[0021] In an embodiment, the solvent in the solvent pool is an organic solvent, and the organic solvent is selected from at least one of an alcohol, an ester, an ether, and a ketone.

[0022] In an embodiment, the temperature of the solvent in the solvent pool is 25℃-40℃.

[0023] The present application also provides a cleaning device for cleaning the laser-printed carrier plate, which comprises a solvent pool, an ultrasonic vibration source at the bottom of the solvent pool, and a laser emitter above the solvent pool.

[0024] In an embodiment, the cleaning device further comprises a filter connected to the solvent tank through a drain hole at the bottom of the solvent tank, for recovering slurry particles in the solvent.

[0025] The technical solution in the present application designs a cleaning process and a cleaning device for a carrier plate used in laser printing, which is improved on the basis of laser wet cleaning technology, combines laser impact, solvent dissolution and ultrasonic vibration, and reasonably controls specific parameters of related devices or equipment in combination with the specific shape of the carrier plate used in laser printing and the location of residual slurry, so as to complete the cleaning of the carrier plate in a very short time. In addition, the cleaning rate of the carrier plate in the cleaning process in the present application is 0.5-0.7 seconds per piece, and the production cycle of the photovoltaic cell laser printing production line is generally 0.7-0.8 seconds per piece, so the cleaning process in the present application meets the requirements of the online cleaning scheme, and the cleaning process does not need to stop the line. In summary, the cleaning process and the cleaning device for the carrier plate used in laser printing in the present application can keep the carrier plate clean while the laser printing system is continuously and uninterruptedly working, so as to avoid the influence of residual slurry on the integrity and consistency of the printed grid electrode. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings shown.

[0027] Figure 1 FIG. 1 is a structural schematic diagram of the cleaning device for the carrier plate used in laser printing in Embodiment 1 of the present application;

[0028] Figure 2 FIG. 4 is an EL detection diagram of a solar cell produced after the cleaning device for the carrier plate used in laser printing in Embodiment 1 of the present application is applied;

[0029] The implementation, functional characteristics and advantages of the present application will be further described with reference to the drawings.

[0030] 1, laser emitter; 2, solvent tank; 3, ultrasonic vibration source; 4, carrier plate; 41, groove; 5, filter. DETAILED DESCRIPTION

[0031] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of the present application.

[0032] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0033] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel solutions are included, for example, "A and / or B" includes A solution, or B solution, or A and B solutions. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize it, and when the combination of technical solutions appears to be contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection claimed by the present application.

[0034] The technical problem solved by the present application is that in the existing laser printing technology, the conventional cleaning method for the residual paste in the carrier plate is ultrasonic cleaning in a solvent, but a small amount of stubborn paste is still difficult to remove or requires longer ultrasonic treatment, which will affect the production efficiency and product quality of the solar cell.

[0035] In order to solve the above technical problem, a cleaning process for a laser printing carrier plate is developed, which can clean and remove the residual paste in the groove of the laser printing carrier plate in a very short time, and the cleaning process can match the production cycle of the solar cell, thereby ensuring the efficient production of the solar cell.

[0036] The present application provides a cleaning process for a laser printing carrier plate, comprising the following steps:

[0037] S10, adjusting the transmission device to send the laser printed carrier plate to the cleaning station, and the cleaning station is located above the solvent pool;

[0038] S20, adjust the solvent pool to rise, so that the carrier plate is immersed in the solvent of the solvent pool;

[0039] S30, start the ultrasonic vibration source located at the bottom of the solvent pool and the laser transmitter located above the cleaning station, so that the laser emitted by the laser transmitter hits the groove of the carrier plate, and the residual slurry at the groove of the carrier plate is cleaned;

[0040] S40, adjust the solvent pool to reset, and send the carrier plate cleaned in the step S30 to the drying station for drying treatment through the transmission device;

[0041] S50, adjust the transmission device to transmit the carrier plate dried in the step S40 to the subsequent station, and send the next carrier plate needing cleaning to the cleaning station for cleaning operation.

[0042] It should be noted that the cleaning process of the laser printing carrier plate in the application introduces ultrasonic vibration and solvent dissolution on the basis of laser cleaning, which can effectively improve the related defects of pure laser cleaning and improve the cleaning effect. It should be noted that in the above process, the carrier plate is first immersed in the solvent in the step S20, and then the ultrasonic vibration source and the laser transmitter are started synchronously in the step S30; the shock wave generated by the cavitation effect of ultrasonic wave in liquid can make the residual slurry separate from the groove of the carrier plate and flow into the solvent; ultrasonic cavitation can produce high-speed microjet on the surface of solid and liquid, which can weaken the boundary pollution layer of residual slurry, enhance the stirring effect and accelerate the dissolution of soluble organic matter in residual slurry in the solvent. During the laser cleaning process, high-energy laser penetrates through the transparent carrier plate and acts on the slurry particles in the micro groove, and the surface layer of the particles will quickly heat up to the vaporization temperature, and the vaporization will cause extremely high pressure, and the residual particles will be separated from the micro groove instantaneously. By using the above process, the cleaning of a piece of laser printing carrier plate can be completed within 0.5-0.7s, and the residual slurry particles in the groove of the carrier plate can be reduced by 99.9%.

[0043] It should be noted that the cleaning process of the laser printing carrier plate in the application needs to ensure that the carrier plate is immersed in the solvent during the laser cleaning in the step S30. If the laser impact is performed first and then the carrier plate is immersed in the solvent, the residual slurry is easy to be separated from the laser vaporization, but the soluble organic matter such as binder in the residual slurry is completely volatilized, so that the residual slurry is solidified in the groove of the carrier plate, thereby greatly increasing the cleaning difficulty of the carrier plate.

[0044] In an embodiment, in the step S20, the solvent pool is adjusted to rise, and the depth of the substrate immersed in the solvent is 0.1mm-2mm. It can be understood that the depth of the substrate immersed in the solvent can be 0.1mm, 0.2mm, 0.5mm, 1mm, 1.1mm, 1.5mm or 2mm; any value within the above range is acceptable.

[0045] It should be noted that by immersing the substrate in the solvent to a certain depth, on the one hand, it is beneficial for the residual slurry in the groove of the substrate to be easily removed during laser cleaning, and on the other hand, the laser needs to penetrate the solvent and the substrate to irradiate the residual slurry in the groove of the substrate. The greater the depth of the substrate immersed in the solvent, the greater the energy loss. If the depth of the substrate immersed in the solvent is too shallow, the effect of ultrasonic vibration will be poor, which is not conducive to removing the residual slurry. In summary, the substrate needs to be immersed in the solvent to an appropriate depth.

[0046] In an embodiment, in the step S20, the laser-printed substrate is sent to the cleaning station, and the direction of the substrate is adjusted so that the groove of the substrate faces downward.

[0047] It should be noted that the groove direction of the laser-printed substrate in the production line is downward, and no flipping operation is required when it reaches the cleaning station. The groove direction facing downward is beneficial for the residual slurry to be removed into the solvent under the action of gravity and the resonance of the ultrasonic wave at the bottom of the solvent pool. In addition, the bottom of the solvent pool has a drain and a filter connected to the drain, and the groove direction facing downward is beneficial for the recovery of the slurry and the maintenance of the solvent in a clean state. Although the groove direction facing upward can avoid energy loss during laser cleaning, it requires two additional processes of flipping the substrate, which increases the complexity of the equipment and makes the solvent pool more turbid during the cleaning process, requiring frequent replacement of the solvent. Therefore, even if the groove direction is downward, it will bring 5-10% of the energy loss of the laser, which is still acceptable for the applicant considering the entire production process.

[0048] In an embodiment, the substrate is made of a material with high light transmittance and low thermal expansion coefficient, has high heat resistance, and will not deform or break after multiple penetrations or irradiations of the laser, thereby ensuring the integrity and consistency of the prepared grid lines.

[0049] In an embodiment, in the step S30, the laser emitter is selected from any one of a continuous laser emitter, a quasi-continuous laser emitter and a pulsed laser emitter.

[0050] In an embodiment, in the step S30, the light spot output by the laser emitter can be a Gaussian light spot, or a specially shaped light spot such as a multi-point light spot, a square, rectangular, circular flat-top light spot, a line light spot, etc.

[0051] In an embodiment, the laser emitter has a power of 100W-2000W in the step S30. It can be understood that the power of the laser emitter can be 100W, 120W, 150W, 300W or 2000W, and all the values within the above range are acceptable.

[0052] In an embodiment, the width of the laser spot output by the laser emitter on the carrier plate is 30μm-10mm in the step S30. It can be understood that the width of the laser spot output by the laser emitter on the carrier plate can be 30μm, 31μm, 35μm, 50μm or 10mm, and all the values within the above range are acceptable.

[0053] It should be noted that the width of the laser spot output by the laser emitter on the carrier plate needs to cover the entire groove range in the step S30, and therefore the width of the laser spot needs to be greater than or equal to the width of the groove. The width of the groove of a conventional carrier plate is 3μm-30μm. In order to meet the needs and reduce the energy consumption of the laser, the width of the laser spot output by the laser emitter on the carrier plate is controlled to be 30μm-10mm. In a specific embodiment, a Gaussian laser spot is used. In general, in order to reduce the alignment accuracy requirement of a single laser beam and a single groove, the width of the laser spot output by the laser emitter on the carrier plate is controlled to be 100μm-200μm. In addition, the width of the laser spot output by the laser emitter on the carrier plate can be expanded to the millimeter level, so that a single laser beam can cover multiple grooves at one time, and the production efficiency is further improved.

[0054] It should be further noted that the power of the laser emitter and the width of the laser spot on the carrier plate have a high correlation. If the width of the laser spot on the carrier plate is controlled to be 100μm-200μm, the power of the laser emitter can be in the order of hundreds of watts. If the laser spot is shaped to have a width of the order of millimeters on the carrier plate, in order to achieve the same energy density, the power of the laser emitter needs to be in the order of kilowatts.

[0055] In an embodiment, the wavelength of the laser emitted by the laser emitter is 248nm-2000nm in the step S30. It can be understood that the wavelength of the laser emitted by the laser emitter can be 248nm, 343nm, 532nm, 1030nm or 2000nm, and all the values within the above range are acceptable.

[0056] It should be noted that the laser of 248nm is a typical output wavelength of excimer laser (such as KrF laser), which is ultraviolet laser with high energy and can directly destroy the chemical bond of organic matter without relying on thermal effect, and is more suitable for cleaning of metal surface stains; the laser of 2000nm is mid-infrared laser, which is often generated by thulium fiber laser or holmium laser and has a longer wavelength. In the present application, the above three kinds of lasers all have good cleaning effect.

[0057] In an embodiment, the distance between the laser emitter and the carrier plate in the step S30 is 270mm-600mm. It can be understood that the distance between the laser emitter and the carrier plate can be 270mm, 271mm, 280mm, 300mm, 320mm or 600mm, and all distances within the above range are acceptable.

[0058] It should be noted that the distance between the laser emitter and the carrier plate in the step S30 refers to the distance between the laser emitter and the carrier plate when the laser emitter is started and emits laser. In order to ensure full utilization of laser energy, the above distance should be approximately equal to the focal length of the laser emitter, i.e. the range of the focal length of the laser emitter is close to 270mm-600mm.

[0059] In an embodiment, the ultrasonic vibration source includes at least one vibration device, and the vibration devices are uniformly distributed in a rectangular lattice at the bottom of the solvent pool. In a specific embodiment, the cleaning device is a single-station cleaning device, i.e. only one carrier plate can be cleaned at a time, the size of the solvent pool is 300mm*300mm*50mm, and the ultrasonic vibration source includes 9 vibration devices which are uniformly distributed in a 3*3 square lattice at the bottom of the solvent pool. In a specific embodiment, the cleaning device is a single-station cleaning device, i.e. only one carrier plate can be cleaned at a time, the size of the solvent pool is 300mm*300mm*50mm, and the ultrasonic vibration source includes 16 vibration devices which are uniformly distributed in a 4*4 square lattice at the bottom of the solvent pool. In a specific embodiment, the cleaning device is a double-station cleaning device, i.e. two carrier plates can be cleaned at a time, the size of the solvent pool is 300mm*800mm*200mm, and the ultrasonic vibration source includes 32 vibration devices which are uniformly distributed in a 4*8 rectangular lattice at the bottom of the solvent pool.

[0060] In an embodiment, the vibration frequency of the vibration device in the step S30 is 80kHz-200kHz. It can be understood that the vibration frequency of the vibration device can be 80kHz, 85kHz, 90kHz, 100kHz or 200kHz, which corresponds to the vibration frequency of the vibration device of the ultrasonic cleaning machine in the prior art, and all vibration frequencies within the above range are acceptable.

[0061] In an embodiment, the vibration frequency of the ultrasonic vibration source can also reach MHz level, corresponding to the vibration frequency of the vibration device in the megasonic cleaning machine.

[0062] In an embodiment, the distance between the plane where the vibration device is located and the carrier plate in the step S30 is 30-200 mm. It can be understood that the plane where the vibration device is located is equivalent to the bottom of the solvent pool, and the distance between the plane where the vibration device is located and the carrier plate is approximately equal to the distance between the bottom of the solvent pool and the carrier plate. The above-mentioned distance can be 30 mm, 35 mm, 60 mm, 80 mm, 100 mm, or 200 mm, and any distance within the above-mentioned range is also acceptable. It should be noted that by controlling the distribution state of the vibration device, the vibration frequency, and the distance to the object, a better impact effect on the residual slurry in the groove can be achieved, so as to facilitate the removal of the residual slurry in a short time.

[0063] In an embodiment, the solvent in the solvent pool is an organic solvent, and the organic solvent is at least one selected from the group consisting of alcohols, esters, ethers, and ketones; preferably, the solvent in the solvent pool is an organic solvent, and the organic solvent comprises ethers and ketones.

[0064] In an embodiment, the temperature of the solvent in the solvent pool is 25-40℃. It should be noted that by controlling the temperature of the solvent in the solvent pool to be 25-40℃, the dissolution of the soluble organic matter in the residual slurry in the solvent is facilitated, thereby promoting the cleaning and removal of the residual slurry.

[0065] It should be further noted that, in general, the temperature of the solvent in the solvent pool is room temperature; when the viscosity of the metal slurry is high, the temperature of the solvent in the solvent pool can be appropriately increased, but the temperature of the solvent in the solvent pool should not be higher than 40℃, otherwise the organic solvent will volatilize rapidly, which will instead reduce the cleaning capacity of the solvent pool.

[0066] The present application also provides a cleaning device, which applies the cleaning process of the laser printing carrier plate; the cleaning device comprises a solvent pool, an ultrasonic vibration source located at the bottom of the solvent pool, and a laser emitter located above the solvent pool.

[0067] In an embodiment, the cleaning device further comprises a filter connected to the solvent pool through a drain at the bottom of the solvent pool, for recovering the slurry particles in the solvent.

[0068] The present application will be further described through specific embodiments as follows:

[0069] The raw materials used in the embodiments of the present application are commercially available, and the present application does not make any limitation on the source of the raw materials.

[0070] Embodiment 1

[0071] Referring to Figure 1 The cleaning device in Embodiment 1 comprises a solvent pool 2, an ultrasonic vibration source 3 and a laser emitter 1, and the bottom of the solvent pool 2 is further connected with a filter 5.

[0072] Embodiment 1 is a single-station single-station cleaning device, which completes the cleaning of one piece of carrier board 4 at a time. The size of the solvent pool 2 is 300mm*300mm*50mm, and the ultrasonic vibration source 3 comprises 16 vibration devices, which are uniformly distributed in a 4*4 square lattice at the bottom of the solvent pool 2.

[0073] The cleaning process of the laser-printed carrier board in Embodiment 1 comprises the following steps:

[0074] S10, adjust the transmission device to send the laser-printed carrier board to the cleaning station, which is located above the solvent pool 2;

[0075] S20, adjust the height of the carrier board 4 so that the distance between the laser emitter 1 and the carrier board 4 is 300mm, and adjust the solvent pool 2 to rise so that the depth of the carrier board 4 immersed in the solvent is about 1mm, and the distance between the carrier board 4 and the bottom of the solvent pool 2 is about 45mm;

[0076] S30, simultaneously start the ultrasonic vibration source 3 located at the bottom of the solvent pool 2 and the laser emitter 1 located above the cleaning station, so that the laser emitted by the laser emitter 1 hits the groove 41 of the carrier board 4, and the residual slurry in the groove 41 of the carrier board 4 is cleaned, and after 0.5s, the cleaning is completed and the ultrasonic vibration source 3 and the laser emitter 1 are turned off;

[0077] S40, adjust the solvent pool 2 to reset, and send the carrier board cleaned in step S30 to the drying station for drying treatment through the transmission device;

[0078] S50, adjust the transmission device to transmit the carrier board dried in step S40 to the subsequent station, and send the next piece of carrier board needing cleaning to the cleaning station for cleaning operation.

[0079] The laser emitter 1 in Embodiment 1 is a pulse laser emitter, the emission power is controlled to be 400W, the laser wavelength is 532nm, and the output spot is a circular flat spot, and the width of each spot on the carrier board 4 is controlled to be 30μm, which can completely cover one groove.

[0080] The cleaning device in Embodiment 1 has multiple laser emitters 1, and the output spots are respectively shot on multiple grooves 41 of the carrier board 4.

[0081] In Example 1, the width of the groove 41 of the carrier plate 4 is approximately 22 μm.

[0082] In Example 1, the vibration frequency of the ultrasonic source 3 is 100kHz.

[0083] The cleaning device from Example 1 was incorporated into the solar cell production unit to form a production-cleaning cyclic operation. The solar cell production unit is a laser transfer printing device that produces solar cells with grid groove widths of approximately 20 μm. The production-cleaning cyclic operation was used to produce solar cells, with 8 solar cells per batch, for a total of 1000 solar cells. The last 5 batches of solar cells were subjected to EL testing, and the test results are shown below. Figure 1 .

[0084] like Figure 1 As shown in the test results, no multiple solar cells were found to have broken grids at the same location. At the same time, the printing quality of the solar cells was good, and no serious grid breakage phenomenon was found.

[0085] Example 2

[0086] Reference Figure 1 The cleaning device in Example 2 includes a solvent tank 2, an ultrasonic source 3, and a laser emitter 1. A filter 5 is also connected to the bottom of the solvent tank 2. Example 2 is a dual-station cleaning device that cleans two carrier plates 4 at a time. The solvent tank 2 has dimensions of 300mm*800mm*200mm. The ultrasonic source 3 includes 32 vibrating devices that are evenly distributed in a 4*8 rectangular array at the bottom of the solvent tank.

[0087] The cleaning process for the laser printing carrier in Example 2 includes the following steps:

[0088] S10. Adjust the transmission device to deliver the laser-printed carrier plate 4 to the cleaning station, which is located above the solvent pool 2.

[0089] S20. Adjust the height of the carrier plate 4 so that the distance between the laser emitter 1 and the carrier plate 4 is 300mm. Adjust the solvent pool 2 to rise so that the carrier plate 4 is immersed in the solvent to a depth of about 0.5mm, and the distance between the bottom of the carrier plate 4 and the bottom of the solvent pool 2 is about 45mm.

[0090] S30. Simultaneously activate the ultrasonic source 3 located at the bottom of the solvent pool 2 and the laser emitter 1 located above the cleaning station, so that the laser emitted by the laser emitter 1 hits the groove 41 of the carrier plate 4 to clean the residual slurry in the groove 41 of the carrier plate 4. After 0.5 seconds, the cleaning is completed and the ultrasonic source 3 and laser emitter 1 are turned off.

[0091] S40, adjusting the solvent pool 2 reset, through the transmission device in step S30 of the cleaning completed carrier plate 4 into the drying station for drying treatment;

[0092] S50, adjusting the transmission device to transmit the carrier plate 4 after drying in step S40 to the subsequent station, and the next piece of carrier plate 4 needs to be cleaned to the cleaning station for cleaning operation.

[0093] The laser emitter 1 in example 2 is a pulse laser emitter, the emission power control is 300W, the laser wavelength is 532nm, the output spot is a circular flat spot, and the width of the spot on the carrier plate 4 is controlled to be 25μm.

[0094] The cleaning device in example 2 has a plurality of laser emitters 1, and the output spots are respectively shot on the plurality of grooves 41 of the carrier plate 4.

[0095] The width of the groove 41 of the carrier plate 4 in example 2 is about 22μm.

[0096] The vibration frequency of the vibration device of the ultrasonic wave source 3 in example 2 is 100kHz.

[0097] The cleaning device in example 2 is integrated into the production device of solar cell pieces to form a production-cleaning cycle operation device. Among them, the production device of solar cell pieces is a laser transfer printing device, which produces solar cell pieces with a grid line groove width of about 20μm. The above production-cleaning cycle operation device is used for solar cell production operation, one batch produces 16 solar cell pieces, a total of 1000 solar cell pieces, and the last 5 batches of solar cell pieces are detected by EL. In the detection result, no continuous multiple pieces are detected at the same position, the solar cell printing quality is good, and no serious broken grid phenomenon occurs.

[0098] The above only describes the exemplary embodiments of the present application, and does not limit the patent scope of the present application, any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A cleaning process for a carrier plate for laser printing, characterized by, The cleaning process of the laser printing carrier plate comprises the following steps: S10, adjusting the transmission device to send the laser printed carrier plate to the cleaning station, and the cleaning station is located above the solvent pool; S20, adjusting the solvent pool to rise, so that the carrier plate is immersed in the solvent of the solvent pool; S30, starting the ultrasonic vibration source located at the bottom of the solvent pool and the laser emitter located above the cleaning station, so that the laser emitted by the laser emitter hits the groove of the carrier plate, and the residual slurry in the groove of the carrier plate is cleaned; S40, adjusting the solvent pool to reset, and sending the carrier plate cleaned in step S30 to the drying station for drying treatment through the transmission device; S50, adjusting the transmission device to send the carrier plate dried in step S40 to the subsequent station, and sending the next piece of carrier plate needing cleaning to the cleaning station for cleaning operation; In step S10, the laser printed carrier plate is sent to the cleaning station, and the direction of the carrier plate is adjusted so that the groove of the carrier plate faces downward; In step S20, the solvent pool is adjusted to rise, so that the depth of the carrier plate immersed in the solvent is 0.1mm-2mm; In step S30, the width of the light spot output by the laser emitter on the carrier plate is 30μm-10mm; the distance between the laser emitter and the carrier plate is 270mm-600mm; In step S30, the ultrasonic vibration source comprises at least one vibration device, and the vibration devices are uniformly distributed in a rectangular lattice at the bottom of the solvent pool; the vibration frequency of the vibration device is 80kHz-200kHz; the distance between the plane where the vibration device is located and the carrier plate is 30mm-200mm; The solvent in the solvent pool is an organic solvent, and the organic solvent is selected from at least one of alcohol, ester, ether and ketone; The temperature of the solvent in the solvent pool is 25℃-40℃.

2. The cleaning process for a carrier for laser printing according to claim 1, wherein The emission power of the laser emitter is 100W-2000W.

3. The cleaning process for a laser printing carrier plate according to claim 1, wherein, The wavelength of the laser emitted by the laser emitter is 248nm-2000nm.

4. A cleaning device characterized by The cleaning device applies the cleaning process of the laser printing carrier plate according to any one of claims 1-3; The cleaning device comprises a solvent pool, an ultrasonic vibration source located at the bottom of the solvent pool, and a laser emitter located above the solvent pool.

5. The cleaning apparatus of claim 4, wherein The cleaning device further comprises a filter connected with the solvent pool through the drain port at the bottom of the solvent pool, which is used to recover the slurry particles in the solvent.

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