Wafer scribing machine

Abstract

The invention relates to the technical field of wafer scribing processing, and discloses a wafer scribing machine, which comprises a lathe bed and a rotary working table arranged on the lathe bed, and is characterized in that the rotary working table moves to a preset position on the lathe bed along the X-axis direction through an X-axis sliding table assembly; the X-axis sliding table assembly comprises an X-axis sliding table, a driving assembly used for driving the X-axis sliding table to move and an X-axis base table in sliding connection with the X-axis sliding table. A Y-axis sliding table assembly is arranged on the lathe bed, a Z-axis sliding table assembly is connected to the Y-axis sliding table assembly in a transmission mode, and a main shaft cutting assembly is installed on the Z-axis sliding table assembly. According to the invention, the structural design is compact, and the long-term precision stability and quick responsiveness of the motion shaft system are effectively guaranteed through the sliding design of the air floating guide rail and the multiple guide rails; and meanwhile, the Z-axis nut seat is matched with the transmission block set in the Z-axis direction to control the spindle cutting assembly to deflect up and down, the repeated positioning precision is good, and the operation and maintenance cost is low.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer dicing processing, in particular to a wafer dicing machine. Background Art

[0002] Various circuit component structures can be processed on silicon wafers to become integrated circuit products with specific electrical functions.

[0003] The traditional rotating grinding wheel wafer cutting technology is affected by the process limits in actual production. The wafer processing has mechanical stress, cracking, low processing efficiency and low yield, which greatly limits the development of wafer manufacturing level. Traditional wafer cutting methods can no longer meet the high-efficiency and high-precision production requirements of wafer products. Therefore, the problems associated with the rotating grinding wheel cutting process cannot be completely solved by optimizing the process itself. It is urgent to adopt a new processing method to solve the bottleneck of wafer cutting and dicing; at the same time, the transmission mechanism of the traditional dicing machine adopts a motor lead screw drive method, which is difficult to meet the high requirements for processing positioning accuracy during wafer processing. The existing dicing machine functions and positioning accuracy are difficult to meet the reliability and technical performance requirements of wafer production. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a wafer dicing machine, which solves the problem that traditional rotary grinding wheel wafer cutting machines are difficult to meet the high-efficiency and high-precision production requirements of existing wafer products due to limitations in function and positioning accuracy.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A wafer dicing machine comprises a bed and a rotating worktable arranged on the bed, wherein the rotating worktable is moved to a predetermined position along the X-axis direction on the bed through an X-axis slide assembly, the X-axis slide assembly comprises an X-axis slide, a driving assembly for driving the X-axis slide to move, and an X-axis base slidably connected to the X-axis slide, the X-axis slide is air-floatedly arranged on the X-axis base; a Y-axis slide assembly is arranged on the bed, a Z-axis slide assembly is transmission-connected to the Y-axis slide assembly, a spindle cutting assembly is installed on the Z-axis slide assembly, and under the coordinated transmission of the X-axis slide assembly, the spindle cutting assembly can slice and cut the wafer workpiece clamped and fixed on the rotating worktable, and each slide assembly can restore to the origin position after slicing and cutting; a knife repairing plate and a non-contact height measuring assembly are arranged on the X-axis slide, and the non-contact height measuring assembly is used to detect the maximum outer diameter wear of the cutting blade in the cutting assembly to reduce tool wear.

[0009] Preferably, a support frame is fixedly provided on the lower end surface of the bed, and a movable wheel group for supporting storage is provided on the support frame.

[0010] Preferably, the driving assembly includes a linear motor stator and a linear motor mover, the linear motor stator is fixedly arranged on the bed, the linear motor stator is transmission-connected to the linear motor mover, the linear motor mover is slidingly and fixedly connected to the X-axis through an X-axis motor mounting plate, a plurality of ceramic air cushion plates are fixedly connected to the X-axis slide through an air cushion mounting plate, the end face of the ceramic air cushion plate is in contact with the X-axis guide plate, and an air outlet is arranged at the center of the ceramic air cushion plate to cooperate with the flotation conditions of the external ventilation component.

[0011] Preferably, an X-axis limit block is fixedly provided on one side of the X-axis slide, an X-axis stopper matching the X-axis limit block is provided on the bed, and a buffer rod is fixedly provided on the sides of the X-axis stops that are close to each other.

[0012] Preferably, an X-axis waterproof cover is arranged on the X-axis slide and located outside the rotary worktable, the non-contact height measurement component is arranged on the X-axis waterproof cover, the knife trimming plate is fixedly arranged on the X-axis waterproof cover through a knife trimming mounting plate, protective cover mounting plates are fixedly arranged at both ends of the X-axis base, and an accordion cover is fixedly arranged between the protective cover mounting plate and the X-axis slide.

[0013] Preferably, the Y-axis slide assembly includes a Y-axis slide and a Y-axis motor, the lower end surface of the Y-axis slide is fixedly connected with a Y-axis nut seat and a Y-axis slider, a Y-axis guide rail that slides with the Y-axis slider is fixedly installed on the bed, a Y-axis motor is fixedly installed on the bed through a motor seat, the output shaft end of the Y-axis motor is transmission-connected to the Y-axis nut seat through a Y-axis lead screw, the lower end surface of the Y-axis nut seat is slidably connected to the Y-axis guide rail through the Y-axis slider, and the Z-axis slide assembly is arranged on the Y-axis slide.

[0014] Preferably, the Z-axis slide assembly includes a Z-axis base fixedly mounted on the Y-axis base, a Z-axis motor fixedly mounted on the Z-axis base, an output shaft end of the Z-axis motor is transmission-connected with a mounting sleeve, the spindle cutting assembly is fixedly mounted in the mounting sleeve, and the drive motor drives the spindle cutting assembly to perform an up and down swing motion of a fixed axis through a Z-axis transmission member.

[0015] Preferably, the Z-axis transmission assembly includes a Z-axis screw fixedly connected to the output shaft of the Z-axis motor, a Z-axis nut seat being threadedly connected to the Z-axis screw, a transmission block group being rotatably connected to the Z-axis nut seat, two sides of the Z-axis nut seat being fixedly connected to the transmission block group via springs, one end of the transmission block group away from the Z-axis nut seat being fixedly connected to the mounting sleeve, one side of the mounting sleeve being rotatably arranged above the Y-axis slide by cooperating with the Z-axis stand via a connecting shaft, and when the Z-axis nut seat moves up and down along the Z-axis screw, the mounting sleeve makes an up and down swinging motion driven by the transmission block group.

[0016] Preferably, a plurality of photoelectric switches are provided on the X-axis base, the Y-axis base and the Z-axis base, and a light shielding sheet cooperating with the photoelectric switches is provided on the X-axis slide, the Y-axis slide and the Z-axis slide.

[0017] Preferably, a set of mutually matching grating scales and grating reading heads are arranged between the X-axis slide and the X-axis base, and between the Y-axis slide and the Y-axis base.

[0018] (III) Beneficial effects

[0019] The present invention has the following beneficial effects:

[0020] The wafer dicing machine reduces the friction between the X-axis slide and the X-axis base when the slide moves, thereby improving the stability of the X-axis slide during movement, thereby improving the accuracy of wafer workpiece transportation on the rotating worktable, which is conducive to the subsequent high-precision dicing and cutting of wafer workpieces; the Y-axis slide adopts a three-rail support motion platform, which can effectively ensure the rigidity of the Y-axis motion platform and ensure long-term accuracy and stability. The nut is fixed on the slider of the middle guide rail and the Y-axis slide supported by the sliders of the two side guide rails, which can effectively ensure that the lead screw does not produce deflection during long-term high-frequency back-and-forth motion, and can effectively ensure the accuracy of the Y-axis motion. The non-contact height measurement component can detect the maximum outer diameter wear of the cutting edge to reduce tool wear and maintain blade stability; the knife repair plate can achieve online sharpening to improve efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the XYZ axial layout structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the disassembled structure of the Z-axis slide assembly of the present invention;

[0024] Figure 4 It is a schematic diagram of the layout structure of the transmission block group and the Z-axis nut seat of the present invention;

[0025] Figure 5 It is a schematic diagram of the layout structure of the Y-axis guide rail and the Y-axis nut seat of the present invention;

[0026] Figure 6 It is a schematic diagram of the structure of the rotary worktable of the present invention;

[0027] Figure 7 This is a schematic diagram of the overall structure of the X-axis slide assembly of the present invention;

[0028] Figure 8 It is a schematic diagram of the layout structure of the ceramic air cushion plate of the present invention.

[0029] In the figure: 1. Support frame; 2. Bed; 3. X-axis slide assembly; 31. Linear motor stator; 32. Linear motor mover; 33. X-axis motor mounting plate; 34. X-axis slide; 35. Air cushion mounting plate; 36. Ceramic air cushion plate; 37. X-axis guide plate; 38. X-axis limit block; 39. X-axis stop block; 310. Buffer rod; 311. Protective cover mounting plate; 312. Organ cover; 4. Rotary workbench; 41. X-axis waterproof cover; 42. Repair knife mounting plate; 43. Repair knife plate; 5. Y-axis slide assembly Parts; 51, Y-axis slide; 52, Y-axis nut seat; 53, Y-axis guide rail; 54, Y-axis motor; 55, Y-axis screw; 56, grating reading head; 57, Y-axis slider; 6, Z-axis slide assembly; 61, Z-axis base; 62, Z-axis motor; 63, Z-axis transmission assembly; 631, Z-axis screw; 632, Z-axis nut seat; 633, transmission block group; 634, connecting shaft; 64, Z-axis stand; 65, mounting sleeve; 7, spindle cutting assembly; 8, photoelectric switch; 9, shading sheet; 10, grating ruler. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figure 1 The present invention provides a technical solution: a wafer dicing machine, comprising a bed 2 and a rotating table 4 arranged on the bed 2, the rotating table 4 is moved to a predetermined position along the X-axis direction on the bed 2 by an X-axis slide assembly 3, the X-axis slide assembly 3 comprises an X-axis slide 34, a driving assembly for driving the X-axis slide 34 to move, and an X-axis base slidably connected to the X-axis slide 34, the X-axis slide 34 is air-floated and arranged on the X-axis base; a Y-axis slide assembly 5 is arranged on the bed 2, and a transmission connection is arranged on the Y-axis slide assembly 5 There is a Z-axis slide assembly 6, on which a spindle cutting assembly 7 is installed. Under the coordinated transmission of the X-axis slide assembly 3, the Y-axis slide assembly 5 and the Z-axis slide assembly 6, the spindle cutting assembly 7 can slice and cut the wafer workpiece clamped and fixed on the rotating worktable 4, and each slide assembly can restore to the original position after slicing and cutting; a knife trimming plate 43 and a non-contact height measuring assembly are arranged on the X-axis slide 34. The non-contact height measuring assembly is used to detect the maximum outer diameter wear of the cutting blade in the cutting assembly to reduce tool wear.

[0032] The present invention reduces the friction between the X-axis slide 34 and the X-axis base when the X-axis slide 34 moves by setting an X-axis slide assembly 3 with an air floating state, so that the stability of the X-axis slide 34 during the movement is improved, thereby improving the accuracy of the wafer workpiece transportation on the rotating worktable 4, which is beneficial to the subsequent high-precision dicing and cutting of the wafer workpiece; through the non-contact height measurement assembly, the maximum outer diameter wear of the cutting edge can be detected to reduce tool wear and maintain the stability of the blade; through the knife repair plate 43, online knife sharpening can be achieved to improve efficiency.

[0033] In this embodiment, a support frame 1 is fixedly provided on the lower end surface of the bed 2, and a movable wheel group for supporting storage is provided on the support frame 1.

[0034] Reference Figure 7 and 8 As shown, in this embodiment, the driving assembly includes a linear motor stator 31 and a linear motor mover 32. The linear motor stator 31 is fixedly arranged on the bed 2. The linear motor mover 32 is connected to the linear motor stator 31 in a transmission manner. The linear motor mover 32 is fixedly connected to the X-axis through the X-axis motor mounting plate 33. A plurality of ceramic air cushion plates 36 are fixedly connected to the X-axis slide 34 through the air cushion mounting plate 35. The end surface of the ceramic air cushion plate is in contact with the X-axis guide plate 37. The center position of the ceramic air cushion plate 36 is provided with an air outlet to match the air flotation condition of the external ventilation component. The X-axis slide 34 is driven by a linear motor. At the same time, the X-axis slide 34 and the X-axis base are coordinated and moved through the air flotation guide rail, which effectively reduces friction and increases the service life of the equipment, so that the X-axis slide 34 has higher movement accuracy and better stability.

[0035] Reference Figure 7 As shown, in this embodiment, an X-axis limit block 38 is fixedly provided on one side of the X-axis slide 34, an X-axis stopper 39 matching the X-axis limit block 38 is provided on the bed 2, and a buffer rod 310 is fixedly provided on the side where the X-axis stoppers 39 are close to each other. By providing the X-axis limit block 38 on one side of the X-axis slide 34, when the X-axis slide 34 is driven by the linear motor to move to a predetermined position, the X-axis stopper 39 can cooperate with the X-axis limit block 38 to limit the movement of the X-axis slide 34, and the buffer rod 310 can be placed to prevent deformation due to impact.

[0036] Reference Figure 2As shown, in this embodiment, an X-axis waterproof cover 41 is arranged on the X-axis slide 34 outside the rotary table 4, a non-contact height measurement component is arranged on the X-axis waterproof cover 41, a trimming plate 43 is fixedly arranged on the X-axis waterproof cover 41 through a trimming mounting plate 42, a protective cover mounting plate 311 is fixedly arranged at both ends of the X-axis base, and an accordion cover 312 is fixedly arranged between the protective cover mounting plate 311 and the X-axis slide 34. By setting the X-axis waterproof cover 41 and the accordion cover 312, it is possible to effectively prevent the debris and cutting water generated during the operation of the entire dicing machine from affecting the stable operation of the X-axis slide 34 and the rotary table 4.

[0037] Reference Figure 3 and 5 As shown, in this embodiment, the Y-axis slide assembly 5 includes a Y-axis slide 51 and a Y-axis motor 54, the lower end surface of the Y-axis slide 51 is fixedly connected with a Y-axis nut seat 52 and a Y-axis slider 57, a Y-axis guide rail 53 that cooperates with the Y-axis slider 57 and slides is fixedly installed on the bed 2, and a Y-axis motor 54 is fixedly installed on the bed 2 through a motor seat, and the output shaft end of the Y-axis motor 54 is transmission-connected with the Y-axis nut seat 52 through a Y-axis lead screw 55, and the lower end surface of the Y-axis nut seat 52 is slidably connected with the Y-axis guide rail 53 through a Y-axis slider 57, and the Z-axis slide assembly 6 is arranged on the Y-axis slide 51. The Y-axis motion platform adopts a three-guide rail support motion platform, which can effectively ensure the rigidity of the Y-axis motion platform and ensure long-term precision stability. The lead screw nut is fixed on the slider of the middle guide rail and the slide supported by the sliders of the two side guide rails, which can effectively ensure that the lead screw does not produce deflection during long-term back and forth high-frequency motion, and can effectively ensure the precision of the Y-axis motion.

[0038] In this embodiment, the Z-axis slide assembly 6 includes a Z-axis base 61 fixedly mounted on the Y-axis base, a Z-axis motor 62 fixedly mounted on the Z-axis base 61, an output shaft end of the Z-axis motor 62 is transmission-connected with a mounting sleeve 65, and a spindle cutting assembly 7 is fixedly mounted in the mounting sleeve 65. The driving motor drives the spindle cutting assembly 7 to perform a fixed-axis up and down swing motion through a Z-axis transmission member.

[0039] In this embodiment, the Z-axis transmission assembly 63 includes a Z-axis screw 631 fixedly connected to the output shaft of the Z-axis motor 62, a Z-axis nut seat 632 is threadedly connected to the Z-axis screw 631, a transmission block group 633 is rotatably connected to the Z-axis nut seat 632, both sides of the Z-axis nut seat 632 are fixedly connected to the transmission block group 633 through springs, one end of the transmission block group 633 away from the Z-axis nut seat 632 is fixedly connected to the mounting sleeve 65, one side of the mounting sleeve 65 is rotatably arranged above the Y-axis slide 51 through a connecting shaft 634 in cooperation with the Z-axis stand 64, when the Z-axis nut seat 632 moves up and down along the Z-axis screw 631, the mounting sleeve 65 performs an up and down swinging motion driven by the transmission block group 633.

[0040] In this embodiment, a plurality of photoelectric switches 8 are provided on the X-axis base, the Y-axis base and the Z-axis base 61, and light shielding sheets 9 cooperating with the photoelectric switches 8 are provided on the X-axis slide 34, the Y-axis slide 51 and the Z-axis slide. Photoelectric switches 8 are provided in the X-axis and Y-axis directions, and the left and right sides are travel limit switches to monitor the position of the slide; the middle photoelectric switch 8 is the origin switch, which is used for zeroing and precise positioning, improves the repeatability and reliability of the entire system, and also provides the possibility for efficient and precise operation.

[0041] In this embodiment, a set of mutually matching grating scales and grating reading heads 56 are provided between the X-axis slide 34 and the X-axis base, and between the Y-axis slide 51 and the Y-axis base. Figure 7 As shown, the grating ruler is mainly responsible for providing the measurement reference, and the grating reading head 56 is responsible for reading and transmitting the position information, forming a high-precision displacement measurement system. By setting the grating ruler, the optical principle of the grating can be used to measure the linear displacement; it has a large detection range, high detection accuracy, and fast response speed. The X-axis slide 34 is moved by the linear motor; when the X-axis slide 34 moves, the displacement of the slide is measured by the grating ruler until the slide is in a suitable position.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by ... does not exclude the existence of other identical elements in the process, method, article or device including the element".

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer dicing machine, comprising a bed and a rotating worktable arranged on the bed, characterized in that: The rotary table is moved to a predetermined position along the X-axis direction on the bed through an X-axis slide assembly, wherein the X-axis slide assembly includes an X-axis slide, a driving assembly for driving the X-axis slide to move, and an X-axis base slidably connected to the X-axis slide, and the X-axis slide is air-floated on the X-axis base; a Y-axis slide assembly is arranged on the bed, and a Z-axis slide assembly is transmission-connected to the Y-axis slide assembly, and a spindle cutting assembly is installed on the Z-axis slide assembly. Under the coordinated transmission of the X-axis slide assembly, the spindle cutting assembly can slice and cut the wafer workpiece clamped and fixed on the rotary table, and each slide assembly can restore to the origin position after slicing and cutting; a knife repair plate and a non-contact height measuring assembly are arranged on the X-axis slide, and the non-contact height measuring assembly is used to detect the maximum outer diameter wear of the cutting blade in the cutting assembly to reduce tool wear.

2. A wafer dicing machine according to claim 1, characterized in that: A supporting frame is fixedly arranged on the lower end surface of the bed, and a movable wheel group for supporting storage is arranged on the supporting frame.

3. A wafer dicing machine according to claim 1, characterized in that: The driving assembly includes a linear motor stator and a linear motor mover, the linear motor stator is fixedly arranged on the bed, the linear motor stator is transmission-connected with the linear motor mover, the linear motor mover is slidingly and fixedly connected to the X-axis through the X-axis motor mounting plate, a plurality of ceramic air cushion plates are fixedly connected to the X-axis slide through the air cushion mounting plate, the end surface of the ceramic air cushion plate is in contact with the X-axis guide plate, and an air outlet is arranged at the center of the ceramic air cushion plate to cooperate with the air flotation conditions of the external ventilation component.

4. A wafer dicing machine according to claim 3, characterized in that: An X-axis limit block is fixedly arranged on one side of the X-axis slide, an X-axis stopper matching the X-axis limit block is arranged on the bed, and a buffer rod is fixedly arranged on the sides of the X-axis stops that are close to each other.

5. A wafer dicing machine according to claim 4, characterized in that: An X-axis waterproof cover is arranged on the X-axis slide and located outside the rotary worktable. The non-contact height measurement component is arranged on the X-axis waterproof cover. The knife trimming plate is fixedly arranged on the X-axis waterproof cover through a knife trimming mounting plate. Protective cover mounting plates are fixedly arranged at both ends of the X-axis base. An accordion cover is fixedly arranged between the protective cover mounting plate and the X-axis slide.

6. A wafer dicing machine according to any one of claims 3 to 5, characterized in that: The Y-axis slide assembly includes a Y-axis slide and a Y-axis motor. The lower end surface of the Y-axis slide is fixedly connected with a Y-axis nut seat and a Y-axis slider. A Y-axis guide rail that slides with the Y-axis slider is fixedly installed on the bed. The Y-axis motor is fixedly installed on the bed through a motor seat. The output shaft end of the Y-axis motor is transmission-connected to the Y-axis nut seat through a Y-axis lead screw. The lower end surface of the Y-axis nut seat is slidably connected to the Y-axis guide rail through the Y-axis slider. The Z-axis slide assembly is arranged on the Y-axis slide.

7. A wafer dicing machine according to claim 6, characterized in that: The Z-axis slide assembly includes a Z-axis base fixedly mounted on a Y-axis base, a Z-axis motor fixedly mounted on the Z-axis base, an output shaft end of the Z-axis motor is transmission-connected with a mounting sleeve, the spindle cutting assembly is fixedly mounted in the mounting sleeve, and the drive motor drives the spindle cutting assembly to perform an up and down swing motion of a fixed axis through a Z-axis transmission member.

8. A wafer dicing machine according to claim 7, characterized in that: The Z-axis transmission assembly includes a Z-axis screw fixedly connected to the output shaft of the Z-axis motor, a Z-axis nut seat being threadedly connected to the Z-axis screw, a transmission block group being rotatably connected to the Z-axis nut seat, two sides of the Z-axis nut seat being fixedly connected to the transmission block group via springs, one end of the transmission block group away from the Z-axis nut seat being fixedly connected to the mounting sleeve, one side of the mounting sleeve being rotatably arranged above the Y-axis slide table through a connecting shaft in cooperation with the Z-axis stand, and when the Z-axis nut seat moves up and down along the Z-axis screw, the mounting sleeve performs an up and down swinging motion driven by the transmission block group.

9. A wafer dicing machine according to claim 7 or 8, characterized in that: The X-axis base, the Y-axis base and the Z-axis base are each provided with a plurality of photoelectric switches, and the X-axis slide, the Y-axis slide and the Z-axis slide are each provided with a light shielding sheet that cooperates with the photoelectric switches.

10. A wafer dicing machine according to claim 9, characterized in that: A set of mutually matching grating scales and grating reading heads are arranged between the X-axis slide and the X-axis base, and between the Y-axis slide and the Y-axis base.

Images