Swing sawing machine

Abstract

The invention discloses a swing sawing machine which is applied to sawing monocrystalline silicon crystals and comprises a swing clamping assembly and a fret saw assembly. The swing clamping assembly comprises a first driving part and a clamping part, the first driving part is connected with the clamping part, the first driving part is used for driving the clamping part to rotate, and the clamping part is used for clamping a crystal; the fret saw assembly comprises a second driving part and a cutting wheel train, the second driving part is connected with the cutting wheel train, and the second driving part is used for controlling the cutting wheel train to be close to or away from the clamping part; and the cutting wheel train is used for cutting the crystal clamped by the clamping part in the moving process. In the saw cutting process, the contact part and the stress point of the cutting wheel train and the crystal are continuously changed, so that the cutting length of each unit length cutting line is shortened, and the cutting resistance is reduced; meanwhile, due to the fact that the position of the workpiece is continuously changed in the cutting process, the cutting point can rapidly move, long-time cutting at the same position is avoided, and then the overall cutting efficiency is improved.

Description

Technical Field

[0001] The invention relates to the field of crystal cutting, in particular to a swing sawing machine. Background Art

[0002] In the existing material cutting process, flat cutting is generally used for cutting larger or harder materials. However, this flat cutting method has many disadvantages. When cutting such materials, the cutting process will be more laborious and require a lot of energy and time. In addition, if the cutting process is accelerated in order to increase the cutting speed, the surface quality of the cut material is often poor, and problems such as surface roughness, scratches, and deformation will occur, which seriously affects the subsequent processing and use performance of the product. This not only reduces production efficiency, but also increases production costs, because products with poor surface quality need to undergo additional post-processing processes such as grinding and trimming. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a swing sawing machine to solve the problem of low efficiency and poor quality in crystal cutting.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: A swing sawing machine, used for sawing single-crystal silicon crystals, comprises a swing clamping component and a wire saw component; The swing clamping assembly comprises a first driving part and a clamping part, wherein the first driving part is connected to the clamping part, the first driving part is used to drive the clamping part to perform rotational motion, and the clamping part is used to clamp the crystal; The wire saw assembly includes a second driving part and a cutting wheel train, wherein the second driving part is connected to the cutting wheel train, and the second driving part is used to control the cutting wheel train to approach or move away from the clamping part; the cutting wheel train is used to cut the crystal clamped by the clamping part during movement.

[0005] The beneficial effects of the present invention are: providing a swing sawing machine, driving the clamping part of the crystal to rotate, so that the crystal produces regular clockwise and counterclockwise swings, so that the contact part and the force point of the cutting wheel train and the crystal are constantly changed during the sawing process, so that the length of each unit length of the cutting line involved in the cutting becomes shorter, thereby reducing the cutting resistance; at the same time, since the workpiece constantly changes its position during the cutting process, the cutting point can move quickly, avoiding long-term cutting at the same position, thereby achieving an improvement in the overall cutting efficiency; in addition, compared with the traditional flat cutting method, the swing cutting constantly changes the cutting position during the cutting process, avoiding local overheating and stress concentration caused by long-term cutting at the same position, thereby effectively improving the surface quality of the material after cutting. The surface after cutting is flatter and smoother, reducing the generation of surface defects, and reducing the workload and cost of subsequent surface treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 It is a schematic diagram of the assembly of a swing sawing machine in an embodiment of the present invention; Figure 2 is a no-load schematic diagram of a clamping portion of a swing sawing machine in an embodiment of the present invention; Figure 3 is a load diagram of a clamping portion of a swing sawing machine in an embodiment of the present invention; Figure 4 A schematic diagram of a support wheel of a clamping part of a swing sawing machine in an embodiment of the present invention; Figure 5 is a schematic diagram of a wire saw assembly of a swing sawing machine in an embodiment of the present invention; Figure 6 is a schematic diagram of a V-shaped guide rail of a swing sawing machine in an embodiment of the present invention; Figure 7 is a cross-sectional view of a V-shaped guide rail of a swing sawing machine in an embodiment of the present invention; Figure 8 is a schematic diagram of a cutting gear train of a swing sawing machine in an embodiment of the present invention; Description of labels: 1. Swing clamping assembly; 11. First driving unit; 12. Clamping unit; 121. Rotating disk; 1211. Turntable; 1212. Flange; 122. Fixing clamp; 123. Support wheel; 124. Adapter plate; 2. Wire saw assembly; 21. Second driving unit; 22. Cutting wheel train; 221. Cutting wire; 222. Mounting panel; 223. Driving wheel; 224. Driven wheel; 225. Tensioning wheel; 23. Power arm; 24. Auxiliary arm; 25. V-shaped guide rail; 3. Conveying assembly. DETAILED DESCRIPTION

[0007] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.

[0008] Please refer to Figures 1 to 3 , a swing sawing machine, used for sawing single crystal silicon crystal, comprising a swing clamping component 1 and a wire saw component 2; The swing clamping assembly 1 comprises a first driving part 11 and a clamping part 12, wherein the first driving part 11 is connected to the clamping part 12, the first driving part 11 is used to drive the clamping part 12 to rotate, and the clamping part 12 is used to clamp the crystal; The wire saw assembly 2 includes a second driving part 21 and a cutting wheel train 22. The second driving part 21 is connected to the cutting wheel train 22. The second driving part 21 is used to control the cutting wheel train 22 to approach or move away from the clamping part 12. The cutting wheel train 22 is used to cut the crystal clamped by the clamping part 12 during movement.

[0009] From the above description, it can be seen that the beneficial effects of the present invention are: providing a swing sawing machine, driving the clamping part 12 that clamps the crystal to rotate, so that the crystal produces regular clockwise and counterclockwise swings, so that the contact part and force point of the cutting wheel train 22 and the crystal are constantly changing during the sawing process, so that the length of each unit length of the cutting line 221 involved in the cutting becomes shorter, thereby reducing the cutting resistance; at the same time, since the workpiece constantly changes its position during the cutting process, the cutting point can move quickly, avoiding long-term cutting at the same position, thereby achieving an improvement in the overall cutting efficiency; in addition, compared with the traditional flat cutting method, the swing cutting constantly changes the cutting position during the cutting process, avoiding local overheating and stress concentration caused by long-term cutting at the same position, thereby effectively improving the surface quality of the material after cutting. The surface after cutting is flatter and smoother, reducing the generation of surface defects, and reducing the workload and cost of subsequent surface treatment.

[0010] In terms of chip removal and cooling, during the swing cutting process, the chips can be quickly removed as the workpiece swings, avoiding the accumulation of chips in the cutting area and reducing the interference of chips on the cutting process. At the same time, as the workpiece constantly changes the cutting position, the cutting area can dissipate heat in time, which is conducive to cooling. This not only increases the service life of the tool, but also further ensures the stability of the cutting quality.

[0011] Please refer to Figures 2 to 4 In some embodiments, the clamping portion 12 includes a rotating disk 121, a fixing clamp 122 and a supporting wheel 123; The axis of the rotating disk 121 is arranged parallel to the first direction, and the driving unit is connected to the rotating disk 121 and is used to drive the rotating disk 121 to rotate; The fixing clamps 122 are symmetrically arranged on both sides of the circumference of the rotating disk 121 and extend toward the first direction, and at least a portion of the fixing clamps 122 is used to clamp the crystal; The supporting wheel 123 abuts against a circumferential surface of the rotating disk 121 .

[0012] As can be seen from the above description, the design of the clamping portion 12 includes a combination of a rotating disk 121, a fixed clamp 122 and a support wheel 123, which enhances the stability of the clamping portion 12 during the cutting process. The setting of the rotating disk 121 enables the clamping portion 12 to rotate in a first direction, so that the cutting path can be optimized by precisely controlling the rotation angle during the cutting process. The symmetrical installation of the fixed clamp 122 and the rotating disk 121 enables the crystal to obtain a uniform and stable clamping force during the clamping process, avoiding the risk of crystal damage due to uneven clamping. The setting of the support wheel 123 helps to reduce the friction of the rotating disk 121, reduce energy consumption and wear during the cutting process, and at the same time ensure the smoothness of the rotation of the clamping portion 12, thereby improving the cutting efficiency and surface quality. At the same time, a support wheel 123 is added to assist in supporting the entire clamping assembly. The principle is that since the entire rotating disk and the receiving plate 124 constitute an L-shaped tooling cantilever, if the receiving plate 124 is too long, the tooling will become unstable and the cutting accuracy will be reduced. Adding a support wheel 123 can also help improve the rigidity of the L-shaped tooling.

[0013] The fixing clip 122 may be a locking fixture that uses a locking structure to firmly fix the crystal; or it may be a threaded fixture that uses a threaded structure to fix the two ends of the crystal.

[0014] Specifically, the first direction is parallel to a horizontal plane, the number of the supporting wheels 123 is at least two, and the supporting wheels 123 are symmetrically arranged at the bottom of the circumference of the rotating disk 121 .

[0015] From the above description, it can be seen that the number of support wheels 123 is at least two, and they are symmetrically arranged at the bottom of the rotating disk 121. The support wheels 123 are used to share the gravity of the clamping part 12 and reduce the load of the first driving member. This design enhances the supporting force of the rotating disk 121 and ensures that the rotating disk 121 is not prone to tilt or offset during the swinging process. The symmetrical setting of the support wheels 123 can effectively distribute the load, avoid unbalanced mechanical effects during the cutting process, and improve the stability and precision of the clamping part 12. In addition, the design of the support wheels 123 reduces the friction between the rotating disk 121 and other components, reduces energy loss and excessive wear, and thus extends the service life of the machine. In summary, the setting of the support wheels 123 improves the overall working efficiency and long-term stability of the swing sawing machine.

[0016] Preferably, the clamping portion 12 further includes a receiving plate 124 , the receiving plate 124 is vertically connected to the rotating disk 121 , and the receiving plate 124 is disposed at one end of the rotating disk 121 close to the supporting wheel 123 .

[0017] From the above description, it can be seen that the receiving plate 124 is vertically connected to the rotating disk 121. While clamping the crystal, the receiving plate 124 is used to provide support at the bottom of the crystal, ensuring that the clamping part 12 can firmly clamp the crystal during the rotation process, and preventing the clamping part 12 from unnecessary displacement or vibration during the cutting process. The design of the receiving plate 124 enables the clamping part 12 to better adapt to different cutting requirements, especially when cutting larger or harder materials, and can effectively disperse the impact force generated during the cutting process to avoid damage to the crystal due to uneven force during the cutting process. The setting of the receiving plate 124 improves the overall stability of the machine, making the cutting process smoother and more efficient.

[0018] In addition, the rotating disk 121 includes a turntable 1211 and a flange 1212 , the turntable 1211 is connected to the first driving part 11 ; the flange 1212 is assembled and connected to the turntable 1211 , and the fixing clamp 122 is arranged on the flange 1212 ; the supporting wheel 123 abuts against the circumferential surface of the flange 1212 .

[0019] As can be seen from the above description, the turntable 1211 is connected to the first driving unit 11, so that the rotating disk 121 can obtain more precise drive and control, thereby ensuring the accuracy and stability during the cutting process. The assembly connection between the flange 1212 and the turntable 1211 enables the fixing clamp 122 to be firmly mounted on the rotating disk 121, ensuring that the clamping force is evenly distributed when clamping the crystal. At the same time, the flange 1212 of matching specifications can be replaced according to the size of the crystal to be cut, thereby improving the versatility of the device; the support wheel 123 is in contact with the circumferential surface of the flange 1212, which helps the stable rotation of the support disk, reduces friction, and avoids an unsmooth cutting process due to excessive wear.

[0020] Please refer to Figures 5 to 8 In some embodiments, the cutting wheel train 22 includes a cutting line 221, a mounting panel 222, at least one driving wheel 223 and at least one driven wheel 224, wherein the driving wheel 223 and the driven wheel 224 are disposed on the mounting panel 222, and the cutting line 221 is slidably disposed between the driving wheel 223 and the driven wheel 224; preferably, the cutting wheel train further includes a tensioning wheel 225, which is disposed on the mounting panel 222 and is used to maintain the tension required for the cutting line 221 to rotate and cut; As can be seen from the above description, the wire saw assembly 2 includes a cutting wire 221, a mounting panel 222, at least one driving wheel 223 and at least one driven wheel 224, which can ensure that the cutting wire 221 maintains efficient operation during the cutting process. The arrangement of the driving wheel 223 and the driven wheel 224 makes the cutting wire 221 more stable during the cutting process, reducing the looseness and swing during the cutting process. The design of the cutting wire 221 sliding between the driving wheel 223, the driven wheel 224 and the tensioning wheel 225 ensures the tension and stability of the cutting wire 221, thereby reducing the vibration and noise during the cutting process and improving the cutting accuracy. In addition, the arrangement of the mounting panel 222 enables all components to be precisely docked, ensuring smooth operation during the cutting process.

[0021] Specifically, along with the rotation of the clamping part 12 , the cutting line 221 adaptively adjusts its shape during the process of cutting the crystal.

[0022] As can be seen from the above description, the cutting line 221 can adaptively adjust its shape during the process of cutting the crystal, and this design improves the adaptability and flexibility of cutting. As the clamping part 12 rotates, the cutting line 221 can adjust its shape in real time according to the changes in the shape and position of the crystal, thereby ensuring the continuity and stability of the cutting process. By adaptively adjusting the shape of the cutting line 221, excessive friction or uneven cutting caused by the fixed shape of the cutting line 221 can be avoided, further improving the cutting efficiency and cutting surface quality. This design effectively improves the intelligence level of the machine, allowing the cutting machine to automatically adjust under different conditions, improving its scope of application and processing capabilities.

[0023] Specifically, during the cutting process, the cutting line 221 is adaptively adjusted to an arc shape.

[0024] Please refer to Figure 1 In some embodiments, a transmission component 3 is further included, wherein the transmission component 3 is slidably connected to the swing clamping component 1, and the transmission component 3 is used to control the swing clamping component 1 to approach or move away from the wire saw component 2.

[0025] It can be seen from the above description that by providing the conveying component 3, it is convenient to transport the cut or uncut crystals to outside the cutting area, so as to facilitate the loading and unloading of the device.

[0026] Please refer to Figures 5 to 7In some embodiments, the wire saw assembly 2 also includes a power arm 23 and an auxiliary arm 24, and the power arm 23 and the auxiliary arm 24 are respectively arranged on both sides of the cutting wheel train 22 and are respectively slidably connected to the two sides of the cutting wheel train 22; the second driving part 21 is used to control the movement of the cutting wheel train 22 along the length direction of the power arm 23; the auxiliary arm 24 is provided with a V-shaped guide rail 25, and the cutting wheel train 22 is slidably connected to the auxiliary arm 24 through the V-shaped guide rail 25.

[0027] Since the traditional gantry structure needs to ensure high-precision processing and installation of the guide grooves of the two columns, its processing process is complicated and prone to errors. At the same time, since it involves the processing of two columns, it is difficult to control the processing accuracy, and it is difficult to ensure that the guide grooves of the two columns are accurately consistent in height, parallelism, verticality, etc. In order to solve the above problems, in the above implementation, the power arm 23 is used for transmission, and the auxiliary arm 24 is only driven, avoiding the problem that the traditional gantry requires high-precision control of the double-column setting. In this example, only the power arm 23 needs to be controlled with high precision, and a V-shaped guide rail 25 is set on the auxiliary arm 24. Its V-shaped groove surface can cooperate with the matching roller or slider to provide lateral support and guiding functions, thereby further improving the cutting accuracy and stability.

[0028] In some embodiments, the rotation range of the clamping portion 12 is -5° to 5°.

[0029] Since single crystal silicon is a brittle material, it is not as ductile or tough as metal. This structure also makes single crystal silicon prone to brittle fracture under external force. In order to avoid brittle fracture during the rotational cutting process of single crystal silicon and ensure the cutting effect, after many tests and evaluations, the rotation amplitude of the clamping part 12 is optimally controlled at -5° to 5°, so as to ensure that the crystal is subjected to uniform mechanical action during the cutting process. This design avoids crystal damage caused by excessive rotation and ensures the stability of the cutting line 221 during the cutting process.

[0030] In summary, the swing sawing machine provided by the present invention solves some key problems in the single crystal silicon cutting process in the existing cutting technology, especially showing significant advantages in improving cutting efficiency, improving cutting surface quality, optimizing cutting stability and extending equipment service life.

[0031] First, the present invention designs a swing clamping assembly so that the crystal can swing clockwise and counterclockwise regularly during the cutting process, so that the time for each unit length of the cutting line to participate in the cutting is shortened, the cutting resistance is reduced, and the overheating and stress concentration caused by long-term cutting at the same position are avoided, thereby improving the cutting efficiency. Swing cutting also effectively improves the cutting surface quality. The surface of the crystal after cutting is smoother and flatter, surface defects are reduced, and the demand and cost of subsequent surface treatment are reduced.

[0032] Secondly, the chips can be discharged quickly during the swing cutting process, avoiding the accumulation of chips in the cutting area and interference with the cutting process. At the same time, the continuous movement of the workpiece promotes the heat dissipation of the cutting area, helps to reduce the temperature during the cutting process, reduces tool wear, thereby increasing the service life of the tool and ensuring the stability of the cutting quality.

[0033] In terms of the clamping part design, a combination of a rotating disk, a fixed clamp and a support wheel is used to enhance the stability of the clamping process. The precise control of the rotating disk enables the clamping part to optimize the cutting path by adjusting the angle reasonably during the cutting process. The symmetrical setting of the support wheel reduces the burden on the first drive part, improves the stability of the clamping part and reduces energy consumption. In addition, the design of the receiving plate provides additional support for the clamped crystal, preventing the crystal from shifting or vibrating during the clamping process.

[0034] The design of the cutting wire assembly ensures the tension and stability of the cutting wire. At the same time, the cutting wire can adaptively adjust its shape to adapt to the changes of the crystal during the cutting process, thereby improving the cutting efficiency and cutting accuracy.

[0035] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A swing sawing machine, used for sawing single crystal silicon crystals, characterized in that: Includes a swing clamp assembly and a wire saw assembly; The swing clamping assembly comprises a first driving part and a clamping part, wherein the first driving part is connected to the clamping part, the first driving part is used to drive the clamping part to perform rotational motion, and the clamping part is used to clamp the crystal; The wire saw assembly includes a second driving part and a cutting wheel train, wherein the second driving part is connected to the cutting wheel train, and the second driving part is used to control the cutting wheel train to approach or move away from the clamping part; the cutting wheel train is used to cut the crystal clamped by the clamping part during movement.

2. The oscillating sawing machine according to claim 1, characterized in that: The clamping part includes a rotating disk, a fixing clamp and a supporting wheel; The axis of the rotating disk is arranged parallel to the first direction, and the driving part is connected to the rotating disk and is used to drive the rotating disk to rotate; The fixing clamps are symmetrically arranged on both sides of the circumferential surface of the rotating disk and extend toward the first direction, and at least a part of the fixing clamps is used to clamp the crystal; The supporting wheel abuts against the circumferential surface of the rotating disk.

3. The oscillating sawing machine according to claim 2, characterized in that: The first direction is parallel to a horizontal plane, the number of the supporting wheels is at least two, and the supporting wheels are symmetrically arranged at the bottom of the circumferential surface of the rotating disk.

4. The oscillating sawing machine according to claim 3, characterized in that: The clamping portion further comprises a receiving plate, the receiving plate is vertically connected to the rotating disk, and the receiving plate is arranged at one end of the rotating disk close to the supporting wheel.

5. The oscillating sawing machine according to claim 2, characterized in that: The rotating disk includes a rotating disk and a flange, the rotating disk is connected to the first driving part; the flange is assembled and connected to the rotating disk, and the fixing clamp is arranged on the flange; the supporting wheel at least abuts against the circumferential surface of the flange.

6. The oscillating sawing machine according to claim 1, characterized in that: The cutting wheel system comprises a cutting line, a mounting panel, at least one driving wheel and at least one driven wheel. The driving wheel and the driven wheel are arranged on the mounting panel, and the cutting line is slidably arranged between the driving wheel and the driven wheel.

7. The oscillating sawing machine according to claim 6, characterized in that: Along with the rotation of the clamping part, the cutting wire adaptively adjusts its shape during the process of cutting the crystal.

8. The oscillating sawing machine according to claim 1, characterized in that: It also includes a transmission component, which is slidably connected to the swing clamping component, and the transmission component is used to control the swing clamping component to move closer to or farther away from the wire saw component.

9. The oscillating sawing machine according to claim 1, characterized in that: The wire saw assembly also includes a power arm and an auxiliary arm, which are respectively arranged on both sides of the cutting wheel train and are respectively slidably connected to both sides of the cutting wheel train; the second driving part is used to control the movement of the cutting wheel train along the length direction of the power arm; the auxiliary arm is provided with a V-shaped guide rail, and the cutting wheel train is slidably connected to the auxiliary arm through the V-shaped guide rail.

10. The oscillating sawing machine according to claim 1, characterized in that: The rotation range of the clamping portion is from -5° to 5°.

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