Coated article and method for manufacturing coated article

Abstract

The present application relates to a coated article and a method for manufacturing a coated article. The coated article includes a doped TFMG layer and / or an undoped TFMG layer disposed on and optionally in contact with a substrate. A top layer is disposed on the TFMG layer and optionally in contact with the TFMG layer. The top layer includes a metal-containing layer and / or a carbon-containing layer. The coated article may also include a doped TFMG layer and an undoped TFMG layer, and a leveling primer layer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 544,254, filed on October 16, 2023, the disclosure of which is hereby incorporated by reference in its entirety. Technical Field

[0002] In at least one aspect, the present invention is directed to coated articles comprising one or more thin film metallic glass layers, and in particular to coated articles having a TFMG support layer. Background Art

[0003] Electroplating is a coating process used to provide corrosion-resistant and decorative metal or metal alloy coatings to a variety of objects. Although electroplating performs well, it presents many environmental issues. Therefore, metal or metal compound PVD layers have been used to replace Ni in conventional Ni-Cr electroplated stacks for plumbing, door hardware, and automotive decorative applications. Due to the columnar microstructure of the thin film process, the corrosion resistance and durability of the PVD layer (e.g., pure Ni) are generally inferior to conventional Ni plating.

[0004] Therefore, there is a need for improved environmentally friendly coating methods for applying corrosion resistant and decorative metal coatings. Summary of the invention

[0005] In at least one aspect, a coated article is provided. The coated article comprises a substrate and a doped thin film metallic glass (TFMG) layer and / or an undoped thin film metallic glass (TFMG) layer disposed on the substrate. A top layer is disposed on and optionally contacts the doped TFMG layer and / or the undoped TFMG layer. Advantageously, the top layer comprises a metal-containing layer or a carbon-containing layer.

[0006] In another aspect, a coated article includes an undoped TFMG, a doped TFMG layer, and a leveling primer layer.

[0007] In another aspect, a method for making a coated article is provided. The method comprises the steps of depositing a doped thin film metallic glass (TFMG) layer and / or an undoped thin film metallic glass (TFMG) layer on a substrate, and depositing a top layer on the doped TFMG layer and / or the undoped TFMG layer by physical vapor deposition. Advantageously, the top layer comprises a metal-containing layer or a carbon-containing layer.

[0008] The foregoing summary is illustrative only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] For a further understanding of the nature, objects and advantages of the present disclosure, reference should be made to the following detailed description, read in conjunction with the following drawings, in which like reference numerals represent like elements and in which:

[0010] Figure 1 . Schematic cross section of a coated article including a TFMG layer and a top layer.

[0011] Figure 2 . Schematic cross section of a coated article including a TFMG layer, a doped TFMG layer and a top layer.

[0012] Figure 3 . Schematic cross section of a coated article including a leveling primer layer, a TFMG layer and a top layer.

[0013] Figure 4 . Schematic cross section of a coated article including a leveling primer layer, a TFMG layer, a doped TFMG layer and a top layer.

[0014] Figure 5A , 5B , 5C and 5D. Schematic flow charts depicting methods of making coated articles. DETAILED DESCRIPTION

[0015] Reference will now be made in detail to the presently preferred compositions, embodiments and methods of the present invention, which constitute the best modes of carrying out the present invention known to the inventors at present. The accompanying drawings are not necessarily drawn to scale. However, it should be understood that the disclosed embodiments are merely examples of the present invention, which can be implemented in different and alternative forms. Therefore, the specific details disclosed herein should not be interpreted as limiting, but only as representative benchmarks for any aspect of the present invention and / or as representative benchmarks for teaching those skilled in the art to use the present invention in a variety of ways.

[0016] Except in the examples or otherwise explicitly stated, all numerical quantities in this specification indicating the amount of material or reaction and / or use conditions should be understood as being modified by the word "about" when describing the broadest scope of the invention. Practice within the stated numerical limits is generally preferred. And, unless expressly stated to the contrary: percentages, "parts of..." and ratios are by weight; the term "polymer" includes "oligomers", "copolymers", "terpolymers", etc.; unless otherwise stated, the molecular weight provided for any polymer refers to the weight average molecular weight; the description of a group or class of materials suitable or preferred for a given object in conjunction with the present invention means that any mixture of two or more of the members of the group or class is equally suitable or preferred; the description of the components in chemical terms refers to the components when added to any combination specified in this specification, and does not necessarily exclude chemical interactions that occur among the components of the mixture once mixed; the first definition of an acronym or other abbreviation applies to all subsequent uses of the same abbreviation in this article, and applies to normal expression variants of the initially defined abbreviation with necessary modifications; and, unless expressly stated to the contrary, the measurement of the same property is determined by the same technology for reference to the property before and after.

[0017] It should also be understood that the present invention is not limited to the specific embodiments and methods described below, as specific components and / or conditions may of course vary. In addition, the terminology used herein is only for the purpose of describing specific embodiments of the present invention, and is not intended to be limiting in any way.

[0018] It must also be noted that, as used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. For example, a component mentioned in the singular is intended to include plural components.

[0019] The term "comprising" is synonymous with "including," "having," "containing," or "characterized by." These terms are inclusive and open-ended and do not exclude additional, unrecited elements or method steps.

[0020] The phrase "consisting of" excludes any element, step, or ingredient not specified in the claim. When the phrase appears in a clause of the body of a claim, rather than immediately following the preamble, it is limited only to the elements set forth in that clause; other elements are not excluded from the claim as a whole.

[0021] The phrase "consisting essentially of limits the scope of a claim to the specified materials or steps, plus those that do not materially affect the basic and novel characteristic(s) of the claimed subject matter.

[0022] With respect to the terms "comprising," "consisting of," and "consisting essentially of," when one of these three terms is used herein, the presently disclosed and claimed subject matter may include the use of either of the other two terms.

[0023] The phrase “composed of” means “comprising” or “including.” Typically, the phrase is used to indicate that an object is formed from a material.

[0024] It should also be understood that the integer range clearly includes all intermediate integers. For example, the integer range 1-10 clearly includes 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10. Similarly, the range 1 to 100 includes 1, 2, 3, 4 ... 97, 98, 99, 100. Similarly, when any range is needed, the difference between the upper limit and the lower limit can be divided by the intermediate digit of the increment of 10 as an alternative upper limit or lower limit. For example, if the scope is 1.1 to 2.1, the following numbers 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9 and 2.0 can be selected as the lower limit or upper limit. In the specific examples set forth herein, concentration, temperature and reaction conditions (for example, pressure, pH, etc.) can be implemented by being expressed as a value rounded to three significant figures plus or minus 50%. In a refinement, the concentration, temperature, and reaction conditions (e.g., pressure, pH, etc.) may be implemented with values ​​expressed as rounding the values ​​provided in the examples to three significant figures plus or minus 30%. In another refinement, the concentration, temperature, and reaction conditions (e.g., pH, etc.) may be implemented with values ​​expressed as rounding the values ​​provided in the examples to three significant figures plus or minus 10%.

[0025] abbreviation:

[0026] "ABS" means acrylonitrile butadiene styrene.

[0027] "at. %" means atomic percent.

[0028] “HiPIMS” means high power impulse magnetron sputtering.

[0029] "PVD" means physical vapor deposition.

[0030] "TFMG" means Thin Film Metallic Glass.

[0031] The term "thin film metallic glass" refers to a metallic material that is amorphous and lacks the crystalline structure typically found in conventional metals. The amorphous or non-crystalline structure of thin film metallic glass provides various properties, such as high strength, hardness, and corrosion resistance.

[0032] "Atomic percent" refers to the proportion of the total number of atoms of a particular element in an alloy or compound, expressed as a percentage of the total number of atoms in the mixture. In other words, it describes the fraction of atoms of a particular element relative to the total number of atoms of all elements present in the material.

[0033] refer to Figure 1 , provides a schematic cross-section of a coated article. Coated article 10 1 A substrate 12 is included. A doped thin film metallic glass (TFMG) 16 and / or an undoped TFMG layer 14 is disposed on and optionally contacts the substrate 12. A top layer 20 is disposed on and optionally contacts the undoped TFMG layer 14. Advantageously, the top layer includes a metal-containing layer and / or a carbon-containing layer.

[0034] In such Figure 2 In the depicted variation, the doped TFMG layer is inserted between the undoped TFMG layer and the top layer. 2 A substrate 12 is included. An undoped TFMG layer 14 is disposed on the substrate 12 and optionally contacts the substrate. A doped TFMG layer 16 is disposed on the undoped TFMG layer 14 and optionally contacts the undoped TFMG layer. A top layer 20 is disposed on the doped TFMG layer 16 and optionally contacts the doped TFMG layer. The doped TFMG layer 16 is a TFMG layer that contains a dopant to change properties such as stability, hardness, corrosion resistance, etc. Typically, the TFMG layer contains a TFMG composition as described herein and a dopant. In this case, the dopant is a foreign element that is intentionally added to the TFMG in a small amount to change its properties. In an improved embodiment, the dopant may be present in an amount of 0.01 weight percent to 5 weight percent of the total weight of the doped TFMG layer. Alternatively, the dopant may be present in an amount of 0.5 atomic percent to 20 atomic percent. In some refinements, the dopant may be present in an amount of at least 0.2 atomic percent, 0.5 atomic percent, 1 atomic percent, 2 atomic percent, 3 atomic percent, or 5 atomic percent, and at most 20 atomic percent, 18 atomic percent, 15 atomic percent, 10 atomic percent, 8 atomic percent, 5 atomic percent, or 3 atomic percent.

[0035] In such Figure 3 In the depicted variant, a leveling primer layer is inserted between the substrate and the undoped TFMG layer. 3A substrate 12 is included. A leveling primer layer 24 is disposed on the substrate 12 and optionally contacts the substrate. An undoped TFMG layer 14 is disposed on the leveling primer layer 24 and optionally contacts the leveling primer layer. A top layer 20 is disposed on the undoped TFMG layer 14 and optionally contacts the undoped TFMG layer. As explained above, the top layer includes a metal-containing layer or a carbon-containing layer.

[0036] In such Figure 4 In the depicted variation, a leveling primer layer is interposed between the substrate and the undoped TFMG layer, and a doped TFMG layer is interposed between the undoped TFMG layer and the metal layer. 4 A substrate 12 is included. A leveling primer layer 24 is disposed on the substrate 12 and optionally contacts the substrate. An undoped TFMG layer 14 is disposed on the leveling primer layer 24 and optionally contacts the leveling primer layer. A doped TFMG layer 16 is disposed on the undoped TFMG layer 14 and optionally contacts the undoped TFMG layer. A top layer 20 is disposed on the doped TFMG layer 16 and optionally contacts the doped TFMG layer. As described above, the top layer includes a metal-containing layer or a carbon-containing layer.

[0037] refer to Figure 1 , 2 , 3 and 4, each coated article includes a top layer that is a metal layer or a carbon layer. In an improvement, the top layer is a metal layer, a metal compound layer, or a metal alloy layer. The metal layer or metal alloy layer or metal compound layer can be formed by physical vapor deposition techniques such as cathode arc deposition, magnetron sputtering, evaporation, etc. In another improvement, the top layer includes metal chromium, metal nickel, or its alloy. In another improvement, the top layer includes a component selected from the group consisting of ZrN, ZrCN, ZrO2, ZrOC, diamond-like carbon (DLC), and a combination thereof. Typically, the top layer has a thickness of about 0.2 microns to 1 micron. In some improvements, the top layer has a thickness of at least 0.1 micron, 0.2 micron, 0.3 micron, 0.4 micron, or 0.5 micron and a thickness of at most 2 microns, 1.5 microns, 1 micron, 0.7 micron, or 0.6 micron.

[0038] refer to Figure 1 , 2, 3 and 4, each coated article includes an undoped TFMG layer and / or an optional doped TFMG layer. Typically, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 each independently have a thickness of about 0.5 to 10 microns. In some refinements, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 each independently have a thickness of at least 0.3 microns, 0.5 microns, 1 micron, 1.5 microns, 2 microns, 3 microns, 4 microns, or 5 microns, and at most 10 microns, 9 microns, 8 microns, 7 microns, 6 microns, or 5 microns.

[0039] In another aspect, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 independently comprise a base element, such as zirconium, copper, nickel, titanium, molybdenum, or a combination thereof. In this case, the base element is the element having the largest atomic percentage. In a refinement, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 independently comprise a base element and an alloying element selected from the group consisting of copper, aluminum, titanium, silicon, nickel, boron, tungsten, chromium, and a combination thereof. In a refinement, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 are independently based on zirconium (e.g., comprising zirconium as a major element). Typically, a zirconium-based TMFG has about 50 to 65% zirconium by atomic percentage. In another refinement, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 independently comprise a zirconium-copper alloy, which typically has 50 to 65% zirconium by atomic percentage and 15 to 30% copper by atomic percentage, with any remainder being additional alloying elements or dopants. Examples of zirconium-based systems include Zr-Cu-Al-Ni compositions such as Zr 60 Cu 24 Al 11 Ni5, Zr-Ti-B-Si composites and Zr-Ti-Ni composites such as Zr 46 Ti 26 Ni 28. It should be understood that any subscript of a chemical formula may be practiced within 20%, 10%, 5%, or 1% of the indicated value. In a refinement, the Zr-Cu-Al-Ni composition comprises 50-65 atomic percent zirconium, 15-30 atomic percent copper, 5-15 atomic percent aluminum, and nickel in an amount of 2-10 atomic percent nickel. In a refinement, the Zr-Ti-B-Si composition comprises 50-60 atomic percent zirconium, 10-30 atomic percent titanium, 1-10 atomic percent boron, and 5-15 atomic percent silicon. In a refinement, the Zr-Ti-Ni composition comprises 40-60 atomic percent zirconium, 10-30 atomic percent titanium, and 5-20 atomic percent nickel. In another refinement, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 are independently Zr-B systems. In a refinement, the Zr-B system comprises 60 to 90 atomic % zirconium and 5 to 40 atomic % boron, with any balance being additional alloying elements or dopants. In a refinement, the Zr-B system is combined with titanium and silicon to form a Zr-Ti-B-Si composition. In another refinement, the Zr-Ti-B-Si composition comprises 50-65 atomic % zirconium, 5-15 atomic % boron, 10-30 atomic % titanium, and 5-15 atomic % silicon.

[0040] In another aspect, the undoped TFMG layer 14 and the optionally doped TFMG layer 16 are independently a cobalt system, such as a Mo-Co-B composition. In a refinement, the Mo-Co-B composition comprises 40-60 atomic percent molybdenum, 20-40 atomic percent cobalt, and 5-20 atomic percent boron, with any balance being additional alloying elements or dopants.

[0041] refer to Figure 1 , 2, 3 and 4, examples of dopants include, but are not limited to, nitrogen (N), oxygen (O), carbon (C), silicon (Si), and the like. Nitrogen is generally introduced as a dopant to improve mechanical properties, such as hardness and wear resistance. The strong electronegativity of nitrogen leads to a denser and more tightly packed structure in the TFMG, which reduces the interatomic distance and enhances hardness and thermal stability. Nitrogen also contributes to improved corrosion resistance in environments with high humidity or salinity. In the improved scheme, nitrogen is present in an amount of 1 to 10 atomic %. Oxygen is generally used as a dopant to enhance the corrosion resistance of the TFMG. By forming an oxide layer or introducing oxygen into an amorphous matrix, the TFMG becomes more resistant to oxidation and environmental degradation. Oxygen also helps to passivate the surface, thereby reducing reactivity in an aggressive environment. In the improved scheme, oxygen is present in an amount of 1 to 5 atomic %. Carbon doping can significantly improve hardness and mechanical strength. This is particularly common in applications where wear resistance is critical, such as cutting tools or in high friction environments. Carbon can also contribute to improved tribological properties by reducing friction. In a refinement, carbon is present in an amount of 0.5 to 5 atomic percent. Silicon is typically added to improve the heat resistance and oxidation resistance of the TFMG. Silicon forms a protective oxide layer on the surface, making the material more stable at elevated temperatures and in corrosive environments. Si-doped TFMGs are often used in high temperature applications or where long-term stability in harsh environments is required. In a refinement, silicon is present in an amount of 5 to 20 atomic percent. In another aspect, the top layer 14 includes a metal-containing layer or a carbon-containing layer, as described in more detail below.

[0042] Additional details on the use of TFMG in multilayer coatings can be found in the following references: PakmanYu, Wahyu Diyatmika, Niklas et al., "Thin film metallic glasses: Properties, applications, and future," Journal of Applied Physics, Vol. 127, No. 030901, 2020, DOI: 10.1063 / 1.5122884, which is hereby incorporated by reference in its entirety. TFMGs offer a unique combination of smooth surfaces, excellent hardness, corrosion resistance, and low surface energy, making them ideal for multilayer coatings that require durability, aesthetics, and protection from environmental degradation.

[0043] The composition of TFMGs can be tailored to meet specific application requirements. The flexibility of adjusting the composition of TFMGs allows the properties to be optimized to suit a variety of applications, such as enhancing thermal stability for use in high temperature environments or improving biocompatibility for use in medical devices. In addition to their functional advantages, TFMGs also represent environmentally friendly alternatives to conventional electroplating techniques, which often involve hazardous chemicals and pose environmental risks. As described in more detail below, TFMGs contain common elements such as zirconium (Zr), titanium (Ti), copper (Cu), nickel (Ni), and aluminum (Al). For example, Zr-based TFMGs exhibit excellent wear resistance and corrosion resistance, making them suitable for environments exposed to moisture or chemicals. Their smooth surface also reduces friction, which is beneficial for applications where low surface energy is important to prevent scaling.

[0044] TFMGs also exhibit mechanical properties, like high hardness, typically exceeding 9 GPa, which allow them to act as effective protective layers in multilayer coatings. These properties remain stable even after heat treatment, making TFMGs suitable for applications involving heat-intensive processes.

[0045] In addition, TFMG forms highly adherent layers on a variety of substrates, improving the durability and longevity of the overall coating. The amorphous nature of TFMG acts as a barrier, preventing interface degradation by inhibiting the diffusion of elements between layers.

[0046] Overall, the versatility of TFMGs makes them suitable for a wide range of applications ranging from industrial protective coatings to biomedical devices, due to their tunable mechanical, thermal, and surface properties.

[0047] refer to Figure 1 , 2 , 3 and 4, each coated article includes a substrate. Although the coated article is not limited by the type of substrate, examples of the substrate are composed of brass, stainless steel, aluminum, zinc, or a polymer (e.g., ABS).

[0048] refer to Figure 3 and 4 , each coated article includes a leveling primer layer 24. The leveling primer layer 24 can be a copper metal layer, a siloxane coating, or a polymer coating. In an improved solution, the leveling primer layer 24 has a thickness of about 1 to 25 microns. In some improved solutions, the leveling primer layer has a thickness of at least 0.2 microns, 0.5 microns, 1 micron, 2 microns, 3 microns, or 5 microns, and at most 25 microns, 20 microns, 15 microns, 10 microns, 8 microns, or 7 microns.

[0049] In another aspect, the top layer 20 is a PVD / PE-CVD coating for a range of different colors and increased durability. In some refinements, the metal-containing layer comprises metallic chromium, metallic nickel, or an alloy thereof. In a variant, the metal-containing layer comprises a component selected from the group consisting of ZrN, ZrCN, ZrO2, ZrOC, diamond-like carbon (DLC), and combinations thereof.

[0050] In another aspect, there is provided a method for manufacturing Figure 1 , 2 , 3 and 4, the coated article method. Figure 5A , 5B , 5C and 5D provide flow charts depicting methods of making the provided coated articles. Figure 5A In step a), a doped thin film metallic glass layer 16 or an undoped thin film metallic glass layer 14 is deposited on and optionally in contact with a substrate 12. Typically, the doped thin film metallic glass layer 16 and / or the undoped thin film metallic glass layer 14 is deposited by physical vapor deposition. In step b), a top layer 20 is deposited by physical vapor deposition on and optionally in contact with the doped thin film metallic glass layer 16 or the undoped thin film metallic glass layer 14 to form a coated article 10. 1 Typically, the doped thin film metallic glass layer 16 and / or the undoped thin film metallic glass layer 14 are deposited by physical vapor deposition.

[0051] refer to Figure 5B In step a), an undoped thin film metallic glass layer 14 is deposited on and optionally in contact with a substrate 12. In step b), a doped thin film metallic glass layer 16 is deposited on and optionally in contact with the undoped thin film metallic glass layer 14. In step c), a top layer 20 is deposited by physical vapor deposition on and optionally in contact with the doped thin film metallic glass layer 16 to form a coated article 10. 2 Typically, the doped thin film metallic glass layer 16 and / or the undoped thin film metallic glass layer 14 are deposited by physical vapor deposition.

[0052] refer to Figure 5C In step a), a leveling primer layer 24 is deposited on and optionally in contact with the substrate 12. In step b), an undoped thin-film metallic glass layer 14 is deposited on and optionally in contact with the leveling primer layer 24. In step c), a top layer 20 is deposited on and optionally in contact with the undoped thin-film metallic glass layer 14 by physical vapor deposition. Typically, the undoped thin-film metallic glass layer 14 is deposited by physical vapor deposition.

[0053] refer to Figure 5D In step a), a leveling primer layer 24 is deposited on the substrate 12 and optionally contacts the substrate. In step b), an undoped thin-film metallic glass layer 14 is deposited on the leveling primer layer 24 and optionally contacts the leveling primer layer. In step c), a doped thin-film metallic glass layer 16 is deposited on the undoped thin-film metallic glass layer 14 and optionally contacts the undoped thin-film metallic glass layer. In step d), a top layer 20 is deposited on the doped thin-film metallic glass layer 16 by physical vapor deposition and optionally contacts the doped thin-film metallic glass layer. Typically, the doped thin-film metallic glass layer 16 and / or the undoped thin-film metallic glass layer 14 are deposited by physical vapor deposition.

[0054] refer to Figure 5A , 5B , 5C and 5D, examples of physical vapor deposition (PVD) techniques include magnetron sputtering or cathodic arc deposition, which can produce a smooth, defect-free surface that contributes to their excellent hardness and corrosion resistance. As described above, the top layer includes a metal-containing layer and / or a carbon-containing layer. Examples of physical vapor deposition methods include magnetron sputtering, high-power pulsed magnetron sputtering, cathodic arc deposition, or a combination thereof.

[0055] In another aspect, the undoped TFMG and doped TFMG layers can be deposited by conventional magnetron sputtering, HiPIMS, cathodic arc deposition, or a combination in a standard PVD system. The target material used in the PVD system can be an alloy made to a specific desired alloy composition, or the film can be formed by co-deposition (e.g., co-sputtering) from separate pure or alloy metal targets (e.g., Zr-Cu formed by simultaneously running a cathodic arc to magnetron sputter Cu and Zr). In addition, the doped TFMG layer can be formed by introducing a reactive gas (N2, O2, CH4) at a controlled rate during the deposition process to produce the desired composition. Additional details on the properties and fabrication methods of the TFMG layer are described in Pakman Yiu, Wahyu Diyatmika, Niklas et al., “Thin film metallic glasses: Properties, applications, and future,” Journal of Applied Physics, Vol. 127, No. 030901, 2020. DOI: 10.1063 / 1.5122884; the entire disclosure of which is hereby incorporated by reference.

[0056] The coatings set forth above can be applied directly to substrates including, but not limited to, brass, stainless steel, aluminum, zinc, and ABS. The substrate can be treated with coatings such as electroless Cu, silicone coatings, and polymer coatings for surface leveling and adhesion promotion.

[0057] In another aspect, Figure 1 , 2 , 3 and 4 can be used in many applications. The coated articles can be used in medical instruments, including surgical blades and needles. The coating improves the sharpness, durability and non-stick properties of the instrument, thereby reducing the force required for insertion and minimizing tissue damage. The coating can be used as a diffusion barrier in electronic devices because TFMG is effective as a diffusion barrier in semiconductors and electronic devices. The coating can be used for corrosion resistance due to the amorphous nature of TFMG. The coated articles can be used in consumer products due to their smooth surface, hardness, and non-stick properties. In other applications, the substrate can be a flexible polymer substrate. The coated articles with a flexible substrate can be used in flexible electronic devices.

[0058] Although exemplary embodiments have been described above, this does not mean that these embodiments describe all possible forms of the present invention. On the contrary, the words used in this specification are descriptive, rather than restrictive, and it should be understood that various changes can be made without departing from the spirit and scope of the present invention. In addition, the features of the embodiments of different implementations can be combined to form further embodiments of the present invention.

Claims

1. A coated article comprising: Base material; a doped thin film metallic glass (TFMG) layer and / or an undoped thin film metallic glass (TFMG) layer disposed on the substrate; as well as A top layer is disposed on the doped TFMG layer and / or the undoped TFMG layer, wherein the top layer includes a metal-containing layer and / or a carbon-containing layer.

2. The coated article of claim 1, wherein The top layer is a metal layer, a metal alloy layer or a metal compound layer.

3. The coated article of claim 1, wherein: The top layer includes metallic chromium, metallic nickel, or alloys thereof.

4. The coated article of claim 1, wherein: The top layer includes a component selected from the group consisting of ZrN, ZrCN, ZrO2, ZrOC, diamond-like carbon (DLC), and combinations thereof.

5. The coated article of claim 1, wherein: The top layer has a thickness of about 0.2 microns to 1 micron.

6. The coated article of claim 1, wherein: The TFMG layer has a thickness of about 0.5 to 10 microns.

7. The coated article of claim 1, wherein: The TFMG layer includes a base element selected from the group consisting of zirconium, copper, nickel, titanium, molybdenum, and combinations thereof.

8. The coated article of claim 7, wherein: The TFMG layer further includes an alloying element selected from the group consisting of copper, aluminum, titanium, silicon, nickel, boron, tungsten, chromium, and combinations thereof.

9. The coated article of claim 1, wherein: The TFMG layer includes zirconium.

10. The coated article of claim 9, wherein: The TFMG layer is a zirconium-copper alloy having 50 to 65 at. % zirconium and 15 to 30 at. % copper, with any balance being additional alloying elements or dopants.

11. The coated article of claim 1, wherein: The doped TFMG layer is interposed between the undoped TFMG layer and the top layer.

12. The coated article of claim 11, wherein The doped TFMG layer has a thickness of about 0.5 to 10 microns.

13. The coated article of claim 11, wherein: The doped TFMG layer includes a TFMG composition and a dopant.

14. The coated article of claim 13, wherein: The dopant is selected from the group consisting of N, C, O, and combinations thereof.

15. The coated article of claim 1, further comprising a leveling primer layer interposed between the substrate and the undoped TFMG layer.

16. The coated article of claim 15, wherein The leveling primer layer is a copper metal layer, a silicone coating, or a polymer coating.

17. The coated article of claim 15, wherein: The leveling primer layer has a thickness of about 1 to 25 micrometers.

18. The coated article of claim 1, further comprising a leveling primer layer interposed between the substrate and the undoped TFMG layer and a doped TFMG layer interposed between the undoped TFMG layer and the top layer.

19. The coated article of claim 1, wherein: The substrate is composed of brass, stainless steel, aluminum, zinc, or a polymer.

20. A method for making a coated article, the method comprising: depositing a doped thin film metallic glass (TFMG) layer and / or an undoped thin film metallic glass (TFMG) layer on a substrate; as well as A top layer is deposited on the doped TFMG layer and / or the undoped TFMG layer by physical vapor deposition, the top layer comprising a metal-containing layer or a carbon-containing layer.

21. The method of claim 20, wherein: The doped TFMG layer and / or the undoped TFMG layer is formed by magnetron sputtering, high power pulsed magnetron sputtering, cathode arc deposition, or a combination thereof.

22. The method of claim 20, wherein: The top layer is a metal layer, a metal alloy layer or a metal compound layer.

23. The method of claim 22, wherein: The metal layer is formed by cathodic arc deposition.

24. The method of claim 20, wherein: The top layer includes metallic chromium, metallic nickel, or alloys thereof.

25. The method of claim 20, wherein: The top layer includes a component selected from the group consisting of ZrN, ZrCN, ZrO2, ZrOC, diamond-like carbon (DLC), and combinations thereof.

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