Ceramic multilayer film coating device

Abstract

The present invention discloses a ceramic multilayer film coating device, which belongs to the field of film coating technology. It solves the problem that the position of the target material of the existing device is relatively fixed and cannot be flexibly adjusted and switched according to the requirements of the multilayer coating of the substrate, which affects the uniformity and consistency of the coating. The device includes a device body, a substrate placement component, a sputtering target part, and an auxiliary adjustment component. The coating box is provided with a coating chamber and a drive cover. The target material switching part includes a switching motor, a switching linkage part, a target material guide seat, a switching push rod, and an intermittent conductive part. The present invention is provided with a target material switching part and an auxiliary adjustment component. The automatic switching mechanism of the target material switching part enables different types of sputtering target substrates to be flexibly moved to a position directly above the ceramic substrate, and the switching can be completed without stopping. The coordinated target material switching part and the auxiliary adjustment component can ensure that the sputtering particles are deposited on the substrate surface with the optimal energy and angle. The adhesion between the film layer and the substrate is enhanced.

Description

Technical Field

[0001] The present invention belongs to the field of film coating technology, and in particular relates to a ceramic multilayer film coating device. Background Art

[0002] Ceramics refer to all kinds of materials and products made from clay as the main raw material and other natural mineral raw materials through processes such as crushing, mixing, molding, and sintering. At the same time, due to the good insulation and thermal conductivity of ceramic substrates, they have broad application prospects in the fields of electronic component packaging and special circuit boards. Ceramic substrate metallization has become a research hotspot in recent years. Ceramic substrate metallization technologies mainly include co-firing method (HTCC / LTCC), thick film method (TFC), direct copper deposition method (DBC), direct aluminum deposition method (DBA) and thin film method (DPC). Magnetron sputtering coating technology, as an efficient physical vapor deposition (PVD) method, has significant advantages in the field of ceramic metallization. Magnetron sputtering can use a variety of materials as targets, including metals, alloys, oxides, nitrides, etc., which can meet the needs of different ceramic metallization. Vacuum coating chambers are commonly used coating equipment / devices for ceramic coating.

[0003] In traditional coating devices, the target position is typically fixed and cannot be flexibly adjusted to the shape and size of the substrate. This makes it difficult to optimize the distance between the target and the substrate, which in turn affects the uniformity and consistency of the coating. Meanwhile, Chinese patent CN115386848B discloses a multi-target DC magnetron sputtering coating device and its application in depositing multilayer metal films on ceramic substrates. The structure of the multi-target DC magnetron sputtering device is as follows: a workpiece rack is provided at the bottom of the coating chamber, and the upper part of the workpiece rack is provided with the first to fifth target materials, an ion source, and a heating tube; three flow meters are provided on the top of the coating chamber; the vacuum pumping system includes a rough pumping system and a fine pumping system for evacuating the coating chamber; the measuring system includes a first thermocouple sensor and a second thermocouple vacuum gauge provided on the coating chamber; the control system includes a first thermocouple vacuum gauge control unit, a first molecular pump controller, first to fifth sputtering target power supplies, a first ion source power supply, and a first bias power supply; however, although the existing device is equipped with multiple target materials, the position of the target materials is relatively fixed and cannot be flexibly adjusted and switched according to the requirements of the multi-layer coating of the substrate. The fixed position makes it difficult to ensure that the target materials are always located in the central area of ​​the substrate, resulting in the inability to optimize the distance between the target materials and the substrate, affecting the uniformity and consistency of the coating. In response to the above problems, we propose a ceramic multi-layer coating device. Summary of the Invention

[0004] The purpose of the present invention is to address the shortcomings of the existing technology and provide a ceramic multilayer film coating device, which solves the problem that the position of the target material in the existing device is relatively fixed and cannot be flexibly adjusted and switched according to the multilayer coating requirements of the substrate. The fixed position makes it difficult to ensure that the target material is always located in the central area of ​​the substrate, affecting the uniformity and consistency of the coating.

[0005] The present invention is achieved by providing a ceramic multilayer film coating device, the ceramic multilayer film coating device comprising:

[0006] The device body includes a coating box, in which a coating chamber and a driving cover are arranged;

[0007] A movable substrate placement assembly is provided at the bottom of the coating chamber for supporting the coating substrate;

[0008] At least one group of sputtering target parts, wherein the sputtering target parts are arranged on the top of the coating chamber, and the sputtering target parts are connected to a target switching part, which is arranged in the driving cover plate and is used to switch and adjust the position of the sputtering target parts;

[0009] An auxiliary adjustment component is mounted on the driving cover plate, and is connected to the sputtering target portion and the substrate placement component respectively, and is used to assist in adjusting the positions of the sputtering target portion and the substrate placement component;

[0010] Among them, the target material switching part includes a switching motor, a switching linkage part, a target material guide seat, a switching push rod, and an intermittent conductive part. The switching motor is fixedly mounted on the driving cover plate, the target material guide seat is fixedly arranged on the inner side of the driving cover plate, and supports the switching linkage part. The switching push rod is fixed in the target material guide seat, and the switching push rod is fixedly connected to the intermittent conductive part, and the intermittent conductive part is conductively connected to the sputtering target material part.

[0011] Preferably, the device body further includes:

[0012] A box support, which is fixedly installed below the coating box and is fixedly connected to the coating box;

[0013] Negative pressure exhaust port, the negative pressure exhaust port is opened on the drive cover;

[0014] The working gas conduit is fixedly installed on one side of the coating box, and the working gas conduit is used to blow working gas and reaction gas into the coating chamber. The side wall of the coating box is detachably installed with a substrate pick-up and placement seat and a target pick-up and placement seat.

[0015] Preferably, the switching linkage unit includes:

[0016] a first gear, the first gear being rotatably mounted in the driving cover plate, and one side of the first gear being fixedly connected to an output end of the switching motor;

[0017] At least one set of second gears, the second gears being rotatably disposed in a target guide groove provided in a target guide seat, the second gears being meshed with each other for transmission, and any set of the second gears being meshed with the first gear for transmission;

[0018] At least one group of target material accommodating grooves is provided in the second gear, a connecting slider is slidably installed in the target material accommodating groove, the bottom of the connecting slider is slidably connected to the target material guide groove through a connecting guide bar, and the top of the connecting slider is detachably connected to the sputtering target part.

[0019] Preferably, the sputtering target portion includes:

[0020] A target conductive seat, wherein the target conductive seat is detachably connected to the connecting slider, and an end of the target conductive seat away from the connecting slider is rotatably connected to the target protection seat;

[0021] A third gear, the third gear being fixedly sleeved on the bottom of the target protection seat;

[0022] The fourth gear is rotatably disposed in the target guide seat and is meshed with the third gear for transmission. The fourth gear is also connected to the auxiliary adjustment assembly;

[0023] A target mounting seat, wherein the target mounting seat is detachably mounted in a target protection seat, and a sputtering target substrate is detachably mounted in the target mounting seat;

[0024] The target material protection part is arranged in the target material protection seat and is used to protect the sputtering target substrate.

[0025] Preferably, the target protection portion includes:

[0026] An auxiliary cathode, which is fixedly mounted on the end of the target conductive seat and is used to apply a negative voltage to the sputtering target substrate to assist in the atomic sputtering of the sputtering target substrate;

[0027] N-type semiconductor, fixedly installed in the target conductive seat;

[0028] At least one group of P-type semiconductors is arranged on one side of the N-type semiconductor and is used to cooperate with the N-type semiconductor to absorb heat in the target protection seat;

[0029] A metal connecting piece, which is arranged in the target protection seat and is used to connect the N-type semiconductor and the P-type semiconductor;

[0030] The spiral spoiler strip is fixedly mounted on the end of the target conductive seat. The spiral spoiler strip is used to disturb the gas flow in the target protection seat and assist in cooling the sputtering target substrate.

[0031] Preferably, the auxiliary adjustment component includes:

[0032] An auxiliary motor, wherein the auxiliary motor is fixedly mounted on the driving cover;

[0033] An auxiliary drive shaft fixedly connected to the output end of the auxiliary motor, wherein one end of the auxiliary drive shaft away from the auxiliary motor extends into the coating chamber and is connected to the substrate placement assembly;

[0034] An auxiliary linkage part, the auxiliary linkage part is connected to the auxiliary drive shaft, the auxiliary linkage part is used to drive the fourth gear, the auxiliary linkage part includes a first rotating wheel, a second rotating wheel and a transmission belt, the first rotating wheel is fixedly sleeved on the outer wall of the auxiliary drive shaft, the second rotating wheel is rotatably mounted on the driving cover plate, the second rotating wheel is fixedly connected to the fourth gear through a connecting rod, and the first rotating wheel and the second rotating wheel are rotatably connected through a transmission belt;

[0035] The heating adjustment part is arranged in the coating chamber, and the heating adjustment part includes a fifth gear and a linkage ring gear. The linkage ring gear is rotatably installed in the coating chamber, and at least one group of electric heating rods is circumferentially arranged in the coating chamber. The electric heating rods are detachably installed in the linkage ring gear. One side of the linkage ring gear is engaged with the fifth gear for transmission, and the fifth gear is fixedly sleeved on the auxiliary drive shaft.

[0036] Preferably, the substrate placement assembly comprises:

[0037] A substrate placement rack, the substrate placement rack is movably arranged at the bottom of the coating chamber, and at least one set of substrate receiving slots is opened in the substrate placement rack;

[0038] A linkage translation seat, wherein the linkage translation seat is slidably installed in the coating box and is slidably connected to the substrate placement rack;

[0039] The translation linkage part is arranged in the coating chamber and is respectively connected to the linkage translation seat and the auxiliary driving shaft. The translation linkage part is used to translationally drive the substrate placement rack.

[0040] Preferably, the substrate placement rack comprises:

[0041] A lifting and positioning seat, wherein the lifting and positioning seat is fixedly mounted on the substrate placement rack and is slidably connected to the linkage translation seat;

[0042] A lifting push seat, the lifting push seat is slidably connected to the lifting positioning seat, and the lifting push seat is used to drive the lifting positioning seat and the substrate placement rack to move up and down;

[0043] A spring telescopic rod fixedly connected to the lifting push seat, wherein the spring telescopic rod is fixedly installed at the bottom of the coating box;

[0044] The positioning guide rail is fixedly installed in the coating box and is slidably connected to the side wall of the substrate placement rack.

[0045] Preferably, the translation linkage portion includes:

[0046] A linkage hinge rod, wherein the linkage hinge rod is fixedly mounted on the end of the auxiliary drive shaft;

[0047] The linkage hinge block is hinged to the end of the linkage hinge rod, and the linkage hinge block is slidably embedded in the hinge limit seat, and the hinge limit seat is detachably connected to the linkage translation seat.

[0048] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0049] In an embodiment of the present invention, a target switching unit and an auxiliary adjustment assembly are provided. The automatic switching mechanism of the target switching unit enables different types of sputtering target substrates to be flexibly moved to a position directly above the ceramic substrate, and switching can be completed without stopping the machine. This avoids the discontinuity of the film structure caused by manual switching of target materials. The precise control of the target switching unit can ensure that each target material is sputtered at the optimal position, thereby improving the uniformity and consistency of the film layer. The coordinated target switching unit and the auxiliary adjustment assembly can ensure that the sputtered particles are deposited on the substrate surface at the optimal energy and angle. This not only improves the uniformity of the film layer, but also enhances the adhesion between the film layer and the substrate.

[0050] In the present invention, the target guide seat is a double-layer seat structure with a hollow interior, and the gap between the two sets of symmetrically arranged second gears and the target guide seat forms an "8"-shaped guide groove, and the connecting slider slides along the "8"-shaped trajectory of the guide groove, and drives the sputtering target parts located at different target material accommodating groove positions to switch back and forth from the edge of the guide groove to the center area, meeting the requirements of multi-layer coating of the target material, and realizing automatic switching of the position of the sputtering target part, further ensuring the quality of multi-layer coating.

[0051] In an embodiment of the present invention, a sputtering target portion is provided, which consists of a target conductive seat, a third gear, a fourth gear, and a target protection portion. The sputtering target portion is linked with an auxiliary adjustment component through the third gear and the fourth gear, so that the auxiliary adjustment component drives the sputtering target portion to rotate while driving the ceramic substrate on the substrate placement component to move back and forth horizontally, thereby improving the sputtering coating efficiency of the ceramic substrate, and the target protection portion can protect the sputtering target substrate from overheating. At the same time, the spiral spoiler is fixedly installed on the bottom of the target conductive seat by welding or riveting, so that it can rotate relative to the sputtering target substrate when the target protection seat rotates, further accelerating the gas flow in the target protection seat and improving the heat dissipation efficiency of the sputtering target substrate. This coordinated movement ensures that the sputtering particles can be evenly deposited on the surface of the substrate, avoiding the problem of uneven film thickness caused by the fixed position of the target and substrate. The rotation of the target and the reciprocating movement of the substrate can effectively reduce the local difference in film thickness, improve the uniformity and consistency of the film, and thus improve the coating quality of the ceramic substrate.

[0052] In an embodiment of the present invention, a substrate placement assembly is provided, which consists of a substrate placement rack, a linkage translation seat and a translation linkage part. The substrate placement rack, the linkage translation seat and the translation linkage part cooperate with each other and can drive the substrate placement rack to move back and forth horizontally while being driven by the auxiliary adjustment assembly. By adjusting the movement speed and trajectory of the substrate placement rack, the process parameters can be flexibly optimized to meet different application requirements. The multi-dimensional movement mode significantly improves the uniformity and efficiency of sputtering coating of ceramic substrates, enhances the adhesion of the film layer, reduces production costs, and at the same time improves the versatility and applicability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a structural schematic diagram of the ceramic multilayer film coating device provided by the present invention.

[0054] Figure 2 It is a schematic diagram of the three-dimensional structure of the ceramic multilayer film coating device provided by the present invention.

[0055] Figure 3 It is a side view of the ceramic multilayer film coating device provided by the present invention.

[0056] Figure 4 yes Figure 3 AA section view.

[0057] Figure 5 It is a structural schematic diagram of the auxiliary adjustment component provided by the present invention.

[0058] Figure 6 It is an axonometric view of the auxiliary adjustment assembly provided by the present invention.

[0059] Figure 7 It is a structural schematic diagram of the target material switching unit provided by the present invention.

[0060] Figure 8 It is a bottom view of the target switching part provided by the present invention.

[0061] Figure 9 It is a structural diagram of the switching linkage part provided by the present invention.

[0062] Figure 10 It is a schematic structural diagram of the sputtering target part provided by the present invention.

[0063] Figure 11 This is a front view of the sputtering target portion provided by the present invention.

[0064] Figure 12 yes Figure 11 BB cross-sectional view.

[0065] Figure 13 It is a structural schematic diagram of the target material protection part provided by the present invention.

[0066] Figure 14 It is a structural schematic diagram of the substrate placement assembly provided by the present invention.

[0067] Figure 15 It is an axonometric view of the substrate placement assembly provided by the present invention.

[0068] Figure 16 It is a top view of the substrate placement assembly provided by the present invention.

[0069] In the figure: 1-device body, 11-box support, 12-coating box, 121-coating chamber, 122-substrate pick-up and placement seat, 123-target pick-up and placement seat, 124-drive cover, 13-negative pressure exhaust port, 14-working gas duct, 2-electric heating rod, 3-auxiliary adjustment component, 31-auxiliary motor, 32-auxiliary drive shaft, 33-auxiliary linkage part, 331-first rotary wheel, 332-second rotary wheel, 333-transmission belt, 34-heating adjustment part, 341-fifth gear, 342-linkage gear ring, 4-sputtering target part, 41-target conductive seat, 42-sputtering target substrate, 43-target protection seat, 44-third gear, 45-fourth gear, 46-target mounting seat, 47-target protection part, 471-auxiliary cathode, 472-N Type semiconductor, 473-P type semiconductor, 474-metal connecting piece, 475-spiral spoiler strip, 5-substrate placement assembly, 51-substrate placement rack, 511-substrate accommodating groove, 512-positioning guide rail, 513-lifting and positioning seat, 514-lifting push seat, 515-spring telescopic rod, 52-linked translation seat, 53-translation linkage part, 531-linked hinge rod, 532-hinge limit seat, 533-linked hinge block, 6-target switching part, 61-target guide seat, 611-target guide groove, 62-switching linkage part, 621-first gear, 622-second gear, 623-target accommodating groove, 624-connecting slider, 625-connecting guide strip, 63-switching push rod, 64-intermittent conductive part, 65-switching motor. DETAILED DESCRIPTION

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0071] Although the existing device is equipped with multiple targets, the position of the targets is relatively fixed and cannot be flexibly adjusted and switched according to the multi-layer coating requirements of the substrate. The fixed position makes it difficult to ensure that the target is always located in the central area of ​​the substrate, resulting in the inability to optimize the distance between the target and the substrate, affecting the uniformity and consistency of the coating. To address the above problems, we propose a ceramic multi-layer coating device. In short, the device consists of a device body 1, a movable substrate placement component 5, a sputtering target part 4, and an auxiliary adjustment component 3. A coating chamber 121 and a drive cover 124 are provided in the coating box 12. A target switching part 6 is provided in the drive cover 124 for switching and adjusting the position of the sputtering target part 4. The target switching part 6 includes a switching motor 65, a switching linkage part 62, a target guide seat 61, a switching push rod 63, and an intermittent conductive part 64. The switching motor 65 is fixedly mounted on the drive cover 124, and the target guide seat 61 is fixedly provided on the inner side of the drive cover 124. During operation, multiple groups of sputtering target substrates 42 are installed in the sputtering target part 4 in sequence, and the ceramic substrate is placed in the substrate placement assembly 5. Then the sputtering target part 4, the auxiliary adjustment assembly 3, and the switching motor 65 are turned on. When the switching motor 65 is started, it can drive the switching linkage part 62 and the sputtering target part 4 to slide along the target guide seat 61, thereby realizing automatic switching of the sputtering target part 4, so that when multi-layer coating is applied to the surface of the substrate, different types of sputtering target substrates 42 located on the sputtering target part 4 are flexibly moved to a position directly above the substrate, and different types of sputtering target substrates 42 are switched smoothly, and automatic switching of the sputtering target substrates 42 can be achieved without stopping the machine. At the same time, when any group of the sputtering target parts 4 moves to the center position of the target guide seat 61, the auxiliary adjustment assembly 3 can drive the sputtering target substrate 42 on the sputtering target part 4 to rotate automatically, and at the same time drive the substrate placement assembly 5 to move back and forth along the bottom of the coating chamber 121, thereby ensuring the consistency and uniformity of the surface of the ceramic substrate during multi-layer coating. In an embodiment of the present invention, a target material switching unit 6 and an auxiliary adjustment assembly 3 are provided. The automatic switching mechanism of the target material switching unit 6 enables different types of sputtering target substrates 42 to be flexibly moved to a position directly above the ceramic substrate, and the switching can be completed without stopping the machine. The discontinuity of the film structure caused by manual switching of the target material is avoided. The precise control of the target material switching unit 6 can ensure that each target material is sputtered at the optimal position, thereby improving the uniformity and consistency of the film layer. The coordinated target material switching unit 6 and the auxiliary adjustment assembly 3 can ensure that the sputtered particles are deposited on the substrate surface with the optimal energy and angle. This not only improves the uniformity of the film layer, but also enhances the adhesion between the film layer and the substrate.

[0072] It should be noted that the present application can be used for multilayer coating operations on ceramic substrates and alloy substrates, and the ceramic substrates can be alumina ceramics, silicon nitride ceramics, silicon carbide ceramics and metal ceramics, and the film layers in the multilayer coating of the present application can be 2-6 layers.

[0073] The embodiment of the present invention provides a ceramic multilayer film coating device, such as Figure 1-Figure 5 As shown, the ceramic multilayer film coating device includes:

[0074] The device body 1 includes a coating box 12, in which a coating chamber 121 and a driving cover plate 124 are provided;

[0075] The coating box 12 can be a cube box or a round box structure with a hollow interior. A drive cover 124 is installed on the top of the coating box 12 by means of a flange sealing connection. At the same time, in order to facilitate the removal and placement of the sputtering target substrate 42 and the ceramic substrate, the side wall of the coating box 12 is detachably installed with a substrate pick-up and placement seat 122 and a target pick-up and placement seat 123. The substrate pick-up and placement seat 122 and the target pick-up and placement seat 123 are detachably installed on the side wall of the coating box 12 by means of snaps or bolts.

[0076] At the same time, the device body 1 also includes:

[0077] The box support 11 is fixedly installed below the coating box 12, and the box support 11 is fixedly connected to the coating box 12. The number of the box support 11 can be 3-8 groups. The box support 11 is fixedly connected to the bottom surface of the coating box 12 by welding or riveting;

[0078] The negative pressure exhaust port 13 is provided on the driving cover plate 124. A negative pressure air pump can be fixedly installed at the negative pressure exhaust port 13. The negative pressure air pump is used to evacuate the air in the coating chamber 121 so as to maintain a negative pressure vacuum in the coating chamber 121, which is beneficial for the multi-layer coating operation on the surface of the ceramic substrate.

[0079] The working gas conduit 14 is fixedly installed on one side of the coating box 12 , and the working gas conduit 14 is used to blow working gas and reaction gas into the coating chamber 121 .

[0080] It should be noted that the end of the working gas conduit 14 is arranged at an angle upward. The working gas conduit 14 is used to pump working gas and reactive gas into the coating chamber 121. The working gas can be argon, and the reactive gas can be nitrogen. Within the coating chamber 121, the argon gas is ionized to form a plasma, generating high-energy argon ions. These argon ions are accelerated by the electric field and bombard the sputtering target substrate 42, causing atoms of the sputtering target substrate 42 to be sputtered and deposited on the surface of the ceramic substrate, thereby ensuring a high sputtering rate. The nitrogen can chemically react with the sputtered metal atoms to form a nitride film. For example, when sputtering titanium metal, nitrogen can react with titanium atoms to form a titanium nitride (TiN) film.

[0081] A movable substrate placement assembly 5, which is disposed at the bottom of the coating chamber 121 and is used to support the coating substrate;

[0082] At least one group of sputtering target parts 4, the sputtering target parts 4 are arranged on the top of the coating chamber 121, the sputtering target parts 4 are connected to the target switching part 6, and the target switching part 6 is arranged in the driving cover plate 124 for switching and adjusting the position of the sputtering target parts 4;

[0083] An auxiliary adjustment assembly 3, which is mounted on the driving cover plate 124 and is connected to the sputtering target portion 4 and the substrate placement assembly 5, respectively. The auxiliary adjustment assembly 3 is used to assist in adjusting the positions of the sputtering target portion 4 and the substrate placement assembly 5;

[0084] Among them, Figure 7-Figure 8 As shown, the target switching part 6 includes a switching motor 65, a switching linkage part 62, a target guide seat 61, a switching push rod 63, and an intermittent conductive part 64. The switching motor 65 is fixedly mounted on the driving cover 124. The target guide seat 61 is fixedly arranged on the inner side of the driving cover 124 and supports the switching linkage part 62. The switching push rod 63 is fixed in the target guide seat 61, and the switching push rod 63 is fixedly connected to the intermittent conductive part 64. The intermittent conductive part 64 is conductively connected to the sputtering target part 4.

[0085] It should be noted that the switching motor 65 can be a servo motor, and the switching motor 65 is fixedly mounted on the drive cover 124 by riveting or mortising, while the target guide seat 61 is fixedly mounted by snap-fit ​​or bolt assembly. The switching push rod 63 can be an electric push rod or a hydraulic rod, and the switching push rod 63 is fixedly mounted in the target guide seat 61 by snap-fit ​​or riveting, and the intermittent conductive member 64 can be an arc-shaped or rectangular electrode sheet. The intermittent conductive member 64 is electrically connected to the sputtering target power supply and can be pushed by the switching push rod 63 to electrically connect with the sputtering target portion 4 at the center of the target guide seat 61, thereby achieving intermittent power supply to the sputtering target portion 4 and ensuring the normal operation of the sputtering target portion 4 at the center of the target guide seat 61.

[0086] In this embodiment, during operation, multiple groups of sputtering target substrates 42 are installed in the sputtering target part 4 in sequence, and the ceramic substrate is placed in the substrate placement assembly 5. Then, the sputtering target part 4, the auxiliary adjustment assembly 3, and the switching motor 65 are turned on. When the switching motor 65 is started, it can drive the switching linkage part 62 and the sputtering target part 4 to slide along the target guide seat 61, thereby realizing automatic switching of the sputtering target part 4, so that when multi-layer coating is applied to the surface of the substrate, different types of sputtering target substrates 42 located on the sputtering target part 4 are flexibly moved to a position directly above the substrate, and different types of sputtering target substrates 42 are switched smoothly, and automatic switching of the sputtering target substrates 42 can be achieved without stopping the machine. At the same time, when any group of the sputtering target parts 4 moves to the center position of the target guide seat 61, the auxiliary adjustment assembly 3 can drive the sputtering target substrates 42 on the sputtering target part 4 to rotate automatically, and at the same time drive the substrate placement assembly 5 to move back and forth along the bottom of the coating chamber 121, thereby ensuring the consistency and uniformity of the surface of the ceramic substrate during multi-layer coating.

[0087] In an embodiment of the present invention, a target material switching unit 6 and an auxiliary adjustment assembly 3 are provided. The automatic switching mechanism of the target material switching unit 6 enables different types of sputtering target substrates 42 to be flexibly moved to a position directly above the ceramic substrate, and the switching can be completed without stopping the machine. The discontinuity of the film structure caused by manual switching of the target material is avoided. The precise control of the target material switching unit 6 can ensure that each target material is sputtered at the optimal position, thereby improving the uniformity and consistency of the film layer. The coordinated target material switching unit 6 and the auxiliary adjustment assembly 3 can ensure that the sputtered particles are deposited on the substrate surface with the optimal energy and angle. This not only improves the uniformity of the film layer, but also enhances the adhesion between the film layer and the substrate.

[0088] In a further preferred embodiment of the present invention, Figure 7-Figure 9 As shown, the switching linkage unit 62 includes:

[0089] A first gear 621 is rotatably mounted within the drive cover 124 . One side of the first gear 621 is fixedly connected to the output end of the switching motor 65 . The first gear 621 is fixedly connected to the output end of the switching motor 65 by an interference fit or a mortise and tenon joint.

[0090] At least one set of second gears 622, the second gears 622 are rotatably disposed in the target guide groove 611, the target guide groove 611 is provided in the target guide seat 61, the second gears 622 are meshed and driven, and any set of the second gears 622 is meshed and driven with the first gear 621;

[0091] It should be noted that the second gear 622 is symmetrically arranged in the target guide groove 611, and there are two groups of second gears 622. The interior of the second gear 622 is hollow, and the second gear 622 is rotatably connected to the target guide seat 61 through a bearing ring or a roller. In this embodiment, the target guide seat 61 is a double-layer seat structure with a hollow interior, and the gap between the two groups of symmetrically arranged second gears 622 and the target guide seat 61 forms an "8"-shaped guide groove, and the connecting slider 624 slides along the "8"-shaped trajectory along the guide groove, and drives the sputtering target part 4 located at different target material receiving grooves 623 to switch back and forth from the edge of the guide groove to the center area, meeting the target multi-layer coating requirements, and realizing automatic switching of the position of the sputtering target part 4, further ensuring the quality of the multi-layer coating.

[0092] At least one group of target material accommodating grooves 623 are provided in the second gear 622. A connecting slider 624 is slidably installed in the target material accommodating groove 623. The bottom of the connecting slider 624 is slidably connected to the target material guide groove 611 through a connecting guide bar 625. The top of the connecting slider 624 is detachably connected to the sputtering target part 4.

[0093] In this embodiment, the number of target material accommodating grooves 623 in each group can be 3-6 groups. At the same time, the shape of the target material accommodating grooves 623 can be an arc-shaped, "U"-shaped or fan-shaped structure. The connecting guide bar 625 can be fixedly connected to the connecting slider 624 by riveting or plugging. The connecting slider 624 is a round seat or a circular ring structure. The shape of the connecting guide bar 625 can be an arc-shaped, rectangular or "S"-shaped structure, and three groups of sputtering target parts 4 can be arranged in the two groups of second gears 622.

[0094] During the coating operation, the switching motor 65 is turned on, and the switching motor 65 starts to drive the first gear 621 to rotate, and the first gear 621 synchronously drives the two sets of second gears 622 to rotate, so that the target material receiving groove 623 in the second gear 622 drives the connecting slider 624 and the sputtering target part 4 to cyclically switch to the central area of ​​the second gear 622 close to each other, so that the sputtering target part 4 that needs to be used is set opposite to the ceramic substrate, ensuring the quality and smoothness of the multi-layer coating.

[0095] In a further preferred embodiment of the present invention, Figure 10-12 As shown, the sputtering target part 4 includes:

[0096] The target conductive seat 41 is detachably connected to the connecting slider 624, and the target conductive seat 41 is rotatably connected to the target protection seat 43 at one end away from the connecting slider 624. The target conductive seat 41 can be a round seat or cylindrical structure with a hollow interior. The bottom of the target conductive seat 41 is detachably connected to the connecting slider 624 by means of threads or bolts. The side wall of the target conductive seat 41 is also provided with a conductive sheet, which can be conductively connected to the intermittent conductive part 64 to ensure the normal operation of the sputtering target part 4, and the target protection seat 43 can be a round seat or circular cavity with a hollow interior. The target protection seat 43 is rotatably connected to the target conductive seat 41 through bearings or rollers.

[0097] A third gear 44, the third gear 44 is fixedly sleeved on the bottom of the target protection seat 43, and the third gear 44 is fixedly sleeved on the outer wall of the target protection seat 43 by welding or riveting;

[0098] The fourth gear 45 is rotatably disposed in the target guide seat 61 and meshes with the third gear 44 for transmission. The fourth gear 45 is also connected to the auxiliary adjustment assembly 3;

[0099] A target mounting seat 46 , wherein the target mounting seat 46 is detachably mounted in the target protection seat 43 , and a sputtering target substrate 42 is detachably mounted in the target mounting seat 46 ;

[0100] The target protection portion 47 is disposed in the target protection seat 43 . The target protection portion 47 is used to protect the sputtering target substrate 42 . The target protection portion 47 is fixedly connected to the target conductive seat 41 .

[0101] In this embodiment, the target mounting seat 46 can be a hollow annular or circular cover structure, and the sputtering target substrate 42 is fixedly installed in the target mounting seat 46 by means of clipping or mortise and tenoning. The sputtering target substrate 42 can be a high-purity cobalt target or a nickel-platinum alloy target. At the same time, a hydraulic or electric protective cover can be installed on the outside of the target mounting seat 46 to protect the surface of the current sputtering target substrate 42 when other sputtering target substrates 42 are working.

[0102] In a further preferred embodiment of the present invention, Figure 13 As shown, the target protection portion 47 includes:

[0103] An auxiliary cathode 471, which is fixedly mounted on the end of the target conductive seat 41. The auxiliary cathode 471 is used to apply a negative voltage to the sputtering target substrate 42 to assist in the sputtering of atoms of the sputtering target substrate 42. The auxiliary cathode 471 is fixedly mounted on the end of the target conductive seat 41 by snapping or riveting;

[0104] N-type semiconductor 472, fixedly mounted in the target conductive seat 41;

[0105] At least one group of P-type semiconductors 473 is disposed on one side of the N-type semiconductor 472 and is used to cooperate with the N-type semiconductor 472 to absorb heat in the target protection seat 43;

[0106] A metal connecting piece 474 is provided in the target protection seat 43 and is used to connect the N-type semiconductor 472 and the P-type semiconductor 473;

[0107] It should be noted that the N-type semiconductor 472 and the P-type semiconductor 473 are electrically connected via a metal connector 474. These two semiconductors can utilize the Peltier effect to achieve cooling or heating functions via a DC power supply. In this embodiment, when current passes through the junction between the two semiconductor materials (N-type semiconductor 472 and P-type semiconductor 473), electrons absorb heat at the junction, causing the junction temperature to decrease (cooling), thereby protecting the sputtering target substrate 42 from overheating. Since the sputtering target substrate 42 absorbs a large amount of energy during the sputtering process, causing the temperature to rise, excessively high temperatures in the target material can cause phase changes, stress concentration, or even melting, thereby affecting the stability of the sputtering process and the quality of the film. In this embodiment, maintaining a low target temperature ensures the stability of the sputtering process and the integrity of the target material. Furthermore, the P-type semiconductors 473 are arranged counterclockwise around one side of the N-type semiconductor 472. The P-type semiconductors 473 can have an arc-shaped, fan-shaped, or "S"-shaped structure.

[0108] The spiral spoiler strip 475 is fixedly mounted on the end of the target conductive seat 41 . The spiral spoiler strip is used to turbulently affect the gas flow in the target protection seat 43 and to assist in cooling the sputtering target substrate 42 .

[0109] In this embodiment, the spiral spoiler strip 475 is fixedly installed on the bottom of the target conductive seat 41 by welding or riveting, so that it can rotate relative to the sputtering target substrate 42 when the target protection seat 43 rotates, further accelerating the gas flow in the target protection seat 43 and improving the heat dissipation efficiency of the sputtering target substrate 42.

[0110] During operation, when the connecting slider 624 drives the target conductive seat 41 to move to the meshing position of the two groups of second gears 622 (the center position of the target guide seat 61), the third gear 44 contacts the fourth gear 45, and the auxiliary adjustment component 3 is started to drive the third gear 44 and the fourth gear 45 to rotate, so that the third gear 44 drives the target protection seat 43 and the sputtering target substrate 42 to rotate, and the target conductive seat 41 is conductively connected to the intermittent conductive part 64, so that the N-type semiconductor 472 and the P-type semiconductor 473 are conductive, and the electrons absorb heat at the joints, so that the temperature at the joints of the N-type semiconductor 472 and the P-type semiconductor 473 is reduced, thereby realizing auxiliary heat dissipation of the sputtering target substrate 42 during operation.

[0111] In an embodiment of the present invention, a sputtering target portion 4 is provided, which consists of a target conductive seat 41, a third gear 44, a fourth gear 45, and a target protection portion 47. The sputtering target portion 4 is linked with the auxiliary adjustment component 3 through the third gear 44 and the fourth gear 45, so that the auxiliary adjustment component 3 drives the sputtering target portion 4 to rotate while driving the ceramic substrate on the substrate placement component 5 to move horizontally back and forth, thereby improving the sputtering coating efficiency of the ceramic substrate, and the target protection portion 47 can protect the sputtering target substrate 42 from overheating. At the same time, the spiral spoiler strip 475 is fixedly installed on the bottom of the target conductive seat 41 by welding or riveting, so that it can rotate relative to the sputtering target substrate 42 when the target protection seat 43 rotates, further accelerating the gas flow in the target protection seat 43, and improving the heat dissipation efficiency of the sputtering target substrate 42. This coordinated movement ensures that the sputtered particles can be evenly deposited on the surface of the substrate, avoiding the problem of uneven film thickness caused by the fixed position of the target and substrate. The rotation of the target and the reciprocating movement of the substrate can effectively reduce the local differences in film thickness, improve the uniformity and consistency of the film, and thus improve the coating quality of the ceramic substrate.

[0112] In a further preferred embodiment of the present invention, Figure 5-Figure 6 As shown, the auxiliary adjustment component 3 includes:

[0113] Auxiliary motor 31, the auxiliary motor 31 is fixedly mounted on the drive cover 124, the auxiliary motor 31 can be a servo motor or a single-phase asynchronous motor, and the auxiliary motor 31 is fixedly mounted on the drive cover 124 using buckles or bolts;

[0114] An auxiliary drive shaft 32 fixedly connected to the output end of the auxiliary motor 31, wherein one end of the auxiliary drive shaft 32 away from the auxiliary motor 31 extends into the coating chamber 121 and is connected to the substrate placement assembly 5;

[0115] An auxiliary linkage portion 33 is connected to the auxiliary drive shaft 32 and is used to drive the fourth gear 45. The auxiliary linkage portion 33 includes a first rotating wheel 331, a second rotating wheel 332, and a transmission belt 333. The first rotating wheel 331 is fixedly mounted on the outer wall of the auxiliary drive shaft 32, and the second rotating wheel 332 is rotatably mounted on the drive cover 124. The second rotating wheel 332 is fixedly connected to the fourth gear 45 via a connecting rod. The first rotating wheel 331 and the second rotating wheel 332 are rotatably connected via the transmission belt 333.

[0116] The first rotating wheel 331 is fixedly sleeved on the outer wall of the auxiliary driving shaft 32 by plugging or riveting, and the second rotating wheel 332 is rotatably connected to the driving cover plate 124 by a bearing. During operation, the auxiliary motor 31 is started to drive the auxiliary driving shaft 32 to rotate, and the auxiliary driving shaft 32 drives the first rotating wheel 331, the second rotating wheel 332, and the transmission belt 333 to rotate, so that the second rotating wheel 332 drives the fourth gear 45 and the third gear 44 to rotate, so that the third gear 44 drives the target material protection seat 43 and the sputtering target substrate 42 to rotate.

[0117] The heating adjustment part 34 is arranged in the coating chamber 121. The heating adjustment part 34 includes a fifth gear 341 and a linkage ring gear 342. The linkage ring gear 342 is rotatably installed in the coating chamber 121, and at least one group of electric heating rods 2 is circumferentially arranged in the coating chamber 121. The electric heating rods 2 are detachably installed in the linkage ring gear 342. One side of the linkage ring gear 342 is engaged with the fifth gear 341 for transmission. The fifth gear 341 is fixedly sleeved on the auxiliary drive shaft 32.

[0118] In this embodiment, the electric heating rod 2 is fixedly installed in the linkage gear ring 342 by mortise and tenon or snap connection. The electric heating rod 2 can be a round rod or a spiral rod structure. The number of electric heating rods 2 can be 3-10 groups. The setting of the heating adjustment part 34 ensures the uniform distribution of temperature in the coating chamber 121, which is beneficial to the adsorption of the film layer and ensures the uniformity of the film layer.

[0119] In a further preferred embodiment of the present invention, Figure 14-16 As shown, the substrate placement component 5 includes:

[0120] The substrate placement rack 51 is movably arranged at the bottom of the coating chamber 121. At least one group of substrate receiving slots 511 is provided in the substrate placement rack 51. The substrate placement rack 51 can be a circular rack or a rectangular rack structure. The substrate receiving slots 511 are arranged in a circle or a matrix. The substrate receiving slots 511 are used to receive ceramic substrates. The provision of multiple groups of substrate receiving slots 511 can ensure the synchronous coating operation of multiple groups of ceramic substrates.

[0121] A linkage translation seat 52 is slidably mounted in the coating box 12 and is slidably connected to the substrate placement rack 51;

[0122] In this embodiment, the linkage translation seat 52 may be a rectangular seat or a round seat, and the center of the linkage translation seat 52 is hollowed to facilitate the sliding passage of the lifting and positioning seat 513 .

[0123] The translation linkage part 53 is disposed in the coating chamber 121 and is connected to the linkage translation seat 52 and the auxiliary driving shaft 32 respectively. The translation linkage part 53 is used to translationally drive the substrate placement rack 51 .

[0124] In an embodiment of the present invention, a substrate placement component 5 is provided, which consists of a substrate placement rack 51, a linkage translation seat 52 and a translation linkage part 53. The substrate placement rack 51, the linkage translation seat 52 and the translation linkage part 53 cooperate with each other and can drive the substrate placement rack 51 to move back and forth horizontally while being driven by the auxiliary adjustment component 3. By adjusting the movement speed and trajectory of the substrate placement rack 51, the process parameters can be flexibly optimized to meet different application requirements. The multi-dimensional movement mode significantly improves the uniformity and efficiency of the sputtering coating of the ceramic substrate, enhances the adhesion of the film layer, reduces the production cost, and at the same time improves the versatility and applicability of the equipment.

[0125] It should be noted that the translation linkage portion 53 includes:

[0126] A linkage hinge rod 531 , the linkage hinge rod 531 being fixedly mounted on the end of the auxiliary drive shaft 32 ;

[0127] The linkage hinge block 533 is hinged to the end of the linkage hinge rod 531 , and the linkage hinge block 533 is slidably embedded in the hinge limit seat 532 , and the hinge limit seat 532 is detachably connected to the linkage translation seat 52 .

[0128] Among them, the linkage hinged rod 531 can be a rectangular arm or rectangular rod structure, one end of the linkage hinged rod 531 is fixedly connected to the end of the auxiliary drive shaft 32 by mortise and tenon or plug-in, and the connecting hinge block is slidingly connected to the hinge limit seat 532. At the same time, the hinge limit seat 532 must also be connected to the bottom of the coating chamber 121, and the side wall of the hinge limit seat 532 is detachably connected to the linkage translation seat 52 by means of snaps or bolts.

[0129] In this embodiment, the substrate placement rack 51 includes:

[0130] The lifting and positioning seat 513 is fixedly mounted on the substrate placement rack 51 and is slidably connected to the linkage translation seat 52. The top of the lifting and positioning seat 513 is fixedly connected to the substrate placement rack 51 by plugging or riveting. The bottom of the lifting and positioning seat is provided with a polished inclined surface.

[0131] A lifting and pushing seat 514 is slidably connected to the lifting and positioning seat 513. The lifting and pushing seat 514 is used to drive the lifting and positioning seat 513 and the substrate placement rack 51 to move up and down. The lifting and pushing seat 514 can be a triangular prism or a prism structure. The position where the lifting and pushing seat 514 contacts the lifting and positioning seat 513 is also provided with a polished inclined surface;

[0132] A spring telescopic rod 515 fixedly connected to the lifting and pushing seat 514, wherein the spring telescopic rod 515 is fixedly installed at the bottom of the coating box 12;

[0133] The positioning guide rail 512 is fixedly installed in the coating box 12. The positioning guide rail 512 is slidably connected to the side wall of the substrate placement rack 51. The positioning guide rail 512 can be fixedly installed in the coating box 12 by means of clipping or bolts.

[0134] During operation, the rotation of the auxiliary drive shaft 32 can drive the linkage hinge rod 531 to swing, and the linkage hinge rod 531 drives the linkage hinge block 533 to move, and the linkage hinge block 533 drives the hinge limit seat 532, the linkage translation seat 52 and the substrate placement rack 51 to move horizontally. At the same time, the lifting and pushing seat 514 contacts the lifting and positioning seat 513, pushing the lifting and positioning seat 513 and the substrate placement rack 51 to move up and down while moving horizontally, realizing multi-dimensional movement of the ceramic substrate. For ceramic substrates with irregular shapes or large sizes, the multi-dimensional movement method can better adapt to their surface characteristics, ensuring that the sputtered particles can evenly cover every corner of the substrate, thereby improving the overall quality of the film layer.

[0135] In summary, the present invention provides a ceramic multilayer film coating device. When working, multiple groups of sputtering target substrates 42 are sequentially installed in the sputtering target part 4, the ceramic substrate is placed in the substrate placement component 5, and then the sputtering target part 4, the auxiliary adjustment component 3, and the switching motor 65 are turned on. When the switching motor 65 is started, it can drive the switching linkage part 62 and the sputtering target part 4 to slide along the target guide seat 61, thereby realizing automatic switching of the sputtering target part 4, so that when the multilayer film is coated on the surface of the substrate, different types of sputtering targets on the sputtering target part 4 are The sputtering target substrate 42 is flexibly moved to a position directly above the substrate, and different types of sputtering target substrates 42 are switched smoothly, and the sputtering target substrate 42 can be automatically switched without stopping. At the same time, when any group of the sputtering target parts 4 moves to the center position of the target guide seat 61, the auxiliary adjustment component 3 can drive the sputtering target substrate 42 on the sputtering target part 4 to rotate automatically, and at the same time drive the substrate placement component 5 to move back and forth along the bottom of the coating chamber 121, thereby ensuring the consistency and uniformity of the surface of the ceramic substrate during multi-layer coating.

[0136] In an embodiment of the present invention, a target material switching unit 6 and an auxiliary adjustment assembly 3 are provided. The automatic switching mechanism of the target material switching unit 6 enables different types of sputtering target substrates 42 to be flexibly moved to a position directly above the ceramic substrate, and the switching can be completed without stopping the machine. The discontinuity of the film structure caused by manual switching of the target material is avoided. The precise control of the target material switching unit 6 can ensure that each target material is sputtered at the optimal position, thereby improving the uniformity and consistency of the film layer. The coordinated target material switching unit 6 and the auxiliary adjustment assembly 3 can ensure that the sputtered particles are deposited on the substrate surface with the optimal energy and angle. This not only improves the uniformity of the film layer, but also enhances the adhesion between the film layer and the substrate.

[0137] It should be noted that for the aforementioned embodiments, for simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should be aware that the present invention is not limited by the order of the actions described, because according to the present invention, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0138] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope of protection of the present invention.

Claims

1. A ceramic multilayer film coating device, characterized in that: include: The device body includes a coating box, in which a coating chamber and a driving cover are arranged; A movable substrate placement assembly is provided at the bottom of the coating chamber for supporting the coating substrate; At least one group of sputtering target parts, wherein the sputtering target parts are arranged on the top of the coating chamber, and the sputtering target parts are connected to a target switching part, which is arranged in the driving cover plate and is used to switch and adjust the position of the sputtering target parts; An auxiliary adjustment component is mounted on the driving cover plate, and is connected to the sputtering target portion and the substrate placement component respectively, and is used to assist in adjusting the positions of the sputtering target portion and the substrate placement component; Among them, the target switching part includes a switching motor, a switching linkage part, a target guide seat, a switching push rod, and an intermittent conductive part. The switching motor is fixedly mounted on the driving cover plate, the target guide seat is fixedly arranged on the inner side of the driving cover plate and supports the switching linkage part. The switching push rod is fixed in the target guide seat, and the switching push rod is fixedly connected to the intermittent conductive part, and the intermittent conductive part is conductively connected to the sputtering target part. The switching linkage unit includes: a first gear, the first gear being rotatably mounted in the driving cover plate, and one side of the first gear being fixedly connected to an output end of the switching motor; At least one set of second gears, the second gears being rotatably disposed in a target guide groove provided in a target guide seat, the second gears being meshed with each other for transmission, and any set of the second gears being meshed with the first gear for transmission; At least one set of target accommodating grooves, the target accommodating grooves being provided in the second gear, a connecting slider being slidably mounted in the target accommodating grooves, the bottom of the connecting slider being slidably connected to the target guide grooves via a connecting guide bar, and the top of the connecting slider being detachably connected to a sputtering target portion; The sputtering target portion includes: A target conductive seat, wherein the target conductive seat is detachably connected to the connecting slider, and an end of the target conductive seat away from the connecting slider is rotatably connected to the target protection seat; A third gear, the third gear being fixedly sleeved on the bottom of the target protection seat; The fourth gear is rotatably disposed in the target guide seat and is meshed with the third gear for transmission. The fourth gear is also connected to the auxiliary adjustment assembly; A target mounting seat, wherein the target mounting seat is detachably mounted in a target protection seat, and a sputtering target substrate is detachably mounted in the target mounting seat; A target material protection portion is provided in the target material protection seat and is used to protect the sputtering target substrate; The auxiliary adjustment component includes: An auxiliary motor, wherein the auxiliary motor is fixedly mounted on the driving cover; An auxiliary drive shaft fixedly connected to the output end of the auxiliary motor, wherein one end of the auxiliary drive shaft away from the auxiliary motor extends into the coating chamber and is connected to the substrate placement assembly; An auxiliary linkage part, the auxiliary linkage part is connected to the auxiliary drive shaft, the auxiliary linkage part is used to drive the fourth gear, the auxiliary linkage part includes a first rotating wheel, a second rotating wheel and a transmission belt, the first rotating wheel is fixedly sleeved on the outer wall of the auxiliary drive shaft, the second rotating wheel is rotatably mounted on the driving cover plate, the second rotating wheel is fixedly connected to the fourth gear through a connecting rod, and the first rotating wheel and the second rotating wheel are rotatably connected through a transmission belt; The heating adjustment part is arranged in the coating chamber, and the heating adjustment part includes a fifth gear and a linkage ring gear. The linkage ring gear is rotatably installed in the coating chamber, and at least one group of electric heating rods is circumferentially arranged in the coating chamber. The electric heating rods are detachably installed in the linkage ring gear. One side of the linkage ring gear is engaged with the fifth gear for transmission, and the fifth gear is fixedly sleeved on the auxiliary drive shaft.

2. The ceramic multilayer film coating device according to claim 1, wherein: The device body also includes: A box support, which is fixedly installed below the coating box and is fixedly connected to the coating box; Negative pressure exhaust port, the negative pressure exhaust port is opened on the drive cover; The working gas conduit is fixedly installed on one side of the coating box, and the working gas conduit is used to blow working gas and reaction gas into the coating chamber. The side wall of the coating box is detachably installed with a substrate pick-up and placement seat and a target pick-up and placement seat.

3. The ceramic multilayer film coating device according to claim 1, wherein: The target material protection part includes: An auxiliary cathode, which is fixedly mounted on the end of the target conductive seat and is used to apply a negative voltage to the sputtering target substrate to assist in the atomic sputtering of the sputtering target substrate; N-type semiconductor, fixedly installed in the target conductive seat; At least one group of P-type semiconductors is arranged on one side of the N-type semiconductor and is used to cooperate with the N-type semiconductor to absorb heat in the target protection seat; A metal connecting piece, which is arranged in the target protection seat and is used to connect the N-type semiconductor and the P-type semiconductor; The spiral spoiler strip is fixedly mounted on the end of the target conductive seat. The spiral spoiler strip is used to disturb the gas flow in the target protection seat and assist in cooling the sputtering target substrate.

4. The ceramic multilayer film coating device according to claim 3, wherein: The substrate placement assembly includes: A substrate placement rack, the substrate placement rack is movably arranged at the bottom of the coating chamber, and at least one set of substrate receiving slots is opened in the substrate placement rack; A linkage translation seat, wherein the linkage translation seat is slidably installed in the coating box and is slidably connected to the substrate placement rack; The translation linkage part is arranged in the coating chamber and is respectively connected to the linkage translation seat and the auxiliary driving shaft. The translation linkage part is used to translationally drive the substrate placement rack.

5. The ceramic multilayer film coating device according to claim 4, wherein: The substrate placement rack comprises: A lifting and positioning seat, wherein the lifting and positioning seat is fixedly mounted on the substrate placement rack and is slidably connected to the linkage translation seat; A lifting push seat, the lifting push seat is slidably connected to the lifting positioning seat, and the lifting push seat is used to drive the lifting positioning seat and the substrate placement rack to move up and down; A spring telescopic rod fixedly connected to the lifting push seat, wherein the spring telescopic rod is fixedly installed at the bottom of the coating box; The positioning guide rail is fixedly installed in the coating box and is slidably connected to the side wall of the substrate placement rack.

6. The ceramic multilayer film coating device according to claim 5, wherein: The translation linkage portion comprises: A linkage hinge rod, wherein the linkage hinge rod is fixedly mounted on the end of the auxiliary drive shaft; The linkage hinge block is hinged to the end of the linkage hinge rod, and the linkage hinge block is slidably embedded in the hinge limit seat, and the hinge limit seat is detachably connected to the linkage translation seat.

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