Sensor packaging structure and manufacturing method thereof

Abstract

The invention discloses a sensor packaging structure and a manufacturing method thereof. The sensor packaging structure comprises a ceramic substrate, a sensing chip mounted and electrically coupled to the ceramic substrate, an annular supporting layer formed on the sensing chip, a light-transmitting sheet arranged on the annular supporting layer, and a packaging body formed on the ceramic substrate. Wherein the ceramic substrate, the sensing chip, the annular supporting layer and the light-transmitting sheet are embedded in the packaging body. The bottom surface of the ceramic substrate and at least part of the outer surface of the light-transmitting sheet are exposed out of the packaging body, and the bottom edge of the packaging body is trimmed to the bottom surface of the ceramic substrate. Therefore, according to the sensor packaging structure, the packaging body can achieve a better protection effect by adopting a framework that the packaging body is used for embedding other components.

Description

Technical Field

[0001] The present invention relates to a packaging structure, and in particular to a sensor packaging structure and a manufacturing method thereof. Background Art

[0002] The basic structure used by the existing sensor packaging structure has been finalized, so the improvement of the basic structure is ignored. For example, the existing sensor packaging structure is a packaging body formed on a substrate to protect other components on the substrate through the packaging body, but the substrate is not within the protection range of the packaging body.

[0003] Therefore, the inventors believe that the above defects can be improved, and propose the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The embodiment of the present invention provides a sensor packaging structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] The embodiment of the present invention discloses a method for manufacturing a sensor packaging structure, which includes: a pre-step: providing a plurality of sensing modules, and the manufacturing process of each sensing module includes: installing and electrically coupling a sensing chip on a ceramic substrate; forming an annular support layer on the top surface of the sensing chip; arranging a light-transmitting sheet on the annular support layer to form a sensing module; a placement step: arranging the ceramic substrates of the plurality of sensing modules on a workbench; a first glue dispensing step: dispensing glue on the workbench to form a blocking wall, which surrounds the plurality of sensing modules on its inner side; a second glue dispensing step: dispensing glue inside the blocking wall of the workbench to form a packaging layer, which buries the plurality of sensing modules therein, and at least a partial outer surface of the light-transmitting sheet of each sensing module is exposed outside the packaging layer; a cutting step: cutting the packaging layer along the outer sides of the plurality of sensing modules and without touching any of the sensing modules, so that the packaging layer forms a plurality of packaging bodies respectively covering the plurality of sensing modules; wherein each sensing module and the corresponding packaging body are collectively defined as a sensor packaging structure.

[0006] Optionally, in any sensor packaging structure, two top edge regions of the packaging body located on opposite sides of the light-transmitting sheet are configured asymmetrically with respect to the light-transmitting sheet.

[0007] Optionally, in the first glue dispensing step, a partition wall located within the blocking wall is formed by glue dispensing on the workbench, and the partition wall is connected to the blocking wall to together form a plurality of separation areas, and each sensing module is located within a separation area; wherein, in the second glue dispensing step, the packaging layer includes a plurality of packaging bodies respectively located within the plurality of separation areas.

[0008] Optionally, in any sensor packaging structure, two top edge regions of the packaging body located on opposite sides of the light-transmitting sheet are symmetrically arranged relative to the light-transmitting sheet.

[0009] Optionally, the manufacturing process of each sensing module further includes: after the sensing chip is mounted on the ceramic substrate, connecting the ceramic substrate and the sensing chip with a plurality of metal wires, so that the ceramic substrate and the sensing chip are electrically coupled to each other through the plurality of metal wires.

[0010] The embodiment of the present invention also discloses a sensor packaging structure, which includes: a ceramic substrate having a first board surface, a second board surface located on the opposite side of the first board surface, and an annular side surface connected between the first board surface and the second board surface; a sensing chip mounted on the first board surface of the ceramic substrate, and the sensing chip is electrically coupled to the ceramic substrate; wherein the top surface of the sensing chip contains a sensing area and a bearing area surrounding the sensing area; an annular support layer formed on the bearing area of ​​the sensing chip; a light-transmitting sheet arranged on the annular support layer; wherein the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together surround a closed space, and the sensing area is located within the closed space; a packaging body formed on the first board surface of the ceramic substrate and covering the entire annular side surface, so that the ceramic substrate, the sensing chip, the annular support layer, and the light-transmitting sheet are buried within the packaging body; wherein the second board surface of the ceramic substrate and at least part of the outer surface of the light-transmitting sheet are exposed outside the packaging body, and the bottom edge of the packaging body is flush with the second board surface of the ceramic substrate.

[0011] Optionally, the ring side surface of the ceramic substrate has a first stepped surface connected to the first board surface, a second stepped surface connected to the second board surface, and a step surface connected between the first stepped surface and the second stepped surface, and the first stepped surface, the second stepped surface, and the step surface are all buried in the package body.

[0012] Optionally, the first step surface, the second step surface, and the step surface are all annular, and the step surface is vertically connected to the first step surface and the second step surface.

[0013] Optionally, the sensor package structure includes a plurality of metal wires connected to the ceramic substrate and the sensing chip, and the ceramic substrate and the sensing chip are electrically coupled to each other through the plurality of metal wires, and each metal wire is at least partially buried in the package body.

[0014] Optionally, the ceramic substrate includes a plurality of bonding pads located on the first board surface, and the sensing chip is located on the inner side of the plurality of bonding pads, the top surface of the sensing chip contains a plurality of connection pads located in the supporting area, and the plurality of connection pads are buried in the annular support layer; wherein one ends of the plurality of metal wires are respectively connected to the plurality of bonding pads, and the other ends of the plurality of metal wires are respectively connected to the plurality of connection pads and buried in the annular support layer.

[0015] To sum up, the sensor packaging structure and manufacturing method disclosed in the embodiments of the present invention can achieve better protection effect through the packaging body by adopting a packaging body to bury the remaining components (that is, all components of the sensing module are buried in the packaging body) (for example, the ring side of the ceramic substrate can be completely protected by the packaging body).

[0016] Furthermore, the sensor packaging structure and manufacturing method disclosed in the embodiment of the present invention can select a ceramic substrate with a small expansion coefficient so that the ceramic substrate is not easily affected by the thermal expansion and contraction of the package body and warpage occurs, thereby enabling the ceramic substrate to be embedded in the package body. In other words, any packaging structure that does not embed the ceramic substrate in the package body is different from the sensor packaging structure referred to in this embodiment.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional schematic diagram of the sensor packaging structure according to the first embodiment of the present invention.

[0019] Figure 2 for Figure 1 Schematic top view of .

[0020] Figure 3 for Figure 1 Schematic cross-sectional view along section line III-III.

[0021] Figure 4 The schematic top view of the sensor packaging structure manufacturing method according to the first embodiment of the present invention after the first glue dispensing step is performed.

[0022] Figure 5 for Figure 4 Schematic cross-sectional view along section line VV.

[0023] Figure 6 for Figure 4 A cross-sectional schematic diagram of the subsequent steps.

[0024] Figure 7 It is a top view schematic diagram of the sensor packaging structure manufacturing method according to the second embodiment of the present invention after the first glue dispensing step is performed.

[0025] Figure 8 for Figure 7 Schematic cross-sectional view along section line VIII-VIII.

[0026] Fig. 9 for Figure 8 A cross-sectional schematic diagram of the subsequent steps.

[0027] Fig.10 Schematic cross-sectional view of a sensor packaging structure according to Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0028] The following is an explanation of the implementation methods of the "sensor packaging structure and its manufacturing method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0029] It should be understood that although the terms "first", "second", "third" and the like may be used herein to describe various components or features, these components or features should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one feature from another feature. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0030] [Example 1]

[0031] See also Figures 1 to 6 As shown, it is the first embodiment of the present invention. This embodiment discloses a sensor packaging structure and a manufacturing method thereof, and the sensor packaging structure 100 can be manufactured by implementing the sensor packaging structure manufacturing method recorded in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the sensor packaging structure 100 can also be manufactured by implementing methods other than this embodiment. In addition, to facilitate understanding of this embodiment, the following content will first introduce the sensor packaging structure manufacturing method, and then explain the sensor packaging structure 100.

[0032] like Figures 3 to 6As shown, the sensor packaging structure manufacturing method in this embodiment includes a pre-step S110, a component placement step S120, a first glue dispensing step S130, a second glue dispensing step S140, and a cutting step S150. It should be noted that the sensor packaging structure manufacturing method can manufacture the sensor packaging structure 100 after implementing the above steps, so the technical content of the sensor packaging structure manufacturing method can also refer to the relevant description content of the sensor packaging structure 100. The following content will generally introduce the various steps of the sensor packaging structure manufacturing method, but the present invention is not limited thereto.

[0033] The preceding step S110: Figure 4 and Figure 5 As shown, a plurality of independent sensing modules M are provided. The manufacturing process of each sensing module M includes: mounting a sensing chip 2 and electrically coupling it to a ceramic substrate 1; forming an annular support layer 4 on the top surface 21 of the sensing chip 2; and arranging a light-transmitting sheet 5 on the annular support layer 4 to form a sensing module M.

[0034] Furthermore, the manufacturing process of each of the sensing modules M in this embodiment may further include: after the sensing chip 2 is mounted on the ceramic substrate 1, a plurality of metal wires 3 are connected to the ceramic substrate 1 and the sensing chip 2, so that the ceramic substrate 1 and the sensing chip 2 are electrically coupled to each other through the plurality of metal wires 3, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the sensing chip 2 may also be mounted and electrically coupled to the ceramic substrate 1 by flip-chip manner according to actual needs.

[0035] The step S120 of placing components: Figure 4 and Figure 5 As shown, the ceramic substrate 1 of the plurality of sensing modules M is disposed on a workbench 200. In this embodiment, the plurality of sensing modules M are disposed at intervals from each other, and the plurality of sensing modules M are preferably arranged in a matrix, so as to facilitate the implementation of the cutting step S150 (e.g., Figure 6 ).

[0036] The first dispensing step S130: Figure 4 and Figure 5As shown, a blocking wall 300 is formed by dispensing glue on the workbench 200, which surrounds the plurality of sensing modules M on its inner side. In this embodiment, the distance between the blocking wall 300 and the adjacent sensing module M is preferably not greater than the distance between two adjacent sensing modules M, and the top edge of the blocking wall 300 is preferably not higher than the outer surface 51 of the light-transmitting sheet 5 of each sensing module M compared to the workbench 200, but the present invention is not limited thereto.

[0037] The second dispensing step S140: Figure 6 As shown, a packaging layer 60 is formed by dispensing glue inside the blocking wall 300 of the workbench 200, in which a plurality of the sensing modules M are embedded, and at least a portion of the outer surface 51 of the light-transmitting sheet 5 of each of the sensing modules M is exposed outside the packaging layer 60.

[0038] Furthermore, before the second glue dispensing step S140 is implemented, the top edge of the blocking wall 300 can be no higher than the outer surface 51 of the light-transmitting sheet 5 of each of the sensing modules M, so that when the second glue dispensing step S140 is implemented, it can effectively control the packaging layer 60 from spreading to the outer surface 51 of any of the light-transmitting sheets 5.

[0039] The cutting step S150: Figure 6 As shown, the packaging layer 60 is cut along the path P outside the plurality of sensing modules M and does not touch any of the sensing modules M, so that the packaging layer 60 forms a plurality of packaging bodies 6 respectively covering the plurality of sensing modules M. Each sensing module M and the corresponding packaging body 6 are collectively defined as a sensor packaging structure 100 (e.g.: Figure 3 ).

[0040] It should be noted that, in any of the sensor packaging structures 100 of the present embodiment, the two top edge regions 61 of the packaging body 6 located on opposite sides of the light-transmitting sheet 5 are asymmetrically configured relative to the light-transmitting sheet 5 (e.g., the angles formed between the two top edge regions 61 and the outer surface 51 of the light-transmitting sheet 5 are slightly different), but the present invention is not limited to this.

[0041] As described above, the sensor package structure manufacturing method has been generally described in the above content of this embodiment. The following content then introduces the sensor package structure 100 formed after the sensor package structure manufacturing method is implemented. Therefore, some technical features of the sensor package structure 100 can also refer to the above content, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the sensor package structure 100 can also be obtained by implementing other methods according to actual needs.

[0042] like Figures 1 to 3 As shown, the sensor packaging structure 100 in this embodiment includes a ceramic substrate 1, a sensing chip 2 mounted on the ceramic substrate 1, a plurality of metal wires 3 electrically coupling the ceramic substrate 1 and the sensing chip 2, an annular support layer 4 formed on the sensing chip 2, a light-transmitting sheet 5 disposed on the annular support layer 4, and a packaging body 6 formed on the ceramic substrate 1, but is not limited thereto.

[0043] It should be noted that, although the sensor package structure 100 is described in this embodiment as including the above-mentioned components, the sensor package structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the sensor package structure 100 can omit a plurality of the metal wires 3, and the sensing chip 2 is fixed and electrically coupled to the ceramic substrate 1 by flip chip method. The following will respectively describe the structure and connection relationship of each component of the sensor package structure 100 in this embodiment.

[0044] The ceramic substrate 1 is square or rectangular in this embodiment, but the present invention is not limited thereto. The ceramic substrate 1 has a first surface 11, a second surface 12 located on the opposite side of the first surface 11, and a ring side surface 13 connected between the first surface 11 and the second surface 12.

[0045] Specifically, the ceramic substrate 1 is provided with a chip fixing area 111 at the substantially center of the first board surface 11, and the ceramic substrate 1 is formed with a plurality of bonding pads 112 located outside the chip fixing area 111 on the first board surface 11. In this embodiment, the plurality of bonding pads 112 are arranged substantially in a ring shape around the chip fixing area 111, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing area 111.

[0046] The sensing chip 2 in this embodiment is square (e.g., rectangular or square). The sensing chip 2 is described below as an image sensing chip, but the present invention is not limited thereto. The sensing chip 2 (the bottom surface 22) is fixed to the chip fixing area 111 of the ceramic substrate 1 by a die-bonding adhesive; that is, the sensing chip 2 is located on the inner side of the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 (in a ring shape) surrounding the sensing area 211, and the two ends of each of the metal wires 3 are respectively connected to the ceramic substrate 1 and the supporting area 212 of the sensing chip 2, so that the ceramic substrate 1 and the sensing chip 2 are electrically coupled to each other through the plurality of metal wires 3.

[0047] In more detail, the sensing chip 2 includes a plurality of connection pads 213 located in the carrying area 212 (that is, the plurality of connection pads 213 are located outside the sensing area 211). The number and position of the plurality of connection pads 213 of the sensing chip 2 in this embodiment respectively correspond to the number and position of the plurality of bonding pads 112 of the ceramic substrate 1; that is, the plurality of connection pads 213 in this embodiment are also generally arranged in a ring shape.

[0048] Furthermore, one end of the plurality of metal wires 3 is respectively connected to the plurality of bonding pads 112, and the other end of the plurality of metal wires 3 is respectively connected to the plurality of connection pads 213 (that is, the two ends of each metal wire 3 are respectively connected to one bonding pad 112 and the corresponding connection pad 213). Any of the metal wires 3 can be bonded in a normal bond form or a reverse bond form according to design requirements, and the present invention is not limited thereto.

[0049] The annular support layer 4 is disposed on the supporting area 212 of the sensing chip 2 and surrounds the outside of the sensing area 211. In this embodiment, each of the connection pads 213 and the metal wires 3 connected thereto are partially buried in the annular support layer 4, and the remaining parts of each of the metal wires 3 are buried in the package body 6, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the annular support layer 4 may be located on the inner side of the plurality of metal wires 3 and not in contact with any of the metal wires 3 (that is, each of the metal wires 3 is located on the outer side of the annular support layer 4 and is completely buried in the package body 6).

[0050] The light-transmitting sheet 5 is illustrated as a flat glass in this embodiment, but the present invention is not limited thereto. The light-transmitting sheet 5 is disposed on the annular support layer 4, so that the light-transmitting sheet 5, the annular support layer 4, and the top surface 21 of the sensing chip 2 together surround a closed space E, and the sensing area 211 is located within the closed space E. It should be additionally noted that the closed space E is preferably not filled with any colloid in this embodiment, but the present invention is not limited thereto.

[0051] The package body 6 is formed on the first board surface 11 of the ceramic substrate 1 and covers the entire annular side surface 13, so that the ceramic substrate 1, the sensing chip 2, the annular support layer 4, the light-transmitting sheet 5, and at least a portion of each of the metal wires 3 are buried in the package body 6. The second board surface 12 of the ceramic substrate 1 and at least a portion of the outer surface 51 of the light-transmitting sheet 5 are exposed outside the package body 6, and the bottom edge 62 of the package body 6 is flush with the second board surface 12 of the ceramic substrate 1.

[0052] It should be noted that the package body 6 in this embodiment is a solidified liquid compound, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the package body 6 may also be a molding compound.

[0053] As described above, the sensor packaging structure 100 and the manufacturing method thereof in this embodiment can achieve better protection effect through the packaging body 6 by adopting a structure in which the packaging body 6 buries the remaining components (that is, all components of the sensing module M are buried in the packaging body 6), so that the sensor packaging structure 100 can obtain better protection effect through the packaging body 6 (for example, the ring side surface 13 of the ceramic substrate 1 can be completely protected by the packaging body 6).

[0054] Furthermore, the carrier of the sensor package structure 100 is the ceramic substrate 1 with a smaller expansion coefficient, so that the ceramic substrate 1 is not easily affected by the thermal expansion and contraction of the package body 6 and warpage occurs, thereby enabling the ceramic substrate 1 to be embedded in the package body 6. In other words, any package structure that does not embed the ceramic substrate in the package body is different from the sensor package structure 100 referred to in this embodiment.

[0055] [Example 2]

[0056] See also Figures 7 to 9 As shown, this is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0057] In the first glue dispensing step S230 of the present embodiment, a partition wall 400 located inside the blocking fence 300 is formed by glue dispensing on the workbench 200, and the partition wall 400 is connected to the blocking fence 300 to form a plurality of partition areas R, and each of the sensing modules M is located inside one of the partition areas R. Furthermore, in the second glue dispensing step S240, the packaging layer includes a plurality of packaging bodies 6 respectively located inside the plurality of partition areas R. In the cutting step S250, the packaging layer is cut along a path P outside the plurality of sensing modules M and not touching any of the sensing modules M, so that the packaging layer forms a plurality of packaging bodies 6 respectively covering the plurality of sensing modules M. Each of the sensing modules M and the corresponding packaging body 6 are collectively defined as a sensor packaging structure 100.

[0058] In more detail, each of the sensing modules M is substantially equidistant from the boundary of the corresponding separation area R, so that in any one of the sensor packaging structures 100 , the two top edge areas 61 of the packaging body 6 located on opposite sides of the light-transmitting sheet 5 are symmetrically arranged relative to the light-transmitting sheet 5 .

[0059] [Example 3]

[0060] See also Fig.10 As shown, it is the third embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0061] In this embodiment, the annular side surface 13 of the ceramic substrate 1 is stepped; that is, the annular side surface 13 has a first step surface 131 (vertically) connected to the first board surface 11, a second step surface 132 (vertically) connected to the second board surface 12, and a step surface 133 (vertically) connected between the first step surface 131 and the second step surface 132. The first step surface 131, the second step surface 132, and the step surface 133 are all annular and buried in the package body 6.

[0062] [Technical Effects of Embodiments of the Invention]

[0063] To sum up, the sensor packaging structure and the manufacturing method thereof disclosed in the embodiments of the present invention can achieve better protection effect through the packaging body by adopting a packaging body to bury the remaining components (that is, all components of the sensing module are buried in the packaging body) (for example, the ring side of the ceramic substrate can be completely protected by the packaging body).

[0064] Furthermore, the sensor packaging structure and manufacturing method disclosed in the embodiment of the present invention can select a ceramic substrate with a small expansion coefficient so that the ceramic substrate is not easily affected by the thermal expansion and contraction of the package body and warpage occurs, thereby enabling the ceramic substrate to be embedded in the package body. In other words, any packaging structure that does not embed the ceramic substrate in the package body is different from the sensor packaging structure referred to in this embodiment.

[0065] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A method for manufacturing a sensor packaging structure, characterized in that: The sensor packaging structure manufacturing method comprises: A preparatory step: providing a plurality of sensing modules, and the manufacturing process of each of the sensing modules includes: Mounting and electrically coupling a sensing chip to a ceramic substrate; An annular supporting layer is formed on the top surface of the sensing chip; and Disposing a light-transmitting sheet on the annular supporting layer to form a sensing module; A placement step: placing the ceramic substrates of the plurality of sensing modules on a workbench; A first glue dispensing step: dispensing glue on the workbench to form a blocking wall, wherein the blocking wall surrounds the plurality of sensing modules on the inner side thereof; a second glue dispensing step; dispensing glue inside the blocking wall of the workbench to form a packaging layer, wherein a plurality of the sensing modules are embedded inside the packaging layer, and at least a partial outer surface of the light-transmitting sheet of each of the sensing modules is exposed outside the packaging layer; and A cutting step: cutting the packaging layer along the outer sides of the plurality of sensing modules without touching any of the sensing modules, so that the packaging layer forms a plurality of packaging bodies respectively covering the plurality of sensing modules; wherein each sensing module and the corresponding packaging body are collectively defined as a sensor packaging structure.

2. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: In any of the sensor packaging structures, two top edge regions of the packaging body located on opposite sides of the light-transmitting sheet are configured asymmetrically relative to the light-transmitting sheet.

3. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: In the first glue dispensing step, a partition wall located within the blocking wall is formed by glue dispensing on the workbench, and the partition wall is connected to the blocking wall to jointly form a plurality of separation areas, and each of the sensing modules is located within one of the separation areas; wherein, in the second glue dispensing step, the packaging layer includes a plurality of the packaging bodies respectively located within a plurality of the separation areas.

4. The method for manufacturing a sensor packaging structure according to claim 3, characterized in that: In any of the sensor packaging structures, two top edge regions of the packaging body located on opposite sides of the light-transmitting sheet are symmetrically arranged relative to the light-transmitting sheet.

5. The method for manufacturing a sensor packaging structure according to claim 1, characterized in that: The manufacturing process of each of the sensing modules further includes: after the sensing chip is mounted on the ceramic substrate, connecting the ceramic substrate and the sensing chip with a plurality of metal wires, so that the ceramic substrate and the sensing chip are electrically coupled to each other through the plurality of metal wires.

6. A sensor packaging structure, characterized in that: The sensor packaging structure includes: a ceramic substrate having a first plate surface, a second plate surface located on the opposite side of the first plate surface, and a ring side surface connected between the first plate surface and the second plate surface; A sensing chip is mounted on the first surface of the ceramic substrate and is electrically coupled to the ceramic substrate; wherein the top surface of the sensing chip includes a sensing area and a carrying area surrounding the sensing area; An annular supporting layer formed in the supporting area of ​​the sensing chip; a light-transmitting sheet disposed on the annular supporting layer; wherein the light-transmitting sheet, the annular supporting layer, and the top surface of the sensing chip together surround a closed space, and the sensing area is located within the closed space; and A packaging body formed on the first surface of the ceramic substrate and covering the entire ring side surface, so that the ceramic substrate, the sensing chip, the ring-shaped supporting layer, and the light-transmitting sheet are buried in the packaging body; The second plate surface of the ceramic substrate and at least a portion of the outer surface of the light-transmitting sheet are exposed outside the packaging body, and the bottom edge of the packaging body is flush with the second plate surface of the ceramic substrate.

7. The sensor packaging structure according to claim 6, characterized in that: The ring side surface of the ceramic substrate has a first stepped surface connected to the first board surface, a second stepped surface connected to the second board surface, and a step surface connected between the first stepped surface and the second stepped surface, and the first stepped surface, the second stepped surface, and the step surface are all buried in the packaging body.

8. The sensor packaging structure according to claim 7, characterized in that: The first step surface, the second step surface, and the step surface are all annular, and the step surface is vertically connected to the first step surface and the second step surface.

9. The sensor packaging structure according to claim 6, characterized in that: The sensor packaging structure includes a plurality of metal wires connected to the ceramic substrate and the sensing chip, and the ceramic substrate and the sensing chip are electrically coupled to each other through the plurality of metal wires, and each of the metal wires is at least partially buried in the packaging body.

10. The sensor packaging structure according to claim 9, characterized in that: The ceramic substrate includes a plurality of bonding pads located on the first board surface, and the sensing chip is located on the inner side of the plurality of bonding pads, the top surface of the sensing chip includes a plurality of connection pads located in the bearing area, and the plurality of connection pads are buried in the annular support layer; wherein one end of the plurality of metal wires is respectively connected to the plurality of bonding pads, and the other ends of the plurality of metal wires are respectively connected to the plurality of connection pads and buried in the annular support layer.

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