A packaging jig capable of reducing silver glue climbing

Abstract

The application provides a packaging jig capable of reducing silver glue climbing, and relates to the technical field of semiconductor packaging. The packaging jig comprises an outer fixed base, an inner insertion bundle frame is inserted into the inner part of the outer fixed base, and the inner insertion bundle frame is sleeved on the outside of a glue loading inner groove; a glue flow frame groove is arranged in the inner part of the inner insertion bundle frame; a high leakage prevention groove is arranged in the inner part of the inner insertion bundle frame and is connected with the glue flow frame groove; when the glue climbs to the position of the high leakage prevention groove, the excess glue is leaked to the glue flow frame groove through the high leakage prevention groove, flows into the inner part of a solidification glue groove under the action of the inclined rectangular through hole, the excess glue is fixed in the inner part of the solidification glue groove, and thus the fixing of the glue is completed. The problems that, in terms of the current traditional packaging frame, the glue climbing risk of the frame to the thin chip of glue dispensing is relatively large, the bonding strength between the frame and the plastic encapsulation glue is relatively low, and the glue climbing risk of the thin chip in the installation process is relatively high are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, in particular to a packaging jig capable of reducing silver glue climbing. BACKGROUND

[0002] Semiconductor packaging is a process of connecting semiconductor chips with external circuits. Through packaging, the chip can be protected from physical and chemical damage, and reliable electrical connection and heat dissipation path are provided. The development of semiconductor packaging technology is of great significance to improve the performance, reliability and miniaturization of electronic products. With the continuous development of semiconductor technology, the integration of integrated circuits is becoming higher and higher, and the packaging technology is also constantly improving. Chips are becoming thinner and thinner. In the current packaging process of semiconductors, the frame is usually fixed by the glue dispensing method. With the increase of glue, the chip is prone to glue climbing during installation. In order to facilitate the installation of the chip, a packaging frame is needed.

[0003] As for the current traditional packaging frame, the glue climbing risk of the frame for dispensing thin chips is relatively high, the bonding strength between the frame and the plastic encapsulating material is low, and the thin chip has a high risk of glue climbing during installation. At the same time, the chip needs to be repaired after long-term use, and the glue needs to be melted and then removed. However, since the glue leaks to the external groove before solidification, it is not easy to melt the glue with the bottom glue, making it difficult to remove the thin chip. SUMMARY

[0004] The present application relates to a packaging jig capable of reducing silver glue climbing, which has a telescopic slide and an inner insertion frame. The telescopic slide is slidingly connected in the inner extension groove, facilitating its extension under the action of the spring, and the constraint insertion block is inserted in the inner constraint slot at the same time, so as to constrain the inner insertion frame by insertion, facilitate the removal of the chip by removing the inner insertion frame, and facilitate the repair of the chip. By opening the glue flow frame groove and the high leakage prevention groove in the inner insertion frame, the glue climbing on the chip will not contact other positions after external leakage, reducing the influence of the glue on the chip and facilitating its use.

[0005] In a first aspect, this disclosure provides an encapsulation fixture that reduces silver paste creepage, specifically comprising: an outer mounting base; an external wiring piece fixedly connected to the outside of the outer mounting base, and the external wiring piece being electrically connected to a power-conducting component inside the outer mounting base; an inner extension groove formed on the inner wall of the outer mounting base; a telescopic slide slidably connected within the inner extension groove; a constraint block fixedly connected to the outer wall of the telescopic slide; an adhesive-carrying inner groove fixed inside the outer mounting base by screws; an inner insertion frame inserted inside the outer mounting base, and the inner insertion frame fitting outside the adhesive-carrying inner groove; a dispensing frame groove formed inside the inner insertion frame; an anti-creep leakage groove formed inside the inner insertion frame, and the anti-creep leakage groove being connected to the dispensing frame groove; a solidification gel groove formed at the bottom of the inner insertion frame, and the solidification gel groove and the dispensing frame groove being connected by a rectangular through hole. The inner insertion frame is connected to the inner insertion frame. Equally spaced constraint slots are provided on the outer wall of the inner insertion frame, and constraint blocks are inserted into the constraint slots. A bottom fixing frame is fitted inside the solidification groove, and the bottom fixing frame is fixed to the bottom of the inner insertion frame with screws. Adhesive rods are fixed to the outer wall of the bottom fixing frame, and these adhesive rods are distributed within the solidification groove. The inner extension groove is a rectangular groove, with a cylindrical rod inside, and a disc-shaped protrusion on the cylindrical rod. The telescopic slide is an L-shaped structure, with a friction plate at the top, a circular groove on the telescopic slide, a circular through hole connected to the circular groove, and a spring on the inner side of the telescopic slide, allowing the telescopic slide to slide within the inner extension groove. The inner insertion frame is a rectangular frame structure, with a rectangular frame-shaped protrusion on its inner wall.

[0006] In at least some embodiments, the outer fixed base is configured as a cuboid structure, with a rectangular groove on the top of the outer fixed base and an electrical component inside the outer fixed base.

[0007] In at least some embodiments, the external wiring piece is configured as a conductive metal piece, and the external wiring piece is provided with a circular connection hole. There are two sets of external wiring pieces.

[0008] In at least some embodiments, the constraint insert is configured as a trapezoidal block structure; the adhesive carrier inner groove is configured as a cuboid structure, and the top of the adhesive carrier inner groove is provided with a rectangular groove.

[0009] In at least some embodiments, the glue-flowing frame groove is configured as a rectangular frame-shaped groove, and the inner wall of the glue-flowing frame groove is provided with an inclined surface.

[0010] In at least some embodiments, the anti-leakage groove is a circular through hole; the solidification groove is configured as a rectangular frame-shaped groove, and the inner side of the solidification groove is connected to the rectangular frame-shaped groove.

[0011] In at least some embodiments, the constraint slot is configured as a rectangular groove; the bottom fixing frame is configured as a rectangular frame-like structure, with rectangular frame-like protrusions on the inner wall of the bottom fixing frame and circular grooves evenly spaced on the outer wall of the bottom fixing frame.

[0012] In at least some embodiments, the adhesive rod is configured as a cylindrical structure with cylindrical protrusions and contact grooves on the cylindrical protrusions.

[0013] The packaging fixture provided by this invention, which reduces silver paste creep, has the following beneficial effects:

[0014] This invention features an internal insertion frame. By inserting the chip into the outer base and the inner adhesive carrier groove, the adhesive material inside the inner adhesive carrier groove rises as the chip is inserted. When the adhesive material rises to the position of the anti-leakage groove, the excess adhesive material is leaked out into the adhesive flow frame groove through the anti-leakage groove, and then flows into the interior of the solidification gel groove under the action of the inclined rectangular through hole. The excess adhesive material is fixed inside the solidification gel groove, thereby completing the fixation of the adhesive material.

[0015] In addition, a telescopic slide is provided. By removing the screws at the bottom of the outer fixed base, the constraint between the outer fixed base and the inner groove of the adhesive is released. Then, the bottom of the outer fixed base is heated to soften the bottom layer of the adhesive. Then, by pushing the telescopic slide outward, it can be adjusted in the inner extension groove. At the same time, the constraint block is slid out from the inside of the constraint slot to contact the constraint on the inner insertion frame. Then, by pulling up the inner insertion frame, the chip and the bottom adhesive can be removed together for easy use. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0017] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0018] In the attached diagram:

[0019] Figure 1 A schematic diagram of a three-dimensional assembly structure according to an embodiment of the present invention is shown;

[0020] Figure 2 A schematic diagram of the three-dimensional assembly bottom view structure according to an embodiment of the present invention is shown;

[0021] Figure 3 A schematic diagram of the exploded structure according to an embodiment of the present invention is shown;

[0022] Figure 4A schematic diagram of the exploded bottom view structure according to an embodiment of the present invention is shown;

[0023] Figure 5 A schematic diagram of a partially cut-out structure according to an embodiment of the present invention is shown;

[0024] Figure 6 The invention is illustrated by an embodiment of the invention. Figure 5 A schematic diagram of the enlarged structure of section A;

[0025] Figure 7 A schematic diagram of the assembly structure of the external fixed base and the telescopic carriage according to an embodiment of the present invention is shown;

[0026] Figure 8 A schematic diagram of the assembly structure of the intercalation frame and the bottom fixing frame according to an embodiment of the present invention is shown;

[0027] Figure 9 A schematic diagram of the interpolation frame structure from a bottom view according to an embodiment of the present invention is shown;

[0028] Figure 10 A schematic diagram of the assembly structure of the outer fixed base and the inner insertion frame according to an embodiment of the present invention is shown.

[0029] List of reference numerals

[0030] 1. External fixed base; 2. External connecting piece; 3. Internal extension groove; 4. Telescopic slide; 5. Constraint insert; 6. Inner adhesive groove; 7. Inner insert frame; 8. Adhesive flow frame groove; 9. Anti-leakage groove; 10. Solidifying gel groove; 11. Constraint slot; 12. Bottom fixed frame; 13. Adhesive rod. Detailed Implementation

[0031] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0032] Example 1: Please refer to Figures 1 to 10This invention proposes a packaging fixture that can reduce silver paste creepage, comprising: an outer base 1; an external wiring piece 2 fixedly connected to the outside of the outer base 1, and the external wiring piece 2 being electrically connected to a power-conducting component inside the outer base 1; an inner extension groove 3 formed on the inner wall of the outer base 1; a telescopic slide 4 slidably connected within the inner extension groove 3; a constraint insert 5 fixedly connected to the outer wall of the telescopic slide 4; an adhesive-carrying inner groove 6 fixed inside the outer base 1 by screws; an inner insertion frame 7 inserted inside the outer base 1, and the inner insertion frame 7 fitting outside the adhesive-carrying inner groove 6; an adhesive flow groove 8 formed inside the inner insertion frame 7; and an anti-creep leakage groove 9 formed inside the inner insertion frame 7, and the anti-creep leakage groove 9 being connected to the adhesive flow groove 6. The adhesive frame groove 8 is connected to the inner insertion frame 7; the bottom of the inner insertion frame 7 is provided with a gel-solidifying groove 10, and the gel-solidifying groove 10 is connected to the adhesive-solidifying frame groove 8 through a rectangular through hole; the outer wall of the inner insertion frame 7 is provided with equidistant constraint slots 11, and constraint blocks 5 are inserted inside the constraint slots 11; a bottom fixing frame 12 is fitted inside the gel-solidifying groove 10, and the bottom fixing frame 12 is fixed to the bottom of the inner insertion frame 7 by screws; adhesive rods 13 are fixed to the outer wall of the bottom fixing frame 12, and the adhesive rods 13 are distributed inside the gel-solidifying groove 10; the inner extension groove 3 is set as a rectangular groove, and a cylindrical rod is provided inside the inner extension groove 3, and a disc-shaped protrusion is provided on the cylindrical rod of the inner extension groove 3; the inner extension groove 3 is used to assist in the installation and fix the telescopic. The telescopic slide 4, during its sliding adjustment, causes the constraint block 5 to insert into the constraint slot 11, thus constraining the inner insertion frame 7 after insertion, maintaining the stability of the inner insertion frame 7, facilitating the constraint processing of thin chips, and making it easy to use. The telescopic slide 4 is designed with an L-shaped structure, with a friction plate on the top and a circular groove on the surface. The circular groove of the telescopic slide 4 is connected to a circular through hole, and a spring is provided on the inner side of the telescopic slide 4. The telescopic slide 4 is slidably connected to the inner extension groove 3. The telescopic slide 4, through its slidable connection to the inner extension groove 3, causes the constraint block 5 to adjust its position, thereby... The control constraint plug 5 is inserted into the constraint slot 11 to facilitate the constraint of the inner insertion frame 7. At the same time, it is quickly inserted under the action of the spring, which facilitates the quick docking process of the auxiliary device through instantaneous insertion, making it easy to use. The inner insertion frame 7 is set as a rectangular frame structure, and there are rectangular frame-shaped protrusions on the inner wall of the inner insertion frame 7. The inner insertion frame 7 is used to control the top liquid level of the adhesive by opening the glue flow frame groove 8 and the solidification gel groove 10 on the inner and outer walls respectively, and in conjunction with the anti-leakage groove 9. During the chip installation process, the adhesive is prevented from climbing up by leaking out, so as to avoid the adhesive from affecting the wire and facilitate the chip assembly process.

[0033] Example 2: Based on Example 1, as follows Figures 1 to 10As shown, the outer mounting base 1 is a cuboid structure with a rectangular groove on its top. An electrical component is located inside the outer mounting base 1. The outer mounting base 1 assists in the installation and fixation of other structures of the device, and connects to the external connector 2 and the chip via the internal electrical component to ensure normal operation of the chip after assembly. The external connector 2 is a conductive metal sheet with circular contact holes; two sets of external connectors are provided. The external connector 2 connects to the internal electrical component of the outer mounting base 1 to facilitate chip connection after external wiring, ensuring normal chip operation. The constraint plug 5 is a trapezoidal block structure. Block 5 is used for position adjustment under the drive of the telescopic slide 4, and is inserted into the constraint slot 11 during the adjustment process. This facilitates the constraint of the inner insertion frame 7 after insertion, so as to maintain stability and assist in the external discharge of the adhesive. The adhesive-carrying inner tank 6 is set as a cuboid structure, and the top of the adhesive-carrying inner tank 6 is provided with a rectangular groove. The adhesive-carrying inner tank 6 is used to assist in loading the adhesive for fixing the chip, so as to facilitate the chip fixing process. The dispensing frame groove 8 is set as a rectangular frame-shaped groove, and the inner wall of the dispensing frame groove 8 is provided with a slope. The dispensing frame groove 8 is used to assist in the external discharge of the climbing adhesive by connecting with the anti-high leakage groove 9, so as to prevent the adhesive from climbing too high and thus avoid damaging the chip. To prevent the adhesive from climbing too high and thus affecting its use, the anti-high leakage groove 9 is a circular through hole. The anti-high leakage groove 9 is used to assist in the leakage of the climbing adhesive by connecting with the dispensing frame groove 8, so as to prevent the adhesive from climbing too high and affecting the use of the chip. The solidification groove 10 is set as a rectangular frame-shaped groove, and the inner side of the solidification groove 10 is connected to a rectangular frame-shaped groove. The constraint slot 11 is set as a rectangular groove. The constraint slot 11 is used to constrain the inner insertion frame 7 through the constraint insert 5 during the insertion of the constraint insert 5, so as to maintain its overall stability and facilitate its use. The bottom fixing frame 12 is set as a rectangular frame-shaped structure. The inner wall of the frame 12 has rectangular frame-shaped protrusions, and the outer wall of the bottom fixing frame 12 has equidistant circular grooves. The bottom fixing frame 12 is used to constrain the adhesive rod 13 to facilitate its connection with the adhesive material, making it easy to remove the adhesive material along with the rod during disassembly. The adhesive rod 13 is designed as a cylindrical structure with cylindrical protrusions and contact grooves. The adhesive rod 13 is used to connect the adhesive material as it leaks into the solidification tank 10, so that when removing the chip, the chip can be removed by removing the entire intercalation frame 7, preventing damage to the chip during the removal process.

[0034] The specific usage and function of this embodiment: In this invention, during assembly, the external connector 2 is connected to the power-conducting component inside the external base 1. Then, the adhesive-carrying inner groove 6 is fixed inside the external base 1 with screws and kept stable. Next, the bottom frame 12 is fitted into the adhesive-carrying groove 10 and the two are fixed with screws. Then, the inner insertion frame 7 is inserted into the external base 1 as a whole, and during the insertion process, it is fitted into the adhesive-carrying inner groove 6, and the adhesive-carrying inner groove 6 and the inner insertion frame 7 are aligned. The walls are then fitted together, and then the adhesive material is filled into the inner tank 6. Finally, the chip is inserted into the outer base 1 and the inner tank 6. As the chip is inserted, the adhesive material inside the inner tank 6 rises. When the adhesive material rises to the position of the anti-leakage groove 9, the excess adhesive material is leaked out into the glue flow frame groove 8 through the anti-leakage groove 9. Under the action of the inclined rectangular through hole, it flows into the solidification gel tank 10. The excess adhesive material is fixed inside the solidification gel tank 10, thereby completing the fixation of the adhesive material.

[0035] When removing the chip, the screws at the bottom of the outer mounting base 1 are removed to release the constraint between the outer mounting base 1 and the inner adhesive groove 6. Then, the bottom of the outer mounting base 1 is heated to soften the bottom layer of adhesive. Then, the telescopic slide 4 is pushed outward to extend and retract within the inner extension groove 3. During the adjustment, the constraint insert 5 slides out from the inside of the constraint slot 11 to contact the constraint on the inner insertion frame 7. The chip is then removed along with the bottom adhesive by pulling up the inner insertion frame 7, making it easy to use.

[0036] The following points should be noted in this article:

[0037] 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in general design.

[0038] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0039] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A packaging fixture that reduces silver paste creep, characterized in that, include: External fixed base (1); An external connector (2) is fixedly connected to the outside of the outer fixed base (1), and the external connector (2) is electrically connected to the power supply component inside the outer fixed base (1); an inner extension groove (3) is provided on the inner wall of the outer fixed base (1); a telescopic slide (4) is slidably connected in the inner extension groove (3); a constraint insert (5) is fixedly connected to the outer wall of the telescopic slide (4); an adhesive-carrying inner groove (6) is fixed inside the outer fixed base (1) by screws; and an inner insert of the outer fixed base (1) is inserted inside the outer fixed base (1). An inner insertion frame (7) is provided, and the inner insertion frame (7) is fitted outside the adhesive carrier inner groove (6); an adhesive flow frame groove (8) is provided inside the inner insertion frame (7); an anti-leakage groove (9) is provided inside the inner insertion frame (7), and the anti-leakage groove (9) is connected to the adhesive flow frame groove (8); a solidification groove (10) is provided at the bottom of the inner insertion frame (7), and the solidification groove (10) is connected to the adhesive flow frame groove (8) through a rectangular through hole; the outer wall of the inner insertion frame (7) is equidistantly spaced A constraint slot (11) is provided, and a constraint insert (5) is inserted inside the constraint slot (11); a bottom fixing frame (12) is fitted inside the solidification groove (10), and the bottom fixing frame (12) is fixed to the bottom of the inner insertion frame (7) by screws; a glued rod (13) is fixed to the outer wall of the bottom fixing frame (12), and the glued rod (13) is distributed inside the solidification groove (10); the inner extension groove (3) is set as a rectangular groove, and a cylindrical rod is provided inside the inner extension groove (3). The cylindrical rod of the extension groove (3) is provided with a disc-shaped protrusion; the telescopic slide (4) is configured as an L-shaped structure, the top of the telescopic slide (4) is provided with a friction plate, the telescopic slide (4) is provided with a circular groove, the circular groove of the telescopic slide (4) is connected to a circular through hole, the inner side of the telescopic slide (4) is provided with a spring, and the telescopic slide (4) is slidably connected in the inner extension groove (3); the inner insertion frame (7) is configured as a rectangular frame structure, and the inner wall of the inner insertion frame (7) is provided with a rectangular frame protrusion.

2. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The outer fixed base (1) is configured as a cuboid structure, with a rectangular groove on the top of the outer fixed base (1) and an electrical component inside the outer fixed base (1).

3. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The external connector (2) is a conductive metal sheet with a circular connection hole. There are two sets of external connectors (2).

4. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The constraint plug (5) is configured as a trapezoidal block structure; the adhesive carrier inner groove (6) is configured as a cuboid structure, and the top of the adhesive carrier inner groove (6) is provided with a rectangular groove.

5. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The glue-flowing frame groove (8) is configured as a rectangular frame-shaped groove, and the inner wall of the glue-flowing frame groove (8) is provided with an inclined surface.

6. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The anti-leakage groove (9) is a circular through hole; the solidification groove (10) is set as a rectangular frame-shaped groove, and the inner side of the solidification groove (10) is connected to the rectangular frame-shaped groove.

7. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The constraint slot (11) is set as a rectangular groove; the bottom fixing frame (12) is set as a rectangular frame structure, the inner wall of the bottom fixing frame (12) is provided with a rectangular frame protrusion, and the outer wall of the bottom fixing frame (12) is provided with circular grooves at equal intervals.

8. The packaging fixture for reducing silver paste creepage according to claim 1, characterized in that: The adhesive rod (13) is configured as a cylindrical structure, with cylindrical protrusions on the adhesive rod (13) and contact grooves on the cylindrical protrusions of the adhesive rod (13).

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