Display panel and manufacturing method thereof

Abstract

An embodiment of the present application discloses a display panel and a preparation method thereof, wherein the display panel includes a substrate, a first insulating layer, a bonding metal layer, a first conductive layer, a light-emitting layer, a second insulating layer, and a second conductive layer, wherein a second via hole is provided through the bonding metal layer, the first conductive layer, and the light-emitting layer, and the second conductive layer covers the bottom surface, the side surface, and the light-emitting layer of the second via hole, and the ratio of the first thickness of the second conductive layer located on the side surface of the second via hole to the second thickness of the second conductive layer located in the light-emitting direction of the sub-light-emitting portion is in the range of 0.8 to 1; by increasing the thickness of the second conductive layer on the side surface of the second via hole, the risk of the second conductive layer on the side surface of the second via hole being broken or poorly connected is reduced, thereby alleviating the technical problem that the conductive layer on the side surface of the via hole in the existing display panel is prone to breaking.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] In the preparation process of existing display panels, etching patterning technology is usually used to form various patterns. The etched pattern will form a via. When the via is deep, a large channel step difference will be formed at the via. When the subsequent conductive film is deposited on the channel step in the via, the ratio of the thickness of the conductive film on the side surface of some deeper vias to its thickness at the bottom ranges from 0.3 to 0.5, resulting in a thinner thickness of the conductive film on the side. The conductive film will become thinner or even break on the side of the via due to the channel step difference, affecting the performance and yield of the display panel.

[0003] Therefore, the existing display panel has a technical problem that the conductive layer on the side of the via hole is prone to breakage. Summary of the Invention

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, which can alleviate the technical problem in existing display panels where the conductive layer on the side of the via hole is prone to breakage.

[0005] An embodiment of the present application provides a display panel, comprising:

[0006] a substrate comprising a driving circuit;

[0007] a first insulating layer, the first insulating layer being disposed above the substrate, and a first via hole being disposed through the first insulating layer;

[0008] a bonding metal layer, the bonding metal layer being disposed on a side of the first insulating layer away from the substrate, the bonding metal layer being electrically connected to the driving circuit through the first via;

[0009] a first conductive layer, the first conductive layer being disposed on a side of the bonding metal layer away from the substrate;

[0010] a light-emitting layer, the light-emitting layer being disposed on a side of the first conductive layer away from the substrate, a second via hole being disposed through the bonding metal layer, the first conductive layer, and the light-emitting layer, the light-emitting layer being divided into a plurality of sub-light-emitting portions by the second via hole, and a second via hole being disposed around a sub-light-emitting portion;

[0011] a second insulating layer, the second insulating layer at least covering the bottom surface and side surfaces of the second via hole;

[0012] a second conductive layer, wherein the entire surface of the second conductive layer is disposed on a side of the light-emitting layer and the second insulating layer away from the substrate, and the second conductive layer covers a bottom surface, a side surface, and the light-emitting layer of the second via hole;

[0013] Among them, the second conductive layer located at any position on the side of the second via has a first thickness in a direction perpendicular to the side at any position, the thickness of the second conductive layer located at the bottom of the second via has a second thickness, and the ratio of the first thickness to the second thickness ranges from 0.8 to 1.

[0014] Optionally, in some embodiments of the present application, the second conductive layer also includes a second portion located in the second via and a third portion connecting the first portion and the second portion, and the second portion includes a first sub-portion located on the side of the second via and a second sub-portion located on the bottom of the second via, wherein the thickness of the first portion is less than the thickness of the second sub-portion, and the thickness of the first portion is less than the thickness of the third portion.

[0015] Optionally, in some embodiments of the present application, the first sub-portion is arranged on a side surface of the second via hole with a uniform thickness.

[0016] Optionally, in some embodiments of the present application, the thickness of the first portion ranges from 1000 angstroms to 2000 angstroms.

[0017] Optionally, in some embodiments of the present application, the bonding metal layer includes a first sub-bonding layer and a second sub-bonding layer that are stacked, the first sub-bonding layer is arranged on the side of the first insulating layer away from the substrate, and the second sub-bonding layer is arranged on the side of the first sub-bonding layer away from the substrate, wherein the contact surface between the first sub-bonding layer and the second sub-bonding layer is roughened.

[0018] Optionally, in some embodiments of the present application, a first protrusion and a first groove are provided on the surface of the first sub-bonding layer facing the second sub-bonding layer, and a second protrusion and a second groove are provided on the surface of the second sub-bonding layer facing the first sub-bonding layer, wherein the first protrusion is adapted to the second groove, and the first groove is adapted to the second protrusion.

[0019] Optionally, in some embodiments of the present application, the preparation material of the first conductive layer includes a first reflective material.

[0020] Optionally, in some embodiments of the present application, the second part includes a first layer and a second layer that are stacked, the second layer is arranged on the side of the first layer away from the substrate, the first layer includes a second reflective material, the preparation material of the second layer is the same as the preparation material of the first part, and the second reflective material at least covers the side and bottom surfaces of the second via.

[0021] Optionally, in some embodiments of the present application, the material used to prepare the first part is a transparent material.

[0022] An embodiment of the present application provides a method for manufacturing a display panel, which is used to manufacture the display panel as described in any of the above embodiments, including:

[0023] Providing a semi-finished panel, the semi-finished panel comprising a substrate, a first insulating layer, a bonding metal layer, a first conductive layer, a light-emitting layer, and a second insulating layer sequentially disposed above the substrate, the light-emitting layer comprising a plurality of spaced-apart sub-light-emitting portions, and a second via hole formed in the semi-finished panel that penetrates the bonding metal layer, the first conductive layer, the light-emitting layer, and surrounds the sub-light-emitting portions;

[0024] Depositing a layer of first conductive material on the entire surface of the second insulating layer;

[0025] removing the first conductive material and a portion of the second insulating layer in the light emitting direction of the sub-light emitting portion;

[0026] Remove the remaining second insulating layer in the light emitting direction of the sub-light emitting portion by etching, exposing the top of the sub-light emitting portion;

[0027] A layer of second conductive material is deposited on top of the first conductive material and the sub-light-emitting portion, and the first conductive material and the second conductive material constitute the second conductive layer.

[0028] Beneficial effect: The first thickness of the second conductive layer on the side of the second via is close to the second thickness of the second conductive layer in the light emitting direction of the sub-light-emitting portion, and the ratio of the first thickness to the second thickness is in the range of 0.8 to 1. By increasing the thickness of the second conductive layer on the side of the second via, the risk of the second conductive layer on the side of the second via is reduced, thereby alleviating the technical problem that the conductive layer on the side of the via is prone to breakage in the existing display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a schematic cross-sectional view of a display panel provided in this application;

[0031] Figures 2A to 2E This is a process state diagram of the display panel manufacturing method provided by this application;

[0032] Figure 3 This is a flow chart of the display panel manufacturing method provided in this application.

[0033] Description of reference numerals:

[0034] DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0036] See also Figure 1The display panel provided in the present application includes a substrate 10, a first insulating layer 20, a bonding metal layer 30, a first conductive layer 40, a light-emitting layer 50, a second insulating layer 60, and a second conductive layer 70. The substrate 10 includes a driving circuit. The first insulating layer 20 is arranged above the substrate 10, and a first via hole 80 is arranged through the first insulating layer 20. The bonding metal layer 30 is arranged on a side of the first insulating layer 20 away from the substrate 10. The bonding metal layer 30 is electrically connected to the driving circuit through the first via hole 80. The first conductive layer 40 is arranged on a side of the bonding metal layer 30 away from the substrate 10. The light-emitting layer 50 is arranged on a side of the first conductive layer 40 away from the substrate 10. A second via hole 90 is provided, and the light-emitting layer 50 is divided into a plurality of sub-light-emitting portions by the second via hole 90. A second via hole 90 is arranged around a sub-light-emitting portion, and the second insulating layer 60 at least covers the bottom and side surfaces of the second via hole 90. The second conductive layer 70 is entirely provided on the side of the light-emitting layer 50 and the second insulating layer 60 away from the substrate 10. The second conductive layer 70 covers the bottom, side surfaces, and the light-emitting layer 50 of the second via hole 90; wherein, the second conductive layer 70 located at any position on the side surface of the second via hole 90 has a thickness of the first thickness in a direction perpendicular to the side surface at any position, and the second conductive layer 70 in the light-emitting direction of the sub-light-emitting portion has a second thickness, and the ratio of the first thickness to the second thickness is in the range of 0.8 to 1.

[0037] In this embodiment, the first thickness of the second conductive layer 70 on the side of the second via 90 is close to the second thickness of the second conductive layer in the light emitting direction of the sub-light-emitting portion, and the ratio of the first thickness to the second thickness is in the range of 0.8 to 1. By increasing the thickness of the second conductive layer 70 on the side of the second via 90, the risk of the second conductive layer 70 on the side of the second via 90 being broken or poorly connected is reduced, thereby alleviating the technical problem of the conductive layer on the side of the via hole in the existing display panel being prone to breakage.

[0038] The technical solution of this application is now described in conjunction with specific embodiments.

[0039] It should be noted that the side surface of the second via hole 90 referred to in this application includes the inner wall slope of the second via hole 90 and the surface of the stepped corner.

[0040] It should be noted that due to the large hole depth, the second via hole needs to be formed by two hole-digging processes. Therefore, the second via hole formed by the two hole-digging processes has a stepped structure. The side of the second via hole disclosed in this application includes the side of the two holes. That is to say, the first thickness of the second conductive layer at the side of the two holes needs to meet the above-mentioned ratio range to the second thickness.

[0041] It should be noted that the second conductive layer in the second via hole may include two stacked layers, namely a first layer formed of a first conductive material and a second layer formed of a second conductive material, and the first layer and the second layer are in a stacked structure in the second via hole.

[0042] In one embodiment, the second conductive layer 70 includes a first portion 701 arranged in the light emitting direction of the sub-light-emitting portion, a second portion 702 located in the second via hole, and a third portion 703 connecting the first portion 701 and the second portion 702, and the second portion includes a first sub-portion located on the side of the second via hole and a second sub-portion located on the bottom of the second via hole, wherein the thickness of the first portion 701 is less than the thickness of the second sub-portion, and the thickness of the first portion 701 is less than the thickness of the third portion 703.

[0043] The thickness of the first portion 701 is smaller than the thickness of the second portion 702 .

[0044] The first portion 701 may cover the sub-light-emitting portion in the film thickness direction.

[0045] It can be understood that the thickness of the first part 701 located in the light emitting direction of the sub-light emitting portion is smaller than that of the second part 702 and the third part 703. By reducing the thickness of the first part 701, the light transmittance of the first part 701 is improved.

[0046] It is understood that the second conductive layer 70 may be formed by depositing the second conductive layer twice to achieve the thickness of the first portion 701 being smaller than the thickness of the second portion 702 or the third portion 703 .

[0047] It should be noted that the second conductive layer 70 in the light emitting direction of the sub-light emitting portion is the first portion 701 , that is, the thickness of the first portion 701 is the second thickness.

[0048] In this embodiment, by reducing the thickness of the first portion 701 of the second conductive layer 70 located in the light emitting direction of the sub-light emitting portion, the light transmittance of the first portion 701 is increased, thereby improving the light emission intensity of the display panel.

[0049] In one embodiment, the thickness of the first portion 701 ranges from 1000 angstroms to 2000 angstroms.

[0050] The thickness of the first portion 701 may be 1000 angstroms, 1500 angstroms, or 2000 angstroms.

[0051] It is understandable that, under the premise of ensuring that the first part 701 has good conductivity and is not easy to break, the smaller the thickness of the first part 701, the greater the light transmittance of the first part 701, which is more conducive to improving the light output intensity of the display panel.

[0052] In one embodiment, the first portion 701 is made of a transparent material.

[0053] The first part 701 is made of a material including indium tin oxide.

[0054] It is understandable that setting the first part 701 to a transparent material can further improve the light transmittance of the first part 701; the transparent material can be an indium tin oxide material but is not limited thereto, and other transparent materials that meet the conductive properties are within the protection scope of this embodiment.

[0055] It should be noted that, since the second portion 702 and the third portion 703 are not arranged in the light emitting direction, they may include transparent materials or non-transparent materials, and the specific selection is made according to actual needs.

[0056] In this embodiment, by making the first portion 701 of a transparent material, the light output intensity is further improved.

[0057] In one embodiment, the second portion 702 includes a first sub-portion located on the side of the second via hole 90 and a second sub-portion located on the bottom of the second via hole 90 , wherein the first sub-portion is arranged on the side of the second via hole 90 with uniform thickness.

[0058] It is understandable that the thickness of the side of the second via 90 can be achieved through multiple depositions according to actual needs. The multiple depositions here include but are not limited to two depositions to form the second conductive layer 70, and can also be three or more times, which also fall within the scope of protection of this application.

[0059] It should be noted that, since the present application can obtain the second conductive layer 70 through multiple depositions, multiple depositions of conductive material will be performed on the side of the second via 90. Taking two depositions as an example, the two depositions can make the thickness of the first sub-portion of the second conductive layer 70 located on the side of the second via 90 more uniform, which is beneficial to the signal transmission of the second conductive layer 70 and improves the uniformity of the voltage drop of the second conductive layer 70.

[0060] In this embodiment, the second conductive layer 70 is obtained by two or more depositions, which improves the thickness uniformity of the first sub-portion of the second conductive layer 70 located on the side of the second via 90, thereby achieving a more uniform voltage drop and improving the display effect.

[0061] In one embodiment, the bonding metal layer 30 includes a first sub-bonding layer and a second sub-bonding layer that are stacked, the first sub-bonding layer is arranged on the side of the first insulating layer 20 away from the substrate 10, and the second sub-bonding layer is arranged on the side of the first sub-bonding layer away from the substrate 10, wherein the contact surface between the first sub-bonding layer and the second sub-bonding layer is roughened.

[0062] The roughening setting includes but is not limited to fitting and engaging the concave-convex structure, surface roughening treatment, and surface melting welding.

[0063] It can be understood that when the sub-light-emitting part is an MLED chip, the MLED chip is prepared first, and a second sub-bonding layer is formed on one side of the MLED chip, and a first sub-bonding layer is formed on one side of the substrate 10. The first sub-bonding layer and the second sub-bonding layer are assembled to realize the transfer of the LED, and the assembly method includes but is not limited to welding.

[0064] In this embodiment, by roughening the contact surface between the first sub-bonding layer and the second sub-bonding layer, the bonding strength between the sub-light-emitting portion and the substrate 10 is improved, and the stability of the display panel is also improved.

[0065] In one embodiment, a first protrusion and a first groove are provided on a surface of the first sub-bonding layer facing the second sub-bonding layer, and a second protrusion and a second groove are provided on a surface of the second sub-bonding layer facing the first sub-bonding layer, wherein the first protrusion is adapted to the second groove, and the first groove is adapted to the second protrusion.

[0066] It can be understood that, for example, in the process of transferring the MLED chip by welding the second sub-bonding layer of the MLED chip and the first sub-bonding layer of the substrate 10, the structural manifestation of the welding method is actually that the sub-bonding layers on both sides adapt to each other through protrusions and grooves; in addition, the above-mentioned protrusions and grooves can be pre-arranged on the side where the first sub-bonding layer and the second sub-bonding layer face each other, so that the first protrusion adapts to the second groove, and the first groove adapts to the second protrusion.

[0067] In this embodiment, the contact area between the first sub-bonding layer and the second sub-bonding layer is increased by the mutually adapted protrusions and grooves, thereby enhancing the bonding force therebetween.

[0068] In one embodiment, the first conductive layer 40 is made of a first reflective material.

[0069] The sub-light emitting portions are stacked horizontally, and any sub-light emitting portion emits light of only one color.

[0070] It is understandable that, since the light emitting direction of the sub-light emitting portion may be toward a side away from the substrate 10 and the display panel is top-emitting, the first conductive layer 40 may include a reflective material to enhance light emission.

[0071] In one embodiment, the sub-light emitting portions may also be arranged in a vertical stack.

[0072] Among them, the sub-light-emitting portion may at least include a first light-emitting portion and a second light-emitting portion vertically stacked along the film thickness direction, the first light-emitting portion and the second light-emitting portion have different luminous colors, and when the sub-light-emitting portion emits light, either the first light-emitting portion or the second light-emitting portion can be selected to emit light; it can be understood that the sub-light-emitting portion may also include a vertically stacked third light-emitting portion, and stacking arrangements with more numbers or more luminous colors should also fall within the scope of protection of this application.

[0073] In one embodiment, the second portion 702 includes a first layer and a second layer stacked together, the second layer is arranged on a side of the first layer away from the substrate, the first layer includes a second reflective material, and the second reflective material at least covers the side and bottom surfaces of the second via 90.

[0074] The second conductive layer 70 is made of a second reflective material, and the second reflective material at least covers the side surfaces and the bottom surface of the second via hole 90 .

[0075] It can be understood that the second portion 702 is arranged between adjacent sub-light-emitting portions of different luminous colors, acting as a light-shielding layer to prevent the light of adjacent sub-light-emitting portions of different luminous colors from mixing.

[0076] In this embodiment, the second portion 702 includes a reflective material to avoid color mixing between adjacent sub-light-emitting portions of different luminous colors, thereby eliminating the need for an additional light-shielding structure similar to a black matrix between adjacent sub-light-emitting portions, thereby reducing costs.

[0077] In one embodiment, the driving circuit includes a silicon-based light emitting diode, and the sub-light emitting portion is an MLED chip.

[0078] It can be understood that the display panel formed by combining silicon-based light-emitting diodes and MLED chips is a small-sized display panel, which is more suitable for the design of this scheme in terms of process; therefore, this scheme mainly uses the small-sized display panel formed by combining such silicon-based light-emitting diodes and MLED chips as an example. Other display panels to which the inventive concept of this application can be applied also fall within the scope of protection of this application.

[0079] See also Figures 2A to 2E 、 Figure 3 , an embodiment of the present application further provides a method for manufacturing a display panel, comprising:

[0080] S1: Providing a semi-finished panel, the semi-finished panel comprising a substrate 10, a first insulating layer 20, a bonding metal layer 30, a first conductive layer 40, a light-emitting layer 50, and a second insulating layer 60 sequentially disposed on the substrate, the light-emitting layer comprising a plurality of spaced-apart sub-light-emitting portions, and a second via hole 90 penetrating the bonding metal layer, the first conductive layer, and the light-emitting layer 50 and surrounding the sub-light-emitting portions. Provide a substrate 10;

[0081] S2: depositing a layer of first conductive material 100 on the entire surface of the second insulating layer 60;

[0082] S3: removing the first conductive material 100 and a portion of the second insulating layer 60 in the light emitting direction of the sub-light emitting portion;

[0083] S4: removing the remaining second insulating layer 60 in the light emitting direction of the sub-light emitting portion by etching, exposing the top of the sub-light emitting portion;

[0084] S5: depositing a layer of second conductive material on top of the first conductive material 100 and the sub-light-emitting portion. The first conductive material 100 and the second conductive material constitute the second conductive layer 70 .

[0085] Among them, the semi-finished panel in step S1 is as follows Figure 2A structure;

[0086] Among them, the following is obtained through step S2: Figure 2B structure;

[0087] Among them, the following is obtained through step S3: Figure 2C The structure of the present invention can further include the step of removing the first conductive material 100 and a portion of the second insulating layer 60 in the light emitting direction of the sub-light emitting portion, and removing the first conductive material 100 and a portion of the second insulating layer 60 in the light emitting direction of the sub-light emitting portion by using a surface planarization process. Such a surface planarization process has higher etching accuracy and can better protect the sub-light emitting portion from etching damage.

[0088] The first conductive material and the second conductive material may be the same or different and may be selected according to actual needs.

[0089] Among them, the following is obtained through step S4: Figure 2D The structure of FIG1 is as follows, wherein etching to remove the second insulating layer 60 remaining in the light emitting direction of the sub-light emitting portion can be done by wet etching using an etchant that does not damage the sub-light emitting portion.

[0090] Among them, the following is obtained through step S5: Figure 2E The structure, wherein the Figure 2E The structure not only increases the thickness of the second conductive layer 70 on the side of the second via hole 90 by secondary deposition, but also reduces the thickness of the second conductive layer 70 in the light emitting direction of the sub-light emitting portion.

[0091] It is understandable that for Figure 2A The semi-finished panel shown can be prepared by separately preparing the first part: a base 10, a first insulating layer 20, and a first sub-bonding layer 301; the second part: forming a light-emitting layer 50 on a supporting substrate, and sequentially arranging a first conductive layer 40 and a first sub-bonding layer 301 on the side of the light-emitting layer away from the supporting substrate, transferring the second part to the first part, combining the first sub-bonding layer and the second sub-bonding layer by a method not limited to welding, then removing the supporting substrate, and forming the second via 90 from the side of the light-emitting layer, and finally preparing the second insulating layer on the entire surface of the side of the light-emitting layer away from the base.

[0092] In this embodiment, the second conductive layer 70 is formed by deposition in a two-step process. The first step is to deposit the first conductive material 100 on the entire surface, remove the first conductive material 100 in the light-emitting direction of the light-emitting layer 50, and retain at least the first conductive material 100 in the second via 90. Then, the second step is to deposit the second conductive material on the entire surface to form the second conductive layer 70, thereby increasing the thickness of the second conductive layer 70 on the side of the second via 90. The thickness of the second conductive layer on the side of the second via 90 is the first thickness, which is close to the thickness of the second conductive layer in the light-emitting direction of the sub-light-emitting portion, that is, the second thickness. The ratio of the first thickness to the second thickness is in the range of 0.8 to 1, thereby avoiding the risk of breakage or virtual connection of the second conductive layer 70 on the side of the second via 90.

[0093] The present application deposits the second conductive layer 70 twice or multiple times, so that the thickness of the second conductive layer 70 on the side of the second via 90 is closer to the thickness of the second conductive layer 70 in the light emitting direction of the sub-light-emitting portion. By depositing the second conductive layer 70 twice, the thickness of the second conductive layer 70 on the side of the second via 90 is increased, the risk of the second conductive layer 70 on the side of the second via 90 being broken or poorly connected is reduced, the connection and conduction capability of the second conductive layer 70 is improved, the performance of the display panel is enhanced, and the manufacturing yield of the display panel is improved.

[0094] The present application also proposes a display module and a terminal device, both of which include the above-mentioned display panel, which will not be repeated here; wherein, the display module also includes at least one of a back plate, a cover plate, an optical film, and a polarizer, and the terminal device includes but is not limited to a mobile phone, a laptop computer, and a tablet computer.

[0095] The display panel provided by the embodiment of the present application includes a substrate, a first insulating layer, a bonding metal layer, a first conductive layer, a light-emitting layer, a second insulating layer, and a second conductive layer, the substrate including a driving circuit, the first insulating layer is arranged above the substrate, a first via hole is arranged through the first insulating layer, the bonding metal layer is arranged on a side of the first insulating layer away from the substrate, the bonding metal layer and the driving circuit are electrically connected through the first via hole, the first conductive layer is arranged on a side of the bonding metal layer away from the substrate, the light-emitting layer is arranged on a side of the first conductive layer away from the substrate, a second via hole is arranged through the bonding metal layer, the first conductive layer, and the light-emitting layer, the light-emitting layer is divided into a plurality of sub-light-emitting portions by the second via hole, a second via hole is arranged around a sub-light-emitting portion, the second insulating layer at least covers the bottom surface and the side surface of the second via hole, and the entire second conductive layer is arranged on the light-emitting layer, the The second insulating layer is away from one side of the substrate, and the second conductive layer covers the bottom surface, side surface and the light-emitting layer of the second via hole; wherein, the second conductive layer located at any position on the side surface of the second via hole has a first thickness in the direction perpendicular to the side surface at any position, and a second thickness of the second conductive layer located in the light-emitting direction of the sub-light-emitting portion, and the ratio of the first thickness to the second thickness is in the range of 0.8 to 1; the first thickness of the second conductive layer on the side surface of the second via hole is close to the second thickness of the second conductive layer in the light-emitting direction of the sub-light-emitting portion, and the ratio of the first thickness to the second thickness is in the range of 0.8 to 1, and the thickness of the second conductive layer on the side surface of the second via hole is increased through the secondary deposition process, thereby reducing the risk of the second conductive layer on the side surface of the second via hole being broken or poorly connected, thereby alleviating the technical problem that the conductive layer on the side surface of the via hole in the existing display panel is prone to breaking.

[0096] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0097] The above is a detailed introduction to the display panel and the display panel preparation method provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: a substrate comprising a driving circuit; a first insulating layer, the first insulating layer being disposed above the substrate, and a first via hole being disposed through the first insulating layer; a bonding metal layer, the bonding metal layer being disposed on a side of the first insulating layer away from the substrate, the bonding metal layer being electrically connected to the driving circuit through the first via; a first conductive layer, the first conductive layer being disposed on a side of the bonding metal layer away from the substrate; a light-emitting layer, the light-emitting layer being disposed on a side of the first conductive layer away from the substrate, a second via hole being disposed through the bonding metal layer, the first conductive layer, and the light-emitting layer, the light-emitting layer being divided into a plurality of sub-light-emitting portions by the second via hole, and a second via hole being disposed around a sub-light-emitting portion; a second insulating layer, the second insulating layer at least covering the bottom surface and side surfaces of the second via hole; a second conductive layer, wherein the entire surface of the second conductive layer is disposed on a side of the light-emitting layer and the second insulating layer away from the substrate, and the second conductive layer covers a bottom surface, a side surface, and the light-emitting layer of the second via hole; In which, the second conductive layer includes a first part arranged in the light emitting direction of the sub-light-emitting portion, and the second conductive layer located at any position on the side of the second via hole has a thickness of the first thickness in a direction perpendicular to the side at any position, and the thickness of the first part is the second thickness, and the ratio of the first thickness to the second thickness ranges from 0.8 to 1.

2. The display panel according to claim 1, wherein The second conductive layer also includes a second portion located in the second via and a third portion connecting the first portion and the second portion, the second portion includes a first sub-portion located on the side of the second via and a second sub-portion located on the bottom of the second via, wherein the thickness of the first portion is less than the thickness of the second sub-portion, and the thickness of the first portion is less than the thickness of the third portion.

3. The display panel according to claim 2, wherein: The first sub-portion is arranged on a side surface of the second via hole with a uniform thickness.

4. The display panel according to claim 3, wherein: The thickness of the first portion ranges from 1000 angstroms to 2000 angstroms.

5. The display panel according to claim 1, wherein: The bonding metal layer includes a first sub-bonding layer and a second sub-bonding layer which are stacked together. The first sub-bonding layer is arranged on the side of the first insulating layer away from the substrate, and the second sub-bonding layer is arranged on the side of the first sub-bonding layer away from the substrate, wherein the contact surface between the first sub-bonding layer and the second sub-bonding layer is roughened.

6. The display panel according to claim 5, wherein: A first protrusion and a first groove are provided on the surface of the first sub-bonding layer facing the second sub-bonding layer, and a second protrusion and a second groove are provided on the surface of the second sub-bonding layer facing the first sub-bonding layer, wherein the first protrusion is adapted to the second groove, and the first groove is adapted to the second protrusion.

7. The display panel according to claim 2, wherein: The first conductive layer is made of a first reflective material.

8. The display panel according to claim 7, wherein: The second part includes a first layer and a second layer that are stacked together, the second layer is arranged on the side of the first layer away from the substrate, the first layer includes a second reflective material, the preparation material of the second layer is the same as the preparation material of the first part, and the second reflective material at least covers the side and bottom surfaces of the second via.

9. The display panel according to claim 8, wherein: The preparation material of the first part is a transparent material.

10. A method for preparing a display panel, for preparing the display panel according to any one of claims 1 to 9, characterized in that: include: Providing a semi-finished panel, the semi-finished panel comprising a substrate, a first insulating layer, a bonding metal layer, a first conductive layer, a light-emitting layer, and a second insulating layer sequentially disposed above the substrate, the light-emitting layer comprising a plurality of spaced-apart sub-light-emitting portions, and a second via hole formed in the semi-finished panel that penetrates the bonding metal layer, the first conductive layer, the light-emitting layer, and surrounds the sub-light-emitting portions; Depositing a layer of first conductive material on the entire surface of the second insulating layer; removing the first conductive material and a portion of the second insulating layer in the light emitting direction of the sub-light emitting portion; Remove the remaining second insulating layer in the light emitting direction of the sub-light emitting portion by etching, exposing the top of the sub-light emitting portion; A layer of second conductive material is deposited on top of the first conductive material and the sub-light-emitting portion, and the first conductive material and the second conductive material constitute the second conductive layer.

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