Chip positioning method and system

Abstract

The present invention provides a chip positioning method and system, which relates to the technical field of semiconductor lasers, and includes the steps of: S10. In the field of view of the image acquisition mechanism, a visual pixel coordinate system with an x-axis and a y-axis is established; S20. The image acquisition mechanism is used to collect an image of the surface of the laser for assembling the chip and establish a standard chip image; S30. Feature matching is performed with the standard chip image to locate the pixel coordinates (X, Y) of the center of the chip to be processed, and the positive direction rotation angle θ of the chip to be processed relative to the standard chip, where the positive direction is the rotation direction around the z-axis; S40. According to the pixel coordinates (X, Y) of the center of the chip to be processed, the laser is moved so that the center point of the chip to be processed is at the origin of the pixel coordinate system; with the center point of the chip to be processed as the rotation center, the laser is rotated by -θ around the z-axis so that the positive direction rotation angle θ of the chip to be processed is zero.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor lasers, and more particularly, to a chip positioning method and system. Background Art

[0002] A high-power pump module is composed of multiple high-power semiconductor chips and their optical passive devices, and the semiconductor chips usually adopt the Chip On Substrate (COS) packaging form.

[0003] Each COS package reserves a specific mounting area on the module carrier for manual assembly. However, this manual mounting method may cause deviations in the position and angle of the COS package after mounting, thus increasing the complexity of subsequent COS chip mounting and power-on. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip positioning method and system, which can improve the accuracy of subsequent COS chip mounting and power-on.

[0005] In a first aspect, the present invention provides a chip positioning method, including the steps of:

[0006] S10. Establish a visual pixel coordinate system with an x-axis and a y-axis within the field of view of the image acquisition mechanism;

[0007] S20. Use the image acquisition mechanism to acquire an image of the surface of the laser for chip assembly and establish a standard chip image;

[0008] S30. Perform feature matching with the standard chip image to locate the pixel coordinates (X, Y) of the center of the chip to be processed, and the positive direction rotation angle θ of the chip to be processed relative to the standard chip, where the positive direction is the rotation direction around the z-axis;

[0009] S40. According to the pixel coordinates (X, Y) of the center of the chip to be processed, move the laser so that the center point of the chip to be processed is at the origin of the pixel coordinate system;

[0010] Taking the center point of the chip to be processed as the rotation center, rotate the laser by -θ around the z-axis so that the positive direction rotation angle θ of the chip to be processed is zero, where the x-axis, y-axis, and z-axis are perpendicular to each other.

[0011] Further, the step S30 specifically includes the steps of: performing feature matching with the standard chip image to locate the pixel coordinates (X n , Y n ) of the centers of at least two chips, and the positive direction rotation angles θ of the at least two chips relative to the standard chip n , where n is the chip number;

[0012] In step S40, after the center point of the previous chip is at the origin of the pixel coordinate system and the rotation angle of the positive direction of the chip is zero, the laser is moved according to the position differences △X and △Y in the x-axis direction and the y-axis direction between the pixel coordinates of the center of the previous chip and the pixel coordinates of the center of the next chip, so that the center point of the next chip is at the origin of the pixel coordinate system.

[0013] Further, when the rotation angle of the positive direction of the previous chip is zero, according to the difference △θ between the rotation angle of the positive direction of the previous chip and the rotation angle of the positive direction of the next chip, with the center point of the next chip as the rotation center, the laser is rotated around the z-axis by -△θ, so that the rotation angle of the positive direction of the next chip is zero.

[0014] Further, the chip positioning method further includes a step performed between step S30 and step S40:

[0015] Compare the rotation angle θ of the positive direction of the chip to be processed with a first preset value;

[0016] When the rotation angle θ of the positive direction of the chip to be processed is greater than zero degree and less than or equal to the first preset value, the chip to be processed is a chip to be adjusted, and step S40 is performed on the chip to be adjusted;

[0017] When the rotation angle θ of the positive direction of the chip to be processed is greater than the first preset value, the chip to be processed is a non-conforming chip.

[0018] Further, the chip positioning method further includes a step performed between step S30 and step S40:

[0019] Step S31. Detect the tilt angle of the top surface of the chip to be processed with respect to the plane formed by the x-axis and the y-axis;

[0020] Step S32. When the tilt angle is greater than zero degree and less than or equal to a second preset value, the chip to be processed is a chip to be adjusted;

[0021] When the tilt angle is greater than the second preset value, the chip to be processed is a non-conforming chip.

[0022] Further, step S31 includes steps:

[0023] Obtain the side lengths L 标 and W 标 ;

[0024] in the x-axis direction and the y-axis direction of the standard chip image respectively;

[0025] Step S32 includes steps:

[0026] When L / L 标 is less than a third preset value, or when W / W 标 is less than a fourth preset value, the chip to be processed is a non - qualified chip;

[0027] When L / L 标 is greater than or equal to the third preset value, and W / W 标 is greater than or equal to the fourth preset value, the chip to be processed is a chip to be adjusted.

[0028] Further, the chip positioning method further includes a step performed after step S32:

[0029] Step S33. Obtain a first tilt angle α x and a second tilt angle α y of the top surface of the chip to be adjusted with respect to the plane formed by the x - axis and the y - axis in the x - axis direction and the y - axis direction respectively;

[0030] The step S40 includes the steps of:

[0031] According to the first tilt angle α x and the second tilt angle α y of the chip to be adjusted, with the center point of the chip to be adjusted as the rotation center, rotate the laser - α x around the y - axis, so that the first tilt angle α x of the chip to be adjusted in the x - axis direction is zero; with the center point of the chip to be adjusted as the rotation center, rotate the laser - α y around the x - axis, so that the second tilt angle α y of the chip to be adjusted in the y - axis direction is zero.

[0032] Further, the step S33 specifically includes:

[0033] Set the coordinates of the center point of the non - deflected chip as (X 未 , Y 未 );

[0034] Grab the coordinates of the center point of a chip to be adjusted (X 前 , Y 前 );

[0035] Taking any point other than (X 前 , Y 前 ) as the rotation center, offset the laser by an angle α 改x and α 改y on the x - axis and the y - axis respectively;

[0036] Grab the coordinates of the center point of the offset chip (X 后 , Y 后 );

[0037] The first tilt angle α is calculated according to Formulas 1 - 4 x and the second tilt angle α y :

[0038] X 未 / X 前 = cos(α x ) Formula 1

[0039] X 未 / X 后 = cos(α x + α 改x ) Formula 2

[0040] Y 未 / Y 前 = cos(α y ) Formula 3

[0041] Y 未 / Y 后 = cos(α y + α 改y ) Formula 4

[0042] Wherein, α 改x and α 改y are known quantities.

[0043] In a second aspect, a chip positioning system provided by the present invention applies the above chip positioning method, and includes: an image acquisition mechanism and a moving platform. The moving platform is used to fix a laser, and the moving platform can drive the laser to move in the x-axis and y-axis directions, and rotate around the z-axis.

[0044] In a third aspect, a chip positioning system provided by the present invention applies the above chip positioning method, and includes: an image acquisition mechanism and a moving platform. The moving platform is used to fix a laser, and the moving platform can drive the laser to move in the x-axis and y-axis directions, rotate around the z-axis, and adjust the pitch angle with respect to the plane formed by the x-axis and y-axis.

[0045] The beneficial effects of the embodiments of the present invention are as follows:

[0046] Before subsequent processing of the chip, such as power-on or chip mounting, the method provided by the present invention can be used to lock the chip to be processed first. In the pixel coordinate system within the field of view of the image acquisition mechanism, the pixel coordinates (X, Y) of the center of the chip to be processed are located, as well as the positive direction rotation angle θ of the chip to be processed relative to the standard chip (abbreviated as the positive direction rotation angle θ of the chip to be processed). Then, the laser is moved so that the center point of the chip to be processed is at the origin of the pixel coordinate system, and the laser is rotated by -θ so that the positive direction rotation angle θ of the chip to be processed is zero. At this time, in the pixel coordinate system, the actual state of the chip to be processed is the standard state, and subsequent chip mounting or power-on processing can be performed thereon with higher accuracy. Other chips on the laser that need to be mounted or powered on are also processed using the same method and can be adjusted to the standard state, providing precise positioning for processes such as chip mounting and power-on of the chips within the laser. Description of the Drawings

[0047] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0048] Figure 1 It is a flowchart of the chip positioning method provided by the embodiment of the present invention;

[0049] Figure 2 It is the image after binarization processing in step S20 of the chip positioning method provided by the embodiment of the present invention;

[0050] Figure 3 It is a schematic diagram of an image of a chip collected by the image acquisition mechanism in the chip positioning method provided by the embodiment of the present invention.

[0051] Figure 4 It is a schematic diagram of an image of another chip collected by the image acquisition mechanism in the chip positioning method provided by the embodiment of the present invention.

[0052] Reference Signs: 1 - Chip; 2 - Standard Chip Image; 3 - Chip to be Processed. Detailed Embodiments

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0054] Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0055] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0056] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0057] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0058] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] As Figure 1 shown, the chip positioning method provided by the present invention includes the steps:

[0060] S10. Establish a visual pixel coordinate system with the x-axis and y-axis in the field of view of the image acquisition mechanism.

[0061] Among them, the origin of the pixel coordinate system can be the center of the image acquisition mechanism, which is convenient for acquiring the complete image of the laser and focusing on each chip 1. Of course, in other implementable solutions, the origin can also be set at other positions in the field of view.

[0062] Calculate the actual distance d corresponding to the side length of a pixel, so as to establish a proportional relationship between the distance information on the image and the actual distance. The nine-point marking method can be used to calculate the actual distance d corresponding to the side length of a pixel. Among them, the nine-point marking method is an existing technology, and the specific calculation process will not be elaborated.

[0063] S20. Use the image acquisition mechanism to acquire an image of the surface of the laser for assembling chip 1.

[0064] The image acquisition mechanism is located directly above the laser, and it acquires images from top to bottom to obtain the images of all chips 1 on the laser. The acquired images can be binarized, and then a standard chip image 2 is established.

[0065] As Figure 2 shown, after the physical picture of the laser acquired by the image acquisition mechanism is visually binarized, a picture is generated, and subsequent feature matching and positioning are performed based on this picture to provide accurate coordinates for the positioning of chip 1 on the subsequent laser.

[0066] In this embodiment, the shape of the chip 1 image is rectangular. After binarization and before feature matching, a standard chip image 2 needs to be established. The length, width, and gray value information of each pixel of the standard chip image 2 are known quantities. The standard chip image 2 is established by using the visual software tool, and this step can be obtained by existing technologies.

[0067] S30. Perform feature matching with the standard chip image 2 to locate the pixel coordinates (X, Y) of the center of the chip 3 to be processed, and the positive direction rotation angle θ of the chip 3 to be processed relative to the standard chip 1. The positive direction is the rotation direction around the z-axis.

[0068] As Figure 3As shown in the figure, by comparing the gray values of each pixel of the collected image of chip 1 with the standard chip image 2, the pixel coordinates (X, Y) of the center of the chip 3 to be processed can be obtained, as well as the positive rotation angle θ of the chip 3 to be processed relative to the standard chip 1. This step belongs to the prior art. In the pixel coordinate system, the pixel coordinates (X, Y) of the center point of the chip 3 to be processed and the positive rotation angle θ of the chip 3 to be processed are detected. Among them, the positive rotation angle θ refers to the rotation angle of one side length of the chip 1 to be processed relative to the same side length of the standard chip image 2 around the z-axis on the plane where the x-axis and y-axis are located. Among them, the x-axis, y-axis, and z-axis are perpendicular to each other.

[0069] S40. According to the pixel coordinates (X, Y) of the center of the chip 3 to be processed, move the laser so that the center point of the chip 3 to be processed is at the origin of the pixel coordinate system; with the center point of the chip 3 to be processed as the rotation center, rotate the laser by -θ around the z-axis so that the positive rotation angle θ of the chip 3 to be processed is zero.

[0070] When the laser moves, the pixel coordinate system in the field of view remains unchanged. When moving, move the center point (X, Y) of the chip 3 to be processed by X*d in the x-axis direction and by Y*d in the y-axis direction, that is, the center point of the chip 3 to be processed can be made to be at the origin of the pixel coordinate system. When rotating, with the center point of the chip 3 to be processed as the rotation center, rotate the laser by -θ around the z-axis. The state of the chip 1 to be processed after completing the above movement and rotation is the standard state.

[0071] Therefore, before subsequent processing of the chip 1, such as power-on or chip mounting, the method provided by the present invention can be used to lock the chip 3 to be processed first. In the pixel coordinate system in the field of view of the image acquisition mechanism, the pixel coordinates (X, Y) of the center of the chip 3 to be processed and the positive rotation angle θ are located; then, move the laser so that the center point of the chip 3 to be processed is at the origin of the pixel coordinate system, and rotate the laser by -θ so that the positive rotation angle θ of the chip 3 to be processed is zero. At this time, in the pixel coordinate system, the actual state of the chip 3 to be processed is the standard state, and then subsequent chip mounting or power-on processing is performed on it, with higher accuracy. Other chips 1 that need to be chip-mounted or powered-on on the laser are also processed using the same method, and can all be adjusted to the standard state, providing precise positioning for processes such as chip mounting and power-on of the chips 1 in the laser.

[0072] Step S30 specifically includes the steps of: performing feature matching with the standard chip image 2 to locate the pixel coordinates (X n , Y n ) of the centers of at least two chips 1, and the positive rotation angles θ of the at least two chips 1 relative to the standard chip 1 respectively n, where n is the chip 1 number; in step S40, after the center point of the previous chip 1 is at the origin of the pixel coordinate system and the rotation angle of the positive direction of chip 1 is zero, according to the position differences △X and △Y in the x-axis direction and y-axis direction between the pixel coordinates of the center of the previous chip 1 and the pixel coordinates of the center of the next chip 1, and the actual distance d corresponding to the side length of one pixel, move the laser so that the center point of the next chip 1 is at the origin of the pixel coordinate system.

[0073] The number of chip 1 on the laser is multiple. These chip 1 can be numbered before positioning, and each chip 1 is positioned in turn in ascending order of the numbers. When positioning the first chip 1, move the center point (X1, Y1) of the first chip 1 by X1*d in the x-axis direction and Y1*d in the y-axis direction, that is, the center point of the first chip 1 can be made to be at the origin of the pixel coordinate system. When rotating, take the center point of the first chip 1 as the rotation center, and rotate the laser -θ1 around the z-axis. The state of the first chip 1 after completing the above movement and rotation is the standard state, and subsequent processing can be carried out on it.

[0074] After the first chip 1 completes subsequent processing, according to the position differences △X and △Y in the x-axis direction and y-axis direction between the pixel coordinates of the center of the first chip 1 and the pixel coordinates of the center of the second chip 1, and the actual distance d corresponding to the side length of one pixel, move the laser so that the center point of the second chip 1 is at the origin of the pixel coordinate system. Specifically, △X = X2 - X1, △Y = Y2 - Y1. Then after the first chip 1 is positioned, the laser moves △X*d in the x-axis direction and the laser moves △Y *d in the y-axis direction. The center of the second chip 1 moves to the origin of the pixel coordinate system.

[0075] Similarly, according to the difference △θ between the positive rotation angle of the previous chip 1 and the positive rotation angle of the next chip 1, after the positive rotation angle of the previous chip 1 is zero, take the center point of the next chip 1 as the rotation center, and rotate the laser -△θ around the z-axis so that the positive rotation angle of the next chip 1 is zero.

[0076] Still taking the first chip 1 and the second chip 1 as an example, the difference △θ between the positive rotation angles of the first chip 1 and the second chip 1 is △θ = θ2 - θ1. After the first chip 1 is positioned, take the center point of the second chip 1 as the rotation center, and rotate the laser -△θ around the z-axis so that the positive rotation angle of the second chip 1 is zero.

[0077] Calculate the differences in position and positive rotation angle between the previous chip 1 and the next chip 1 in sequence according to the numbering order, so as to complete the positioning one by one, reduce the calculation difficulty, and by analogy, complete the positioning of all chips 1.

[0078] The chip positioning method further includes a step performed between step S30 and step S40: comparing the positive rotation angle θ of the chip 1 to be processed with a first preset value; when the positive rotation angle θ of the chip 1 to be processed is greater than zero degree and less than or equal to the first preset value, the chip 3 to be processed is the chip 1 to be adjusted, and perform step S40 on the chip 1 to be adjusted; when the positive rotation angle θ of the chip 1 to be processed is greater than the first preset value, the chip 1 to be processed is a non-conforming chip 1.

[0079] The first preset value can be 5°. The light emitted by the chip 1 with too large an offset cannot enter the optical element, so there is no need to perform subsequent processing. Finding non-conforming chips 1 in advance can provide early remedies and avoid increasing subsequent remedial costs. Only the chips 1 that meet the conditions perform step S40 to achieve compensation for position and positive rotation angle.

[0080] Embodiment 2

[0081] Based on Embodiment 1, this embodiment also detects the tilt angle. Because when the chip 1 is welded to the laser, the solder distribution under the chip 1 and the laser may be uneven, which may cause the top surface of the chip 1 not to be parallel to the surface of the laser for mounting the chip 1. Therefore, in this embodiment, the tilt angle of the chip 1 is detected and angle compensation is performed during subsequent processing.

[0082] The chip positioning method further includes a step performed between step S30 and step S40:

[0083] Step S31. Detect the tilt angle of the top surface of the chip 3 to be processed with respect to the plane formed by the x-axis and the y-axis.

[0084] As Figure 4 shown, in this step, the lens of the image acquisition mechanism is perpendicular to the surface of the laser for mounting the chip 1. Therefore, the plane formed by the x-axis and the y-axis is parallel to the surface of the laser for mounting the chip 1. In an ideal state, the top surface of the chip 1 should be completely parallel to the surface of the laser for mounting the chip 1, that is, the tilt angle is zero degree.

[0085] Step S32. When the tilt angle is greater than zero degree and less than or equal to a second preset value, the chip 3 to be processed is the chip 1 to be adjusted; when the tilt angle is greater than the second preset value, the chip 3 to be processed is a non-conforming chip 1.

[0086] The second preset value can be 5°. Only the chip 1 that meets the conditions, that is, the chip 1 to be adjusted, is necessary for subsequent tilt angle compensation. For the chip 1 with an excessive offset, that is, the unqualified chip 1, the emitted light cannot enter the optical element, and there is no need for subsequent processing. Finding the unqualified chip 1 in advance can provide early remedies and avoid increasing subsequent remedial costs.

[0087] The specific judgment method is as follows:

[0088] Step S31 includes the steps of: obtaining the side lengths L 标 and W 标 of the standard chip image 2 in the x-axis direction and the y-axis direction respectively; identifying the shortest projection lengths L and W of the chip 3 image to be processed in the x-axis direction and the y-axis direction. That is, if the chip 1 deflects around the x-axis direction, then the shortest projection of the detected chip 1 in the y-axis direction is less than W 标 . Similarly, if the chip 1 deflects around the y-axis direction, then the shortest projection of the detected chip 1 in the x-axis direction is less than L 标 . Step S32 includes the steps of: when L / L 标 is less than the third preset value, or when W / W 标 is less than the fourth preset value, the chip 3 to be processed is an unqualified chip 1. And when L / L 标 is greater than or equal to the third preset value, and W / W 标 is greater than or equal to the fourth preset value, the chip 3 to be processed is a chip 1 to be adjusted. Among them, the third preset value and the fourth preset value can both be 95%. The chips 1 with unqualified tilt angles can be quickly judged through the projection size, improving the detection efficiency.

[0089] The chip positioning method further includes the steps carried out after step S32: step S33. In the x-axis direction and the y-axis direction, respectively obtain the first tilt angle α x and the second tilt angle α y of the top surface of the chip 1 to be adjusted with respect to the plane formed by the x-axis and the y-axis; step S40 includes the steps of: according to the first tilt angle α x and the second tilt angle α y of the chip 1 to be adjusted, with the center point of the chip 1 to be adjusted as the rotation center, rotate the laser by -α x around the y-axis, so that the first tilt angle α x of the chip 1 to be adjusted in the x-axis direction is zero; with the center point of the chip 1 to be adjusted as the rotation center, rotate the laser by -α y around the x-axis, so that the second tilt angle α y of the chip 1 to be adjusted in the y-axis direction is zero.

[0090] For the chip 1 to be adjusted, it is also necessary to determine the specific value of the tilt angle to facilitate the vertical angle compensation of the chip 1 during subsequent processing of the chip 1.

[0091] Step S33 specifically includes: setting the center point coordinates of the un-deflected chip 1 as (X 未 , Y 未 ); grasping the center point coordinates (X 前 , Y 前 ) of a chip 1 to be adjusted; taking any point other than (X 前 , Y 前 ) as the rotation center, and offsetting the laser by an angle α 改x and α 改y on the x-axis and y-axis respectively, where α 改x and α 改y are arbitrary known values. Among them, the rotation center can be one of the four corners of the projected image of the chip 1 to be adjusted; grasping the center point coordinates (X 后 , Y 后 ) of the offset chip 1;

[0092] Calculating the first tilt angle α x and the second tilt angle α y according to Formula 1 - Formula 4:

[0093] X 未 / X 前 = cos(α x ) Formula 1

[0094] X 未 / X 后 = cos(α x + α 改x ) Formula 2

[0095] Y 未 / Y 前 = cos(α y ) Formula 3

[0096] Y 未 / Y 后 = cos(α y + α 改y ) Formula 4

[0097] Among them, α 改x and α 改y are known quantities.

[0098] The calculation processes of the first tilt angle α x and the second tilt angle α y are the same. Taking the solution of the first tilt angle α x as an example, the specific calculation process is as follows:

[0099] Divide Equation 2 by Equation 1:

[0100]

[0101] Cross - multiply:

[0102] Use the angle addition formula for cosine:

[0103]

[0104] Substitute this into the equation:

[0105]

[0106] Distribute :

[0107]

[0108] Rearrange the terms to isolate the terms involving and sin( ):

[0109]

[0110] Factor out on the left side:

[0111]

[0112] Divide both sides by (assuming ≠0):

[0113]

[0114] Rearrange to solve for tan( ):

[0115]

[0116] Solve for :

[0117]

[0118] where, X 前 and X 后 are test values, is a set value, and only is the unknown. After finding , when subsequent chip - mounting or power - on processing is performed on Chip 1, it can be rotated counter - clockwise around the y - axis with the center point of Chip 1 as the rotation center by , so that the first tilt angle α x equals zero.

[0119] Embodiment 3

[0120] The chip 1 positioning system provided by the present invention executes the chip positioning method in Embodiment 1. The system includes an image acquisition mechanism and a moving platform. The moving platform is used to fix the laser. The moving platform may include a fixed seat. A rotating platform that can rotate around the z-axis is connected below the fixed seat. A two-dimensional slide is connected below the rotating platform. The two-dimensional slide can drive the rotating platform and the fixed seat to move along the x-axis and y-axis directions together, so that the chip 3 to be processed can be moved to the origin of the pixel coordinate system and the positive direction rotation angle of the chip 1 is adjusted to zero.

[0121] Embodiment 4

[0122] This system can execute the chip positioning methods in Embodiment 1 and Embodiment 2, and includes an image acquisition mechanism and a moving platform. The moving platform is used to fix the laser. On the basis of Embodiment 3, in this embodiment, the moving platform further includes a first pitch angle adjustment seat and a second pitch angle adjustment seat arranged in sequence in the up-down direction between the fixed seat and the rotating platform. Among them, the first pitch angle adjustment seat can adjust the pitch angle of the fixed seat around the x-axis, and the second pitch angle adjustment seat is arranged below the first pitch angle adjustment seat and can adjust the pitch angle of the fixed seat around the y-axis to achieve compensation for the vertical angle of the chip 1 on the laser.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip positioning method, characterized in that: Includes steps: S10. In the field of view of the image acquisition mechanism, a visual pixel coordinate system having an x-axis and a y-axis is established; S20. The image acquisition mechanism acquires an image of the surface of the laser for assembling the chip and establishes a standard chip image; S30. Perform feature matching with the standard chip image to locate the pixel coordinates (X, Y) of the center of the chip to be processed, and the positive rotation angle θ of the chip to be processed relative to the standard chip (1), wherein the positive direction is the rotation direction around the z-axis; S40. According to the pixel coordinates (X, Y) of the center of the chip to be processed, move the laser so that the center point of the chip to be processed is at the origin of the pixel coordinate system; Taking the center point of the chip to be processed as the rotation center, rotate the laser -θ around the z axis so that the positive rotation angle θ of the chip to be processed is zero, wherein the x axis, y axis and z axis are perpendicular to each other; The step S30 specifically includes the steps of: performing feature matching with the standard chip image to locate the pixel coordinates (X n ,Y n ), and the at least two chips are respectively rotated by an angle θ relative to the positive direction of the standard chip n , n is the chip number; In step S40, after the center point of the previous chip is at the origin of the pixel coordinate system and the positive rotation angle of the chip is zero, the laser is moved according to the position differences △X and △Y between the pixel coordinates of the center of the previous chip and the pixel coordinates of the center of the next chip in the x-axis direction and the y-axis direction, so that the center point of the next chip is at the origin of the pixel coordinate system.

2. The chip positioning method according to claim 1, characterized in that: When the positive rotation angle of the previous chip is zero, according to the difference △θ between the positive rotation angle of the previous chip and the positive rotation angle of the next chip, the laser is rotated -△θ around the z-axis with the center point of the next chip as the rotation center, so that the positive rotation angle of the next chip is zero.

3. The chip positioning method according to claim 1, characterized in that: The chip positioning method further includes the following steps performed between step S30 and step S40: Compare the positive rotation angle θ of the chip to be processed with a first preset value; When the positive rotation angle θ of the chip to be processed is greater than zero and less than or equal to the first preset value, the chip to be processed is the chip to be adjusted, and the chip to be adjusted performs step S40; When the positive rotation angle θ of the chip to be processed is greater than a first preset value, the chip to be processed is an unqualified chip.

4. The chip positioning method according to claim 1, characterized in that: The chip positioning method further includes the following steps performed between step S30 and step S40: Step S31. Detecting the inclination angle of the top surface of the chip to be processed relative to the plane formed by the x-axis and the y-axis; Step S32: when the tilt angle is greater than zero and less than or equal to a second preset value, the chip to be processed is a chip to be adjusted; When the tilt angle is greater than the second preset value, the chip to be processed is a failed chip.

5. The chip positioning method according to claim 4, characterized in that: The step S31 comprises the steps of: Get the side length L of the standard chip image in the x-axis direction and the y-axis direction respectively 标 and W 标 ; Identify the shortest projection lengths L and W of the chip image to be processed in the x-axis direction and the y-axis direction; The step S32 comprises the steps of: When L / L 标 is less than the third preset value, or when W / W 标 When it is less than a fourth preset value, the chip to be processed is an unqualified chip; When L / L 标 is greater than or equal to the third preset value, and W / W 标 When it is greater than or equal to the fourth preset value, the chip to be processed is a chip to be adjusted.

6. The chip positioning method according to claim 5, characterized in that: The chip positioning method further includes the following steps performed after step S32: Step S33: Obtain the first inclination angle α of the top surface of the chip to be adjusted relative to the plane formed by the x-axis and the y-axis in the x-axis direction and the y-axis direction respectively. x and the second inclination angle α y ; The step S40 comprises the steps of: According to the first tilt angle α of the chip to be adjusted x and the second inclination angle α y , take the center point of the chip to be adjusted as the rotation center, rotate the laser around the y-axis -α x , so that the first tilt angle α of the chip to be adjusted in the x-axis direction x Zero; take the center point of the chip to be adjusted as the rotation center, rotate the laser around the x-axis -α y , so that the second tilt angle α of the chip to be adjusted in the y-axis direction y is zero.

7. The chip positioning method according to claim 6, characterized in that: The step S33 specifically includes: Assume the coordinates of the center point of the undeflected chip are (X 未 ,Y 未 ); Grab the center coordinates (X 前 ,Y 前 ); Non (X 前 ,Y 前 ) as the rotation center, and the laser is offset by an angle α on the x-axis and y-axis respectively. 改x and α 改y ; Grab the chip center coordinates after the offset (X 后 ,Y 后 ); The first inclination angle α is calculated according to formula 1-formula 4 x and the second inclination angle α y : X 未 / X 前 =cos(α x )Formula 1 X 未 / X 后 = cos(α x +α 改x )Formula 2 Y 未 / Y 前 = cos (α y ) Formula 3 Y 未 / Y 后 = cos (α y +α 改y ) Formula 4 Among them, α 改x and α 改y is a known quantity.

8. A chip positioning system, characterized in that: The system applies the chip positioning method described in any one of claims 1 to 3, comprising: an image acquisition mechanism and a mobile platform, wherein the mobile platform is used to fix the laser, and the mobile platform can drive the laser to move in the x-axis and y-axis directions, and rotate around the z-axis.

9. A chip positioning system, characterized in that: The system applies the chip positioning method described in any one of claims 1 to 7, comprising: an image acquisition mechanism and a mobile platform, wherein the mobile platform is used to fix the laser, and the mobile platform can drive the laser to move in the x-axis and y-axis directions, rotate around the z-axis, and adjust the pitch angle relative to the plane formed by the x-axis and the y-axis.

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