PCB over-temperature protection device, method and equipment

Abstract

The invention relates to a PCB over-temperature protection device, method and equipment, and relates to the technical field of servers, the device comprises at least one control circuit and a complex programmable logic device CPLD, and the control circuit comprises a thermistor and at least one voltage comparator; the thermistor is arranged in a monitoring area of a printed circuit board (PCB) and is used for converting the temperature of the monitoring area into a target voltage signal; the forward input end of the voltage comparator receives a target voltage signal, the reverse input end of the voltage comparator receives a reference voltage signal corresponding to the voltage comparator, and the voltage comparator is used for outputting a high level when the target voltage signal is higher than the reference voltage signal; the CPLD comprises a plurality of input pins respectively corresponding to the voltage comparators, each input pin is electrically connected with the output end of the corresponding voltage comparator, and the CPLD is used for triggering over-temperature protection operation corresponding to the input pin when the high level is received through the input pin, so that the timeliness of PCB over-temperature protection is improved.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a PCB over-temperature protection device, method and equipment. Background Art

[0002] As the power consumption of the server increases, the current that needs to pass through its connector during the operation of the server is also increasing. Due to line connection problems or environmental factors such as vibration and dust during operation, the line connection on the PCB (Printed Circuit Board) is prone to temperature rise, which may cause the PCB to burn in severe cases, thus affecting the normal operation of the server business and posing a hidden danger to the safety of the computer room.

[0003] In the related art, when designing a PCB, over-temperature protection of the PCB is mainly achieved by placing a thermistor near the connector, converting the temperature change into a voltage change based on the thermistor, sampling through an ADC (Analog-to-digital converter) chip, and then monitoring the sampled signal through a BMC (Baseboard Management Controller).

[0004] However, when the PCB temperature is monitored by the above method, since the BMC monitors the temperature by polling, when the PCB temperature rises rapidly, the method cannot respond in time, which may cause the PCB to burn out. Summary of the invention

[0005] The present invention provides a PCB over-temperature protection device, method and equipment, which are used to solve the problem of untimely PCB over-temperature protection in the related art.

[0006] In a first aspect, an embodiment of the present application provides a PCB over-temperature protection device, the device comprising:

[0007] The above device comprises at least one control circuit and a complex programmable logic device CPLD, wherein:

[0008] The control circuit comprises a thermistor and at least one voltage comparator;

[0009] The thermistor is arranged in a monitoring area of ​​the printed circuit board PCB, and is used to convert the temperature of the monitoring area into a target voltage signal;

[0010] The positive input terminal of the voltage comparator receives the target voltage signal, and the negative input terminal receives the reference voltage signal corresponding to the voltage comparator, and is used to: output a high level when the target voltage signal is higher than the reference voltage signal;

[0011] The CPLD comprises a plurality of input pins corresponding to the voltage comparators respectively, each input pin is electrically connected to the output end of the corresponding voltage comparator, and is used to trigger the over-temperature protection operation corresponding to any input pin when a high level is received through any input pin.

[0012] The above embodiment and the above method, by setting a control circuit, can trigger the corresponding voltage comparator to output a high level when the target voltage signal is higher than any reference voltage signal, so that the input pin of the CPLD directly performs the subsequent over-temperature protection operation after receiving the high level. Compared with the polling control method based on BMC in the related art, this operation does not need to perform analog-to-digital conversion based on the ADC chip, nor does it need to wait for the polling time, which can greatly improve the time response speed and ensure that the operation is triggered at the optimal protection time when the temperature rises at a faster rate.

[0013] In a possible implementation manner, the thermistor is a positive temperature coefficient thermistor, and the control circuit includes a first resistor and a first power supply module;

[0014] The first end of the first resistor is electrically connected to the first power supply module, and the second end is electrically connected to the first end of the thermistor;

[0015] The first end of the thermistor is used to output the target voltage signal, and the second end of the thermistor is grounded.

[0016] The above embodiment provides a specific method for converting the temperature of the monitoring area into a target voltage signal. As the temperature of the monitoring area increases, the target voltage signal also increases, which facilitates the subsequent triggering of the corresponding voltage comparator to output a high level, thereby triggering the CPLD to perform an over-temperature protection operation.

[0017] In a possible implementation manner, the control circuit includes a second power supply module and a reference voltage output circuit corresponding to each voltage comparator;

[0018] The reference voltage output circuit includes a second resistor and a third resistor, wherein a first end of the second resistor is electrically connected to the second power supply module, and a second end of the second resistor is electrically connected to a first end of the third resistor; the first end of the third resistor is used to output a reference voltage signal, and a second end of the third resistor is grounded;

[0019] In reference voltage output circuits corresponding to different voltage comparators, the output reference voltage signals are different.

[0020] The above embodiment provides a possible specific method for generating a reference voltage signal. Based on this method, reference voltage signals with different values ​​can be generated to facilitate subsequent over-temperature protection.

[0021] In a possible implementation, the at least one voltage comparator includes: a first voltage comparator and a second voltage comparator, and a first reference voltage signal corresponding to the first voltage comparator is smaller than a second reference voltage signal corresponding to the second voltage comparator;

[0022] The CPLD comprises a first input pin corresponding to the first voltage comparator and a second input pin corresponding to the second voltage comparator;

[0023] The CPLD is specifically used for: when a high level is received through the first input pin, sending a frequency reduction instruction to a central processing unit CPU connected to the CPLD to instruct the CPU to reduce the operating frequency;

[0024] When a high level is received through the second input pin, the PCB is powered off.

[0025] In the above embodiment, different over-temperature protection operations are set for different reference voltage signals, that is, when the first voltage comparator outputs a high level, the CPLD performs a frequency reduction operation to reduce system power consumption; when the second voltage comparator outputs a high level, the CPLD performs a power-off operation, which can reduce the impact on the business on the PCB.

[0026] In a possible implementation manner, the CPLD is specifically used for:

[0027] When a high level is received through the second input pin, determining the target control circuit where the second voltage comparator is located;

[0028] If the target monitoring area corresponding to the target control circuit is located at the front end of the power protection chip, the total power supply of the PCB is cut off;

[0029] If the target monitoring area is located at the rear end of the power protection chip, the output of the power protection chip is cut off.

[0030] In the above embodiment, by judging whether the front end or the back end of the protection chip is over-temperature, it is selected to cut off the power protection chip for local protection, or to cut off the PSU output to protect the entire PCB. When local protection can solve the problem, local protection is given priority, and after the business is migrated, the power is cut off for maintenance, thereby minimizing the loss.

[0031] In a possible implementation manner, the CPLD is specifically used for:

[0032] When the over-temperature protection operation corresponding to any of the above input pins is triggered, a log corresponding to the current over-temperature protection operation is generated.

[0033] The above embodiment generates a corresponding log after the over-temperature protection operation is triggered, so as to facilitate the subsequent rapid location of the cause of the fault.

[0034] In a possible implementation manner, the above device further includes a conversion module and a baseboard management controller BMC, wherein:

[0035] The input end of the conversion module is connected to the thermistor and is used to: convert the target voltage signal into a digital signal;

[0036] The BMC is connected to the conversion module and is used to: receive the digital signal output by the conversion module under normal working conditions, and monitor the temperature of the monitoring area based on the digital signal;

[0037] The CPLD is connected to the BMC and the conversion module respectively, and is used to: when it is determined that the BMC is not in a normal working state, receive the digital signal output by the conversion module, and monitor the temperature of the monitoring area based on the digital signal.

[0038] The above embodiment can realize that during the BMC startup or failure period, the CPLD can monitor the temperature of the corresponding monitoring area in real time based on the digital signal output by the conversion module, so as to perform relevant temperature control.

[0039] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0040] PCB, and the over-temperature protection device arranged on the PCB.

[0041] In a third aspect, an embodiment of the present application provides a PCB over-temperature protection method, the method comprising:

[0042] The temperature of the monitoring area of ​​the PCB is converted into a target voltage signal through a thermistor;

[0043] By each voltage comparator, when the target voltage signal is higher than the reference voltage signal corresponding to the voltage comparator, outputting a high level;

[0044] Through the CPLD, when a high level output by a corresponding voltage comparator is received through any input pin, an over-temperature protection operation corresponding to the any input pin is triggered.

[0045] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the steps in the above-mentioned PCB over-temperature protection method of the present application are implemented.

[0046] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, which is stored in a computer-readable storage medium; when the processor of a memory access device reads the computer program from the computer-readable storage medium, the processor executes the computer program, so that the memory access device executes the steps in the above-mentioned PCB over-temperature protection method of the present application.

[0047] For each of the above-mentioned second to fifth aspects and the technical effects that may be achieved by each of the above-mentioned aspects, please refer to the above-mentioned description of the technical effects that can be achieved by the first aspect or various possible schemes in the first aspect, and no further details will be given here. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0049] Figure 1 A schematic diagram of a possible PCB over-temperature protection device provided in an embodiment of the present application;

[0050] Figure 2 A schematic diagram of another possible PCB over-temperature protection device provided in an embodiment of the present application;

[0051] Figure 3 A schematic diagram of a possible PCB over-temperature protection device example provided in an embodiment of the present application;

[0052] Figure 4 A schematic diagram of a flow chart of a PCB over-temperature protection method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the drawings in the embodiment of the present application. Obviously, the described embodiment is only a part of the embodiment of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be arbitrarily combined with each other. In addition, although the logical order is shown in the flow chart, in some cases, the steps shown or described can be performed in an order different from that here.

[0054] The terms "first" and "second" in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the term "comprising" and any of their variations are intended to cover non-exclusive protection. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices. "Multiple" in the present application can mean at least two, for example, two, three or more, and the embodiments of the present application are not limited.

[0055] The following is a description of exemplary embodiments of the present application in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding, which should be considered as merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description. It should be noted that in the embodiments of the present application, certain software, components, models and other existing solutions in the industry may be mentioned, which should be considered as exemplary, and their purpose is only to illustrate the feasibility of the implementation of the technical solution of the present application, but it does not mean that the applicant has or will necessarily use the solution.

[0056] In the technical solution of this application, the acquisition, transmission, storage, and use of data are in compliance with the requirements of relevant national laws and regulations.

[0057] In order to facilitate those skilled in the art to better understand the technical solutions provided by the embodiments of the present application, the following is a brief description of the professional terms involved:

[0058] (1) Thermistor: A sensor resistor whose resistance value changes with temperature. According to the temperature coefficient, thermistors can be divided into PTC (Positive Temperature Coefficient) thermistors and NTC (Negative Temperature Coefficient) thermistors. The resistance value of a positive temperature coefficient thermistor increases with the increase of temperature, while the resistance value of a negative temperature coefficient thermistor decreases with the increase of temperature.

[0059] (2) CPLD (Complex Programmable Logic Device): implements specific logic and completes monitoring and control functions.

[0060] (3) BMC (Baseboard Management Controller): A device used for remote out-of-band management.

[0061] (4) GPU (Graphics Processing Unit): A microprocessor specifically designed to process image and graphics-related operations.

[0062] (5) ADC (Analog-to-digital converter) chip: used to convert analog signals into digital signals.

[0063] (6) PSU (Power Supply Unit): provides 12V power to the server.

[0064] (7) PCB (Printed Circuit Board): It is one of the important components of the electronics industry. It is used to connect various electronic components through circuits and play a role in conduction and transmission. A board is a type of PCB. It is made with a plug-in and can be inserted into the slot of the main circuit board (motherboard) of the computer. It is used to control the operation of hardware, such as monitors, acquisition cards and other devices. After installing the driver, the corresponding hardware functions can be realized.

[0065] (8) Gold Finger: refers to a series of slender and thin metal contact pieces designed at the edge of the circuit board. It undertakes the key interconnection task and is responsible for transmitting data, electrical signals and power between different circuit boards or electronic devices.

[0066] During the long-term operation of the server, it may be affected by vibration, temperature, poor contact and other factors, which may cause the server to have problems such as component damage and board temperature rise. In serious cases, the board may burn out. If the board burns out during the normal operation of the server, it will not only affect the normal operation of the business and cause great losses, but may also cause safety hazards such as fire in the computer room.

[0067] In the related art, as the power consumption of servers increases day by day, for example, the current of the power supply board of GPU models can reach more than 1000A, and the current that needs to pass through its connector also gradually increases, and the current flowing through each connector reaches more than 100A. In this scenario, when there are problems with the line connection of the power supply cable or the GPU card power supply gold finger, such as poor contact, or under the influence of environmental factors such as vibration and dust during long-term operation, the line connection on the board, such as the contact position between the current connector and the cable, or the contact position between the GPU power supply gold finger and the power supply connector, is prone to connection problems, which in turn leads to temperature rise. If the temperature cannot be monitored in time and over-temperature protection measures cannot be taken, as the temperature continues to rise, it may cause the board to burn.

[0068] In the related art, there are two main methods for over-temperature protection of PCB:

[0069] One is to place a thermistor near the connector, convert the temperature change into voltage change based on the thermistor, sample it through the ADC (Analog-to-digital converter) chip, and then monitor the sampled signal through the BMC (Baseboard Management Controller). When the temperature is found to be too high, relevant actions are taken.

[0070] However, when the PCB temperature is monitored by the above method, since the BMC monitors the temperature by polling, when the PCB temperature rises rapidly, the method cannot respond in time, which may cause the PCB to burn out.

[0071] The second is to monitor the power consumption of the board and perform corresponding protection actions when abnormal power consumption occurs to prevent the board from burning.

[0072] However, this method only relies on power consumption for monitoring and cannot determine the temperature of the PCB in real time. Furthermore, when the temperature is abnormal, it is not possible to detect and take corresponding measures in time, and there is also the problem of untimely monitoring and protection.

[0073] In order to overcome the above problems, an embodiment of the present application provides a PCB over-temperature protection device, which can protect the PCB to the greatest extent and avoid the PCB from burning.

[0074] The present application is further described in detail below in conjunction with the accompanying drawings. Figure 1 As shown in FIG. 1 , a schematic diagram of a PCB over-temperature protection device provided in an embodiment of the present application is shown. Figure 1 As shown, the device includes at least one control circuit and a CPLD.

[0075] In a specific implementation, the number of the above control circuits can be set based on demand, and each control circuit corresponds to a monitoring area on the PCB. If it is necessary to monitor multiple areas on the PCB at the same time, multiple control circuits can be set. Figure 1 Only one control circuit is shown, that is, the first resistor R1, thermistor RT, resistors R2, R3 and voltage comparator U1, resistors R4, R5 and voltage comparator U2 can be regarded as one control circuit. If multiple control circuits are set in the PCB over-temperature protection device, the connection relationship between each control circuit and CPLD is the same.

[0076] In an embodiment of the present application, a control circuit includes a thermistor and at least one voltage comparator; wherein each voltage comparator corresponds to a reference voltage signal, and the number of voltage comparators in the control circuit can be set based on demand.

[0077] In the following, the embodiments of the present application only describe the structure of one control circuit. If there are multiple control circuits, the structures of other control circuits can also be found in the description below.

[0078] The thermistor is set in the monitoring area of ​​the PCB to convert the temperature of the monitoring area into a target voltage signal;

[0079] In the embodiment of the present application, the above-mentioned monitoring area refers to the vicinity of a high-current connector. Placing the thermistor near the high-current connector can sense the temperature of the nearby PCB. When the cable is not in good contact or other current abnormalities increase, the surface temperature of the PCB will rise. The resistance value of the thermistor changes with the temperature, causing the voltage on it to change, and the temperature of the monitoring area can be converted into a target voltage signal.

[0080] In a possible implementation manner, the control circuit further includes: a first resistor and a first power supply module;

[0081] When the thermistor is a positive temperature coefficient thermistor, the specific circuit structure corresponding to the thermistor is: the first end of the first resistor is electrically connected to the first power supply module, and the second end is electrically connected to the first end of the thermistor; the first end of the thermistor is used to output the target voltage signal, and the second end of the thermistor is grounded.

[0082] For example, Figure 1 As shown, the first resistor R1 is connected in series with the thermistor RT, the other end of the first resistor R1 is connected to the first power supply module V1, and the voltage corresponding to the connection between the first resistor R1 and the thermistor RT is the target voltage signal. As the temperature of the monitoring area changes, the resistance of the thermistor will increase, and then the value of the target voltage signal will increase.

[0083] In another possible implementation, when the thermistor is a negative temperature coefficient thermistor, the specific circuit structure corresponding to the thermistor is: the first end of the thermistor is electrically connected to the first power supply module, the second end is electrically connected to the first end of the first resistor, and the second end of the first resistor is grounded; the second end of the thermistor is used to output a target voltage signal.

[0084] For example, Figure 1 The first resistor R1 and the thermistor RT are interchanged, and the voltage corresponding to the connection between the first resistor R1 and the thermistor RT is the target voltage signal. As the temperature of the monitoring area changes, the resistance of the thermistor will decrease, and then the value of the target voltage signal will increase.

[0085] In the embodiment of the present application, the positive input terminal of each voltage comparator receives the target voltage signal, and the reverse input terminal receives the reference voltage signal corresponding to the voltage comparator, and is used to: output a high level when the target voltage signal is higher than the reference voltage signal;

[0086] like Figure 1 As shown, taking the voltage comparator UI as an example, its positive input terminal is connected to the position between the first resistor R1 and the thermistor RT to receive the target voltage signal, and the reverse input terminal receives the reference voltage signal. When the voltage at the positive input terminal is higher than the voltage at the reverse input terminal, a high level is output, otherwise a low level is output. In implementation, when the voltage comparator UI outputs a high level, it means that the target voltage signal is higher than the reference voltage signal, that is, the resistance of the thermistor increases. Therefore, the output value of the voltage comparator can be used to determine whether the resistance of the thermistor increases to the set threshold, that is, whether the temperature of the monitoring area has reached the preset temperature.

[0087] In some embodiments, different reference voltage signals need to be set for different voltage comparators.

[0088] In a possible implementation manner, the present application may generate the above-mentioned reference voltage signal based on the following reference voltage output circuit.

[0089] Specifically, the control circuit includes a second power supply module and a reference voltage output circuit corresponding to each voltage comparator;

[0090] The reference voltage output circuit includes a second resistor and a third resistor, wherein a first end of the second resistor is electrically connected to the second power supply module, and a second end of the second resistor is electrically connected to a first end of the third resistor; the first end of the third resistor is used to output a reference voltage signal, and a second end of the third resistor is grounded;

[0091] In reference voltage output circuits corresponding to different voltage comparators, the output reference voltage signals are different.

[0092] For example, Figure 1 A control circuit is provided, including two voltage comparators, namely a first voltage comparator U1 and a second voltage comparator U2, and a reference voltage output module corresponding to each voltage comparator; wherein the first voltage comparator U1 corresponds to a first reference voltage output module, specifically including a second resistor R2 and a third resistor R3; the second voltage comparator U2 corresponds to a second reference voltage output module, including a second resistor R4 and a third resistor R5. In the embodiment of the present application, the above-mentioned second power supply module may include at least one, and the second power supply module and the first power supply module may also be the same. Specifically, when the second power supply module includes multiple ones, each reference voltage output circuit may correspond to a second power supply module, such as Figure 1 As shown, the second power supply module V21 corresponds to the first reference voltage output module, and the second power supply module V22 corresponds to the second reference voltage output module; optionally, multiple reference voltage output modules may correspond to the same second power supply module.

[0093] By adjusting the values ​​of the second resistor and the third resistor in the reference voltage output module, the corresponding reference voltage signals can be adjusted. For example, by adjusting the values ​​of resistors R2 and R3, the first reference voltage signal corresponding to the first reference voltage output module can be adjusted, and by adjusting the values ​​of resistors R4 and R5, the second reference voltage signal corresponding to the second reference voltage output module can be adjusted.

[0094] Since the working principle of the voltage comparator is: when the target voltage signal received at the positive input terminal is higher than the reference voltage signal received at the inverting input terminal, it will output a high level and trigger the CPLD to perform over-temperature protection. As the temperature of the monitoring area of ​​the PCB increases, the resistance of the thermistor will change and the target voltage signal will increase. Therefore, different reference voltage signals can correspond to different temperature thresholds. By increasing the reference voltage signal, the corresponding temperature threshold will increase accordingly.

[0095] In another possible implementation, the present application may directly connect the power supply unit to the inverting input terminal of the voltage comparator to generate the above-mentioned reference voltage signal. Figure 2 As shown, a power supply unit V3 is connected to the inverting input terminal of the first voltage comparator U1, and the voltage value of the power supply unit V3 is set to the value of the above-mentioned first reference voltage signal; similarly, a power supply unit V4 is connected to the inverting input terminal of the second voltage comparator U2, and the voltage value of the power supply unit V4 is set to the value of the above-mentioned second reference voltage signal.

[0096] In an embodiment of the present application, the CPLD includes multiple input pins corresponding to each voltage comparator, each input pin is electrically connected to the output end of the corresponding voltage comparator, and is used to: trigger the over-temperature protection operation corresponding to any input pin when a high level is received through any input pin.

[0097] In a specific implementation, the voltage comparator corresponding to each input pin and the reference voltage signal corresponding to the voltage comparator can be recorded in advance in the CPLD, and then the over-temperature protection operations corresponding to each reference voltage signal can be pre-set.

[0098] In a possible implementation manner, the at least one voltage comparator includes: a first voltage comparator U1 and a second voltage comparator U2, and a first reference voltage signal corresponding to the first voltage comparator is smaller than a second reference voltage signal corresponding to the second voltage comparator;

[0099] The CPLD comprises a first input pin corresponding to the first voltage comparator and a second input pin corresponding to the second voltage comparator;

[0100] The CPLD is specifically used for: when a high level is received through the first input pin, sending a frequency reduction instruction to a central processing unit CPU connected to the CPLD to instruct the CPU to reduce the operating frequency;

[0101] When a high level is received through the second input pin, the PCB is powered off.

[0102] In an embodiment of the present application, since the first reference voltage signal is lower than the second reference voltage signal, that is, the temperature threshold corresponding to the first voltage comparator is lower than the second temperature threshold corresponding to the second voltage comparator, based on this, in the present application, the intensity of the over-temperature protection operation corresponding to the first voltage comparator can be set to be lower than the over-temperature protection operation of the second voltage comparator, that is, when the first voltage comparator outputs a high level, the CPLD performs a frequency reduction operation to reduce system power consumption, thereby reducing the temperature of the monitoring area of ​​the PCB; when the second voltage comparator outputs a high level, the CPLD performs a power-off operation.

[0103] In a possible implementation manner, the CPLD is specifically used for:

[0104] When a high level is received through the second input pin, determining the target control circuit where the second voltage comparator is located;

[0105] If the target monitoring area corresponding to the target control circuit is located at the front end of the power protection chip, the total power supply of the PCB is cut off;

[0106] If the target monitoring area is located at the rear end of the power protection chip, the output of the power protection chip is cut off.

[0107] In an embodiment of the present application, when the second voltage comparator outputs a high level, when the CPLD performs a power-off operation, it can determine whether to perform regional power-off or overall power-off based on the position of the monitoring area. Specifically, the layout of various devices on the PCB is usually as follows: devices in different areas are connected to the PCB main power supply, i.e., PSU, through corresponding voltage protection chips, respectively. The rear end of the above-mentioned power protection chip refers to: the target monitoring area is located on the side of the power protection chip close to the PCB main power supply. At this time, the control of the power protection chip cannot achieve temperature reduction, so it is necessary to cut off the main power supply of the above-mentioned PCB; the front end of the above-mentioned power protection chip refers to: the target monitoring area is located on the side of the power protection chip close to the device area. At this time, the control of the power protection chip can achieve over-temperature protection. Therefore, at this time, only the output of the above-mentioned power protection chip needs to be cut off.

[0108] Sudden power outage during business operation may cause irreparable losses. By judging whether the front end or back end of the protection chip is over-temperature, you can choose to cut off the power protection chip for local protection, or cut off the PSU output to protect the entire PCB. When local protection can solve the problem, local protection can be given priority, and after the business is migrated, power can be cut off for maintenance, thereby minimizing the loss.

[0109] In a possible implementation manner, the CPLD is specifically used for:

[0110] When the over-temperature protection operation corresponding to any of the above input pins is triggered, a log corresponding to the current over-temperature protection operation is generated.

[0111] In the embodiment of the present application, after the corresponding over-temperature protection operation is triggered, a corresponding log can be generated to facilitate subsequent checking of the cause of the fault. Specifically, the log can record: the current over-temperature protection operation, the identification of any of the above input pins, and the corresponding monitoring area, etc.

[0112] The above method, by setting a control circuit, can trigger the corresponding voltage comparator to output a high level when the target voltage signal is higher than any reference voltage signal, so that the input pin of the CPLD directly performs the subsequent over-temperature protection operation after receiving the high level. Compared with the polling control method based on BMC in the related art, this operation does not need to perform analog-to-digital conversion based on the ADC chip, nor does it need to wait for the polling time, which can greatly improve the time response speed. When the temperature rises at a faster speed, it can ensure that the over-temperature protection operation is triggered at the optimal protection time.

[0113] In a possible implementation manner, the PCB over-temperature protection device further includes a conversion module and a baseboard management controller BMC, wherein:

[0114] The input end of the conversion module is connected to the thermistor and is used to: convert the target voltage signal into a digital signal;

[0115] The BMC is connected to the conversion module and is used to: receive the digital signal output by the conversion module under normal working conditions, and monitor the temperature of the monitoring area based on the digital signal;

[0116] The CPLD is connected to the BMC and the conversion module respectively, and is used to: when it is determined that the BMC is not in a normal working state, receive the digital signal output by the conversion module, and monitor the temperature of the monitoring area based on the digital signal.

[0117] In the embodiment of the present application, the conversion module may be an ADC chip, which is used to convert the target voltage signal output by the thermistor into a digital signal for easy reading by the CPLD and the BMC. By reading the target voltage signal, it can correspond to the resistance value of the thermistor, and then obtain the temperature of the monitoring area corresponding to the thermistor, so as to facilitate temperature monitoring of the PCB.

[0118] In specific implementation, Figure 3As shown, the input end of the conversion module is connected to one end of the thermistor outputting the target voltage signal, and the output end is connected to the CPLD and the BMC respectively. It should be noted that the connection between the conversion module and the CPLD and the BMC can be achieved through I2C. At the same time, the CPLD and the BMC are also connected to each other, and this connection can also be achieved through I2C.

[0119] In a specific implementation, when the BMC is in a normal working state, it receives the digital signal output by the conversion module, monitors the temperature of the monitoring area based on the digital signal, and controls the fan to dissipate heat based on the monitored temperature; but since it takes a certain amount of time for the BMC to work normally from power-on, or during a period when the BMC fails, it is unable to read the temperature and control the fan. At this time, the CPLD detects that the BMC is not in a normal working state (this monitoring can be achieved through an I2C connection between it and the BMC). At this time, the CPLD replaces the BMC to execute the operation of receiving the digital signal output by the conversion module and monitoring the temperature of the monitoring area based on the digital signal.

[0120] Specifically, the CPLD monitors in real time whether the BMC is working normally. If the BMC is working normally, the BMC reads the ADC chip and controls the fan. When it detects that the temperature has risen, the fan speed in the corresponding area is increased to cool the PCB. If the BMC fails or is in the startup state (that is, not in a normal working state), the CPLD reads the ADC chip data, monitors the temperature, and controls the fan.

[0121] The above embodiment can realize that during the BMC startup or failure period, the CPLD can monitor the temperature of the corresponding monitoring area in real time based on the digital signal output by the conversion module, so as to perform relevant temperature control.

[0122] An embodiment of the present application also provides an electronic device, which includes a PCB and an over-temperature protection device arranged on the PCB. The specific structure of the over-temperature protection device and the process of performing over-temperature protection can be specifically referred to the aforementioned embodiment and will not be repeated here.

[0123] Specifically, when the over-temperature protection device is set on the PCB board, the thermistor in the over-temperature protection device is set close to the connector with large current, that is, the monitoring area corresponding to each control circuit refers to: the area with large current on the PCB; the CPLD in the above-mentioned over-temperature protection device establishes a connection relationship with the CPU on the PCB and the power protection chip of each area, so that when the temperature rise in a certain monitoring area is detected, the corresponding over-temperature protection operation is performed on it.

[0124] Based on the same inventive concept, the present application also provides a PCB over-temperature protection method, which is applied to the above-mentioned PCB over-temperature protection device, see Figure 4 , the method comprising:

[0125] Step S401, converting the temperature of the monitoring area of ​​the PCB into a target voltage signal through a thermistor;

[0126] Step S402, through each voltage comparator, when the target voltage signal is higher than the reference voltage signal corresponding to the voltage comparator, output a high level;

[0127] Step S403 , through the CPLD, when a high level output by a corresponding voltage comparator is received through any input pin, an over-temperature protection operation corresponding to any input pin is triggered.

[0128] The process of executing PCB over-temperature protection in the embodiment of the present application can be specifically referred to the aforementioned embodiment and will not be described in detail here.

[0129] An embodiment of the present application also provides a computer-readable storage medium that stores computer-executable instructions required to execute the above-mentioned processor, which includes a program for executing the above-mentioned processor.

[0130] In some possible implementations, various aspects of the PCB over-temperature protection method provided in the present application can also be implemented in the form of a program product, which includes a program code. When the above-mentioned program product is run on an electronic device, the above-mentioned program code is used to enable the above-mentioned electronic device to execute the steps of the PCB over-temperature protection method according to various exemplary embodiments of the present application described above in this specification.

[0131] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, devices, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0132] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (apparatus), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1A device that provides the functions specified in a block or multiple blocks.

[0133] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0134] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0135] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0136] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A PCB over-temperature protection device, characterized in that: The device comprises at least one control circuit and a complex programmable logic device (CPLD), wherein: The control circuit includes a thermistor and at least one voltage comparator; The thermistor is arranged in a monitoring area of ​​the printed circuit board PCB, and is used to convert the temperature of the monitoring area into a target voltage signal; The positive input terminal of the voltage comparator receives the target voltage signal, and the negative input terminal receives the reference voltage signal corresponding to the voltage comparator, and is used to: output a high level when the target voltage signal is higher than the reference voltage signal; The CPLD includes a plurality of input pins corresponding to each voltage comparator, each input pin is electrically connected to the output end of the corresponding voltage comparator, and is used to trigger an over-temperature protection operation corresponding to any input pin when a high level is received through any input pin.

2. The device according to claim 1, characterized in that The thermistor is a positive temperature coefficient thermistor, and the control circuit includes a first resistor and a first power supply module; A first end of the first resistor is electrically connected to the first power supply module, and a second end of the first resistor is electrically connected to a first end of the thermistor; The first end of the thermistor is used to output the target voltage signal, and the second end of the thermistor is grounded.

3. The device according to claim 1, characterized in that The control circuit includes a second power supply module and a reference voltage output circuit corresponding to each voltage comparator respectively; The reference voltage output circuit comprises a second resistor and a third resistor, wherein a first end of the second resistor is electrically connected to the second power supply module, and a second end of the second resistor is electrically connected to a first end of the third resistor; the first end of the third resistor is used to output a reference voltage signal, and a second end of the third resistor is grounded; In reference voltage output circuits corresponding to different voltage comparators, the output reference voltage signals are different.

4. The device according to claim 1, characterized in that The at least one voltage comparator comprises: a first voltage comparator and a second voltage comparator, wherein a first reference voltage signal corresponding to the first voltage comparator is smaller than a second reference voltage signal corresponding to the second voltage comparator; The CPLD comprises a first input pin corresponding to the first voltage comparator, and a second input pin corresponding to the second voltage comparator; The CPLD is specifically used for: when a high level is received through the first input pin, sending a frequency reduction instruction to a central processing unit CPU connected to the CPLD to instruct the CPU to reduce the operating frequency; When a high level is received through the second input pin, the PCB is powered off.

5. The device according to claim 4, characterized in that The CPLD is specifically used for: When a high level is received through the second input pin, determining a target control circuit where the second voltage comparator is located; If the target monitoring area corresponding to the target control circuit is located at the front end of the power protection chip, the total power supply of the PCB is cut off; If the target monitoring area is located at the rear end of the power protection chip, the output of the power protection chip is cut off.

6. The device according to claim 1, characterized in that The CPLD is specifically used for: When an over-temperature protection operation corresponding to any of the input pins is triggered, a log corresponding to the current over-temperature protection operation is generated.

7. The device according to any one of claims 1 to 6, characterized in that: The device also includes a conversion module and a baseboard management controller BMC, wherein: The input end of the conversion module is connected to the thermistor and is used to: convert the target voltage signal into a digital signal; The BMC is connected to the conversion module and is used to: receive the digital signal output by the conversion module under normal working conditions, and monitor the temperature of the monitoring area based on the digital signal; The CPLD is connected to the BMC and the conversion module respectively, and is used to: when it is determined that the BMC is not in a normal working state, receive the digital signal output by the conversion module, and monitor the temperature of the monitoring area based on the digital signal.

8. An electronic device, characterized in that: The device comprises: PCB, and the over-temperature protection device according to any one of claims 1 to 7 arranged on the PCB.

9. A PCB over-temperature protection method, characterized in that: Applied to the PCB over-temperature protection device according to any one of claims 1 to 7, the method comprises: The temperature of the monitoring area of ​​the PCB is converted into a target voltage signal through a thermistor; By each voltage comparator, when the target voltage signal is higher than the reference voltage signal corresponding to the voltage comparator, outputting a high level; Through the CPLD, when a high level output by a corresponding voltage comparator is received through any input pin, an over-temperature protection operation corresponding to the any input pin is triggered.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to claim 9 is implemented.

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