LED Packaging Structure, Multicolor LED Matrix and Control Method Thereof

Abstract

The present invention provides an LED packaging structure, a multicolor LED matrix and a control method thereof. In this LED packaging structure, a driving chip is used to drive a first multicolor light-emitting unit in the same package as it and a second multicolor light-emitting unit not in the same package as it, so that multiple multicolor light-emitting units can be driven by one driving chip, thereby reducing the design cost of applying this LED packaging structure. And because the driving chip and the first multicolor light-emitting unit are located in the same package, the mounting cost of applying this LED packaging structure can also be reduced. In addition, the LED packaging structure includes two groups of active power pin groups and several groups of passive power pin groups, making the wiring more convenient during the PCB layout design, reducing the problem of wiring crossover between the LED module and the power line, and thus enabling single-sided layout and single-layer wiring.

Description

Technical Field

[0001] The present invention relates to the field of LED devices, and in particular, to an LED packaging structure, a multi-color LED matrix, and a control method thereof. Background Art

[0002] RGB pixel chips are usually composed of three independent LED chips, corresponding to three colors: red, green, and blue. These chips are integrated together through precise packaging technology to form a complete pixel unit for displaying images or providing lighting.

[0003] However, as the number of RGB pixel chips increases, the number of driving chips for driving the RGB pixel chips also increases, and thus the cost also increases. In addition, the RGB pixel chip has only three power pins corresponding to the three LED chips, and since the power supply voltages connected to the three power pins are different, there will be a problem of cross-wiring when the RGB pixel chip is connected to the power supply and when the RGB pixel chips are connected to each other. Summary of the Invention

[0004] The present invention provides an LED packaging structure, a multi-color LED matrix, and a control method thereof to save costs and achieve single-layer wiring on a PCB board.

[0005] According to the technical solution of the present invention, an LED packaging structure is provided, including:

[0006] An active LED module, the active LED module includes a first multi-color light-emitting unit, a driving chip, and several groups of driving signal output pin groups. The driving chip is connected to the first multi-color light-emitting unit. The first multi-color light-emitting unit and the driving chip are located in the same package body. The driving signal output pin groups are used to output driving signals;

[0007] Two groups of active power pin groups, both of the two groups of active power pin groups are coupled to the active LED module;

[0008] At least one first type of passive LED module, the first type of passive LED module includes a second multi-color light-emitting unit and a group of driving signal input pin groups. A group of driving signal input pin groups are respectively connected to a group of driving signal output pin groups. The driving chip is used to drive the first multi-color light-emitting unit and the second multi-color light-emitting unit to emit light of the same color at the same time, and this color is one of the multi-colors;

[0009] At least two groups of passive power pins, and each two groups of the passive power pins are correspondingly coupled to one of the first type of passive LED modules. The number of the passive power pin groups is twice that of the first type of passive LED modules; the active power pin group is connected to an adjacent passive power pin group, and the remaining passive power pin groups are connected to their adjacent passive power pin groups, and the two connected passive power pin groups are respectively coupled to different first type of passive LED modules.

[0010] Optionally, both of the two groups of active power pin groups are connected to the active LED module, and each two groups of the passive power pin groups are correspondingly connected to one of the first type of passive LED modules.

[0011] Optionally, both the first multi-color light-emitting unit and the second multi-color light-emitting unit include a first pixel structure, a second pixel structure, and a third pixel structure, and the light emitted by the first pixel structure, the second pixel structure, and the third pixel structure has different colors;

[0012] The driving chip is respectively connected to the first pixel structure, the second pixel structure, and the third pixel structure in the first multi-color light-emitting unit;

[0013] Each group of driving signal output pin groups includes a first driving signal output pin, a second driving signal output pin, and a third driving signal output pin, and each group of driving input signal pin groups includes a first driving signal input pin, a second driving signal input pin, and a third driving signal input pin; in a driving signal output pin group and its corresponding driving signal input pin group, the first driving signal output pin is connected to the first driving signal input pin, the second driving signal output pin is connected to the second driving signal input pin, and the third driving signal output pin is connected to the third driving signal input pin.

[0014] Optionally, it further includes:

[0015] A plurality of second type of passive LED modules connected in series. Among the first second type of passive LED module and the active LED module at the head, the first pixel structure of one is correspondingly connected to the first pixel structure of the other, the second pixel structure of one is correspondingly connected to the second pixel structure of the other, and the third pixel structure of one is correspondingly connected to the third pixel structure of the other; the last second type of passive LED module is connected to the two groups of active power pin groups, and in any two adjacent second type of passive LED modules, the first pixel structure of one is correspondingly connected to the first pixel structure of the other, the second pixel structure of one is correspondingly connected to the second pixel structure of the other, and the third pixel structure of one is correspondingly connected to the third pixel structure of the other;

[0016] A plurality of third - type passive LED module groups, each of the third - type passive LED module groups includes a plurality of the third - type passive LED modules connected in series, and the number of the third - type passive LED modules in each group is the same as the number of the second - type passive LED modules; in each third - type passive LED module group, the first third - type passive LED module corresponds to one of the first - type passive LED modules. Among the first third - type passive LED module and the corresponding first - type passive LED module, the first pixel structure of one is correspondingly connected to the first pixel structure of the other, the second pixel structure of one is correspondingly connected to the second pixel structure of the other, and the third pixel structure of one is correspondingly connected to the third pixel structure of the other; the last third - type passive LED module is connected to two groups of the passive power pin groups, and among any two adjacent third - type passive LED modules, the first pixel structure of one is correspondingly connected to the first pixel structure of the other, the second pixel structure of one is correspondingly connected to the second pixel structure of the other, and the third pixel structure of one is correspondingly connected to the third pixel structure of the other.

[0017] Optionally, the active power pin group includes a first active power pin, a second active power pin and a third active power pin, and the passive power pin group includes a first passive power pin, a second passive power pin and a third passive power pin; wherein, the first active power pin and the first passive power pin are connected to the same power voltage to supply power to the first pixel structure; the second active power pin and the second passive power pin are connected to the same power voltage to supply power to the second pixel structure; the third active power pin and the third passive power pin are connected to the same power voltage to supply power to the third pixel structure; the first active power pin, the second active power pin and the third active power pin are connected to power voltages of different magnitudes.

[0018] Optionally, the active power pin group includes a first active power pin and a fourth active power pin, and each of the passive power pin groups includes a first passive power pin and a fourth passive power pin; wherein, the first active power pin and the first passive power pin are connected to the same power voltage to supply power to the first pixel structure; the fourth active power pin and the fourth passive power pin are connected to the same power voltage to supply power to the second pixel structure and the third pixel structure; the first active power pin and the fourth active power pin are connected to power voltages of different magnitudes.

[0019] Optionally, the driving chip is used to output a corresponding driving signal according to a control instruction; or, the driving chip includes a random signal module, and the random signal module is used to control the driving chip to randomly output a driving signal;

[0020] The driving signal is used to control the lighting sequence of the LED packaging structure within one frame time. The driving signal includes a first driving signal, a second driving signal, and a third driving signal. The first driving signal, the second driving signal, and the third driving signal are respectively used to drive the first pixel structure, the second pixel structure, and the third pixel structure in the first multi-color light-emitting unit and the second multi-color light-emitting unit. The driving signal output pin group includes a first driving signal output pin, a second driving signal output pin, and a third driving signal output pin. The first driving signal output pin, the second driving signal output pin, and the third driving signal output pin are respectively used to output the first driving signal, the second driving signal, and the third driving signal, and the driving signal is connected to the first pixel structure, the second pixel structure, and the third pixel structure in the first multi-color light-emitting unit.

[0021] According to the technical solution of the present invention, a multi-color LED matrix is further provided, including:

[0022] A lamp board;

[0023] A plurality of the above-mentioned LED packaging structures, and the LED packaging structures are distributed in an array on the lamp board; wherein, a plurality of the active LED modules are connected in series through data input pins and data output pins, that is, in any two adjacent active LED modules, the data output pin of one is connected to the data input pin of the other.

[0024] According to the technical solution of the present invention, a control method for a multi-color LED matrix is further provided, which is used to control the above-mentioned multi-color LED matrix.

[0025] Optionally, the number of the LED packaging structures is at least two, and the control method for the multi-color LED matrix includes: at the same moment, the light emitted by at least one of the LED packaging structures is one color among the multi-colors, and the light emitted by at least one of the LED packaging structures is another color among the multi-colors.

[0026] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0027] In the LED packaging structure, multi-color LED matrix and its control method provided by the technical solution of the present invention, the driving chip is used to drive the first multi-color light-emitting unit in the same package as it and the second multi-color light-emitting unit not in the same package as it, so that a single driving chip can be used to drive multiple multi-color light-emitting units, thereby reducing the design cost of applying this LED packaging structure. And since the driving chip and the first multi-color light-emitting unit are located in the same package, the mounting cost of applying this LED packaging structure can also be reduced. In addition, the LED packaging structure includes two groups of active power pin groups and several groups of passive power pin groups. The active power pin group is connected to a passive power pin group adjacent to it, and the remaining passive power pin groups are connected to the passive power pin groups adjacent to them and coupled to different first-type passive LED modules, making the wiring more convenient during the PCB layout design, reducing the problem of wiring crossing between the LED module and the power line, and thus enabling single-sided layout and single-layer wiring. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic structural diagram of the LED packaging structure provided by an embodiment of the present invention Figure 1 ;

[0029] Figure 2 is a schematic structural diagram of the LED packaging structure provided by an embodiment of the present invention Figure 2 ;

[0030] Figure 3 is a schematic structural diagram of the LED packaging structure provided by an embodiment of the present invention Figure 3 ;

[0031] Figure 4 is a schematic structural diagram of the active LED module provided by an embodiment of the present invention Figure 1 ;

[0032] Figure 5 is a schematic structural diagram of the active LED module provided by an embodiment of the present invention Figure 2 ;

[0033] Figure 6 is a schematic structural diagram of the multi-color light-emitting unit provided by an embodiment of the present invention Figure 1 ;

[0034] Figure 7 is a schematic structural diagram of the multi-color light-emitting unit provided by an embodiment of the present invention Figure 2 ;

[0035] Figure 8 is a schematic structural diagram of the multi-color LED matrix provided by an embodiment of the present invention;

[0036] Figure 9It is the voltage timing diagram of the driving signals of two LED packaging structures in the multi-color LED matrix provided by the embodiments of the present invention.

[0037] Reference numerals:

[0038] 1 - LED packaging structure;

[0039] 101 - First multi-color light-emitting unit;

[0040] 102 - Driving chip;

[0041] 103 - Second multi-color light-emitting unit;

[0042] 104 - First pixel structure;

[0043] 105 - Second pixel structure;

[0044] 106 - Third pixel structure;

[0045] VC - Control instruction;

[0046] DI - Data input pin;

[0047] DO - Data output pin;

[0048] V1 - Active power pin group;

[0049] V2 - Passive power pin group;

[0050] V3 - Driving signal output pin group;

[0051] V4 - Driving signal input pin group;

[0052] V11 - First active power pin;

[0053] V12 - Second active power pin;

[0054] V13 - Third active power pin;

[0055] V14 - Fourth active power pin;

[0056] V24 - Fourth passive power pin;

[0057] V21 - First passive power pin;

[0058] V22 - Second passive power pin;

[0059] V23 - Third passive power pin;

[0060] V31 - First driving signal output pin;

[0061] V32 - Second driving signal output pin;

[0062] V33 - Third drive signal output pin;

[0063] V41 - First drive signal input pin;

[0064] V42 - Second drive signal input pin;

[0065] V43 - Third drive signal input pin. Detailed implementation

[0066] As described in the background art, with the increase in the number of RGB pixel chips, the driving cost will increase accordingly, and there will be problems of cross-wiring when the RGB pixel chips are connected to the power supply and to each other.

[0067] In view of this, the technical solution of the present invention creatively proposes an LED packaging structure, including:

[0068] An active LED module, the active LED module includes a first multi-color light-emitting unit, a driving chip, and several groups of drive signal output pin groups, the driving chip is connected to the first multi-color light-emitting unit, the first multi-color light-emitting unit and the driving chip are located in the same package, and the drive signal output pin groups are used to output drive signals;

[0069] Two groups of active power supply pin groups, both groups of the active power supply pin groups are coupled to the active LED module;

[0070] At least one group of first-type passive LED modules, the first-type passive LED modules include a second multi-color light-emitting unit and a group of drive signal input pin groups, a group of the drive signal input pin groups are respectively connected to a group of the drive signal output pin groups, and the driving chip is used to drive the first multi-color light-emitting unit and the second multi-color light-emitting unit to emit light of the same color at the same time, and this color is one of the multi-colors;

[0071] At least two groups of passive power supply pin groups, each two groups of the passive power supply pin groups are correspondingly coupled to one of the first-type passive LED modules, and the number of the passive power supply pin groups is twice that of the first-type passive LED modules; the active power supply pin group is connected to an adjacent passive power supply pin group, and the remaining passive power supply pin groups are connected to the adjacent passive power supply pin groups, and the two connected passive power supply pin groups are respectively coupled to different first-type passive LED modules.

[0072] Therefore, by using a driving chip to drive the first multi-color light-emitting unit within the same package as it and the second multi-color light-emitting unit not within the same package as it, the driving cost and the mounting cost of applying this LED packaging structure can be reduced. In addition, the LED packaging structure includes two sets of active power pin groups and several sets of passive power pin groups, making the wiring more convenient during the PCB layout design, reducing the problem of wiring crossover between the LED module and the power line, and thus enabling single-sided layout and single-layer wiring.

[0073] Next, the embodiments in the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention. The terms "first", "second", "third", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0074] Please refer to Figure 1 , the LED packaging structure 1 includes: an active LED module, two sets of active power pin groups V1, at least one first type of passive LED module, and at least two sets of passive power pin groups V2.

[0075] The active LED module includes a first multi-color light-emitting unit 101, a driving chip 102, and several driving signal output pin groups. The driving chip 102 is connected to the first multi-color light-emitting unit 101. The first multi-color light-emitting unit 101 and the driving chip 102 are located within the same package. The driving signal output pin group V3 is used to output driving signals.

[0076] The first type of passive LED module includes a second multi-color light-emitting unit 103 and a set of driving signal input pin groups V4. A set of driving signal input pin groups V4 are all correspondingly connected to a set of driving signal output pin groups V3. The driving chip 102 is used to drive the first multi-color light-emitting unit 101 and the second multi-color light-emitting unit 103 to emit light of the same color at the same time, and this color is one of the multi-colors.

[0077] Please refer to Figure 3 , in this embodiment, both the first multi-color light-emitting unit 101 and the second multi-color light-emitting unit 103 include a first pixel structure 104, a second pixel structure 105, and a third pixel structure 106. The lights emitted by the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 have different colors. For example, the light emitted by the first pixel structure 104 is red, the light emitted by the second pixel structure 105 is green, and the light emitted by the third pixel structure 106 is blue.

[0078] In this embodiment, please refer to Figure 3 , the driving signals include a first driving signal, a second driving signal, and a third driving signal. The driving signals are used to control the lighting sequence of the LED packaging structure 1 within one frame time. The first driving signal, the second driving signal, and the third driving signal are respectively used to drive the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the first multi-color light-emitting unit 101 and the second multi-color light-emitting unit 103.

[0079] The driving chip 102 is respectively connected to the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the first multi-color light-emitting unit 101. Specifically, by connecting to the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the first multi-color light-emitting unit 101, the driving chip 102 can send the first driving signal, the second driving signal, and the third driving signal to the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the first multi-color light-emitting unit 101 respectively, so as to control the lighting sequence of the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the first multi-color light-emitting unit 101 within one frame time according to the received driving signals.

[0080] In each set of driving signal output pin groups V3 in the active LED module, it includes a first driving signal output pin V31, a second driving signal output pin V32, and a third driving signal output pin V33. Each set of driving input signal pin groups includes a first driving signal input pin V41, a second driving signal input pin V42, and a third driving signal input pin V43. In one of the driving signal output pin groups V3 and its corresponding driving signal input pin group V4, the first driving signal output pin V31 is connected to the first driving signal input pin V41, the second driving signal output pin V32 is connected to the second driving signal input pin V42, and the third driving signal output pin V33 is connected to the third driving signal input pin V43. Specifically, the first driving signal, the second driving signal, and the third driving signal are respectively output through the first driving signal output pin V31, the second driving signal output pin V32, and the third driving signal output pin V33 in each driving signal output pin group V3, and then are connected to the first driving signal input pin V41, the second driving signal input pin V42, and the third driving signal input pin V43 in a one-to-one correspondence through the first driving signal output pin V31, the second driving signal output pin V32, and the third driving signal output pin V33, so that the first driving signal input pin V41, the second driving signal input pin V42, and the third driving signal input pin V43 in each driving input signal pin group can correspondingly receive the first driving signal, the second driving signal, and the third driving signal, so that the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the second multi-color light-emitting unit 103 of each first-type passive LED module can respectively receive the first driving signal, the second driving signal, and the third driving signal through the first driving signal input pin V41, the second driving signal input pin V42, and the third driving signal input pin V43, and further can control the lighting sequence of the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the second multi-color light-emitting unit 103 of each first-type passive LED module within one frame time according to the received driving signal.

[0081] Therefore, within the same frame time, since the first multi-color light-emitting unit 101 and each first-type passive LED module receive the same driving signal, the lighting sequences of the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the second multi-color light-emitting unit 103 of the first multi-color light-emitting unit 101 and each first-type passive LED module are the same within the same frame time, that is, at the same moment, one LED package structure 1 emits light of one color, and this color is one of multiple colors.

[0082] In one embodiment, please refer to Figure 4, the driving chip 102 is used to output corresponding driving signals according to the control instruction VC. Specifically, the driving chip 102 can receive the control instruction VC frame by frame. Different data bits in the control instruction VC represent the lighting sequence of different pixel structures in the form of data frames, so that the driving chip 102 can control the lighting sequence of the LED packaging structure 1 within one frame time according to the control instruction VC.

[0083] In another embodiment, please refer to Figure 5 , the driving chip 102 includes a random signal module, and the random signal module is used to control the driving chip 102 to randomly output driving signals.

[0084] Please continue to refer to Figure 1 , both groups of active power supply pin groups V1 are coupled to the active LED module.

[0085] Every two groups of passive power supply pin groups V2 are correspondingly coupled to a first type of passive LED module. The number of passive power supply pin groups V2 is twice that of the first type of passive LED module; the active power supply pin group V1 is connected to an adjacent passive power supply pin group V2, and the remaining passive power supply pin groups V2 are connected to the adjacent passive power supply pin groups V2, and the two connected passive power supply pin groups V2 are respectively coupled to different first type of passive LED modules. Therefore, all power supply pin groups are connected to the power supply pin groups coupled to adjacent LED modules, so that the crossing of power lines can be reduced during the PCB design and wiring, thereby realizing single-layer wiring.

[0086] In one embodiment, please refer to Figure 2 , both two active power supply pin groups V1 are connected to the active LED module, and every two passive power supply pin groups V2 are correspondingly connected to a first type of passive LED module.

[0087] In another embodiment, please refer to Figure 3 , the LED packaging structure 1 further includes: a plurality of second type of passive LED modules connected in series and a plurality of groups of third type of passive LED module groups.

[0088] In several second - type passive LED modules connected in series, in the first second - type passive LED module and the active LED module at the head, the first pixel structure 104 of one is correspondingly connected to the first pixel structure 104 of the other, the second pixel structure 105 of one is correspondingly connected to the second pixel structure 105 of the other, and the third pixel structure 106 of one is correspondingly connected to the third pixel structure 106 of the other; the last second - type passive LED module is connected to two groups of active power pin groups V1. And in any two adjacent second - type passive LED modules, the first pixel structure 104 of one is correspondingly connected to the first pixel structure 104 of the other, the second pixel structure 105 of one is correspondingly connected to the second pixel structure 105 of the other, and the third pixel structure 106 of one is correspondingly connected to the third pixel structure 106 of the other. Therefore, the first pixel structure 104 in the first multi - color light - emitting unit 101 is in series with the first pixel structures 104 in each second - type passive LED module, the second pixel structure 105 in the first multi - color light - emitting unit 101 is in series with the second pixel structures 105 in each second - type passive LED module, and the third pixel structure 106 in the first multi - color light - emitting unit 101 is in series with the third pixel structures 106 in each second - type passive LED module, so that the driving signal received by the first multi - color light - emitting unit 101 can drive the active LED module and each second - type passive LED module, thereby enabling the first pixel structures 104, second pixel structures 105, and third pixel structures 106 in the active LED module and each second - type passive LED module to have the same light - emitting sequence within the same frame time.

[0089] Each group of third - type passive LED module groups includes a plurality of third - type passive LED modules connected in series. The number of third - type passive LED modules in each group is the same as the number of second - type passive LED modules. In each group of third - type passive LED module groups, the first third - type passive LED module at the head corresponds to one of the first - type passive LED modules. Among the first third - type passive LED module at the head and the corresponding first - type passive LED module, the first pixel structure 104 of one is connected to the first pixel structure 104 of the other correspondingly, the second pixel structure 105 of one is connected to the second pixel structure 105 of the other correspondingly, and the third pixel structure 106 of one is connected to the third pixel structure 106 of the other correspondingly. The last third - type passive LED module is connected to two groups of passive power supply pins V2. And among any two adjacent third - type passive LED modules, the first pixel structure 104 of one is connected to the first pixel structure 104 of the other correspondingly, the second pixel structure 105 of one is connected to the second pixel structure 105 of the other correspondingly, and the third pixel structure 106 of one is connected to the third pixel structure 106 of the other correspondingly. Therefore, the first pixel structure 104 in the first - type passive LED module is in series with the first pixel structures 104 in each of the third - type passive LED modules in the corresponding third - type passive LED module group, the second pixel structure 105 in the first - type passive LED module is in series with the second pixel structures 105 in each of the third - type passive LED modules in the corresponding third - type passive LED module group, and the third pixel structure 106 in the first - type passive LED module is in series with the third pixel structures 106 in each of the third - type passive LED modules in the corresponding third - type passive LED module group. This enables the driving signal received by the first - type passive LED module to drive the first - type passive LED module and each of the corresponding third - type passive LED modules, so that the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the first - type passive LED module and each of the corresponding third - type passive LED modules have the same light - emitting sequence within the same frame time.

[0090] Therefore, within the same frame time, since the first multi - color light - emitting unit 101 and each of the first - type passive LED modules receive the same driving signal, the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the active LED module, the first - type passive LED module, the second - type passive LED module, and the third - type passive LED module have the same light - emitting sequence within the same frame time. That is, at the same moment, one LED package structure 1 emits a color of light, and this color is one of a plurality of colors.

[0091] In one embodiment, please refer to Figure 6, the active power pin group V1 includes a first active power pin V11, a second active power pin V12, and a third active power pin V13, and the passive power pin group V2 includes a first passive power pin V21, a second passive power pin V22, and a third passive power pin V23; wherein, the first active power pin V11 and the first passive power pin V21 are connected to the same power supply voltage to supply power to the first pixel structure 104; the second active power pin V12 and the second passive power pin V22 are connected to the same power supply voltage to supply power to the second pixel structure 105; the third active power pin V13 and the third passive power pin V23 are connected to the same power supply voltage to supply power to the third pixel structure 106; the first active power pin V11, the second active power pin V12, and the third active power pin V13 are connected to different magnitudes of power supply voltages. For example, the light emitted by the first pixel structure 104 is red light, the light emitted by the second pixel structure 105 is green light, and the light emitted by the third pixel structure 106 is blue light. At this time, the operating voltage of the third pixel structure 106 is greater than the operating voltage of the second pixel structure 105, and the operating voltage of the second pixel structure 105 is greater than the operating voltage of the first pixel structure 104.

[0092] In another embodiment, please refer to Figure 7 , the active power pin group V1 includes a first active power pin V11 and a fourth active power pin V14, and the passive power pin group V2 both includes a first passive power pin V21 and a fourth passive power pin V24; wherein, the first active power pin V11 and the first passive power pin V21 are connected to the same power supply voltage to supply power to the first pixel structure 104; the fourth active power pin V14 and the fourth passive power pin V24 are connected to the same power supply voltage to supply power to the second pixel structure 105 and the third pixel structure 106; the first active power pin V11 and the fourth active power pin V14 are connected to different magnitudes of power supply voltages. For example, the light emitted by the first pixel structure 104 is red light, the light emitted by the second pixel structure 105 is green light, and the light emitted by the third pixel structure 106 is blue light. At this time, by adjusting the process parameters of the second pixel structure 105 and the third pixel structure 106, the operating voltages of the second pixel structure 105 and the third pixel structure 106 can be made the same.

[0093] In summary, in the LED packaging structure provided by the embodiment of the present invention, the driving chip is used to drive the first multi-color light-emitting unit in the same package as it and the second multi-color light-emitting unit not in the same package as it, so that a single driving chip can be used to drive multiple multi-color light-emitting units, thereby reducing the cost of applying this LED packaging structure. And because the driving chip and the first multi-color light-emitting unit are located in the same package, the mounting cost of applying this LED packaging structure can also be reduced. In addition, the LED packaging structure includes two groups of active power pins and several groups of passive power pins. The active power pin group is connected to an adjacent passive power pin group, and the remaining passive power pin groups are connected to the passive power pin groups adjacent to different first-type passive LED modules, making the wiring more convenient during PCB layout design, reducing the problem of wiring crossovers between the LED module and the power line, and thus enabling single-sided layout and single-layer wiring.

[0094] The embodiment of the present invention also provides a multi-color LED matrix, including: a lamp board and several LED packaging structures 1 in the above embodiments.

[0095] Please refer to Figure 8 , the LED packaging structures 1 are distributed in an array on the lamp board, and several active LED modules are connected in series through the data input pin DI and the data output pin DO, that is, in any two adjacent active LED modules, the data output pin DO of one is connected to the data input pin DI of the other. Among them, the data input pin DI can receive a signal with display information, and through the data input pin DI, the signal with display information can be transmitted to the driving chip 102, so that the driving chip 102 drives the LED packaging structure 1 according to the received signal with display information.

[0096] Correspondingly, the embodiment of the present invention also provides a control method for controlling the multi-color LED matrix in the above embodiments.

[0097] In this embodiment, the number of LED packaging structures 1 is at least two, and the control method of this multi-color LED matrix includes: at the same moment, the light emitted by at least one LED packaging structure 1 is one color among the multi-colors, and the light emitted by at least one LED packaging structure 1 is another color among the multi-colors.

[0098] In a specific embodiment, please refer to Figure 9 , Figure 9The voltage timing diagram of the driving signals for two LED packaging structures 1 is shown. The first driving signal, the second driving signal, and the third driving signal can respectively control the first pixel structure 104, the second pixel structure 105, and the third pixel structure 106 in the corresponding LED packaging structure 1. That is, when the first driving signal is at a high level, the first pixel structure 104 in the corresponding LED packaging structure 1 lights up; when the second driving signal is at a high level, the second pixel structure 105 in the corresponding LED packaging structure 1 lights up; when the third driving signal is at a high level, the third pixel structure 106 in the corresponding LED packaging structure 1 lights up. Therefore, at the same moment, if the types of the lit pixel structures in the two LED packaging structures 1 are different, then at the same moment, the colors of the light emitted by the two LED packaging structures 1 are also different, thereby weakening the color separation phenomenon of the multi-color LED matrix.

[0099] In one embodiment, please refer to Figure 4 and Figure 9 , by artificially setting the control instruction VC, in the multi-color LED matrix, at least one LED packaging structure 1 emits light of one color among the multiple colors, and at least one LED packaging structure 1 emits light of another color among the multiple colors, so that the multi-color LED matrix can emit light of at least two colors, thereby avoiding the color separation phenomenon of the multi-color LED matrix. Among them, the control instruction VC is input into the active LED module through the data input pin DI, and the control instruction VC can be transmitted to the driving chip 102 through the data input pin DI, so that the driving chip 102 controls the light emission sequence of the LED packaging structure 1 according to the control instruction VC.

[0100] In another embodiment, please refer to Figure 5 and Figure 9 , the driving chip 102 further includes a random signal module. Since the output signal of the random signal module is random, the lighting sequence of different types of pixel structures in each LED packaging structure 1 in the multi-color LED matrix is also random. Therefore, at the same moment, several LED packaging structures 1 can emit light of one, two, or three colors. However, when several LED packaging structures 1 emit light of the same color, the multi-color LED matrix will have a color separation phenomenon. Therefore, adding a random signal module to the driving chip 102 can weaken the color separation phenomenon of the multi-color LED matrix.

[0101] This embodiment is a method embodiment adopting the above structural embodiment. Therefore, for the detailed explanation of each feature in this embodiment, please refer to the relevant description of the same feature in the above structural embodiment, and will not be elaborated here.

[0102] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. An LED packaging structure, characterized in that: include: An active LED module, the active LED module comprising a first multi-color light-emitting unit, a driving chip and a plurality of driving signal output pin groups, the driving chip is connected to the first multi-color light-emitting unit, the first multi-color light-emitting unit and the driving chip are located in the same package, and the driving signal output pin group is used to output a driving signal; Two sets of active power pin groups, both of which are coupled to the active LED module; At least one first-type passive LED module, the first-type passive LED module includes a second multi-color light-emitting unit and a group of drive signal input pin groups, the group of drive signal input pin groups are correspondingly connected to a group of drive signal output pin groups, and the driver chip is used to drive the first multi-color light-emitting unit and the second multi-color light-emitting unit to emit the same color of light at the same time, and the color is one of the multiple colors; At least two groups of passive power pin groups, each two groups of the passive power pin groups are coupled to one of the first passive LED modules, and the number of the passive power pin groups is twice the number of the first passive LED modules; the active power pin group is connected to a passive power pin group adjacent to it, and the remaining passive power pin group is connected to the passive power pin group adjacent to it, and the two connected groups of the passive power pin groups are respectively coupled to different first passive LED modules; A plurality of second-type passive LED modules connected in series, wherein in the first second-type passive LED module and the active LED module, the first pixel structure of one is connected to the first pixel structure of the other, the second pixel structure of one is connected to the second pixel structure of the other, and the third pixel structure of one is connected to the third pixel structure of the other; the last second-type passive LED module is connected to two groups of active power pin groups, and, in any two adjacent second-type passive LED modules, the first pixel structure of one is connected to the first pixel structure of the other, the second pixel structure of one is connected to the second pixel structure of the other, and the third pixel structure of one is connected to the third pixel structure of the other; A plurality of groups of third-class passive LED module groups, each group of the third-class passive LED module groups includes a plurality of the third-class passive LED modules connected in series, the number of the third-class passive LED modules in each group is the same as the number of the second-class passive LED modules; in each group of the third-class passive LED module groups, the first-place third-class passive LED module corresponds to one of the first-class passive LED modules.

2. The LED packaging structure according to claim 1, characterized in that: The two groups of active power pin groups are both connected to the active LED module, and every two groups of passive power pin groups are correspondingly connected to one of the first-type passive LED modules.

3. The LED packaging structure according to claim 1, characterized in that: The first multi-color light-emitting unit and the second multi-color light-emitting unit both include a first pixel structure, a second pixel structure and a third pixel structure, and the first pixel structure, the second pixel structure and the third pixel structure emit light of different colors; The driving chip is respectively connected to the first pixel structure, the second pixel structure and the third pixel structure in the first multi-color light-emitting unit; Each group of drive signal output pins includes a first drive signal output pin, a second drive signal output pin and a third drive signal output pin, and each group of drive input signal pins includes a first drive signal input pin, a second drive signal input pin and a third drive signal input pin; in one of the drive signal output pins and the corresponding drive signal input pin group, the first drive signal output pin is connected to the first drive signal input pin, the second drive signal output pin is connected to the second drive signal input pin, and the third drive signal output pin is connected to the third drive signal input pin.

4. The LED packaging structure according to claim 3, characterized in that: In the first-placed third-category passive LED module and the corresponding first-category passive LED module, the first pixel structure of one is connected correspondingly to the first pixel structure of the other, the second pixel structure of one is connected correspondingly to the second pixel structure of the other, and the third pixel structure of one is connected correspondingly to the third pixel structure of the other; the last-placed third-category passive LED module is connected to the two passive power pin groups, and in any two adjacent third-category passive LED modules, the first pixel structure of one is connected correspondingly to the first pixel structure of the other, the second pixel structure of one is connected correspondingly to the second pixel structure of the other, and the third pixel structure of one is connected correspondingly to the third pixel structure of the other.

5. The LED packaging structure according to claim 3, characterized in that: The active power pin group includes a first active power pin, a second active power pin and a third active power pin, and the passive power pin group includes a first passive power pin, a second passive power pin and a third passive power pin; wherein, the first active power pin and the first passive power pin are connected to the same power supply voltage to supply power to the first pixel structure; the second active power pin and the second passive power pin are connected to the same power supply voltage to supply power to the second pixel structure; the third active power pin and the third passive power pin are connected to the same power supply voltage to supply power to the third pixel structure; the first active power pin, the second active power pin and the third active power pin are connected to power supply voltages of different sizes.

6. The LED packaging structure according to claim 3, characterized in that: The active power pin group includes a first active power pin and a fourth active power pin, and the passive power pin group includes a first passive power pin and a fourth passive power pin; wherein, the first active power pin and the first passive power pin are connected to the same power supply voltage to supply power to the first pixel structure; the fourth active power pin and the fourth passive power pin are connected to the same power supply voltage to supply power to the second pixel structure and the third pixel structure; the first active power pin and the fourth active power pin are connected to power supply voltages of different sizes.

7. The LED packaging structure according to claim 3, characterized in that: The driving chip is used to output a corresponding driving signal according to a control instruction; or, the driving chip includes a random signal module, and the random signal module is used to control the driving chip to randomly output a driving signal; The drive signal is used to control the lighting order of the LED packaging structure within a frame time. The drive signal includes a first drive signal, a second drive signal and a third drive signal. The first drive signal, the second drive signal and the third drive signal are respectively used to drive the first pixel structure, the second pixel structure and the third pixel structure in the first multi-color light-emitting unit and the second multi-color light-emitting unit. The drive signal output pin group includes a first drive signal output pin, a second drive signal output pin and a third drive signal output pin. The first drive signal output pin, the second drive signal output pin and the third drive signal output pin are respectively used to output the first drive signal, the second drive signal and the third drive signal, and the drive signal is connected to the first pixel structure, the second pixel structure and the third pixel structure in the first multi-color light-emitting unit.

8. A multi-color LED matrix, characterized in that: include: Light board; A plurality of LED packaging structures as described in any one of claims 1 to 7, wherein the LED packaging structure array is distributed on the lamp board; wherein, a plurality of the active LED modules are connected in series via a data input pin and a data output pin, that is, of any two adjacent active LED modules, the data output pin of one is connected to the data input pin of the other.

9. A control method for a multi-color LED matrix, characterized in that: Used to control the multi-color LED matrix as claimed in claim 8.

10. The control method of the multi-color LED matrix according to claim 9, characterized in that: The number of the LED packaging structures is at least two, and the control method of the multi-color LED matrix includes: at the same time, the light emitted by at least one of the LED packaging structures is one color among the multiple colors, and the light emitted by at least one of the LED packaging structures is another color among the multiple colors.

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