Electronic device

Abstract

The invention discloses electronic equipment, which belongs to the technical field of electronics and comprises a circuit board, a first electronic component and an electromagnetic sensitive module, the electromagnetic sensitive module and the first electronic component are located on the two opposite surfaces of the circuit board, and an isolation layer is arranged on the circuit board and clamped between the electromagnetic sensitive module and the first electronic component. The isolation layer is used for reducing interference of electromagnetic waves generated by the first electronic component and / or electromagnetic waves generated by circuit wiring in the circuit board on the electromagnetic sensitive module.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to an electronic device. Background Art

[0002] Due to the shape restrictions of electronic devices such as mobile phones, the size of printed circuit boards (PCBs) in electronic devices is limited, and with the development of information technology, the number of electronic components carried by PCB boards continues to increase.

[0003] In the related art, in order to enable a PCB board of limited size to carry enough electronic components, an electromagnetic sensitive module, such as a camera module, a magnetic sensor, etc., is usually attached to one side surface of the PCB board in the form of a board, so that the electromagnetic sensitive module can be used for wiring within the projection area on the PCB board, and the other side surface of the PCB board opposite to the electromagnetic sensitive module can be used to place other electronic modules. Compared with digging a hole on the PCB board and accommodating the electromagnetic sensitive module in the hole, it is possible to avoid the multi-layer wiring in the PCB board occupied by the hole and the layout space on the other side of the PCB board opposite to the electromagnetic sensitive module.

[0004] However, if the power of the electronic module arranged on the other side surface of the PCB board opposite to the electromagnetic sensitive module is relatively large, when the electronic module is working, the electromagnetic waves based on the electronic module will generate a large current in the PCB board below the electromagnetic sensitive module. The large current will generate electromagnetic interference to the electromagnetic sensitive module, resulting in a decrease in the performance of the electromagnetic sensitive module. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem that electromagnetic waves generated by internal wiring of a PCB board and other devices on the PCB board cause electromagnetic interference to an electromagnetic sensitive module, resulting in a degradation in the performance of the electromagnetic sensitive module.

[0006] An embodiment of the present application provides an electronic device, the electronic device comprising: a circuit board, a first electronic component and an electromagnetic sensitive module;

[0007] The electromagnetic sensitive module and the first electronic component are located on opposite surfaces of the circuit board, and an isolation layer is provided on the circuit board. The isolation layer is sandwiched between the electromagnetic sensitive module and the first electronic component. The isolation layer is used to reduce the interference of electromagnetic waves generated by the first electronic component and / or electromagnetic waves generated by circuit traces in the circuit board on the electromagnetic sensitive module.

[0008] In an embodiment of the present application, an electromagnetic sensitive module and a first electronic component are arranged on opposite surfaces of a circuit board, and an isolation layer is arranged between the electromagnetic sensitive module and the first electronic component. The isolation layer can be used to block or absorb electromagnetic waves generated by the first electronic component and / or the circuit wiring inside the circuit board, thereby reducing the interference of these electromagnetic waves on the electromagnetic sensitive module. An electromagnetic sensitive module, such as a camera module, can be arranged in the area where the isolation layer is located. At this time, the electromagnetic interference received by the electromagnetic sensitive module is reduced, thereby improving the working stability of the electromagnetic sensitive module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a front view of a circuit board, a first electronic component and an electromagnetic sensitive module in a first electronic device provided in an embodiment of the present application;

[0010] Figure 2 is along Figure 1 Cross-section along the middle BB direction;

[0011] Figure 3 is a front view of a circuit board in a second electronic device provided in an embodiment of the present application;

[0012] Figure 4 is along Figure 3 One of the cross-sections in the mid-CC direction;

[0013] Figure 5 is along Figure 3 The second cross-section in the CC direction;

[0014] Figure 6 is a front view of a circuit board in a third electronic device provided in an embodiment of the present application;

[0015] Figure 7 is along Figure 6 One of the cross-sections in the mid-DD direction;

[0016] Figure 8 is along Figure 6 The second cross-section in the middle DD direction;

[0017] Fig. 9 is a front view of a circuit board in a fourth electronic device provided in an embodiment of the present application;

[0018] Fig.10 is a front view of a circuit board, a first electronic component, and an electromagnetic sensitive module in a fifth electronic device provided in an embodiment of the present application;

[0019] Fig.11 is along Fig.10 One of the cross-sections in the EE direction;

[0020] Fig.12 is along Fig.10 The second cross-section in the EE direction;

[0021] Fig.13 is along Fig.10 The third cross-section view along the EE direction. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0023] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0024] The camera modules in the related art are in the following two forms:

[0025] The first method is to open a through hole on the circuit board to arrange the first camera module in the through hole. In this case, the through hole will occupy the area of ​​the circuit board used for wiring and mounting electronic components. In order to meet the functional requirements of the circuit board, the area of ​​the circuit board needs to be increased.

[0026] The second method: In order to reduce the area of ​​the circuit board, the second camera module is attached to the upper surface of the circuit board. At this time, the area of ​​the circuit board corresponding to the second camera module can still be used for wiring, and the lower surface of the circuit board opposite to the second camera module can be used to carry electronic components, thereby improving the layout space and utilization rate of the circuit board. However, the electromagnetic waves generated by the electronic components will interfere with the second camera module, and the second camera module will also generate electromagnetic interference to the circuit wiring below it.

[0027] For example, when the electronic components have electromagnetic radiation, a first induced current is induced on the circuit trace between the electronic components and the second camera module 103, and the first induced current then generates a magnetic field, which will generate electromagnetic interference to the second camera module. Correspondingly, the electromagnetic radiation emitted by the second camera module will also generate electromagnetic interference to the circuit trace between the electronic components and the second camera module, or even to the electronic components.

[0028] In an embodiment of the present application, the circuit board is modified so that when the electromagnetic sensitive module is attached to the surface of the circuit board, the electromagnetic interference of other electronic components on the circuit board to the electromagnetic sensitive module can be reduced, so as to solve the problem that the working performance of the electromagnetic sensitive module is reduced due to the electromagnetic interference of the internal circuit wiring of the circuit board and the electronic components on the other side of the circuit board.

[0029] It should be noted that the electromagnetic sensitive module in the embodiments of the present application can be any module that is easily affected by electromagnetic interference and causes reduced working performance or even damage. For the sake of convenience of explanation, in the embodiments of the present application, the electromagnetic sensitive module is usually used as a camera module as an example for illustration, which does not constitute a specific limitation here.

[0030] The electronic device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0031] See also Figure 1 and Figure 2 , the circuit board structure provided in the embodiment of the present application includes: a circuit board 10, a first electronic component 20 and an electromagnetic sensitive module 30;

[0032] The electromagnetic sensitive module 30 and the first electronic component 20 are located on opposite surfaces of the circuit board 10, and an isolation layer 13 is provided on the circuit board 10. The isolation layer 13 is sandwiched between the electromagnetic sensitive module 30 and the first electronic component 20. The isolation layer 13 is used to reduce the interference of the electromagnetic waves generated by the first electronic component 20 and / or the electromagnetic waves generated by the circuit routing in the circuit board 10 on the electromagnetic sensitive module 30.

[0033] In some embodiments, the electronic device provided in the embodiments of the present application may be a terminal, or may be other devices other than a terminal. For example, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc., and may also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiments of the present application.

[0034] In some embodiments, the first electronic component 20 may be any electronic component capable of generating electromagnetic waves.

[0035] It should be noted that, when the isolation layer 13 is not set, the first electronic component 20 generates electromagnetic waves during operation, and the electromagnetic waves are electromagnetically induced by the circuit traces in the circuit board 10, thereby generating an induced current on the circuit traces in the circuit board 10. The electromagnetic field generated by the induced current will interfere with the nearby electromagnetic sensitive module 30, such as a camera module.

[0036] In some embodiments, electronic components with strong radiation on the circuit board 10 are usually encapsulated in a shielding cover to block the electromagnetic waves of the electronic components from radiating outward. However, the shielding cover can only block the electromagnetic waves of the electronic components from radiating outward from the circuit board, and the influence on the penetration of the circuit board 10 and the circuit routing in the circuit board 10 cannot be avoided. The isolation layer 13 in the embodiment of the present application can block the electromagnetic waves generated by the electronic components located on one surface of the circuit board 10 from radiating into the circuit board 10 and to the other surface of the circuit board 10.

[0037] like Fig.10 As shown, for the second electronic component 40 located on the same surface of the circuit board as the electromagnetic sensitive module 30, the second electronic component 40 can be arranged in a shielding cover to reduce the electromagnetic interference of the second electronic component 40 on the electromagnetic sensitive module.

[0038] It should be noted that the circuit board structure in the embodiment of the present application is mainly used to solve the problem of electromagnetic interference to the electromagnetic sensitive module 30 caused by electromagnetic induction between the electromagnetic sensitive module 30 and the first electronic component 20 and the circuit wiring sandwiched between the electromagnetic sensitive module 30 and the first electronic component 20, when the electromagnetic sensitive module 30 is set on the surface of one side of the circuit board and the first electronic component 20 is set on the surface of the other side of the circuit board.

[0039] In some embodiments, the isolation layer 13 can be made of any material that limits the penetration of electromagnetic waves, such as an absorbing material that can absorb electromagnetic waves, or a magnetic isolation material that can reflect electromagnetic waves, etc. For the sake of convenience, in the embodiments of the present application, the isolation layer 13 is usually made of an absorbing material as an example. Among them, the absorbing material generally uses ferromagnetic materials, aluminum alloy powder weak magnetic materials, polymer magnetic materials, etc.

[0040] In this way, in the scenario where the first electronic component 20 generates electromagnetic waves, the circuit routing inside the circuit board 10 may be affected by the electromagnetic waves generated by the first electronic component 20 to generate induced current, thereby increasing the electromagnetic wave field strength. By utilizing the isolation layer 13, the electromagnetic waves generated by the first electronic component 20 and the electromagnetic waves corresponding to the induced current on the circuit routing inside the circuit board 10 can be reduced from propagating in the direction of the electromagnetic sensitive module 30. Thus, the isolation layer 13 can be used to block or absorb the electromagnetic waves generated by the first electronic component 20 and / or the circuit routing inside the circuit board 10, thereby reducing the interference of these electromagnetic waves on the electromagnetic sensitive module 30. Thus, an electromagnetic sensitive module 30, such as a camera module, can be set in the area where the isolation layer 13 is located. At this time, the electromagnetic interference to the electromagnetic sensitive module 30 is reduced, thereby improving the working stability of the electromagnetic sensitive module 30.

[0041] In some embodiments, the isolation layer 13 can be exposed on the surface of the circuit board 10. For example, the isolation layer 13 is disposed on the first surface 11 of the circuit board 10, and the electromagnetic sensitive module 30 is attached to the isolation layer 13. In this way, the isolation layer 13 can block the electromagnetic waves generated by the induction circuit on the circuit traces inside the circuit board 10 and the electromagnetic waves generated by the first electronic component 20 from propagating in the direction of the electromagnetic sensitive module 30, thereby reducing the electromagnetic interference received by the electromagnetic sensitive module 30 and reducing the risk of reduced working performance or even damage of the electromagnetic sensitive module 30 due to electromagnetic interference.

[0042] In some embodiments, the isolation layer 13 can be embedded inside the circuit board 10, so that the electromagnetic sensitive module 30 and the first electronic component 20 located on the opposite surfaces of the circuit board 10 are distributed on opposite sides of the isolation layer 13. In this way, the isolation layer 13 can at least block the electromagnetic waves generated by the first electronic component 20 from propagating in the direction of the electromagnetic sensitive module 30, thereby reducing the electromagnetic interference received by the electromagnetic sensitive module 30 and reducing the risk of reduced working performance or even damage of the electromagnetic sensitive module 30 due to electromagnetic interference.

[0043] As an optional embodiment, the isolation layer 13 includes an absorbing layer disposed on the first surface 11 of the circuit board 10, the absorbing layer is used to absorb electromagnetic waves, and the electromagnetic sensitive module 30 is disposed corresponding to the absorbing layer;

[0044] The first electronic component 20 is located on the second surface 12 of the circuit board 10 , and the first electronic component 20 is arranged opposite to at least a portion of the absorbing layer, wherein the first surface 11 and the second surface 12 are opposite surfaces of the circuit board 10 .

[0045] In some embodiments, the absorbing layer can be formed by removing the surface ink on the circuit board 10 and then filling the formed groove with absorbing material, or by pasting a film of absorbing material in the formed groove.

[0046] In this embodiment, by providing an absorbing layer on the first surface 11 of the circuit board 10, the electromagnetic waves generated by the first electronic component 20 on the second surface 12 of the circuit board 10 and the electromagnetic waves generated by the induced current on the circuit traces in the circuit board 10 can be blocked from propagating toward the first surface 11 of the circuit board 10. In this way, the electromagnetic sensitive module can be provided on the first surface 11 of the circuit board 10, such as being attached to the absorbing layer or being spaced apart from the absorbing layer. In this way, the electromagnetic interference of the electromagnetic sensitive module by the first electronic component 20 and the circuit traces in the circuit board 10 can be reduced, thereby improving the working performance of the electromagnetic sensitive module.

[0047] As an optional implementation, Figure 3 , Figure 4 or Figure 5 As shown, at least two holes are opened in the area of ​​the circuit board 10 covered by the absorbing layer, and the at least two holes are filled with absorbing materials to form at least two absorbing columns 14. The at least two absorbing columns 14 are arranged at intervals from each other, and at least two absorbing columns 14 are in contact with the absorbing layer. The absorbing columns 14 are used to absorb electromagnetic waves.

[0048] In some embodiments, the absorbing column 14 can be a structure made of a material having electromagnetic wave absorption performance, that is, an absorbing material, wherein the absorbing material generally adopts ferromagnetic material, aluminum alloy powder weak magnetic material, polymer magnetic material, etc.

[0049] By embedding at least two absorbing columns 14 spaced apart from each other in the circuit board 10, the influence of the electromagnetic waves generated by the first electronic component 20 during operation on the circuit wiring in the circuit board 10 can be effectively reduced, the magnitude of the induced current generated on the circuit wiring in the circuit board 10 can be reduced, and the electromagnetic wave interference caused by the induced current on the circuit wiring in the circuit board 10 can be reduced.

[0050] In this embodiment, the absorbing layer and the absorbing column 14 in the embodiment of the present application can form a Faraday cage effect, which can more effectively block the electromagnetic waves generated by the electronic components located on the second surface 12 of the circuit board 10 from radiating into the circuit board 10 and to the first surface 11 of the circuit board 10, and reduce the electromagnetic waves in the circuit board 10, thereby reducing the risk of circuit wiring being interfered by electromagnetic waves.

[0051] In some embodiments, at least two absorbing columns 14 are spaced apart from each other and arranged around the circumference of the absorbing layer. In this way, a Faraday cage effect can be formed, which can more effectively block the electromagnetic waves generated by the electronic components located on the second surface 12 of the circuit board 10 from radiating into the circuit board 10 and to the first surface 11 of the circuit board 10, and reduce the electromagnetic waves in the circuit board 10, thereby reducing the risk of circuit routing being interfered by electromagnetic waves.

[0052] As an optional implementation, Figure 3 As shown, at least two absorbing columns 14 are divided into a first row of absorbing columns S1 and a second row of absorbing columns S2 ; the first row of absorbing columns S1 includes at least one absorbing column 14 , and the second row of absorbing columns S2 also includes at least one absorbing column 14 .

[0053] In some embodiments, Figure 3 or Figure 6 As shown, the absorbing column 14 is a cylindrical structure, and a plurality of cylindrical absorbing columns 14 are arranged to form a first row of absorbing columns S1 and a second row of absorbing columns S2.

[0054] In some embodiments, Fig. 9 As shown, the absorbing columns 14 are of a long strip structure, and a plurality of the long strip absorbing columns 14 are arranged along the long side direction thereof to form a first row of absorbing columns S1 and a second row of absorbing columns S2.

[0055] It should be noted that in some other embodiments, the absorbing columns 14 may be lengthened along the second direction X, so that the first row of absorbing columns S1 is composed of one absorbing column 14, and the second row of absorbing columns S2 is composed of another absorbing column 14. The second direction X is the extension direction of the first row of absorbing columns S1 and the second row of absorbing columns S2.

[0056] It should be noted that, in the above embodiments, the absorbing layer is a rectangular structure. Of course, the absorbing layer can also be other structures, such as circular, semi-circular, etc. The shape of the absorbing layer can be adjusted accordingly as needed, such as adjusted to be determined by the shape of the electromagnetic sensitive module to be set on the circuit board 10. Following the adjustment of the shape of the absorbing layer, the relative positions of the first row of absorbing columns S1 and the second row of absorbing columns S2 and the absorbing layer can be adjusted accordingly. For example, when the absorbing layer is a circular structure, the first row of absorbing columns S1 and the second row of absorbing columns S2 are respectively arc-shaped and symmetrically arranged on opposite sides of the circular structure.

[0057] In this embodiment, by arranging at least two absorbing columns 14 into two rows of absorbing columns 14 spaced apart from each other, the projection area of ​​the absorbing layer on the circuit board 10 can be located between the first row of absorbing columns S1 and the second row of absorbing columns S2, so that the circuit traces in the area covered by the absorbing layer of the circuit board 10 are surrounded between the two rows of absorbing columns. In this way, the electromagnetic waves generated by the first electronic components 20 on the second surface of the circuit board 10 can be blocked to a greater extent, and the induced current on the circuit traces in the area covered by the absorbing layer of the circuit board 10 can be reduced. In addition, compared with the method of arranging at least two absorbing columns 14 around the absorbing layer, by arranging at least two absorbing columns 14 into two rows of absorbing columns 14 spaced apart from each other, the influence of the absorbing columns 14 on the circuit traces in the area covered by the isolation layer of the circuit board 10 can be reduced, so that the circuit traces in the area covered by the isolation layer of the circuit board 10 can be electrically connected to other circuit traces or devices in the circuit board 10 through the gap between the first row of absorbing columns S1 and the second row of absorbing columns S2.

[0058] In some embodiments, the routing direction of the circuit routing in the area of ​​the circuit board 10 covered by the absorbing layer includes at least one of the following:

[0059] In the direction from the first gap H1 to the second gap H2, the first gap H1 is the gap between the first end of the first row of absorbing columns S1 and the first end of the second row of absorbing columns S2, and the second gap H2 is the gap between the second end of the first row of absorbing columns S1 and the second end of the second row of absorbing columns S2;

[0060] From the third gap H3 to the fourth gap H4, the third gap H3 is the gap between two adjacent absorbing columns 14 in the first row of absorbing columns S1, and the fourth gap H4 is the gap between two adjacent absorbing columns 14 in the second row of absorbing columns S2.

[0061] In some embodiments, the routing direction of the circuit routing in the area of ​​the circuit board 10 covered by the absorbing layer is mainly from the first gap H1 to the second gap H2, that is, it is roughly the same as the extension direction of the first row of absorbing columns S1 and the second row of absorbing columns S2. At this time, absorbing columns are respectively provided on both sides of the circuit routing, so that electromagnetic waves on both sides of the circuit routing can be effectively absorbed, thereby reducing the induced current on the circuit routing, and when the circuit routing transmits current, the electromagnetic waves generated by the current can also be effectively absorbed.

[0062] In some embodiments, the routing direction of the circuit routing in the area of ​​the circuit board 10 covered by the absorbing layer is mainly from the first gap H1 to the second gap H2, and can pass through the third gap H3 or the fourth gap H4 to extend to the area of ​​the circuit board 10 not covered by the absorbing layer.

[0063] For example, a circuit trace entering the area of ​​the circuit board 10 covered by the absorbing layer from the first gap H1 or the second gap H2 may pass through the third gap H3 or the fourth gap H4 to extend to the area of ​​the circuit board 10 not covered by the absorbing layer.

[0064] Of course, when the first row of absorbing columns S1 and the second row of absorbing columns S2 each include a long strip of absorbing columns 14, the routing direction of the circuit routing in the area covered by the absorbing layer of the circuit board 10 is from the first gap H1 to the second gap H2. Compared with the method of providing at least two mutually spaced absorbing columns 14 in the first row of absorbing columns S1 and the second row of absorbing columns S2, this method can improve the electromagnetic wave absorbing effect, but the wiring influence on the circuit routing in the area covered by the absorbing layer of the circuit board 10 is increased.

[0065] In this embodiment, since there is a gap between the first row of absorbing columns S1 and the second row of absorbing columns S2, the gap can be used to achieve the connection between the circuit traces in the area covered by the absorbing layer of the circuit board 10 and the circuit traces in the area not covered by the absorbing layer of the circuit board 10. In addition, the gap between two adjacent absorbing columns in the same row of the first row of absorbing columns S1 and the second row of absorbing columns S2 can also be used to achieve the connection between the circuit traces in the area covered by the isolation layer of the circuit board 10 and the circuit traces in the area not covered by the isolation layer of the circuit board 10. The provision of the isolation layer and the absorbing columns 14 does not hinder the wiring in the area covered by the isolation layer of the circuit board 10, and the utilization rate of the circuit board 10 can be improved.

[0066] In some embodiments, Figure 4 , Figure 7 or Fig.12 As shown, the first end of the absorbing column 14 is in contact with the absorbing spacer, and the second end of the absorbing column 14 passes through the second surface 12 .

[0067] In other embodiments, Figure 5 , Figure 8 or Fig.13 As shown, a first end of the absorbing column 14 contacts the absorbing layer, and a second end of the absorbing column 14 is located inside the circuit board 10 .

[0068] Among them, the first end of the absorbing column 14 is the end of the absorbing column 14 facing the absorbing layer. When the second end of the absorbing column 14 penetrates the second surface 12, the absorbing column 14 penetrates the entire circuit board 10; when the second end of the absorbing column 14 is located inside the circuit board 10, the absorbing column 14 only penetrates the first surface 11 of the circuit board 10 to achieve contact with the absorbing layer by being exposed from the first surface 11.

[0069] In this embodiment, one end of the absorbing column 14 contacts the absorbing layer, so that the absorbing column 14 and the absorbing layer form a Faraday cage structure to block the electromagnetic waves of the first electronic component 20 from interfering with the electromagnetic sensitive module corresponding to the absorbing layer.

[0070] It is worth mentioning that when the absorbing column 14 passes through the entire circuit board 10, the Faraday cage structure has a larger area to block the electromagnetic waves of the first electronic component 20 from propagating to the corresponding area of ​​the absorbing layer, so its electromagnetic shielding effect is better; when the absorbing column 14 only passes through the first surface 11 of the circuit board 10 but not the second surface 12, there is a part of the thickness area on the circuit board 10 that is not penetrated by the absorbing column 14. At this time, the utilization rate of the circuit board 10 can be further improved.

[0071] For example, taking the circuit board 10 with 10 layers of circuit traces stacked inside as an example, when the absorbing column 14 penetrates the layout space of 5 layers of circuit traces close to the first surface 11, the remaining layout space of 5 layers of circuit traces close to the second surface 12 can still be used.

[0072] As an optional implementation, Figure 7 , Figure 8 or Fig.11 As shown, a groove 111 is disposed on the first surface 11 of the circuit board 10 , and the wave absorbing layer is disposed at the bottom of the groove 111 .

[0073] In this embodiment, by disposing the absorbing layer at the bottom of the groove 111 , compared with directly stacking the absorbing layer on the first surface 11 of the circuit board 10 , the thickness of the circuit board 10 can be reduced and the volume of the circuit board 10 can be reduced.

[0074] In other embodiments, in addition to removing the ink layer on the first surface 11 of the circuit board 10, a computerized numerical control (CNC) precision machining process may be used to deepen the groove 111 on the circuit board 10. At this time, the exposed surface of the absorbing layer may not be aligned with the first surface 11 of the circuit board 10, that is, the exposed surface of the absorbing layer is located on the side of the first surface 11 of the circuit board 10 close to the second surface 12. In this way, by using a deeper groove 111, the height of the electromagnetic sensitive module attached to the absorbing layer can be reduced, and more absorbing materials can be filled in the groove 111 to improve the electromagnetic wave absorption performance.

[0075] As an optional embodiment, at least two holes 112 are opened in the area of ​​the circuit board 10 covered by the absorbing layer, the groove 111 is connected to the at least two holes 112, and the at least two holes 112 are filled with absorbing material, wherein the absorbing material filled in the at least two holes 112 forms at least two absorbing columns 14.

[0076] In this embodiment, the absorbing column 14 is manufactured by digging holes around the groove 111 and filling the holes with absorbing materials. Compared with embedding or nailing the absorbing column 14 into the circuit board 10 , the manufacturing process of the circuit board structure can be simplified.

[0077] In some embodiments, the groove 111 is filled with an absorbing material, and the absorbing material filled in the groove 111 forms an absorbing layer.

[0078] In some embodiments, Figure 7 , Figure 8 or Fig.12 As shown, after a groove 111 and at least two holes 112 are formed on the circuit board 10, the groove 111 and the at least two holes 112 may be filled with absorbing material. In this way, the process of manufacturing the absorbing layer and the absorbing column 14 can be simplified, and the contact reliability between the absorbing layer and the absorbing column 14 can be improved, that is, the absorbing layer and the absorbing column 14 are an integrated absorbing material structure.

[0079] Of course, in other embodiments, such as Fig.13 As shown, after a groove 111 and at least two holes 112 are opened on the circuit board 10, absorbing material is only filled in the at least two holes 112 to form absorbing columns 14, and then a thin film of absorbing material is arranged in the groove 111 by a film-sticking method to form an absorbing layer. The manufacturing process of the absorbing layer and the absorbing column 14 is not limited here.

[0080] In some embodiments, an insulating layer 15 may be provided on the exposed surface of the absorbing layer, and the insulating layer 15 may be an insulating film such as a PET sheet, or, after the absorbing layer is provided in the groove 111, an insulating material such as an insulating glue is filled on the exposed surface of the absorbing layer to form an insulating layer 15 covering the exposed surface of the absorbing layer. In this way, the exposed surface of the circuit board structure can be insulated to prevent the absorbing layer from being exposed and causing erroneous electrical contact with other electrical structures.

[0081] In some embodiments, when the electromagnetic sensitive module 30 needs to be electrically connected to the circuit traces in the circuit board 10 or the devices on the circuit board 10 , the electrical connection can be achieved by using a wire or an interface that penetrates the absorbing layer and the insulating layer 15 .

[0082] In some embodiments, the electromagnetic sensitive module 30 may include at least two camera modules, such as Fig. 9 The first camera module 31 and the second camera module 32 shown in the figure, at this time, a hollow area 16 can be opened on the circuit board 8, and the first camera module 31 is set in the hollow area 16, and the second camera module 32 is set at the corresponding position of the isolation layer 13. At this time, the width of the isolation layer 13 in the first direction Y is narrow, wherein the first direction Y is the spacing direction between the side of the hollow area 16 facing the isolation layer 13 and the side of the isolation layer 13 facing away from the hollow area 16. At this time, the circuit wiring in the area of ​​the circuit board 10 covered by the isolation layer 13 mainly extends along the second direction X, wherein the second direction X is perpendicular to the first direction Y. In this embodiment, Figure 3 As shown, the first row of absorbing columns S1 and the second row of absorbing columns S2 can be spaced apart along the first direction Y, for example: Figure 3 As shown, the first row of absorbing columns S1 is located on a side of the isolation layer 13 close to the hollow area 16, and the second row of absorbing columns S2 is located on a side of the isolation layer 13 away from the hollow area 16. In this way, the first row of absorbing columns S1 and the second row of absorbing columns S2 can be located on opposite sides of the circuit line in the area covered by the isolation layer 13 of the circuit board 10 along the second direction X. According to the electromagnetic field surrounding the circuit line generated by the current on the circuit line, by arranging the first row of absorbing columns S1 and the second row of absorbing columns S2 on opposite sides of the circuit line, the electromagnetic field generated by the circuit line can be effectively reduced from radiating outward, and the interference of the external electromagnetic field on the circuit line can be reduced.

[0083] In this embodiment, the electromagnetic interference of the circuit wiring in the area covered by the isolation layer 13 of the circuit board 10 to the electromagnetic sensitive module corresponding to the isolation layer 13 can be effectively reduced, and the electromagnetic interference of the electromagnetic sensitive module corresponding to the isolation layer 13 to the circuit wiring in the area covered by the isolation layer 13 of the circuit board 10 can also be reduced.

[0084] It should be noted that in the drawings of the present application specification, an example is given in which a hollow area 16 is opened on the circuit board 10, and an electronic device is provided with two camera modules, wherein one camera module is arranged at a corresponding position of the isolation layer 13, and the other camera module is arranged in the hollow area 16. In other embodiments, the hollow area 16 may not be opened on the circuit board 10, and all camera modules included in the electronic device may be attached to the isolation layer 13 on the circuit board 10, which does not constitute a specific limitation herein.

[0085] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0086] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A circuit board, a first electronic component and an electromagnetic sensitive module; The electromagnetic sensitive module and the first electronic component are located on opposite surfaces of the circuit board, and an isolation layer is provided on the circuit board. The isolation layer is sandwiched between the electromagnetic sensitive module and the first electronic component. The isolation layer is used to reduce the interference of electromagnetic waves generated by the first electronic component and / or electromagnetic waves generated by circuit traces in the circuit board on the electromagnetic sensitive module.

2. The electronic device according to claim 1, characterized in that: The isolation layer includes an absorbing layer disposed on the first surface of the circuit board, the absorbing layer is used to absorb electromagnetic waves, and the electromagnetic sensitive module is disposed corresponding to the absorbing layer; The first electronic component is located on the second surface of the circuit board, and the first electronic component is arranged opposite to at least a portion of the absorbing layer, wherein the first surface and the second surface are opposite surfaces of the circuit board.

3. The electronic device according to claim 2, characterized in that: At least two holes are formed in the area of ​​the circuit board covered by the absorbing layer. The at least two holes are filled with absorbing materials to form at least two absorbing columns. The at least two absorbing columns are spaced apart from each other and contact the absorbing layer.

4. The electronic device according to claim 3, characterized in that: The at least two wave-absorbing columns are divided into a first row of wave-absorbing columns and a second row of wave-absorbing columns, the first row of wave-absorbing columns includes at least one wave-absorbing column, and the second row of wave-absorbing columns includes at least one wave-absorbing column; The first row of absorbing columns extends along a first side of the absorbing layer; the second row of absorbing columns extends along a second side of the absorbing layer; the absorbing layer is a rectangular structure, and the first side and the second side are two opposite sides of the absorbing layer.

5. The electronic device according to claim 4, characterized in that: The routing direction of the circuit routing in the area of ​​the circuit board covered by the absorbing layer includes at least one of the following: In the direction from the first gap to the second gap, the first gap is the gap between the first end of the first row of absorbing columns and the first end of the second row of absorbing columns, and the second gap is the gap between the second end of the first row of absorbing columns and the second end of the second row of absorbing columns; In the direction from the third gap to the fourth gap, the third gap is the gap between two adjacent absorbing columns in the first row of absorbing columns, and the fourth gap is the gap between two adjacent absorbing columns in the second row of absorbing columns.

6. The electronic device according to any one of claims 3 to 5, characterized in that: The first end of the absorbing column contacts the absorbing layer, and the second end of the absorbing column penetrates the second surface; or, The first end of the absorbing column is in contact with the absorbing layer, and the second end of the absorbing column is located inside the circuit board.

7. The electronic device according to any one of claims 2 to 5, characterized in that: The first surface of the circuit board is provided with a groove, and the wave absorbing layer is arranged at the bottom of the groove.

8. The electronic device according to claim 7, characterized in that: At least two holes are formed in the area of ​​the circuit board covered by the absorbing layer, the groove is connected to the at least two holes, and the at least two holes are filled with absorbing material, wherein the absorbing material filled in the at least two holes forms the at least two absorbing columns.

9. The electronic device according to claim 8, characterized in that: The groove is filled with a wave-absorbing material, and the wave-absorbing material filled in the groove forms the wave-absorbing layer.

10. The electronic device according to any one of claims 2 to 5, characterized in that: An insulating layer is sandwiched between the electromagnetic sensitive module and the wave absorbing layer.

11. The electronic device according to any one of claims 2 to 5, characterized in that: The electromagnetic sensitive module includes a camera module.

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