PCB structure and server

Abstract

The invention provides a PCB structure and a server, and relates to the technical field of PCB design. The PCB structure comprises a circuit board body, an electric connection layer, a constant temperature crystal oscillator and a shielding cover. The circuit board body is provided with a crystal oscillator electric connection position, the electric connection layer is laid on the circuit board body, the electric connection layer is provided with a separation belt, the separation belt divides the electric connection layer into a first area and a second area, the first area is arranged corresponding to the crystal oscillator electric connection position, and part of the first area is connected with the second area through the separation belt. The constant-temperature crystal oscillator is arranged on the first area, the shielding cover is arranged on the first area, and the shielding cover covers the constant-temperature crystal oscillator. The constant-temperature crystal oscillator is protected by the shielding cover, and the first region and the second region of the electric connection layer are separated by the separation strip, so that the interference of the external environment on the constant-temperature crystal oscillator can be reduced, the environment temperature can be maintained, and the constant-temperature crystal oscillator can maintain high-precision and stable clock signal transmission.

Description

Technical Field

[0001] The present application relates to the technical field of PCB structures, and in particular to a PCB structure and a server. Background Art

[0002] Oven-Controlled Crystal Oscillator (OCXO) is a high-precision crystal oscillator that uses a constant temperature bath to keep the temperature of the crystal oscillator constant. Due to its advantages such as high precision and high stability, it is widely used in applications that require stable frequency, such as communications, clock synchronization, and high-precision measurement.

[0003] The oven-controlled crystal oscillator is usually installed on the server's printed circuit board (PCB) to provide a high-precision clock signal.

[0004] However, in the server, due to the influence of factors such as fan ventilation and heat dissipation or high-power power supply, the temperature of the thermostat may not be constant, thereby affecting the stability of the clock signal. Summary of the invention

[0005] The present application provides a PCB structure and a server, which are used to solve the problem of unstable clock signal of a constant temperature crystal oscillator in a PCB.

[0006] A PCB structure provided in an embodiment of the present application includes:

[0007] The circuit board body has a crystal oscillator electrical connection position;

[0008] An electrical connection layer is laid on the circuit board body, and a separation zone is hollowed out on the electrical connection layer to separate the electrical connection layer into a first area and a second area, and the first area is arranged corresponding to the electrical connection position of the crystal oscillator;

[0009] A constant temperature crystal oscillator is arranged on the first area;

[0010] The shielding cover is arranged on the first area and covers the constant temperature crystal oscillator.

[0011] In some possible implementations, the PCB structure provided in the embodiment of the present application has a corresponding position provided on the crystal oscillator electrical connection position;

[0012] The shielding covers are arranged correspondingly to the corresponding positions.

[0013] In some possible implementations, the PCB structure provided in the embodiment of the present application has a plurality of ground vias spaced apart at corresponding positions.

[0014] In some possible implementations, in the PCB structure provided in the embodiment of the present application, the center distance between two adjacent ground vias is 0.4 mm to 0.6 mm.

[0015] In some possible implementations, the PCB structure provided in the embodiment of the present application has a plurality of first mounting holes arranged at intervals at corresponding positions, and a plurality of mounting pins are arranged at the bottom of the shielding cover;

[0016] The mounting pin passes through the electrical connection layer and is disposed in the first mounting hole.

[0017] In some possible implementations, the PCB structure provided in the embodiment of the present application is further provided with at least one second mounting hole at a corresponding position;

[0018] The second mounting hole is staggered with the first mounting hole.

[0019] In some possible implementations, in the PCB structure provided in the embodiment of the present application, the extension path of the separation zone is consistent with the extension path of the outer side wall of the shielding cover;

[0020] The first area is located inside the separation zone, and the second area is located outside the separation zone.

[0021] In some possible implementations, in the PCB structure provided in the embodiment of the present application, a third area is formed between the two ends of the separation belt;

[0022] The third region connects the first region and the second region.

[0023] In some possible implementations, in the PCB structure provided in the embodiment of the present application, the width of the third area is 3 mm to 5 mm.

[0024] In a second aspect, an embodiment of the present application provides a server, including a server body and a PCB structure as described above, wherein the PCB structure is arranged on the server body.

[0025] The present invention provides a PCB structure and a server, wherein the PCB structure includes a circuit board body, an electrical connection layer, a constant temperature crystal oscillator and a shielding cover. The circuit board body is provided with a crystal oscillator electrical connection position, the electrical connection layer is laid on the circuit board body, a dividing strip is provided on the electrical connection layer, the dividing strip divides the electrical connection layer into a first area and a second area, the first area is provided corresponding to the crystal oscillator electrical connection position, and part of the first area is connected to the second area via the dividing strip. The constant temperature crystal oscillator is provided on the first area, the shielding cover is provided on the first area, and the shielding cover is provided on the constant temperature crystal oscillator. The constant temperature crystal oscillator is protected by the shielding cover, and the first area and the second area of ​​the electrical connection layer are separated by the dividing strip, which can reduce the interference of the external environment on the constant temperature crystal oscillator, and can maintain the ambient temperature, so that the constant temperature crystal oscillator maintains high-precision and stable clock signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0027] Figure 1 A schematic diagram of the structure of the PCB provided in the embodiment of the present application;

[0028] Figure 2 for Figure 1 Exploded diagram of

[0029] Figure 3 for Figure 2 A is an enlarged view of the constant temperature crystal oscillator and the electrical connection layer;

[0030] Figure 4 for Figure 3 A perspective view of the circuit board, wherein the dotted line portion is a structural feature on the circuit board body;

[0031] Figure 5 for Figure 2 An enlarged view of the circuit board body indicated by A.

[0032] Description of reference numerals:

[0033] 100. Circuit board body;

[0034] 110, crystal oscillator electrical connection position;

[0035] 120, corresponding position;

[0036] 130. Ground vias;

[0037] 140, first mounting hole;

[0038] 150, second mounting hole;

[0039] 200, electrical connection layer;

[0040] 210. Divider strip;

[0041] 220, first area;

[0042] 230, second area;

[0043] 240, third area;

[0044] 300, constant temperature crystal oscillator;

[0045] 400. Shielding cover.

[0046] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0048] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0049] As mentioned in the background art, an oven controlled crystal oscillator is usually mounted on a printed circuit board of a server to provide a high-precision clock signal.

[0050] The oven-controlled crystal oscillator is based on the working principle of the crystal oscillator, but with the addition of the thermostat technology. By placing the crystal oscillator in the thermostat and setting the constant temperature working point, the thermostat is kept at a constant temperature, so that it is not affected by the external temperature within a certain range, and the output frequency is stabilized. However, due to the influence of fan ventilation and heat dissipation or high-power power supply in the server, the temperature of the thermostat will be unstable, which will affect the stability of the clock signal.

[0051] In view of the above problems existing in the prior art, the present invention provides a PCB structure and a server, wherein the PCB structure includes a circuit board body, an electrical connection layer, a constant temperature crystal oscillator and a shielding cover. The circuit board body is provided with a crystal oscillator electrical connection position, the electrical connection layer is laid on the circuit board body, a dividing strip is provided on the electrical connection layer, and the dividing strip divides the electrical connection layer into a first area and a second area, the first area is provided corresponding to the crystal oscillator electrical connection position, and part of the first area is connected to the second area via the dividing strip. The constant temperature crystal oscillator is provided on the first area, the shielding cover is provided on the first area, and the shielding cover is provided on the constant temperature crystal oscillator. The constant temperature crystal oscillator is protected by the shielding cover, and the first area and the second area of ​​the electrical connection layer are separated by the dividing strip, which can reduce the interference of the external environment on the constant temperature crystal oscillator, and can maintain the ambient temperature, so that the constant temperature crystal oscillator maintains high-precision and stable clock signal transmission.

[0052] The following is an introduction to exemplary application scenarios of the present invention.

[0053] The PCB structure provided by the present invention can be applied to servers in related fields, such as communication equipment, precision instruments, aerospace, etc. Specifically, the PCB structure provided by the present invention can enable the constant temperature crystal oscillator to maintain high-precision and stable clock signal transmission.

[0054] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0055] Reference Figures 1 to 5 As shown, a PCB structure provided in an embodiment of the present application includes a circuit board body 100 , an electrical connection layer 200 , a constant temperature crystal oscillator 300 and a shielding cover 400 .

[0056] The circuit board body 100 has a crystal oscillator electrical connection position 110, and the electrical connection layer 200 is laid on the circuit board body 100. A separation zone 210 is hollowed out on the electrical connection layer 200 to separate the electrical connection layer 200 into a first area 220 and a second area 230. The first area 220 is arranged corresponding to the crystal oscillator electrical connection position 110.

[0057] The oven controlled crystal oscillator 300 is disposed on the first region 220 , the shielding cover 400 is disposed on the first region 220 , and the shielding cover 400 covers the oven controlled crystal oscillator 300 .

[0058] It can be understood that the circuit board body 100 has at least one surface as a component welding surface, the electrical connection layer 200 is laid on the component welding surface, and the electrical connection layer 200 is electrically connected to the component welding surface for wiring and placing components.

[0059] The first area 220 of the electrical connection layer 200 is arranged corresponding to the crystal oscillator electrical connection position 110 on the circuit board body 100. The first area 220 can be used to install the constant temperature crystal oscillator 300, and the second area 230 can be used to install other electronic components. Other electronic components include but are not limited to relays, heat sinks, transformers, SAW meters, integrated ICs, high-frequency heads, etc.

[0060] Among them, refer to Figure 1 and Figure 2 As shown, the constant temperature crystal oscillator 300 is protected by the shielding cover 400, which can prevent the surrounding airflow from damaging the temperature of the constant temperature tank. Secondly, the shielding cover 400 can also effectively isolate the interference of the three-dimensional electromagnetic field on the constant temperature crystal oscillator 300; of course, the constant temperature crystal oscillator 300 will generate certain electromagnetic radiation when working, and the shielding cover 400 can reduce the impact of such radiation on the circuit of the second area 230, protecting other sensitive electronic components.

[0061] Furthermore, the first area 220 and the second area 230 of the electrical connection layer 200 are separated by a dividing strip 210, which can prevent the constant temperature crystal oscillator 300 from being interfered with by the electronic components or circuits on the second area 230, and can also prevent the temperature of the constant temperature bath of the constant temperature crystal oscillator 300 from being quickly dispersed through the electrical connection layer 200 to maintain the stability of the ambient temperature, thereby allowing the constant temperature crystal oscillator 300 to maintain high-precision and stable clock signal transmission.

[0062] It is understandable that the first area 220 and the second area 230 can be electrically connected via cables or metal connectors (such as copper), so that the constant temperature crystal oscillator 300 disposed on the first area 220 is electrically connected to related electronic components or circuits in the second area 230.

[0063] The PCB structure provided in the embodiment of the present application protects the constant temperature crystal oscillator 300 through the shielding cover 400, and the first area 220 and the second area 230 of the electrical connection layer 200 are separated by the dividing strip 210. This can reduce the interference of the external environment on the constant temperature crystal oscillator 300 and maintain the ambient temperature, so that the constant temperature crystal oscillator 300 can maintain high-precision and stable clock signal transmission.

[0064] Exemplarily, the circuit board body 100 may be a PCB in the prior art, and the present application does not impose too many restrictions on this.

[0065] It is understandable that, since the constant temperature crystal oscillator 300 contains a constant temperature tank and a temperature compensation circuit, the volume of the constant temperature crystal oscillator 300 is usually larger than that of an ordinary crystal oscillator. Therefore, when laying out on the circuit board body 100, a sufficient area can be reserved for the constant temperature crystal oscillator 300, and noise sources (such as fans, clock circuits, VRM (Voltage Regulator Module), inductors and other magnetic devices) can be arranged away from the constant temperature crystal oscillator 300 to ensure that the constant temperature crystal oscillator 300 can work normally without interference from other electronic components.

[0066] For example, the shielding cover 400 may be made of metal. Since the electromagnetic radiation frequency of the high-frequency constant temperature crystal oscillator 300 is relatively high, the shielding cover 400 is made of a high-conductivity metal material, which has a better shielding effect. The material of the shielding cover 400 may include, but is not limited to, silver, copper, gold, or aluminum.

[0067] Among them, the separation strip 210 is mainly used to separate the electrical connection layer 200 into a first area 220 and a second area 230. The shape of the separation strip 210 can be a long strip, a wavy line, a ring, a square, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0068] Reference Figure 4 and Figure 5 As shown, in some embodiments, a corresponding position 120 is circumferentially arranged on the crystal oscillator electrical connection position 110 .

[0069] The shielding cover 400 is disposed corresponding to the corresponding position 120 , and the oven controlled crystal oscillator 300 is disposed in the corresponding position 120 .

[0070] In the above embodiment, the corresponding position 120 provided on the circuit board body 100 is mainly used for positioning and installing the shielding cover 400, and the extension shape of the corresponding position 120 can be similar to the extension shape of the outer wall of the shielding cover 400. In addition, during the layout, the constant temperature crystal oscillator 300 is located in the corresponding position 120, and there is a preset distance between the constant temperature crystal oscillator 300 and the corresponding position 120 to avoid direct contact between the constant temperature crystal oscillator 300 and the shielding cover 400.

[0071] The preset distance between the constant temperature crystal oscillator 300 and the corresponding position 120 may be 0.8 mm to 1.2 mm. Preferably, the preset distance may be 1 mm.

[0072] Exemplarily, the electrical connection layer 200 may be a layered structure having good electrical conductivity, such as copper foil.

[0073] The area on the first area 220 of the electrical connection layer 200 corresponding to the corresponding position 120 can be treated with a window-opening bright copper. The purpose of the bright copper treatment is mainly to allow the shielding cover 400 to directly contact the bright copper of the first area 220 to facilitate the grounding of the electromagnetic interference of the shielding cover 400 through the circuit board body 100.

[0074] The width of the bright copper region may be in the range of 0.8 mm to 1.2 mm. Preferably, the width of the bright copper region may be in the range of 1 mm.

[0075] Reference Figure 4 and Figure 5 As shown, in some specific embodiments, a plurality of ground vias 130 are arranged at intervals at the corresponding positions 120 .

[0076] Because crystal oscillator devices are not only sensitive to interference from the surrounding electromagnetic fields, but also special devices that are prone to generate interference sources.

[0077] Therefore, in the above embodiment, the grounding via 130 is formed on the bright copper area corresponding to the circuit board body 100 and the shielding cover 400. The grounding via 130 connects the shielding cover 400 to the ground of the circuit board body 100, which helps to form a closed shielding loop, reduce the leakage of electromagnetic radiation, and thus reduce EMI (Electromagnetic Interference). In addition, the EMC (Electromagnetic Compatibility) of the system can also be improved.

[0078] The spacing between the ground vias 130 can be designed based on the wavelength of the signal. For high-frequency signals, the wavelength is shorter, so more dense ground vias 130 can be arranged to provide an effective shielding effect.

[0079] Reference Figure 4 and Figure 5 As shown, in some specific embodiments, the hole center distance between two adjacent ground vias 130 is 0.4 mm to 0.6 mm.

[0080] Preferably, the hole center distance between two adjacent ground vias 130 may be 0.57 mm (ie, converted to 22.5 mil).

[0081] For example, the center distance between two adjacent ground vias 130 should be less than a certain ratio of the signal wavelength (1 / 20 wavelength or less) to ensure that the signal will not be significantly affected by electromagnetic interference during transmission. Since the high-speed line above 56G adopts the PAM4 (fourth-order pulse amplitude modulation) encoding method:

[0082] Actual real rate = signal rate / 4

[0083] For example, if the signal network frequency is 112G (actually 106.25Gbps), then its base frequency is:

[0084] Base frequency = 106.25 / 4 ≈ 26.56 GHZ

[0085] For high-speed signals on PCBs, the signals are actually electromagnetic waves propagating in dielectrics. Their speed is affected by the dielectric material and is usually much lower than the speed of light in a vacuum (about 3×10^8 m / s).

[0086] In a PCB, ideally, the relationship between wavelength (λ), propagation velocity (v) and frequency (f) is:

[0087] λ = v / f

[0088] Then, the electromagnetic wavelength on the PCB is:

[0089] λ ≈ (3×10^8 m / s) / (26.56×10^9 Hz) ≈ 11.3mm = 450mil

[0090] The hole center distance between two adjacent ground vias 130 is:

[0091] λ / 20 ≈ 22.5mil

[0092] Therefore, by setting the hole center distance between two adjacent ground vias 130 to 22.5 mil, interference sources with a signal rate less than or equal to 112 Gbps can be effectively shielded and filtered out.

[0093] Reference Figure 4 and Figure 5 As shown, in some embodiments, a plurality of first mounting holes 140 are circumferentially disposed on the corresponding position 120 , and a plurality of mounting pins are disposed on the bottom of the shielding cover 400 .

[0094] The mounting pin passes through the electrical connection layer 200 and is disposed in the first mounting hole 140 .

[0095] In the above embodiment, during installation, the plurality of mounting pins of the shielding cover 400 may be correspondingly disposed in the plurality of first mounting holes 140 on the circuit board body 100 through the electrical connection layer 200 , and the shielding cover 400 may be fixed through the first mounting holes 140 .

[0096] For example, the first mounting hole 140 may be a PTH hole (Plated Through Hole). The shape of the first mounting hole 140 may be an ellipse, a circle, a square, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0097] Reference Figure 4 and Figure 5 As shown, in some embodiments, at least one second mounting hole 150 is further provided at the corresponding position 120 .

[0098] The second mounting hole 150 is staggered with the first mounting hole 140 .

[0099] In the above embodiment, the second mounting hole 150 is staggered with the first mounting hole 140, and the shielding cover 400 is also provided with staggered mounting pins, thereby playing the role of foolproof and positioning installation, and preventing the shielding cover 400 from being installed upside down. In addition, the shielding cover 400 can be conveniently installed at the corresponding position 120 on the circuit board body 100, so that the shielding cover 400 corresponds to the grounding via 130.

[0100] For example, the second mounting hole 150 may be a PTH hole (Plated Through Hole). The shape of the second mounting hole 150 may be an ellipse, a circle, a square, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0101] Reference Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the extension path of the dividing strip 210 is consistent with the extension path of the outer side wall of the shielding cover 400 .

[0102] The first area 220 is located inside the dividing strip 210 , and the second area 230 is located outside the dividing strip 210 .

[0103] In the above embodiment, the extension path of the dividing strip 210 is consistent with the extension path of the outer wall of the shielding cover 400, so that the first area 220 can be formed in the middle area of ​​the electrical connection layer 200. In this way, the shape of the formed first area 220 can correspond to the shape of the crystal oscillator electrical connection position 110 on the circuit board body 100, thereby avoiding the problem that the area of ​​the first area 220 is too large and thus cannot effectively shield interference, and avoiding the problem that the ambient temperature loses quickly due to the area of ​​the first area 220 being too large.

[0104] Exemplarily, the shielding cover 400 may be a rectangular body, the separating strip 210 may be in the shape of a U-shaped ring, and the first area 220 may be in the shape of a rectangle. Of course, the shielding cover 400 may also be a cylindrical body, the separating strip 210 may be in the shape of a circular ring, and the first area 220 may be in the shape of a circle. The present application does not impose too many restrictions on this.

[0105] Specifically, refer to Figure 2 , Figure 3 and Figure 4 As shown, the shape of the shielding cover 400 may be a rectangle, the shape of the corresponding position 120 may be a U-shaped ring, and the mounting hole 140 is disposed at a circumferential position of the corresponding position 120 .

[0106] Exemplarily, the edge width of the separation strip 210 may be 0.4 mm to 0.6 mm. Preferably, the edge width of the separation strip 210 may be 0.5 mm.

[0107] Exemplarily, the edge width of the corresponding position 120 may be 0.8 mm to 1.2 mm, and the side wall thickness of the shielding cover 400 may be 0.4 mm to 0.6 mm. Preferably, the edge width of the corresponding position 120 may be 1 mm, and the side wall thickness of the shielding cover 400 may be 0.5 mm.

[0108] Reference Figure 3 As shown, in some specific embodiments, a third area 240 is formed between the two ends of the separation strip 210;

[0109] The third region 240 connects the first region 220 and the second region 230 .

[0110] In the above embodiment, the third area 240 of the electrical connection layer 200 is mainly used to connect the first area 220 and the second area 230, so that the constant temperature crystal oscillator 300 on the first area 220 can be electrically connected to the relevant electronic components or circuits in the second area 230 through the surface routing of the third area 240.

[0111] Exemplarily, the shape of the third area 240 may be a rectangle, a trapezoid, a sector, etc., and the embodiment of the present application does not impose too many restrictions on this.

[0112] In some specific embodiments, the width of the third region 240 is 3 mm to 5 mm.

[0113] In the above embodiment, setting an appropriate width can ensure the effectiveness of the third area 240 in electromagnetic shielding and reduce interference with the signal of the constant temperature crystal oscillator 300 in the first area 220. This can prevent the third area 240 from being too wide, resulting in failure to effectively shield interference, and can also prevent the problem of the ambient temperature of the first area 220 from being lost quickly through the third area 240.

[0114] At the same time, it can also avoid the problem that the width of the third area 240 is too narrow, which causes inconvenience in routing the constant temperature crystal oscillator 300 through the third area 240 .

[0115] Preferably, the width of the third region 240 may be 4 mm.

[0116] A server provided in an embodiment of the present application includes a server body and the above-mentioned PCB structure, wherein the PCB structure is arranged on the server body.

[0117] In the embodiment of the present application, since the server adopts the PCB structure in the above embodiment, it also has the advantages and benefits brought by the above PCB structure, that is, the constant temperature crystal oscillator 300 can maintain high-precision and stable clock signal transmission.

[0118] Those skilled in the art will readily appreciate other embodiments of the present application after considering the description and practicing the contents disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The description and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0119] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A PCB structure, characterized in that: include: A circuit board body (100) having a crystal oscillator electrical connection position (110); an electrical connection layer (200) laid on the circuit board body (100), wherein a separation strip (210) is hollowed out on the electrical connection layer (200) to separate the electrical connection layer (200) into a first area (220) and a second area (230), wherein the first area (220) is arranged corresponding to the crystal oscillator electrical connection position (110); A constant temperature crystal oscillator (300), arranged on the first area (220); A shielding cover (400) is disposed on the first area (220) and covers the constant temperature crystal oscillator (300).

2. The PCB structure according to claim 1, characterized in that: A corresponding position (120) is provided on the crystal oscillator electrical connection position (110); The shielding cover (400) is arranged corresponding to the corresponding position (120).

3. The PCB structure according to claim 2, characterized in that: A plurality of grounding vias (130) are arranged at intervals on the corresponding positions (120).

4. The PCB structure according to claim 3, characterized in that: The hole center distance between two adjacent ground via holes (130) is 0.4 mm to 0.6 mm.

5. The PCB structure according to claim 2, characterized in that: A plurality of first mounting holes (140) are arranged at intervals on the corresponding positions (120), and a plurality of mounting pins are arranged at the bottom of the shielding cover (400); The mounting pin passes through the electrical connection layer (200) and is disposed in the first mounting hole (140).

6. The PCB structure according to claim 5, characterized in that: At least one second mounting hole (150) is also provided at the corresponding position (120); The second mounting hole (150) and the first mounting hole (140) are arranged in a staggered manner.

7. The PCB structure according to any one of claims 1 to 6, characterized in that: The extension path of the separation strip (210) is consistent with the extension path of the outer side wall of the shielding cover (400); The first area (220) is located inside the separation zone (210), and the second area (230) is located outside the separation zone (210).

8. The PCB structure according to claim 7, characterized in that: A third area (240) is formed between the two ends of the separation strip (210); The third region (240) connects the first region (220) and the second region (230).

9. The PCB structure according to claim 8, characterized in that: The width of the third region (240) is 3 mm to 5 mm.

10. A server, characterized in that: It comprises a server body and a PCB structure as claimed in any one of claims 1 to 9, wherein the PCB structure is arranged on the server body.

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